TW202002351A - Display panel and manufacturing method thereof - Google Patents

Abstract

A display panel includes a substrate, an active device layer disposed on the substrate, an insulating layer disposed on the active device layer, a plurality of first electrodes separated from each other, a plurality of dielectric patterns separated from each other and disposed on the first electrodes, a plurality of organic light-emitting patterns, and a second electrode disposed on the organic light-emitting patterns. The insulating layer has a plurality of first areas and a second area in between the first areas. The first electrodes are respectively disposed on the first areas of the insulating layer. The dielectric patterns are respectively disposed on the first electrode and have a plurality of openings. The openings are respectively overlapped with the first electrodes. The organic light-emitting patterns are respectively disposed on the dielectric patterns and in the openings. The gap between dielectric patterns overlaps with the second area of the insulating layer. A manufacturing method of the display panel is also provided.

Description

Display panel and manufacturing method thereof

The invention relates to a display panel and a manufacturing method thereof, and in particular to a display panel with a dielectric pattern and a manufacturing method thereof.

Organic light emitting diode (Organic light emitting diode; OLED) has advantages such as long life, thin thickness, high contrast, low heat generation, and low power consumption, so it has been widely used as an indicator or light source in homes and various devices.

Ink Jet Printing (IJP) technology can improve the material utilization rate in the OLED process to reduce the process cost, but before the inkjet coating needs to form a corresponding pixel set hydrophobic bank (bank), to Define the area of each pixel. However, when the droplets are sprayed into the containing space formed by the retaining wall, the difference between the surface tension of the liquid and the adhesion of the sidewall of the retaining wall results in poor uniformity of the thickness of the film formed by the subsequent drying process, resulting in the surrounding of the pixels The brightness and chromaticity are obviously different from the center.

The invention provides a display panel which can improve the aperture ratio and the uniformity of the film thickness and provide good display quality.

The display panel of the present invention includes a substrate, an active device layer disposed on the substrate, an insulating layer disposed on the active device layer, and having a plurality of first regions and a second region between the first regions, and a plurality of first electrodes separated from each other And are respectively disposed on the first region of the insulating layer, a plurality of dielectric patterns are separated from each other and are respectively disposed on the first electrode and have a plurality of openings, and a plurality of organic light emitting patterns are respectively disposed on and in the dielectric patterns, and The second electrode is disposed on the organic light emitting pattern. The openings overlap with the first electrodes, respectively. The gap between the dielectric patterns overlaps the second region of the insulating layer.

The manufacturing method of the display panel of the present invention includes the following steps. Provide a substrate. The active device layer is arranged on the substrate. An insulating layer is disposed on the active device layer. The insulating layer has a plurality of first regions and a second region between the first regions. A plurality of first electrodes are provided on the insulating layer. The first electrodes are separated from each other and are respectively located on the first region. A plurality of dielectric patterns are provided on the first electrode. The dielectric patterns are separated from each other and have a plurality of openings. The openings overlap with the first electrodes, the gap between the dielectric patterns overlaps with the second region of the insulating layer, and the gap exposes the insulating layer. The insulating layer with the exposed gap is surface-treated. A plurality of organic light emitting patterns are arranged on the dielectric pattern and in the opening. And, a second electrode is provided on the organic light emitting pattern.

Based on the above, in the display panel according to an embodiment of the present invention, since the display panel is provided with a dielectric pattern on the first electrode, and the dielectric pattern has hydrophilicity and/or ink affinity, the insulation between the gaps between the dielectric patterns is exposed The layer can be hydrophobic and/or ink repellent by surface treatment. Therefore, the organic light emitting pattern can be fixed to the dielectric pattern. In this way, the display panel can define a plurality of pixel structures without using a conventional retaining wall structure, and can avoid mixing or color mixing of adjacent organic light-emitting patterns, and can further increase the aperture ratio of the display panel and enhance the display quality. In addition, since this embodiment does not require a conventional retaining wall structure, the film thickness of the organic light-emitting pattern can be uniform and uniform, so that the display panel can provide uniform brightness and good display quality.

