JP5654155B1

JP5654155B1 - Work bonding machine

Info

Publication number: JP5654155B1
Application number: JP2014078192A
Authority: JP
Inventors: 義和大谷
Original assignee: Shin Etsu Engineering Co Ltd
Current assignee: Shin Etsu Engineering Co Ltd
Priority date: 2014-04-04
Filing date: 2014-04-04
Publication date: 2015-01-14
Anticipated expiration: 2034-04-04
Also published as: JP2015199218A

Abstract

【課題】各種デバイスで板状ワークに、もう一枚の板状ワークを貼り合わせる貼り合わせデバイスの製造工程において、第一保持部材による第一ワークの加圧時及び第一ワークからの粘着ピンの引き剥がし時において第一ワークの変形を最小限に抑えるワーク貼り合わせ装置の提供。【解決手段】制御部７で接離用駆動部４及び着脱用駆動部５が作動制御され、減圧雰囲気ＤＰで第一保持部材１又は粘着ピン３のいずれか一方か又は両方を第二保持部材２に対し相対的に接近移動させ、第一ワークＷ１と第二ワークＷ２が貼り合わせ、前記貼り合わせ後は、第一保持部材１の剛性当接面１１が第一ワークＷ１に接触した状態で、粘着ピン３を第一ワークＷ１から離隔する方向へ移動させ、粘着ピン３の引き剥がしに伴い第一ワークＷ１における粘着ピン３で粘着保持された部位の周辺部分が、剛性当接面１１と接触して剛性当接面１１に沿うように形状保持されるワーク貼り合わせ装置。【選択図】図１Kind Code: A1 In a manufacturing process of a bonding device in which another plate-shaped workpiece is bonded to a plate-shaped workpiece with various devices, when the first workpiece is pressed by a first holding member and the adhesive pin from the first workpiece is Providing a workpiece laminating device that minimizes deformation of the first workpiece during peeling. The control unit 7 controls the operation of the contact / separation drive unit 4 and the attachment / detachment drive unit 5 so that one or both of the first holding member 1 and the adhesive pin 3 is a second holding member in a reduced pressure atmosphere DP. 2, the first work W1 and the second work W2 are bonded together, and after the bonding, the rigid contact surface 11 of the first holding member 1 is in contact with the first work W1. The adhesive pin 3 is moved in a direction away from the first work W1, and the peripheral portion of the portion of the first work W1 that is adhesively held by the adhesive pin 3 as the adhesive pin 3 is peeled off is connected to the rigid contact surface 11. A workpiece laminating apparatus that is held in shape so as to be in contact with the rigid abutting surface 11 in contact. [Selection] Figure 1

Description

本発明は、タッチパネルと液晶モジュール（ＬＣＭ）の間にＵＶ硬化性の光学透明樹脂（ＯＣＲ）に封止して貼り合わせたタッチパネル式のフラットパネルディスプレイ（ＦＰＤ）や３Ｄ（３次元）ディスプレイや電子書籍か、又は有機発光ダイオード（ＯＬＥＤ：有機ＥＬ）を内部に封止した有機ＥＬディスプレイなどのような、ＬＣＭやフレキシブルプリント配線板（ＦＰＣ）やガラス基板などの板状ワークに対し、タッチパネルやカバーガラスやカバーフィルムやＦＰＤなどのもう一枚の板状ワークを貼り合わせるための貼合デバイスの製造過程に用いられるワーク貼り合わせ装置に関する。 The present invention is a touch panel type flat panel display (FPD), 3D (three-dimensional) display, electronic, and the like which is sealed and bonded to a UV curable optical transparent resin (OCR) between a touch panel and a liquid crystal module (LCM). Touch panels and covers for LCM, flexible printed wiring boards (FPCs) and glass substrates such as books or organic EL displays with organic light emitting diodes (OLEDs) sealed inside The present invention relates to a workpiece laminating apparatus used in the manufacturing process of a laminating device for laminating another plate-shaped workpiece such as glass, a cover film, and FPD.

従来、この種のワーク貼り合わせ装置として、チャンバの内側に設けられた上テーブルに、基板保持面に弾性体と真空吸着機構とパージガスブロー機構とを備えた弾性体プレートを設け、上テーブルとは独立して上下することができる粘着ピンプレートに複数の粘着ピンを備え、上テーブル及び弾性体プレートに粘着ピンが移動可能な貫通孔を設け、粘着ピンの先端に粘着機構（粘着シート）を有する構成とした基板組立装置がある（例えば、特許文献１参照）。
さらに、粘着ピン及び下テーブルにそれぞれ上下基板を保持し、真空チャンバ内が減圧状態になると、上下基板のＸＹθ方向のずれを修正する。上下基板の位置合わせが終了すると、上テーブルを移動させると共に、それに同期して粘着ピン駆動機構を下テーブル側に移動させることで上下基板を接触させ、更に上テーブルのみが下降し、加圧を行うと共に粘着ピンから上基板を離脱させる。基板を加圧する際に弾性体プレート上の弾性体が変形することによって、基板全体を均一に加圧することができる。
前述のような方法では、粘着ピンの粘着シートを基板面から剥がす際に周囲の弾性体が緩衝部材として働き、粘着ピン部分の基板面に大きな引き剥がし力が作用せずに、引き剥がし力が分散されるために基板に歪が発生しにくくなる。 Conventionally, as this kind of work laminating apparatus, an upper table provided inside the chamber is provided with an elastic plate having an elastic body, a vacuum suction mechanism and a purge gas blow mechanism on the substrate holding surface. The adhesive pin plate that can be moved up and down independently is provided with a plurality of adhesive pins, a through hole through which the adhesive pin can move is provided in the upper table and the elastic plate, and an adhesive mechanism (adhesive sheet) is provided at the tip of the adhesive pin There is a substrate assembly apparatus configured (see, for example, Patent Document 1).
Furthermore, when the upper and lower substrates are respectively held by the adhesive pins and the lower table and the inside of the vacuum chamber is in a reduced pressure state, the displacement of the upper and lower substrates in the XYθ direction is corrected. When the alignment of the upper and lower substrates is completed, the upper table is moved, and the adhesive pin drive mechanism is moved to the lower table side in synchronization therewith to bring the upper and lower substrates into contact with each other. And the upper substrate is detached from the adhesive pin. When the substrate is pressed, the elastic body on the elastic plate is deformed, so that the entire substrate can be pressed uniformly.
In the above-described method, when the adhesive sheet of the adhesive pin is peeled off from the substrate surface, the surrounding elastic body acts as a buffer member, and the peeling force is not exerted on the substrate surface of the adhesive pin portion, and the peeling force is exerted. Dispersion makes it difficult for the substrate to be distorted.

特開２００７−３１００４１号公報JP 2007-310041 A

近年では、貼合デバイスを構成する基板などの板状ワークが薄肉化され、板状ワークとしてカバーフィルムが用いられることもあり、板状ワークの薄肉化に伴って剛性も低下する傾向にある。
しかし乍ら、特許文献１に記載のものでは、上テーブルによる基板の加圧時に弾性体を変形させるため、上基板において弾性体が変形した箇所と接触する部位も変形して部分的な歪みが発生する。
さらに、基板面からの粘着ピンの剥離時においても弾性体を弾性変形させて緩衝するように構成しているため、上基板において粘着ピンで粘着保持された部位及びその周辺部分が、弾性体の変形に伴い変形して部分的な歪みが発生する。
これらの部分的な歪みにより、貼合デバイスのギャップ不良や、貼り合わせた上下基板に部分的な位置ズレができてアライメント不良が発生するという問題があった。
特に、上基板として薄肉化された基板やフィルムなどを用いた際には、ギャップ不良やアライメント不良が顕著に表れて、位置ズレも大きくなるという問題があった。
また、上テーブルの弾性体プレートと粘着ピンの粘着シートに接していた上基板を離脱（剥がす）時には、弾性体において粘着チャックの周辺近傍に配置される部位に対し、上基板において粘着ピンで粘着保持された部位の周辺部分が強く押し付けられるとともに、これら両者の変形により弾性体と上基板の接触面積が更に増大するため、大きな静電気が発生して帯電（剥離帯電）する。
しかも、弾性体プレート及び粘着ピンから上基板を離脱して離す剥離動作は、減圧された真空チャンバ内の絶乾状態（湿度がほぼ０％の状態）で行われるため、剥離帯電の影響が非常に大きくなる。また、密閉された真空チャンバの内部における剥離動作であるため、大気中での剥離動作とは異なり、ブローイオナイザーやフォトイオナイザーを用いて、発生した剥離帯電を簡単に除去するというも事実上困難な条件下にある。
それにより、発生した帯電による電荷によって、真空チャンバー内の導電部分へアーク放電が発生し、上基板の貼り合わせ面に存在する電子回路などが断線を起こすか、或いは破壊までは至らなくとも、静電気によってその特性が変化させられることもあるという問題があった。 In recent years, a plate-like workpiece such as a substrate constituting a bonding device has been thinned, and a cover film is sometimes used as the plate-like workpiece, and the rigidity tends to decrease as the plate-like workpiece is thinned.
However, in the one described in Patent Document 1, since the elastic body is deformed when the substrate is pressed by the upper table, the portion of the upper substrate that contacts the portion where the elastic body is deformed is also deformed, resulting in partial distortion. Occur.
Furthermore, since the elastic body is elastically deformed and buffered even when the adhesive pin is peeled off from the substrate surface, the portion held by the adhesive pin on the upper substrate and the peripheral portion thereof are the elastic body. Due to the deformation, the deformation causes a partial distortion.
Due to these partial distortions, there is a problem that a gap defect of the bonding device or a partial positional deviation occurs in the bonded upper and lower substrates, resulting in an alignment failure.
In particular, when a thin substrate or film is used as the upper substrate, there has been a problem that gap defects and alignment defects are remarkably exhibited and positional deviation is increased.
In addition, when the upper substrate that is in contact with the upper plate elastic plate and the adhesive sheet of the adhesive pin is removed (peeled), the upper substrate is adhered with the adhesive pin to the portion disposed near the periphery of the adhesive chuck. Since the peripheral portion of the held portion is strongly pressed and the contact area between the elastic body and the upper substrate is further increased by deformation of both of them, large static electricity is generated and charged (peeling off).
In addition, the peeling operation that separates and separates the upper substrate from the elastic plate and the adhesive pin is performed in an absolutely dry state (humidity is almost 0%) in a vacuum chamber that is depressurized. Become bigger. In addition, since the peeling operation is performed inside a sealed vacuum chamber, unlike the peeling operation in the air, it is practically difficult to easily remove the generated peeling charge using a blow ionizer or a photo ionizer. Under conditions.
As a result, the electric charge generated by the charging causes arc discharge to the conductive part in the vacuum chamber, and the electronic circuit existing on the bonding surface of the upper substrate is broken or static electricity is not destroyed. However, there is a problem that the characteristics may be changed.

