TW200815268A - Work transferring method, electrostatic chuck device, and board joining method - Google Patents

Abstract

An electrostatic chuck device enabling even a thin work with low rigidity to be releasedly placed without causing deformation and displacement during the movement. An electrostatic chuck (2) is attached to a holding plate (1) by an attaching means (3). A work (A) is chucked and held by the attached electrostatic chuck (2). The electrostatic chuck (2) and the work (A) are integrally separated from the holding plate (1) by a separating means (4). Since the work (A) is not brought into a free state, it can be transferred to the release position without being affected by the gravity. When only the electrostatic chuck (2) is re-attached to the holding plate (1) by the attaching means (3) after the electrostatic attracting function of the electrostatic chuck (2) is stopped, the electrostatic chuck (2) is separated from the surface of the work (A) moved to the release position, and the work (A) is left at the release position and placed.

Description

200815268 IX. Description of the Invention: [Technical Field] The present invention relates to a substrate bonding method, for example, a flat panel display such as a liquid crystal display (LCD) or a plasma display (pDp) or a flexible display. In the case of transporting a substrate made of a glass substrate such as CF, glass, or TFT glass, or a PES (a plastic film made of a plastic film such as Poly-Ether), the substrate is attached and detached. φ: a substrate assembly apparatus of the machine, an insulator such as a substrate, a workpiece transfer method such as a substrate transfer apparatus of a workpiece (subject to be processed) such as a conductor or a semi-V-body wafer, and an electrostatic chuck device and a substrate using the same The bonding method is as follows: 5. A method for adsorbing and holding a workpiece by using an electrostatic chuck of a holding plate, opening the workpiece to be transported at a predetermined position by the held workpiece, and forming an electrostatic chuck by holding the plate and holding the workpiece. The electrostatic chuck device and the substrate bonding method using the same. [Prior Art] _ In the case of a substrate laminating machine as a superimposed two-piece substrate, The pressure plate is internally provided with an electrostatic chuck composed of an insulating member of the electrode plate, so that the workpiece holding glass substrate aligns the upper substrate and the lower substrate in the χγ direction, and then decompresses the vacuum chamber, and the vacuum chamber reaches When the desired degree of vacuum is applied, the electrostatic adsorption function of the pressure plate is released, the upper substrate is dropped onto the lower substrate, and the upper and lower substrates are superposed, and then the pressure plate is lowered, and the upper and lower substrates are pressed together until the two are The interval reaches a prescribed gap (for example, refer to Patent Document 1) 〇 and, with an electrostatic chuck (electrostatic adsorption mechanism) above the substrate (upper side 117682.doc 200815268

The holding of the plate is released, and the gas is ejected from the back side of the upper substrate, and the gas is forcibly poured between the electrostatic adsorption surface of the upper holding plate and the back surface of the upper substrate, thereby breaking the close relationship between the electrostatic adsorption surface and the substrate surface. In the state, the two are peeled off, and the electrostatic adsorption force between the two is forcibly attenuated and disappeared. At the same time, the falling force of the lower substrate (lower substrate), that is, the acceleration of the falling, is forcibly caused by the gas pressure of the gas to be poured. Thereby, the upper substrate is instantaneously pressed to the lower substrate, and the upper substrate is moved and pressed to the lower substrate without change in the state of being held by the electrostatic adsorption mechanism, thereby sealing the overlapping of the upper and lower substrates (for example, refer to the patent document) 2). Patent Document 1: Patent Publication No. 2001-166272 (page 6, FIG. 8) Patent Document 2: Patent No. m378 (p. g., FIG. [Summary of the Invention] However, in the conventional workpiece transfer method or electrostatic chuck device In the case of Patent Document 1, (4) Empty +, the workpiece (upper substrate) is freely dropped by the release of the electrostatic adsorption function, but the adsorption force of the substrate of the electrostatic chuck does not immediately disappear even if the adsorption force of the power supply substrate is blocked. Since the action continues, the release of the substrate is delayed due to the decrease in the adsorption force of the substrate, and the interface between the electrostatic adsorption surface and the workpiece starts to peel off. Finally, the part is completely peeled off and falls freely. Since the workpiece (upper substrate) is rotationally moved '4 free fall' centering on the portion where the final peeling is centered, there is a problem that the pressure at the free fall is caused when 上下Im ^ is a difference between the upper and lower substrates. In the middle, the sealing is incomplete, the air is easy to mix. Further, there is a problem that the workpiece (upper substrate) is electrostatically opposed to the electrostatic 117682.doc 200815268 The portion to be peeled off is partially sagging by gravity, and the inclination is 'and' is easily changed by the inclination. Therefore, it is difficult to correct in the free fall, and it is difficult to correct after landing on the lower substrate, so that the predetermined parallel cannot be achieved. However, in recent years, in the tendency of a substrate for a liquid crystal display or a plasma display to increase in size, it has been started to manufacture a substrate that exceeds 丨〇〇mm. However, even if the substrate is enlarged, the parallelism is required to be the same as that of the small substrate. In particular, φ, if one side of the substrate exceeds 1000 mm, the interval between the Z directions becomes extremely small compared to the size of the χ γ direction. Therefore, it is desirable for the image tube to move the upper and lower substrates completely in parallel, but it is actually very Difficulty. In such an environment, if there is a slight tilt on a large upper substrate of more than 1 mm, the interval between the two directions is extremely small compared to the size of the XY direction, so that it may be applied in advance. Any of the opposite sides of the upper and lower substrates, the liquid crystal sealing sealing material (ring adhesive) or the film surface of both substrates is damaged. In the case of Patent Document 2, the gas is ejected from the back side of the workpiece (upper substrate) to the workpiece, but it is used as before. The workpiece is a glass substrate having a thickness of 〇·7~ι·ι 111111, and the rigidity of the surface is relatively high. Therefore, the gas for separation is easily transmitted to the surface of the surface, so that the gas can be surely It has been peeled off from the electrostatic chuck. In recent years, such as mobile phones or notebook computers, the use of liquids and liquids that focus on lightweighting has increased. In this application, the thickness of the glass of the workpiece is about 〇·5 mm or less. Very thin display, and the workpiece used in the * display is a PES with a thickness of several hundred um (Poly-Ether-117682.doc 200815268)

