WO2015068222A1

WO2015068222A1 - Contact probe

Info

Publication number: WO2015068222A1
Application number: PCT/JP2013/079994
Authority: WO
Inventors: 中村耕平; 古田可陽
Original assignee: 理化電子株式会社
Priority date: 2013-11-06
Filing date: 2013-11-06
Publication date: 2015-05-14
Also published as: TWM495641U

Abstract

[Problem] Provided is a contact probe that can be easily handled and that can be substituted without socket development and manufacturing costs. [Solution] A contact probe composed of a coil spring and a pair of electroconductive vertical members, wherein the pair of electroconductive side members comprises a contact part for bringing head parts into contact with an electrode or a signal terminal of a wiring substrate, a flange part provided at an intermediate point along the vertical direction of the contact part, a plate-shaped extension part extending downward from the contact part along a center line, and a pawl part protruding from the vicinity of the distal end of the extension part to the center line, the extension part including a side surface having a sloped surface sloping from an intermediate point to the center line side, the pair of electroconductive vertical members being combined in a mode facing the direction in which the head parts oppose each other, and the coil spring being disposed coaxially with the contact part between the flanges to urge the pair of electroconductive vertical members in a mutually opposing direction, and the pawl part making sliding contact with the sloped surface.

Description

Contact probe

The present invention relates to a contact probe used for measurement and inspection of electrical characteristics of a semiconductor device such as an IC.

Conventionally, the semiconductor device described above is formed by accommodating an IC chip in a package such as a BGA (Ball Grid Array). Contact probes are arranged between a plurality of signal terminals provided on a wiring board provided in an inspection device such as a tester and a plurality of electrodes provided on a package, and signals are transmitted via the contact probes. The semiconductor device is inspected.

The spring probe 1 which has been mainstream in the market as such a contact probe will be described with reference to FIG. FIG. 10A shows a partial longitudinal section of the state in which the spring probe 1 is housed in the socket S, and FIG. 10B is a view taken along the line CC ′ of FIG. 10A. For example, as shown in FIG. 10A, the spring probe 1 includes a cylindrical pipe 2, a spring 3 inserted into the pipe 2 coaxially with the pipe 2, and plans inserted into both ends of the pipe 2.

Jars

4 and 5 are provided, and the heads of the

plungers

4 and 5 are urged by the springs 3 in opposite directions, and protrude from both ends of the pipe 2.

As a socket for attaching the spring probe 1, as shown in FIG. 10A, a socket S having a large number of accommodation holes K for accommodating the spring probe 1 is frequently used. As shown in FIGS. 10A and 10B, the accommodation hole K is, for example, a cylindrical pipe accommodation hole 6 that can accommodate the pipe 2, and a cylindrical shape that is arranged above the pipe accommodation hole 6 and into which the plunger 4 can be inserted. The first plunger insertion hole 7 and a cylindrical second plunger insertion hole 8 which is disposed below the pipe accommodation hole 6 and into which the plunger 5 can be inserted. The first plunger insertion hole 7 and the second plunger insertion hole 8 are formed coaxially.

The spring probe 1 is attached to the socket S. For example, the head of the plunger 4 is brought into contact with the electrode D, the head of the plunger 5 is brought into contact with the signal terminal E, and the wiring board is placed on the electrode side. By retracting the spring 3 close to the plunger 4, the

plungers

4 and 5 are pushed in the longitudinal direction of the contact probe and used. (Hereafter, pushing in this way is called "adding overdrive.")

However, with the recent high integration of ICs and the like, the above-mentioned narrowing of the pitch between the electrodes D advances, and the need for a contact probe with a thin outer diameter is increasing. However, in the configuration in which the spring 3 is disposed in the pipe 2 described above, the diameter of the wire of the spring 3 must be reduced in order to reduce the outer diameter of the pipe 2. Then, in order to obtain a desired elastic repulsion force, it is necessary to increase the number of windings of the spring 3, and as a result, the length of the contact probe is increased, the resistance value is increased, and the inductance component is increased. There was a problem of causing deterioration.

In response to such a problem, several proposals have been made regarding contact probes having a configuration excluding metal pipes (see, for example, Patent Document 1).

JP 2008-32743 A

According to Patent Document 1, a pair of conductive needles extending in opposite directions and a pair of conductive needles interposed between the pair of conductive needles, each intermediate between the pair of conductive needles A compression coil spring that elastically biases the portion, and the ends of the pair of conductive needles that are received in the compression coil spring are elastic springs of the compression coil spring. Conductive contacts that can be engaged with each other against the urging force, and are always in sliding contact with each other when reciprocating in the axial direction of the compression coil spring, and can be reduced in inductance and resistance. A sex contact is disclosed.

More specifically, the conductive needle-like body of Patent Document 1 has both conductive needle-like shapes so that the engaging portions as the respective immersive end portions abut against each other in the radial direction in the compression coil spring. Each of the intermediate portions of the body is elastically biased by the compression coil springs, and each of the elastic biasing positions is set to a substantially point symmetrical position with respect to the axial center of the compression coil spring, Each projecting end is positioned radially outward with respect to each corresponding bullet energizing position, and the projecting end to be brought into contact with the contacted object is from a position where it receives the elastic energizing force of the compression coil spring. Is located outside the compression coil spring in the radial direction (see paragraph [0011] of Patent Document 1).