In order to make the above-mentioned features and advantages of the present invention more obvious and understandable, the embodiments are specifically described below in conjunction with the accompanying drawings for detailed description as follows.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. Throughout the specification, the same reference numerals denote the same elements. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “connected to” another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connections. Furthermore, "electrical connection" or "coupling" may be that there are other elements between the two elements.

It should be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers, and/or sections, these elements, components, regions, and/or Or part should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Accordingly, "first element", "component", "region", "layer" or "portion" discussed below may be referred to as a second element, component, region, layer or section without departing from the teachings herein.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology and the present invention, and will not be interpreted as idealized or excessive Formal meaning unless explicitly defined as such in this article.

FIG. 1A to FIG. 1F are schematic cross-sectional views of a manufacturing process of a display panel according to an embodiment of the invention. FIG. 2A is a schematic partial top view of a display panel before a plurality of dielectric patterns are provided in an embodiment of the invention. 2B is a schematic partial top view of a display panel according to an embodiment of the invention. For convenience of description and observation, FIGS. 2A and 2B only schematically show some components. In this embodiment, the display panel 10 (shown in FIG. 1F) includes a substrate 100, an active device layer 120, an insulating layer 140, a plurality of first electrodes 150, a plurality of dielectric patterns 160, a plurality of organic light emitting patterns 200, and Second electrode 180. The method for manufacturing the display panel 10 will be described below with an embodiment.

Please refer to FIG. 1A, the substrate 100 is provided first. The material of the substrate 100 may be glass, quartz, organic polymer, opaque/reflective material (for example: conductive material, metal, wafer, ceramic, or other applicable materials) or other applicable materials. If a conductive material or metal is used, a layer of insulating material (not shown) is covered on the substrate 100 to avoid short circuit problems.

Next, the active device layer 120 is provided on the substrate 100. The active device layer 120 may be, for example, an active device array (not shown), wherein the active device array described above includes a plurality of thin film transistors (TFTs) (not shown). The thin film transistor is, for example, low temperature poly-Si (LTPS) or amorphous silicon thin-film transistor (a-Si), but the invention is not limited thereto.

Next, an insulating layer 140 is provided on the active device layer 120. The insulating layer 140 has a plurality of first regions 12 and a second region 14 between these first regions 12. In this embodiment, the material of the insulating layer 140 includes an inorganic material. The inorganic material includes silicon nitride (SiN _x ) or other suitable materials, and the invention is not limited thereto.

Then, a plurality of first electrodes 150 are disposed on the insulating layer 140. These first electrodes 150 are separated from each other and are respectively located on the first region 12. Please refer to FIG. 1A and FIG. 2A at the same time. In this embodiment, each first electrode 150 is disposed on each first region 12, and the plurality of first regions 12 are separated by the second region 14 to be independent of each other. In this embodiment, each first electrode 150 is located in the corresponding first region 12 and is arranged in an array independently of each other, but the invention is not limited thereto. In other embodiments, each first electrode 150 may also be arranged in a pre-designed pattern shape.

In an embodiment, the first electrode 150 may be a single-layer, double-layer or multi-layer structure. The material of the first electrode 150 may be a conductor material, for example: aluminum (Al), silver (Ag), chromium (Cr), copper (Cu), nickel (Ni), titanium (Ti), molybdenum (Mo), magnesium ( Mg), platinum (Pt), gold (Au), etc., or may be, for example, metal oxides, such as indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, indium gallium oxide Etc., or other suitable materials, or a stack of at least two of the above. For example, the first electrode 150 may be a three-layer structure composed of ITO/Ag/ITO, but the invention is not limited thereto. In other embodiments, the first electrode 150 may also be Ti/Al/Ti or a three-layer structure composed of Mo/Al/Mo. In some embodiments, the first electrode 150 may be formed by chemical vapor deposition (CVD), physical vapor deposition (PVD), atomic layer deposition (ALD), vapor deposition (VTE), sputtering (SPT), or Its combination. In some embodiments, the first electrode 150 may serve as an anode of the organic light emitting pattern 200, but the present invention is not limited thereto.