Plastic film such as Sulphone). Such a workpiece such as a glass substrate or a plastic film of about 0.5 mm or less has extremely low rigidity compared with a glass substrate of 0.7 to 1.1 mm which has been used in the past, and therefore, even if a gas for spraying is peeled off, the power is driven. The workpiece is locally pressed and deformed, and the flow path of the stripping gas is concentrated in the deformed portion, and there is a fear that the workpiece cannot be reliably peeled off by the residual adsorbing force, and at the same time, the stripping air flow is pressed and deformed at the time of peeling. Part of it is concentrated and expanded, with the possibility of local deformation. The object of the inventions of claims 1 and 4 of the present invention is that even if the workpiece is thin and has low rigidity, the load is not deformed or displaced during the movement. The invention described in claim 2 is intended to reliably maintain the transfer of the workpiece, in addition to the object of the invention described in claim 1. The invention described in claim 3 is intended to improve the peelability of the workpiece, except for the object of the invention described in claim 2 or 2. According to the invention of claim 5, in addition to the object of the invention described in claim 4, the object of the invention is that the substrate having a low rigidity is bonded to the fixed position irrespective of the instability of the release of the electrostatic adsorption force. Stripping is performed on the ground. In order to achieve the above object, the invention of claim 1 is characterized in that the electrostatic chuck is formed in a thin plate shape or a film shape and is movably supported, and the electrostatic chuck is electrostatically adsorbed on the surface of the workpiece opposite thereto, in the workpiece In the state of being electrostatically adsorbed, the electrostatic chuck is moved from the adsorption position to the open position, and the electrostatic adsorption function of the electrostatic chuck is stopped, and only the electrostatic chuck is moved from the open position toward the adsorption position in the opposite direction, and moves to 117682. Doc 200815268 The surface of the workpiece in the open position is stripped of the electrostatic chuck. The invention according to claim 2, wherein the electrostatic chuck is formed into a thin plate shape or a film shape, and the holding plate is formed of a rigid body. The smooth base is configured to be freely supported in a direction orthogonal thereto. The invention according to claim 3, characterized in that, in the configuration of the invention of the claim or the above, the electrostatic adsorption portion of the electrostatic chuck is locally deformed from a portion opposed to the outer peripheral end portion of the workpiece, A configuration in which a peeling gap is partially formed between the outer peripheral end portions of the workpiece. Further, the invention of claim 4 is characterized in that the electrostatic chuck is movably supported in a direction orthogonal thereto with respect to the workpiece side surface of the holding plate so that the electrostatic chuck is along the side surface of the workpiece, and the static electricity is electrostatically charged. Adsorbing the surface of the workpiece, moving the electrostatic chuck from the adsorption position to the open position while the workpiece is electrostatically adsorbed, and stopping the electrostatic adsorption function of the electrostatic chuck, and only inverting the electrostatic chuck from the open position to the adsorption position ^ Move to peel the electrostatic chuck from the surface of the workpiece moving to the open position. The invention according to claim 5, characterized in that the electrostatic chuck device according to claim 4 is provided on either or both of the pair of holding plates, and the two substrates are opposed to each other as the workpiece between the holding plates. Further, the electrostatic chuck of the electrostatic chuck device is peeled off from one of the holding plates while one of the substrates is electrostatically adsorbed, and the one substrate is moved to the other substrate, and the ring is passed through the ring. The invention relates to the invention of claim 2, wherein the electrostatic chuck is adhered to the holding plate by an adhesive mechanism, and the workpiece is sucked and held by the adhered electrostatic chuck, and By using the isolation mechanism to separate the electrostatic chuck and the workpiece, the workpiece is not in a free state, and is not affected by gravity or the like: it is transported to an open position, and at the same time, the electrostatic chucking function of the electrostatic chuck is stopped, and the adhesive mechanism is only used. Adhere the electrostatic chuck to the retaining plate again, from

