TW202123357A - Element transfer device and method for manufacturing element module which is to transfer micro LEDs to a circuit board for adhesion without repetitive transfer steps - Google Patents

Abstract

The object of the present invention is to provide an element transfer device capable of transferring elements to the circuit board at an interval different from the interval between elements provided on an element substrate. In addition, a method is provided for manufacturing an element module capable of arranging elements on a circuit substrate at an interval different from the interval between elements provided on an element substrate. The element transfer device of the present invention includes: an elastic sheet including a first through hole and a second through hole; a first retaining pin whose first shaft is inserted into the first through hole; and a second retaining pin whose second shaft is inserted into the second through hole; a first adhesive part which is arranged on the first retaining pin to adhere the first element; and a second adhesive part which is arranged on the second retaining pin to adhere the second element.

Description

Component transfer device and manufacturing method of component module

The present invention relates to a component transfer device that picks up components from a component substrate on which components are formed, and releases the components to a circuit substrate on which a circuit for driving the components is formed. In addition, it relates to a method of manufacturing a component module using a component transfer device.

In small and medium-sized displays such as smart phones, displays that use liquid crystal or OLED (Organic Light Emitting Diode) have been commercialized. Among them, OLED displays using self-luminous elements, namely OLEDs, have the advantages of high contrast ratio and no need for backlight compared with liquid crystal displays. However, since the OLED is composed of organic compounds, it is difficult to ensure the high reliability of the OLED display due to the deterioration of the organic compounds.

On the other hand, as a next-generation display, the development of so-called micro LED displays in which tiny micro LEDs are arranged in pixels arranged in a matrix is advancing. Although micro LEDs are self-luminous elements similar to OLEDs, they are different from OLEDs in that they are composed of stable inorganic compounds such as gallium (Ga) or indium (In). Therefore, compared with an OLED display, a micro LED display can easily ensure high reliability. Furthermore, the luminous efficiency of the micro LED is relatively high, and high brightness can be achieved. Therefore, micro LED displays are highly anticipated as next-generation displays with high reliability, high brightness, and high contrast.

In a micro LED display, it is necessary to arrange micro LEDs in each pixel of a circuit substrate (also called a backplane or a TFT (Thin Film Transistor) substrate). As one of the methods of arranging micro LEDs on a circuit board, it is known to use a transfer substrate to pick up a plurality of micro LEDs from an element substrate, bond the transfer substrate to the circuit substrate, and transfer the picked up multiple micro LEDs. Method for circuit board (for example, refer to Patent Document 1 or Patent Document 2). [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Specification of U.S. Patent Application Publication No. 2016/0240516 [Patent Document 2] Specification of U.S. Patent Application Publication No. 2017/0047306

[The problem to be solved by the invention]

However, the previous transfer substrate cannot be used directly when the interval between the elements formed on the element substrate is different from the interval between the elements arranged on the circuit substrate. In this case, it is necessary to repeat the transfer step to adjust the interval between the components, and the manufacturing operation is greatly increased. That is, the repetition of the transfer step becomes one of the main reasons for the increase in the manufacturing cost of the micro LED display.

In view of the above-mentioned problems, one of the problems of the present invention is to provide a component transfer device that can arrange components on a circuit board at an interval different from the interval between the components formed on the component board. In addition, one of the problems is to provide a method for fabricating an element module in which elements are arranged on a circuit substrate at an interval different from the interval between elements formed on the element substrate. [Technical means to solve the problem]

A component transfer device according to an embodiment of the present invention includes: an elastic sheet including a first through hole and a second through hole; a first holding pin whose first shaft is inserted into the first through hole; and a second holding pin , The second shaft portion is inserted into the second through hole; the first adhesive portion is provided on the first holding pin to adhere the first element; and the second adhesive portion is provided on the second holding pin to adhere the second element .

The method of manufacturing a component module according to an embodiment of the present invention stretches and contracts the elastic sheet, so that the distance between the first holding pin inserted in the first through hole of the elastic sheet and the second holding pin inserted in the second through hole Change, and in each of the first adhesive portion provided on the first holding pin and the second adhesive portion provided on the second holding pin, the first element and the second element on the first support substrate are adhered and picked up.

The manufacturing method of the component module of one embodiment of the present invention is by inserting the first through hole and the second through hole of the elastic sheet, and is provided with the first holding pin of the first adhesive part and provided with the second adhesive And pick up the first element and the second element on the first support substrate to expand and contract the elastic sheet, so that the distance between the first holding pin and the second holding pin changes, and the distance between the first holding pin and the second holding pin is changed. 2 On the support substrate, place and release the first component and the second component.

Hereinafter, each embodiment of the present invention will be described with reference to the drawings. In addition, the embodiment is only an example, and those skilled in the art can easily think of it by maintaining the gist of the invention and making appropriate changes. Of course, it is also included in the scope of the present invention. In addition, in order to make the description clearer, the drawings may show the width, thickness, shape, etc. of each part in a schematic manner compared to the actual state. However, the shape shown in the figure is only an example, and does not limit the interpretation of the present invention.

In each embodiment of the present invention, for the convenience of description, the phrase "up" or "down" is used for description, but there may be cases where the relationship between the top and the bottom is reversed. For example, the performance of the element on the substrate is only to illustrate the up-and-down relationship between the substrate and the element, and other components may be arranged between the substrate and the element.

In this manual, "α includes A, B, or C", "α includes any of A, B, and C", and "α includes one selected from the group consisting of A, B, and C" as long as Unless otherwise specified, the case where α includes plural combinations of A to C is not excluded. Furthermore, these performances do not exclude the situation where α contains other elements.

In this specification, the so-called "component" refers to, for example, a microelectromechanical system (MEMS: Micro Electro Mechanical System), a light emitting diode (LED: Light Emitting Diode), or a laser diode (LD: Laser Diode), but the component Not limited to these. In addition, LEDs include mini LEDs or micro LEDs.

In this specification, the so-called "component module" means a circuit board on which components are arranged. The component module is, for example, a MEMS module configured with MEMS, an LED module configured with LED, or an LD module configured with LD, etc., but the component module is not limited to these.

<The first embodiment> 1A to 1D, a component transfer device 10 according to an embodiment of the present invention will be described.

[structure] FIG. 1A is a schematic plan view of a component transfer device 10 according to an embodiment of the present invention. As shown in FIG. 1A, the component transfer device 10 includes an elastic sheet 100 and a plurality of holding pins 110.

FIG. 1B is a schematic plan view of the elastic sheet 100 of the component transfer device 10 according to an embodiment of the present invention. Specifically, FIG. 1B shows that the elastic sheet 100 of the holding pin 110 is removed from the component transfer device 10. As shown in FIG. 1B, the elastic sheet 100 is provided with a through hole 101. The holding pin 110 shown in FIG. 1A is inserted into the through hole 101 of the elastic sheet 100. Therefore, the through hole 101 is provided at the position where the holding pin 110 is installed.

Fig. 1C is a schematic cross-sectional view of a component transfer device 10 according to an embodiment of the present invention. Specifically, Fig. 1C is a schematic cross-sectional view taken along the line A-A' of Fig. 1A. As shown in FIG. 1C, in the component transfer device 10, a holding pin 110 is inserted into the through hole 101 of the elastic sheet 100. An adhesive part 120 is provided at one end of the holding pin 110. In addition, in the constant state of the component transfer device 10, the interval between two adjacent holding pins 110 is L1.

