JP2591453B2 - Burn-in board inspection apparatus and burn-in board inspection method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a burn-in board inspection apparatus and a burn-in board inspection method for inspecting a burn-in board used for a high-temperature bias test of a semiconductor device or the like.

[0002]

2. Description of the Related Art It is well known that a burn-in board is generally used for a burn-in test of a semiconductor integrated circuit (IC) device or the like. A large number of IC sockets and electronic circuit components are mounted on the burn-in board, and the burn-in board is repeatedly used under a severe condition such as a high temperature every time a burn-in test is performed. Due to such severe use conditions, IC on burn-in board
Poor contact of the socket, failure of circuit components, disconnection of the pattern, and the like may occur. Therefore, various burn-in board inspection methods and burn-in board inspection apparatuses have hitherto been devised in order to discover defects of the burn-in board.

As a conventional burn-in board inspection method and burn-in board inspection apparatus, for example,
No. 126781 is listed. FIG. 6 shows an outline of the burn-in board inspection apparatus. FIG.
(A) is a front view of the burn-in board inspection apparatus, (B) is a side view of the burn-in board inspection apparatus, and (C) is a top view of the burn-in board inspection apparatus. On the burn-in board 62, there are provided a plurality of sockets 6 into which ICs are inserted.
3 is mounted (FIG. 6C). A plurality of measurement pins 13 that can be inserted into the socket 63 are provided below the measurement jig 14.
Are arranged. That is, the number of the measuring pins 13 is one.
Equal to the number of internal pins of one socket 63. The upper portion of the measuring jig 14 is connected to an inspection apparatus main body (not shown), and the measuring jig 14 moves in a vertical direction (Z-axis direction) and a horizontal direction (XY-axis direction) with respect to the burn-in board 62. It is possible.

At the time of burn-in board inspection, the inspection apparatus body lowers the measuring jig 14 toward the burn-in board 62 (in the Z-axis direction), and inserts the measuring pins 13 into the socket 63. As a result, each measurement pin 13 contacts the internal lead in the socket 63. In this state, the continuity test of the socket 63 is performed to determine whether there is a defect in the burn-in board. When the inspection of one socket 63 is completed, the inspection apparatus main body separates the measuring jig 14 from the burn-in board 62 and removes the measuring pin 13 from the socket 63. Next, the measuring jig 14 is moved parallel to the surface of the burn-in board 62 (in the XY axis direction), and the measuring jig 14 is stopped on another socket 63. Then, the measuring jig 14 is lowered toward the socket 63 to inspect the socket 63 and circuit components and the like around the socket 63. By performing such processing for all the sockets 63, the inspection of one burn-in board 62 is completed.

[0005]

However, in the above-described conventional burn-in board inspection method and burn-in board inspection apparatus, since measurement is performed for each socket and each peripheral circuit, a burn-in board having a plurality of sockets is required. Multiple tests had to be performed to test the board. For this reason, there has been a problem that it takes an extremely long time to inspect one burn-in board. Further, in the conventional burn-in board inspection apparatus, a mechanism for accurately moving the measuring jig to each socket position is required, so that there is a problem that the structure of the burn-in board inspection apparatus becomes complicated. .

[0006]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a burn-in board inspection apparatus and a burn-in board inspection method that can easily and quickly perform a burn-in board inspection.

[0007]

According to a first aspect of the present invention, there is provided a burn-in board inspection apparatus for inspecting a burn-in board having a plurality of sockets and a measuring terminal electrically connected to the plurality of sockets. A test board having a plurality of board leads capable of contacting the contacts of the plurality of sockets on the burn-in board, and having a measurement terminal electrically connected to the board leads; and A burn-in board inspection device comprising: a measurement terminal; and an inspection jig for measuring electrical characteristics between the measurement terminals of the inspection substrate.

According to a second aspect of the present invention, a plurality of sockets,
And a burn-in board inspection method for inspecting a burn-in board having a measurement terminal electrically connected to the plurality of sockets, wherein a plurality of sockets on the burn-in board are connected to a plurality of sockets on the test board. And a measuring terminal on the inspection board electrically connected to the plurality of board leads, and
A burn-in board inspection method characterized by measuring electrical characteristics between measurement terminals of the burn-in board.

[0009]

According to the first aspect of the present invention, the plurality of board leads on the inspection board come into contact with the contacts of the plurality of sockets on the burn-in board. The inspection jig measures electrical characteristics between the measurement terminals of the burn-in board and the measurement terminals of the inspection substrate. For example, when there is a defect in the burn-in board, the electrical characteristics between the two measurement terminals show values different from the normal values. This makes it possible to determine whether or not the burn-in board is defective. According to the present invention, all the plurality of sockets on the burn-in board can be inspected simultaneously, so that the inspection time can be reduced. In addition, a complicated configuration for performing inspection for each socket is not required.

According to the second aspect of the present invention, a plurality of board leads on the inspection board are brought into contact with the contacts of the plurality of sockets on the burn-in board. Then, the electrical characteristics between the measurement terminals on the inspection substrate electrically connected to the plurality of substrate leads and the substrate terminals of the inspection substrate are measured. Therefore, based on the electrical characteristics, the burn-in board can be inspected in a short time.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A burn-in board inspection apparatus and a burn-in board inspection method according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of a burn-in board and a burn-in board inspection board according to an embodiment of the present invention.
FIG. 2 and FIG. 3 are views showing the inspection substrate. FIG.
Inspection board 1, Burn-in board 2, Connect jig 1
1 is a diagram showing connections of a DC tester 10 and the like. A plurality of IC sockets 3, electronic components, and the like are mounted on the rectangular burn-in board 2. The internal lead of each socket 3 is wired to the wiring pattern 6b of the burn-in card edge 9 provided at the end of the burn-in board 2 via the external lead 8, the electronic component 12, and the like.