The surface of the workpiece moved to the open position peels off the electrostatic chuck, and the workpiece is left in the open position to be loaded. Therefore, even if the workpiece is thin and has low rigidity, the load can be opened without being deformed or displaced during the movement. As a result, the workpiece can be conveyed to a fixed position in a state where the posture of the workpiece is likely to be stable as compared with the case where the posture of the workpiece is easily released by the release of the electrostatic adsorption. Further, even if it is a workpiece having a low rigidity, the flow path of the gas for peeling is not concentrated in the special portion as compared with the conventional one in which the workpiece is peeled off by the gas, and the same as the high-rigidity member, It is really good to peel off. According to the invention of claim 2, in addition to the effect of the invention of the eighth item 1, the static suction cup is formed into a thin plate shape or a film shape, and the phase τ ^ is opposite to the smooth base surface of the holding plate formed of the rigid body The direction of the orthogonal direction is freely supported by the white movement, and the action of the adhesive structure is performed by at least causing the electrostatic adsorption portion of the electrostatic electricity and the disk to be smoothed along the smooth base surface formed by the rigid body. The base surface and the electrostatic adsorption port are in contact with each other without any gaps, and are electrostatically charged and attached. Then, by the action of the isolation mechanism, the electrostatic suction 117682 is peeled off from the base surface under the condition that the workpiece is electrostatically adsorbed. Doc -10- 200815268 The disc, because the workpiece does not become free, so it is transported without being affected by gravity, etc., and the electrostatic chuck is peeled off from the surface of the moving workpiece by the action of the adhesive mechanism. Initial state. Thereby, the transfer of the workpiece can be surely maintained. (5) The invention of claim 3, wherein in addition to the effect of the invention of claim 1 or 2, the electrostatic adsorption of the electrostatic chuck is locally deformed from a portion opposite to the outer end portion of the f-piece, between the outer peripheral portion of the workpiece Partially forming the gap for peeling, • & and 'the gap between the electrostatic adsorption portion of the electrostatic chuck and the surface of the workpiece is ΤΓ :i ] 丨 the underwater sub-expansion, the residual adsorption force is forcibly attenuated and reduced by 0 Thereby, the peelability of the workpiece can be improved. According to the invention of claim 4, the electrostatic chuck of the branch is moved freely relative to the side surface of the holder of the holding plate in a direction orthogonal thereto, and the surface of the workpiece is electrostatically adsorbed while the electrostatic chuck is along the side surface of the workpiece. And the electrostatic chuck is moved from the adsorption position by the electrostatic adsorption of the workpiece. • The workpiece does not become a free state, and thus is not transmitted to the open position by the influence of gravity or the like, and at the same time, the electrostatic adsorption function of the electrostatic chuck is stopped. Only the electrostatic chuck is moved from the open position toward the adsorption position in the opposite direction, and the '@' electrostatic chuck is peeled off from the surface of the workpiece moved to the open position. • Thus, even if the guard piece that is thin and has low rigidity is moving, it can be opened and loaded without deformation or deviation. As a result, the workpiece can be transported to a fixed position in a state where the posture of the workpiece is unstable, and the position of the workpiece is unstable due to the instability of the electrostatic adsorption due to the release of the electrostatic adsorption. VIII I17682.doc 200815268 Moreover, compared with the past, when the workpiece is peeled off by the gas jet pressure, the workpiece with low rigidity is not concentrated in the flow path of the gas for the peeling. Can be sure (four), and its work =

According to the invention of claim 5, in addition to the effect of the invention of claim 4, the electrostatic chuck is removed from one of the two holding plates and moved to the other substrate by the electrostatic adsorption state of one of the plates. The ring-shaped adhesive is bonded to the two substrates 'because the substrate is not free, so that the substrate is not free. It is conveyed and properly bonded without being affected by gravity or the like. "With the adhesive force of the above-mentioned ring-shaped adhesive, it is easy to peel the electrostatic chuck from the one that is held by the plate. i. Thus even if it is a substrate having low rigidity, It is also possible to adhere to a fixed position and to be reliably peeled off irrespective of the instability of the release of the electrostatic adsorption force. As a result, it is possible to prevent two of the conventional substrate bonding machines in which the upper substrate is freely dropped by the release of the electrostatic adsorption. The substrate is misaligned with each other, and at the same time, the sealing space can be surely formed to prevent the incorporation of air. At the same time, the upper substrate is peeled off from the electrostatic adsorption surface, and no tilt occurs at all, so that the prescribed parallelism can be achieved. In the case of a large substrate exceeding m^n, it is possible to completely prevent the inclination of the substrate from causing damage to the liquid crystal sealing sealing material (ring adhesive) or the film surfaces of the two substrates. Compared with the conventional substrate bonding machine in which the ejection pressure is directly peeled off from the substrate, even if the substrate is low in rigidity, the flow path of the gas for separation is not concentrated. The fixed part, like the workpiece with high rigidity, can be 117682.doc • 12-200815268 and it is excellent in workability. And 'Because of the foreign matter, the surface of the electrostatic chuck is partially broken and the support is also blocked because of the retaining plate and The thin plate or film-shaped electrostatic chuck is a separate component, so that it can be easily exchanged for the holding plate at the sigh site, and the maintenance is good, especially the electrostatic chuck device of the present invention is used. In the case of a production line or the like, the entire operation of the production line can be restarted in a short period of time, so that the production rate can be expected without lowering the operation rate. [Embodiment] The workpiece transfer method and the electrostatic chuck device of the present invention are shown. D is equipped with the case of a substrate bonding machine that disassembles and attaches to a glass substrate or a plastic film substrate of a workpiece, a crystal display (LCD) or a plasma display (pDp) or a flexible display panel. As shown in Fig. 5 (a) to (c), the substrate bonding machine is arranged such that a rigid body such as a metal or a ceramic is formed into a flat plate having a thickness which is free from distortion (flexure) deformation. Fixing # #上上上上保持板1,Γ, so that the two substrates A and B are detachably held in the upper and lower holding plates ii, which are parallel to the smooth surface, 'divided around them After the vacuum chamber 8 reaches a predetermined degree of vacuum, the upper and lower holding plates 1 and 1 are relatively moved in the direction of χγθ (horizontal direction in the drawing) to align the substrate Β and Β, and then at least the substrate A. One of the crucibles is separated from the upper and lower sides of the plate i, 丨, and the smooth surface is peeled and overlapped, and the vacuum in the vacuum chamber S is broken, and the two substrates A are pressurized by the difference in air pressure generated inside and outside the two substrates A and B. Between B and B, until the specified gap is reached. As shown by the solid line in Fig. 5(a), the upper and lower plates are kept, 117682.doc •13·200815268 1 is lifted (not shown) to z The square & direction (in the direction of the lower surface of the drawing) can be relatively loosely supported. In the ring of atmospheric pressure ^^A, the state of the upper and lower retaining plates 1 and Γ is released in the upward and downward directions. The smooth surface is equipped with a holding robot (not shown) The substrates A and B are sent. Thereafter, the two-dot chain line in Fig. 5(a) is moved to move the upper and lower holding plates 1, Γ close to the vacuum chamber S. 'Divided between these two by the above-mentioned lifting mechanism

Then, when the vacuum chamber (4) is operated by a suction mechanism (not shown), when the predetermined degree of vacuum is reached, the horizontal movement mechanism (not shown) is actuated to hold the upper and lower plates, and Either one of the sides moves in the direction (4) with respect to the other direction, thereby sequentially performing the rough matching and the fine matching as the alignment (coincidence) of the substrates a and B held thereon.

