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TWM616102U - Burn-in apparatus - Google Patents

Burn-in apparatus Download PDF

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Publication number
TWM616102U
TWM616102U TW110205882U TW110205882U TWM616102U TW M616102 U TWM616102 U TW M616102U TW 110205882 U TW110205882 U TW 110205882U TW 110205882 U TW110205882 U TW 110205882U TW M616102 U TWM616102 U TW M616102U
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Taiwan
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burn
cabinet
load
adapter
circuit substrate
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TW110205882U
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Chinese (zh)
Inventor
甘明達
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捷拓科技股份有限公司
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Priority to TW110205882U priority Critical patent/TWM616102U/en
Publication of TWM616102U publication Critical patent/TWM616102U/en

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Abstract

一種燒機設備,包含一機櫃、複數連接裝置與一燒機測試系統,該機櫃包含一櫃體以及複數載板,該複數載板間隔設置於該櫃體的容置空間中,該複數連接裝置裝設於該機櫃中,各該連接裝置包含一電路基板與至少一轉接座,該電路基板具有複數負載區域,該複數負載區域的位置彼此分離,該電路基板於各該負載區域設有複數接點,該至少一轉接座可拆組的設置在該電路基板並電連接該複數接點,各該轉接座具有至少一待測元件連接器,該機櫃的各該載板設有該複數連接裝置中的至少一連接裝置,該燒機測試系統裝設於該機櫃中並電連接該複數連接裝置。A burn-in equipment includes a cabinet, a plurality of connection devices and a burn-in test system. The cabinet includes a cabinet body and a plurality of carrier boards, the plurality of carrier boards are arranged at intervals in the accommodating space of the cabinet body, and the plurality of connection devices Installed in the cabinet, each of the connecting devices includes a circuit substrate and at least one adaptor, the circuit substrate has a plurality of load regions, the positions of the plurality of load regions are separated from each other, and the circuit substrate is provided with a plurality of load regions in each of the load regions. The at least one adaptor is detachably arranged on the circuit substrate and electrically connected to the plurality of contacts, each adaptor has at least one component under test connector, and each carrier board of the cabinet is provided with the At least one connecting device among the plurality of connecting devices, the burn-in test system is installed in the cabinet and electrically connected to the plurality of connecting devices.

Description

燒機設備Burn-in equipment

本新型係關於一種燒機設備,尤指一種用於電子元件執行燒機程序使用之燒機測試設備。 This model relates to a burn-in equipment, especially a burn-in test equipment used for electronic components to execute the burn-in program.

現有電子元件於出廠前,為了確保電子元件之功能正確與可靠度,須進行燒機程序(burn in),藉由燒機程序模擬電子元件的負載狀態進行測試。 Before the existing electronic components leave the factory, in order to ensure the correct and reliable functions of the electronic components, a burn-in procedure (burn in) is required to simulate the load status of the electronic components for testing.

請參考圖9,習知燒機手段是將待測的電子元件(後稱待測元件60)分別連接一電源供應器50、一負載裝置51與一量測裝置52,由一控制裝置53調控該電源供應器50輸出至該待測元件60的測試電源的大小,該負載裝置51可為電子負載(electronic load)或客製水泥電阻,該量測裝置52可電連接該待測元件60的輸出端以量測其輸出電壓及/或電流,該控制裝置53從該量測裝置52接收其量測資料,該控制裝置52可將所述量測資料儲存在儲存裝置(例如硬碟),並可透過顯示器呈現量測資料給使用者檢視。 Please refer to FIG. 9, the conventional burn-in method is to connect the electronic component to be tested (hereinafter referred to as the component under test 60) to a power supply 50, a load device 51 and a measurement device 52, respectively, and are controlled by a control device 53 The power supply 50 outputs the size of the test power supply to the component under test 60. The load device 51 can be an electronic load or a custom-made cement resistor. The measuring device 52 can be electrically connected to the component under test 60. The output terminal measures its output voltage and/or current, the control device 53 receives the measurement data from the measurement device 52, and the control device 52 can store the measurement data in a storage device (such as a hard disk), The measurement data can be presented to the user for viewing through the display.

然而,由於待測元件60的型號多元,不同型號的待測元件60所能承受的負載量也彼此不同,由此可見,該負載裝置51的阻抗必須因應待測元件60的型號而隨時調整、替換或客製化製作,導致習知燒機過程難以簡化。 However, due to the multiple models of the component under test 60, the load capacity of the component under test 60 of different models is also different from each other. It can be seen that the impedance of the load device 51 must be adjusted at any time according to the model of the component under test 60. Replacement or customized production makes it difficult to simplify the conventional burn-in process.

