JPH0348171A - Leadless probe card of in-circuit tester for hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To achieve a quick and simple inspection of a hybrid integrated circuit by using a leadless probe card having bumps to perform an inspection with a contact of a bump at a position corresponding to a measuring position of a circuit substrate. CONSTITUTION:Passive parts such as chip parts and capacitors are mounted on a thick film multi-layer substrate 1 as object to be inspected. On the other hand, a leadless flexible probe card 11 has bumps 10 formed at positions corresponding to measuring positions of the substrate 1 and the bumps 10 are connected to a protrusion pattern for connectors for connection to a measuring equipment. When inspecting the substrate 1, a bump 10 of the card 11 is positioned with a measuring position of the substrate 1 and a part to be inspected is pressed form the side of the card 11 with a partially pressing jig to contact the bump. Thus, inspection is accomplished quickly and simply by positioning the card 11 having the bumps 10 with the substrate 1.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a leadless probe card for an in-circuit tester for hybrid integrated circuits, and more specifically, for use in a leadless probe card before or after die bonding or wire bonding in the formation of hybrid integrated circuits. This invention relates to a leadless probe card for an in-circuit tester for later electrical testing.

[Prior Art] A hybrid integrated circuit is a circuit in which semiconductor components and passive components are mounted on an insulating substrate to form an electronic circuit, which is then packaged and treated as a single component. When manufacturing a hybrid integrated circuit, it is necessary to perform electrical testing at an intermediate stage before the entire circuit is packaged, that is, in the middle of the manufacturing process of the hybrid integrated circuit. In other words, after going through processes such as circuit design, hybrid IC design, pattern design, screen fabrication, and board processing, the circuit board is electrically inspected, wire bonded, further inspected, and then the substrate mountain The process begins. In this electrical inspection of circuit boards, for example, electrical inspection of thick or thin film substrates is performed before die bonding or wire bonding (hereinafter also referred to as assembling) chip components such as ICs to the substrate. This allows us to determine whether the cause of a defect that occurs after assembly is a defect caused by the board that occurred before assembly or a defect that occurred after assembly, and then repair it.

Conventionally, electrical inspection of boards before and after assembly is
As shown in FIG. 6, inspection is carried out by bringing the lead probe 25 into contact with a required measurement point on the substrate 11. The tip of the probe was positioned and fixed on the probe card.

In tests performed using such equipment, tests using external lead pins or lead terminals can be easily performed, but electrical information such as voltage and current that uses any internal point can be easily carried out. Measurements are carried out by taking measures to make the inspection as easy as possible, such as by bringing a lead probe into contact with the internal points, or by connecting wires to empty external pins in advance.

In addition, electronic devices such as OA equipment, communication equipment, consumer equipment, and even industrial equipment are becoming more multi-functional, complex, and high-performance. As a result, the use of in-circuit testers, in-circuit emulators, etc. to test each module inside the circuit and to check the operation of the motherboard excluding those parts has become an important means during development and design. ing.

[Problems to be Solved by the Invention] However, as mentioned above, in the case where a lead probe is used, it is not only difficult to stand the probe up when aligning the measurement point and the lead probe, but also it is difficult to set up the probe before inspection. The problem is that it takes time.

In addition, recent hybrid integrated circuits are often produced in small quantities with a wide variety of products, so there are problems such as difficulty in switching between different models and the need to be careful about where to store the blower and how to protect the tip of the probe during storage.

Furthermore, when using a lead probe type for inspection of circuits that are becoming larger and larger, or analog-digital mixed circuits, care must be taken to protect the tip of the probe where the blower is stored and during storage, in order to handle high-mix, low-volume production. Not only is it necessary to test such hybrid integrated circuits, but there is also the disadvantage that in-circuit testers for testing such hybrid integrated circuits are not yet commercially available.

Therefore, as a result of various studies regarding the above-mentioned problems, the present inventor found that the above-mentioned problems could be solved by using a probe card in which bumps were formed corresponding to the measurement points on the object to be measured. The present invention has been made based on this knowledge.