Therefore, the hole of the socket which accommodates the conductive contact of Patent Document 1 is a coil spring support hole having a circular cross section provided in the middle portion in the thickness direction of both insulating plates, and its axis with respect to the coil spring support hole. It consists of a pair of needle-like body support holes having a rectangular cross-section each opening at a point-symmetrical position with the center as a center and opening on the opposite outer surfaces of both insulating plates (see paragraph [0013] of Patent Document 1) .

Then, in the mainstream socket S described above, the accommodation hole K is formed by coaxially arranging the pipe accommodation hole 6, the first plunger insertion hole 7, and the second plunger insertion hole 8. When the conductive contact of Patent Document 1 is used in place of the spring probe 1, there is a problem that the conductive contact of Patent Document 1 cannot be accommodated in the accommodation hole K of the socket S described above. Therefore, there is a possibility that a manufacturer who intends to replace the spring probe 1 with the conductive contact described in Patent Document 1 needs extra socket development costs and manufacturing costs, such as the need to redesign and manufacture the socket. was there.

Furthermore, according to the conductive contact of Patent Document 1, for example, when a force on the inner side in the radial direction of the coil spring is applied to the protruding end, the engagement portions are disengaged from each other, and the conductive needle-like body is removed from the coil spring. May come off and the members may fall apart. Therefore, according to the conductive contact of Patent Document 1, there is a problem that the handling may be complicated, for example, it is necessary to handle carefully so as not to come off.

Accordingly, the present invention has been made in view of the above-described conventional problems, and an object of the present invention is to provide a contact probe that can be replaced without incurring the development cost and manufacturing cost of the socket and that is easy to handle. There is.

Invention of Claim 1 is a contact probe arrange | positioned between the electrode of a semiconductor device, and the said wiring board for a semiconductor device test | inspection, Comprising: In the contact probe provided with a coil spring and a pair of electroconductive vertical member, The pair of conductive vertical members includes a contact portion whose head is brought into contact with the electrode or the signal terminal of the wiring board, a flange portion provided in the middle in the vertical direction of the contact portion, and a downward extension from the contact portion. A substantially plate-like extending portion that extends along a central straight line that passes through a substantially central portion of a transverse section of the contact portion in the vertical direction, with a gap provided between the central straight line and the central straight line. Each of the extending portion and a claw portion protruding from the vicinity of the distal end of the extending portion toward the central straight line, and the extending portion is a side surface facing the central straight line, from the middle in the vertical direction Heading toward the contact portion while inclining toward the central straight side The pair of conductive vertical members includes side surfaces having slopes, and the pair of conductive vertical members are combined in a manner in which the heads face in opposite directions, and the coil spring is the flange portion of the pair of conductive vertical members combined The pair of conductive members are mounted in a state where the contact portions are provided between each other, and the pair of conductive longitudinal members are urged in the opposite directions while the central straight line is substantially the shaft of the coil spring. One of the claw portions of the vertical member is a contact probe that engages with the other claw portion against the urging force and slides into contact with the other inclined surface when the contact portions approach each other. is there.

According to a second aspect of the present invention, in the contact probe according to the first aspect, the conductive longitudinal member is provided at the contact portion below the flange portion and is capable of entering between adjacent coils of the coil spring. It is characterized by providing.

According to a third aspect of the present invention, in the contact probe according to the first or second aspect, the conductive vertical member includes a bulging portion that bulges toward the coil spring in the middle in the vertical direction of the extending portion. To do.

According to a fourth aspect of the present invention, in the contact probe according to any one of the first to third aspects, the conductive longitudinal member is formed by depositing a metal by plating on an opening patterned by photolithography on a substrate. It is characterized by being subjected to an electroforming process.

According to a fifth aspect of the present invention, in the contact probe according to the fourth aspect, the metal is made of Ni.

According to a sixth aspect of the present invention, in the contact probe according to the fourth aspect, the metal is composed of Cu and Ni, and the deposition is performed by laminating a Cu layer, a Ni layer, and a Cu layer in this order from the bottom. Features.

The invention according to claim 7 is the contact probe according to any one of claims 4 to 6, wherein the conductive longitudinal member is formed at a temperature of 200 ° C. to 300 ° C. in a predetermined gas atmosphere after the electroforming step. It is characterized by being subjected to a baking process for baking.