After the alignment is completed, as shown in FIG. 5(b), the other one of the substrates A and B is held in the upper and lower holding plates 1 and 1 and moved by the ring-shaped adhesive (the sealing material) on the substrate B. ) C is instantaneously crimped, and the seal is overlapped by two. Then, as shown in Fig. 5 (4), the upper and lower holding plates 1 and 1 are moved in the direction away from each other by the operation of the elevating mechanism, and the suction mechanism is reversely actuated or the other mechanism is moved into the vacuum chamber s at substantially the same time. By supplying air or nitrogen, by returning the environment in the vacuum chamber S to atmospheric pressure, the pressure difference occurring inside and outside the two substrates AB is uniformly pressurized, and when the liquid crystal is sealed, it is crushed to a predetermined gap. And complete the fitting step. Further, the electrostatic chuck device D of the present invention comprises an upper and lower holding plate 1 made of the above-mentioned rigid body, and an electrostatic chuck 2 which adsorbs and holds the substrates A and B. 117682.doc -14- 200815268 In the example of the figure, the electrostatic chuck 2 is movably supported in the direction Z (the direction in the lower direction of the drawing) orthogonal to the smooth surface of the upper holding plate 1, and, on the other hand, The holding plate 1 is provided with an adhesive mechanism 3 for detachably attaching the electrostatic chuck 2 to a smooth surface to each smooth surface, and for separating the isolation mechanism 4 of the electrostatic chuck 2 from each smooth surface. • Adhering the electrostatic chuck 2 to the smooth surface of the upper holding plate 1 by the edge bonding mechanism 3, electrostatically adsorbing the upper substrate A by the attached electrostatic chuck 2, and integrating the electrostatic chuck 2 and the upper substrate A with the above-mentioned isolation mechanism 4 After stopping the parallel movement of the upper holding plate in the five-way open position, after stopping the electrostatic attraction work of the electrostatic chuck 2, the adhesive mechanism 3 is used to move only the electrostatic chuck 2 from the open position to the upper direction of the holding plate 1 in the opposite direction. The electrostatic chuck 2 is peeled off from the surface of the substrate A at the open position, whereby the substrate a and the bonding operation described above are performed. The electrostatic chuck 2 is formed by laminating a dielectric material such as a thin plate or a film of an insulating organic material such as polyamidamine, polyetheretherketone (PEEK) or |naphthalene (pEN). A conductive paste or a conductive electrode portion 2C which is patterned by screen printing or the like. • Λ electrode 邛 2 (isolated from the surrounding and connected to a power supply (not shown) for applying a voltage thereto. • As a specific example, it is preferable to embed two or more electrode units 2 〇, for example, The electrostatic chuck of the bipolar type which is embedded in the comb-tooth shape, and the electrostatic chuck 2 which is supported by the reciprocating movement in the up-down direction is made up of, and immediately after the operation of the isolation mechanism 4 described later, The power supply connection is cut off to stop the electrostatic adsorption function. 117682.doc -15- 200815268 The above-mentioned adhesive mechanism 3 is fixedly disposed on one or both sides of the smooth surface of the upper and lower holding plates 丨, 丨, and the surface of the electrostatic chuck 2 opposed thereto, for example. a magnet such as a permanent magnet or an electromagnet, a magnet that is attracted by the magnetic gas, or a magnetic body 3b that is formed into a film-like metal by sputtering or the like, or is fixed separately. An adhesive material other than a magnetic force or a mechanical touch type A structure other than the connection mechanism, by the magnetic force or the adhesive force, the electrostatic chuck is detachably attached to the smooth surface. φ i describes the isolation mechanism 4' from the upper and lower holding plates 1, 1, One or both sides of the sliding surface are filled with a gas or other fluid such as nitrogen or air to press the electrostatic chuck 2 toward the opposite surface of the electrostatic chuck 2, or the electrostatic chuck 2 is pressed by a driving body that is reciprocated by a cylinder or the like, or as the above-mentioned adhesive The mechanism 3 exchanges the magnetic poles of any one of the magnets 3a and 3b which are opposed to each other, and rebounds by making the magnetic poles of the opposing magnets 3a and 3b the same, whereby the electrostatic chuck 2 is parallelly separated from the smooth surface. The embodiment illustrates the embodiment of the present invention. The first embodiment is characterized in that, as shown in the figure, the magnet of the adhesive mechanism 3 is embedded in the flat π-faced dog of the holding plate. The pedestal (base) is slidably supported by the guiding mechanism (not shown) in a downward direction with respect to the smooth base surface u of the tip end surface. The magnet of the above-mentioned adhesive mechanism 3 is thinned. The electrostatic chuck 2 in the form of a film or a film, as the above-described isolation mechanism 4, ejects gas or fluid from the vent hole 4a opened inside the holding plate 丨 and the pedestal to the electrostatic chuck 2, or The sealed space formed between the base surface la and the electrostatic chuck 2 is increased in internal pressure, thereby resisting the magnetic force of the adhesive mechanism 3, and electrostatically sucking 117682.doc -16·200815268 almost entirely from the base In the holding plate 丨 and the pedestal, the suction suction mechanism 5 for suction and holding in the atmosphere is provided, and the plurality of suction path pipes formed as the suction adsorption mechanism 5 are connected to each other. When a suction source (not shown) such as a vacuum pump is used, the suction path is used as the vent hole 4a of the isolation mechanism 4. • In addition, only the smooth surface of the upper holding plate 1 is shown in the drawing. The electrostatic chuck 2 is supported in a reciprocating manner in the up-and-down direction, and is moved as a workpiece_A in a state in which the rigidity of the substrate is approximately 〇·5 mm or less, which is extremely low, and the substrate is moved. The plate i is smoothly supported in the vertical direction so as to support the electrostatic chuck 2 so as to be movable while holding and holding the surface of the lower substrate B. Therefore omitted. As the magnet 3a fixedly disposed on the pedestal of the holding plate, a permanent magnet, an electromagnet or the like is used as the magnet 3b fixedly disposed on the opposite surface of the electrostatic chuck 2, and a magnet formed in a thin plate shape or a film shape can be used. It is desirable to hold the cushioning property of the electrostatic chuck 2 or the peelability of the two magnets 3a and 3b. Further, as shown in FIG. 2 and FIG. 3, as the above-mentioned adhesive mechanism 3, the magnets 3a fixed to the pedestal of the holding plate 1 are fixed to the magnetic surface (4) of the opposite surface of the -# electric chuck 2, and The electrodes of the opposite magnetic poles are arranged alternately with each other, so that when the electrostatic chuck 2 is pulled from the base surface la by the above-described isolation mechanism 4, even if a slight shift is made to χγθ*, The magnetic force (repulsive force) of the action of the adhesive mechanism 3 is automatically restored to the original position. 117682.doc •17- 200815268