Therefore, it is an object of the present invention to make the test quick and easy;
Moreover, it is an object of the present invention to provide a leadless probe card for an in-circuit tester for hybrid integrated circuits that requires less space to store, does not require care to protect the tips of the leads, and can be manufactured at a low cost.

[Means for Solving the Problems] The object of the present invention is to provide a lead for an in-circuit tester for a hybrid integrated circuit, characterized in that the board has a bump at a position corresponding to an electrical measurement point of an object to be measured. Achieved by Resprobe Card.

Next, embodiments of the present invention will be described in more detail with reference to the drawings, but these are merely examples and the present invention is not limited thereto.

The substrate used in the present invention may be a printed circuit board, a flexible substrate, or the like, and may be either a thin film substrate or a thick film substrate.

Table 1 shows the manufacturing process of the hybrid integrated circuit used in the present invention, and screen manufacturing is performed following circuit design, hybrid IC design, and pattern design. Fabricate a leadless probe card.

Here, a leadless probe card has a test pattern formed thereon, and for example, a bump is formed at a position corresponding to an electrical measurement point of a product circuit pattern, but first, there is a gap between this bump position and a part of the connector. Connections are made by wiring, and then pants are formed at the bump positions using solder or the like.

Next, there is a board process, where after forming a circuit on the board, electrical testing of this board is performed using a leadless probe card.After board testing, chip parts such as ICs are die-bonded, and then after the die-bonding. Perform electrical inspection after mounting chip components. Thereafter, after wire bonding and a substrate mounting process, a pre-sealing inspection and a post-sealing inspection are performed.

Table 1 Figure 1 (a) is a front view of the thick film multilayer board on which each chip component is die-bonded, and Figure 1 (b) is the front view of the thick film multilayer board shown in Figure 1 (a). FIG. 3 is a front view of a leadless probe card having bumps at positions corresponding to measurement points.

In FIG. 1(a), reference numeral 1 denotes a thick film multilayer substrate, on which various chip components and passive components such as capacitors are mounted. Specifically, 2 is a VLSI chip, 3 is L
SI chip, 4 is MSI chip, 5 is transistor, 6
is a pair chip such as a diode, and 7 is a chip capacitor. 8 is a pad, and 9 is a bonding wire.

In FIG. 1(b), 11 is a leadless flexible probe card board, and 10 is a bump. This board has a connector protrusion pattern for connecting to a measuring instrument, and the bump 10 is connected to this connector protrusion pattern.

FIG. 2 is for explaining another embodiment of the leadless probe card of the present invention, and FIG. 2(a) shows an object to be measured using the leadless probe card of the present invention. It is a thick film substrate with a size of 3 x 3 inches and a thickness of 0.
635+am, and there are 12 circuit patterns in it. 1 is one circuit board, and 1' is a board on which a scribe line 16 is included.

FIG. 2(b) is a front view of the leadless probe card 11, where 10 is a measurement bump made on one circuit board, 13 is an alignment pattern, and 14 is a bump for fixing the probe card. It is a screw hole. Reference numeral 12 denotes a connector section, which is connected to a connector of a measuring instrument. 15 is a lead conductor.

As shown in FIG. 3, the bump 10 structure is formed at points on the conductive surface 16 by soldering or the like. The bumps may also be formed of other conductive materials.

In the leadless probe card of the present invention, a symmetrical pattern of the object to be measured is made, but in addition to this, several other objects to be measured may be collected and formed on one board, and then formed as a separate test pattern. good.

Next, a measurement method using the leadless probe card of the present invention will be explained. Basically, an inspection apparatus shown in FIG. 4 is used. This inspection device has a stage 19 supported on a stage 20 and a vacuum pipe in the center. The thick film substrate 1, which is the object to be measured, is fixed on the stage 19 by vacuum, and the stage can be mechanically moved up and down, left and right, and front and rear. The amount of movement thereof is accurately adjusted by the computer to match the measurement point of the leadless probe card 1. The leadless probe card is also connected to the connector 18 and coupled to the measurement equipment. This inspection device can be used by applying a laser trimmer for laser trimming of substrates. Although the installation of the prober differs depending on the model of the laser trimmer, in the present invention, it is possible to manufacture a one-dress probe card at a low cost.

