TW202213612A - Vacuum-laminating device and method of manufacturing laminated body - Google Patents
Vacuum-laminating device and method of manufacturing laminated body Download PDFInfo
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- TW202213612A TW202213612A TW110134916A TW110134916A TW202213612A TW 202213612 A TW202213612 A TW 202213612A TW 110134916 A TW110134916 A TW 110134916A TW 110134916 A TW110134916 A TW 110134916A TW 202213612 A TW202213612 A TW 202213612A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
- B32B38/1833—Positioning, e.g. registration or centering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
- B32B38/1833—Positioning, e.g. registration or centering
- B32B38/1841—Positioning, e.g. registration or centering during laying up
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1858—Handling of layers or the laminate using vacuum
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
本發明特別是關於具有可拆裝之運送板的真空積層裝置及積層體的製造方法。 In particular, the present invention relates to a vacuum lamination device having a detachable conveying plate and a method for manufacturing a lamination body.
真空積層裝置係將構成電子零件之複數片工件(workpiece)進行積層者,具有對準(alignment)手段及積層手段。此對準手段係在藉由積層手段將工件進行積層之前,藉由進行各工件的對位而能夠抑制要形成之積層體之各工件彼此的偏移。再者,積層手段要進行工件的積層動作時,藉由在真空下進行積層而防止空氣混入工件之層間。於如此的真空下,為了使工件吸附固定,乃採用例如帶電固定等負壓抽吸以外的手段。 A vacuum lamination device is a device for laminating a plurality of workpieces constituting an electronic component, and has an alignment means and a lamination means. This alignment means can suppress the misalignment of the workpieces in the layered body to be formed by aligning the workpieces before laminating the workpieces by the lamination means. Furthermore, when the lamination means is to perform the lamination operation of the workpieces, the lamination is performed under vacuum to prevent air from entering between the layers of the workpieces. Under such a vacuum, in order to adsorb and fix the workpiece, means other than negative pressure suction such as charging and fixing are used.
在此說明,於專利文獻1記載有:一種真空積層裝置,係於真空室內具備帶電手段及對準手段,使一方的工件帶電固定於帶電手段,並將另一方的工件載置於對準手段,於設成真空下的真空室(vacuum chamber)內進行對準動作或積層動作者。
Here,
[先前技術文獻] [Prior Art Literature]
[專利文獻] [Patent Literature]
專利文獻1:日本特開2013-167712號公報 Patent Document 1: Japanese Patent Laid-Open No. 2013-167712
然而,於專利文獻1中,因對於由多數個零件構成的帶電手段及對準手段施予用以維持密封性或滑動性等真空措施,會有造成增加成本之虞。
However, in
本發明係鑒於上述課題而完成者,目的在於提供一種真空積層裝置及積層體的製造方法,該真空積層裝置及積層體的製造方法能夠使需要進行真空措施的零件減少,而進行對準動作及積層動作。 The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a vacuum lamination apparatus and a method for manufacturing a laminated body that can perform an alignment operation and Layered action.
為了解決上述課題,本發明的真空積層裝置,係將複數片工件依序積層的真空積層裝置,具備:運送板,係保持前述工件;對準手段,係固定支撐前述運送板,並且進行前述運送板所保持的前述工件的對位;積層手段,係於真空下將已對位的前述工件積層於積層台上;及運送手段,係移動於前述對準手段與前述積層手段之間,於前述工件保持於前述運送板的狀態下,固定支撐前述運送板,並且將前述工件從前述對準手段運送至前述積層手段;前述運送板係可與前述對準手段及前述運送手段各自拆裝,且係將前述工件帶電固定於一側,另一側與前述運送手段磁性固定者。 In order to solve the above-mentioned problems, a vacuum lamination apparatus of the present invention is a vacuum lamination apparatus for sequentially laminating a plurality of workpieces, and includes a conveying plate for holding the workpieces, and alignment means for fixedly supporting the conveying plate and carrying out the conveying. Alignment of the workpieces held by the plate; lamination means for laminating the aligned workpieces on a lamination table under vacuum; and transport means for moving between the alignment means and the lamination means, in the above The workpiece is held on the conveying plate, the conveying plate is fixedly supported, and the workpiece is conveyed from the alignment means to the stacking means; the conveying plate is detachable from the alignment means and the conveying means, respectively, and The workpiece is charged and fixed on one side, and the other side is magnetically fixed with the conveying means.
再者,上述真空積層裝置中,也可設成前述運送板係由磁性體構成,並且前述運送板的一側設有絕緣體。 Furthermore, in the above-mentioned vacuum lamination apparatus, the conveying plate may be formed of a magnetic body, and an insulator may be provided on one side of the conveying plate.
再者,上述真空積層裝置中,也可設成前述運送板係將與具有 黏著性之前述工件的第一面為相反之側之非黏著性的第二面予以帶電固定者。 Furthermore, in the above-mentioned vacuum lamination apparatus, the conveying plate system may be provided with the The adhesive first surface of the workpiece is the opposite non-adhesive second surface to be charged and fixed.
再者,上述真空積層裝置中,也可設成前述對準手段係具備對準台及設於前述對準台上的設置區塊,前述運送板係以使前述工件與前述對準台呈非接觸狀態的方式載置於前述設置區塊。 Furthermore, in the above-mentioned vacuum lamination apparatus, the alignment means may include an alignment stage and a setting block provided on the alignment stage, and the conveying plate may be configured so that the workpiece and the alignment stage are not aligned. The contact state is placed in the aforementioned setting block.
再者,上述真空積層裝置中,也可設成使前述運送手段抵接於前述積層手段而形成密閉空間,並且於設成真空下的前述密閉空間內,藉由前述運送手段使前述運送板移動而將前述工件積層。 Furthermore, in the above-mentioned vacuum lamination apparatus, the conveyance means may be in contact with the lamination means to form a closed space, and the conveyance plate may be moved by the conveyance means in the closed space under vacuum. Instead, the aforementioned workpieces are laminated.
再者,上述真空積層裝置也可設成更具備運送板回收手段,前述運送板回收手段係可對前述運送板進行除電而將前述運送板自前述工件剝離,並將前述運送板回收。 Furthermore, the vacuum lamination apparatus may further include conveying plate recovery means for removing static electricity from the conveying plate, peeling the conveying plate from the workpiece, and recovering the conveying plate.