Further, 'by pulling the electrostatic chuck 2 to the base surface 1a of the holding plate 1 by the above-described adhesive mechanism 3, and forcibly peeling off from the workpiece (upper substrate) which has finished moving" is not bringing the entire surface of the electrostatic chuck 2 closer However, as shown in the enlarged view of the important part of Fig. 1(b), by directly drawing only the portion facing the workpiece A to be moved, the outer peripheral end portion A1, and locally deforming, It is preferable that a peeling gap s is formed locally between the outer peripheral end portions A1 of the workpiece A. Next, the workpiece transfer method using the electrostatic chuck device D is described. First, as shown in Fig. 1(a), the adhesion mechanism 3 or the suction suction mechanism 5 is actuated to bring the thin plate-like or film-shaped electrostatic chuck 2 closer to the base surface of the holding plate which is formed of a rigid body. The electrostatic chuck portion 2a is smoothed along the base surface la and bonded, and the workpiece a is electrostatically adsorbed to the electrostatic chuck 2. Next, as shown in Fig. 1(b), the isolation mechanism 4 is used. Actuated, in the state where the workpiece A is electrostatically adsorbed, the electrostatic chuck 2 is pulled away from the base _ surface 1a of the holding plate ,, and the workpiece A is directed toward the other workpiece (the lower substrate bait moves in parallel, since the workpiece A does not It becomes a free state, so it is transmitted without being affected by gravity or the like, and is temporarily fixed to the other side by the ring-shaped adhesive C. B. And after the movement is finished, the power of the electrostatic chuck 2 is cut off and stopped. The electrostatic adsorption function is caused by the above-mentioned adhesive mechanism 3 or the suction adsorption mechanism 5 being slightly delayed, and if the thin-plate or film-shaped electrostatic chuck 2 is forcibly pulled from the temporarily fixed workpiece A, the remaining of the electrostatic chuck 2 at this time The adsorption force is weak, so A gap S1 for peeling is formed between the workpiece A and the electrostatic adsorption portion 2a of the electrostatic chuck 2, and the electrostatic chuck portion 2a of the electrostatic chuck 2 is easily peeled off from the gap 81. At the same time, the sheet is simultaneously peeled off from the portion 81 of the 117682.doc 18 200815268. The electrostatic chuck 2 in the form of a film or a film, the magnets 3&, 3b, which are arranged by alternately arranging the electrodes of the opposite magnetic poles, are not slightly offset from the base surface U of the holding plate, but are automatically adhered to the original position and restored. In the initial state.

Therefore, even if the workpiece A having extremely low rigidity is used, it can be transported to the fixed position regardless of the instability of the residual suction force or the electrostatic adsorption force of the electrostatic chuck 2, and the peeling can be surely performed. Further, since the electrostatic adsorption portion of the electrostatic chuck 2 is smoothed along the base surface 1& of the holding plate 1 made of a rigid body, the electrostatic adsorption portion 2a and the surface of the workpiece are in contact with each other without any gap. Adsorption, so that the workpiece A can be surely held. Further, static is started from a portion which is singularly facing the outer end portion of the workpiece A; the suction cup 2 is partially deformed, and if it is at the peripheral end portion of the outer surface of the MA, a peeling gap 81 is formed, and static electricity is applied to the electrostatic chuck 2 The adsorption portion, such as the surface of the workpiece A, 'the gap for the peeling is enlarged at a time, and