本新型之目的在於提供一種燒機設備,以期改善習知燒機過程難以簡化的缺點。 The purpose of the present invention is to provide a burn-in equipment, in order to improve the disadvantage that the conventional burn-in process is difficult to simplify.

為了達成前述目的,本新型所提出之燒機設備係包含: 一機櫃,其包含一櫃體以及複數載板,該櫃體中具有一容置空間,該複數載板間隔設置於該櫃體的容置空間中;複數連接裝置,裝設於該機櫃中,各該連接裝置包含:一電路基板,具有複數負載區域,該複數負載區域的位置彼此分離,該電路基板於各該負載區域設有複數接點;及至少一轉接座,可拆組的設置在該電路基板並電連接該複數接點,各該轉接座具有至少一待測元件連接器;該機櫃的各該載板設有該複數連接裝置中的至少一連接裝置;以及一燒機測試系統,裝設於該機櫃中並電連接該複數連接裝置。 In order to achieve the aforesaid purpose, the burn-in equipment proposed by the present model includes: A cabinet including a cabinet body and a plurality of carrier boards, the cabinet body has an accommodating space, and the plurality of carrier boards are arranged in the accommodating space of the cabinet body at intervals; a plurality of connecting devices are installed in the cabinet, Each of the connecting devices includes: a circuit substrate with a plurality of load regions, the positions of the plurality of load regions are separated from each other, the circuit substrate is provided with a plurality of contacts in each of the load regions; and at least one adaptor, which can be detachably arranged The circuit board is electrically connected to the plurality of contacts, and each of the adapters has at least one component under test connector; each of the carrier boards of the cabinet is provided with at least one of the plurality of connection devices; and a burn-in machine The test system is installed in the cabinet and electrically connected to the plurality of connection devices.

藉由前述燒機設備,針對不同型號的待測元件僅須更換對應的轉接座,而且本新型燒機設備包含設於機櫃中的燒機測試系統以及電路基板為共用型之構造,故針對不同型號的待測元件僅須更換對應的轉接座即可,且轉接座的體積小、重量輕,讓操作人員能夠更簡便而省力地取置轉接座,具有簡化燒機過程的功效。 With the aforementioned burn-in equipment, it is only necessary to replace the corresponding adapters for different types of components to be tested, and the new burn-in equipment includes a burn-in test system installed in the cabinet and a shared circuit board structure, so it is aimed at Different types of components to be tested only need to replace the corresponding adapter, and the adapter is small in size and light in weight, allowing the operator to easily and effortlessly pick and place the adapter, which has the effect of simplifying the burn-in process .

此外,本新型燒機設備亦具備高度空間充分利用之特性,本新型燒機設備利用機櫃中之容置空間設置多個間隔排列之載板,並以載板提供通用型的電路基板設置,並提供與待測元件相匹配之轉接座設置,在使用過程中,待測元件能集中分層設置之載板上方,並與電路基板上之轉接座電性連接,使該燒機設備具備高度空間充分利用之特性。 In addition, the new type of burn-in equipment also has the characteristics of high space utilization. The new type of burn-in equipment uses the accommodating space in the cabinet to install a plurality of carrier boards arranged at intervals, and provides a universal circuit board setting with the carrier board, and Provide an adapter set that matches the component to be tested. During use, the component to be tested can be concentrated and layered above the carrier board, and electrically connected to the adapter on the circuit board, so that the burn-in equipment has The characteristic of making full use of high space.

10:機櫃 10: Cabinet

11:櫃體 11: Cabinet

110:容置空間 110: accommodating space

12:載板 12: Carrier board

13:前側板 13: Front side panel

14:抽屜滑軌 14: Drawer slide

20:連接裝置 20: Connect the device

21:電路基板 21: Circuit board

210:負載區域 210: load area

211:測試電源接點 211: Test the power contact

212:負載接點 212: Load contact

213:插針座 213: pin seat

22:轉接座 22: Adapter

220:待測元件連接器 220: Component under test connector

221:端子台 221: terminal block

30:待測元件 30: component under test

31:針腳 31: Pin

41:控制裝置 41: control device

42:人機介面裝置 42: Human-machine interface device

43:電源供應器 43: power supply

44:量測裝置 44: Measuring device

45:負載裝置 45: load device

46:儲存裝置 46: storage device

50:電源供應器 50: power supply

51:負載裝置 51: load device

52:量測裝置 52: Measuring device

53:控制裝置 53: control device

60:待測元件 60: component under test

圖1:本新型燒機設備的實施例的前視平面示意圖。 Figure 1: A schematic front plan view of an embodiment of the new burn-in equipment.