為了解決上述課題,本發明的積層體的製造方法,係將複數片工件依序積層之積層體的製造方法,包含:將前述工件帶電固定於前述運送板之一側的步驟;於將前述運送板固定支撐於對準台的狀態下,進行被前述運送板帶電固定的前述工件之對位的步驟;在將前述工件帶電固定於前述運送板之一側的狀態下,將前述運送板的另一側磁性固定,並將已對位的前述工件自前述對準台運送至積層台的步驟;及於真空下,將已對位的前述工件積層於前述積層台上的步驟。 In order to solve the above-mentioned problems, the method for manufacturing a layered product of the present invention is a method for manufacturing a layered product in which a plurality of workpieces are sequentially layered, including the steps of: charging and fixing the workpieces to one side of the conveying plate; In the state where the plate is fixed and supported on the alignment stage, the step of aligning the workpieces charged and fixed by the transport plate is performed; in the state where the workpiece is charged and fixed on one side of the transport plate, the other side of the transport plate is charged. One side is magnetically fixed, and the aligned workpieces are transported from the alignment stage to the stacking stage; and the aligned workpieces are stacked on the stacking stage under vacuum.
再者,上述積層體的製造方法中,也可設成前述運送工件的步驟係使前述運送板磁性固定於具有上壁及側壁的真空室內,且藉由使前述真空室抵接於前述積層台而形成密閉空間。 Furthermore, in the above-mentioned method of manufacturing a layered body, the step of conveying the workpiece may be such that the conveying plate is magnetically fixed in a vacuum chamber having an upper wall and a side wall, and the vacuum chamber is brought into contact with the lamination table. form a closed space.
依據本發明,能夠提供一種真空積層裝置及積層體的製造方 法,該真空積層裝置及積層體的製造方法能夠使需要施加真空措施的零件減少,而進行對準動作及積層動作。 According to the present invention, it is possible to provide a vacuum lamination apparatus and a method for manufacturing a laminated body The vacuum lamination device and the method for manufacturing a laminated body can reduce the number of parts requiring vacuum measures, and perform the alignment operation and the lamination operation.
1:運送板 1: Shipping board
1a:運送板1之一側
1a: one side of the
1b:運送板1之另一側
1b: The other side of the
10:翻轉單元(翻轉手段) 10: Flip unit (flip means)
11:翻轉台 11: Flip table
20:帶電單元(帶電手段) 20: Charged unit (charged means)
21:荷電粒子照射部 21: Charged particle irradiation section
30:對準單元(對準手段) 30: Alignment unit (alignment means)
31:對準台 31: Alignment stage
32:設置區塊 32: Setting Blocks
33:XY θ軸電動致動器 33: XY theta axis electric actuator
34:對準攝像單元 34: Align the camera unit
40:運送單元(運送手段) 40: Delivery unit (transportation means)
41:真空室 41: Vacuum Chamber
41s:周壁 41s: Zhou Wall
41t:上壁 41t: Upper wall
42:運送板夾頭 42: Transport plate chuck
42h:貫穿孔 42h: Through hole
42m:磁力部 42m: Magnetic part
43:升降活塞 43: Lifting Piston
44:導軸部 44: Guide shaft
45:剝離活塞 45: Peel Piston
50:積層單元 50: Lamination unit
51:積層台 51: Stacking table
60:運送板回收單元(運送板回收手段) 60: Transport board recovery unit (transport board recovery means)
61:把持手段 61: Control means
62:除電手段 62: Elimination means
100:真空積層裝置 100: Vacuum Lamination Device
A:帶電/翻轉位置 A: Live/flipped position
a:黏著層 a: adhesive layer
B:對準台位置 B: Alignment stage position
C:待機位置 C: Standby position
c:荷電粒子 c: charged particle
D:積層台位置 D: Position of the stacking table
G:把持位置 G: Holding position
i:除電空氣 i: static-removing air
L:積層體 L: Laminate
p:保護層 p: protective layer
Pa:大氣壓 Pa: atmospheric pressure
W:工件 W: workpiece
Wa:帶黏著劑的工件 Wa: Workpiece with adhesive
圖1係顯示本發明之實施型態之真空積層裝置的俯視示意圖。 FIG. 1 is a schematic top view of a vacuum lamination device according to an embodiment of the present invention.
圖2係於XZ平面截斷圖1所示的真空積層裝置而得的剖視示意圖。 FIG. 2 is a schematic cross-sectional view of the vacuum lamination device shown in FIG. 1 cut along the XZ plane.
圖3係說明從工件之積層工序中的帶電動作至對準動作為止的剖視示意圖,分別為(a)顯示帶電動作,(b)顯示保護層之剝離及翻轉單元所為的翻轉動作,(c)顯示翻轉單元所為的運送動作,(d)顯示對準動作。 3 is a schematic cross-sectional view illustrating the charging operation in the lamination process of the workpiece to the alignment operation, respectively (a) showing the charging operation, (b) showing the peeling of the protective layer and the inverting operation by the inverting unit, (c) respectively. ) shows the conveying action performed by the inversion unit, and (d) shows the alignment action.
圖4係說明工件之積層工序中的運送單元所為的運送動作的剖視示意圖,分別為(a)顯示運送準備狀態,(b)顯示運送板的磁性固定狀態,(c)顯示與對準台的分離狀態,(d)顯示對積層台的抵接狀態。 4 is a schematic cross-sectional view illustrating the conveying operation performed by the conveying unit in the lamination process of workpieces, respectively (a) showing the state of preparation for conveying, (b) showing the magnetic fixing state of the conveying plate, (c) showing the alignment stage The separated state of , (d) shows the abutment state to the stacking table.
圖5係說明工件之積層工序中的真空下的積層動作的剖視示意圖,分別為(a)顯示抽真空狀態,(b)顯示積層狀態,(c)顯示剝離活塞的伸展狀態,(d)顯示運送板的磁性固定解除狀態,(e)顯示剝離活塞的收縮狀態。 5 is a schematic cross-sectional view illustrating the lamination operation under vacuum in the lamination process of the workpiece, respectively (a) showing the vacuuming state, (b) showing the lamination state, (c) showing the extended state of the peeling piston, (d) The magnetic fixation release state of the conveying plate is shown, and (e) the retracted state of the peeling piston is shown.