1D is a schematic cross-sectional view of the holding pin 110 and the adhesive portion 120 of the component transfer device 10 according to an embodiment of the present invention. As shown in FIG. 1D, the holding pin 110 includes a shaft portion 111, a first head 112, and a second head 113. The first head 112 is provided at the first end of the shaft 111, and the second head 113 is provided at the second end opposite to the first end of the shaft 111. The outer diameter of each of the first head 112 and the second head 113 is larger than the outer diameter of the shaft 111. The shaft portion 111 of the holding pin 110 is inserted into the through hole 101, and the elastic sheet 100 is sandwiched between the first head 112 and the second head 113. In addition, an adhesive portion 120 is provided on the surface of the first head 112 on the opposite side of the surface on which the shaft portion 111 is provided.

The outer diameter of the shaft 111 is smaller than the opening diameter of the through hole 101. In addition, the length of the shaft portion 111 is greater than the depth of the through hole 101 (corresponding to the film thickness of the elastic sheet 100). Therefore, the shaft 111 in the through hole 101 can float not only in the in-plane direction of the elastic sheet 100 but also in the film thickness direction.

In addition, the outer diameter of the shaft portion 111 may be approximately the same as the opening diameter of the through hole 101 so that the shaft portion 111 hardly floats in the in-plane direction of the elastic sheet 100. Furthermore, the length of the shaft portion 111 may be approximately the same as the depth of the through hole 101, so that the shaft portion 111 hardly floats in the film thickness direction of the elastic sheet 100.

On the other hand, each of the first head 112 and the second head 113 is located on the outer side of the through hole 101 and protrudes from the opening surface of the through hole 101. The outer diameter of each of the first head 112 and the second head 113 is larger than the opening diameter of the through hole 101. Therefore, the first head 112 and the second head 113 do not enter the through hole 101. Therefore, the first head 112 and the second head 113 can function as fasteners for preventing the holding pin 110 from falling off the through hole 101 of the elastic sheet 100.

The component transfer device 10 uses the adhesive portion 120 to pick up components from the component substrate and release the components to the circuit substrate. Therefore, the adhesive force of the adhesive portion 120 is large enough to pick up the component from the component substrate, and small enough to release the component to the circuit substrate.

The outer diameters of the shaft portion 111, the first head portion 112, the second head portion 113, and the adhesive portion 120 can be appropriately determined in consideration of the size or shape of the component. For example, the outer diameter of the first head 112 or the second head 113 can be set to 1.25 times or more and 5 times or less with respect to the outer diameter of the shaft 111. The outer diameter of the first head 112 and the outer diameter of the second head 113 may be the same or different. The outer diameter of the adhesive portion 120 is also the same. That is, the outer diameter of the adhesive portion 120 may be the same as the outer diameter of the first head 112 or different from the outer diameter of the first head 112.

The length of the shaft 111 only needs to be greater than the film thickness of the elastic sheet 100. When the length of the shaft portion 111 is greater than the film thickness of the elastic sheet 100, the movement range of the shaft portion 111 in the film thickness direction of the elastic sheet 100 becomes larger. However, if the length of the shaft portion 111 is too large compared to the film thickness of the elastic sheet 100, the first head 112 or the second head 113 is too far from the elastic sheet 100, so the alignment of the holding pin 110 and the element is unstable. Therefore, the length of the shaft 111 is preferably 1 time or more and 2 times or less with respect to the film thickness of the elastic sheet 100.

The adhesive portion 120 preferably includes a flat surface of the adhesive element. The surface roughness of the flat surface of the adhesive portion 120 is, for example, 1 μm or less, preferably 0.5 μm or less. If the surface roughness of the flat surface is small, the contact area with the device increases, so the adhesion between the adhesive portion 120 and the device can be increased. In addition, it is preferable that the surface on the opposite side of the surface on which the shaft portion 111 of the second head portion 113 is provided is also a flat surface. When the second head 113 has a flat surface, since pressure can be applied to the flat surface of the second head 113 evenly, the parallelism of the adhesive portion 120 can be easily adjusted.

The film thickness of the adhesive portion 120 can be appropriately determined in consideration of the size or shape of the element. The adhesive portion 120 can embed components by being stretchable. Therefore, the film thickness of the adhesive portion 120 is preferably greater than the height of the device. In addition, it is also possible to make the adhesive portion 120 have fluidity and to adhere the element by embedding the element.

The cross-sectional shape of each of the through hole 101, the shaft portion 111, the first head portion 112, the second head portion 113, and the adhesive portion 120 shown in FIGS. 1A to 1D is circular, but it is not limited to this. The cross-sectional shape of each of the through hole 101, the shaft portion 111, the first head portion 112, the second head portion 113, and the adhesive portion 120 may be polygonal, elliptical, or the like. That is, the shape of each of the through hole 101, the shaft portion 111, the first head 112, the second head 113, and the adhesive portion 120 may be various shapes such as a polygonal column, a cylinder, or an elliptical cylinder.

The size of the elastic sheet 100 can be appropriately determined in consideration of the size of the element substrate or the circuit substrate. The size of the elastic sheet 100 is, for example, 50 mm square, but it is not limited to this. In addition, the shape of the elastic sheet 100 is, for example, a rectangle, but it is not limited to this. The shape of the elastic sheet 100 can also be polygonal, circular, or elliptical.

The film thickness of the elastic sheet 100 can be appropriately determined in consideration of the rigidity of the component transfer device 10. The film thickness of the elastic sheet 100 is, for example, 1 mm or more and 10 mm or less, but it is not limited to this. When the film thickness of the elastic sheet 100 is thin, the rigidity of the component transfer device 10 becomes weak. Moreover, when the film thickness of the elastic sheet 100 is thick, the stretchability of the elastic sheet 100 decreases. Therefore, the film thickness of the elastic sheet 100 is preferably within the above-mentioned range, which is the thickness provided with the through holes 101.

The number or spacing of the holding pins 110 can be appropriately determined in consideration of the arrangement of the components of each of the first substrate and the second substrate, the size of the components, and the like. For example, the retaining pins 110 may be arranged in a matrix or a zigzag pattern in the elastic sheet 100.

1E is a schematic cross-sectional view showing a state in which the elastic sheet 100 is stretched in the component transfer device 10 according to an embodiment of the present invention. As shown in FIG. 1E, the component transfer device 10 stretches the elastic sheet 100 by applying force to the in-plane direction of the elastic sheet 100. At the same time, the interval between the holding pins 110 is also stretched from L1 in the constant state shown in FIG. 1C to L2 in the stretched state shown in FIG. 1E. In FIG. 1E, the elastic sheet 100 is shown in a stretched state, but the elastic sheet 100 can also be reduced. Therefore, by adjusting the force applied to the elastic sheet 100, the interval between the holding pins 110 can be adjusted.

