TW202143512A - Transfer substrate - Google Patents

Abstract

The problem of this embodiment is to provide a transfer substrate that can improve the transfer efficiency of the light-emitting element. The transfer substrate of this embodiment temporarily holds the light-emitting element, and has a holding surface contacting the terminal side of the light-emitting element, and the holding surface is an adhesive concave-convex surface.

Description

Transfer substrate

The embodiment of the present invention relates to a transfer substrate.

In recent years, various light-emitting devices constructed by arranging tiny-sized light-emitting elements have been proposed. Such a light-emitting element is, for example, after being formed on a substrate for forming an element, it is temporarily held on another holding substrate, and finally mounted on a wiring substrate. When transferring the light-emitting element from the element-forming substrate to the holding substrate, as an example, a technique is known in which the light-emitting element is peeled from the element-forming substrate by sucking the light-emitting element with a suction jig.

In the manufacturing steps of such a light-emitting device, when the light-emitting element on a certain substrate is transferred to another substrate, it is desirable to smoothly perform the peeling of the light-emitting element from one substrate and the transfer of the light-emitting element to the other substrate.

In this specification, at least one of the substrates temporarily holding the light-emitting element is referred to as a transfer substrate.

The purpose of this embodiment is to provide a transfer substrate that can improve the transfer efficiency of the light-emitting element.

Transmission board of one embodiment The transfer substrate for temporarily holding the light-emitting element has a holding surface contacting the terminal side of the light-emitting element, and the holding surface is an adhesive concave-convex surface.

Transmission board of one embodiment The transfer substrate temporarily holding the light-emitting element has a holding surface in contact with the terminal side of the light-emitting element, and when the light-emitting element is held on the holding surface, the holding surface has a plurality of protrusions overlapping with one light-emitting element Department.

Transmission board of one embodiment The transfer substrate temporarily holding the light-emitting element has a holding surface in contact with the terminal side of the light-emitting element, and when the light-emitting element is held on the holding surface, the holding surface has a plurality of recesses overlapping with one light-emitting element .

According to this embodiment, it is possible to provide a transfer substrate capable of improving the transfer efficiency of the light-emitting element.

Hereinafter, the present embodiment will be described with reference to the drawings. Furthermore, the disclosure is only an example at the end, and those skilled in the art can easily think of appropriate changes to maintain the gist of the invention, and of course they are included in the scope of the present invention. In addition, in order to make the description more clear, the drawings may show the width, thickness, shape, etc. of each part schematically compared with the actual state. However, it is only an example in the end and does not limit the interpretation of the present invention. By. In addition, in this specification and the figures, there are the following situations, that is, with regard to the figures that have appeared, the same reference signs are assigned to the constituent elements that perform the same or similar functions as the aforementioned elements, and repeated detailed descriptions are appropriately omitted. .

FIG. 1 is a diagram for explaining the light-emitting device 1. The light-emitting device 1 described in this embodiment is, for example, a display device that displays an image, a lighting device, or the like.

The light-emitting device 1 includes a wiring board 2 and a plurality of light-emitting elements 3. The wiring substrate 2 is provided with various wirings such as scanning lines, signal lines, and power supply lines on a base substrate such as a glass substrate or a resin substrate. Such a wiring substrate 2 has a plurality of transistors for driving the light-emitting elements 3, and is sometimes referred to as a TFT substrate, an array substrate, a backplane, or the like. Each of the light-emitting elements 3 is mounted on the wiring board 2. The light-emitting elements 3 are arranged in a matrix on the wiring substrate 2. The light-emitting element 3 is, for example, a light-emitting diode (LED) of an extremely small size, such as a small LED or a micro LED. The light emitting element 3 has a substantially square planar shape or a substantially rectangular planar shape. For example, the length of one side of the micro LED is less than 100 μm, and the length of one side of the small LED is greater than 100 μm.

In the example shown in FIG. 1, as the light-emitting element 3, a red light-emitting element 3R that emits red, a green light-emitting element 3G that emits green, and a blue light-emitting element 3B that emits blue are arranged in one direction.

2 and 3 are diagrams showing an example of the manufacturing method of the light-emitting device 1 shown in FIG. 1.

First, as shown in (A) of FIG. 2, a plurality of light-emitting elements 3 attached to the support 4 are prepared. The plurality of light-emitting elements 3 are arranged at a specific pitch. The light-emitting element 3 has terminals 3T corresponding to the anode and the cathode, and a first light-emitting surface 3E. The light emitting element 3 is attached to the support 4 on the side of the terminal 3T. The first light-emitting surface 3E is located on the upper surface side opposite to the terminal 3T (or opposite to the support 4).