本発明は、このような問題に対処することを課題とするものであり、第一保持部材による第一ワークの加圧時及び第一ワークからの粘着ピンの引き剥がし時において第一ワークの変形を最小限に抑えること、などを目的とするものである。 The present invention is directed to addressing such problems, and the deformation of the first workpiece is performed when the first workpiece is pressed by the first holding member and when the adhesive pin is peeled off from the first workpiece. The purpose is to minimize the above.

このような目的を達成するために本発明は、第一ワークを粘着保持手段で粘着保持し、減圧雰囲気で前記第一ワークと第二ワークを相対的に接近移動して貼り合わせるとともに、前記第一ワークから前記粘着保持手段を剥離するワーク貼り合わせ装置であって、前記第一ワークと対向して面状に接触する剛性当接面を有する第一保持部材と、前記粘着保持手段として前記第一保持部材を貫通するように設けられる粘着ピンと、前記第一保持部材又は前記第二ワークが保持される第二保持部材のいずれか一方か若しくは両方を相対的に接近移動させる接離用駆動部と、前記第一保持部材に対して前記粘着ピンを相対的に往復動させる着脱用駆動部と、前記接離用駆動部及び前記着脱用駆動部をそれぞれ作動制御する制御部と、を備え、前記制御部は、減圧雰囲気において前記接離用駆動部及び前記着脱用駆動部により、前記第一保持部材又は前記粘着ピンのいずれか一方か若しくは両方を、前記第一ワークと前記第二ワークが貼り合わされるように前記第二保持部材に対し相対的に接近移動させ、前記第一ワーク及び前記第二ワークの貼り合わせ後に、前記接離用駆動部により前記剛性当接面が前記第一ワークの表面に接触する状態を保持し、前記着脱用駆動部により前記粘着ピンを前記第一ワークから離隔する方向へ移動させて、前記第一ワークにおける前記粘着ピンの粘着部で粘着保持された部位の周辺部分が、前記剛性当接面に面接触した状態で引き剥がすことを特徴とする。 In order to achieve such an object, the present invention holds the first workpiece in an adhesive holding means, moves the first workpiece and the second workpiece relatively close together in a reduced pressure atmosphere, and bonds them together. A work laminating apparatus for peeling the adhesive holding means from one work, a first holding member having a rigid contact surface facing the first work and contacting the surface, and the first holding member as the adhesive holding means Contact / separation drive unit that relatively moves either one or both of the adhesive pin provided to penetrate one holding member and the second holding member holding the first holding member or the second workpiece. And an attaching / detaching drive unit that reciprocates the adhesive pin relative to the first holding member, and a control unit that controls the contact / separation driving unit and the attaching / detaching drive unit . Control The first workpiece and the second workpiece are bonded to one or both of the first holding member and the adhesive pin by the contact / separation drive unit and the attachment / detachment drive unit in a reduced pressure atmosphere. In this manner, the rigid contact surface is brought into contact with the surface of the first workpiece by the contact / separation driving unit after the first workpiece and the second workpiece are bonded together. holds state contact, said adhesive pin is moved in the direction away from the first workpiece by the detachable drive unit, the peripheral portion of the site that was adhered and held by the adhesive portion of the adhesive pin at the first workpiece However, it peels off in the state which surface-contacted to the said rigid contact surface .

前述した特徴を有する本発明は、制御部で接離用駆動部及び着脱用駆動部が作動制御され、減圧雰囲気で第一保持部材又は粘着ピンのいずれか一方か若しくは両方を第二保持部材に対し相対的に接近移動させることにより、第一ワークと第二ワークが貼り合わされる。この貼り合わせ後は、第一保持部材の剛性当接面が第一ワークに接触した状態で、粘着ピンを第一ワークから離隔する方向へ移動させることにより、粘着ピンの引き剥がしに伴い第一ワークにおける粘着ピンで粘着保持された部位の周辺部分が、剛性当接面と接触して剛性当接面に沿うように形状保持される。
したがって、第一保持部材による第一ワークの加圧時及び第一ワークからの粘着ピンの引き剥がし時において第一ワークの変形を最小限に抑えることができる。
その結果、上テーブルによる基板の加圧時及び基板面からの粘着ピンの剥離時にそれぞれ弾性体が変形して上基板に部分的な歪みを発生する従来のものに比べ、第一ワークとして薄肉化された基板やフィルムなどの剛性が低いものを用いても、第一保持部材による第一ワークの加圧時及び第一ワークからの粘着ピンの引き剥がし時において第一ワークに部分的な歪みが発生しないため、貼り合わせた第一ワークと第二ワークが平行に保たれてギャップ不良の発生を防止できるとともに、貼り合わせた第一ワークと第二ワークが部分的に位置ズレしないため、アライメント不良の発生を防止できる。 In the present invention having the above-described features, the control unit controls the operation of the contact / separation drive unit and the attachment / detachment drive unit, and either or both of the first holding member and the adhesive pin are used as the second holding member in a reduced pressure atmosphere. The first workpiece and the second workpiece are bonded together by moving relatively closer to each other. After the bonding, the adhesive pin is moved away from the first workpiece while the rigid contact surface of the first holding member is in contact with the first workpiece. The shape of the peripheral portion of the part of the workpiece that is adhesively held by the adhesive pin comes into contact with the rigid contact surface and is held along the rigid contact surface.
Therefore, the deformation of the first workpiece can be minimized when the first workpiece is pressed by the first holding member and when the adhesive pin is peeled off from the first workpiece.
As a result, the thickness of the first workpiece is reduced compared to the conventional one in which the elastic body deforms when the substrate is pressed by the upper table and the adhesive pin is peeled off from the substrate surface, causing partial distortion in the upper substrate. Even when a low-stiffness substrate or film is used, the first workpiece is partially distorted when the first workpiece is pressed by the first holding member and when the adhesive pin is peeled off from the first workpiece. Since it does not occur, the bonded first and second workpieces are kept parallel to prevent gap defects, and the bonded first and second workpieces are not partially misaligned. Can be prevented.

本発明の実施形態に係るワーク貼り合わせ装置の全体構成を示す説明図であり、（ａ）が貼り合わせ前の縦断正面図、（ｂ）が貼り合わせ後の縦断正面図である。It is explanatory drawing which shows the whole structure of the workpiece | work bonding apparatus which concerns on embodiment of this invention, (a) is a vertical front view before bonding, (b) is a vertical front view after bonding. ワーク貼り合わせ工程を示す説明図であり、（ａ）が受け取り後の縮小縦断正面図、（ｂ）が粘着時の縮小縦断正面図、（ｃ）が貼り合わせ時の縮小縦断正面図、（ｄ）が引き剥がし時の縮小縦断正面図である。It is explanatory drawing which shows a workpiece | work bonding process, (a) The reduction | decrease vertical front view after reception, (b) The reduction | decrease vertical front view at the time of adhesion, (c) The reduction | decrease vertical front view at the time of bonding, (d) ) Is a reduced longitudinal front view at the time of peeling. 帯電防止手段の変形例を示す説明図であり、（ａ）が貼り合わせ前の縦断正面図、（ｂ）が貼り合わせ後の縦断正面図である。It is explanatory drawing which shows the modification of an antistatic means, (a) is a vertical front view before bonding, (b) is a vertical front view after bonding. 帯電防止手段の変形例を示す説明図であり、（ａ）が貼り合わせ前の縦断正面図、（ｂ）が貼り合わせ後の縦断正面図である。It is explanatory drawing which shows the modification of an antistatic means, (a) is a vertical front view before bonding, (b) is a vertical front view after bonding. 吸着保持手段の変形例を示す説明図であり、（ａ）が貼り合わせ前の縦断正面図、（ｂ）が貼り合わせ後の縦断正面図である。It is explanatory drawing which shows the modification of an adsorption | suction holding means, (a) is a vertical front view before bonding, (b) is a vertical front view after bonding. ワーク貼り合わせ工程を示す説明図であり、（ａ）が受け取り後の縮小縦断正面図、（ｂ）が粘着時の縮小縦断正面図、（ｃ）が貼り合わせ時の縮小縦断正面図、（ｄ）が引き剥がし時の縮小縦断正面図である。It is explanatory drawing which shows a workpiece | work bonding process, (a) The reduction | decrease vertical front view after reception, (b) The reduction | decrease vertical front view at the time of adhesion, (c) The reduction | decrease vertical front view at the time of bonding, (d) ) Is a reduced longitudinal front view at the time of peeling.

以下、本発明の実施形態を図面に基づいて詳細に説明する。
本発明の実施形態に係るワーク貼り合わせ装置Ａは、図１〜図６に示すように、板状の第一ワークＷ１を粘着保持手段で粘着保持し、減圧雰囲気ＤＰで第一ワークＷ１と板状の第二ワークＷ２を相対的に接近移動して、第一ワークＷ１と第二ワークＷ２を貼り合わせ、第二ワークＷ２に貼り合わされた第一ワークＷ１から前記粘着保持手段を剥離する真空貼り合わせ装置である。
この真空貼り合わせ装置の具体例としては、変圧室Ｂに搬入された第一ワークＷ１を粘着保持手段で粘着保持して受け取り、その後、減圧された変圧室Ｂ内で第二ワークＷ２に対し相対的に接近移動して貼り合わせる（合着する）ことにより、内部に封止空間を有する貼合デバイスＷが作成される。これに続いて、貼合デバイスＷの第一ワークＷ１から前記粘着保持手段を剥離した後に、変圧室Ｂを大気圧に戻すことで、貼合デバイスＷの封止空間の内圧と圧力差が生じ、この圧力差により貼合デバイスＷを所定ギャップまで均等に加圧され、完成した貼合デバイスＷを変圧室Ｂから搬出するように構成される。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
As shown in FIGS. 1 to 6, the workpiece bonding apparatus A according to the embodiment of the present invention holds the plate-like first workpiece W 1 with an adhesive holding means, and the first workpiece W 1 and the plate in a reduced pressure atmosphere DP. The second workpiece W2 having a shape is moved relatively close, the first workpiece W1 and the second workpiece W2 are bonded together, and the adhesive holding means is peeled off from the first workpiece W1 bonded to the second workpiece W2. It is a matching device.
As a specific example of this vacuum bonding apparatus, the first work W1 carried into the variable pressure chamber B is adhesively held by the adhesive holding means, and then relative to the second work W2 in the decompressed variable pressure chamber B. The bonding device W which has a sealing space inside is created by closely moving and sticking together (bonding). Following this, after peeling off the adhesive holding means from the first workpiece W1 of the bonding device W, the pressure inside the sealed space of the bonding device W and the pressure difference are generated by returning the transformation chamber B to atmospheric pressure. By this pressure difference, the bonding device W is evenly pressurized to a predetermined gap, and the completed bonding device W is configured to be carried out from the variable pressure chamber B.