[material] The elastic sheet 100 is preferably an elastic material having the property of deforming when a force is applied, and recovering when the force is removed. As the elastic material of the elastic sheet 100, for example, natural rubber (NR: Natural Rubber), silicone rubber (SI), polyurethane rubber (PUR: Polyurethane Rubber), fluorine rubber (FPM), nitrile rubber (NBR: Nitrile-Butadiene Rubber) ), styrene·butadiene rubber (SBR: Styrene Butadiene Rubber), butadiene rubber (BR: Butadiene Rubber), isoprene rubber (IR: Isoprene Rubber), EPDM: Ethylene- Propylene-Diene Monomer), polyacrylate rubber (ACM), or butyl rubber (IIR: Isobutylene Isoprene Rubber), etc. These rubbers can be used alone or in combination. In particular, when high heat resistance is required, the elastic material of the elastic sheet 100 is preferably silicon rubber or fluorine rubber. In addition, regarding the silicone rubber in this specification, it is assumed that it contains polydimethylsiloxane (PDMS).

In addition, the elastic sheet 100 may contain additives such as a vulcanizing material, a filler, a softening agent, a coloring agent, or an anti-deterioration agent. As the vulcanizing material, sulfur, sulfur compounds, peroxides, or the like can be used. As the filler, barium sulfate, calcium carbonate, silicic acid, magnesium silicate, calcium silicate, or the like can be used. As the softener, paraffin-based processing oil, naphthenic-based processing oil, or the like can be used. As a coloring agent, carbon black, titanium white, ultramarine blue, phthalocyanine, iron red, lead chromate, etc. can be used. As the anti-deterioration agent, phenol, wax, or the like can be used.

Furthermore, the elastic sheet 100 may also contain a vulcanization assistant or a vulcanization accelerator. As the vulcanization aid, zinc stearate, stearic acid, zinc white, zinc oxide, magnesium oxide, or the like can be used. As the vulcanization accelerator, thiazoles, thiurams, sulfenamides, or dithiocarbamates, etc. can be used.

The holding pin 110 can use the same elastic material as the elastic sheet 100. In addition, the holding pin 110 may also use a material with higher rigidity (rigid material). As the rigid material of the holding pin 110, for example, quartz, glass, or silicon can be used. Furthermore, the holding pin 110 can also be made of metal materials such as aluminum, brass, or stainless steel.

The holding pin 110 can be manufactured integrally with the shaft portion 111, the first head 112, and the second head 113, but it is not limited to this. Each of the shaft portion 111, the first head portion 112, and the second head portion 113 may be separately produced, and the holding pins 110 may be produced by crimping, welding, or following them. Therefore, the shaft 111, the first head 112, and the second head 113 may be made of different materials.

The adhesive part 120 can use the same elastic material as the elastic sheet 100. In particular, the elastic material of the adhesive portion 120 is preferably an elastic material with low repellency. In addition, the adhesive portion 120 can use a material (planarization material) that can easily form a flat surface. As the flattening material of the adhesive portion 120, for example, polyimide resin, acrylic resin, epoxy resin, or silicone resin can be used. another. The material of the adhesive part 120 may also be photosensitive resin.

The adhesive portion 120 may further use a gel material obtained by mixing starch, carboxymethyl cellulose, polyvinyl acetate, or polyvinyl alcohol with borax or the like to gel.

The material of the adhesive part 120 may be different from the material of the holding pin 110. For example, a rigid material may be used for the holding pin 110 to increase the rigidity of the holding pin 110, and an elastic material that keeps deformation may be used for the adhesive portion 120.

The materials of the adhesive portion 120 need not all be the same. The material of the adhesive portion 120 can be changed according to the position where the holding pin 110 is set. For example, the first material may be used for the adhesive portion 120 of the holding pin 110 provided on the inner side of the elastic sheet 100, and the second material may be used for the adhesive portion 120 of the holding pin 110 provided on the outer side of the elastic sheet 100. By changing the material of the adhesive portion 120, the adhesive force can be changed according to the position of the holding pin 110.

As described above, according to the component transfer device 10 of the present embodiment, the elastic sheet 100 can be utilized to transfer components on the circuit board at an interval different from the interval between the components of the component substrate. Moreover, in the component transfer device 10, since the holding pin 110 is provided with the adhesive portion 120, the holding pin 110 can be made rigid, and the material of the adhesive portion 120 can be selected according to the picked up or released component. Therefore, since the number of repetitions of the transfer step can be reduced by using the component transfer device 10, the manufacturing operation or manufacturing cost of the device including the component 610 can be reduced.

＜Examples of changes＞ 2A to 2C, the component transfer device 10A, which is a modification example of the component transfer device 10, will be described. Hereinafter, the description of the same configuration as the component transfer device 10 will be omitted, and the configuration different from the component transfer device 10 will be mainly described.

Fig. 2A is a schematic cross-sectional view of a component transfer device 10A according to an embodiment of the present invention. Specifically, FIG. 2A is a schematic cross-sectional view of the component transfer device 10A cut at the same position as the line A-A' of FIG. 1A. As shown in FIG. 2A, the component transfer device 10A includes an elastic sheet 100, a plurality of holding pins 110, a first adhesive part 120R, a second adhesive part 120G, and a third adhesive part 120B. The film thicknesses are different in the first adhesive part 120R, the second adhesive part 120G, and the third adhesive part 120B. That is, in the component transfer device 10A, one end of each of the plurality of holding pins 110 is provided with any one of the first adhesive portion 120R, the second adhesive portion 120G, and the third adhesive portion 120B with different film thicknesses. In addition, in the constant state of the component transfer device 10A, the interval between two adjacent holding pins 110 is L1.

In FIG. 2A, the first element 610R, the second element 610G, and the third element 610B of different heights, which are provided on the first support substrate 600 of the element substrate 60, are also shown. The film thicknesses of the first adhesive portion 120R, the second adhesive portion 120G, and the third adhesive portion 120B of the component transfer device 10A are adjusted according to the heights of the first element 610R, the second element 610G, and the third element 610B, respectively. That is, on the first element 610R with a smaller height, the first adhesive portion 120R with a larger film thickness is provided, and on the third element 610B with a larger height, the third adhesive portion 120B with a smaller film thickness is provided.

In the following description, when the first adhesive part 120R, the second adhesive part 120G, and the third adhesive part 120B are not particularly distinguished, it is expressed as the adhesive part 120A. In addition, when the first element 610R, the second element 610G, and the third element 610B are not particularly distinguished, it is expressed as the element 610.

2B is a schematic cross-sectional view showing a state in which the component 610 is picked up by the adhesive portion 120A in the component transfer device 10A according to an embodiment of the present invention. As shown in FIG. 2B, a first element 610R, a second element 610G, and a third element 610B are adhered to the first adhesive portion 120R, the second adhesive portion 120G, and the third adhesive portion 120B, respectively. Since the film thickness of the adhesive portion 120A varies according to the height of the component 610, in the state where the component 610 is adhered to the adhesive portion 120A, the holding pin 110 can be made to the bottom surface of the component 610 (the side opposite to the surface where the adhesive portion 120A is adhered) The distance between faces) is roughly the same.

In the case of a light-emitting element like a mini LED or a micro-LED, the height of the light-emitting element may vary according to the color of the light. For example, when the first element 610R, the second element 610G, and the third element 610B are respectively a red light-emitting element, a green light-emitting element, and a blue light-emitting element, in the element transfer device 10A, the red light-emitting element, the green light-emitting element, and the green light-emitting element The heights of the light-emitting element and the blue light-emitting element are adjusted to the film thicknesses of the first adhesive portion 120R, the second adhesive portion 120G, and the third adhesive portion 120B, respectively. Therefore, even for light-emitting elements of different heights, if the element transfer device 10A is used, the light-emitting elements can be picked up all at once. In addition, since the distance between the holding pin 110 and the bottom surface of each light-emitting element is aligned, the light-emitting element can be released to the circuit board together.