Next, as shown in (B) of FIG. 2, the sheet member 5 is attached to the side of the first light-emitting surface 3E of the light-emitting element 3. That is, the light-emitting element 3 is temporarily located between the support 4 and the sheet member 5, and then to both the support 4 and the sheet member 5. Furthermore, before the sheet member 5 is attached to the light-emitting element 3, the arrangement pitch of the light-emitting element 3 on the support 4 can be changed. Thereafter, in a state where the adhesive force between the light-emitting element 3 and the sheet member 5 is greater than the adhesive force between the light-emitting element 3 and the support 4, the support 4 is peeled off from the light-emitting element 3.

Thereby, as shown in FIG. 2(C), the state where the sheet member 5 is attached to the side of the first light-emitting surface 3E of the light-emitting element 3 is maintained, and on the other hand, the side of the terminal 3T is exposed.

Next, as shown in (D) of FIG. 2, the light-emitting element 3 is placed on the transfer substrate 10. The details of the transfer substrate 10 will be described later. The transfer substrate 10 has an adhesive holding surface 10A that is in contact with the side of the terminal 3T of the light-emitting element 3. Furthermore, before the light-emitting elements 3 are placed on the transfer substrate 10, the arrangement pitch of the light-emitting elements 3 on the sheet member 5 can be changed. If necessary, after the light-emitting element 3 is placed on the transfer substrate 10, treatment (for example, ultraviolet irradiation treatment) for reducing the adhesion between the light-emitting element 3 and the sheet member 5 may be added. After that, in a state where the adhesive force between the light-emitting element 3 and the sheet member 5 is smaller than the adhesive force between the light-emitting element 3 and the transfer substrate 10, the sheet member 5 is peeled off from the light-emitting element 3.

Thereby, as shown in FIG. 3(E), the state where the transfer substrate 10 is next to the terminal 3T of the light-emitting element 3 is maintained, and on the other hand, the side of the first light-emitting surface 3E is exposed.

Then, as shown in (F) of FIG. 3, the light-emitting element 3 is picked up from the transfer substrate 10 using the picking jig 100. The jig 100 is, for example, a vacuum suction jig, which absorbs the first light-emitting surface 3E of the light-emitting element 3. Then, by moving the jig 100 to the side away from the transfer substrate 10, the light-emitting element 3 is peeled off from the holding surface 10A of the transfer substrate 10.

Next, as shown in (G) of FIG. 3, the light-emitting element 3 adsorbed by the jig 100 is moved above the wiring substrate 2, and the light-emitting element 3 is mounted on a specific position of the wiring substrate 2. The so-called mounting is equivalent to electrically connecting each of the anode terminal and the cathode terminal of the light-emitting element 3 to the anode electrode and the cathode electrode provided on the wiring substrate 2. Furthermore, in (F) and (G) of FIG. 3, it is shown that the fixture 100 transmits one light-emitting element 3, but the fixture 100 can transmit a plurality of light-emitting elements 3 in batches.

Next, the transfer substrate 10 will be described.

FIG. 4 is a perspective view showing an example of the configuration of the transfer substrate 10. In the transfer substrate 10, the holding surface 10A for holding the light-emitting element 3 is an adhesive concave-convex surface. In the configuration example shown in FIG. 4, the holding surface 10A has a plurality of convex portions 10V protruding from the base portion 10B. Each of the convex portions 10V is formed in a substantially hemispherical shape. The plurality of convex portions 10V are arranged in a matrix in the first direction X and the second direction Y. In addition, the shape of the convex portion 10V is not limited to the example shown in the figure, and may be a cone shape, a pyramid shape, a truncated cone shape, a truncated cone shape, or the like. In addition, the arrangement of the convex portions 10V is not limited to the example shown in the figure, and may be a densest packing arrangement, a staggered arrangement, a random arrangement, or the like.

In the state where the light-emitting element 3 shown by the broken line in the figure is held on the holding surface 10A, one light-emitting element 3 and a plurality of convex portions 10V arranged in the first direction X and a plurality of convex parts 10V arranged in the second direction Y The convex portions 10V overlap.