詳しく説明すると、本発明の実施形態に係るワーク貼り合わせ装置Ａは、第一ワークＷ１と対向するように設けられる第一保持部材１と、第一保持部材１又は第二ワークＷ２が保持される第二保持部材２のいずれか一方か若しくは両方を相対的に接近移動させる接離用駆動部４と、前記粘着保持手段として第一保持部材１を貫通するように設けられる粘着ピン３と、第一保持部材１に対して粘着ピン３を相対的に往復動させる着脱用駆動部５と、を主要な構成要素として備えている。
また、第一保持部材１に向け第一ワークＷ１を吸引して保持する吸着保持手段６を備えることも可能である。
さらに、少なくとも接離用駆動部４及び着脱用駆動部５や吸着保持手段６をそれぞれ作動制御するための制御部７が備えられている。 If it demonstrates in detail, the workpiece | work bonding apparatus A which concerns on embodiment of this invention will hold | maintain the 1st holding member 1 provided so that the 1st workpiece | work W1 may be opposed, and the 1st holding member 1 or the 2nd workpiece | work W2. An approach / separation drive unit 4 for relatively moving either one or both of the second holding members 2, an adhesive pin 3 provided so as to penetrate the first holding member 1 as the adhesive holding means, An attaching / detaching drive unit 5 for reciprocating the adhesive pin 3 relative to the one holding member 1 is provided as a main component.
It is also possible to provide suction holding means 6 that sucks and holds the first workpiece W1 toward the first holding member 1.
Further, a control unit 7 is provided for controlling the operation of at least the contact / separation drive unit 4, the attachment / detachment drive unit 5, and the suction holding means 6.

貼合デバイスＷは、例えばＦＰＤや３Ｄ（３次元）ディスプレイや電子書籍か又は有機ＥＬディスプレイなどのような、構成部品が一体的に組み付けられた薄板状の構造体である。
第一ワークＷ１は、例えばタッチパネルやカバーガラスやカバーフィルムなどからなり、ＬＣＭやフレキシブルプリント配線板（ＦＰＣ）などからなる第二ワークＷ２を覆うように接着されることで、ＦＰＤや有機ＥＬディスプレイなどを構成するものである。
さらに必要に応じて、第一ワークＷ１及び第二ワークＷ２の対向面のいずれか一方又は両方には、シール材Ｗ３がディスペンサなどの定量吐出ノズルを用いて塗布される。
シール材Ｗ３としては、紫外線などの光エネルギーを吸収して重合が進行することにより硬化して接着性を発現する、ＵＶ硬化性の光学透明樹脂（ＯＣＲ）などの光硬化型接着剤を用い、スペーサーなどのセルギャップ制限機能が無い貼り合わせを行う貼合デバイスＷに適している。
また、その他の例として、熱エネルギーの吸収により重合が進行して硬化する熱硬化型接着剤、二液混合硬化型接着剤などのシール材Ｗ３を用いたり、シール材Ｗ３を介在させずに第一ワークＷ１と第二ワークＷ２の対向面同士を貼り合わせたり変更することも可能である。
なお、第一ワークＷ１及び第二ワークＷ２は、図１〜図６に示されるように、通常、上下方向へ対向するように配置され、上側の第一ワークＷ１と下側の第二ワークＷ２が貼り合わされる方向を以下「Ｚ方向」という。 The bonding device W is a thin plate-like structure in which components are integrally assembled, such as an FPD, a 3D (three-dimensional) display, an electronic book, or an organic EL display.
The first work W1 is made of, for example, a touch panel, a cover glass, a cover film, and the like, and is adhered so as to cover the second work W2 made of LCM, a flexible printed wiring board (FPC), etc. It constitutes.
Further, if necessary, a sealing material W3 is applied to one or both of the opposing surfaces of the first workpiece W1 and the second workpiece W2 using a quantitative discharge nozzle such as a dispenser.
As the sealing material W3, a light curable adhesive such as UV curable optical transparent resin (OCR), which is cured by absorbing light energy such as ultraviolet rays and is cured by polymerization, is used. It is suitable for a bonding device W that performs bonding without a cell gap limiting function such as a spacer.
Further, as another example, a sealing material W3 such as a thermosetting adhesive or a two-component mixed curing adhesive that is cured by polymerization by absorption of thermal energy is used, or the sealing material W3 is not interposed. It is also possible to bond or change the facing surfaces of the first workpiece W1 and the second workpiece W2.
1 to 6, the first work W1 and the second work W2 are usually arranged so as to face each other in the vertical direction, and the upper first work W1 and the lower second work W2 are arranged. The direction in which is attached is hereinafter referred to as the “Z direction”.

第一保持部材１は、例えば金属やセラミックスなどの剛体で歪み（撓み）変形しない厚さの平板状に形成された定盤などからなり、搬入された第一ワークＷ１とＺ方向へ対向して面状に接触する剛性当接面１１を有している。
剛性当接面１１は、第一保持部材１のワーク側端面（下面）に、平滑か又は略平滑に近い状態で一体形成され、第一ワークＷ１との帯電防止手段１２を有することが好ましい。
帯電防止手段１２とは、少なくとも後述する粘着ピン３に接している第一ワークＷ１を剥がす時に、静電気が発生して帯電（剥離帯電）しないようにするための部材である。
帯電防止手段１２の具体例として、図１及び図２と図５及び図６に示される場合には、第一保持部材１の剛性当接面１１と第一ワークＷ１の表面（上面）との間に複数の空間部１２ｓをＸＹ方向へ分散するように形成して、第一ワークＷ１の表面（上面）との接触面積が狭くなるように構成することが好ましい。
詳しく説明すると、第一保持部材１の剛性当接面１１においてその全体又は第一ワークＷ１と対向する部位に、エンボス加工や切削加工やそれに類似した加工を施すことで、複数の凸状部１２ａがＸＹ方向へ分散するように一体形成されている。複数の凸状部１２ａを第一ワークＷ１の表面に接触させることで、ＸＹ方向へ隣り合う凸状部１２ａの間に複数の空間部１２ｓがそれぞれ分散して配置されるように構成している。空間部１２ｓ及び凸状部１２ａのサイズは、第一保持部材１の剛性当接面１１を第一ワークＷ１の表面に接触させた際に、第一ワークＷ１が空間部１２ｓ及び凸状部１２ａの凹凸形状に沿って屈曲変形しないように、同形状の細かい凸状部１２ａを多数形成することが好ましい。
また、帯電防止手段１２の他の例として、複数（多数）の凸状部１２ａや空間部１２ｓに代えて、第一ワークＷ１の電荷が第一保持部材１へ流れるように構成することも可能である。またさらに、第一保持部材１の材料全体を帯電防止材料で構成したり、図１及び図２と図５及び図６に示される凸状部１２ａの表面に帯電防止コーティングを施したり、これらを組み合わせることも可能である。 The first holding member 1 is composed of, for example, a platen having a thickness that does not deform (bend) with a rigid body such as metal or ceramics, and is opposed to the loaded first workpiece W1 in the Z direction. It has a rigid contact surface 11 that contacts the surface.
The rigid contact surface 11 is preferably formed integrally with the workpiece-side end surface (lower surface) of the first holding member 1 in a smooth or substantially smooth state and has an antistatic means 12 with the first workpiece W1.
The antistatic means 12 is a member for preventing static charge from being generated (peeling off) when at least the first work W1 in contact with the adhesive pin 3 described later is peeled off.
As a specific example of the antistatic means 12, in the case shown in FIGS. 1, 2, 5, and 6, the rigid contact surface 11 of the first holding member 1 and the surface (upper surface) of the first workpiece W1 It is preferable that the plurality of space portions 12s be formed so as to be dispersed in the XY direction between them so that the contact area with the surface (upper surface) of the first workpiece W1 is narrowed.
More specifically, a plurality of convex portions 12a are formed by embossing, cutting, or processing similar to the whole or a portion of the rigid contact surface 11 of the first holding member 1 facing the first workpiece W1. Are integrally formed so as to be dispersed in the XY directions. By making the plurality of convex portions 12a contact the surface of the first workpiece W1, the plurality of space portions 12s are arranged in a distributed manner between the convex portions 12a adjacent to each other in the XY direction. . The size of the space portion 12s and the convex portion 12a is such that when the rigid contact surface 11 of the first holding member 1 is brought into contact with the surface of the first workpiece W1, the first workpiece W1 has the space portion 12s and the convex portion 12a. It is preferable to form a large number of fine convex portions 12a having the same shape so as not to bend and deform along the uneven shape.
As another example of the antistatic means 12, it is also possible to configure so that the charge of the first work W 1 flows to the first holding member 1 instead of the plurality of (many) convex portions 12 a and the space portions 12 s. It is. Furthermore, the entire material of the first holding member 1 is made of an antistatic material, or an antistatic coating is applied to the surface of the convex portion 12a shown in FIGS. 1, 2, 5, and 6. Combinations are also possible.