圖2:本新型燒機設備的實施例的局部放大示意圖。 Figure 2: A partial enlarged schematic diagram of an embodiment of the new burn-in equipment.

圖3:本新型中,電路基板的俯視平面示意圖。 Figure 3: In the present invention, a schematic top plan view of the circuit substrate.

圖4:本新型中,燒機測試系統的實施例的方塊示意圖。 Figure 4: A block diagram of an embodiment of the burn-in test system in the present invention.

圖5:本新型中,電路基板與轉接座的結合結構的俯視平面示意圖(一)。 Fig. 5: A schematic top plan view of the combined structure of the circuit substrate and the adaptor in the present invention (1).

圖6:本新型中,電路基板與轉接座的結合結構的俯視平面示意圖(二)。 Figure 6: The top plan view of the combined structure of the circuit substrate and the adaptor in the present invention (2).

圖7:本新型中,電路基板與轉接座的結合結構的俯視平面示意圖(三)。 Figure 7: The top plan view of the combined structure of the circuit substrate and the adaptor in the present invention (3).

圖8:本新型中,電路基板與轉接座的結合結構的俯視平面示意圖(四)。 Figure 8: The top plan view of the combined structure of the circuit substrate and the adaptor in the present invention (4).

圖9:習知對一待測元件進行燒機測試的方塊示意圖。 Figure 9: A block diagram of a conventional burn-in test of a device under test.

本新型燒機設備的實施例包含一機櫃、複數連接裝置與一燒機測試系統,各該連接裝置用以連接待測元件,由該燒機測試系統對所述待測元件實施燒機測試,其中,所述待測元件可為積體電路元件(Integrated Circuit,IC),例如直流/直流電源轉換器或交流/直流電源轉換器的IC產品。 The embodiment of the new burn-in equipment includes a cabinet, a plurality of connection devices and a burn-in test system, each of the connection devices is used to connect the component to be tested, and the burn-in test system performs a burn-in test on the component to be tested, Wherein, the component under test may be an integrated circuit component (Integrated Circuit, IC), such as an IC product of a DC/DC power converter or an AC/DC power converter.

如圖1及圖2所示,該機櫃10包含一櫃體11以及複數載板12,該櫃體11中具有一個或一個以上之容置空間110,該複數載板12係間隔設置於該櫃體11的容置空間110中。如圖1及圖2所示的實施例中,其揭示櫃體11中具有開口朝前的一容置空間110,且櫃體11的前側於該開口之側邊處具有一前側板13,該複數載板12係於該容置空間呈上下間隔排列,各該載板12兩側分別結合一抽屜滑軌14連接該櫃體11之側壁,使所述載板12藉由兩側的抽屜滑軌14能被操作自該櫃體11之容置空間110朝前拉出及推入該容置空間110中。 As shown in Figure 1 and Figure 2, the cabinet 10 includes a cabinet body 11 and a plurality of carrier boards 12, the cabinet body 11 has one or more accommodating spaces 110, the plurality of carrier boards 12 are arranged in the cabinet at intervals The accommodating space 110 of the body 11. In the embodiment shown in Figures 1 and 2, it is disclosed that the cabinet 11 has an accommodating space 110 with an opening facing forward, and the front side of the cabinet 11 has a front side plate 13 at the side of the opening. A plurality of carrier boards 12 are arranged at intervals in the accommodating space, and a drawer slide rail 14 is connected to the side wall of the cabinet 11 on both sides of each carrier board 12, so that the carrier board 12 slides through the drawers on both sides. The rail 14 can be operated to be pulled forward from the accommodating space 110 of the cabinet 11 and pushed into the accommodating space 110.