In such a transfer substrate 10, the base portion 10B and the convex portion 10V may be formed of the same material, or may be formed of different materials. At least the convex portion 10V in the transmission substrate 10 is formed using, for example, a self-adhesive and elastic material such as silicon-based, acrylic-based, epoxy-based, or the like. In this embodiment, the entire transfer substrate 10 is formed of the same material. As a method of manufacturing the transfer substrate 10, for example, a method of molding using materials such as ultraviolet curing type, heat curing type, moisture curing type, etc., a method of irradiating a flat substrate with laser light, or forming a flat substrate The surface of the substrate is sandblasted.

FIG. 5 is a cross-sectional view showing a configuration example of the transfer substrate 10. Here, the figure shows a cross section of the transfer substrate 10 along the line A-B shown in FIG. 4. The cross-sectional shape of the convex portion 10V is semicircular.

First, focus on the width W of the convex portion 10V. The width W here corresponds to the length of the convex portion 10V along the first direction X. In the case where the convex portion 10V is formed in a hemispherical shape as shown in FIG. 4, the width W corresponds to the diameter of the convex portion 10V in a plan view. The width W1 of the bottom side (side close to the base portion 10B) of the convex portion 10V is greater than the width W2 (W1>W2) of the top side (the side opposite to the bottom or the side connected to the light-emitting element 3) of the convex portion 10V. The width W at the bottom of the convex portion 10V (the portion connected to the base portion 10B) is, for example, 1 to 200 μm. The width W of one convex portion 10V is set such that a plurality of convex portions 10V overlap one light-emitting element 3 and the size of the light-emitting element 3 is taken into consideration. For example, if the light emitting element 3 is a small LED, the width W is desirably 10 to 50 μm. Moreover, if the light emitting element 3 is a micro LED, the width W is desirably 2 to 25 μm.

Next, focus on the height H of the convex portion 10V. The height H here corresponds to the length of the portion protruding from the base portion 10B along the third direction (the normal line direction of the base portion 10B) Z. The height H is greater than the height Ht of the terminal 3T of the light-emitting element 3 (H>Ht), for example, 0.5 to 50 μm. If the light emitting element 3 is a small LED, the height H is desirably 10 to 50 μm. In addition, if the light emitting element 3 is a micro LED, the height H is desirably 0.5 to 25 μm.

Next, focus on the pitch P of the adjacent convex portions 10V. The pitch P here is the length along the first direction X between the tops of the adjacent convex portions 10V in the first direction X. The pitch P is, for example, 100 μm or less. The pitch P is set in such a way that a plurality of convex portions 10V overlap one light-emitting element 3, taking into consideration the size of the light-emitting element 3, etc., and is set. For example, when the light-emitting element 3 is a small LED, the pitch P is desirably greater than or equal to the width W of the convex portion 10V and less than or equal to 100 μm. In addition, when the light-emitting element 3 is a micro LED, the pitch P is desirably greater than or equal to the width W of the convex portion 10V and less than or equal to 50 μm. In the case where the adjacent protrusions 10V are arranged in such a way that they are connected at their bottoms, the pitch P and the width W are equal.

From another point of view, the above-mentioned concave-convex surface, that is, the holding surface 10A, can be regarded as having a concave portion 10C between adjacent convex portions 10V.

In the configuration example shown in FIG. 5, the plurality of convex portions 10V all have the same shape, but the plurality of convex portions 10V may include convex portions 10V having different shapes. In addition, the adjacent convex portions 10V may have different widths, or may have different heights.

FIG. 6 is a diagram for explaining the transfer step of the light-emitting element 3 in the transfer substrate 10.

(A) of FIG. 6 is a diagram showing the step shown in (D) of FIG. 2, that is, the step of placing the light-emitting element 3 on the transfer substrate 10. When the light-emitting element 3 attached to the sheet member 5 is pressed toward the transfer substrate 10, the holding surface 10A deforms in such a manner that the convex portion 10V collapses. Thereby, the adhesive force between the light-emitting element 3 and the transmission substrate 10 is greater than the adhesive force between the light-emitting element 3 and the sheet member 5 to ensure the contact area between the light-emitting element 3 and the holding surface 10A. Therefore, the sheet member 5 can be easily peeled from the light-emitting element 3. The adhesion between the light-emitting element 3 and the transfer substrate 10 can be achieved by the contact area between the light-emitting element 3 and the holding surface 10A (or, by pressing the light-emitting element 3 toward the transfer substrate 10) in addition to the adhesive force of the self-adhesive holding surface 10A. Force) while adjusting.

