TW202111332A - Test probe, method of manufacturing the same, and test socket supporting the same - Google Patents
Test probe, method of manufacturing the same, and test socket supporting the same Download PDFInfo
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- 238000012360 testing method Methods 0.000 title claims abstract description 89
- 239000000523 sample Substances 0.000 title claims abstract description 54
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000000034 method Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/0675—Needle-like
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N17/00—Diagnosis, testing or measuring for television systems or their details
- H04N17/002—Diagnosis, testing or measuring for television systems or their details for television cameras
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- General Health & Medical Sciences (AREA)
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- General Engineering & Computer Science (AREA)
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- Computer Hardware Design (AREA)
- Measuring Leads Or Probes (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
Description
本揭露是有關於一種對待測試裝置(例如相機模組)的電性特性進行測試的測試探針、其製造方法以及支持其之測試座。The disclosure relates to a test probe for testing the electrical characteristics of a device to be tested (such as a camera module), a manufacturing method thereof, and a test seat supporting the test probe.
應用於小型行動裝置的超小型相機模組具有連接件10,連接件10具有部分圓柱形的接觸端子12,如圖1中所示。藉由將金屬片(metal strip)彎曲成部分圓柱形狀來形成接觸端子12。在連接件10的測試中,彈簧插針(pogo pin)的柱塞(plunger)與接觸端子12接觸。The ultra-compact camera module applied to a small mobile device has a
一般而言,彈簧插針的柱塞具有一或多個尖端(tip),以在測試中接觸由鉛形成的凸塊端子。當接觸具有彎曲凸起形狀的接觸端子12時,柱塞的尖端可能因滑動而導致接觸誤差。為解決此問題,本發明人提出一種具有叉形柱塞的測試探針,如韓國專利第10-1920824號中所揭露的。叉形柱塞具有V形接觸面,且可容置待測試端子,以與用於測試的端子進行表面接觸。Generally speaking, the plunger of the pogo pin has one or more tips to contact bump terminals formed of lead during testing. When contacting the
然而,在進行多次重複測試之後,外來材料被轉移至此種傳統測試探針的接觸表面且在所述接觸表面上累積,且因此接觸電阻增大,此是有問題的。另外,藉由具有待測試端子的兩個表面接觸點執行測試。然而,由於累積的外來材料,表面接觸點的接觸電阻異常增大,且因此測試的可靠性會降低。因此,正常的相機模組可能被辨識為有缺陷。外來材料的此種累積或測試探針與接觸端子之間的不穩定接觸會導致設備維護或清潔、錯誤讀數等,因此對大規模生產良率具有負面影響。However, after performing multiple repeated tests, foreign materials are transferred to and accumulated on the contact surface of such a conventional test probe, and therefore the contact resistance increases, which is problematic. In addition, the test is performed by two surface contact points with terminals to be tested. However, due to accumulated foreign materials, the contact resistance of the surface contact points is abnormally increased, and therefore the reliability of the test may be reduced. Therefore, a normal camera module may be identified as defective. Such accumulation of foreign materials or unstable contact between the test probe and the contact terminal can cause equipment maintenance or cleaning, false readings, etc., and therefore have a negative impact on mass production yield.
一或多個示例性實施例的態樣提供一種用於減少外來材料的轉移及累積並改善測試的可靠性的測試探針、其製造方法以及支持其之測試座。Aspects of one or more exemplary embodiments provide a test probe for reducing the transfer and accumulation of foreign materials and improving the reliability of the test, a manufacturing method thereof, and a test seat supporting the same.
本文提供一種對待測試裝置進行測試的測試探針。所述測試探針包括線接觸部分,所述線接觸部分包括第一接觸線組及第二接觸線組,所述第一接觸線組及所述第二接觸線組各自包括線性地延伸且彼此間隔開的兩條接觸線,其中所述第一接觸線組與所述第二接觸線組被設置成V形或U形。This article provides a test probe for testing the device to be tested. The test probe includes a wire contact portion, the wire contact portion includes a first contact wire group and a second contact wire group, each of the first contact wire group and the second contact wire group includes linearly extending and mutually Two spaced-apart contact wires, wherein the first contact wire group and the second contact wire group are arranged in a V shape or a U shape.