如圖1與圖2所示,該複數連接裝置20裝設於該機櫃10中,且該機櫃10的各該載板12設有該複數連接裝置20中的至少一連接裝置20,在圖1與圖2所示的實施例中,每個載板12上可設有兩個所述連接裝置20。各該連接裝置20包含一電路基板21與至少一轉接座22,該電路基板21與該至少一轉接座22可為印刷電路板(PCB),故該電路基板21與該至少一轉接座22具有電子電路布局(layout),該至少一轉接座22用以連接待測元件30。其中,該電路基板21是固 定在該載板12上,請參考圖3,該電路基板21的頂面具有複數負載區域210,該複數負載區域210的位置彼此分離,該電路基板21於各該負載區域210設有複數接點,該複數接點包含複數測試電源接點211與複數負載接點212,其電連接該電路基板21的電子電路布局。如圖3所示的實施例,該電路基板21具有呈矩陣排列結構的八個負載區域210。該至少一轉接座22可拆組的設置在該電路基板21並電連接該複數接點,各該轉接座22具有至少一待測元件連接器220,其電連接該轉接座22的電子電路布局,各該待測元件連接器220可為複數端子柱或導電彈性夾片,其中,各該端子柱為具導電性的中空圓柱體,各該端子柱或導電彈性夾片豎立在該轉接座22的頂面,該複數端子柱或導電彈性夾片的位置係對應待測元件30的針腳31(pin)位置,是以,一個待測元件30即能在一組待測元件連接器220上插拔。 As shown in FIGS. 1 and 2, the plurality of connecting devices 20 are installed in the cabinet 10, and each of the carrier boards 12 of the cabinet 10 is provided with at least one connecting device 20 of the plurality of connecting devices 20, as shown in FIG. 1 As in the embodiment shown in FIG. 2, each carrier board 12 may be provided with two connecting devices 20. Each of the connecting devices 20 includes a circuit substrate 21 and at least one adapter 22. The circuit substrate 21 and the at least one adapter 22 may be printed circuit boards (PCB), so the circuit substrate 21 and the at least one adapter 22 The socket 22 has an electronic circuit layout, and the at least one adapter socket 22 is used to connect the device under test 30. Wherein, the circuit board 21 is solid Set on the carrier board 12, please refer to FIG. 3. The top surface of the circuit substrate 21 has a plurality of load areas 210, and the positions of the plurality of load areas 210 are separated from each other. The circuit substrate 21 is provided with a plurality of connections on each load area 210. Point, the plurality of contacts includes a plurality of test power contacts 211 and a plurality of load contacts 212, which are electrically connected to the electronic circuit layout of the circuit board 21. As shown in the embodiment shown in FIG. 3, the circuit substrate 21 has eight load areas 210 in a matrix arrangement. The at least one adapter 22 is detachably arranged on the circuit substrate 21 and electrically connected to the plurality of contacts. Each adapter 22 has at least one DUT connector 220, which is electrically connected to the adapter 22. Electronic circuit layout, each of the component under test connectors 220 can be a plurality of terminal posts or conductive elastic clips, wherein each of the terminal posts is a hollow cylinder with conductivity, and each terminal post or conductive elastic clip stands on the On the top surface of the adapter 22, the position of the plurality of terminal posts or conductive elastic clips corresponds to the pin 31 (pin) position of the component under test 30, so one component under test 30 can be connected to a group of components under test Plug and unplug the device 220.

該轉接座22與該電路基板21的結合方式可透過插針(pin)與端子台,例如圖2所示,該轉接座22的底面可設置透過其電子電路布局電連接該待測元件連接器220的端子台221,該電路基板21的每個負載區域210的頂面可設置有透過其電子電路布局電連接其測試電源接點211與複數負載接點212的插針座213,該轉接座22上的端子台221可拆組的連接該電路基板21上的插針座213,即插針座213的插針能插入並連接端子台221的插孔,使該轉接座22的電子電路布局與該電路基板21的電子電路布局構成電性連接。是以,透過上述連接架構,當該轉接座22設置在該電路基板21時,該轉接座22的待測元件連接器220即可電連接該電路基板21之負載區域210的測試電源接點211與負載接點212;又當該待測元件30設置在該轉接座22的待測元件連接器220時,該待測元件30能透過該轉接座22而電連接該電路基板21之負載區域210的測試電源接點211與負載接點212。 The connecting method of the adapter 22 and the circuit substrate 21 can be through pins and terminal blocks. For example, as shown in FIG. 2, the bottom surface of the adapter 22 can be arranged to electrically connect the component under test through its electronic circuit layout. For the terminal block 221 of the connector 220, the top surface of each load area 210 of the circuit substrate 21 can be provided with a pin seat 213 that electrically connects its test power contact 211 and a plurality of load contacts 212 through its electronic circuit layout. The terminal block 221 on the adapter 22 can be detachably connected to the pin block 213 on the circuit board 21, that is, the pins of the pin block 213 can be inserted into and connected to the socket of the terminal block 221, so that the adapter 22 The electronic circuit layout of the circuit board 21 is electrically connected to the electronic circuit layout of the circuit board 21. Therefore, through the above-mentioned connection structure, when the adapter 22 is disposed on the circuit substrate 21, the DUT connector 220 of the adapter 22 can be electrically connected to the test power connection of the load area 210 of the circuit substrate 21. Point 211 and load contact 212; and when the component under test 30 is set on the component under test connector 220 of the adapter 22, the component under test 30 can be electrically connected to the circuit substrate 21 through the adapter 22 The test power contact 211 and the load contact 212 of the load area 210.