Please refer to FIG. 1B and FIG. 2A, and then, a plurality of dielectric layers 160 are disposed on the first electrodes 150. For example, the dielectric patterns 160 partially overlap the first electrodes 150 in a direction perpendicular to the substrate 100, and a portion of the dielectric patterns 160 is located in the second region 14. These dielectric patterns 160 are separated from each other and have a plurality of openings 162. These openings 162 are located in the first region 12 and overlap the corresponding first electrodes 150 in the direction perpendicular to the substrate 100, respectively. Specifically, the openings 162 expose the first electrodes 150. In this embodiment, the gap D between these dielectric patterns 160 overlaps the second region 14 of the insulating layer 140, and the gap D exposes the insulating layer. In this embodiment, the method of forming the dielectric pattern 160 firstly forms a dielectric material (not shown) on the insulating layer 140 over the entire surface and covers the first electrode 150. The dielectric material is patterned through, for example, a yellow photolithography process to form a plurality of dielectric patterns 160 and corresponding openings 162 separated from each other, but the invention is not limited thereto.

It is worth mentioning that please refer to FIG. 1C, and then, the insulating layer 140 exposed to the gap D is subjected to a surface treatment 300. For example, the step of performing the surface treatment 300 includes plasma treatment of the insulating layer 140 with tetrafluoromethane (CF ₄ ) as a working gas. In this embodiment, after the step of surface treatment 300 is performed, the insulating layer 140 exposed in the gap D has a high contact angle for Propylene glycol methyl ether acetate (PGMEA), and the contact angle is greater than 40°. In other words, the insulating layer 140 exposed by the gap D has hydrophobicity and/or ink repellency. Specifically, the exposed insulating layer 140 has a hydrophobic surface. In this way, compared to the conventional method of forming a receiving space for defining a pixel structure through a retaining wall structure, this embodiment does not require a retaining wall structure to accommodate a subsequently formed organic light-emitting pattern 200, and a pixel can be defined Structure and avoid mixing or color mixing of the organic light emitting patterns 200 on the adjacent dielectric patterns 160.

Next, please refer to FIG. 1D, FIG. 1E and FIG. 2B, a plurality of organic light emitting patterns 200 are disposed on the dielectric patterns 160 and in the openings 162, respectively. Please refer to FIG. 1D first. In this embodiment, in order to increase the utilization rate of the material and reduce the manufacturing cost of the display panel 10, the organic light emitting pattern 200 may be formed by an ink jet printing (IJP) process. For example, the organic light emitting material 200' may be disposed on the dielectric pattern 160 by an inkjet coating process and located in the opening 162 and contact the first electrode 150. The organic light emitting material 200' is, for example, a liquid material of the organic light emitting pattern 200 as a pixel.

Then, referring to FIGS. 1D, 1E, and 2, through a curing process (not shown), the liquid organic light-emitting material 200' is dried to form a solid organic light-emitting pattern 200. In some embodiments, the organic light emitting pattern 200 may be a multi-layer structure, including a hole injection layer (HIL), a hole transfer layer (HTL), and an emission layer (EL). For convenience of description and clear representation, FIG. 1E is represented by only one layer structure.

In some embodiments, the material of the hole injection layer is, for example, xylylene copper, star arylamines, polyaniline, polyethylene dioxythiophene, or other suitable materials. The material of the hole transport layer is, for example, triaromatic amines, cross-structured diamine biphenyl, diamine biphenyl derivatives or other suitable materials. The light-emitting layer may be a red organic light-emitting pattern, a green organic light-emitting pattern, a blue organic light-emitting pattern, or a different color (for example, white, orange, yellow, etc.) light-emitting pattern generated by mixing light of various spectra.