在所述兩條接觸線之間的空間中可提供有凹陷部分。A recessed portion may be provided in the space between the two contact lines.
所述凹陷部分可沿所述接觸線的延伸方向具有均勻的曲率。The recessed portion may have a uniform curvature along the extending direction of the contact line.
所述線接觸部分可包括一或多個其他接觸線組,所述一或多個其他接觸線組包括線性地延伸且彼此間隔開的兩條接觸線。The line contact portion may include one or more other contact line groups including two contact lines extending linearly and spaced apart from each other.
本文提供一種製造測試探針的方法。所述方法包括:提供圓柱形構件;在所述構件的端部上在縱向方向上形成凹陷;以及對所述端部執行平面切割,以留下包括所述構件的中心軸線的預定寬度。This article provides a method of manufacturing test probes. The method includes: providing a cylindrical member; forming a depression in a longitudinal direction on an end of the member; and performing plane cutting on the end to leave a predetermined width including a center axis of the member.
所述凹陷可包括圓錐或半球。The depression may include a cone or a hemisphere.
所述方法可更包括:在所述凹陷的頂點處在所述縱向方向上形成孔。The method may further include: forming a hole in the longitudinal direction at the apex of the recess.
本文提供一種對待測試裝置進行測試的測試座。所述測試座包括:測試探針,包括線接觸部分,所述線接觸部分包括第一接觸線組及第二接觸線組,所述第一接觸線組及所述第二接觸線組各自包括線性地延伸且彼此間隔開的兩條接觸線;以及探針支持件,被配置成支持所述測試探針 其中所述第一接觸線組與所述第二接觸線組被設置成V形或U形。This article provides a test socket for testing the device to be tested. The test socket includes: a test probe, including a line contact part, the line contact part includes a first contact line group and a second contact line group, the first contact line group and the second contact line group each include Two contact wires extending linearly and spaced apart from each other; and a probe support member configured to support the test probe The first contact line group and the second contact line group are arranged in a V shape or a U shape.
在下文中,將參照附圖詳細闡述根據本揭露的第一實施例的測試探針40、其製造方法以及測試座。Hereinafter, the
圖1示出待測試裝置(例如相機模組)的連接件10。連接件10可包括待測試的接觸點12,接觸點12藉由將金屬板彎曲成「U」形而具有部分圓柱形形狀。FIG. 1 shows a connecting
圖2是根據本揭露的第一實施例的探針40的線接觸部分20的詳細透視圖。FIG. 2 is a detailed perspective view of the
參照圖2,線接觸部分20可包括V形端部22、自V形端部22成一體地延伸的凸緣24、以及自凸緣24成一體地延伸的延伸部26。2, the
V形端部22可包括V形接觸部分221,V形接觸部分221在測試中與待測試接觸點進行線接觸。The V-