According to the present invention, there is provided a contact probe disposed between an electrode of a semiconductor device and the wiring substrate for testing the semiconductor device, the contact probe including a coil spring and a pair of conductive vertical members, The conductive vertical member is extended downward from the contact portion, a contact portion whose head is brought into contact with the electrode or the signal terminal of the wiring board, a flange portion provided in the middle in the vertical direction of the contact portion, and A substantially plate-like extending portion extending along a central straight line passing in a vertical direction substantially at the center of the cross section of the contact portion and extending with a gap between the central straight line And a claw that protrudes from the vicinity of the tip of the extended portion toward the central straight line, and the extended portion is a side surface facing the central straight line, and extends from the middle in the vertical direction to the center. Inclined surface toward the contact portion while inclining to the straight line side And the pair of conductive longitudinal members are combined in a manner in which the heads face in opposite directions, and the coil spring is formed between the flanges of the pair of conductive longitudinal members combined. The pair of conductive longitudinal members are mounted in a state where the contact portion is interposed therebetween, and the pair of conductive longitudinal members are urged in the opposite directions with the central straight line being substantially the axis of the coil spring. One of the claw portions is locked to the other claw portion against the urging force, and when the contact portions approach each other, it is configured to be in sliding contact with the other inclined surface. Since the central straight line as the vertical axis of the portion and the axis of the coil spring substantially coincide with each other, the above-described first plunger insertion hole, second plunger insertion hole and pipe accommodation hole are arranged in the socket S arranged coaxially. Contact of the present invention Enables accommodating the probe, the manufacturer to replace the spring probe 1 into contact probe of the present invention can be used as it is socket S. For example, even if a force perpendicular to the center straight line is applied to the head of the contact portion, the pair of conductive longitudinal members are attached in opposite directions with the contact portion provided inside the coil spring. Since the claws are locked against the urging force, the coil spring and the pair of conductive longitudinal members are not easily detached, and the handling becomes easy. As described above, according to the present invention, it is possible to provide a contact probe that can be replaced without incurring socket development costs and manufacturing costs, and that can be easily handled.

Moreover, since it is the structure which is provided in the said contact part under the said collar part, and is provided with the protrusion part which can penetrate | invade between the adjacent coils of the both ends vicinity of the said coil spring, for example, the force of the vertical direction worked on the coil spring. Even in this case, since the coil spring is unlikely to be detached from the conductive vertical member due to the protrusions that enter between adjacent coils near both ends of the coil spring, it is possible to provide a contact probe that is easier to handle.

In addition, since the conductive longitudinal member is configured to include a bulging portion that bulges toward the coil spring in the middle of the extending portion in the longitudinal direction, the above-described overdrive is added to the conductive longitudinal member in the longitudinal direction. The inclined surface and the claw portion can be brought into stronger contact with each other by the coil spring around the bulging portion where the side surfaces face each other.

In addition, the conductive longitudinal member has a structure that undergoes an electroforming process in which a metal is deposited by plating on an opening patterned by photolithography on a substrate. Therefore, a contact probe with high shape quality can be provided.

In addition, since the metal is made of Ni, it is possible to provide a low-cost contact probe with excellent mass productivity.

In addition, the metal is made of Cu and Ni, and the deposition is made up of the Cu layer, the Ni layer, and the Cu layer in that order from the bottom, so that the strength of the Ni layer is improved and the Cu layer is used. In addition, it is possible to provide a contact probe that can reduce resistance and is highly convenient.

In addition, since the conductive vertical member has a structure in which a baking step of baking at a temperature of 200 ° C. to 300 ° C. in a predetermined gas atmosphere is performed after the electroforming step, for example, the conductive vertical member immediately after plating. By removing hydrogen from, a conductive longitudinal member having higher hardness can be obtained. Therefore, when the head of the contact portion is brought into contact with the electrode, the head can enter into the electrode slightly from the surface, the contact resistance can be lowered, and the wear resistance is improved. An excellent contact probe can be provided.

It is a perspective explanatory view of the contact probe of the 1st example concerning the embodiment of the present invention. It is front explanatory drawing and right side explanatory drawing of the contact probe of 1st Example which concerns on embodiment of this invention. It is front explanatory drawing of the use condition of the contact probe of 1st Example which concerns on embodiment of this invention. FIG. 4 is a cross-sectional explanatory view taken along line AA ′ in FIG. 3. It is explanatory drawing of the manufacturing method of the contact probe of the 1st Example which concerns on embodiment of this invention. It is a perspective explanatory view of the contact probe of the 2nd example concerning the embodiment of the present invention. FIG. 7 is a cross-sectional explanatory view taken along the line BB ′ of FIG. 6. It is front explanatory drawing of the contact probe of 3rd Example based on embodiment of this invention. It is front explanatory drawing of the use condition of the contact probe of 3rd Example which concerns on embodiment of this invention. It is explanatory drawing explaining the example of the conventional contact probe.

Prior to the description of the contact probe 10 of the present embodiment, the socket 50 in the present embodiment will be described with reference to FIG. FIG. 2A is a front explanatory view of the state in which the contact probe 10 is held by the socket 50, and is shown in a longitudinal section. FIG. 2B is an explanatory diagram on the right side in a state where the contact probe 10 is held by the socket 50, and is shown in a vertical cross section excluding the conductive

vertical members

20 and 22.

As shown in FIGS. 2 and 10, the socket 50 of the present embodiment has a known configuration, and includes, for example, a main body 50 a and a lid 50 b.
First, as shown in FIG. 2, the main body 50a is an insulating block having a thickness of, for example, two-thirds of the distance between the semiconductor device 100 to be inspected and the wiring board 102 for inspection of the semiconductor device. It consists of members. The main body 50 a of this embodiment includes a cylindrical hole 54 and a lower opening 56.