FIG. 6(B) is a diagram showing the step shown in FIG. 3(F), that is, the step of extracting the light-emitting element 3 from the transfer substrate 10. After the light-emitting element 3 is transferred from the sheet member 5 to the transfer substrate 10, since the shape of the convex portion 10V is restored, the contact area between the light-emitting element 3 and the holding surface 10A is reduced. That is, the adhesive force between the light-emitting element 3 and the transmission substrate 10 is reduced. Therefore, when using the jig 100 to capture the light-emitting element 3, a weak force can be used to capture it.

As a comparative example, in a case where the holding surface 10A of the transfer substrate 10 is flat, the holding surface 10A and the surface on the terminal side of the light-emitting element 3 are substantially in contact with each other. Therefore, the adhesive force of the light-emitting element 3 in the holding surface 10A depends on the physical properties of the material constituting the holding surface 10A. In this case, in the extraction step of the light-emitting element 3 as shown in (F) of FIG. 3, when the adhesion force between the light-emitting element 3 and the transmission substrate 10 is too strong, the light-emitting element 3 cannot be captured smoothly, and It is necessary to enhance the adsorption force of the jig 100 or the adhesion force between the jig 100 and the light-emitting element 3.

According to this embodiment, by applying the transfer substrate 10 having the concave and convex surface, that is, the holding surface 10A, the light-emitting element 3 can be smoothly transferred to the transfer substrate 10, and the transfer efficiency of the light-emitting element can be improved.

Next, another configuration example of the transfer substrate 10 will be described.

FIG. 7 is a cross-sectional view showing another example of the structure of the transfer substrate 10.

FIG. 7(A) shows the transfer substrate 10 in which the cross-sectional shape of the convex portion 10V is a semi-ellipse.

FIG. 7(B) shows the transmission substrate 10 in which the cross-sectional shape of the convex portion 10V is a triangle. When the convex portion 10V is formed in a cone shape or a pyramid shape, it is formed into a triangular cross-sectional shape as shown in the figure.

FIG. 7(C) shows the transfer substrate 10 in which the cross-sectional shape of the convex portion 10V is a trapezoid. When the convex portion 10V is formed in a truncated cone shape or a truncated cone shape, it is formed into a trapezoidal cross-sectional shape as shown in the figure.

FIG. 8 is a cross-sectional view showing another example of the structure of the transfer substrate 10. The configuration example shown in FIG. 8 is different from the configuration example shown in FIG. 5 in that adjacent convex portions 10V are arranged with gaps. In such a configuration example, the pitch P of the adjacent convex portions 10V is larger than the width W of the convex portions 10V, and is preferably 100 μm or less.

Here, the cross-sectional shape of the convex portion 10V is semicircular, but it may be semi-elliptical, triangular, trapezoidal, etc., as shown in FIG. 7.

FIG. 9 is a perspective view showing another configuration example of the transfer substrate 10. The configuration example shown in FIG. 9 is different from the configuration example shown in FIG. 4 in that the convex portion 10V has a shape extending in one direction. Here, the plurality of convex portions 10V are arranged in the first direction X, and each of the convex portions 10V extends in the second direction Y. The adjacent convex portions 10V are arranged in contact with each other, but they may also be arranged with gaps as in the configuration example shown in FIG. 8. Moreover, in the X-Z plane, the cross-sectional shape of the convex portion 10V is semicircular, but it may also be semi-elliptical, triangular, trapezoidal, or the like.

FIG. 10 is a perspective view showing another example of the structure of the transfer substrate 10. As with the configuration example shown in FIG. 4, in the transfer substrate 10, the holding surface 10A holding the light-emitting element 3 is an adhesive concave-convex surface. The holding surface 10A has a plurality of recesses 10C. Each of the recesses 10C is formed in a substantially hemispherical shape, but the shape of the recesses 10C is not limited to the example shown in the figure, and may be a cone shape, a pyramid shape, a truncated cone shape, a truncated cone shape, or the like. The plurality of recesses 10C are arranged in a matrix in the first direction X and the second direction Y, but the arrangement of the recesses 10C is not limited to the example shown in the figure, and may be a densest packing arrangement, a staggered arrangement, a random arrangement, etc.

In the figure, in the state where the light-emitting element 3 shown by the dotted line is held on the holding surface 10A, one light-emitting element 3 and a plurality of recesses 10C arranged in the first direction X, and a plurality of recesses arranged in the second direction Y 10C overlap.