The residual adsorption force is forcibly attenuated and disappears, so that the detachment of the guard A can be improved. Embodiment 2 In this embodiment 2, as shown in FIG. 4(a)(b), the face l, +, y 8) does not form the electrostatic chuck 2 as the base Sla or the guard AA of the holding plate i, The end portion of the end portion is detachably attached to the holder, and the front side holding plate 1 or the outer end portion: H7682.doc -19-200815268 is folded or partially folded by the holder 2e. While holding the plate 1', a current is supplied to the electrode portion 2c by connection with the current supply portion 2f, and an elastically deformable wrapable portion 2g is formed between the outer end portion 2d and the electrostatic adsorption portion 2a, and is reciprocally movable upward and downward. The configuration of the electrostatic adsorption b portion 2a is different from that of the first embodiment shown in Figs. 1 to 3, and the configuration is the same as that of the first embodiment shown in Figs. In the case of the example shown in the figure, the end portion 2d of the φ is fixed to the outer periphery of the electrostatic chuck 2 or the entire circumference of the outer end portion 2d is fixed at a predetermined interval. As another example, one of the outer end portions 2d of the parallel arrangement of the electrostatic chucks 2 may be fixed in parallel, or one of the parallel outer end portions 2d may be fixed at an appropriate interval. Thus, in the second embodiment shown in Fig. 4, the electrostatic chuck 2 can be supported by the guide mechanism without the guide mechanism (not shown), which is reciprocally supported in the up-and-down direction, and is actuated by the isolation mechanism 4 from the holding plate. When the electrostatic chuck 2 is pulled apart, the base surface & does not shift to the home position by shifting in the direction of χγθ. • As shown in FIG. 2 and FIG. 3, as the adhesive mechanism 3, it is not necessary to fix the magnets 3& which are fixedly disposed on the pedestal of the holding plate 1, and the magnets 固定 disposed on the opposite faces of the electrostatic chuck 2, and The electrode electrodes of the opposite magnetic poles are arranged alternately with each other, and in place of the magnets of the electrostatic chuck 2, even if a magnetic body such as a metal such as a film is formed in a film shape, it is possible to shift in the direction of the x-direction. By performing the reciprocating motion, the structure of the above-described adhesive mechanism 3 can be simplified and the cost can be reduced as compared with the embodiment shown in Figs. Embodiment 3 117682.doc -20- 200815268 As shown in Fig. 5 (a) to (c), this embodiment 3 shows an example of a substrate laminator using the electrostatic chuck device D described above, although the plate is held up and down,丨, the upper surface of the base surface la, la, respectively, is arranged in a thin plate or film-like electrostatic chuck 2, but only the upper base surface la reciprocatingly supported upwardly and downwardly, and electrostatic adsorption is performed on the electrostatic chucks 2, respectively. When the upper and lower substrates A and B are aligned, after the substrates A and B are placed in alignment, the isolation mechanism 4 is actuated, and the upper substrate A is electrostatically adsorbed from the upper substrate surface. The upper electrostatic chuck 2, 1 is pulled apart to move it to the lower substrate B, and after being bonded to the lower substrate B by the annular adhesive C, the adhesive mechanism 3 is actuated to forcibly peel off from the bonded substrate A. The electrostatic chuck 2 is returned to the upper base surface 1a. Moreover, between the base surface la below the lower holding plate and the electrostatic chuck 2, for example, a bonding material or a mechanical touch connection mechanism or an adhesive is disposed, as long as the two are detachably mounted as described above. The holding plate 1 is actuated by the adhesive mechanism 3 or the isolating mechanism 4, and the lower holding plate 1 does not reciprocate in the upward and downward directions. @ As shown in Fig. 6 (4) and (b), as needed, 'hold the plate!, the lower base = la' and the lower electrostatic chuck 2, respectively, to the z (up and down) direction - a straight line Through holes 6, inside the through holes 6, 7 electric chucks: the surface separation has been adhered to the upper and lower substrates A, B of the separation mechanism is opened: up and down) directionally freely disposed at the tip end of the insulating material > into a lift pin' or by actuation control such as

The fluid is ejected upward, and the surface of the electrostatic chuck 2 that has been attached to the upper substrate is pushed up to form a slight de-energization of, for example, about 2 to 3 between the inner surface B1 of the lower substrate B 117682.doc 200815268. The gap 82 is ideal. The separation mechanism 7 is embedded in the atmosphere of the lower surface of the electrostatic chuck 2 in the atmosphere in which the gap S2 is formed between the surface of the electrostatic chuck 2 below and the inner surface B1 of the lower substrate]8 or in a predetermined low vacuum. Between the above electrode portions, a high voltage is applied to the southeast voltage source (not shown), and the polarity of the voltage is repeatedly reversed from the state applied when the substrate B is electrostatically adsorbed, and the two are changed by

The voltage of the electrode portion 2e on φ induces an electric field that neutralizes the electric charges remaining on the upper and lower substrates A and B. Further, in the illustrated example, the above-described embodiment i shown in FIGS. 1 to 3 is used as the electrostatic chuck device D. However, although not shown as another example, the embodiment shown in FIG. 4 may be used. 2. Next, the operation of the substrate bonding machine using the electrostatic chuck device D will be described. First, in the atmospheric pressure state shown by the solid line in Fig. 5(a), the thin plate-like or film-shaped electrostatic chuck 2 is pulled closer to the upper surface by the action of the above-described adhesive mechanism 3 or the suction suction mechanism 5. And smoothly adhering along the upper base surface, and in this state, the upper and lower substrates A and B are transported by the transport robot, and are respectively attached to the electrostatic chuck 2 and attached to the upper holding surface la. On the lower base surface 1a, the electrostatic chuck 2 below the upper surface is electrostatically adsorbed and held. Then, as shown by the chain double-dashed line in Fig. 5(a), the upper and lower holding plates 1, 1 ' are moved close to each other to form a vacuum chamber s by the action of the elevating mechanism, and after the vacuum chamber S reaches a predetermined degree of vacuum, In this state, the upper and lower holding plates 丨 and ^ are relatively adjusted and moved, and the alignment of the upper and lower substrates A and B is performed 117682.doc -22-200815268. After the alignment operation is completed, as shown in FIG. 5(b), the upper electrostatic chuck 2 is peeled off from the upper base surface ia by the operation of the isolation mechanism 4 in a state where the upper substrate A is electrostatically adsorbed. The upper substrate person is moved toward the lower substrate 6. Therefore, the upper and lower substrates A and Β are pressed against each other with the ring-shaped adhesive C interposed therebetween, and the two are superposed after being sealed.