圖6係說明工件之積層工序中的運送板的回收動作的剖視示意圖(a)~(c)、(e)及俯視示意圖(d),分別為(a)顯示大氣開放狀態,(b)顯示運送單元與積層台的分離狀態,(c)、(d)顯示運送板的回收動作,(e)顯示運送板的回收動作結束狀態。 6 is a schematic cross-sectional view (a) to (c), (e) and a schematic plan view (d) for explaining the recovery operation of the conveying plate in the lamination process of the workpieces, respectively (a) showing the open air state, (b) The separation state of the conveying unit and the stacking table is displayed, (c) and (d) show the recovery operation of the conveying plate, and (e) shows the completed state of the collecting operation of the conveying plate.
以下一邊參照圖式一邊詳細地說明本發明的實施型態。以下說明的實施型態係例示將本發明具體地實現的型態者。因此,依據可應用本發明的裝置的構成或各種條件,以下說明的實施型態的構成應可適當地修正或變更者,本發明並非限定於以下的實施型態者。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The embodiments described below are examples of those in which the present invention is embodied. Therefore, depending on the configuration of the device to which the present invention can be applied and various conditions, the configuration of the embodiments described below should be appropriately modified or changed, and the present invention is not limited to the following embodiments.
<關於用語> <About terminology>
在本說明書及申請專利範圍的記載中,如以下的方式定義各用語。所指的「積層」係表示複數片(包含二片)的貼合。所指的「積層體」係表示將複數片(包含二片)的工件W貼合而成者。所指的「沿XY θ軸的移動」係表示沿X軸方向及Y軸方向的移動與沿θ軸方向的轉動。 In the description of this specification and the claim, each term is defined as follows. The "lamination" referred to means lamination of a plurality of sheets (including two sheets). The "layered body" referred to means what is formed by bonding a plurality of (including two) workpieces W together. The "movement along the XY θ axis" refers to the movement along the X axis direction and the Y axis direction and the rotation along the θ axis direction.
圖1係顯示本發明之實施型態之真空積層裝置100的俯視示意圖。圖2係於XZ平面截斷圖1所示的真空積層裝置100而得的剖視示意圖。在此說明,X軸方向係表示對工件W實施各處理工序時工件W移動的方向,Y軸方向係表示與X軸方向正交的方向。再者,Z軸方向係表示與X軸方向及Y軸方向正交,且表示對工件W實施各處理工序時工件W面對的方向。
FIG. 1 is a schematic top view showing a
<關於真空積層裝置> <About the vacuum lamination device>
真空積層裝置100係將屬於電子零件經薄化後的各種基板之複數片工件W予以高精度且高速地積層的裝置。此真空積層裝置100具備:運送板1、翻轉單元(翻轉手段)10、帶電單元(帶電手段)20、對準單元(對準手段)30、運送單元(運送手段)40、積層單元(積層手段)50及運送板回收單元(運送板回收手段)60。以下依此等單元的順序進行說明。此外,真空積層裝置100更具備控制手段(未圖
示),該控制手段係對於翻轉單元10、帶電單元20、對準單元30、運送單元40、積層單元50及運送板回收單元60的驅動等進行控制。
The
於本實施型態中,如圖3之(a)所示,工件W係使用單面側(第一面)設有黏著層a及防止塵埃等附著於此黏著層a的保護層p者。然而不限於此,例如能夠使用兩面側設有黏著層a及保護層p者,或任何一面都未設有黏著層a及保護層p者等各式各樣之樣態的工件W。 In this embodiment, as shown in FIG. 3( a ), the workpiece W is provided with an adhesive layer a on one side (first side) and a protective layer p for preventing dust and the like from adhering to the adhesive layer a. However, it is not limited to this, for example, various types of workpieces W such as those provided with the adhesive layer a and the protective layer p on both sides or without the adhesive layer a and the protective layer p on either side can be used.
<關於運送板> <About the delivery board>
在從Z軸方向來看時,運送板1係具有以能夠將工件W載置成不會突出的方式而設定的大致矩形形狀,且由鐵系及SUS440等磁性體構成。再者,於屬於運送板1的表面之一側1a(參照圖3之(a))之至少可載置工件W的區域供設置絕緣體(未圖示),例如,矽橡膠等矽系材料。透過此絕緣體,於運送板1的一側1a供工件W帶電固定。另一方面,位於與一側1a相反之側之屬於運送板1之背面的另一側1b(參照圖3之(a))係藉由運送板夾頭42(參照圖4之(b))而磁性固定。
When viewed from the Z-axis direction, the conveying
本實施型態的運送板1係由磁性體構成,藉由於一側1a設置絕緣體,對於相同的運送板1能夠應用不同的固定手段(於運送板1的一側1a帶電固定、及於運送板1的另一側1b磁性固定)。再者,於本實施型態中,藉由將運送板1設成可對於各單元(翻轉單元10、對準單元30、運送單元40)拆裝,工件W能夠利用運送板1而往各單元移動。如此一來,由於能夠將各單元實體地區分,所以不須如專利文獻1那般地於真空室內配置帶電單元及對準單元,而能夠僅配置供工件W帶電固定的運送板1。藉此,可刪減必須施行真空措施的構件,能夠進行對準動作及積層動作。
The conveying
<關於翻轉單元> <About the flip unit>
翻轉單元10具備翻轉台11及翻轉單元驅動機構(未圖式),該翻轉單元驅動機構係進行翻轉單元10之沿X軸方向(箭號III方向:帶電/翻轉位置A、對準台位置B)的移動、沿Z軸方向(箭號IV方向)的移動及沿Y軸周圍(箭號II方向)的旋轉。翻轉台11具備在將運送板1載置於翻轉台11上的狀態進行固定的運送板固定機構(未圖示)。此運送板固定機構也可由設於翻轉台11上之複數個吸附通口所為之真空吸附、機械夾頭及磁力等、或此等的組合來構成。此外,運送板固定機構所產生的保持力係預先設定成:固定有運送板1之翻轉台11翻轉時,運送板1不會自翻轉台11落下的值。
The
<關於帶電單元> <About the charged unit>
帶電單元20具備照射荷電粒子c的荷電粒子照射部21,及進行帶電單元20之沿X軸方向(箭號I方向)之移動的帶電單元驅動機構(未圖示),且配置於翻轉單元10之Z軸方向的上方。荷電粒子照射部21係將荷電粒子c朝鉛直方向下側照射者,例如可為照射陰離子或陽離子的電離器(ionizer)。如圖1所示,此荷電粒子照射部21於Y軸方向以包覆翻轉台11的方式延伸。
The charging
<關於對準單元> <About Alignment Unit>
對準單元30具備:對準台31;設於對準台31上的設置區塊32;及進行對準台31之沿XY θ軸移動的XY θ軸電動致動器33。再者,對準單元30具備從下方對作為工件W之對位參照用的標記的對準標記進行攝像的對準攝像單元34。以
下依序說明此等元件。
The
對準台31具備:從對準台31的各角部朝向中心部延伸,且由透明的構件構成的複數個窗部(未圖示)。 The alignment table 31 includes a plurality of window portions (not shown) that extend from each corner portion of the alignment table 31 toward the center portion and are formed of a transparent member.