FIG. 11 is a cross-sectional view showing a configuration example of the transfer substrate 10. Here, the figure shows a cross section of the transfer substrate 10 along the line C-D shown in FIG. 10. The cross-sectional shape of the recess 10C is semicircular.

First, focus on the width W of the recess 10C. The width W here corresponds to the length of the recess 10C along the first direction X. In the case where the recess 10C is formed in a hemispherical shape as shown in FIG. 10, the width W corresponds to the diameter of the recess 10C in a plan view. The width W1 of the bottom side of the recess 10C is smaller than the width W2 of the upper side of the recess 10C (W2>W1). The width W of the upper portion of the concave portion 10C is the same as the width W of the convex portion 10V described with reference to FIG. 5, and is, for example, 1 to 200 μm.

Next, focus on the height (or depth) H of the recess 10C. The height H here corresponds to the length along the third direction Z. The height H of the concave portion 10C is the same as the height H of the convex portion 10V, and is, for example, 0.5 to 50 μm.

Next, focus on the pitch P of the adjacent recesses 10C. The pitch P here corresponds to the length along the first direction X between the bottoms of the recesses 10C adjacent in the first direction X. The pitch P of the concave portion 10C is the same as the pitch P of the convex portion 10V, and is, for example, the width W of the concave portion 10C or more and 100 μm or less.

From another point of view, the above-mentioned uneven surface, that is, the holding surface 10A, can be regarded as having a convex portion 10V between adjacent concave portions 10C.

In the configuration example shown in FIG. 11, the plurality of recesses 10C all have the same shape, but the plurality of recesses 10C may include recesses 10C having different shapes. In addition, the adjacent recesses 10C may have different widths, or may have different heights.

FIG. 12 is a cross-sectional view showing another example of the structure of the transfer substrate 10.

FIG. 12(A) shows the transfer substrate 10 in which the cross-sectional shape of the recess 10C is a semi-ellipse.

FIG. 12(B) shows the transmission substrate 10 in which the cross-sectional shape of the concave portion 10C is a triangle. When the recess 10C is formed in a cone shape or a pyramid shape, it is formed into a triangular cross-sectional shape as shown in the figure.

FIG. 12(C) shows the transfer substrate 10 in which the cross-sectional shape of the recess 10C is a trapezoid. When the recess 10C is formed in a truncated cone shape or a truncated cone shape, it is formed into a trapezoidal cross-sectional shape as shown in the figure.

FIG. 13 is a cross-sectional view showing another example of the structure of the transfer substrate 10. The configuration example shown in FIG. 13 is different from the configuration example shown in FIG. 11 in that the adjacent recesses 10C are arranged with gaps. In such a configuration example, the pitch P of the adjacent recesses 10C is larger than the width W of the recesses 10C, and is preferably 100 μm or less.

Here, the cross-sectional shape of the recess 10C is a semicircle, but as shown in FIG. 12, it may be a semi-ellipse, a triangle, a trapezoid, or the like.

FIG. 14 is a perspective view showing another configuration example of the transfer substrate 10. The configuration example shown in FIG. 14 is different from the configuration example shown in FIG. 10 in that the recessed portion 10C has a shape extending in one direction. Here, the plurality of recesses 10C are arranged in the first direction X, and each of the recesses 10C extends in the second direction Y. The adjacent recesses 10C are arranged in contact with each other, but they may also be arranged with gaps as in the configuration example shown in FIG. 13. Moreover, in the X-Z plane, the cross-sectional shape of the recess 10C is semicircular, but it may also be semi-elliptical, triangular, trapezoidal, or the like.

In the other configuration examples described with reference to FIGS. 7 to 14 described above, the same effects as the configuration examples shown in FIG. 4 and the like can also be obtained.

As described above, according to this embodiment, it is possible to provide a transfer substrate capable of improving the transfer efficiency of the light-emitting element.

In addition, the present invention is not limited to the above-mentioned embodiment itself, and the constituent elements may be changed and embodied in the implementation stage without departing from the scope of the spirit thereof. In addition, various inventions can be formed by appropriate combinations of a plurality of constituent elements disclosed in the above-mentioned embodiments. For example, it is possible to omit several constituent elements from all the constituent elements shown in the embodiment. Furthermore, it is also possible to appropriately combine the constituent elements of different embodiments. [Cross-reference of related applications]

The present invention is based on Japanese Patent Application No. 2020-011030 filed on January 27, 2020 and claims its priority. The entire content of the Japanese Patent Application is incorporated herein by reference.