第二保持部材２は、例えば金属やセラミックスなどの剛体で歪み（撓み）変形しない厚さの平板状に形成された定盤などからなり、搬入された第二ワークＷ２とＺ方向へ対向して面状に接触する第二当接面２１を有している。
第二当接面２１の具体例としては、第二保持部材２のワーク側端面（上面）にシート状の弾性体２２が固着して設けられ、第二保持部材２のワーク側端面に対し弾性体２２を挟んで第二ワークＷ２の表面（下面）が接触するように構成することが好ましい。
弾性体２２の弾性変形可能な緩衝面には、第二帯電防止手段２３として弾性体２２の表面と第二ワークＷ２の表面との接触面積が狭くなるように、複数の空間部２３ｓと凸状部２３ａをＸＹ方向へ分散して形成することが好ましい。空間部２３ｓと凸状部２３ａのサイズは、弾性体２２の表面と第二ワークＷ２の表面を接触させた際に、第二ワークＷ２が空間部２３ｓ及び凸状部２３ａの凹凸形状に沿って屈曲変形しないように、同形状の細かい凸状部２３ａを多数形成することが好ましい。
また、第二当接面２１の他の例として図示しないが、シート状の弾性体２２を固着せず、第一保持部材１の剛性当接面１１と同様に、平滑か又は略平滑に近い状態で一体形成することも可能である。 The second holding member 2 is composed of, for example, a platen having a thickness that does not deform (bend) with a rigid body such as metal or ceramics, and is opposed to the loaded second workpiece W2 in the Z direction. It has the 2nd contact surface 21 which contacts planarly.
As a specific example of the second contact surface 21, a sheet-like elastic body 22 is fixedly provided on the work side end surface (upper surface) of the second holding member 2, and is elastic with respect to the work side end surface of the second holding member 2. It is preferable that the surface (lower surface) of the second workpiece W2 is in contact with the body 22 in between.
On the elastically deformable buffer surface of the elastic body 22, a plurality of space portions 23s and a convex shape are formed so that the contact area between the surface of the elastic body 22 and the surface of the second workpiece W2 as the second antistatic means 23 becomes narrow. It is preferable to form the portions 23a by dispersing them in the XY direction. The size of the space part 23s and the convex part 23a is such that when the surface of the elastic body 22 and the surface of the second work W2 are brought into contact, the second work W2 follows the uneven shape of the space part 23s and the convex part 23a. It is preferable to form a large number of fine convex portions 23a of the same shape so as not to bend and deform.
Although not shown as another example of the second contact surface 21, the sheet-like elastic body 22 is not fixed, and is smooth or nearly smooth like the rigid contact surface 11 of the first holding member 1. It is also possible to integrally form in a state.

さらに、第一保持部材１の剛性当接面１１及び第二保持部材２の第二当接面２１には、変圧室Ｂ内に搬入された第一ワークＷ１と第二ワークＷ２をそれぞれ着脱自在で且つ移動不能に保持するための手段がそれぞれ設けられている。
上方に配置される第一保持部材１の剛性当接面１１には、第一ワークＷ１を着脱自在で且つ移動不能に保持するための手段（粘着保持手段）として、粘着ピン３が第一保持部材１をＺ方向へ貫通して往復動自在に設置されている。さらに必要に応じて図示されるように、吸着保持手段６を設けることも可能である。
下方に配置される第二保持部材２の第二当接面２１には、第二ワークＷ２を着脱自在で且つ移動不能に保持するための保持手段として、図示されていないが、粘着保持手段又は吸着保持手段のいずれか一方か若しくは両方を設けている。 Further, the first work W1 and the second work W2 carried into the variable pressure chamber B can be detachably attached to the rigid contact surface 11 of the first holding member 1 and the second contact surface 21 of the second holding member 2, respectively. In addition, each means is provided for holding it immovable.
On the rigid contact surface 11 of the first holding member 1 disposed above, the adhesive pin 3 is first held as means (adhesive holding means) for holding the first workpiece W1 detachably and immovably. The member 1 is installed so as to freely reciprocate through the Z direction. Further, as shown in the figure, suction holding means 6 can be provided as necessary.
Although not shown as a holding means for holding the second workpiece W2 detachably and immovably on the second contact surface 21 of the second holding member 2 disposed below, an adhesive holding means or Either one or both of the suction holding means are provided.

粘着ピン３は、第一保持部材１に開穿された貫通孔１ａを通ってＺ方向へ往復動自在に設けられる昇降部３ａと、昇降部３ａの先端に第一ワークＷ１とＺ方向へ対向するように設けられる粘着部３ｂと、昇降部３ａの基端に設けられて後述する着脱用駆動部５と連係する従動部３ｃと、を有している。
粘着部３ｂは、その全体又は一部が例えばフッ素ゴムやエラストマー、ブチルゴム、感光性樹脂、アクリル系やシリコン系などの粘着材料でシート状に形成される粘着シートであり、弾性のある面状に形成された粘着面を有している。粘着部３ｂの粘着面は、例えばエンボス加工などで凹凸状に形成されて全体的に弾性変形し易くすることにより、第一ワークＷ１の表面に対して容易に粘り付くように構成することが好ましい。
粘着ピン３の具体例として、図１〜図６に示される例の場合には、プレート状に形成された一つの従動部３ｃに対し、複数組の昇降部３ａ及び粘着部３ｂがそれぞれＸＹ方向へ分散するように連結され、後述する着脱用駆動部５の作動でプレート状の従動部３ｃ及び複数の昇降部３ａを介して複数の粘着部３ｂの粘着面が、それぞれ同期して第一ワークＷ１の表面に向けて接近移動するように構成されている。昇降部３ａ及び粘着部３ｂの数は、第一ワークＷ１のサイズや第一ワークＷ１の厚さや第一ワークＷ１の材質などに対応して決められ、大型サイズの第一ワークＷ１を吊持するには、多数組の昇降部３ａ及び粘着部３ｂをそれぞれＸＹ方向へ所定間隔毎に配置する必要がある。 The adhesive pin 3 passes through a through-hole 1a opened in the first holding member 1 and is provided with an elevating part 3a that can be reciprocated in the Z direction, and is opposed to the first work W1 in the Z direction at the tip of the elevating part 3a. And a follower 3c provided at the base end of the elevating part 3a and linked to the attaching / detaching drive part 5 described later.
The adhesive part 3b is an adhesive sheet that is formed in a sheet shape with an adhesive material such as fluorine rubber, elastomer, butyl rubber, photosensitive resin, acrylic or silicon, for example, and has an elastic surface. It has a formed adhesive surface. The pressure-sensitive adhesive surface of the pressure-sensitive adhesive portion 3b is preferably configured so as to easily stick to the surface of the first workpiece W1, for example, by being formed into an uneven shape by embossing or the like and being easily elastically deformed as a whole. .
In the case of the example shown in FIGS. 1 to 6 as a specific example of the adhesive pin 3, a plurality of sets of lifting and lowering parts 3a and adhesive parts 3b are respectively provided in the XY direction with respect to one driven part 3c formed in a plate shape. The adhesive surfaces of the plurality of adhesive portions 3b are synchronized with each other via the plate-like driven portion 3c and the plurality of elevating portions 3a by the operation of the attaching / detaching drive portion 5 described later. It is comprised so that it may approach and move toward the surface of W1. The number of the raising / lowering part 3a and the adhesion part 3b is decided according to the size of the 1st workpiece | work W1, the thickness of the 1st workpiece | work W1, the material of the 1st workpiece | work W1, etc., and suspends the large sized 1st workpiece | work W1. In this case, it is necessary to arrange a large number of sets of elevating parts 3a and adhesive parts 3b at predetermined intervals in the XY direction.

そして、第一保持部材１又は第二保持部材２のいずれか一方か若しくは両方は、接離用駆動部４と連係して、相対的にＺ方向へ接近移動させるように構成されている。
接離用駆動部４は、Ｚ方向へ往復動可能なアクチュエーターなどで構成され、後述する制御部７により例えば図１（ａ）の実線に示されるように、搬送ロボットなどの受け渡し部材で変圧室Ｂ内に搬入された第一ワークＷ１及び第二ワークＷ２の受け渡し時において、第一保持部材１又は第二保持部材２のいずれか一方を他方からＺ方向へ相対的に離隔移動させるか、若しくは第一保持部材１及び第二保持部材２の両方を互いにＺ方向へ相対的に離隔移動させるように作動制御されている。
その後は、例えば図１（ａ）の二点鎖線及び図１（ｂ）の一点鎖線に示されるように、第一保持部材１側又は第二保持部材２側のいずれか一方を他方に向けてＺ方向へ接近移動させるか、若しくは第一保持部材１側及び第二保持部材２側の両方を互いにＺ方向へ接近移動させることにより、第一ワークＷ１と第二ワークＷ２がシール材Ｗ３を挟んでＺ方向へ重ね合わされ、必要がある場合には更に加圧して貼り合わせるように作動制御されている。
詳しく説明すると、第一保持部材１又は粘着ピン３のいずれか一方か若しくは両方を第二保持部材２に対し相対的にＺ方向へ接近移動させることで、第一ワークＷ１と第二ワークＷ２がシール材Ｗ３を挟んでＺ方向へ重ね合わされ、更に面状加圧して貼り合わせるように作動制御されている。
第一ワークＷ１及び第二ワークＷ２の貼り合わせ後には、例えば図１（ｂ）の実線に示されるように、第一保持部材１を剛性当接面１１（帯電防止手段１２）が第一ワークＷ１の表面に面接触した状態を一時的に保つように作動制御されている。
さらに、粘着ピン３が第一ワークＷ１から離隔する方向へ移動した後には、例えば図１（ｂ）の二点鎖線に示されるように、剛性当接面１１（帯電防止手段１２）を第一ワークＷ１の表面から離隔する方向へ移動させるように作動制御することが好ましい。 Then, either one or both of the first holding member 1 and the second holding member 2 are configured so as to move relatively in the Z direction in cooperation with the contact / separation driving unit 4.
The contact / separation drive unit 4 is configured by an actuator or the like that can reciprocate in the Z direction. As shown by a solid line in FIG. At the time of delivery of the first workpiece W1 and the second workpiece W2 carried into B, either one of the first holding member 1 or the second holding member 2 is relatively moved away from the other in the Z direction, or The operation is controlled so that both the first holding member 1 and the second holding member 2 are moved relatively apart from each other in the Z direction.
Thereafter, for example, as indicated by the two-dot chain line in FIG. 1A and the one-dot chain line in FIG. 1B, either the first holding member 1 side or the second holding member 2 side is directed toward the other. The first workpiece W1 and the second workpiece W2 sandwich the sealing material W3 by moving in the Z direction or by moving both the first holding member 1 side and the second holding member 2 side in the Z direction. The operation is controlled so that they are laminated in the Z direction and, if necessary, further pressed and bonded.
More specifically, by moving one or both of the first holding member 1 and the adhesive pin 3 closer to the second holding member 2 in the Z direction, the first work W1 and the second work W2 are moved. The operation is controlled so that they are superimposed in the Z direction with the sealing material W3 interposed therebetween, and are further pressed and bonded in a sheet form.
After the first workpiece W1 and the second workpiece W2 are bonded together, for example, as shown by the solid line in FIG. 1B, the first holding member 1 is attached to the rigid contact surface 11 (antistatic means 12). The operation is controlled so as to temporarily maintain the surface contact with the surface of W1.
Furthermore, after the adhesive pin 3 has moved in the direction away from the first workpiece W1, the rigid contact surface 11 (antistatic means 12) is moved to the first position as shown by the two-dot chain line in FIG. It is preferable to control the operation so as to move in a direction away from the surface of the workpiece W1.