V形接觸部分221可包括第一接觸線組222及第二接觸線組223,第一接觸線組222及第二接觸線組223中的每一者具有線性地延伸且彼此間隔開的兩條接觸線。第一接觸線組222及第二接觸線組223中的每一者可延伸成使得兩條接觸線以一定間隔並排向下傾斜。第一接觸線組222與第二接觸線組223可在中心處會聚於一個點上。V形接觸部分221可包括設置在四個邊緣處的四條接觸線。因此,在測試中,待測試接觸點可與V形接觸部分221的所述四條接觸線進行線接觸。The V-
V形端部22可包括第一凹陷部分224及第二凹陷部分225,第一凹陷部分224沿第一凹陷部分224的延伸方向在第一接觸線組222的所述兩條接觸線之間具有均勻的曲率,第二凹陷部分225沿第二凹陷部分225的延伸方向在第二接觸線組223的所述兩條接觸線之間具有均勻的曲率。The V-
V形端部22可包括凹入部分226,凹入部分226在第一接觸線組222與第二接觸線組223會聚的點處在縱向方向上延伸。The V-
V形端部22可具有板狀,所述板狀具有適合於設置在待測試裝置中的待測試接觸點的節距的厚度。The V-
凸緣24可成一體地自V形端部22向後延伸。凸緣24可被形成為板狀,所述板狀具有較V形端部22大的寬度,以改善強度。另外,凸緣24可被形成為板狀,以防止在測試中旋轉。The
延伸部26可自凸緣24成一體地向後延伸。具有圓柱形形狀的延伸部26可接觸第一柱塞(34)的端部。此處,可省略延伸部26,且凸緣24可與第一柱塞(34)成一體地形成。延伸部26並非僅限於圓柱形形狀,且可具有各種形狀。The
具有部分圓柱形形狀的待測試接觸點容置於V形接觸部分221的第一接觸線組222與第二接觸線組223之間,且接觸四個接觸點P1、P2、P3及P4。因此,即使當因對準誤差及容差而出現所述四個接觸點P1、P2、P3及P4的位置誤差時,在V形接觸部分221與待測試接觸點之間將出現接觸誤差的機率亦可降低。另外,即使當外來材料因重複測試而被轉移至所述四個尖銳的線性接觸點P1、P2、P3及P4時,轉移的外來材料仍被推至第一凹陷部分224及第二凹陷部分225或被推出,使得外來材料不會在所述四個接觸點P1、P2、P3及P4處累積。具體而言,待測試接觸點接觸多個接觸點(例如四個接觸點P1、P2、P3及P4),且因此可減小接觸電阻。The contact point to be tested having a partial cylindrical shape is accommodated between the first
一般而言,待測試裝置的待測試接觸點被設置成具有非常窄的節距。因此,慮及待測試的多個接觸點具有窄的節距,V形端部22可被形成為具有窄的寬度的板狀。另外,凸緣24可被形成為具有較V形端部22寬的寬度的板狀,以改善強度。Generally speaking, the contact points to be tested of the device to be tested are set to have a very narrow pitch. Therefore, considering that the plurality of contact points to be tested have a narrow pitch, the V-
可使用整體具有均勻厚度的板製造線接觸部分20,但強度及耐久性可能會降低。因此,僅V形端部22可具有小的厚度,以避免相鄰的待測試接觸點的干擾,且其餘部分可被處理成具有較大寬度的凸緣24或延伸部26。The
以下將參照圖3闡述製造圖2所示線接觸部分20的方法。Hereinafter, a method of manufacturing the
圖3是示意性地示出根據本揭露實施例的製造線接觸部分20的方法的一組圖。FIG. 3 is a set of diagrams schematically showing a method of manufacturing the
在步驟S11中,提供與線接觸部分20的長度對應的圓柱形構件21。In step S11, a
在步驟S12中,使用V形鑽在圓柱形構件21的一個端部處在縱向方向上形成凹陷212,例如圓錐或半球。In step S12, a V-shaped drill is used to form a
在步驟S13中,使用直鑽在凹陷212的頂點處在縱向方向上形成孔214。In step S13, a
在步驟S14中,使用切割工具對端部執行第一平面處理及第二平面處理,以留下包括圓柱形構件21的中心軸線的預定寬度。可藉由第一平面處理形成V形端部22,且可藉由第二平面處理形成凸緣24。In step S14, a cutting tool is used to perform the first plane processing and the second plane processing on the end to leave a predetermined width including the central axis of the