該燒機測試系統裝設於該機櫃10中並電連接該複數連接裝置20,請參考圖4,該燒機測試系統可包含一控制裝置41與電連接該控制裝置41的一人機介面裝置42、複數電源供應器43、複數量測裝置44、複數負載裝置45與一儲存裝置46,其中,圖4僅以一個電源供應器43、一個量測裝置44與一個負載裝置45舉例說明,一個連接裝置20可對應連接一個電源供應器43、一個量測裝置44與一個負載裝置45。該電源供應器43、該量測裝置44與該負載裝置45可電連接該連接裝置20的電路基板21的電子電路布局,以與所述待測元件30構成電性連接,該控制裝置41可調控該電源供應器43輸出至各待測元件的測試電源的大小,該負載裝置45可為電子負載(electronic load),該量測裝置44可為數位電表以量測待測元件30的輸出電壓及/或電流,該控制裝置41從該量測裝置44接收其量測資料,該控制裝置41可將所述量測資料儲存在儲存裝置46(例如硬碟),並可透過該人機介面裝置42的顯示器呈現量測資料給使用者檢視。如圖1所示,該人機介面裝置42可裝設於該櫃體11之前側板13,以供操作人員檢視及操作,舉例來說,該人機介面裝置42可為觸控顯示面板。 The burn-in test system is installed in the cabinet 10 and is electrically connected to the plurality of connection devices 20. Please refer to FIG. 4. The burn-in test system may include a control device 41 and a man-machine interface device 42 electrically connected to the control device 41 , A plurality of power supplies 43, a plurality of measurement devices 44, a plurality of load devices 45 and a storage device 46, wherein, Figure 4 only a power supply 43, a measurement device 44 and a load device 45 for example, one connected The device 20 can be connected to a power supply 43, a measuring device 44 and a load device 45 correspondingly. The power supply 43, the measuring device 44 and the load device 45 can be electrically connected to the electronic circuit layout of the circuit board 21 of the connecting device 20 to form an electrical connection with the component under test 30. The control device 41 can Regulate the size of the test power output from the power supply 43 to each component under test. The load device 45 can be an electronic load. The measuring device 44 can be a digital meter to measure the output voltage of the component under test 30. And/or current, the control device 41 receives its measurement data from the measurement device 44, the control device 41 can store the measurement data in a storage device 46 (such as a hard disk), and can use the man-machine interface The display of the device 42 presents the measurement data for the user to view. As shown in FIG. 1, the man-machine interface device 42 can be installed on the front side panel 13 of the cabinet 11 for the operator to view and operate. For example, the man-machine interface device 42 can be a touch display panel.

本新型的連接裝置20能因應各式待測元件30而包含數種態樣,且透過該電路基板21與該轉接座22的電子電路布局,讓複數負載區域210的接點形成並聯連接,讓複數待測元件連接器220形成並聯連接,使複數負載區域210與複數待測元件連接器220可分配或平均分配該負載裝置45的負載量,舉例說明如下。 The connecting device 20 of the present invention can include several aspects in response to various types of components 30 under test, and through the electronic circuit layout of the circuit board 21 and the adapter 22, the contacts of the plurality of load regions 210 are connected in parallel. Let the plurality of DUT connectors 220 form a parallel connection, so that the plurality of load areas 210 and the plurality of DUT connectors 220 can distribute or evenly distribute the load of the load device 45. Examples are as follows.