It is worth noting that the difference between the surface tension of the liquid and the adsorption force of the retaining wall structure will cause the film thickness to be uneven during the drying process. Therefore, the thickness of the organic light-emitting pattern formed by the above-mentioned conventional process increases as The structure of the retaining wall is increasing, which leads to uneven film thickness. Since the display panel 10 according to an embodiment of the invention is provided with the dielectric pattern 160 on the first electrode 150, and the PGMEA contact angle of the dielectric pattern 160 is less than 10°. In other words, the dielectric pattern 160 has hydrophilicity and/or ink affinity. Therefore, the droplet-shaped organic light emitting material 200' can be adsorbed onto the dielectric pattern 160 and fixed to the dielectric pattern 160 through the hydrophobic and/or ink repellent insulating layer 140. In this way, in this embodiment, a plurality of pixel structures can be defined without requiring a conventional retaining wall structure to accommodate these organic light-emitting materials 200'. Therefore, in addition to avoiding the mixing or color mixing of the organic light emitting patterns 200 on the adjacent dielectric patterns 160, the dielectric patterns 160 can further increase the aperture ratio of the display panel 10 and improve the display quality. In addition, since this embodiment does not require a conventional retaining wall structure, the thickness of the organic light-emitting pattern 200 formed after curing the organic light-emitting material 200' can be uniform and uniform to provide uniform brightness and good display quality.

Please refer to FIGS. 1F and 2B. FIG. 1F is a schematic cross-sectional view of the display panel 10 of FIG. 2B along the cross-sectional line A-A'. Then, the second electrode 180 is provided on the organic light emitting pattern 200. In this embodiment, before the step of providing the second electrode 180, it may further include providing an electron transport layer 170 between the organic light emitting pattern 200 and the second electrode 180. The electron transport layer 170 is formed on the organic light emitting pattern 200 by a thermal evaporation process, for example, to reduce the driving voltage of the organic light emitting pattern 200. The electron transport layer 170 is, for example, provided over the entire surface of the insulating layer 140 and covering the dielectric pattern 160, and is exposed to the insulating layer 140 exposed to the gap D in the second region 14. In this embodiment, the material of the electron transport layer may be an oxazole derivative and its dendrimer, a metal chelate compound (such as Alq3), an azole compound, a diazoanthracene derivative, a silicon-containing heterocyclic compound, or other suitable s material.

In this embodiment, the second electrode 180 may be disposed on the organic light emitting pattern 200 over the entire surface and overlap the dielectric pattern 160, the organic light emitting pattern 200, and the first electrode 150, but the invention is not limited thereto. The material of the second electrode 180 may be a transparent conductive material, such as indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, or indium germanium zinc oxide. In some embodiments, the second electrode 180 may be formed by chemical vapor deposition (CVD), physical vapor deposition (PVD), atomic layer deposition (ALD), vapor deposition (VTE), sputtering (SPT), or Its combination. In some embodiments, the second electrode 180 may serve as a cathode of the organic light emitting pattern 200.

In short, since the display panel 10 according to an embodiment of the present invention is provided with a dielectric pattern 160 on the first electrode 150, and the dielectric pattern 160 has hydrophilicity and/or ink affinity, the gap D between the dielectric patterns 160 The exposed insulating layer 140 may have hydrophobicity and/or ink repellency through the surface treatment 300. Therefore, the droplet-shaped organic light-emitting material 200' can be adsorbed onto the dielectric pattern 160 and pushed away by the hydrophobicity and/or ink repellency of the gap D of the insulating layer 140 to be fixed on the dielectric pattern 160. In this way, the present display panel 10 can define a plurality of pixel structures without accommodating the organic light-emitting materials 200' through a conventional retaining wall structure. Therefore, in addition to avoiding the mixing or color mixing of the organic light emitting patterns 200 on the adjacent dielectric patterns 160, the dielectric patterns 160 can further increase the aperture ratio of the display panel 10 and improve the display quality. In addition, the manufacturing process of the display panel 10 can be simplified and the manufacturing cost can be reduced. In addition, since this embodiment does not require a conventional retaining wall structure, the thickness of the organic light emitting pattern 200 formed after curing the organic light emitting material 200' can be uniform and uniform, so that the display panel 10 can provide uniform brightness and good Display quality.