如上所述,在圓柱形構件21的端部處形成凹陷212之後,僅執行平面切割以留下包括中心軸線的預定寬度,使得可輕易地形成具有第一接觸線組222及第二接觸線組223的V形接觸部分221。As described above, after the
圖4是根據本揭露的第一實施例的測試探針40的透視圖。FIG. 4 is a perspective view of the
參照圖4,測試探針40可包括線接觸部分20及彈簧插針30。Referring to FIG. 4, the
由於線接觸部分20相同於圖2中所示的結構,因此將不再對其予以贅述。Since the
彈簧插針30可包括圓柱形的筒32、部分地容置於筒32的一側中的第一柱塞34、以及部分地容置於筒32的另一側中且接觸例如測試基板的焊盤的第二柱塞36。The
筒32可包括在筒32中介於第一柱塞34與第二柱塞36之間的彈簧。第一柱塞34及第二柱塞36中的至少一者可被支持,以藉由筒32中的彈簧的壓縮或恢復而彈性滑動。The
在測試中,第一柱塞34的端部可接觸線接觸部分20的延伸部26的端部。In the test, the end of the
第二柱塞36可接觸例如測試電路基板的焊盤。The
圖5及圖6分別是根據本揭露的第一實施例的測試座50的透視圖及分解透視圖。5 and 6 are respectively a perspective view and an exploded perspective view of the
如圖式中所示,測試座50可包括容置並支持多個線接觸部分20的接觸部分支持件51、容置並支持處於浮動狀態的接觸部分支持件51的殼體52、以及支持多個彈簧插針30的探針支持件53,彈簧插針30被容置於殼體52的下部中且在殼體52的下部中被支持,且設置於與所述多個線接觸部分20對應的位置處。As shown in the figure, the
接觸部分支持件51可包括第一接觸部分支持件512及第二接觸部分支持件514,在第一接觸部分支持件512中插置有線接觸部分20以部分地突出,第二接觸部分支持件514設置於第一接觸部分支持件512之下。第一接觸部分支持件512包括第一開口5122,在第一開口5122中插置有線接觸部分20的V形端部22。第二接觸部分支持件514可包括第二開口5142,在第二開口5142中插置有線接觸部分20的延伸部26。接觸部分支持件51可在浮動狀態下由殼體52的第一容置部分522中的四個彈簧526支持。The
容置接觸部分支持件51的第一容置部分522及容置探針支持件53的第二容置部分(未示出)可分別形成於殼體52的上部及下部中,隔板介於第一容置部分522與第二容置部分之間。隔板可包括第三開口524,在第三開口524中容置有以下將進行闡述的彈簧插針30的第一柱塞34。The first
彈簧插針30可包括圓柱形的筒32、部分地容置於筒32的一側中的第一柱塞34、部分地容置於筒32的另一側中的第二柱塞36、以及在筒32中介於第一柱塞34與第二柱塞36之間且將第一柱塞34與第二柱塞36偏置遠離彼此的彈簧38。The
可將探針支持件53插置並固定於存在於殼體52的下部中的第二容置部分中,且第二柱塞36可包括容置彈簧插針30的第四開口532,使得第二柱塞36可部分地向外突出。可藉由固定插針536將探針支持件53固定於殼體52的下部中。The
可以可移除的方式將支持線接觸部分20的接觸部分支持件51插置於第一容置部分522中且在第一容置部分522中被支持。因此,當線接觸部分20有缺陷或者線接觸部分20的壽命結束時,可輕易地更換線接觸部分20。The
圖7是應用圖4所示測試探針40的測試座60的剖視圖。FIG. 7 is a cross-sectional view of the
參照圖7,測試座60可包括容置並支持線接觸部分20的接觸部分支持件61以及容置並支持彈簧插針30的探針支持件63。Referring to FIG. 7, the
接觸部分支持件61可包括容置線接觸部分20的V形端部22及凸緣24的第一接觸部分支持件612以及容置線接觸部分20的延伸部26的第二接觸部分支持件614。The
第一接觸部分支持件612可包括容置線接觸部分20的V形端部22的接觸端子容置孔6122以及容置線接觸部分20的凸緣24的凸緣容置孔6124。The first
第二接觸部分支持件614可包括容置線接觸部分20的延伸部26的延伸部容置孔6142。The second
探針支持件63可包括容置筒32及第一柱塞34的第一探針支持件632及容置第二柱塞36的第二探針支持件634。The
第一探針支持件632可包括容置彈簧插針30的第一柱塞32的第一柱塞容置孔6322以及容置筒32的筒容置孔6324。The
第二探針支持件634可包括容置彈簧插針30的第二柱塞36的第二柱塞容置孔6342。The
在測試之前,第一柱塞34可突出至第二接觸部分支持件614的延伸部容置孔6142。Before the test, the