2C is a schematic cross-sectional view showing a state in which the elastic sheet 100 is stretched in the component transfer device 10A according to an embodiment of the present invention. As shown in FIG. 2C, the component transfer device 10A stretches the elastic sheet 100 by applying force to the in-plane direction of the elastic sheet 100. At the same time, the interval between the holding pins 110 is also stretched from L1 in the constant state shown in FIG. 2A to L2 in the stretched state shown in FIG. 2C. In FIG. 2C, the elastic sheet 100 is shown in a stretched state, but the elastic sheet 100 can also be reduced. Therefore, by adjusting the force applied to the elastic sheet 100, the interval between the holding pins 110 can be adjusted.

As described above, according to the component transfer device 10A of the modified example of this embodiment, since the film thickness of the adhesive portion 120 is adjusted according to the height of the component 610, the components 610 with different heights can be picked up or released at the same time. Therefore, since the number of repetitions of the transfer step can be reduced by using the component transfer device 10, the manufacturing operation or manufacturing cost of the device including the component can be reduced.

The above-mentioned configuration includes a modified example and is only an embodiment, and the present invention is not limited to the above-mentioned configuration.

<The second embodiment> 3A to 3C, a component transfer device 20 according to an embodiment of the present invention will be described. Hereinafter, the description of the same configuration as the first embodiment will be omitted, and the configuration different from the first embodiment will be mainly described.

FIG. 3A is a schematic cross-sectional view of a component transfer device 20 according to an embodiment of the present invention. Specifically, FIG. 3A is a schematic cross-sectional view of the component transfer device 20 cut at the same position as the line A-A' shown in FIG. 1A. As shown in FIG. 3A, the component transfer device 20 includes an elastic sheet 200, a plurality of holding pins 210, and an adhesive part 220. The elastic sheet 200 is provided with a through hole 201 and a holding pin 210 is embedded. In addition, an adhesive part 220 is provided at one end of the holding pin 210. In addition, in the constant state of the component transfer device 20, the interval between two adjacent holding pins 210 is L1.

3B is a schematic cross-sectional view of the holding pin 210 and the adhesive portion 220 of the component transfer device 20 according to an embodiment of the present invention. As shown in FIG. 3B, the holding pin 210 includes a shaft portion 211, a first head portion 212, and a second head portion 213. A first head 212 is provided at one end of the shaft 211, and a second head 213 is provided at the other end of the shaft 211. In addition, an adhesive portion 220 is provided on the surface of the first head portion 212 on the opposite side of the surface on which the shaft portion 211 is provided.

The shaft portion 211 has a tapered shape, and the outer diameter varies depending on the position. That is, the outer diameter of the shaft portion 211 is the largest on the side of the first head 212 and smallest on the side of the second head 213. The outer diameter of the first head 212 is greater than the maximum outer diameter of the shaft 211. In addition, the outer diameter of the second head 213 is larger than the minimum outer diameter of the shaft 211.

The through hole 201 also has the same taper as the shaft 211, and the opening diameter varies depending on the position. That is, the opening diameter of the through hole 201 is the largest on the first opening surface on the side of the first head 212 and smallest on the side of the second head 213. The outer diameter of the first head 212 is larger than the opening diameter of the first opening surface. In addition, the outer diameter of the second head 213 is larger than the opening diameter of the second opening surface.

The opening diameter of the first opening surface or the opening diameter of the second opening surface of the through hole 201 is preferably smaller than the maximum outer diameter of the shaft portion 211, but it is not limited to this. When the opening diameter of the first opening surface or the second opening diameter of the through hole 201 is smaller than the maximum outer diameter of the shaft portion 211, the elastic sheet 200 can be fixed at the middle position of the shaft portion 211.

The taper angle of the shaft 211 and the through hole 201 can be appropriately determined in consideration of the length of the shaft 211 or the film thickness of the elastic sheet 200. In addition, the taper angle of the shaft portion 211 and the taper angle of the through hole 201 are preferably the same, but it is not limited to this.

3C is a schematic cross-sectional view showing a state in which the elastic sheet 200 is stretched in the component transfer device 20 according to an embodiment of the present invention. As shown in FIG. 3C, the component transfer device 20 stretches the elastic sheet 200 by applying force to the in-plane direction of the elastic sheet 200. At the same time, the interval between the holding pins 210 is also stretched from L1 in the constant state shown in FIG. 3A to L2 in the stretched state shown in FIG. 3C. Therefore, by adjusting the force applied to the elastic sheet 200, the interval between the holding pins 110 can be adjusted. In FIG. 3C, the elastic sheet 200 is shown in a stretched state, but the elastic sheet 200 can also be reduced. Therefore, by adjusting the force applied to the elastic sheet 200, the interval between the holding pins 210 can be adjusted.

Moreover, when the opening diameter of the first opening surface or the opening diameter of the second opening surface of the through hole 201 is smaller than the maximum outer diameter of the shaft portion 211, as shown in FIG. 3C, the shaft portion 211 can be fixed at a specific position. Therefore, since the component transfer device 20 can fix the holding pin 210 to the elastic sheet 200 in the stretched state, the pickup or release of the component 610 is stable.

As described above, according to the component transfer device 20 of the present embodiment, the elastic sheet 200 can be utilized to transfer components on the circuit board at an interval different from the interval between the components of the component substrate. In addition, in the component transfer device 20, the holding pin 210 can be fixed to the stretched elastic sheet 200, and the component 610 can be picked up or released stably. Therefore, by using the component transfer device 20, the manufacturing operation or manufacturing cost of the device including the component 610 can be reduced, and the yield rate can be improved.

＜Examples of changes＞ 4A to 4C, the component transfer device 20A, which is a modification example of the component transfer device 20, will be described. Hereinafter, the description of the same configuration as the component transfer device 20 will be omitted, and the configuration different from the component transfer device 10 will be mainly described.

4A is a schematic cross-sectional view of a component transfer device 20A according to an embodiment of the present invention. Specifically, FIG. 4A is a schematic cross-sectional view of the component transfer device 20A cut at the same position as the line A-A' of FIG. 1A. As shown in FIG. 4A, the component transfer device 20A includes an elastic sheet 200A, a plurality of holding pins 210A, and an adhesive part 220. The elastic sheet 200A is provided with a through hole 201A, and a holding pin 210A is embedded. In addition, an adhesive portion 220 is provided at one end of the holding pin 210A. In addition, in the constant state of the component transfer device 20A, the interval between two adjacent holding pins 210A is L1.

4B is a schematic cross-sectional view of the holding pin 210A and the adhesive portion 220 of the component transfer device 20A according to an embodiment of the present invention. As shown in FIG. 4B, the holding pin 210A includes a shaft portion 211A, a first head portion 212A, and a second head portion 213A. A first head 212A is provided at one end of the shaft 211A, and a second head 213A is provided at the other end of the shaft 211A. In addition, an adhesive portion 220A is provided on the surface on the opposite side of the surface on which the shaft portion 211A of the first head portion 212A is provided.