As shown in FIG. 2, the cylindrical hole 54 is a cylindrical vertical hole having an inner diameter slightly larger than the outer diameter of the coil spring 12 described later and having an opening on the upper surface of the main body 50a. And the depth of the cylindrical hole 54 is formed from the upper surface of the main body 50a to such a depth that a coil spring 12 described later can be accommodated. Next, as shown in FIG. 2, the lower opening 56 is a circular hole in a plan view in which a contact portion 24 to be described later can be inserted. The lower opening 56 is opened in the bottom surface of the socket 50 and the cylindrical shaft of the cylindrical hole 54. It is arranged coaxially with G and communicates with the cylindrical hole 54.

Next, as shown in FIG. 2, the lid 50 b is formed of, for example, an insulating plate member that is placed on the upper surface of the main body 50 a and includes an upper opening 58. The upper opening 58 has the same size and shape as the lower opening 56 described above, and is formed as a through hole that penetrates the insulating plate member. As shown in FIG. 2, the lid 50 b is combined with the main body 50 a in a state where the cylindrical hole 54 and the upper opening 58 are arranged coaxially with the cylinder axis G of the cylindrical hole 54. That is, as shown in FIG. 2, the lower opening 56, the cylindrical hole 54, and the upper opening 58 are arranged coaxially about the cylinder axis G, and the upper opening 58, the cylindrical hole 54, and the lower opening The space formed by 56 forms an accommodation hole for accommodating the contact probe 10. Thus, the accommodation hole of the present embodiment has the same shape as the accommodation hole K described above, the cylindrical hole 54 to the pipe accommodation hole 6, and the lower opening 56 to the second plunger insertion hole 8. The upper openings 58 correspond to the first plunger insertion holes 7, respectively.

As shown in FIG. 2, the socket 50 is disposed between the semiconductor device 100 and the wiring board 102 for inspection. In the present embodiment, the semiconductor device 100 is formed of a BGA package as shown in FIG. 2, but is not limited to the BGA package, and is a surface mount type package such as a QFP (Quad FLAT Package). Also good. Further, the wiring board 102 is formed of a known printed board, and has signal terminals E on the surface as shown in FIG.
Further, the socket 50 is not limited to the configuration including the main body 50a and the lid body 50b as in the present embodiment. For example, the lower portion formed of a lower portion in which the socket is halved at the center in the vertical direction; It is also possible to have a configuration in which the upper part is formed by combining the upper part on the lower part (see FIG. 10).

Next, the contact probe 10 of the first example according to the embodiment of the present invention will be described with reference to FIGS. FIG. 1A is a perspective view illustrating a contact probe 10 according to the present embodiment, and FIG. 1B is a perspective explanatory view of conductive

longitudinal members

20 and 22 according to the present embodiment.
As shown in FIG. 1, the contact probe 10 of this embodiment includes a coil spring 12 and a pair of conductive

vertical members

20 and 22.
As shown in FIGS. 1A and 2, the coil spring 12 is formed by, for example, winding a wire having a diameter of approximately 0.01 mm in a coil shape with a constant diameter, and the natural length (the length when no force is applied) is the thickness of the socket 50. The coil spring member is slightly longer than the length. At that time, the inner diameter of the coil spring 12 is formed to have a size such that four corners of contact portions 24 and 24 'described later are inscribed inside the coil spring 12 (see FIG. 4). The wire may be formed of piano wire, stainless steel, or BeCu.

Next, as shown in FIG. 1B, one conductive vertical member 20 of the pair of conductive

vertical members

20 and 22 includes a contact portion 24, a flange portion 26, an extending portion 28, and a claw portion 38. And is formed of a needle-like conductive member made of Ni or Ni alloy.
First, as shown in FIGS. 1 and 2, the contact portion 24 corresponds to the upper portion of the conductive longitudinal member 20, and is formed in, for example, a rectangular column shape having a length that is approximately one-half of the coil spring 12. More specifically, as shown in FIGS. 1, 2, and 4, the contact portion 24 is formed of a quadrangular columnar member having a long side H and a short side N and a rectangular cross-sectional shape. Further, as shown in FIG. 2A, the contact portion 24 has a head portion 30 that is formed in a substantially inverted V shape when viewed from the front, and forms a contact end that contacts the electrode D. 1 and 2, reference numeral 44 indicates the bottom 44 of the contact portion 24. Moreover, the short side N mentioned above is corresponded to the width | variety of the

side parts

23 and 25 of the contact part 24, as shown to FIG. 2B.
In addition, the front view shape of the head is not limited to the substantially inverted V shape of the present embodiment, and may be, for example, a V shape, a wave shape, or a flat shape.

Next, as shown in FIGS. 1 and 2, the flange portion 26 is a protruding portion that protrudes from the middle in the longitudinal direction of both

side portions

23 and 25 of the contact portion 24 with the same protruding length in the long side H direction described above. It is formed. In other words, as shown in FIGS. 1 and 2, the flange portion 26 is formed by widening the middle in the longitudinal direction of the contact portion 24 in the long side H direction, that is, in the lateral direction. Specifically, the front view width of the collar portion 26 is formed to be approximately twice the long side H, for example. In FIG. 2, the symbol L indicates a central straight line that passes through the center of the cross section of the contact portion in the vertical direction.