圖7示出其中測試端子12被按壓以進行測試且彈簧38被壓縮的情況。當測試完成時,停止按壓測試端子12,且第一柱塞34因彈簧38而向上投射且向上推動線接觸部分20。因此,當測試完成時,線接觸部分20的V形端部22可向外突出。FIG. 7 shows a situation in which the
圖8是根據本揭露的另一實施例的測試探針70的透視圖。FIG. 8 is a perspective view of a
參照圖8,測試探針70可包括圓柱形的筒72、部分地容置於筒72的一側中的第一柱塞74、以及部分地容置於筒72的另一側中且接觸例如測試基板的焊盤的第二柱塞76。8, the
筒72可包括在筒72中介於第一柱塞74與第二柱塞76之間的彈簧。第一柱塞74及第二柱塞76中的至少一者可被支持,以藉由筒72中的彈簧的壓縮或恢復而彈性滑動。The
在測試中,第一柱塞74的端部可接觸待測試裝置的待測試接觸點。第一柱塞73可包括V形端部742、凸緣744及延伸部746。除延伸部746之外,第一柱塞74具有與圖2所示線接觸部分20相似的形狀,且因此不再對其予以贅述。延伸部746可包括容置於筒72中且不伸出的擴張端部748。During the test, the end of the
第二柱塞76可接觸例如測試電路基板的焊盤。The
圖9是應用圖8所示測試探針70的測試座80的剖視圖。FIG. 9 is a cross-sectional view of the
參照圖9,測試座80可包括容置並支持第一柱塞74的第一柱塞支持件81、容置並支持筒72的筒支持件82、以及設置於筒支持件82之下且容置並支持第二柱塞76的第二柱塞支持件83。9, the
在根據本揭露實施例的測試探針中,彼此間隔開的兩對接觸線被設置成以V形或U形延伸,使得當待測試裝置容置於V形凹槽中時,測試探針可在四個點處與待測試裝置進行線接觸。因此,在本揭露的測試探針中,儘管重複測試,仍可有效地防止外來材料的轉移及累積,且使接觸電阻減小,進而可改善測試的可靠性。In the test probe according to the embodiment of the present disclosure, two pairs of contact wires spaced apart from each other are arranged to extend in a V-shape or U-shape, so that when the device to be tested is accommodated in the V-shaped groove, the test probe can Make line contact with the device under test at four points. Therefore, in the test probe of the present disclosure, despite repeated testing, the transfer and accumulation of foreign materials can be effectively prevented, and the contact resistance can be reduced, thereby improving the reliability of the test.
儘管已參照有限的示例性實施例及圖式闡述了本揭露,然而本揭露並非僅限於上述示例性實施例。熟習此項技術者可根據說明作出各種潤飾及變化。Although the present disclosure has been described with reference to limited exemplary embodiments and drawings, the present disclosure is not limited to the foregoing exemplary embodiments. Those who are familiar with this technique can make various modifications and changes according to the instructions.
因此,本揭露的範圍不應僅限於上述示例性實施例,且不僅應由以下申請專利範圍確定,亦應由其等效內容確定。Therefore, the scope of the present disclosure should not be limited to the above exemplary embodiments, and should not only be determined by the scope of the following patent applications, but also by its equivalent content.