接離用駆動部４の具体例として、図１〜図６に示される例の場合には、第一保持部材１のみを接離用駆動部４と連係させて、第一保持部材１側を第二保持部材２側に向けてＺ方向へ相対的に接近移動させている。
また、その他の例として図示しないが、第二保持部材２のみを接離用駆動部４と連係させて、第二保持部材２側を第一保持部材１側に向けＺ方向へ相対的に接近移動したり、第一保持部材１及び第二保持部材２をそれぞれ接離用駆動部４と連係させて、第一保持部材１側と第二保持部材２側を同時にＺ方向へ相対的に接近移動したり変更することも可能である。 As a specific example of the contact / separation drive unit 4, in the example shown in FIGS. 1 to 6, only the first holding member 1 is linked to the contact / separation drive unit 4, and the first holding member 1 side is moved. It is relatively moved in the Z direction toward the second holding member 2 side.
Although not shown as another example, only the second holding member 2 is linked to the contact / separation driving unit 4 so that the second holding member 2 side is relatively close to the first holding member 1 side in the Z direction. The first holding member 1 and the second holding member 2 are respectively linked to the contact / separation driving unit 4 so that the first holding member 1 side and the second holding member 2 side simultaneously approach each other in the Z direction. It can also be moved and changed.

着脱用駆動部５は、Ｚ方向へ往復動可能なアクチュエーターなどで構成され、後述する制御部７により例えば図１（ａ）の実線に示されるように、変圧室Ｂ内に搬入された第一ワークＷ１の表面に、粘着ピン３の粘着部３ｂを接触させて粘着保持するように作動制御されている。
その後は、例えば図１（ａ）の二点鎖線及び図１（ｂ）の一点鎖線に示されるように、粘着ピン３の全体を第二保持部材２と相対的にＺ方向へ相対的に接近移動させて、第一ワークＷ１と第二ワークＷ２がシール材Ｗ３を挟んでＺ方向へ重ね合わされ、必要がある場合には更に加圧して貼り合わせるように作動制御することが好ましい。
また第一ワークＷ１及び第二ワークＷ２の貼り合わせ後には、例えば図１（ｂ）の実線に示されるように、第一保持部材１の剛性当接面１１（帯電防止手段１２）が第一ワークＷ１の表面に面接触した状態で、粘着ピン３の粘着部３ｂを第一ワークＷ１の表面からＺ方向へ離隔させるように作動制御している。 The detachable drive unit 5 is composed of an actuator that can reciprocate in the Z direction, and the first unit carried into the variable pressure chamber B by the control unit 7 described later, for example, as shown by the solid line in FIG. The operation is controlled so that the adhesive portion 3b of the adhesive pin 3 is brought into contact with the surface of the workpiece W1 to be adhesively held.
After that, for example, as indicated by the two-dot chain line in FIG. 1A and the one-dot chain line in FIG. 1B, the entire adhesive pin 3 is relatively close to the second holding member 2 in the Z direction. It is preferable to control the operation so that the first workpiece W1 and the second workpiece W2 are moved and overlapped in the Z direction with the sealant W3 interposed therebetween.
Further, after the first workpiece W1 and the second workpiece W2 are bonded, the rigid contact surface 11 (antistatic means 12) of the first holding member 1 is the first as shown by the solid line in FIG. The operation is controlled such that the adhesive portion 3b of the adhesive pin 3 is separated from the surface of the first workpiece W1 in the Z direction in a state of surface contact with the surface of the workpiece W1.

吸着保持手段６は、第一ワークＷ１の表面と対向するように設けられる通気口６ａと、通気口６ａに連通するように接続される通気路６ｂと、通気路６ｂに接続される吸排気源６ｃと、を有する吸引チャックである。
吸排気源６ｃは、ポンプや圧縮機などで構成され、後述する制御部７により第一ワークＷ１及び第二ワークＷ２の受け渡し後又は受け渡し時において、通気路６ｂを介して通気口６ａから吸引するように作動制御されている。また第一ワークＷ１及び第二ワークＷ２の貼り合わせ後には、第一保持部材１の剛性当接面１１（帯電防止手段１２）が第一ワークＷ１の表面に面接触した状態で、通気路６ｂを介して通気口６ａから圧縮空気などの流体を第一ワークＷ１の表面に向けて噴出することも可能である。 The suction holding means 6 includes a vent 6a provided so as to face the surface of the first workpiece W1, a vent 6b connected to communicate with the vent 6a, and an intake / exhaust source connected to the vent 6b. 6c.
The intake / exhaust source 6c is composed of a pump, a compressor, and the like, and sucks from the vent 6a via the vent passage 6b after or at the time of delivery of the first workpiece W1 and the second workpiece W2 by the control unit 7 described later. The operation is controlled as follows. Further, after the first work W1 and the second work W2 are bonded together, the air passage 6b is in a state where the rigid contact surface 11 (antistatic means 12) of the first holding member 1 is in surface contact with the surface of the first work W1. It is also possible to eject a fluid such as compressed air from the vent 6a toward the surface of the first workpiece W1 through the air hole 6a.

制御部７は、接離用駆動部４，着脱用駆動部５及び吸着保持手段６とそれぞれ電気的に接続するだけでなく、変圧室Ｂの内外に第一ワークＷ１及び第二ワークＷ２を出し入れするための開閉手段や、変圧室Ｂ内を大気雰囲気ＡＰから所定真空度の減圧雰囲気ＤＰに調整する室圧調整手段（図示しない）などにも電気的に接続するコントローラーである。
制御部７となるコントローラーは、その制御回路（図示しない）に予め設定されたプログラムに従って、予め設定されたタイミングで順次それぞれ作動制御している。
詳しく説明すると、制御部７は、例えば図１（ａ）の実線に示されるように、大気雰囲気ＡＰの変圧室Ｂ内に搬入された第一ワークＷ１を、粘着ピン３や吸着保持手段６により第一保持部材１の剛性当接面１１に受け取り、第二ワークＷ２を保持手段（図示しない）により第二保持部材２の第二当接面２１に受け取るように作動制御している。
その後に、変圧室Ｂ内が減圧雰囲気ＤＰに切り替わった後は、例えば図１（ａ）の二点鎖線及び図１（ｂ）の一点鎖線に示されるように、接離用駆動部４や着脱用駆動部５により、第一保持部材１又は粘着ピン３のいずれか一方か若しくは両方を第二保持部材２に対し相対的にＺ方向へ接近移動させることで、第一ワークＷ１と第二ワークＷ２がシール材Ｗ３を挟んでＺ方向へ重ね合わされ、これらを貼り合わせるように作動制御している。
この貼り合わせ時には、第一ワークＷ１と第二ワークＷ２を相対的にＺ方向へ更に面状加圧することが好ましい。また、面状加圧に代えて上側の第一ワークＷ１を下側の第二ワークＷ２に向け落下させて貼り合わせることも可能である。
なお、第一ワークＷ１及び第二ワークＷ２の貼り合わせ直前において、第一保持部材１又は第二保持部材２のいずれか一方を他方に対してＸＹθ方向に調整移動することで、第一ワークＷ１と第二ワークＷ２の位置合わせ（アライメント）を行うことが好ましい。
さらに、第一ワークＷ１及び第二ワークＷ２の貼り合わせ後は、例えば図１（ｂ）の実線に示されるように、接離用駆動部４により第一保持部材１の剛性当接面１１（帯電防止手段１２）が第一ワークＷ１の表面に対し面接触する状態を保持し、着脱用駆動部５により粘着ピン３の粘着部３ｂを第一ワークＷ１から離隔する方向へ移動させるように作動制御している。 The control unit 7 not only electrically connects the contact / separation drive unit 4, the attachment / detachment drive unit 5, and the suction holding means 6, but also puts the first work W 1 and the second work W 2 in and out of the variable pressure chamber B. The controller is also electrically connected to opening / closing means for controlling the pressure, and chamber pressure adjusting means (not shown) for adjusting the inside of the variable pressure chamber B from the atmospheric atmosphere AP to the reduced pressure atmosphere DP having a predetermined vacuum degree.
The controller serving as the controller 7 sequentially controls the operation at a preset timing in accordance with a preset program in its control circuit (not shown).
Explaining in detail, for example, as shown by the solid line in FIG. 1A, the control unit 7 causes the first work W 1 carried into the variable pressure chamber B of the atmospheric atmosphere AP to be adhered by the adhesive pins 3 and the suction holding means 6. Operation is controlled so that the second workpiece W2 is received on the second contact surface 21 of the second holding member 2 by a holding means (not shown).
After that, after the inside of the variable pressure chamber B is switched to the reduced pressure atmosphere DP, for example, as shown by a two-dot chain line in FIG. 1A and a one-dot chain line in FIG. The drive unit 5 moves either the first holding member 1 or the adhesive pin 3 or both closer to the second holding member 2 in the Z direction so that the first workpiece W1 and the second workpiece are moved. W2 is overlapped in the Z direction with the sealing material W3 interposed therebetween, and the operation is controlled so that these are bonded together.
At the time of bonding, it is preferable to further pressurize the first workpiece W1 and the second workpiece W2 relatively in the Z direction. Moreover, it is also possible to drop the upper first work W1 toward the lower second work W2 in place of the planar pressurization and bond them together.
In addition, immediately before bonding the first workpiece W1 and the second workpiece W2, either the first holding member 1 or the second holding member 2 is adjusted and moved in the XYθ direction with respect to the other, thereby the first workpiece W1. The second workpiece W2 is preferably aligned (aligned).
Further, after the first workpiece W1 and the second workpiece W2 are bonded, for example, as shown by the solid line in FIG. 1B, the rigid contact surface 11 ( The antistatic means 12) keeps the surface contact with the surface of the first workpiece W1, and operates to move the adhesive portion 3b of the adhesive pin 3 away from the first workpiece W1 by the attaching / detaching drive portion 5. I have control.