Next, as shown in FIGS. 1 and 2, the extending portion 28 corresponds to the lower portion of the conductive vertical member 20, and has a thickness slightly shorter than half of the long side H described above, for example. It is formed in a substantially plate shape having a substantially vertically long length of 24. As shown in FIG. 2, the extending portion 28 is the bottom portion 44 described above, and extends along the central straight line L from the one side portion 25 side while providing a gap with the central straight line L. Established. As shown in FIGS. 1B and 2, the extending portion 28 includes a side surface 34 that faces the central straight line L, and the side surface 34 is formed vertically with respect to the extending portion 28 as shown in FIGS. 1B and 2. It has the inclined surface 36 which inclines in the direction, ie, the middle of a longitudinal direction, toward the bottom straight line 44, inclining to the center straight line L side.

More specifically, as shown in FIG. 2A, the front view shape of the side surface 34 of the extending portion 28 includes a perpendicular portion that is substantially parallel to the central straight line L from a claw portion 38 to a bottom portion 44 described later, and the upper end of the perpendicular line. And a hatched portion (36) inclined toward the central straight line L at a predetermined angle with respect to the perpendicular. In addition, the back surface 39 of the extension part 28 of a present Example is formed in the flat surface which extended the side part 25 of the contact part 24 to the vertical direction, as shown to FIG. 2A.
In the present embodiment, as shown in FIG. 2A, the inclined surface 36 and the bottom 44 intersect each other at a position where the substantially central straight line L passes in the front view.

Next, as shown in FIG. 1B and FIG. 2A, the claw portion 38 is provided on the side surface 34 in the vicinity of the tip of the extending portion 28, and is formed by a protruding piece protruding from the side surface 34 toward the central straight line L side. 2A, the angle between the upper surface 38a (see FIG. 1B) and the side surface 34 of the claw portion 38 may be, for example, approximately 90 degrees when viewed from the front, or an angle smaller than 90 degrees. May be. By forming in this way, as will be described later, when the claws 38, 38 'are engaged with each other, it is difficult for both to come off.

Next, the difference between the other conductive vertical member 22 of the pair of conductive

vertical members

20 and 22 and the conductive vertical member 20 described above is as shown in FIGS. Is in the shape of Therefore, in the following description, about the same part as the electroconductive vertical member 20, the code | symbol which attached | subjected "'" to the same code | symbol or the same code | symbol is used, and the description is abbreviate | omitted.
Specifically, as shown in FIG. 2A, the shape of the head portion 30 ′ of the conductive vertical member 22 is formed so as to protrude in a V shape when viewed from the front, and contacts the signal terminal E of the wiring board 102.

As described above, the contact probe 10 of this embodiment is a contact probe disposed between the electrode D of the semiconductor device 100 and the wiring substrate 102 for testing the semiconductor device, and the coil spring 12 and a pair of conductive members. In the contact probe including the conductive

vertical members

20, 22, the pair of conductive

vertical members

20, 22 are

contact portions

24, 24 that bring the

heads

30, 30 ′ into contact with the electrodes D or the signal terminals E of the wiring board 102. ′, A

flange portion

26, 26 ′ provided in the middle in the vertical direction of the

contact portions

24, 24 ′, and a substantially plate-like extension portion extending downward from the

contact portions

24, 24 ′, Extending

portions

28 and 28 ′ extending along the central straight line L passing through the approximate center of the cross-sections 24 and 24 ′ in the vertical direction with a gap between the central straight line L and the extending portion Projected from the vicinity of the tip of 28, 28 'toward the center straight line L The

extended portions

28, 28 ′ are side surfaces facing the central straight line L, and include the protruding

claw portions

38, 38 ′, and are inclined from the middle in the vertical direction toward the central straight line L side. The configuration includes a side surface 34 having inclined surfaces 36, 36 'facing 24'.

Next, an example of a method for assembling the contact probe 10 according to the present embodiment will be described with reference mainly to FIGS.
First, for example, the coil spring 12 is fixed, and the extending portion 28 ′ is inserted from the one end 12 a side of the coil spring 12 with the head 30 ′ of the conductive longitudinal member 22 facing down. At that time, as shown in FIG. 1A, the claw portion 38 ′ is directed toward the central straight line L side. Then, while the contact portion 24 ′ is inserted inside the coil spring 12, the flange portion 26 ′ is pressed against the one end 12 a from below.

Next, as shown in FIG. 1A, the extending portion 28 is inserted from the other end 12b side of the coil spring 12 with the head 30 of the conductive vertical member 20 facing upward and the claw portion 38 facing the central straight line L side. To do. Then, the flange portion 26 is pressed against the other end 12 b of the coil spring 12 from above while inserting the contact portion 24 inside the coil spring 12. At that time, the conductive longitudinal member 20 is pushed in and assembled so that the claw portion 38 ′ is positioned above the claw portion 38.