In terms of structure, please refer to FIGS. 1F and 2B, the display panel 10 includes a substrate 100, an active device layer 120 disposed on the substrate 100, an insulating layer 140 disposed on the active device layer 120, a plurality of first electrodes 150, a plurality of The dielectric pattern 160, the plurality of organic light emitting patterns 200 and the second electrode 180 are disposed on the organic light emitting pattern 200. The insulating layer 140 has a plurality of first regions 12 and a second region 14 between these first regions 12. The first electrodes 150 are separated from each other and are respectively disposed on the first regions 12 of the insulating layer 140. The dielectric patterns 160 are separated from each other and are respectively disposed on the first electrodes 150, and have a plurality of openings 162. The openings 162 overlap the first electrodes 150 in the direction perpendicular to the substrate 100. The organic light emitting patterns 200 are respectively disposed on the dielectric patterns 200 and in the openings 162, and the gap D between the dielectric patterns overlaps the second region 14 of the insulating layer 140. The second electrode 180 is disposed on the organic light emitting pattern 200. In this embodiment, the display panel 10 further includes an electron transport layer 170 disposed between the organic light emitting pattern 200 and the second electrode 180. The electron transport layer 170 contacts the insulating layer 140.

Please refer to FIGS. 1F, 2A and 2B. In this embodiment, the orthographic projection of each first electrode 150 on the substrate 100 is in the orthographic projection of each dielectric pattern 160 on the substrate 100. In other words, a portion of the dielectric pattern 160 may overlap and contact the first electrode 150, and another portion overlap and contact the insulating layer 140. In addition, the organic light emitting pattern 200 overlaps the dielectric pattern 160. The outer edge of the orthographic projection of the dielectric pattern 160 on the substrate 100 is within the orthographic projection edge of the organic light emitting pattern 200 on the substrate 100. The organic light emitting pattern 200 is in contact with the insulating layer 140 in the gap D. Under the above arrangement, the organic light emitting pattern 200 may be fixed to the dielectric pattern 160. In this way, the display panel 10 can define a plurality of pixel structures without using a conventional retaining wall structure, and can avoid mixing or color mixing of adjacent organic light-emitting patterns 200 to improve display quality. In addition, since this embodiment does not require a conventional retaining wall structure, the film thickness of the organic light-emitting pattern 200 can be uniform and uniform, so that the display panel 10 can provide uniform brightness and good display quality.

In this embodiment, in the direction perpendicular to the substrate 100, the distance W1 from the edge of the opening 162 to the second region 14 is greater than or equal to 1 micrometer and less than or equal to 5 micrometers. In addition, the distance W2 from the edge of the first electrode 150 to the outer edge of the dielectric pattern 160 is 1 μm or more and 5 μm or less. Under the above arrangement, the size of the opening 160 can be adjusted to increase the aperture ratio, and the distance between adjacent organic patterns 200 can be further reduced to increase the number of pixel structures, so the display panel 10 can be further improved Display quality.

In short, since the display panel 10 according to an embodiment of the present invention is provided with a dielectric pattern 160 on the first electrode 150, and the dielectric pattern 160 has hydrophilicity and/or ink affinity, the gap D between the dielectric patterns 160 The exposed insulating layer 140 may have hydrophobicity and/or ink repellency through the surface treatment 300. Therefore, the organic light emitting pattern 200 may be fixed to the dielectric pattern 160. In this way, the display panel 10 can define a plurality of pixel structures without using a conventional retaining wall structure, and can avoid mixing or color mixing of adjacent organic light emitting patterns 200, and can further increase the aperture ratio of the display panel 10 To improve display quality. In addition, since this embodiment does not require a conventional retaining wall structure, the film thickness of the organic light-emitting pattern 200 can be uniform and uniform, so that the display panel 10 can provide uniform brightness and good display quality.

The following embodiments continue to use the element numbers and partial contents of the previous embodiments, wherein the same reference numerals are used to denote the same or similar elements. For the description of the parts that omit the same technical content, please refer to the previous embodiments. Repeat the details.