從Z軸方向來看,設置區塊32係以相對於對準台31的中心呈點對稱的方式沿著對準台31上的外周緣配置複數個。再者,設置區塊32於上表面具備使運送板1真空吸附的複數個吸附通口(未圖示)。本實施型態中的設置區塊32係以相對於對準台31的中心呈點對稱的方式配置複數個,然而不限於此方式,也能夠以將對準台31上的外周緣完全包圍的方式設置。
Viewed from the Z-axis direction, a plurality of installation blocks 32 are arranged along the outer periphery of the alignment table 31 so as to be point-symmetrical with respect to the center of the alignment table 31 . Furthermore, the setting
XY θ軸電動致動器33係為了將工件W朝基準位置對位而能夠進行沿XY θ軸的移動,亦即進行於XY平面內的移動及轉動。
The XYθ-axis
對準攝像單元34係具備對準用攝像機(未圖示)及對準用照明(未圖示),隔著複數個窗部而從對準台31的下方對工件W的對準標記進行攝像。
The
<關於運送單元> <About Shipping Unit>
運送單元40具備:真空室41;運送板夾頭42;進行運送單元40之沿X軸方向(箭號V方向:對準台位置B、待機位置C、積層台位置D)及Z軸方向(箭號IV及VI方向)的移動的運送單元驅動機構(未圖示)。以下依序說明此等元件。
The conveying
真空室41係具備:大致矩形形狀的上壁41t;及以連續地包圍上壁41t之各外周緣的方式垂下的周壁41s。
The
於真空室41的上壁41t設有驅動機構,該驅動機構係由升降活塞43、一對導軸部44及一對剝離活塞45構成,且承擔在真空室41內的驅動。首先,升降活塞43的下端被固定於運送板夾頭42,藉由伸縮於沿Z軸方向收縮的
待機狀態與沿Z軸方向(箭號VII方向)伸展的伸展狀態之間,而使運送板夾頭42沿Z軸方向(箭號VII方向)移動。再者,一對導軸部44的下端分別被固定於運送板夾頭42,升降活塞43沿Z軸方向伸縮時,為了維持運送板夾頭42的水平度而以與升降活塞43同步的方式進行伸縮。再者,一對剝離活塞45伸縮於沿Z軸方向收縮的待機狀態與移動限制狀態之間,該移動限制狀態係經由運送板夾頭42的貫穿孔42h而沿Z軸方向(箭號VIII方向)伸展的狀態。此外,此一對剝離活塞45係設定成於沿Z軸方向(箭號VIII方向)伸展的移動限制狀態下,剝離活塞45的下端會與運送板夾頭42的下表面呈同一面(參照圖5之(c))。
The
於本實施型態中,升降活塞43及一對剝離活塞45係藉由例如氣壓缸或油壓缸等而構成可自由伸縮。再者,本實施型態的真空室41內的驅動機構係採用隔有密封構件之導塊(guide block)構造,藉此,防止真空室41的內部空間與外部空間經由驅動機構而進行流體連通。此外,本實施型態之真空室41內的驅動機構的配置及個數僅為例示,其能夠適當地選擇最適合的配置或個數。
In this embodiment, the
從Z軸方向的下方來看,於真空室41之周壁41s的下端以形成封閉的區域的方式連續設有密封構件(未圖示)。藉由使此真空室41的密封構件抵接及密接於積層台51上,能夠將真空室41的內部空間維持於密閉狀態(參照圖4之(d))。
A seal member (not shown) is continuously provided at the lower end of the
在從Z軸方向來看時,運送板夾頭42具有以能夠將運送板1保持成不會突出的方式而設定的大致矩形形狀,且具備一對貫穿孔42h及複數個磁力部42m。此一對貫穿孔42h係配置於與剝離活塞45對應的位置,且以剝離活塞45能以非接觸狀態插通的方式,將貫穿孔42h的直徑設定得比剝離活塞45的直徑大。再者,複數個磁力部42m係用以將運送板1磁性固定於運送板夾頭42者,
而由永久磁鐵構成。
When viewed from the Z-axis direction, the
本實施型態的運送板夾頭42係以容許剝離活塞45沿Z軸方向伸縮的方式具有貫穿孔42h者,然而不限於此,例如也可於運送板夾頭42的外周緣設置連續的缺口部。再者,本實施型態的磁力部42m係由永久磁鐵構成,然而不限於此,例如也可使用依據來自控制手段的指示而進行ON/OFF控制的電磁鐵。此外,本實施型態之於運送板夾頭42的貫穿孔42h及磁力部42m的配置或個數僅為例示,而能夠適當地選擇最適合的配置或個數。
The conveying
運送單元驅動機構能夠使運送單元40沿X軸方向(箭號V方向:對準台位置B、待機位置C、積層台位置D)及Z軸方向(箭號IV及VI方向)移動。特別是,藉由運送單元驅動機構使運送單元40沿Z軸方向(箭號IV及VI方向)移動,能夠進行運送板1的回收(參照圖4之(b)及圖4之(c)),或進行使用於抽真空之密閉空間的形成(參照圖4之(d))等,而詳細內容於後述。
The conveyance unit drive mechanism can move the
<關於積層單元> <About Lamination Unit>
積層單元50具備供工件W積層的積層台51。在從Z軸方向來看時,此積層台51具有以能夠將運送單元40之真空室41設置成不會突出的方式而設定的大致矩形形狀,藉由真空室41的周壁41s座落於積層台51上而形成密閉空間。再者,積層台51具備用以將藉由真空室41及積層台51形成的密閉空間予以抽真空及大氣開放的排氣通口(未圖示)及開放通口(未圖示)。再者,積層台51具備以將工件W載置於積層台51上的狀態進行固定的工件固定機構(未圖示)。
The stacking
本實施型態的排氣通口及開放通口係設於積層台51,然而不限於此,例如也可設於真空室41。再者,若工件W固定於積層台51上,則本實施