In this state, as shown in FIGS. 1A and 2, the pair of conductive

longitudinal members

20 and 22 are combined in such a manner that the

heads

30 and 30 ′ face in opposite directions. Further, as shown in FIGS. 1A and 2, the coil spring 12 is disposed with the central straight line L between the

flange portions

26 and 26 ′ as a substantially axis of the coil spring 12 and is compressed and mounted. The pair of conductive

longitudinal members

20 and 22 are biased in opposite directions. Moreover, as shown in FIG. 2, the pair of conductive

vertical members

20 and 22 are locked against the urging force of the coil spring 12 by engaging the

claws

38 and 38 ′. Further, as shown in FIG. 4, the four corners of the

contact portions

24, 24 ′ are respectively provided inside the coil spring 12.

In the contact probe 10 configured in this way, for example, even if a lateral force is applied to the

heads

30 and 30 ′ of the contact portion 24, the

contact portions

24 and 24 ′ are located inside the coil spring 12. Since the claw portions 38 and 38 'are engaged with each other in the installed state, the coil spring 12 and the pair of conductive

vertical members

20 and 22 are difficult to be detached.

When the contact probe 10 is assembled to the socket 50, the contact probe 10 is first inserted into the main body 50a as shown in FIG. At that time, for example, the contact portion 24 ′ can be easily inserted into the lower opening 56 by inserting the shaft 13 of the coil spring 12 and the cylinder axis G of the cylindrical hole 54 so as to be aligned. In this regard, the socket of Patent Document 1 has a needle-like body support hole into which the head of the conductive needle-like body is inserted, which opens at a point-symmetrical position about the axis of the coil spring support hole. When the conductive needle-shaped body is assembled into the socket, there is a problem that it is necessary to confirm the coil spring support hole and insert the head, and the assembly work is complicated and time-consuming.
Next, the lid 50b may be placed on the upper side of the main body 50a while being inserted into the upper opening 58 of the lid 50b and connected with screws or the like.

Next, the operation of the contact probe 10 will be described with reference to FIGS.
First, FIG. 2 shows a state in which the electrode D and the signal terminal E are separated from the

contact portions

24 and 24 ′ in the vertical direction. On the other hand, FIG. 3 shows a state in which the electrode D and the signal terminal E are close to each other and the

contact portions

24 and 24 ′ are pushed in the vertical direction against the urging force of the coil spring 12, that is, a state in which overdrive is applied. In this state, the semiconductor device 100 is inspected.

When overdrive is applied, the claw portions 38 and 38 'move away from each other along the direction of the central straight line L, as shown in FIG. 3, and each of the claw portions 38 and 38' moves to the other

inclined surfaces

36 and 36. The pair of conductive

vertical members

20 and 22 are brought into an electrically conductive state in sliding contact with '. More specifically, the protruding ends of the claw portions 38 and 38 'are in sliding contact with the other inclined surfaces 36 and 36'.

As described above, the

inclined surfaces

36 and 36 ′ are formed by inclined surfaces inclined from the middle of the extending

portions

28 and 28 ′ in the central straight line L direction to the

bottom portions

44 and 44 ′ toward the central straight line L, In addition, as shown in FIG. 4, the coil spring 12 has the ends of the back surfaces 39 and 39 ′ of the

extended portions

28 and 28 ′ of the pair of conductive

vertical members

20 and 22 in a combined state inscribed inside thereof. Therefore, as the contact portions 24 and 24 'approach each other, the claw portions 38 and 38' are strongly pressed against the other inclined surfaces 36 and 36 'as shown in FIG. The contact resistance between 20, 22 can be lowered.

As described above, the pair of conductive

longitudinal members

20 and 22 of the present embodiment are combined in such a manner that the

heads

30 and 30 ′ face in opposite directions, and the coil spring 12 is combined with the pair of conductive longitudinal members. The pair of conductive longitudinal members 20 are mounted with the

contact portions

24, 24 ′ disposed between the

flange portions

26, 26 ′ of the

ridges

20, 22, and the central straight line L as the shaft 13 of the coil spring 12. 22 is urged in the opposite direction, and one claw portion 38, 38 'of the pair of conductive

longitudinal members

20, 22 is engaged with the other claw portion 38, 38' against the urging force. When the contact portions 24 and 24 'come close to each other, they are in sliding contact with the other inclined surfaces 36 and 36', respectively.
As described above, according to the contact probe 10 of the present embodiment, for example, the socket used as the mainstream socket by adjusting the length of the coil spring 12 to the length of the cylindrical hole 54 or the pipe accommodation hole 6. 50 or the socket S can be used as they are, so that the conventional spring probe 1 can be replaced with the contact probe 10 without incurring the development cost and manufacturing cost of a new socket.

Next, the manufacturing method of the electroconductive

vertical members

20 and 22 of a present Example is demonstrated. The manufacturing method of the electroconductive

vertical members

20 and 22 of a present Example includes an electroforming process and a baking process.
First, the electroforming process will be described with reference to FIG. FIG. 5A is a perspective view for explaining the patterned opening 63, and FIG. 5B is an explanatory view of an electroplating process.
In the electroforming process, as shown in FIG. 5A, first, a resist 62 is applied on a substrate 61 such as a plastic plate, and a mask in which the shape of the conductive

longitudinal members

20 and 22 is patterned in front view is patterned. In addition, an exposure step of exposing the resist 62 using an exposure apparatus, and development that forms the opening 63 (see FIG. 5A) opening in the front view shape by removing the exposed resist region with a developing device. Process. Thus, the opening 63 is patterned on the base 61 by photolithography.