3A is a schematic cross-sectional view of a display panel according to another embodiment of the invention. The display panel 10A shown in this embodiment is similar to the display panel 10 shown in FIG. 1F. The main difference is that the second region 14 of the insulating layer 140 has a convex structure 142A, and the convex structure 142A is on the substrate 100. The projection is separated from the orthographic projection of the first electrode 150 on the substrate 100. In this embodiment, the convex structure 142A and the insulating layer 140 are the same film layer. For example, after the insulating layer 140 is formed, the insulating layer 140 may be patterned through the yellow photolithography process to form the raised structure 142A in the second region 14. Under the above arrangement, the convex structure 142A may be formed between the adjacent first electrodes 150 and assist the dielectric pattern 160 to define a plurality of pixel structures. Specifically, the convex structure 142A can further prevent the adjacent organic light emitting patterns 200 from mixing or mixing due to flow. In addition, the convex structure 142A is located in the second region 14 that does not have a light-emitting function between the first electrodes 150, and therefore does not affect the aperture ratio of the display panel 10A. In this way, the display panel 10A can obtain technical effects similar to those of the foregoing embodiments.

In this embodiment, the height H1A of the convex structure 142A is equal to or greater than 0.1 μm and equal to or less than 10 μm. For example, the height H1A of the convex structure 142A is the height from the top surface 143A of the convex structure 142A to the surface of the insulating layer 140. Under the above arrangement, the height H1A of the convex structure 142A can be adjusted to be similar to the thickness of the organic light emitting pattern 200. Therefore, the film thickness of the organic light emitting pattern 200 can be uniform, and the generation of leakage current can be further reduced, so that the display panel 10 can provide uniform brightness and good display quality.

3B is a schematic cross-sectional view of a display panel according to another embodiment of the invention. The display panel 10B shown in this embodiment is similar to the display panel 10A shown in FIG. 3A, the main difference is that the cross-sectional shape of the convex structure 142B of the display panel 10B is an arc shape, and the convex structure 142A of the display panel 10A Has a trapezoidal cross-sectional shape. In this way, the display panel 10B can obtain technical effects similar to those of the foregoing embodiments.

In summary, the display panel and the manufacturing method thereof according to an embodiment of the present invention, because the display panel is provided with a dielectric pattern on the first electrode, and the dielectric pattern has hydrophilicity and/or ink affinity, and between the dielectric patterns The insulating layer exposed by the gap can be hydrophobic and/or ink repellent through surface treatment. Therefore, the organic light emitting pattern can be fixed to the dielectric pattern. In this way, the display panel can define a plurality of pixel structures without using a conventional retaining wall structure, and can avoid mixing or color mixing of adjacent organic light-emitting patterns, and can further increase the aperture ratio of the display panel and enhance the display quality. In addition, since this embodiment does not require a conventional retaining wall structure, the film thickness of the organic light-emitting pattern can be uniform and uniform, so that the display panel can provide uniform brightness and good display quality. In addition, a convex structure may be formed between adjacent first electrodes to further avoid mixing or color mixing of adjacent organic light emitting patterns due to flow. In addition, the convex structure is located in the second region that does not have a light-emitting function between the first electrodes, and therefore does not affect the aperture ratio of the display panel. In addition, the height of the raised structure can be adjusted to be similar to the thickness of the organic light emitting pattern. Therefore, the film thickness of the organic light emitting pattern can be uniform, and the generation of leakage current can be further reduced, so that the display panel can provide uniform brightness and good display quality.

Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to the scope defined in the appended patent application.

10, 10A, 10B ‧‧‧ Display panel 12‧‧‧ First area 14‧‧‧ Second area 100‧‧‧ Substrate 120‧‧‧ Active element layer 140‧‧‧‧Insulation layer 142A, 142B‧‧‧Bump Structure 150‧‧‧first electrode 160‧‧‧dielectric pattern 162‧‧‧ opening 170‧‧‧electron transport layer 180‧‧‧second electrode 200‧‧‧ organic light emitting pattern 200′‧‧‧ organic light emitting material 300 ‧‧‧Surface treatment A-A'‧‧‧Hatchline D‧‧‧Gap H1A‧‧‧Height W1‧‧‧First distance W2‧‧‧Second distance

FIG. 1A to FIG. 1F are schematic cross-sectional views of a manufacturing process of a display panel according to an embodiment of the invention. FIG. 2A is a schematic partial top view of a display panel before a plurality of dielectric patterns are provided in an embodiment of the invention. 2B is a schematic partial top view of a display panel according to an embodiment of the invention. 3A is a schematic cross-sectional view of a display panel according to another embodiment of the invention. 3B is a schematic cross-sectional view of a display panel according to another embodiment of the invention.