A measurement method using this inspection device is shown in FIG.

FIG. 5(a) shows a case where a partial inspection is performed in a board inspection, and the hybrid integrated circuit board 1 and the bump side of the leadless flexible probe card are combined, and the part corresponding to the inspection location is probed with a partial holding jig 22. Measure by pressing from the card side to make sufficient contact. FIG. 5(b) shows a partial inspection of the chip component 2 mounted on the substrate 1. After the chip component 2 is aligned with the bump side of the probe card, it is pressed with the holding jig 23. FIG. 5(C) shows a case where the entire board is inspected, and after the hybrid integrated circuit board 1 and the bump side of the leadless flexible probe card are aligned, the entire back surface thereof is pressed with the holding jig 23.

Note that the arrow indicates the pressing force.

FIG. 5(d) shows chip components 2.3 mounted on the board 1.
If the mounted component has a slight step, press it with a soft rubber-like holding jig 23 from the back of the leadless flexible probe card (it will be pressed according to the step). Ru.

Further, when a hard material is used as the leadless probe card, the height can be adjusted by providing convex portions 112 and 113 of the mounting component on the leadless probe card, as shown in FIG. 5(e).

In FIG. 5(f>), contrary to FIG. 5(e), a base material 24 for adjusting the height is provided on the substrate to make the surface flat and then contact with a leadless probe card made of a hard material. .

Further, electrical measurements on a board having circuits on both sides can be carried out by bringing leadless probe cards 11 into contact with both sides of the board, as shown in FIG. 5(g), or
Or, as shown in FIG. 5(h), on one side of the substrate,
Measurement can be performed by using the leadless probe card 11 and the conventional lead probe 25 on the other hand.

The method for producing the leadless probe card of the present invention can use any thick film technology known prior to this application. In addition, known raw materials, materials, etc. are used in the production.

[Operations and Effects of the Invention] The present invention uses a leadless probe card having bumps instead of conventional lead probes, and uses the leadless probe card having bumps at positions corresponding to measurement positions on a circuit board to measure a circuit. Because it tests the board, it is quick and easy, requires less space to store, does not require care to protect the ends of the leads, and has the advantage that such leadless probe cards can be manufactured at low cost. have

[Brief explanation of drawings]

Figure 1(a) is a front view of a thick film multilayer board on which each chip component is die-bonded, and Figure 1(b) is a front view of the thick film multilayer board on which each chip component is die-bonded. FIG. 3 is a front view of a leadless probe card with bumps at certain positions. Further, FIG. 2 is a front view showing another embodiment of the leadless probe card of the present invention, and FIG. 2(a) is a front view showing a thick film substrate as an object to be measured. Also, Figure 2(b)
is a front view of another leadless probe card. FIG. 3 is a sectional view showing a bump used in the present invention. FIG. 4 is a perspective view showing an inspection device used in the present invention. FIGS. 5(a) to 5(h) are cross-sectional views showing embodiments in which measurements were taken using the leadless probe card of the present invention. FIG. 6 is a cross-sectional view showing a hybrid integrated circuit being measured using a conventional lead probe. Explanation of codes 1...Thick film multilayer board 2-6...Pair chip component 7...Chip capacitor 8...Ponding pad 9...Wire 10...Bud 11...Leadless probe card! 2... Connector protrusion 13... Positioning pattern 14... Screw hole 15... Lead 16... Scribe line 17... Conductor 18... Connector
! 9... Loading table 20... Table 21... Vacuum tube 22... Partial holding jig 23... Whole holding jig 24... Base material 25... Lead probe 111
...Hard base material 112.113 ...Protrusion

Claims (1)

[Claims] A leadless probe card for an in-circuit tester for hybrid integrated circuits, characterized by having bumps on a substrate corresponding to electrical measurement points of an object to be measured.