このような本発明の実施形態に係るワーク貼り合わせ装置Ａによると、変圧室Ｂに搬入された第一ワークＷ１を粘着ピン３の粘着部３ｂで粘着保持して受け取る。その後、制御部７で接離用駆動部４及び着脱用駆動部５が作動制御され、減圧雰囲気ＤＰ（減圧された変圧室Ｂ内）において、第一保持部材１又は粘着ピン３のいずれか一方か若しくは両方を第二保持部材２に対し相対的に接近移動させる。これにより、第一ワークＷ１と第二ワークＷ２が重ね合わされ、必要がある場合には更に面状加圧して貼り合わされる。
この貼り合わせ後は、第一保持部材１の剛性当接面１１が第一ワークＷ１に面接触した状態で、粘着ピン３を第一ワークＷ１から離隔する方向へ移動させる。これにより、粘着ピン３の引き剥がしに伴い第一ワークＷ１における粘着ピン３で粘着保持された部位の周辺部分が、剛性当接面１１と面接触して剛性当接面１１に沿うように形状保持される。
したがって、第一保持部材１による第一ワークＷ１の加圧時及び第一ワークＷ１からの粘着ピン３の引き剥がし時において第一ワークＷ１の変形を最小限に抑えることができる。
その結果、第一ワークＷ１として薄肉化された基板やフィルムなどの剛性が低いものを用いても、第一保持部材１による第一ワークＷ１の加圧時及び第一ワークＷ１からの粘着ピン３の引き剥がし時において第一ワークＷ１に部分的な歪みが発生しないため、貼り合わせた第一ワークＷ１と第二ワークＷ２が平行に保たれてギャップ不良の発生を防止できるとともに、貼り合わせた第一ワークＷ１と第二ワークＷ２が部分的に位置ズレしないため、アライメント不良の発生を防止できる。
それにより、減圧雰囲気ＤＰ（真空中）において第一ワークＷ１及び第二ワークＷ２の間に、スペーサーなどのセルギャップ制限機能が無いＯＣＲやＯＬＥＤなどを挟んで貼り合わせる際に、部分的な加圧ではなく略面全体で加圧できるとともに、第一ワークＷ１との剥離時に第一保持部材１の剛性当接面１１から粘着ピン３を相対的に引き剥がすことができるので有効である。 According to such a workpiece bonding apparatus A according to the embodiment of the present invention, the first workpiece W1 carried into the variable pressure chamber B is adhesively held by the adhesive portion 3b of the adhesive pin 3 and received. Thereafter, the control unit 7 controls the operation of the contact / separation drive unit 4 and the attachment / detachment drive unit 5, and either the first holding member 1 or the adhesive pin 3 in the reduced pressure atmosphere DP (in the reduced pressure chamber B). Or both are moved relatively close to the second holding member 2. Thereby, the 1st work W1 and the 2nd work W2 are piled up, and when necessary, it is further stuck and applied by surface pressure.
After the bonding, the adhesive pin 3 is moved in a direction away from the first work W1 in a state where the rigid contact surface 11 of the first holding member 1 is in surface contact with the first work W1. As a result, when the adhesive pin 3 is peeled off, the peripheral portion of the portion of the first workpiece W1 that is adhesively held by the adhesive pin 3 is in surface contact with the rigid contact surface 11 and along the rigid contact surface 11 Retained.
Therefore, deformation of the first work W1 can be minimized when the first work W1 is pressed by the first holding member 1 and when the adhesive pin 3 is peeled off from the first work W1.
As a result, even if a thin substrate or film having a low thickness is used as the first work W1, the pressure pin 3 from the first work W1 and when the first work W1 is pressed by the first holding member 1 are used. Since the first work W1 is not partially distorted at the time of peeling, the bonded first work W1 and the second work W2 can be kept in parallel to prevent the occurrence of a gap defect and the bonded first work W1. Since the first workpiece W1 and the second workpiece W2 are not partially displaced, it is possible to prevent the occurrence of alignment failure.
As a result, partial pressure is applied when an OCR or OLED having no cell gap limiting function such as a spacer is sandwiched between the first workpiece W1 and the second workpiece W2 in a reduced pressure atmosphere DP (in a vacuum). This is effective because the pressure can be applied over substantially the entire surface, and the adhesive pin 3 can be relatively peeled from the rigid contact surface 11 of the first holding member 1 at the time of separation from the first workpiece W1.

特に、第一保持部材１の剛性当接面１１は、第一ワークＷ１との帯電防止手段１２を有し、制御部７は、粘着ピン３が第一ワークＷ１から離隔する方向へ移動した後に、帯電防止手段１２を第一ワークＷ１から離隔する方向へ移動させる場合には、第一ワークＷ１と剛性当接面１１の剥離による静電気の発生が帯電防止手段１２で抑制される。
したがって、第一ワークＷ１と剛性当接面１１の剥離時における帯電の発生を防止することができる。
その結果、弾性体プレートと粘着ピンの粘着シートが接していた上基板の離脱時に大きな静電気が発生して帯電する従来のものに比べ、減圧された絶乾状態で且つイオナイザーなどによる除電が困難な密閉空間（変圧室Ｂ）内において、アーク放電によるデバイスの破壊や回路の断線だけでなく、静電気によるその特性変化を防止できる。
In particular, the rigid contact surface 11 of the first holding member 1 has the antistatic means 12 with the first work W1, and the control unit 7 moves after the adhesive pin 3 moves away from the first work W1. When the antistatic means 12 is moved away from the first work W1, the generation of static electricity due to the separation of the first work W1 and the rigid contact surface 11 is suppressed by the antistatic means 12 .
Therefore, it is possible to prevent the occurrence of charging when the first workpiece W1 and the rigid contact surface 11 are separated.
As a result, it is difficult to remove static electricity with an ionizer or the like in a completely dry state under reduced pressure as compared with the conventional one in which the elastic plate and the adhesive sheet of the adhesive pin are in contact with each other and large static electricity is generated when the substrate is detached. In the sealed space (transformer room B), not only destruction of the device due to arc discharge and disconnection of the circuit, but also its characteristic change due to static electricity can be prevented.

さらに、帯電防止手段１２として、第一保持部材１の剛性当接面１１と第一ワークＷ１との接触面積が狭くなるように複数の空間部１２ｓを剛性当接面１１に分散して形成する場合には、第一ワークＷ１の表面に剛性当接面１１を接触させても、これら両者間に複数の空間部１２ｓが分散して、第一ワークＷ１と剛性当接面１１の接触面積が狭いため、第一ワークＷ１と剛性当接面１１の剥離に伴う静電気がほとんど発生しない。
したがって、簡単な構造で剥離帯電の発生を確実に防止することができる。
その結果、低コストでありながら、アーク放電によるデバイスの破壊や回路の断線と、静電気によるその特性変化を完全に防止できる。 Further, as the antistatic means 12, a plurality of space portions 12s are formed dispersed on the rigid contact surface 11 so that the contact area between the rigid contact surface 11 of the first holding member 1 and the first workpiece W1 is reduced. In this case, even if the rigid contact surface 11 is brought into contact with the surface of the first workpiece W1, a plurality of space portions 12s are dispersed between them, and the contact area between the first workpiece W1 and the rigid contact surface 11 is increased. Since it is narrow, static electricity accompanying peeling of the first workpiece W1 and the rigid contact surface 11 hardly occurs.
Therefore, it is possible to reliably prevent the occurrence of peeling electrification with a simple structure.
As a result, it is possible to completely prevent device destruction and circuit disconnection due to arc discharge and changes in its characteristics due to static electricity while being low in cost.

また、第二保持部材２に対し弾性体２２を挟んで第二ワークＷ２が接触するように構成した場合には、第一保持部材１及び第二保持部材２による第一ワークＷ１と第二ワークＷ２の加圧に伴って弾性体２２が弾性変形し、第一ワークＷ１及び第二ワークＷ２の全面が均等に加圧される。
したがって、第一ワークＷ１からの粘着ピン３の引き剥がし時における第一ワークＷ１に部分的な歪みの防止と、第一保持部材１及び第二保持部材２による第一ワークＷ１と第二ワークＷ２の加圧ムラの防止を共に達成することができる。
その結果、貼合デバイスＷの貼り合わせ精度の更なる向上が図れる。 When the second work W2 is configured to contact the second holding member 2 with the elastic body 22 interposed therebetween, the first work W1 and the second work by the first holding member 1 and the second holding member 2 are used. The elastic body 22 is elastically deformed with the pressurization of W2, and the entire surfaces of the first work W1 and the second work W2 are evenly pressurized.
Accordingly, the first work W1 is prevented from being partially distorted when the adhesive pin 3 is peeled off from the first work W1, and the first work W1 and the second work W2 by the first holding member 1 and the second holding member 2 are used. The prevention of pressure unevenness can be achieved together.
As a result, the further improvement of the bonding accuracy of the bonding device W can be achieved.

次に、本発明の各実施例を図面に基づいて説明する。
この実施例１は、図１（ａ）（ｂ）〜図４（ａ）（ｂ）に示すように、第一保持部材１に吸着保持手段６を設けたものである。
詳しく説明すると、吸着保持手段６を構成する通気路６ｂの一部として第一保持部材１に通孔６ｂ１が開設され、通孔６ｂ１の先端となる剛性当接面１１に通気口６ａを開口させている。 Next, each embodiment of the present invention will be described with reference to the drawings.
In the first embodiment, as shown in FIGS. 1A and 1B to FIGS. 4A and 4B, the first holding member 1 is provided with suction holding means 6.
More specifically, a through hole 6b1 is formed in the first holding member 1 as a part of the ventilation path 6b constituting the suction holding means 6, and the ventilation hole 6a is opened in the rigid contact surface 11 which is the tip of the through hole 6b1. ing.