10‧‧‧Display panel

12‧‧‧ District 1

14‧‧‧District 2

100‧‧‧ substrate

120‧‧‧Active component layer

140‧‧‧Insulation

150‧‧‧First electrode

160‧‧‧Dielectric pattern

162‧‧‧ opening

170‧‧‧Electronic transmission layer

180‧‧‧Second electrode

200‧‧‧ organic light-emitting pattern

A-A’‧‧‧hatching

D‧‧‧clearance

W1‧‧‧ First distance

W2‧‧‧Second distance

Claims (11)

A display panel includes: a substrate; an active element layer disposed on the substrate; an insulating layer disposed on the active element layer, and having a plurality of first regions and a first region between the first regions Two regions; a plurality of first electrodes, separated from each other and disposed on the first regions of the insulating layer; a plurality of dielectric patterns, separated from each other and disposed on the first electrodes, respectively, and having a plurality of openings , The openings overlap with the first electrodes, respectively; a plurality of organic light-emitting patterns are respectively disposed on the dielectric patterns and in the openings, wherein a gap between the dielectric patterns and the insulating layer The second regions overlap; and a second electrode is disposed on the organic light-emitting patterns. The display panel according to item 1 of the patent application scope, wherein the orthographic projection of each of the first electrodes on the substrate is in the orthographic projection of each of the dielectric patterns on the substrate. The display panel as described in item 1 of the patent application range, wherein the distance from the edge of each opening to the second region in the direction perpendicular to the substrate is 1 μm or more and 5 μm or less. The display panel according to item 1 of the patent application scope, wherein the organic light-emitting patterns overlap the dielectric patterns, and the outer edge of the orthographic projection of the dielectric patterns on the substrate is on the organic light-emitting patterns on the substrate Within the orthographic projection edge, and each of the organic light emitting patterns is in contact with the insulating layer in the gap. The display panel as described in item 1 of the patent application scope further includes an electron transport layer disposed between the organic light-emitting patterns and the second electrode, and the electron transport layer contacts the insulating layer. The display panel according to item 1 of the patent application scope, wherein the second region of the insulating layer has a raised structure, and the raised structure and the insulating layer are the same film layer. The display panel as described in item 6 of the patent application range, wherein the height of the raised structure is greater than or equal to 0.1 microns and less than or equal to 10 microns. The display panel according to item 6 of the patent application scope, wherein the orthographic projection of the convex structure on the substrate is separated from the orthographic projection of the first electrode on the substrate. A manufacturing method of a display panel includes: providing a substrate; disposing an active device layer on the substrate; disposing an insulating layer on the active device layer, the insulating layer having a plurality of first regions and the first regions A second region between them; setting a plurality of first electrodes on the insulating layer, the first electrodes are separated from each other and located on the first regions respectively; setting a plurality of dielectric patterns on the first electrodes, The dielectric patterns are separated from each other and have a plurality of openings, the openings respectively overlap the first electrodes, a gap between the dielectric patterns overlaps the second region of the insulating layer, and the gap is exposed The insulating layer; performing a surface treatment on the insulating layer exposed in the gap; disposing a plurality of organic light emitting patterns on the dielectric patterns and the openings; and disposing a second electrode on the organic light emitting patterns . The method for manufacturing a display panel as described in item 9 of the patent application scope, wherein after performing the surface treatment step, the insulating layer exposed in the gap has a contact angle to propylene glycol methyl ether acetate, and the contact angle is greater than 40 °. The method for manufacturing a display panel as described in item 9 of the patent application range, wherein the step of performing the surface treatment includes plasma treatment of the insulating layer with tetrafluoromethane as a working gas.

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