型態之工件固定機構可為任何的型態,例如能夠採用藉由真空吸附或接著劑所造成的貼附等。在此,工件固定機構為真空吸附時,則將工件W之真空吸附中的真空度設定得比形成於真空室41內的密閉空間的真空度大。
The exhaust port and the open port of the present embodiment are provided in the stacking table 51 , but are not limited thereto, and may be provided in the
<關於運送板回收單元> <About the transport board recovery unit>
運送板回收單元60具備:把持手段61;除電手段62;及進行運送板回收單元60之沿X軸方向(箭號IX方向)移動的運送板回收單元驅動機構(未圖示)。以下依序說明該等元件。
The conveying
把持手段61能夠從上下方向把持運送板1,並且使運送板1沿XY平面內(XY軸方向及θ方向)(參照圖6之(d))移動。若此把持手段61能夠把持運送板1,則可為任何的型態,也可採用例如藉由電動致動器或氣動致動器等來驅動的機械手(machine hand)或推送器(pusher)等。
The holding means 61 can hold the
除電手段62由電離器構成,係產生電荷中和所必須的電荷,且將此電荷作為除電空氣i供給至帶電物體(設於運送板1之一側1a的絕緣體)。如圖6之(c)所示,此除電手段62藉由對設於運送板1之一側1a的絕緣體流放除電空氣i,而使運送板1與積層體L之最上部的靜電吸附力積極地降低。
The neutralization means 62 is constituted by an ionizer, generates electric charges necessary for neutralization of electric charges, and supplies the electric charges to the charged object (insulator provided on one
本實施型態的除電手段62係採用電離器,然而不限於此,也可除此以外更採用例如將設於運送板1之一側1a的絕緣體形成比供載置工件W的區域寬廣,而以具有導電性的把持手段61直接把持此絕緣體的外周緣。藉此,藉由絕緣體的外周緣及把持手段61而進行於絕緣體的電荷中和,因此,能夠使運送板1與積層體L之最上部的靜電吸附力更積極地降低。
The static elimination means 62 of the present embodiment uses an ionizer, however, it is not limited to this. In addition, for example, the insulator provided on one
運送板回收單元驅動機構能夠以使把持手段61接近運送板1,並
且使除電手段62接近積層台51的方式,使該等手段各自沿X軸方向(箭號IX方向)移動。
The conveying plate recovery unit drive mechanism can bring the gripping means 61 close to the conveying
<關於工件的積層工序> <About the lamination process of the workpiece>
使用圖3至圖6依序說明具體的真空積層裝置100中的工件W的積層工序。此外,各單元(翻轉單元10、帶電單元20、對準單元30、運送單元40、積層單元50及運送板回收單元60)的驅動係以控制手段為主體,依據來自控制手段的指示而執行。在此,於此工件的積層工序中,由於運送板1總是被固定於各單元之其中一者,所以能夠以穩定的狀態進行工件W的對位或運送等。
The lamination process of the workpiece|work W in the concrete vacuum lamination|stacking
<關於帶電動作> <About electrified action>
首先,如圖3之(a)所示,藉由運送板供給單元(未圖示),運送板1的另一側以接觸的方式被載置於帶電/翻轉位置A所配置的翻轉台11上,並且運送板1藉由運送板固定機構而固定於翻轉台11。接著,藉由工件供給單元(未圖示),未設有黏著層a及保護層p的工件W的表面(第二面)以接觸的方式被載置於運送板1之一側1a所設置的絕緣體上。再者,藉由帶電單元驅動機構,帶電單元20以橫越翻轉台11之上方的方式沿X軸方向(箭號I(1)方向)移動。此時,藉由從荷電粒子照射部21朝向下方照射荷電粒子c,設於運送板1之一側1a的絕緣體係表面帶電,隔著此絕緣體而使工件W帶電固定於運送板1的一側1a。在此,如圖1所示,當從Z軸方向來看時,載置有工件W的運送板1的一側1a,即以未載置工件W的區域包圍工件W的方式形成。
First, as shown in FIG. 3( a ), the other side of the conveying
本實施型態的帶電動作,係設成將工件W載置於翻轉台11所固
定的運送板1上之後,藉由帶電單元20使工件W帶電固定於絕緣體,然而不限於此。例如也可在將工件W載置於翻轉台11所固定的運送板1上之前,藉由帶電單元20,使運送板1的絕緣體帶電,之後,使工件W帶電固定於絕緣體。此外,如本實施型態的帶電動作,藉由將工件W載置於翻轉台11所固定的運送板1上之後,使工件W帶電固定於絕緣體,能夠抑制於運送板1之工件W的位置偏移或發生皺折等,並且能夠抑制來自絕緣體的放電的危險性以及於絕緣體發生污染等。
In the electrification operation of the present embodiment, the workpiece W is placed on the inversion table 11 and fixed.