_ In the superimposing step, not only the gas or the fluid flowing between the upper and lower substrates A and B can be completely prevented, but also the thin-plate or film-shaped electrostatic chuck 2 which is present on the substrate A is extremely low in rigidity. Since the buffer material is slightly uneven even if the pressurization of the ring-shaped adhesive c is slightly uneven, it is difficult to affect the ring-shaped adhesive C or the reverse current device (not shown) formed between the upper and lower substrates A and B. The benefits of waiting. Further, after the movement of the substrate A is completed, the power supply of the upper electrostatic chuck 2 is cut off, and the electrostatic adsorption function is stopped. • After that, the atmospheric pressure is restored in the vacuum chamber S, and the pressure difference generated between the inside and the outside of the two substrates A and b is uniformly pressurized, and the pressure difference between the inside and the outside of the two substrates Α and β is crushed to a predetermined gap. Fit step. As shown in FIG. 5(c), the adsorption mechanism '5 is attracted by the adhesive mechanism field, and the electrostatic chuck 2 is pulled up from the upper substrate a through the annular adhesive C and the lower substrate B. The base surface u starts to peel off both of them. At this time, the degree of vacuum in the vacuum chamber 8 passes through the Paschen discharge region of the range of tens h to thousands of h, and the residual adsorption force of the electrostatic chuck 2 above the L ^ is extremely 117682.doc -23· 200815268 However, The substrate A and the upper electrostatic chuck 2 are held in contact with each other by the adhesive force of the ring-shaped adhesive c, so that it may be difficult to peel off. Therefore, as described above, the entire surface of the upper electrostatic chuck 2 is not simultaneously peeled off from the surface of the upper substrate A, but is partially deformed from a portion opposed to the outer peripheral end portion A1 of the substrate a to be bonded, if A peeling gap is partially formed between the outer peripheral end portions A1 of the upper substrate a, and the peeling gap is gradually enlarged on the surfaces of the electrostatic adsorption portion 2a and the upper substrate A of the electrostatic chuck 2, and the residual adsorption force is forcibly lost. The electrostatic adsorption surface of the electrostatic chuck 2 above is smoothly peeled off from the surface of the upper substrate A as a whole. Therefore, even if the substrate A is extremely low in rigidity, it can be bonded to the fixed position and reliably peeled off irrespective of the instability of the remaining suction force or the electrostatic adsorption force of the upper electrostatic chuck 2. Further, the electrostatic chuck 2 which is peeled off from the surface of the upper substrate A is adhered to the upper base surface 1a, and then the upper and lower holding plates 1 and 1' are moved in the direction in which they are separated from each other by the operation of the elevating mechanism to return to the initial state. In this state, the periphery of the upper and lower substrates A and b is bonded to the atmosphere, or to a low vacuum of 100 Pa or more. In this environment, as shown in Fig. 6 (a) and (b), The separating mechanism 7 raises the lift pin from the base surface 1 a' of the lower holding plate 1 and the plurality of through holes 6 of the electrostatic chuck 2 that is opened below, or ejects a gas such as nitrogen or air or the like upward. The upper and lower substrates A and b are pushed up from the surface of the lower surface of the electrostatic chuck 2, and a small gap S2 for removing electricity of, for example, about 2 to 3 mm is formed between the upper substrate B and the inner surface B1 of the lower substrate B. 117682.doc -24- 200815268 In this state, the voltage of two or more electrode portions 2〇 embedded in the electrostatic chuck 2 underneath is changed, and the electrostatic chuck 2 from below is adhered to the glass. The peeling electrification which occurs at the moment of peeling off the state of the substrate B induces an electric field (specifically, an alternating electric field) which neutralizes the electric charges remaining on the upper and lower substrates A and B. As a result, a part of the surrounding gas in the induced electric field portion air or the like is ionized and ionized, that is, the neutral molecules are separated into positive and negative charges, so that the charge on the lower substrate B is neutralized and the charge is removed. Then, the upper and lower substrates a and B are transported by the transfer robot, and the electrostatic chuck 2 adhered to the upper surface of the upper base surface la and the electrostatic chuck 2 attached to the lower surface of the lower base surface la' are transported and matched. When it is set, there is a possibility of entering the glass fragments (fragments). At this time, the electrostatic adsorption accompanying the upper and lower substrates A and B causes the glass fragments to be caught between the electrostatic chucks 2, and the surface of the dielectric body of the electrostatic chuck 2 is partially broken and malfunctions. Even in this case, In addition, the electrostatic chuck 2 having a thin plate shape or a film shape is detachably attached to the upper and lower pedestal surfaces u and amps. Therefore, there is an advantage that the electrostatic chuck 2 can be easily exchanged for excellent maintainability. The electrostatic chuck device D of the invention is disposed on a substrate of a glass substrate or a plastic film substrate which is used for disassembly and assembly of the workpieces A and B for use in a liquid crystal display (LCD) or a plasma display (PDP) or a flexible display panel. In the case of a bonding machine, the present invention is not limited thereto, and may be disposed in a substrate assembly device other than the substrate bonding machine, or a substrate transfer device that transports the substrate, or a substrate 117682 other than the glass substrate for holding and holding the LCD panel. Doc •25- 200815268 Also.