10:連接件 12:接觸端子/接觸點/測試端子 20:線接觸部分 21:圓柱形構件 22、742:V形端部 24、744:凸緣 26、746:延伸部 30:彈簧插針 32、72:筒 34、74:第一柱塞 36、76:第二柱塞 38、526:彈簧 40:測試探針/探針 50、60、80:測試座 51、61:接觸部分支持件 52:殼體 53、63:探針支持件 70:測試探針 81:第一柱塞支持件 82:筒支持件 83:第二柱塞支持件 212:凹陷 214:孔 221:V形接觸部分 222:第一接觸線組 223:第二接觸線組 224:第一凹陷部分 225:第二凹陷部分 226:凹入部分 512、612:第一接觸部分支持件 514、614:第二接觸部分支持件 522:第一容置部分 524:第三開口 532:第四開口 536:插針 632:第一探針支持件 634:第二探針支持件 748:擴張端部 5122:第一開口 5142:第二開口 6122:接觸端子容置孔 6124:凸緣容置孔 6142:延伸部容置孔 6322:第一柱塞容置孔 6324:筒容置孔 6342:第二柱塞容置孔 P1、P2、P3、P4:接觸點 S11、S12、S13、S14:步驟10: Connector 12: Contact terminal/contact point/test terminal 20: Line contact part 21: Cylindrical member 22, 742: V-shaped end 24, 744: flange 26, 746: Extension 30: spring pin 32, 72: tube 34, 74: first plunger 36, 76: second plunger 38, 526: Spring 40: test probe/probe 50, 60, 80: test seat 51, 61: contact part of the support 52: shell 53, 63: Probe support 70: Test Probe 81: The first plunger support 82: tube support 83: second plunger support 212: Depression 214: Hole 221: V-shaped contact part 222: The first contact line group 223: The second contact line group 224: The first recessed part 225: The second recessed part 226: Recessed part 512, 612: first contact part support 514, 614: second contact part support 522: first housing part 524: third opening 532: fourth opening 536: Pin 632: The first probe support 634: second probe support 748: Expansion End 5122: first opening 5142: second opening 6122: Contact terminal receiving hole 6124: Flange receiving hole 6142: Extension Hole 6322: first plunger housing hole 6324: cylinder housing hole 6342: second plunger housing hole P1, P2, P3, P4: contact points S11, S12, S13, S14: steps
結合附圖,根據示例性實施例的以下說明,以上內容及/或態樣將變得顯而易見且更易於理解,在附圖中: 圖1是相機模組的連接件的透視圖。 圖2是根據本揭露的第一實施例的線接觸部分的詳細透視圖。 圖3是示出根據本揭露的第一實施例的製造線接觸部分的方法的一組圖。 圖4是根據本揭露的第一實施例的測試探針的透視圖。 圖5是根據本揭露的第一實施例的測試座的透視圖。 圖6是圖5所示測試座的分解透視圖。 圖7是圖5所示測試座的剖視圖。 圖8是根據本揭露的第二實施例的測試探針的透視圖。 圖9是應用圖8所示測試探針的測試座的剖視圖。With reference to the accompanying drawings, according to the following description of exemplary embodiments, the above content and/or aspects will become obvious and easier to understand. In the accompanying drawings: Fig. 1 is a perspective view of a connector of a camera module. Fig. 2 is a detailed perspective view of a line contact part according to the first embodiment of the present disclosure. FIG. 3 is a set of diagrams showing a method of manufacturing a line contact part according to the first embodiment of the present disclosure. Fig. 4 is a perspective view of the test probe according to the first embodiment of the present disclosure. Fig. 5 is a perspective view of a test socket according to the first embodiment of the present disclosure. Fig. 6 is an exploded perspective view of the test socket shown in Fig. 5. Fig. 7 is a cross-sectional view of the test socket shown in Fig. 5. Fig. 8 is a perspective view of a test probe according to a second embodiment of the present disclosure. Fig. 9 is a cross-sectional view of a test socket to which the test probe shown in Fig. 8 is applied.