After being placed on the predetermined conveying
<關於翻轉單元所為的翻轉及運送動作> <About the inversion and conveyance of the inversion unit>
首先,如圖3之(b)所示,帶電固定在運送板1之工件W所設置的保護層p藉由剝離單元(未圖示)而剝離。藉此,帶電固定在運送板1之工件W成為將具有黏著性之黏著層a僅設於單面側的工件W(以下稱為「帶黏著劑的工件Wa」)。之後,翻轉單元10藉由翻轉單元驅動機構而沿Y軸周圍(箭號II(2)方向)旋轉180°,並且帶黏著劑的工件Wa的黏著層a以朝向下方的方式配置。在此,藉由運送板固定機構所造成之運送板1之另一側1b之相對於翻轉台11的固定保持力,及藉由帶電固定所造成之帶黏著劑的工件Wa之相對於運送板1之一側1a的靜電吸附力,係預先設定成:翻轉台11翻轉時,運送板1及帶黏著劑的工件Wa不會從翻轉台11落下的值。
First, as shown in FIG.3(b), the protective layer p provided in the workpiece|work W charged and fixed to the
本實施型態中,採用將黏著層a及保護層p僅設於單面側的工件W作為帶電固定於運送板1上的工件W,然而不限於此,例如也可採用將黏著層a及保護層p設於兩面側的工件W,或兩面側不設置黏著層a及保護層p的工件W。此外,採用將黏著層a及保護層p設於兩面側的工件W作為帶電固定於運送板1上
的工件W時,工件W之其中任一面的保護層p直接載置於運送板1之一側1a的絕緣體上。
In this embodiment, the workpiece W in which the adhesive layer a and the protective layer p are provided only on one side is used as the workpiece W that is charged and fixed on the conveying
接著,如圖3之(c)所示,翻轉單元10藉由翻轉單元驅動機構,從帶電/翻轉位置A沿X軸方向(箭號III(3)方向)往對準台位置B移動之後,沿Z軸方向的下方(箭號IV(4)方向)移動。藉此,使運送板1之一側1a之未載置工件Wa的區域抵接於對準單元30之設置區塊32的上表面。然後,使運送板1吸附固定於設置區塊32的上表面後,解除運送板固定機構所為之運送板1的另一側1b相對於翻轉台11的固定。其後,如圖3之(d)所示,翻轉單元10藉由翻轉單元驅動機構沿Z軸方向的上方(箭號IV(5)方向)移動後,從對準台位置B沿X軸方向(箭號III(6)方向)往帶電/翻轉位置A移動。
Next, as shown in FIG. 3( c ), the reversing
<關於對準動作> <About alignment action>
如圖3之(d)所示,對準攝像單元34從下方對設於帶黏著劑的工件Wa之一對對準標記進行攝像。此經攝像的影像發送給影像處理裝置(未圖示),藉由影像處理而算出一對對準標記之各自的位置,並且算出此經算出之一對對準標記的位置與預先設定的基準位置的誤差。在此,若此誤差在預定範圍內,則判斷為帶黏著劑的工件Wa的對位已適當地進行,而結束帶黏著劑的工件Wa的對位動作。相對於此,若此誤差在預定範圍外,則判斷為帶黏著劑的工件Wa的對位未適當地進行。此時,XY θ軸電動致動器33以使誤差達最小的方式,藉由對準台31、設置區塊32及運送板1而進行帶黏著劑的工件Wa之沿XY θ軸的移動。此對預先設定的基準位置的對位係持續進行至誤差達預定範圍內為止。
As shown in FIG.3(d), the
本實施型態的對準動作,由於帶黏著劑的工件Wa與對準台31於
非接觸狀態下進行,所以塵埃等不會附著於黏著層a,能夠平順地進行。
In the alignment operation of the present embodiment, the workpiece Wa with the adhesive and the
<關於運送單元所為的運送動作> <About the transport action performed by the transport unit>
關於運送單元所為的運送動作,係使用圖4之(a)至圖4之(d)並區分為運送板的磁性固定狀態及運送狀態的二個狀態分別進行說明。 The conveyance operation performed by the conveyance unit will be described using FIG. 4( a ) to FIG. 4( d ), and is divided into two states of the magnetic fixing state of the conveying plate and the conveying state, respectively.
(運送板的磁性固定狀態) (magnetically fixed state of the transport plate)
運送單元40在升降活塞43及剝離活塞45收縮的待機狀態停止於待機位置C。首先,於對準單元30判斷為帶黏著劑的工件Wa的對位已適當地進行時,如圖4之(a)所示,運送單元40藉由運送單元驅動機構沿X軸方向(箭號V(7)方向)從待機位置C往對準台位置B移動。其後,如圖4之(b)所示,運送單元40藉由運送單元驅動機構而往Z軸方向的下方(箭號IV(8)方向)移動,運送板夾頭42抵接於運送板1的另一側1b。此時,由磁性體構成的運送板1藉由永久磁鐵構成的複數個磁力部42m而被運送板夾頭42磁性固定。在此,於運送板1,作用於Z軸方向的下方之對設置區塊32的吸附保持力設定成比作用於Z軸方向的上方之磁力部42m的磁力大。藉此,運送板1不會從設置區塊32浮起,而是以吸附固定於設置區塊32的狀態磁性固定於運送板夾頭42,因此,能夠防止帶電固定於運送板1上的帶黏著劑的工件Wa的位置偏移。
The
本實施型態中,磁力部42m係採用永久磁鐵,惟也可取而代之,改以採用進行ON/OFF控制的電磁鐵時,在運送板夾頭42抵接於運送板1之另一側1b的前後時序(timing),從OFF控制切換至ON控制而使其產生磁力。
In this embodiment, permanent magnets are used for the
(運送狀態) (shipping status)
首先,解除運送板1之一側1a對設置區塊32之上表面的吸附固定之後,如圖4之(c)所示,運送單元40藉由運送單元驅動機構而往Z軸方向的上方(箭號IV(9)方向)移動。之後,如圖4之(d)所示,運送單元40藉由運送單元驅動機構而從對準台位置B往積層台位置D移動,且沿X軸方向(箭號V(10)方向)移動後,往Z軸方向的下方(箭號VI(11)方向)移動。藉此,藉由設於真空室41之周壁41s之下端的密封構件抵接及密接於積層台51,真空室41內形成密閉空間(內部壓力為大氣壓Pa)。此時,帶電固定於運送板1的帶黏著劑的工件Wa及積層於積層台51的積層體L係以非接觸狀態於上下方向相對向配置。
First, after releasing the suction and fixation of one
在此,在積層於積層台51的積層體L,僅最下部的工件W為未設黏著層a的工件W,藉由工件固定機構而固定於積層台51,其他的工件W係由帶黏著劑的工件Wa構成,藉由相互的黏著力而固定。於本實施型態中,藉由運送單元驅動機構,使真空室41對於積層台51的推壓力調整成所希望的值,而提高形成在真空室41內的密閉空間的氣密度。
Here, in the layered body L stacked on the stacking table 51, only the lowermost workpiece W is the workpiece W without the adhesive layer a, which is fixed to the stacking table 51 by the workpiece fixing mechanism, and the other workpieces W are adhered with tapes. The workpiece Wa of the agent is formed and fixed by mutual adhesive force. In this embodiment, the pressing force of the
<關於積層動作> <About the stacking operation>
自此,關於積層動作,使用圖5之(a)至圖5之(e)區分成抽真空狀態、積層狀態及運送板的磁性固定解除狀態的三個狀態分別進行說明。此外,於圖5之(b)至圖5之(e)中,為了容易掌握升降活塞43或一對剝離活塞45的動作,以灰色表示處於動作狀態的構件。