Further, although the substrate bonding machine in which the two substrates A and B are bonded in a vacuum is described, the present invention is not limited thereto, and a substrate bonding machine in which the substrates A and B are bonded to the atmosphere may be used. It is also possible to obtain the same effects as the above-described vacuum bonding λ machine. Moreover, in the illustrated example, the electrostatic chuck 2 is supported reciprocally only with respect to the upper surface 1a of the upper holding plate 1 in the up-down direction, but is not limited thereto, and the electrostatic chuck 2 is held relative to the lower side. The plate 1, the lower base surface 1& is movably supported in the 2 direction, and further, the lower holding plate is provided with the adhesive mechanism 3 and the isolation mechanism 4, and the standing mechanism 3 is used to adhere the electrostatic chuck 2 to the lower holding plate. ^ Under the base surface la, with the electrostatic chuck 2 adhered, electrostatically adsorbing the lower substrate B, and using the above-mentioned isolation mechanism 4, the electrostatic chuck 2 and the lower substrate b are integrally held from the lower holding plate to the open position. After being separated and moved in parallel, at the same time, after the electrostatic chuck function of the electrostatic chuck 2 is stopped, only the electrostatic chuck 2 is held downward from the open position by the adhesive mechanism 3, and moved in the opposite direction, by moving from the _ to the open position. The surface of the lower substrate B is peeled off from the electrostatic chuck 2, and the bonding operation of the substrates A and B may be performed. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front elevational view showing a workpiece transfer method and an electrostatic chuck device according to the present invention, and (a) and (b) are diagrams showing an operation sequence. Fig. 2 is a reduced bottom view taken along line (2)-(2) of Fig. 1(a). Figure 3 is a enlarged plan view of the line (3)-(3) along the line Ka). > Fig. 4 is a longitudinal sectional view showing the workpiece transfer method of the present invention and the electrostatic chuck device of the second embodiment. (4) (b) shows the sequence of the operation steps. 117682.doc * 26 - 200815268 Fig. 5 is a front view showing the reduced longitudinal direction of the third embodiment of the bonding machine using the workpiece transfer method and the electrostatic chuck device of the present invention, wherein the substrates are represented in steps (a) to (c). The method of fitting. Fig. 6 is a front view showing the reduction of the longitudinal direction when the power is removed, and (a) and (b) are the sequence of the operation steps. [Main component symbol description]

1 upper holding plate la base surface Γ lower holding plate la. base surface 2 electrostatic chuck 2a electrostatic adsorption portion 2b dielectric body 2c electrode portion 2d outer end portion 2e stator 2f current supply portion 2g flexible portion 3 adhesive mechanism 3a Magnet 3b Magnetic body (magnet) 4 Isolation mechanism 4a Ventilation hole 4b Confined space 117682.doc -27- 200815268

5 6 7 A A1 B C S 51 52 Suction suction mechanism Through hole Separation mechanism Workpiece (upper substrate) Peripheral end part Workpiece (lower substrate) Ring adhesive Electrostatic chuck device Vacuum chamber Stripping gap Clearance gap

117682.doc 28-

Claims (1)

200815268 X. Patent application scope: 1 · A workpiece transfer method, which uses an electrostatic chuck of a holding plate to adsorb and hold a workpiece to open the held workpiece and load it at a predetermined position, characterized in that an adhesive mechanism and isolation are provided on the above holding plate a mechanism for pulling the electrostatic chuck to the holding plate and disassembling it freely along the holding j, the separating mechanism peeling the electrostatic chuck from the holding plate, and the electrostatic chuck is adhered to the holding plate by the squeezing mechanism And holding and holding the I piece by the adhered electrostatic chuck, and at the same time, by separating the electrostatic chuck and the workpiece from the holding plate by the above-mentioned isolation mechanism, stopping the electrostatic suction of the electrostatic chuck, and then using the above The adhesive mechanism only adheres the electrostatic chuck to the retaining plate again, thereby leaving the workpiece loaded. 2. If the method of conveying the guards is requested, the upper (four) electric suction cups are formed into a thin plate shape or a film shape, and the smooth base surface of the holding plate made of the rigid body is freely supported in the direction of the parent. . (3) The electrostatic chucking portion of the electrostatic chuck is partially deformed from a portion opposite to the stomach y1 door hopper and is outside the workpiece as the workpiece is transferred as described in claim 1 or 2. Partially forming a peeling space between the doors ^ 4. An electrostatic chuck device is formed by holding the plate and the disk. (4) is that the electrostatic attraction of the reading workpiece is perpendicular to the workpiece side surface of the holding plate. Supporting the electrostatic chuck, so that the electrostatic suction = moving 1 dry side surface state 117682.doc 200815268, the surface of the electrostatic adsorption guard, the electrostatic chuck is electrostatically adsorbed from the adsorption position to the open position, while The electrostatic adsorption function of the electrostatic chuck is stopped, and only the electrostatic chuck is moved from the open position to the adsorption position in the opposite direction, and the electrostatic chuck is peeled off from the surface of the workpiece moved to the open position. A method of bonding a substrate, characterized in that the electrostatic chuck device according to claim 4 is provided on either or both of the pair of holding plates, and the two substrates are opposed to each other as the workpiece between the holding plates. The electrostatic chuck of the electrostatic chuck device is peeled off from one of the holding plates while the substrate of one of the substrates is electrostatically adsorbed, and the substrate of the one of the substrates is moved to the other substrate, and the two substrates are bonded together by a ring-shaped adhesive. Substrate 0 117682.doc