The shaft portion 211A has a tapered shape, and the outer diameter varies depending on the position. That is, the outer diameter of the shaft portion 211A is smallest on the side of the first head 212A and largest on the side of the second head 213A. The outer diameter of the first head 212A is larger than the minimum outer diameter of the shaft 211A. In addition, the outer diameter of the second head 213A is larger than the maximum outer diameter of the shaft 211A.

The through hole 201A also has the same taper as the shaft portion 211A, and the opening diameter varies depending on the position. That is, the opening diameter of the through hole 201A is the smallest on the first opening surface on the side of the first head 212A, and is largest on the side of the second head 213A. The outer diameter of the first head 212A is larger than the opening diameter of the first opening surface. In addition, the outer diameter of the second head 213A is larger than the opening diameter of the second opening surface.

The opening diameter of the first opening surface or the opening diameter of the second opening surface of the through hole 201A is preferably smaller than the maximum outer diameter of the shaft portion 211A, but it is not limited thereto. When the opening diameter of the first opening surface or the second opening diameter of the through hole 201A is smaller than the maximum outer diameter of the shaft portion 211A, the elastic sheet 200 can be fixed at the middle position of the shaft portion 211A.

The taper angle of the shaft 211A and the through hole 201A can be appropriately determined in consideration of the length of the shaft 211A or the film thickness of the elastic sheet 200A. In addition, the taper angle of the shaft portion 211A and the taper angle of the through hole 201A are preferably the same, but it is not limited to this.

4C is a schematic cross-sectional view showing a state in which the elastic sheet 200A is stretched in the component transfer device 20 according to an embodiment of the present invention. As shown in FIG. 4C, the component transfer device 20A stretches the elastic sheet 200A by applying force to the in-plane direction of the elastic sheet 200A. At the same time, the interval between the holding pins 210A is also stretched from L1 in the constant state shown in FIG. 4A to L2 in the stretched state shown in FIG. 4C. Therefore, by adjusting the force applied to the elastic sheet 200A, the interval between the holding pins 110A can be adjusted. In FIG. 4C, the elastic sheet 200A is shown in a stretched state, but the elastic sheet 200A can also be reduced. Therefore, by adjusting the force applied to the elastic sheet 200A, the interval between the holding pins 210A can be adjusted.

Furthermore, when the opening diameter of the first opening surface or the opening diameter of the second opening surface of the through hole 201A is smaller than the maximum outer diameter of the shaft portion 211A, as shown in FIG. 4C, the shaft portion 211A can be fixed at a specific position. Therefore, since the component transfer device 20 can fix the holding pin 210A to the stretched elastic sheet 200A, the pickup or release of the component 610 is stable.

As described above, according to the component transfer device 20A of the modified example of this embodiment, the flexibility of the elastic sheet 200A can be utilized to transfer components on the circuit board at an interval different from the interval between the components of the component substrate. In addition, in the component transfer device 20A, the holding pin 210A can be fixed to the elastic sheet 200A in the stretched state, and the component 610 can be stably picked up or released. Therefore, by using the component transfer device 20, the manufacturing operation or manufacturing cost of the device including the component 610 can be reduced, and the yield rate can be improved.

<The third embodiment> With reference to FIGS. 5 to 8H, a method of manufacturing a component module according to an embodiment of the present invention will be described. In this embodiment, a method of transferring the component 610 from the component substrate 60 on which the component 610 is formed to the circuit substrate 70 on which the circuit of the drive element 610 is formed using the component transfer device 10 will be described.

[Component substrate] FIG. 5 is a schematic perspective view of a device substrate 60 used in a method of manufacturing a device module according to an embodiment of the present invention.

As shown in FIG. 5, the element substrate 60 includes a first support substrate 600 and a plurality of elements 610. In FIG. 5, a plurality of elements 610 are arranged in a matrix on the first support substrate 600, but it is not limited to this. The plurality of elements 610 can also be arranged on the first support substrate 600 in a zigzag pattern. For the component substrate 60, the component 610 can be picked up by the component transfer device 10, and the component 610 may be separately arranged on the first support substrate 600.

The first support substrate 600 can use rigid substrates such as quartz, glass, silicon, sapphire, polyimide, acrylic, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), and other flexible substrates.性substrate. In addition, the first support substrate 600 is not limited to a substrate, and may be a film or a sheet.

In addition, the first support substrate 600 may be a substrate or a wafer used for forming the element 610, or may be a dicing film or a dicing sheet.

[Circuit Board] The circuit substrate 70 is formed on the second support substrate 700 with a circuit for driving the element 610. As the second support substrate 700, a translucent substrate such as a glass substrate, a quartz substrate, a sapphire substrate, a polyimide substrate, an acrylic substrate, a siloxane substrate, or a fluororesin substrate can be used. In addition, when translucency is not required, as the second support substrate 700, a semiconductor substrate such as a silicon substrate, a silicon carbide substrate, or a compound semiconductor substrate, or a conductive substrate such as a stainless steel substrate can also be used. In addition, the second supporting substrate 700 may be a rigid substrate having rigidity, or a flexible substrate having flexibility.

As an example of the circuit board 70, a circuit board 70 that can be used in a display device will be described. FIG. 6 is a block diagram showing the layout structure of the circuit board 70 used in the manufacturing method of the device module according to one embodiment of the present invention.

As shown in FIG. 6, on the second support substrate 700, a pixel area 710, a driver circuit area 720, and a terminal area 730 are provided. The driver circuit area 720 and the terminal area 730 are arranged around the pixel area 710.

The pixel area 710 includes a plurality of pixels arranged in a matrix, and each pixel includes any one of a red light-emitting pixel 710R, a green light-emitting pixel 710G, and a blue light-emitting pixel 710B. In addition, a pixel circuit 711 is provided in each pixel. In addition, although not shown, each pixel is provided with an electrode electrically connected to the element 610. Furthermore, in order to bond the device 610 to the electrode, a conductive adhesive 790 may be provided on the electrode. The conductive adhesive 790 is, for example, an adhesive containing a conductive filler, but it is not limited to this. The conductive adhesive 790 may also be a silver paste that has been cured over time. In addition, the conductive adhesive 790 may be a thermosetting adhesive or a light curing adhesive. The conductive adhesive 790 fixes the picked-up component 610 on the second support substrate 700 of the circuit substrate 70, and electrically connects the component 610 and the wiring provided on the second support substrate 700.

The driver circuit area 720 includes a gate driver circuit 720G and a source driver circuit 720S. The pixel circuit 711 and the gate driver circuit 720G are electrically connected via the gate wiring 721. In addition, the pixel circuit 711 and the source driver circuit 720S are connected via a source wiring 722. The red light-emitting pixel 710R, the green light-emitting pixel 710G, and the blue light-emitting pixel 710B are disposed at positions where the gate wiring 721 and the source wiring 722 intersect.

The terminal area 730 includes a terminal portion 730T for connection with external equipment. The terminal portion 730T and the gate driver circuit 720G are electrically connected via the connection wiring 731. In addition, the terminal portion 730T and the source driver circuit 720S are electrically connected via the connection wiring 732. The external device and the circuit board 70 are electrically connected by connecting a flexible printed circuit board (FPC: Flexible Printed Circuit) or the like connected to the external device to the terminal portion 730T. A signal from an external device can be supplied to drive each pixel circuit 711 provided on the circuit board 70.