Next, the electroforming process includes an electroplating process in which Ni as a metal is deposited in the opening 63 by a plating method. Specifically, in the electroplating step, as shown in FIG. 5B, the substrate 61 and the Ni plate 65 are immersed in the Ni plating bath 64, the substrate 61 is connected to the cathode side, and the Ni plate 65 is connected to the anode side. By doing so, Ni is deposited in the opening 63, and the shape of the conductive

longitudinal members

20 and 22 of this embodiment is formed. Next, in the electroforming process, the conductive

longitudinal members

20 and 22 are taken out from the opening 63.
As described above, the conductive

vertical members

20 and 22 are configured through an electroforming process in which Ni as a metal is deposited by plating on the openings 63 patterned by photolithography on the base 61. It is.

In the electroforming process, in order to reduce the contact resistance between the electrode D and the signal terminal E and the conductive

vertical members

20 and 22, the entire surface of the conductive

vertical members

20 and 22 taken out as described above is plated with, for example, Au. A surface plating step of applying may be included. Further, the surface plating is not limited to Au plating, and may be platinum cobalt plating or rhodium plating, for example. Further, the surface plating is performed by forming a Ni plating film on the surfaces of the conductive

longitudinal members

20 and 22, forming an alloy film containing Au, Pd and Co thereon, and further forming an Au plating film thereon. It may be a three-layer structure.

Further, the metal deposited in the opening 63 described above is not limited to Ni in this embodiment, and may be Au, Pd, or Co, for example.
Further, the metal deposited in the opening 63 may be a plurality of metals such as Cu and Ni. In this case, a Cu layer is first formed, a Ni layer is formed thereon, and a Cu layer is formed thereon, so that the Ni layer may be stacked in a sandwich shape with the upper and lower sides of the Cu layer sandwiched therebetween. This is because, by forming such a sandwich, the resistance can be lowered by the Cu layer while improving the strength by the Ni layer, and a highly convenient contact probe can be provided.

Next, the baking process performed after the electroforming process mentioned above is demonstrated.
This baking process refers to a process in which the conductive

longitudinal members

20 and 22 taken out as described above are baked at a temperature of 200 ° C. to 300 ° C. in a predetermined gas atmosphere such as nitrogen gas.
By passing through this baking process, for example, hydrogen escapes from the conductive

vertical members

20 and 22, and the hardness of the conductive

vertical members

20 and 22 is improved. In the conductive

longitudinal members

20 and 22 of this example, the hardness was adjusted to Hv = 380 to 600 in terms of Vickers hardness. By passing through this baking process, when the head part of a contact part is made to contact | abut to an electrode, the said head part can penetrate | invade slightly from the surface of an electrode, and can reduce contact resistance. Moreover, the contact probe of the outstanding characteristics, such as abrasion resistance improving, can be provided by hardness improvement. This baking process is also called a hydrogen embrittlement treatment process.
As described above, the conductive

vertical members

20 and 22 of the present embodiment are configured to undergo a baking process in which baking is performed at a temperature of 200 ° C. to 300 ° C. in a predetermined gas atmosphere after the electroforming process. It is.

Next, a contact probe 70 of a second example according to the embodiment of the present invention will be described with reference to FIGS. FIG. 6A is a perspective view for explaining the contact probe 70 of the present embodiment, and FIG. 6B is a perspective view for explaining the conductive longitudinal members 72 and 74 according to the present embodiment. The difference between the second embodiment and the first embodiment is that, as shown in FIG. 6, the conductive longitudinal members 72, 74 of the second embodiment are provided with projections 46, 46 '. In the drawings, the same parts as those in the first embodiment are denoted by the same reference numerals or the same reference numerals with “′” added thereto, and the description thereof is omitted.

As shown in FIGS. 6A and 6B, the protrusion 46 of this embodiment is a protrusion provided on the

side portions

23 and 25 of the contact portion 24 below the flange 26, that is, a protrusion protruding in the same direction as the flange 26. It is formed with a part.
The shape of the protrusion 46 is, for example, a semicircular shape when viewed from the front, and the semicircular diameter is formed so as to be able to enter between adjacent coils of the coil spring 12 mounted as described above. Further, as shown in FIG. 6A, for example, the protrusion 46 is disposed at a position where it can enter between the coil at the other end 12b of the coil spring 12 and the coil adjacent to the coil. Further, as shown in FIG. 6, the conductive longitudinal member 74 of the present embodiment includes a protruding portion 46 ′ similar to the protruding portion 46, and thus description thereof is omitted.

In this manner, as shown in FIG. 6, the coil spring 12 is mounted so that the protrusions 46 and 46 'can enter between adjacent coils near both ends thereof, so that the coil spring 12 and a pair of conductive longitudinal members are inserted. Even if a longitudinal force is applied to the coil spring 12, for example, after the 72 and 74 are assembled, the coil spring 12 is more difficult to come off than the contact probe 10 of the first embodiment. FIG. 7 shows a state in which the coil spring 12 is engaged with both end portions in the above-described short side N direction of the protrusion 46 ′.

