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TW202003750A - 黏著帶 - Google Patents

黏著帶 Download PDF

Info

Publication number
TW202003750A
TW202003750A TW108119482A TW108119482A TW202003750A TW 202003750 A TW202003750 A TW 202003750A TW 108119482 A TW108119482 A TW 108119482A TW 108119482 A TW108119482 A TW 108119482A TW 202003750 A TW202003750 A TW 202003750A
Authority
TW
Taiwan
Prior art keywords
adhesive
group
structural formula
adhesive layer
adhesive tape
Prior art date
Application number
TW108119482A
Other languages
English (en)
Chinese (zh)
Inventor
塩島太郎
麻生隆浩
樋口勲夫
Original Assignee
日商積水化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW202003750A publication Critical patent/TW202003750A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C09J133/16—Homopolymers or copolymers of esters containing halogen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J143/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium, or a metal; Adhesives based on derivatives of such polymers
    • C09J143/04—Homopolymers or copolymers of monomers containing silicon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW108119482A 2018-06-05 2019-06-05 黏著帶 TW202003750A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2018-108014 2018-06-05
JP2018108014 2018-06-05

Publications (1)

Publication Number Publication Date
TW202003750A true TW202003750A (zh) 2020-01-16

Family

ID=68770408

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108119482A TW202003750A (zh) 2018-06-05 2019-06-05 黏著帶

Country Status (3)

Country Link
JP (1) JP7348838B2 (ja)
TW (1) TW202003750A (ja)
WO (1) WO2019235487A1 (ja)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2582875B2 (ja) * 1988-11-01 1997-02-19 日東電工株式会社 再剥離型粘着剤
JPH04117475A (ja) * 1990-09-07 1992-04-17 Toyo Ink Mfg Co Ltd 再剥離型粘着剤組成物
JP2601956B2 (ja) * 1991-07-31 1997-04-23 リンテック株式会社 再剥離型粘着性ポリマー
US8389629B2 (en) * 2007-10-16 2013-03-05 Denki Kagaku Kogyo Kabushiki Kaisha Adhesive, adhesive sheet, multi-layered adhesive sheet, and production method for electronic part
JP5379919B1 (ja) * 2013-02-13 2013-12-25 古河電気工業株式会社 半導体加工用粘着テープ
JP5607847B1 (ja) * 2013-11-29 2014-10-15 古河電気工業株式会社 半導体加工用粘着テープ
KR101709689B1 (ko) * 2013-12-19 2017-02-23 주식회사 엘지화학 다이싱 필름 점착층 형성용 조성물 및 다이싱 필름
CN110225824B (zh) 2017-02-14 2021-06-11 王子控股株式会社 剥离性膜

Also Published As

Publication number Publication date
WO2019235487A1 (ja) 2019-12-12
JPWO2019235487A1 (ja) 2021-04-30
JP7348838B2 (ja) 2023-09-21

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