The inspection substrate 1 has substantially the same shape as the burn-in board 2, and one surface thereof is provided with a plurality of conductive substrate leads 5 (FIGS. 1 and 2). That is, the board lead 5 is soldered in a state where the board lead 5 is inserted into the through hole of the test board 1, and when the test board 1 is stacked on the burn-in board 2, the board lead 5 comes into contact with the internal lead 4 of the socket 3. It has a configuration (FIG. 4). The board lead 5 is wired to a card edge 7 provided at an end of the inspection board 1 via a through hole and a wiring pattern 6a. Therefore, the board leads 5 and the terminals of the card edge 7 are electrically connected in one-to-one correspondence.

The connecting jig 11 includes a card connector 11a into which the card edge 7 of the inspection board 1 is inserted, and a card connector 11b into which the burn-in board card edge 9 is inserted (FIG. 4). These card connectors 11a and 11b are connected to a DC through an output cable 11C.
It is connected to the tester 10 and the like. DC tester 10
It can measure not only C current and DC voltage but also resistance value. Further, instead of the DC tester 10, a capacitance meter capable of measuring the capacitance of a capacitor may be used.

Subsequently, a burn-in board inspection method according to this embodiment will be described below. First, the operator places the inspection substrate 1 on the burn-in board 2 and inserts the substrate lead 5 into the socket 3. Then, the board leads 5 come into contact with the internal leads 4 in all the sockets 3, and each terminal of the card edge 7 of the inspection board 1 and the internal leads 4 of the socket 3 are electrically connected. In this state, the inspection substrate 1 and the burn-in board 2 are mounted on the connection jig 11.
That is, the card edge 7 of the inspection board 1 is inserted into the card connector 11a, and the card edge 9 of the burn-in board 2 is inserted into the card connector 11b. Also, the DC tester 10 and the like are connected to the output cable 11c of the connection jig 11. This prepares the burn-in board for inspection.

Next, the socket 3 on the burn-in board 2
An inspection is performed to determine whether or not the external electronic component 12 is connected to the external lead 8. In the following description, the external electronic component 12 is treated as a resistor. FIG. 5 is a block diagram showing a path of a current flowing through the burn-in board 2, the inspection board 1, and the like. As shown in FIG. 5, when a certain DC voltage is applied between the positive and negative sides, the current flows in the direction of the arrow. That is, the current flows from the connection jig 11 into the wiring pattern 6b on the card edge 9 of the burn-in board 2. Further, this current enters the DC tester 10 via the external electronic component 12, the internal lead 4 of the socket 3, the board lead 5, the wiring pattern 6 a, the card edge 9 of the test board 1, and the connect jig 11.

If the electronic component 12 is out of order, the value of the current flowing through the electronic component 12 is different from the normal value. Therefore, by measuring the current value at the time of inspection and comparing / determining it with a normal value, it is possible to determine whether or not the external electronic component 12 has a defect. When the electronic component 12 is another electronic component such as a Zener diode or a capacitor, the inspection method is the same as the inspection method described above.

Not only the failure of the electronic component 12, but also the disconnection of the wiring pattern on the connect jig 11, the burn-in board 2, the contact failure of the socket 3, the failure of the test board 1, and the like can be similarly performed. . By using a microcomputer that can inspect these parts in order,
It is possible to judge the quality of the contact between all the external electronic components 12 and the socket 3 of one burn-in board 2 in one inspection process.

[0019]

As described above, according to the present invention, the board leads of the test board are inserted into all the sockets on the burn-in board, and the electrical characteristics between the two boards are measured. The burn-in board can be inspected easily in a short time.

[Brief description of the drawings]

FIG. 1 is a perspective view of a burn-in board and an inspection board according to an embodiment of the present invention.

FIG. 2 is a perspective view of the back surface of the inspection substrate according to one embodiment of the present invention.

FIG. 3 is a plan view of an inspection substrate according to one embodiment of the present invention.

FIG. 4 is a cross-sectional view of a burn-in board and an inspection board according to one embodiment of the present invention.

FIG. 5 is a block diagram illustrating a current path of a burn-in board or the like according to an embodiment of the present invention.

FIG. 6 is a diagram illustrating a conventional burn-in board inspection apparatus and a burn-in board inspection method.

[Description of Signs] 1 Inspection board 2 Burn-in board 3 Socket 5 Board lead 7 Card edge (measurement terminal) 9 Burn-in card edge (measurement terminal) 10 DC tester and capacitance meter (measurement jig) 11 Connect jig (measurement) jig)

Claims (2)

(57) [Claims] 1. A burn-in board inspection apparatus for inspecting a burn-in board having a plurality of sockets and a measurement terminal electrically connected to the plurality of sockets, the burn-in board inspection apparatus comprising: A test board having a plurality of board leads capable of contacting a contact, and having a measuring terminal electrically connected to the board lead, and a measuring terminal of the burn-in board and a measuring terminal of the testing board. A burn-in board inspection apparatus, comprising: an inspection jig for measuring electrical characteristics. 2. A burn-in board inspection method for inspecting a burn-in board having a plurality of sockets and a measurement terminal electrically connected to the plurality of sockets, the method comprising: A plurality of substrate leads on the inspection substrate are brought into contact with the contacts, a measurement terminal on the inspection substrate electrically connected to the plurality of substrate leads, and a measurement terminal of the burn-in board. A burn-in board inspection method characterized by measuring an electrical characteristic during the test.