[Method of Making Component Module] FIG. 7 is a flowchart of a method of manufacturing a component module according to an embodiment of the present invention. As shown in FIG. 7, the manufacturing method of the component module of this embodiment includes the step of aligning the component transfer device 10 and the component substrate 60 (S100), the step of picking up the component 610 from the component substrate 60 (S200), and the component transfer The step of aligning the device 10 and the circuit board 70 (S300), and the step of releasing the component 610 to the circuit board 70 (S400).

Hereinafter, the manufacturing method of the component module will be described in detail with reference to FIGS. 8A to 8H. In addition, each of FIGS. 8A to 8H is a schematic diagram showing a method of manufacturing a component module according to an embodiment of the present invention.

FIG. 8A shows a state in which the component transfer device 10 is installed on the component substrate 60 in step S100. The interval between the holding pins 110 of the component transfer device 10 is L1. Moreover, the adhesive part 120 is provided in the 1st head part 112 of a holding pin. On the other hand, the element substrate 60 is provided with a first element 610R, a second element 610G, and a third element 610B on the first support substrate 600. The interval between the elements 610 is L2.

FIG. 8B shows the state of the elastic sheet 100 of the tensile element transfer device 10 in step S100. In order to make the interval between the holding pins 110 of the component transfer device 10 match the interval L2 between the components 610, a force is applied to stretch and fix the elastic sheet 100. In addition, the alignment mark provided on the component transfer device 10 is aligned with the alignment mark provided on the element substrate 60. The alignment mark can be arranged in the center of the component transfer device 10 or the component substrate 60, and can also be arranged on the periphery or four corners of the component transfer device 10 or the component substrate 60. In addition, a plurality of alignment marks may be used to align the component transfer device 10 and the component substrate 60. The interval between the holding pins 110 is made consistent with the interval L2 between the components 610, and the alignment of the component transfer device 10 and the component substrate 60 is completed.

8C shows a state in which the adhesive portion 120 of the component transfer device 10 is pressed against the first component 610R, the second component 610G, and the third component 610B of the component substrate 60 in step S200. Since the adhesive portion 120 is flexible, the greater the height of the element 610 is, the more the element 610 is embedded in the adhesive portion 120. In this state, in order to increase the adhesive force between the adhesive portion 120 and the element 610, a force can also be applied to the elastic sheet 100 or the retaining pin 110.

FIG. 8D shows a state in which the component transfer device 10 picks up the first component 610R, the second component 610G, and the third component 610B in step S200. When the adhesive force between the adhesive portion 120 and the element 610 is greater than the adhesive force (adhesive force) between the first support substrate 600 and the element 610, the element 610 is peeled from the first support substrate 600. Although the heights of the first element 610R, the second element 610G, and the third element 610B are different, since the heights of the first element 610R, the second element 610G, and the third element 610B are adjusted by the adhesive portion 120, the holding pin 110 The distances to the bottom surfaces of the first element 610R, the second element 610G, and the third element 610B are approximately the same. That is, in a state where the elements 610 with different heights are adhered to the adhesive portion 120, the bottom surfaces of the elements 610 are located in substantially the same plane. In other words, the adhesive portion 120 is deformed and held in such a manner that the bottom surface of the first element 610R, the bottom surface of the second element 610G, and the bottom surface of the third element 610B are substantially the same.

FIG. 8E shows a state in which the component transfer device 10 is installed on the circuit board 70 in step S300. The interval between the holding pins 110 of the component transfer device 10 is L2. On the other hand, the circuit board 70 is provided on the second support substrate 700 with a conductive adhesive 790 for connection with electrodes. The interval between the conductive adhesive 790 (between electrodes) is L3.

FIG. 8F shows the state of reducing the elastic sheet 100 of the component transfer device 10 in step S300. In order to match the interval between the holding pins 110 of the component transfer device 10 with the interval L3 between the conductive adhesive 790, force is applied to shrink and fix the elastic sheet 100. Alignment marks can be used for alignment. That is, the alignment mark provided on the component transfer device 10 is aligned with the alignment mark provided on the circuit board 70. The alignment marks can be arranged in the center of the component transfer device 10 or the circuit substrate 70, and can also be arranged on the periphery or four corners of the component transfer device 10 or the circuit substrate 70. In addition, a plurality of alignment marks may be used to align the component transfer device 10 and the circuit board 70. The interval between the holding pins 110 and the interval L3 between the conductive adhesive 790 are aligned, and the alignment of the component transfer device 10 and the circuit board 70 is completed.

8G shows a state in which the first element 610R, the second element 610G, and the third element 610B adhered to the adhesive portion 120 of the element transfer device 10 are pressed against the conductive adhesive 790 of the circuit board 70 in step S400. In this state, in order to increase the adhesive force between the conductive adhesive 790 and the element 610, force may also be applied to the elastic sheet 100 or the holding pin 110.

FIG. 8H shows a state in which the component transfer device 10 releases the first component 610R, the second component 610G, and the third component 610B in step S400. When the adhesive force between the conductive adhesive 790 and the component 610 is greater than the adhesive force between the adhesive portion 120 and the component 610, the component 610 peels off from the pickup surface. If the force is removed from the elastic sheet 100 of the component transfer device 10, the interval between the holding pins 110 returns to the constant state L1.

In the case where the circuit board 70 requires a plurality of components 610, steps S100 to S400 are repeated. For example, when the component 610 is a micro LED, the component transfer device 10 can be used to repeat the pickup and release of the red micro LED, the green micro LED, and the blue micro LED to produce a full-color display micro LED module .

In addition, when the element 610 is a micro-ultraviolet LED, a red phosphor, a green phosphor, and a blue phosphor can be arranged on the side of the emitted light, and the phosphor can be converted from the micro-ultraviolet LED to emit light. UV light to produce miniature LED modules capable of full-color display.

As described above, according to the method for manufacturing a component module according to an embodiment of the present invention, the elastic sheet 100 of the component transfer device 10 can be stretched and retracted and the component 610 can be picked up or released. In addition, even for the elements 610 with different heights, since the adhesive portion 120 adjusts the height difference of the element 610, the alignment of the element 610 is easier. Therefore, if the component 610 is mounted on the circuit board 70 using the component transfer device 10, the manufacturing operation or manufacturing cost of the component module is reduced, and the yield rate is improved.

＜Variation 1＞ 9, a method of manufacturing a component module, which is a modification of the above-mentioned third embodiment, will be described. The manufacturing method of the component module of this modification can be performed with the same steps as the above. Therefore, in the following, the description of the same configuration as the above will be omitted, and the configuration different from the above will be mainly described.

FIG. 9 is a schematic diagram showing a state before the component transfer device 10 with the component 610 picked up is pressed against the circuit board 70A in the manufacturing method of the component module according to one embodiment of the present invention. On the adhesive portion 120 of the component transfer device 10, the first component 610R, the second component 610G, and the third component 610B are adhered. Also, although not shown, an electrode is arranged on the second support substrate 700A of the circuit board 70A, and a conductive adhesive 790 is provided on the electrode. Therefore, the first element 610R, the second element 610G, and the third element 610B can be electrically connected to the electrodes of the circuit board 70A via the conductive adhesive 790. In addition, the electrical connection between the first element 610R, the second element 610G, and the third element 610B, and the electrode of the circuit board 70A is not limited to the conductive adhesive 790. For example, the first element 610R, the second element 610G, and the third element 610B may be electrically connected to the electrodes of the circuit board 70A via an anisotropic conductive film (ACF: Anisotropic Conductive Film).