実施例１の制御部７は、図２（ａ）に示されるように、第一ワークＷ１が搬入された後の状態で、接離用駆動部４により第一保持部材１を、剛性当接面１１が第一ワークＷ１の表面に向け接近移動させるように作動制御している。第一保持部材１の剛性当接面１１が第一ワークＷ１の表面に接触する頃より、吸着保持手段６が通孔６ｂ１の通気口６ａから吸引することで、第一ワークＷ１の表面を剛性当接面１１に沿って吸引保持する。また粘着ピン３は、粘着部３ｂが第一ワークＷ１の表面から離れた位置で待機している。
その後、図２（ｂ）に示されるように、着脱用駆動部５により粘着ピン３の粘着部３ｂを第一ワークＷ１の表面に向けて移動させて粘着保持し、吸着保持手段６による第一ワークＷ１の吸着保持から粘着ピン３による第一ワークＷ１の粘着保持に切り替わるように作動制御している。それ以降は通気口６ａからの吸引を停止して吸着保持が解除されるように作動制御することも可能である。
また、図２（ｃ）に示される例のように、吸着保持手段６による第一ワークＷ１の吸着保持から粘着ピン３による第一ワークＷ１の粘着保持に切り換えた直後に、第一ワークＷ１と第一保持部材１の剛性当接面１１（帯電防止手段１２）の間に隙間が空くように接近移動させた状態で、複数の粘着ピン３により第一ワークＷ１と第二ワークＷ２がシール材Ｗ３を挟んでＺ方向へ重なり合い、好ましくは更に加圧して、第一ワークＷ１と第二ワークＷ２が貼り合わされるように作動制御することも可能である。
第一ワークＷ１及び第二ワークＷ２の貼り合わせ後は、図２（ｄ）に示されるように、粘着ピン３の粘着部３ｂが第一ワークＷ１の表面から引き剥がされた直後に、吸着保持手段６が通孔６ｂ１の通気口６ａから圧縮空気などの流体を第一ワークＷ１の表面に向け噴出させるように作動制御することも可能である。
これと略同時に、図２（ｄ）の二点鎖線に示されるように、第一保持部材１の剛性当接面１１（帯電防止手段１２）を第一ワークＷ１から離隔する方向へ移動させ、上述したワーク搬入後の状態に戻るように作動制御している。 As shown in FIG. 2A, the control unit 7 according to the first embodiment causes the first holding member 1 to be in rigid contact with the contact / separation driving unit 4 in a state after the first work W1 is loaded. The operation is controlled so that the surface 11 moves closer to the surface of the first workpiece W1. From the time when the rigid contact surface 11 of the first holding member 1 comes into contact with the surface of the first work W1, the suction holding means 6 sucks the air through the vent 6a of the through hole 6b1, thereby making the surface of the first work W1 rigid. It sucks and holds along the contact surface 11. The adhesive pin 3 stands by at a position where the adhesive portion 3b is separated from the surface of the first workpiece W1.
Thereafter, as shown in FIG. 2B, the attaching / detaching drive unit 5 moves the adhesive part 3 b of the adhesive pin 3 toward the surface of the first work W 1 to adhere and hold it. The operation is controlled so that the suction holding of the workpiece W1 is switched to the adhesion holding of the first workpiece W1 by the adhesive pin 3. After that, it is possible to control the operation so that the suction from the vent 6a is stopped and the suction holding is released.
Further, as in the example shown in FIG. 2C, immediately after switching from the suction holding of the first workpiece W1 by the suction holding means 6 to the adhesion holding of the first workpiece W1 by the adhesive pin 3, the first workpiece W1 and The first workpiece W1 and the second workpiece W2 are sealed by the plurality of adhesive pins 3 in a state in which the first holding member 1 is moved so as to leave a gap between the rigid contact surfaces 11 (antistatic means 12) of the first holding member 1. It is also possible to control the operation so that the first workpiece W1 and the second workpiece W2 are bonded together by overlapping in the Z direction with W3 interposed therebetween, preferably further pressing.
After bonding the first workpiece W1 and the second workpiece W2, as shown in FIG. 2 (d), immediately after the adhesive portion 3b of the adhesive pin 3 is peeled off from the surface of the first workpiece W1, it is sucked and held. It is also possible to control the operation of the means 6 so that a fluid such as compressed air is ejected from the vent 6a of the through hole 6b1 toward the surface of the first workpiece W1.
At substantially the same time, as shown by the two-dot chain line in FIG. 2D, the rigid contact surface 11 (antistatic means 12) of the first holding member 1 is moved away from the first workpiece W1, The operation is controlled so as to return to the state after the workpiece is loaded.

このような本発明の実施例１に係るワーク貼り合わせ装置Ａによると、吸着保持手段６により第一保持部材１の剛性当接面１１（帯電防止手段１２）に第一ワークＷ１を吸着保持してから、粘着ピン３の粘着部３ｂを第一ワークＷ１の表面に接触させて粘着するため、第一ワークＷ１を確実に受け取れる。
したがって、第一ワークＷ１の落下などの事故を防止できるという利点がある。 According to the work laminating apparatus A according to the first embodiment of the present invention, the first work W1 is sucked and held on the rigid contact surface 11 (antistatic means 12) of the first holding member 1 by the suction holding means 6. After that, since the adhesive portion 3b of the adhesive pin 3 is brought into contact with the surface of the first workpiece W1 and is adhered, the first workpiece W1 can be reliably received.
Therefore, there is an advantage that accidents such as dropping of the first workpiece W1 can be prevented.

また、図３（ａ）（ｂ）に示される例と、図４（ａ）（ｂ）に示される例は、帯電防止手段１２の変形例である。
図３（ａ）（ｂ）に示される例の場合には、剛性当接面１１に帯電防止手段１２として第一ワークＷ１と部分接触するように導電層１２ｂを部分的に形成している。
詳しく説明すると、第一保持部材１の剛性当接面１１においてその全体又は第一ワークＷ１と対向する部位に、導電材料を固着（接着）するか又は塗布して積層するなどして部分的にコーティングすることにより、剛性当接面１１の表面抵抗値が部分的に約１０⁷ Ω／ｃｍ未満（好ましくは約１０⁶ Ω／ｃｍ以下）になるように構成されている。導電材料としては、帯電防止テープ、フッ素樹脂、セラミックス、カーボンナノチューブ（ＣＮＴ）などの炭素材料、その他の導電性の帯電防止材料や導電性の静電気除去材料が挙げられる。部分的な導電層１２ｂのサイズは、部分的な導電層１２ｂを第一ワークＷ１の表面に接触させた際に、第一ワークＷ１が部分的な導電層１２ｂ及び凸状部１２ａの凹凸形状に沿って屈曲変形しないように、同形状の細かい導電層１２ｂを多数形成することが好ましい。
図４（ａ）（ｂ）に示される帯電防止手段１２の場合には、剛性当接面１１に帯電防止手段１２として第一ワークＷ１と面接触するように導電層１２ｃを全面的に形成している。
詳しく説明すると、第一保持部材１の剛性当接面１１においてその全体又は第一ワークＷ１と対向する部位に、導電材料を固着（接着）するか又は塗布して積層するなどして全体的にコーティングすることにより、剛性当接面１１の表面抵抗値が全体的に約１０⁷ Ω／ｃｍ未満（好ましくは約１０⁶ Ω／ｃｍ以下）になるように構成されている。 Further, the example shown in FIGS. 3A and 3B and the example shown in FIGS. 4A and 4B are modified examples of the antistatic means 12.
In the example shown in FIGS. 3A and 3B, the conductive layer 12b is partially formed on the rigid contact surface 11 so as to partially contact the first work W1 as the antistatic means 12.
More specifically, the conductive material is fixed (adhered) or applied and laminated on the whole of the rigid contact surface 11 of the first holding member 1 or on the portion facing the first work W1. By coating, the surface resistance value of the rigid contact surface 11 is partially less than about 10 ⁷ Ω / cm (preferably about 10 ⁶ Ω / cm or less). Examples of the conductive material include antistatic tape, fluororesin, ceramics, carbon materials such as carbon nanotubes (CNT), other conductive antistatic materials, and conductive static electricity removing materials. The size of the partial conductive layer 12b is such that when the partial conductive layer 12b is brought into contact with the surface of the first workpiece W1, the first workpiece W1 has a concavo-convex shape of the partial conductive layer 12b and the convex portion 12a. It is preferable to form a large number of fine conductive layers 12b having the same shape so as not to be bent and deformed along.
In the case of the antistatic means 12 shown in FIGS. 4 (a) and 4 (b), a conductive layer 12c is entirely formed on the rigid contact surface 11 so as to be in surface contact with the first workpiece W1 as the antistatic means 12. ing.
More specifically, the entire surface of the rigid contact surface 11 of the first holding member 1 or the portion facing the first work W1 is fixed (adhered) or coated and laminated on the entire surface. By coating, the surface resistance value of the rigid contact surface 11 is generally less than about 10 ⁷ Ω / cm (preferably about 10 ⁶ Ω / cm or less).

図３（ａ）（ｂ）及び図４（ａ）（ｂ）に示されるワーク貼り合わせ装置Ａによると、第一ワークＷ１の表面に剛性当接面１１の導電層１２ｃを接触させて、それらを剥離する際に静電気が発生しても、第一ワークＷ１の電荷が導電層１２ｃを通って剛性当接面１１へ流れ放出される。
したがって、簡単な構造で剥離帯電の発生を確実に防止することができる。
その結果、低コストでありながら、アーク放電によるデバイスの破壊や回路の断線と、静電気によるその特性変化を完全に防止できるという利点がある。 According to the workpiece laminating apparatus A shown in FIGS. 3A, 3B and 4A, 4B, the conductive layer 12c of the rigid contact surface 11 is brought into contact with the surface of the first workpiece W1, and they are Even if static electricity is generated when peeling off, the charge of the first workpiece W1 flows through the conductive layer 12c to the rigid contact surface 11 and is released.
Therefore, it is possible to reliably prevent the occurrence of peeling electrification with a simple structure.
As a result, there is an advantage that it is possible to completely prevent device destruction and circuit disconnection due to arc discharge and its characteristic change due to static electricity while being low in cost.