Next, a contact probe 80 of a third example according to the embodiment of the present invention will be described with reference to FIGS. FIG. 8 is a partial cross-sectional front view of the contact probe 70 in a state where no load is applied to the

heads

30 and 30 ′. FIG. 9 is an explanatory front view illustrating a state in which overdrive is applied.
The difference between the third embodiment and the second embodiment is that, as shown in FIG. 8, the conductive

longitudinal members

82 and 84 of the present embodiment are provided with the bulging portions 76 and 76 ', and the following explanation will be given. In the drawings, the same parts as those in the first and second embodiments are denoted by the same reference numerals or the same reference numerals with “′” added thereto, and the description thereof is omitted. However, the pair of conductive longitudinal members in the present embodiment are denoted by

reference numerals

82 and 84 in FIGS. 8 and 9.

As shown in FIG. 8, the bulging

portions

76 and 76 ′ of the present embodiment are formed by raising the vertical intermediate portions of the back surfaces 39 and 39 ′ described above in a substantially letter-like shape when viewed from the front. The bulging shape is not limited to a generally square shape when viewed from the front, but may be an arc shape when viewed from the front.
By providing the bulging portions 76 and 76 'in this way, as shown in FIG. 9, the above-described overdrive is applied, and the conductive

vertical members

82 and 84 move in the vertical direction, so that the side surfaces 34 and 34' Since the claw portions 38, 38 'and the extending portions 28, 28' are tightly bound by the coil spring 12 portions around the bulging portions 76, 76 ', the inclined surfaces 36, 36' The claw portions 38 and 38 'can be brought into contact with each other more strongly, and the contact resistance between the conductive vertical members 82 and 82' can be further reduced.

As described above, according to the contact probes 10, 70, and 80 of the present embodiment, a contact probe that can be replaced without incurring the development cost and manufacturing cost of the socket and can be easily handled can be provided. .

As described above, some of the embodiments of the present invention have been described in detail with reference to the drawings. However, these are merely examples, and the present invention is variously modified and improved based on the knowledge of those skilled in the art. It is possible to carry out the invention.

10, 70, 80 Contact probe 12 Coil spring 13

Coil spring shaft

20, 22, 72, 74, 82, 84 Conductive longitudinal member 24, 24 'Contact portion 26, 26' Elongation portion 28, 28 'Extension portion 30, 30 'Heads 34, 34' Side surfaces 36, 36 'Inclined surfaces 38, 38' Claw portions 46, 46 'Protrusion portion 63 Opening portions 76, 76' Expanded portion D Electrode E Signal terminal G Tube axis L Center straight line 100 Semiconductor device 102 Wiring board

Claims

A contact probe disposed between an electrode of a semiconductor device and the wiring board for testing the semiconductor device, and a contact probe including a coil spring and a pair of conductive longitudinal members,
The pair of conductive vertical members is
A contact portion for bringing a head into contact with the electrode or a signal terminal of the wiring board;
A flange provided in the middle in the longitudinal direction of the contact portion;
A substantially plate-like extension portion extending downward from the contact portion, and a gap between the center straight line and a central straight line passing through a substantially center of a transverse section of the contact portion in a vertical direction. An extending portion that is extended by providing
Each including a claw protruding from the vicinity of the tip of the extended portion toward the central straight line,
The extending portion is
A side surface facing the central straight line, including a side surface having an inclined surface toward the contact portion while being inclined from the middle in the vertical direction toward the central straight line side,
The pair of conductive longitudinal members are combined in a manner in which the heads face in opposite directions,
The coil spring is mounted in a state in which the contact portion is provided between the flange portions of the pair of conductive longitudinal members combined, and the pair of the pair of conductive vertical members is set with the center straight line being substantially the axis of the coil spring. Energizing the conductive longitudinal member in the opposite direction,
The one claw portion of the pair of conductive vertical members is engaged with the other claw portion against the biasing force, and slides with the other inclined surface when the contact portions approach each other. Contact probe characterized by contact.
2. The contact probe according to claim 1, wherein the conductive vertical member is provided at the contact portion below the flange portion and includes a protruding portion that can enter between adjacent coils of the coil spring.
The contact probe according to claim 1, wherein the conductive longitudinal member includes a bulging portion that bulges toward the coil spring in the middle of the extending portion in the vertical direction.
The electroconductive longitudinal member is obtained by performing an electroforming process in which a metal is deposited by a plating method in an opening patterned by photolithography on a substrate. Contact probe.
The contact probe according to claim 4, wherein the metal is made of Ni.
The contact probe according to claim 4, wherein the metal is made of Cu and Ni, and the deposition is made up of a Cu layer, a Ni layer, and a Cu layer in that order from the bottom.
7. The conductive longitudinal member is subjected to a baking step of baking at a temperature of 200 ° C. to 300 ° C. in a predetermined gas atmosphere after the electroforming step. Contact probe.