The circuit board 70A includes a curved surface in at least a part. Specifically, the second support substrate 700B includes a curved surface protruding toward the component transfer device 10 side.

The elastic sheet 100 of the component transfer device 10 can not only be stretched in the in-plane direction, but also bend in the vertical direction of the elastic sheet 100. Therefore, even if the circuit board 70A includes a curved surface, if the component transfer device 10 is pressed against the circuit substrate 70A, the component transfer device 10 will also bend along the circuit substrate 70A, and the first element 610R, the second element 610G, and the second element 610G can be bent. The three-element 610B is attached to the circuit board 70A.

Although the heights of the first component 610R, the second component 610G, and the third component 610B are different, the height difference is adjusted by the adhesive portion 120 of the component transfer device 10, so that the picked up first component 610R and second component The positions of the bottom surfaces of each of the element 610G and the third element 610B are approximately aligned. Therefore, even if the elastic sheet 100 is bent and bends along it, the positions of the bottom surfaces of each of the first element 610R, the second element 610G, and the third element 610B are aligned and bend. Therefore, it is easier to align the first element 610R, the second element 610G, and the third element 610B with respect to the circuit board 70A including a curved surface.

The component transfer device 10 can apply force to the elastic sheet 100 to be fixed and press against the circuit board 70A. In addition, the component transfer device 10 may also change the force applied to the elastic sheet 100 while pressing against the circuit board 70A.

The component transfer device 10 can be configured to bend the elastic sheet 100 along the curved surface of the circuit substrate 70A after the component 610 is placed at the center of the circuit substrate 70A, and place the component 610 on the end of the circuit substrate 70A. In addition, the component transfer device 10 may also bend the elastic sheet along the curved surface of the circuit substrate 70A after placing the component 610 on one end of the circuit substrate 70A and place the component 610 on the other end. In this case, a plurality of alignment marks can also be used, and the alignment can be performed appropriately.

As described above, according to the modification example of the third embodiment, that is, the manufacturing method of the component module, the component 610 can be released for the circuit board 70A including the curved surface protruding toward the component transfer device 10 side. In the component transfer device 10, since the adhesive portion 120 adjusts the height difference of the component 610, the bottom surface of the component 610 is aligned. Therefore, it is easier to align the component 610 compared to the circuit board 70A including a curved surface. Therefore, if the component transfer device 10 is used to transfer the component 610 on the circuit board 70A including a curved surface, the manufacturing operation or manufacturing cost of the component module can be reduced, and the yield rate can be improved.

＜Variation 2＞ 10, another modification of the third embodiment, namely, a method of manufacturing a component module will be described. The manufacturing method of the component module of this modification can be performed with the same steps as the above. Therefore, in the following, the description of the same configuration as the above will be omitted, and the configuration different from the above will be mainly described.

FIG. 10 is a schematic diagram showing a state before the component transfer device 10 with the component 610 picked up is pressed against the circuit board 70B in the manufacturing method of the component module according to one embodiment of the present invention.

The circuit board 70B includes a curved surface in at least a part. Specifically, the second support substrate 700B includes a curved surface that is recessed toward the component transfer device 10 side.

The elastic sheet 100 of the component transfer device 10 can be bent along the curved surface of the circuit board 70B. At this time, the curved panel 30 can be used to adjust the curvature of the component transfer device 10. Specifically, the curved surface 30 matching the curved surface of the circuit board 70B is pressed from the second head 113 side of the holding pin 110 of the component transfer device 10. The elastic sheet 100 is bent with the same curvature as the curved surface of the curved plate 30 and the circuit board 70B. Since the positions of the bottom surfaces of the first element 610R, the second element 610G, and the third element 610B are also aligned and curved, the first element 610R, the second element 610G, and the third element are relatively curved with respect to the circuit board 70B including a curved surface. The alignment of the 610B is relatively easy. In addition, since the bending of the component transfer device 10 is fixed by the curved plate 30, the first component 610R, the second component 610G, and the third component 610B can be attached to the circuit board 70 stably.

The curved plate 30 can use the same material as the second supporting substrate 700B, but it is not limited to this. The curved panel 30 only needs to be able to fix the bending of the component transfer device 10.

As described above, according to another modification of the third embodiment, that is, the method of manufacturing a component module, the component 610 can be released for the circuit board 70B that includes a curved surface recessed toward the component transfer device 10 side. In the component transfer device 10, since the adhesive portion 120 adjusts the height difference of the component 610, the bottom surface of the component 610 is aligned. In addition, by using the curved plate 30 to bend the component transfer device 10, the curvature of the component transfer device 10 can be adjusted. Therefore, the alignment of the element 610 with respect to the circuit board 70B including a curved surface becomes easy. In addition, since the curved plate 30 fixes the bending of the component transfer device 10, the component 610 can be stably placed on the circuit board 70B. Therefore, if the component transfer device 10 is used to transfer the component 610 on the circuit board 70B including a curved surface, the manufacturing operation or manufacturing cost of the component module can be reduced, and the yield rate can be improved.

As an embodiment of the present invention, the above-mentioned respective embodiments can be appropriately combined and implemented as long as they do not contradict each other. In addition, based on the display device of each embodiment, those skilled in the art who appropriately add, delete, or change the configuration of the elements, or add, omit, or change the conditions are also included as long as they have the gist of the present invention. The scope of the invention.

It should be understood that other effects that are different from those obtained by the aspects of the above-mentioned embodiments, or those that can be easily predicted by those skilled in the art, can of course be obtained by the present invention from the description of this specification.

10: Component transfer device 10A: Component transfer device 20: Component transfer device 20A: Component transfer device 30: curve panel 60: Component substrate 70: Circuit board 70A: Circuit board 70B: Circuit board 100: elastic sheet 100A: elastic sheet 101: Through hole 110: keep pin 110A: Holding pin 111: Shaft 112: first head 113: 2nd head 120: Adhesive part 120A: Adhesive part 120B: The third adhesive part 120G: The second adhesive part 120R: Adhesive part 1 200: elastic sheet 200A: elastic sheet 201: Through hole 201A: Through hole 210: hold pin 210A: Holding pin 211: Shaft 211A: Shaft 212: first head 212A: 1st head 213: 2nd head 213A: 2nd head 220: Adhesive Department 220A: Adhesive part 600: 1st supporting board 610: Components 610B: 3rd element 610G: 2nd element 610R: first component 700: 2nd supporting board 700A: 2nd supporting board 700B: 2nd supporting board 710: pixel area 710B: blue light-emitting pixels 710G: Green luminous pixels 710R: Red luminous pixels 711: Pixel Circuit 720: driver circuit area 720G: Gate driver circuit 720S: Source driver circuit 721: gate wiring 722: Source Wiring 730: terminal area 730T: Terminal 731: Connection wiring 732: Connection Wiring 790: Conductive adhesive L1: interval L2: interval L3: interval S100~400: steps