From now on, the lamination operation will be described with reference to three states divided into a vacuum state, a lamination state, and a magnetic fixation release state of the conveying plate using FIGS. 5( a ) to 5 ( e ). In addition, in FIG.5(b)-FIG.5(e), in order to grasp|ascertain the operation|movement of the
(抽真空狀態) (vacuum state)
首先,如圖5之(a)所示,形成在真空室41內之密閉空間內的氣體經由設置於積層台51的排氣通口而被排氣,藉此而進行抽真空(參照圖中的點區域)。此密閉空間內的真空壓Pv例如設定為-100(kpa)左右。在此,帶黏著劑的工件Wa帶電固定於運送板1,並且運送板1被運送板夾頭42磁性固定,因此,即使於真空下,帶黏著劑的工件Wa或運送板1不會從運送板夾頭42落下。
First, as shown in FIG. 5( a ), the gas in the closed space formed in the
(積層狀態) (layered state)
真空室41內的真空壓Pv達到所希望的值之後,如圖5之(b)所示,升降活塞43轉移至伸展狀態,運送板夾頭42往Z軸方向的下方(箭號VII(12)方向)移動。然後,帶電固定於運送板1的帶黏著劑的工件Wa抵接於積層在積層台51之積層體L的最上部。再者,由此狀態,升降活塞43依據使用於帶黏著劑的工件Wa之黏著劑的種類而使運送板夾頭42往Z軸方向的下方(箭號VII(12)方向)移動達預先設定的推入量。藉此,帶電固定於運送板1的帶黏著劑的工件Wa藉由黏著力而與積層體L一體地積層。
After the vacuum pressure Pv in the
於本實施型態中,將帶電固定於運送板1的帶黏著劑的工件Wa與積層在積層台51之積層體L之間的空間予以抽真空之後,藉由帶黏著劑的工件Wa與積層體L一體地積層,防止空氣混入積層體L的層間。再者,於本實施型態中,運送單元40不僅能夠進行運送板1的運送,也能夠進行密閉空間的形成、工件W之積層等,因此,能夠進行構成真空積層裝置100之各單元的簡略代、成本的刪減。此外,於本實施型態的積層動作中,為了使積層體L的積層精度更提升,也可採用例如針導(pin guide)積層方式,亦即,使設於積層台51及運送板夾頭42的針及導孔相互卡合而進行積層的方法。
In this embodiment, after vacuuming the space between the work Wa with the adhesive charged and fixed to the conveying
(運送板的磁性固定解除狀態) (The magnetic fixation of the transport plate is released)
首先,如圖5之(c)所示,一對剝離活塞45往Z軸方向的下方(箭號VIII(13)方向)伸展,並且以非接觸狀態插通設於運送板夾頭42的貫穿孔42h。然後,在剝離活塞45的下端到達與運送板夾頭42之下表面成為同一面的位置,亦即到達抵接於運送板1之另一側1b的位置的狀態,停止剝離活塞45的伸展。在此,由於剝離活塞45的下端抵接於運送板1,並且呈牢固地固定的移動限制狀態,所以會限制運送板1之往Z軸方向的上方移動。
First, as shown in FIG. 5( c ), the pair of peeling
接著,如圖5之(d)所示,藉由升降活塞43,運送板夾頭42往Z軸方向的上方(箭號VII(14)方向)移動,並且處於收縮的待機狀態。此時,比作用於運送板1之磁力部42m的磁力大的力藉由升降活塞43而負荷於運送板夾頭42,而解除運送板夾頭42與運送板1的磁性固定。再者,由於藉由剝離活塞45而限制運送板1之往Z軸方向的上方移動,所以於積層體L的層間不會被負荷會造成剝離的外力,能夠維持積層體L的積層精度。然後,如圖5之(e)所示,剝離活塞45往Z軸方向的上方(箭號VIII(15)方向)移動,處於收縮的待機狀態。
Next, as shown in FIG. 5( d ), by raising and lowering the
於本實施型態中,磁力部42m係採用永久磁鐵,惟也可取而代之,改以採用進行ON/OFF控制的電磁鐵時,在剝離活塞45的下端抵接於運送板1之另一側1b的前後時序,從ON控制切換至OFF控制而使磁力消失。
In the present embodiment, the
<關於運送板的回收動作> <About the collection operation of the conveying board>
關於運送板的回收動作,使用圖6之(a)至圖6之(e)區分成回收準備狀態及回收狀態的二個狀態分別進行說明。此外,圖6之(a)至圖6之(c)、圖6之(e)係說明
運送板1之回收動作的剖視示意圖,圖6之(d)係僅顯示於圖6之(c)中的運送板1及積層體L的俯視示意圖。
The collection|recovery operation of a conveyance board is demonstrated using FIG.6(a)-FIG.6(e), and is divided into two states which are a collection|recovery preparation state and a collection|recovery state, respectively. In addition, FIG. 6(a) to FIG. 6(c) and FIG. 6(e) are for explanation
Fig. 6(d) is a schematic plan view of the conveying
(回收準備狀態) (recycling ready state)
首先,如圖6之(a)所示,經由設於積層台51的開放通口而將氣體供給至形成於真空室41內的密閉空間內,以使內部壓力成為大氣壓Pa的方式進行大氣開放。然後,如圖6之(b)所示,運送單元40藉由運送單元驅動機構而往Z軸方向的上方(箭號VI(16)方向)移動之後,沿X軸方向(箭號V(17)方向)從積層台位置D移動至待機位置C。
First, as shown in FIG. 6( a ), gas is supplied into the closed space formed in the
(回收狀態) (recycling status)
如圖6之(c)所示,運送板回收單元60藉由運送板回收單元驅動機構而沿X軸方向(箭號IX方向)移動,藉此,把持手段61接近運送板1,並且除電手段62接近積層台51。然後,藉由把持手段61,於把持位置G的運送板1被從上下方向把持之後,如圖6之(d)所示,運送板1沿XY平面內(XY軸方向及θ方向)移動。此外,藉由除電手段62將除電空氣i流入運送板1與積層體L之間。
As shown in FIG. 6( c ), the conveying
在此,針對使用把持手段61及除電手段62的除電機制進行說明。首先,積層在積層體L之最上部的帶黏著劑的工件Wa與運送板1之間的帶電固定相對於沿Z軸方向的拉伸力為堅強,然而相對於與XY平面平行的剪力,就比較容易產生橫向偏移。因此,如圖6之(c)所示,在積層體L的位置被維持在固定的狀態下,藉由把持手段61使運送板1相對於積層體L往XY平面內滑動。此時,由於藉由除電手段62將除電空氣i流入運送板1與積層體L之間,所以積層
在積層體L之最上部的帶黏著劑的工件Wa與運送板1之間的靜電吸附力隨著從絕緣體之外側朝向內側逐次變弱。藉由反覆進行此滑動及除電空氣i的流入,運送板1從積層體L分離並被回收。結果,如圖6之(e)所示,於積層台51上,帶黏著劑的工件Wa一體地積層於積層體L的最上部。
Here, the static elimination mechanism using the holding means 61 and the static elimination means 62 will be described. First, the electrification fixation between the workpiece Wa with the adhesive layered on the uppermost part of the layered body L and the conveying
於本實施型態中,將運送板1從積層體L分離並回收時,由於在積層體L的層間不會被負荷會造成剝離的外力,所以能夠防止空氣混入層間。再者,本實施型態中的工件W係使用帶黏著劑的工件Wa進行了說明,然而也可在改以使用兩側面設有黏著層a及保護層p的工件W時,工件W積層於積層體L之後,剝離位於工件W之上表面側的保護層p。再者,於本實施型態中,於積層體L之層間的黏著劑的黏著力比積層體L與運送板1之間的靜電吸附力大時,運送板1也可藉由把持手段61沿XY平面內移動,而且沿Z軸方向移動。此乃由於即使藉由把持手段61對積層體L負荷Z軸方向的外力,也因積層體L之層間不會剝離,所以能夠防止空氣混入層間且能夠維持積層精度之故。
In the present embodiment, when the conveying