1: Light-emitting device 2: Wiring board 3: Light-emitting element 3B: Blue light-emitting element 3G: Green light emitting element 3R: Red light-emitting element 3E: The first light-emitting surface 3T: Terminal 4: Support 5: Sheet member 10: Transfer substrate 10A: Keep the surface 10B: base part 10C: recess 10V: convex 100: Fixture A-B, C-D: line H, Ht: height P: Pitch W, W1, W2: width X: 1st direction Y: 2nd direction Z: 3rd direction

FIG. 1 is a diagram for explaining the light-emitting device 1. 2(A) to (D) are diagrams showing an example of a method of manufacturing the light-emitting device 1 shown in FIG. 1. 3(E) to (G) are diagrams showing an example of a method of manufacturing the light-emitting device 1 shown in FIG. 1. FIG. 4 is a perspective view showing an example of the configuration of the transfer substrate 10. FIG. 5 is a cross-sectional view showing a configuration example of the transfer substrate 10. 6(A) and (B) are diagrams for explaining the transfer steps of the light-emitting element 3 in the substrate 10. 7(A) to (C) are cross-sectional views showing another example of the structure of the transfer substrate 10. FIG. 8 is a cross-sectional view showing another example of the structure of the transfer substrate 10. FIG. 9 is a perspective view showing another configuration example of the transfer substrate 10. FIG. 10 is a perspective view showing another example of the structure of the transfer substrate 10. FIG. 11 is a cross-sectional view showing a configuration example of the transfer substrate 10. 12(A) to (C) are cross-sectional views showing another example of the structure of the transfer substrate 10. FIG. 13 is a cross-sectional view showing another example of the structure of the transfer substrate 10. FIG. 14 is a perspective view showing another configuration example of the transfer substrate 10.

3: Light-emitting element

10: Transfer substrate

10A: Keep the surface

10B: base part

10V: convex

A-B: line

X: 1st direction

Y: 2nd direction

Z: 3rd direction

Claims (15)

A transfer substrate that temporarily holds the light-emitting element, and It has a holding surface in contact with the terminal side of the light-emitting element, The aforementioned retaining surface is an adhesive concave-convex surface. Such as the transfer substrate of claim 1, wherein in the state where the light-emitting element is held on the aforementioned holding surface, The holding surface has a plurality of convex portions overlapping with one light-emitting element. Such as the transmission substrate of claim 2, wherein the width of the bottom side is greater than the width of the top side in the cross section of the aforementioned convex portion. Such as the transmission substrate of claim 3, wherein the width of the aforementioned convex portion is 2 to 50 μm. Such as the transmission substrate of claim 3, wherein the height of the aforementioned convex portion is 0.5 to 50 μm. The transfer substrate of claim 3, wherein the pitch of the adjacent protrusions is 100 μm or less. Such as the transmission substrate of claim 3, wherein the cross-sectional shape of the aforementioned convex portion is any one of a semicircle, a semiellipse, a triangle, and a trapezoid. Such as the transfer substrate of claim 1, wherein in the state where the light-emitting element is held by the holding surface, The holding surface has a plurality of recesses overlapping with one light-emitting element in a plan view. Such as the transfer substrate of claim 8, wherein in the cross section of the aforementioned recess, the width of the bottom part is smaller than the width of the upper part. Such as the transfer substrate of claim 8, wherein the width of the aforementioned recess is 2 to 50 μm. Such as the transfer substrate of claim 8, wherein the height of the aforementioned recess is 0.5 to 50 μm. The transfer substrate of claim 8, wherein the pitch of the adjacent recesses is 100 μm or less. Such as the transmission substrate of claim 8, wherein the cross-sectional shape of the aforementioned recess is any one of a semicircle, a semiellipse, a triangle, and a trapezoid. A transfer substrate that temporarily holds the light-emitting element, and It has a holding surface in contact with the terminal side of the light-emitting element, In the state where the light-emitting element is held on the aforementioned holding surface, The holding surface has a plurality of convex portions overlapping with one light-emitting element. A transfer substrate that temporarily holds the light-emitting element, and It has a holding surface in contact with the terminal side of the light-emitting element, In the state where the light-emitting element is held on the aforementioned holding surface, The holding surface has a plurality of recesses overlapping with one light-emitting element.

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