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TW202020024A - 樹脂組成物、其硬化膜、固體攝像元件、有機電致發光元件、顯示裝置 - Google Patents

樹脂組成物、其硬化膜、固體攝像元件、有機電致發光元件、顯示裝置 Download PDF

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Publication number
TW202020024A
TW202020024A TW108130716A TW108130716A TW202020024A TW 202020024 A TW202020024 A TW 202020024A TW 108130716 A TW108130716 A TW 108130716A TW 108130716 A TW108130716 A TW 108130716A TW 202020024 A TW202020024 A TW 202020024A
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TW
Taiwan
Prior art keywords
general formula
resin composition
polysiloxane
group
mol
Prior art date
Application number
TW108130716A
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English (en)
Chinese (zh)
Inventor
日比野利保
的羽良典
諏訪充史
藤井真実
Original Assignee
日商東麗股份有限公司
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Publication date
Application filed by 日商東麗股份有限公司 filed Critical 日商東麗股份有限公司
Publication of TW202020024A publication Critical patent/TW202020024A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
    • C08K5/27—Compounds containing a nitrogen atom bound to two other nitrogen atoms, e.g. diazoamino-compounds
    • C08K5/28—Azides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Silicon Polymers (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
TW108130716A 2018-08-31 2019-08-28 樹脂組成物、其硬化膜、固體攝像元件、有機電致發光元件、顯示裝置 TW202020024A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018162721 2018-08-31
JP2018-162721 2018-08-31

Publications (1)

Publication Number Publication Date
TW202020024A true TW202020024A (zh) 2020-06-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW108130716A TW202020024A (zh) 2018-08-31 2019-08-28 樹脂組成物、其硬化膜、固體攝像元件、有機電致發光元件、顯示裝置

Country Status (5)

Country Link
JP (1) JP7327163B2 (ja)
KR (1) KR20210052431A (ja)
CN (1) CN112368336A (ja)
TW (1) TW202020024A (ja)
WO (1) WO2020045214A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021186994A1 (ja) * 2020-03-16 2021-09-23 セントラル硝子株式会社 組成物、組成物前駆体の溶液、組成物の製造方法、基板、及びパターン付き基板の製造方法
JPWO2022131278A1 (ja) * 2020-12-15 2022-06-23
WO2023171487A1 (ja) * 2022-03-07 2023-09-14 東レ株式会社 感光性樹脂組成物、硬化物、表示装置および表示装置の製造方法
CN116107163A (zh) * 2022-12-28 2023-05-12 上海玟昕科技有限公司 一种含纳米粒子的正性光刻胶组合物

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4488215B2 (ja) * 2004-08-19 2010-06-23 信越化学工業株式会社 レジスト組成物並びにこれを用いたパターン形成方法
JP5560518B2 (ja) 2005-09-28 2014-07-30 東レ株式会社 熱硬化性樹脂組成物
JP4896755B2 (ja) * 2007-02-01 2012-03-14 東京応化工業株式会社 液晶表示素子用平坦化絶縁膜形成用組成物および液晶表示素子用平坦化絶縁膜の製造方法
JP5105073B2 (ja) * 2008-03-24 2012-12-19 Ｊｓｒ株式会社 感放射線性樹脂組成物、ならびに層間絶縁膜およびマイクロレンズの製造方法
WO2011040248A1 (ja) * 2009-09-29 2011-04-07 東レ株式会社 ポジ型感光性樹脂組成物、それを用いた硬化膜および光学デバイス
WO2011136073A1 (ja) * 2010-04-28 2011-11-03 Jsr株式会社 ポジ型感放射線性組成物、表示素子用層間絶縁膜及びその形成方法
JP5648518B2 (ja) * 2011-02-10 2015-01-07 Jsr株式会社 ポジ型感放射線性樹脂組成物、表示素子用層間絶縁膜及びその形成方法
JP6201280B2 (ja) * 2011-03-30 2017-09-27 東レ株式会社 シロキサン系樹脂組成物の製造方法、それを用いた硬化膜、光学物品および固体撮像素子の製造方法
JP5830978B2 (ja) * 2011-07-04 2015-12-09 東レ株式会社 シロキサン系樹脂組成物およびその製造方法、それを硬化してなる硬化膜ならびにそれを有する光学物品および固体撮像素子
CN110095941B (zh) * 2011-12-26 2023-02-17 东丽株式会社 感光性树脂组合物和半导体元件的制造方法
JP6281288B2 (ja) * 2013-01-21 2018-02-21 セントラル硝子株式会社 ヘキサフルオロイソプロパノール基を含む珪素化合物およびその製造方法、並びにそれが重合してなる高分子化合物
JP6318634B2 (ja) * 2013-02-14 2018-05-09 東レ株式会社 感光性シロキサン組成物、硬化膜及び素子
WO2014156520A1 (ja) * 2013-03-28 2014-10-02 東レ株式会社 感光性樹脂組成物、保護膜又は絶縁膜、タッチパネル及びその製造方法
JP6358416B2 (ja) * 2013-07-11 2018-07-18 日産化学工業株式会社 アルコキシシリル基を含有する固体撮像素子用高屈折率膜形成組成物
JP2015017195A (ja) * 2013-07-11 2015-01-29 日産化学工業株式会社 固体撮像素子用リフロー型高屈折率膜形成組成物
JP6323225B2 (ja) 2013-11-01 2018-05-16 セントラル硝子株式会社 ポジ型感光性樹脂組成物、それを用いた膜の製造方法および電子部品
CN111801621A (zh) * 2018-02-28 2020-10-20 中央硝子株式会社 含硅层形成组合物和使用其制造带图案的基板的方法

Also Published As

Publication number Publication date
JPWO2020045214A1 (ja) 2021-08-10
CN112368336A (zh) 2021-02-12
KR20210052431A (ko) 2021-05-10
WO2020045214A1 (ja) 2020-03-05
JP7327163B2 (ja) 2023-08-16

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