20:線接觸部分20: Line contact part
22:V形端部22: V-shaped end
24:凸緣24: flange
26:延伸部26: Extension
221:V形接觸部分221: V-shaped contact part
222:第一接觸線組222: The first contact line group
223:第二接觸線組223: The second contact line group
224:第一凹陷部分224: The first recessed part
225:第二凹陷部分225: The second recessed part
226:凹入部分226: Recessed part
P1、P2、P3、P4:接觸點P1, P2, P3, P4: contact points
Claims (8)
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KR1020190110423A KR102208381B1 (en) | 2019-09-06 | 2019-09-06 | Test probe and method manufacturing for the same, and test socket supporting the same |
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KR (1) | KR102208381B1 (en) |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI771085B (en) * | 2021-06-29 | 2022-07-11 | 美科樂電子股份有限公司 | Probe base structure |
TWI829074B (en) * | 2021-06-29 | 2024-01-11 | 美科樂電子股份有限公司 | Probe holder structure |
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KR102473943B1 (en) | 2021-04-01 | 2022-12-05 | (주)티에스이 | Pin for test socket and test socket having the same |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001021615A (en) * | 1999-07-06 | 2001-01-26 | Yokowo Co Ltd | Contact probe of socket for inspecting bga |
TW539128U (en) * | 2001-12-31 | 2003-06-21 | Via Tech Inc | IC testing socket with elastic probes |
JP3565824B2 (en) * | 2002-05-31 | 2004-09-15 | 沖電気工業株式会社 | Semiconductor package test probe and test method |
JP4695337B2 (en) * | 2004-02-04 | 2011-06-08 | 日本発條株式会社 | Conductive contact and conductive contact unit |
JP4097647B2 (en) * | 2004-11-11 | 2008-06-11 | 株式会社センサータ・テクノロジーズジャパン | BGA ket |
KR20080086192A (en) * | 2007-03-22 | 2008-09-25 | 리노공업주식회사 | Plunger and inspection probe equipped with it |
JP5255459B2 (en) * | 2009-01-06 | 2013-08-07 | 日本電子材料株式会社 | Contact probe |
KR101058146B1 (en) * | 2009-11-11 | 2011-08-24 | 하이콘 주식회사 | Spring contacts and sockets with spring contacts |
KR101154519B1 (en) * | 2010-05-27 | 2012-06-13 | 하이콘 주식회사 | Structure of spring contacts |
KR101704712B1 (en) * | 2011-03-14 | 2017-02-08 | 리노공업주식회사 | A Test Pin for the Testing Apparatus |
JPWO2013061486A1 (en) * | 2011-10-26 | 2015-04-02 | ユニテクノ株式会社 | Contact probe and inspection socket with the same |
TWM429101U (en) * | 2012-01-17 | 2012-05-11 | Ccp Contact Probes Co Ltd | Probe |
KR101328581B1 (en) * | 2012-06-13 | 2013-11-13 | 리노공업주식회사 | Test probe and machining method thereof |
WO2015068222A1 (en) * | 2013-11-06 | 2015-05-14 | 理化電子株式会社 | Contact probe |
JP6269337B2 (en) * | 2014-06-16 | 2018-01-31 | オムロン株式会社 | Probe pin and electronic device using the same |
JP6665979B2 (en) * | 2015-05-19 | 2020-03-13 | 日本電子材料株式会社 | Electrical contact |
KR101882209B1 (en) * | 2016-03-23 | 2018-07-27 | 리노공업주식회사 | Coaxial Test Socket Assembly |
KR101819191B1 (en) * | 2016-07-20 | 2018-01-16 | 주식회사 마이크로컨텍솔루션 | Contact probe |
KR101920824B1 (en) * | 2017-02-02 | 2018-11-21 | 리노공업주식회사 | A test probe and test socket |
KR101958351B1 (en) * | 2017-08-04 | 2019-03-15 | 리노공업주식회사 | A test probe and test device using the same |
-
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- 2019-09-06 KR KR1020190110423A patent/KR102208381B1/en active Active
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI771085B (en) * | 2021-06-29 | 2022-07-11 | 美科樂電子股份有限公司 | Probe base structure |
TWI829074B (en) * | 2021-06-29 | 2024-01-11 | 美科樂電子股份有限公司 | Probe holder structure |
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