この実施例２は、図５（ａ）（ｂ）及び図６（ａ）〜（ｄ）に示すように、粘着ピン３に吸着保持手段６を設けた構成が、図１〜図４に示した実施例１とは異なり、それ以外の構成は図１〜図４に示した実施例１と同じものである。
詳しく説明すると、吸着保持手段６を構成する通気路６ｂの一部として粘着ピン３に通気孔６ｂ２が開設され、通気孔６ｂ２の先端となる粘着部３ｂに通気口６ａを開口させている。 As shown in FIGS. 5 (a) and 5 (b) and FIGS. 6 (a) to 6 (d), the second embodiment has a configuration in which the suction holding means 6 is provided on the adhesive pin 3 as shown in FIGS. Unlike the first embodiment, the other configuration is the same as that of the first embodiment shown in FIGS.
More specifically, a vent hole 6b2 is opened in the adhesive pin 3 as a part of the vent path 6b constituting the suction holding means 6, and the vent hole 6a is opened in the adhesive portion 3b which is the tip of the vent hole 6b2.

実施例２の制御部７は、図６（ａ）に示されるように、第一ワークＷ１が搬入された後の状態で、着脱用駆動部５により粘着ピン３を、粘着部３ｂが第一ワークＷ１の表面に向け接近移動させて粘着保持するように作動制御している。また、第一保持部材１は、剛性当接面１１が第一ワークＷ１の表面から離れた位置で待機している。
この頃より、図６（ｂ）に示されるように、吸着保持手段６が通気孔６ｂ２の通気口６ａから吸引することで、第一ワークＷ１の表面を粘着ピン３の粘着部３ｂに対し確実に吸引保持するように作動制御されている。
また、図６（ｃ）に示される例のように、第一ワークＷ１と第一保持部材１の剛性当接面１１（帯電防止手段１２）の間に隙間が空くように接近移動させた状態で、複数の粘着ピン３により第一ワークＷ１と第二ワークＷ２がシール材Ｗ３を挟んでＺ方向へ重なり合い、好ましくは更に加圧して、第一ワークＷ１と第二ワークＷ２が貼り合わされるように作動制御することも可能である。
第一ワークＷ１及び第二ワークＷ２の貼り合わせ後は、図６（ｄ）に示されるように、吸着保持手段６が通気孔６ｂ２の通気口６ａから圧縮空気などの流体を第一ワークＷ１の表面に向け噴出すると同時に、粘着ピン３の粘着部３ｂが第一ワークＷ１の表面から引き剥がされるように作動制御することも可能である。
その直後に、図６（ｄ）の二点鎖線に示されるように、第一保持部材１の剛性当接面１１（帯電防止手段１２）を第一ワークＷ１から離隔する方向へ移動させ、上述したワーク搬入後の状態に戻るように作動制御している。 As shown in FIG. 6A, the control unit 7 according to the second embodiment is configured so that the adhesive pin 3 is attached by the attaching / detaching drive unit 5 and the adhesive portion 3b is the first after the first work W1 is loaded. The operation is controlled so as to move closer to the surface of the workpiece W1 and hold the adhesive. Further, the first holding member 1 stands by at a position where the rigid contact surface 11 is separated from the surface of the first workpiece W1.
From this time, as shown in FIG. 6 (b), the suction holding means 6 sucks from the vent 6a of the vent hole 6b2, so that the surface of the first work W1 is surely attached to the adhesive portion 3b of the adhesive pin 3. The operation is controlled so as to hold the suction.
In addition, as in the example shown in FIG. 6C, a state in which the first workpiece W1 and the rigid contact surface 11 (antistatic means 12) of the first holding member 1 are moved close to each other so that a gap is left therebetween. Thus, the first workpiece W1 and the second workpiece W2 are overlapped in the Z direction with the plurality of adhesive pins 3 sandwiching the sealing material W3, preferably further pressurized so that the first workpiece W1 and the second workpiece W2 are bonded together. It is also possible to control the operation.
After bonding the first workpiece W1 and the second workpiece W2, as shown in FIG. 6 (d), the suction holding means 6 applies fluid such as compressed air from the vent 6a of the vent 6b2 to the first workpiece W1. It is also possible to control the operation so that the adhesive portion 3b of the adhesive pin 3 is peeled off from the surface of the first workpiece W1 at the same time as it is ejected toward the surface.
Immediately thereafter, the rigid contact surface 11 (antistatic means 12) of the first holding member 1 is moved away from the first workpiece W1 as shown by the two-dot chain line in FIG. The operation is controlled so as to return to the state after the workpiece is loaded.

このような本発明の実施例２に係るワーク貼り合わせ装置Ａによると、第一ワークＷ１を第一保持部材１に受け取る際、複数の粘着ピン３に設けられた吸着保持手段６で第一ワークＷ１を直接的に吸着保持するため、実施例１のような第一ワークＷ１に設けられた吸着保持手段６で第一ワークＷ１を間接的に吸着保持するものに比べ、第一保持部材１に対する第一ワークＷ１の接触面積が減少し、第一ワークＷ１の剥離に伴う静電気の発生を少なくすることができるという利点がある。 According to the workpiece laminating apparatus A according to the second embodiment of the present invention, when the first workpiece W1 is received by the first holding member 1, the first workpiece is held by the suction holding means 6 provided on the plurality of adhesive pins 3. In order to directly hold W1 by suction, the suction holding means 6 provided on the first work W1 as in the first embodiment is compared with the first holding member 1 that is indirectly suctioned and held by the suction holding means 6. There is an advantage that the contact area of the first workpiece W1 is reduced, and the generation of static electricity accompanying the peeling of the first workpiece W1 can be reduced.

特に、図６（ａ）〜（ｄ）に示される例のように、制御部７が、第一保持部材１と第二保持部材２による第一ワークＷ１及び第二ワークＷ２の加圧時のみ、第一保持部材１の剛性当接面１１（帯電防止手段１２）を第一ワークＷ１の表面に対し瞬間的に接触させる場合には、それ以外のタイミンクは剛性当接面１１（帯電防止手段１２）が第一ワークＷ１の表面と離れて、剛性当接面１１（帯電防止手段１２）と第一ワークＷ１との接触が瞬時であるため、第一ワークＷ１と剛性当接面１１の剥離時における電子の移動量も制限される。
したがって、第一ワークＷ１との剥離時における帯電の発生を僅かに抑制することができる。
その結果、アーク放電の発生確率を低減できて安全性の向上が図れる。 In particular, as in the example shown in FIGS. 6A to 6D, the control unit 7 only applies pressure to the first workpiece W1 and the second workpiece W2 by the first holding member 1 and the second holding member 2. When the rigid contact surface 11 (antistatic means 12) of the first holding member 1 is momentarily brought into contact with the surface of the first workpiece W1, the other timing is the rigid contact surface 11 (antistatic means). 12) is separated from the surface of the first workpiece W1, and the contact between the rigid contact surface 11 (antistatic means 12) and the first workpiece W1 is instantaneous, so that the first workpiece W1 and the rigid contact surface 11 are separated. The amount of electron movement at the time is also limited.
Therefore, it is possible to slightly suppress the occurrence of charging during peeling from the first workpiece W1.
As a result, the probability of occurrence of arc discharge can be reduced and safety can be improved.

なお、第一保持部材１に吸着保持手段６を設けた実施例１では、図３（ａ）（ｂ）及び図４（ａ）（ｂ）の帯電防止手段１２の変形例を示したが、これに限定されず、粘着ピン３に吸着保持手段６を設けた実施例２でも、図３（ａ）（ｂ）及び図４（ａ）（ｂ）と同様な帯電防止手段１２を設けてもよい。 In the first embodiment in which the first holding member 1 is provided with the suction holding means 6, a modification of the antistatic means 12 of FIGS. 3A and 3B and FIGS. 4A and 4B is shown. However, the present invention is not limited to this. Even in the second embodiment in which the suction holding means 6 is provided on the adhesive pin 3, the same antistatic means 12 as that shown in FIGS. Good.

Ａワーク貼り合わせ装置１第一保持部材
１１剛性当接面１２帯電防止手段
１２ｓ空間部１２ｂ，１２ｃ導電層
２第二保持部材３粘着ピン
４接離用駆動部５着脱用駆動部
７制御部ＤＰ減圧雰囲気
Ｗ１第一ワークＷ２第二ワーク A Work bonding apparatus 1 First holding member 11 Rigid contact surface 12 Antistatic means 12s Space portion 12b, 12c Conductive layer 2 Second holding member 3 Adhesive pin 4 Contact / separation drive unit 5 Detachment drive unit 7 Control unit DP Depressurized atmosphere W1 First work W2 Second work

Claims

The first workpiece is adhered and held by an adhesive holding means, and the first workpiece and the second workpiece are relatively moved and bonded together in a reduced-pressure atmosphere, and the workpiece is bonded to peel the adhesive holding device from the first workpiece. A device,
A first holding member having a rigid contact surface facing the first workpiece and contacting the surface,
An adhesive pin provided to penetrate the first holding member as the adhesive holding means;
An approach / separation drive unit for relatively moving either one or both of the first holding member or the second holding member holding the second workpiece; and
An attaching / detaching drive section for reciprocating the adhesive pin relative to the first holding member;
A control unit for controlling the operation of the contact / separation drive unit and the attachment / detachment drive unit ,
In the reduced pressure atmosphere, the control unit may be configured such that the first workpiece and the second workpiece are either or both of the first holding member and the adhesive pin by the contact / separation drive unit and the attachment / detachment drive unit. After the first work and the second work are pasted together, the rigid contact surface is brought into contact with the first work by the contact / separation drive unit. The portion that is kept in contact with the surface of the adhesive and moved in the direction of separating the adhesive pin from the first workpiece by the attaching / detaching drive unit, and is adhered and held by the adhesive portion of the adhesive pin in the first workpiece A workpiece laminating apparatus , wherein a peripheral portion of the workpiece is peeled off in a state of being in surface contact with the rigid contact surface .

The rigid contact surface of the first holding member has an antistatic means for the first work, and the control unit moves the charging pin in a direction away from the first work, and then The workpiece bonding apparatus according to claim 1, wherein the prevention means is moved in a direction away from the first workpiece.

3. The workpiece bonding apparatus according to claim 2, wherein a plurality of spaces are dispersed and formed on the rigid contact surface as the antistatic means so that a contact area with the first workpiece is reduced.

3. The workpiece bonding apparatus according to claim 2, wherein a conductive layer is formed on the rigid contact surface so as to contact the first workpiece as the antistatic means.

Only when the control unit is pressurizing the first workpiece and the second workpiece by the first holding member and the second holding member, the rigid contact surface of the first holding member is the surface of the first workpiece. The workpiece laminating apparatus according to claim 2, wherein the workpiece laminating device is brought into contact with the workpiece instantaneously.