1、態樣一 1. Aspect One

請參考圖2與圖5,該至少一轉接座22為複數轉接座22,該複數轉接座22的數量與該電路基板21之該複數負載區域210的數量相同,舉例來說,該複數轉接座22的數量可為八個,該電路基板21之該複數負載區域210的數量亦為八個,以形成一對一的對應連接,即一個轉接座22設置在一個負載區 域210。如前所述,每個轉接座22可設有一個或多個待測元件連接器220,當各該轉接座22設有複數待測元件連接器220時,請參考圖2與圖5以每個轉接座22設有兩組待測元件連接器220為例,其分別供設置待測元件30,各該待測元件30透過該轉接座22和該電路基板21的電子電路布局而與該電源供應器43、該負載裝置45、該量測裝置44構成訊號連接,使各該待測元件30能接受測試,是以,以圖5所示的實施例而言,該電路基板21上設有八個轉接座22,每個轉接座22設有兩個待測元件30,故該連接裝置20一共設有十六個待測元件30。當該負載裝置45的加載量為600瓦特(W),每個待測元件30相當於分配到37.5瓦特(W)的負載量,所述加載量是指該負載裝置45所模擬出的負載量的功率上限。再舉一例,請參考圖6,當每個轉接座22僅設有單一個待測元件30,且該負載裝置45的加載量為600瓦特(W)時,每個待測元件30相當於分配到75瓦特(W)的負載量。是以,每個轉接座22可視需求設有不同數量的待測元件連接器220以供連接待測元件30,待測元件30的負載量可依前述範例類推。 2 and 5, the at least one adapter 22 is a plurality of adapters 22, the number of the plurality of adapters 22 is the same as the number of the plurality of load areas 210 of the circuit board 21, for example, the The number of the plurality of adapters 22 can be eight, and the number of the plurality of load areas 210 of the circuit board 21 is also eight to form a one-to-one correspondence connection, that is, one adapter 22 is arranged in one load area. Domain 210. As mentioned above, each adaptor 22 can be provided with one or more DUT connectors 220. When each adaptor 22 is provided with a plurality of DUT connectors 220, please refer to Figures 2 and 5 Take, for example, that each adapter 22 is provided with two sets of DUT connectors 220, which are respectively provided for the DUT 30, and each DUT 30 passes through the adapter 22 and the electronic circuit layout of the circuit board 21 The power supply 43, the load device 45, and the measuring device 44 form a signal connection, so that each component under test 30 can be tested. Therefore, in the embodiment shown in FIG. 5, the circuit board There are eight adapter seats 22 on the 21, and each adapter seat 22 is equipped with two components to be tested 30, so the connecting device 20 is equipped with a total of sixteen components to be tested 30. When the load capacity of the load device 45 is 600 watts (W), each component under test 30 is equivalent to the load capacity allocated to 37.5 watts (W), and the load capacity refers to the load capacity simulated by the load device 45 Power limit. For another example, please refer to FIG. 6, when each adapter 22 is provided with only a single component under test 30, and the load capacity of the load device 45 is 600 watts (W), each component under test 30 is equivalent to Allocate to a load of 75 watts (W). Therefore, each adaptor 22 can be provided with a different number of DUT connectors 220 for connecting the DUT 30 according to requirements, and the load of the DUT 30 can be deduced according to the foregoing example.

2、態樣二 2. Aspect Two

該至少一轉接座22為複數轉接座22,該複數轉接座22的數量少於該電路基板21之該複數負載區域210的數量,各該轉接座22的待測元件連接器220電連接該電路基板21之至少二個負載區域210的接點,也就是說,各該轉接座22的待測元件連接器220電連接該電路基板21之部分負載區域210的測試電源接點211與負載接點212,亦即一個轉接座22可對應設置在多個負載區域210,而為一對多的設置結構。請參考圖7為例,每個轉接座22設置在兩個負載區域210,各該轉接座22的底面設有複數端子台221,該複數端子台221的位置對應於該兩負載區域210之插針座213的位置而能對應插接,每個轉接座22可設有單一個或多個待測元件連接器220,圖7僅以一個待測元件連接器220為例,以供設置一個待測元件30。整體來看,圖7所示的該連接裝置20一共設有四個 待測元件30,當該負載裝置45的加載量為600瓦特(W),每個待測元件30相當於分配到150瓦特(W)的負載量。是以,每個轉接座22可視需求設有不同數量的待測元件連接器220以供連接待測元件30,待測元件30的負載量可依前述範例類推。 The at least one adapter 22 is a plurality of adapters 22, the number of the plurality of adapters 22 is less than the number of the plurality of load regions 210 of the circuit board 21, and the DUT connector 220 of each adapter 22 Electrically connect the contacts of at least two load areas 210 of the circuit board 21, that is, the DUT connector 220 of each adapter 22 is electrically connected to the test power contacts of a part of the load area 210 of the circuit board 21 211 and load contacts 212, that is, one adapter 22 can be correspondingly arranged in multiple load areas 210, and is a one-to-many arrangement structure. Please refer to FIG. 7 as an example. Each adapter 22 is arranged in two load areas 210, and the bottom surface of each adapter 22 is provided with a plurality of terminal blocks 221, and the position of the plurality of terminal blocks 221 corresponds to the two load areas 210. The position of the pin seat 213 can be inserted correspondingly. Each adapter 22 can be provided with a single or multiple DUT connectors 220. FIG. 7 only uses one DUT connector 220 as an example. Set up a component 30 to be tested. On the whole, the connecting device 20 shown in FIG. 7 has a total of four For the component under test 30, when the load capacity of the load device 45 is 600 watts (W), each component under test 30 is equivalent to a load assigned to 150 watts (W). Therefore, each adaptor 22 can be provided with a different number of DUT connectors 220 for connecting the DUT 30 according to requirements, and the load of the DUT 30 can be deduced according to the foregoing example.