Fig. 1A is a schematic plan view of a component transfer device according to an embodiment of the present invention. Fig. 1B is a schematic top view of the elastic sheet of the component transfer device according to one embodiment of the present invention. Fig. 1C is a schematic cross-sectional view of a component transfer device according to an embodiment of the present invention. 1D is a schematic cross-sectional view of the holding pin and the adhesive part of the component transfer device of one embodiment of the present invention. Fig. 1E is a schematic cross-sectional view showing a state in which the elastic sheet is stretched in the component transfer device of one embodiment of the present invention. Fig. 2A is a schematic cross-sectional view of a component transfer device according to an embodiment of the present invention. FIG. 2B is a schematic cross-sectional view showing a state of picking up components on the adhesive part in the component transfer device of one embodiment of the present invention. 2C is a schematic cross-sectional view showing the state in which the elastic sheet is stretched in the component transfer device of one embodiment of the present invention. Fig. 3A is a schematic cross-sectional view of a component transfer device according to an embodiment of the present invention. 3B is a schematic cross-sectional view of the holding pin and the adhesive part of the component transfer device of one embodiment of the present invention. 3C is a schematic cross-sectional view showing a state in which the elastic sheet is stretched in the component transfer device of one embodiment of the present invention. Fig. 4A is a schematic cross-sectional view of a component transfer device according to an embodiment of the present invention. 4B is a schematic cross-sectional view of the holding pin and the adhesive part of the component transfer device of one embodiment of the present invention. 4C is a schematic cross-sectional view showing a state in which the elastic sheet is stretched in the component transfer device of one embodiment of the present invention. Fig. 5 is a schematic perspective view of a device substrate used in a method of manufacturing a device module according to an embodiment of the present invention. FIG. 6 is a block diagram showing the layout structure of a circuit board used in a method of manufacturing a device module according to an embodiment of the present invention. FIG. 7 is a flowchart of a method of manufacturing a component module according to an embodiment of the present invention. Fig. 8A is a schematic diagram showing a manufacturing method of a device module according to an embodiment of the present invention. Fig. 8B is a schematic diagram showing a manufacturing method of a component module according to an embodiment of the present invention. Fig. 8C is a schematic diagram showing a manufacturing method of a device module according to an embodiment of the present invention. FIG. 8D is a schematic diagram showing a manufacturing method of a component module according to an embodiment of the present invention. Fig. 8E is a schematic diagram showing a manufacturing method of a component module according to an embodiment of the present invention. Fig. 8F is a schematic diagram showing a manufacturing method of a component module according to an embodiment of the present invention. Fig. 8G is a schematic diagram showing a manufacturing method of a component module according to an embodiment of the present invention. Fig. 8H is a schematic diagram showing a manufacturing method of a device module according to an embodiment of the present invention. FIG. 9 is a schematic diagram showing the state before pressing the component transfer device with the component picked up against the circuit board in the manufacturing method of the component module according to one embodiment of the present invention. FIG. 10 is a schematic diagram showing the state before pressing the component transfer device with components picked up against the circuit board in the manufacturing method of the component module according to one embodiment of the present invention.

10: Component transfer device

100: elastic sheet

101: Through hole

110: keep pin

120: Adhesive part

L1: interval

Claims (20)

A component transfer device, which includes: An elastic sheet, which includes a first through hole and a second through hole; The first holding pin, the first shaft portion of which is inserted through the first through hole; The second holding pin, the second shaft portion of which is inserted through the second through hole; The first adhesive part is provided on the above-mentioned first holding pin and adheres the first element; and The second adhesive part is provided on the second holding pin and adheres the second element. Such as the component transfer device of claim 1, wherein the interval between the first holding pin and the second holding pin can be adjusted by the expansion and contraction of the elastic sheet. The component transfer device of claim 1, wherein the material of each of the first adhesive part and the second adhesive part is an elastic material with low repellency. The component transfer device of claim 1, wherein the first adhesive portion and the second adhesive portion are deformed in such a manner that the bottom surface of the first component and the bottom surface of the second component are substantially the same, and the deformation is maintained. The component transfer device of claim 1, wherein the film thickness of the first adhesive part is different from the film thickness of the second adhesive part. The component transfer device of claim 1, wherein the first shaft portion and the second shaft portion can float in the first through hole and the second through hole, respectively. The component transfer device of claim 1, wherein each of the first through hole, the second through hole, the first shaft portion, and the second shaft portion includes a taper. Such as the component transfer device of claim 1, wherein the materials of the first holding pin and the second holding pin are different from the materials of the first adhesive part and the second adhesive part. Such as the component transfer device of claim 1, which further includes a curved panel, and The elastic sheet is bent along the curved surface of the curved plate. An element transfer device according to any one of claims 1 to 9, wherein each of the first element and the second element is an LED. A method of manufacturing a component module, which expands and contracts an elastic sheet, and changes the interval between a first holding pin inserted in the first through hole of the elastic sheet and a second holding pin inserted in the second through hole, and Adhere and pick up the first component and the second component on the first supporting substrate to each of the first adhesive portion provided on the first holding pin and the second adhesive portion provided on the second holding pin. Such as the manufacturing method of the component module of claim 11, which further The elastic sheet is expanded and contracted, and the interval between the first holding pin and the second holding pin is changed, and On the second supporting substrate, the first element adhered to the first adhesive portion and the second element adhered to the second adhesive portion are placed and released. For example, the method of manufacturing a component module of claim 11, wherein the first adhesive portion and the second adhesive portion are deformed and held in such a manner that the bottom surface of the first component is substantially consistent with the bottom surface of the second component, and is adhered and picked up The first element and the second element on the first support substrate. According to claim 11, the method for manufacturing a component module, wherein the elastic sheet is bent along the curved surface of the second supporting substrate, and the first component and the second component are released on the second supporting substrate. For example, the method for manufacturing a component module of claim 11, wherein the elastic sheet is bent along the curved surface of the curved surface substantially consistent with the curvature of the curved surface of the second support substrate, and the second support substrate is placed on the second support substrate and released. 1 element and the second element mentioned above. A method for manufacturing a component module by inserting a first holding pin inserted in a first through hole of an elastic sheet and provided with a first adhesive part, and a second through hole inserted in an elastic sheet and provided with a second The second holding pin of the adhesive part adheres and picks up the first element and the second element on the first support substrate, The elastic sheet is expanded and contracted, and the interval between the first holding pin and the second holding pin is changed, and On the second support substrate, the first element and the second element are placed and released. For example, the manufacturing method of the component module of claim 16, wherein the first adhesive portion and the second adhesive portion are deformed and held in such a way that the bottom surface of the first component is substantially consistent with the bottom surface of the second component, and the adhesive is adhered and picked up The first element and the second element on the first support substrate. The method for manufacturing a component module according to claim 16, wherein the elastic sheet is bent along the curved surface of the second supporting substrate, and the first component and the second component are released on the second supporting substrate. For example, the method of manufacturing a component module of claim 16, wherein the elastic sheet is bent along the curved surface of a curved surface substantially consistent with the curvature of the curved surface of the second support substrate, and the second support substrate is placed on the second support substrate and released. 1 element and the second element mentioned above. The method for manufacturing a component module according to any one of claims 11 to 19, wherein each of the first component and the second component is an LED.

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