如以上所述,已說明了關於將一片工件W積層於積層體L的積層工序,然而在必須再將工件W積層於積層體L時,係藉由反覆進行必須的片數的積層工序(圖3至圖6)而能夠形成所希望的積層體L。 As described above, the lamination process of laminating one piece of workpiece W on the laminate L has been described. However, when it is necessary to laminate the workpiece W on the laminate L again, the required number of lamination processes are repeatedly performed (Fig. 3 to FIG. 6 ), a desired layered body L can be formed.
1:運送板 1: Shipping board
10:翻轉單元(翻轉手段) 10: Flip unit (flip means)
11:翻轉台 11: Flip table
20:帶電單元(帶電手段) 20: Charged unit (charged means)
21:荷電粒子照射部 21: Charged particle irradiation section
30:對準單元(對準手段) 30: Alignment unit (alignment means)
31:對準台 31: Alignment stage
32:設置區塊 32: Setting Blocks
33:XY θ軸電動致動器 33: XY theta axis electric actuator
34:對準攝像單元 34: Align the camera unit
40:運送單元(運送手段) 40: Delivery unit (transportation means)
41:真空室 41: Vacuum Chamber
41s:周壁 41s: Zhou Wall
41t:上壁 41t: Upper wall
42:運送板夾頭 42: Transport plate chuck
42h:貫穿孔 42h: Through hole
42m:磁力部 42m: Magnetic part
43:升降活塞 43: Lifting Piston
44:導軸部 44: Guide shaft
45:剝離活塞 45: Peel Piston
50:積層單元 50: Lamination unit
51:積層台 51: Stacking table
60:運送板回收單元(運送板回收手段) 60: Transport board recovery unit (transport board recovery means)
61:把持手段 61: Control means
62:除電手段 62: Elimination means
100:真空積層裝置 100: Vacuum Lamination Device
A:帶電/翻轉位置 A: Live/flipped position
B:對準台位置 B: Alignment stage position
C:待機位置 C: Standby position
c:荷電粒子 c: charged particle
D:積層台位置 D: Position of the stacking table
i:除電空氣 i: static-removing air
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JP2006201330A (en) * | 2005-01-19 | 2006-08-03 | Fujitsu Ltd | Bonded substrate manufacturing apparatus and bonded substrate manufacturing method |
JP4661716B2 (en) * | 2006-07-24 | 2011-03-30 | 株式会社日立プラントテクノロジー | Board bonding equipment |
WO2008041293A1 (en) | 2006-09-29 | 2008-04-10 | Shin-Etsu Engineering Co., Ltd. | Work transferring method, electrostatic chuck device, and board joining method |
WO2010023935A1 (en) * | 2008-08-29 | 2010-03-04 | 株式会社ニコン | Substrate aligning apparatus, substrate aligning method and method for manufacturing multilayer semiconductor |
JP5560590B2 (en) | 2009-05-14 | 2014-07-30 | 株式会社ニコン | Substrate bonding equipment |
JP5334135B2 (en) * | 2010-08-20 | 2013-11-06 | ニチゴー・モートン株式会社 | Laminating equipment |
KR101054885B1 (en) * | 2011-03-09 | 2011-08-08 | 주식회사진영정기 | Magnetic chuck |
WO2013011970A1 (en) * | 2011-07-15 | 2013-01-24 | 電気化学工業株式会社 | Method for producing translucent rigid substrate laminate and device for pasting together translucent rigid substrates |
KR101268898B1 (en) * | 2011-10-26 | 2013-05-29 | 주식회사 엘트린 | Apparatus for bonding substrates and method of bonding substrates |
KR101906509B1 (en) * | 2011-12-07 | 2018-10-10 | 다즈모 가부시키가이샤 | Bonding device and bonding method |
JP2013167712A (en) * | 2012-02-15 | 2013-08-29 | Hitachi High-Technologies Corp | Substrate bonding device, and substrate bonding method |
KR101543424B1 (en) * | 2012-08-24 | 2015-08-10 | 가부시키가이샤 메이키 세이사쿠쇼 | Lamination method and lamination system |
JP6311967B2 (en) * | 2014-03-06 | 2018-04-18 | Tianma Japan株式会社 | Substrate bonding apparatus and substrate bonding method |
JP6644578B2 (en) * | 2016-02-17 | 2020-02-12 | 日東電工株式会社 | Optical film transport and recovery apparatus, optical film manufacturing system, and optical film transport and recovery method |
KR20190055713A (en) * | 2017-11-15 | 2019-05-23 | 주식회사 마인즈아이 | Method and apparatus for attaching and detaching thin film using electrostatic force |
-
2020
- 2020-09-18 JP JP2020157699A patent/JP7488738B2/en active Active
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- 2021-09-17 TW TW110134916A patent/TWI796793B/en active
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JP7488738B2 (en) | 2024-05-22 |
CN114193901B (en) | 2024-08-09 |
CN114193901A (en) | 2022-03-18 |
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TWI796793B (en) | 2023-03-21 |
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