3、態樣三 3. Aspect Three

該至少一轉接座22為單一轉接座22,該轉接座22的待測元件連接器220電連接該電路基板21之所有該複數負載區域210的接點,亦即一個轉接座22的底面設有複數端子台221,該複數端子台221的位置對應於該複數負載區域210之插針座213的位置而能對應插接,而為一對多的設置結構。請參考圖8為例,該轉接座22可設有單一個待測元件連接器220以供設置一個待測元件30,當該負載裝置45的加載量為600瓦特(W),該待測元件30相當於分配到600瓦特(W)的負載量。是以,每個轉接座22可視需求設有不同數量的待測元件連接器220以供連接待測元件30,待測元件30的負載量可依前述範例類推。 The at least one adaptor 22 is a single adaptor 22, and the DUT connector 220 of the adaptor 22 is electrically connected to all the contacts of the plurality of load areas 210 of the circuit board 21, that is, an adaptor 22 A plurality of terminal blocks 221 are provided on the bottom surface of the plurality of terminal blocks 221, and the position of the plurality of terminal blocks 221 corresponds to the position of the pin seat 213 of the plurality of load areas 210 and can be inserted correspondingly, and is a one-to-many arrangement structure. Please refer to FIG. 8 as an example. The adapter 22 may be provided with a single DUT connector 220 for setting a DUT 30. When the loading capacity of the load device 45 is 600 watts (W), the DUT connector 220 The element 30 corresponds to a load distributed to 600 watts (W). Therefore, each adaptor 22 can be provided with a different number of DUT connectors 220 for connecting the DUT 30 according to requirements, and the load of the DUT 30 can be deduced according to the foregoing example.

需說明的是,前述態樣的電路架構僅為範例,實際應用時,各該轉接座22上的電子電路布局可因應測試需求及各式待測元件30的屬性而有多元、彈性設計。此外,各該轉接座22的尺寸及其底面設有對應數量與對應位置的端子台221,以供能對應插設在多個負載區域210的插針座213。 It should be noted that the circuit structure of the aforementioned aspect is only an example. In actual application, the electronic circuit layout on each adapter 22 can be designed in multiple and flexible ways according to the test requirements and the attributes of the various components under test 30. In addition, the size of each adapter 22 and its bottom surface are provided with corresponding numbers and corresponding positions of the terminal blocks 221 to provide energy for the corresponding pin sockets 213 inserted in the plurality of load areas 210.

綜上所述,在本新型中,針對不同型號的待測元件30僅須設置、更換對應的轉接座22,且本新型燒機設備包含設於機櫃10中的燒機測試系統以及電路基板21為共用型之構造,針對不同型號的待測元件30僅須更換對應的轉接座22即可,且轉接座22的體積小、重量輕,讓操作人員能夠更簡便而省力地取置轉接座22,具有簡化燒機過程的功效。本新型燒機設備還能進一步令該櫃體中具有開口朝前的一所述容置空間110,該櫃體11的前側具有前側板13,該複數載板12於該容置空間110呈上下間隔排列,使該櫃體11更能充分利 用空間提供多組待測元件30執行燒機程序。再者,本明燒機設備還能進一步令該櫃體11中之各該載板12兩側分別結合抽屜滑軌14連接該櫃體11,使所述載板12能被操作而自該櫃體11之容置空間110移出及送入該容置空間110中,以便於待測元件30於櫃體11內之電路基板21上的轉接座22上之拆組作業。 To sum up, in the present invention, only the corresponding adaptor 22 needs to be set and replaced for different types of components 30 under test, and the burn-in equipment of the present invention includes a burn-in test system and a circuit substrate arranged in the cabinet 10 21 is a shared structure. For different types of components 30 to be tested, only the corresponding adapter 22 needs to be replaced. The adapter 22 is small in size and light in weight, allowing the operator to pick and place more easily and effortlessly. The adapter 22 has the effect of simplifying the burn-in process. The new burn-in equipment can further enable the cabinet body to have a accommodating space 110 with an opening facing forward. The cabinet body 11 has a front side plate 13 on the front side. Arranged at intervals, so that the cabinet 11 can fully benefit Use space to provide multiple sets of components under test 30 to execute the burn-in program. Furthermore, the burning machine equipment of the present invention can further enable the two sides of each carrier board 12 in the cabinet 11 to be connected to the cabinet 11 with drawer slide rails 14 respectively, so that the carrier board 12 can be operated from the cabinet. The accommodating space 110 of the body 11 is moved out and sent into the accommodating space 110 to facilitate the disassembly and assembly operation of the component 30 to be tested on the adapter 22 on the circuit board 21 in the cabinet 11.

10:機櫃 10: Cabinet

11:櫃體 11: Cabinet

110:容置空間 110: accommodating space

12:載板 12: Carrier board

13:前側板 13: Front side panel

14:抽屜滑軌 14: Drawer slide

20:連接裝置 20: Connect the device

21:電路基板 21: Circuit board

22:轉接座 22: Adapter

30:待測元件 30: component under test

42:人機介面裝置 42: Human-machine interface device

Claims (7)

一種燒機設備,其包含: 一機櫃,其包含一櫃體以及複數載板,該櫃體中具有一容置空間,該複數載板間隔設置於該櫃體的容置空間中; 複數連接裝置,裝設於該機櫃中,各該連接裝置包含: 一電路基板,具有複數負載區域,該複數負載區域的位置彼此分離,該電路基板於各該負載區域設有複數接點;及 至少一轉接座,可拆組的設置在該電路基板並電連接該複數接點,各該轉接座具有至少一待測元件連接器; 該機櫃的各該載板設有該複數連接裝置中的至少一連接裝置;以及 一燒機測試系統,裝設於該機櫃中並電連接該複數連接裝置。 A burn-in device, which includes: A cabinet including a cabinet body and a plurality of carrier boards, the cabinet body has an accommodating space, and the plurality of carrier boards are arranged at intervals in the accommodating space of the cabinet body; A plurality of connecting devices are installed in the cabinet, and each of the connecting devices includes: A circuit substrate having a plurality of load regions, the positions of the plurality of load regions are separated from each other, the circuit substrate is provided with a plurality of contacts in each of the load regions; and At least one adaptor, detachably arranged on the circuit substrate and electrically connected to the plurality of contacts, each adaptor has at least one DUT connector; Each carrier board of the cabinet is provided with at least one connecting device among the plurality of connecting devices; and A burn-in test system is installed in the cabinet and electrically connected to the plurality of connection devices. 如請求項1所述之燒機設備,其中,該櫃體的前側具有一前側板,該複數載板於該容置空間呈上下間隔排列。The burn-in device according to claim 1, wherein the front side of the cabinet body has a front side plate, and the plurality of carrier plates are arranged at an upper and lower interval in the accommodating space. 如請求項1或2所述之燒機設備,其中,各該載板兩側分別結合一抽屜滑軌連接該櫃體。The burn-in equipment according to claim 1 or 2, wherein two sides of each carrier board are respectively connected with a drawer slide rail to connect to the cabinet. 如請求項1所述的燒機設備,其中,各該轉接座的該至少一待測元件連接器為複數待測元件連接器。The burn-in device according to claim 1, wherein the at least one component under test connector of each adapter is a plurality of component under test connectors. 如請求項1所述的燒機設備,其中,各該轉接座的該至少一待測元件連接器為單一待測元件連接器。The burn-in device according to claim 1, wherein the at least one component under test connector of each adapter is a single component under test connector. 如請求項1所述的燒機設備,其中,該至少一轉接座為複數轉接座,各該轉接座的待測元件連接器電連接該電路基板之至少二所述負載區域的接點。The burn-in device according to claim 1, wherein the at least one adaptor is a plurality of adaptors, and the DUT connector of each adaptor is electrically connected to at least two of the load areas of the circuit substrate point. 如請求項1所述的燒機設備,其中,該至少一轉接座為單一轉接座,其待測元件連接器電連接該電路基板之該複數負載區域的接點。The burn-in device according to claim 1, wherein the at least one adapter is a single adapter, and the DUT connector is electrically connected to the contacts of the plurality of load areas of the circuit substrate.
TW110205882U 2021-05-21 2021-05-21 Burn-in apparatus TWM616102U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI860799B (en) * 2023-07-28 2024-11-01 周宗貴 Power board structure of integrated circuit burn-in system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI860799B (en) * 2023-07-28 2024-11-01 周宗貴 Power board structure of integrated circuit burn-in system

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