TW202002275A - Display panel and method for manufacturing the same - Google Patents

Abstract

A display panel has a display area and a peripheral area which surrounds the display area and includes a first substrate, a second substrate, a dielectric layer, and a sealing layer. The first substrate and the second substrate are disposed to be opposite to each other, in which the first substrate has a first region and a second region. The second region is locate within the peripheral area and is away from the display area relative to the first region, and a surface roughness at the second region the first substrate is greater than a surface roughness at the first region of the first substrate. The dielectric layer is disposed on the first substrate and covers above the first region, in which an interface between the dielectric layer and first substrate coincides with an interface between the first and second regions. The sealing layer is disposed between the first and second substrates and covers the second region.

Description

Display panel and manufacturing method thereof

This disclosure relates to a display panel and its manufacturing method.

Among various electronic products of household appliances, display panels have been widely used to output images or operate menus. In response to the current trend in the consumer market, these electronic products with display panels tend to be designed with narrow bezels.

In this regard, in the manufacturing process of the display panel, the substrate and the opposite substrate are first bonded through the colloid layer, and then each panel is separated by cutting the mother sheet. In other words, the bonding relationship between the substrate and the counter substrate is maintained by the colloid layer. In the case of current electronic products toward narrow bezel design, if the layout area of the colloid layer is excessively reduced in order to reduce the bezel, the adhesion relationship between the substrate and the counter substrate will be reduced, and the structural strength of the display panel will therefore be reduced. .

One embodiment of the present disclosure provides a display panel having a display area and a peripheral area surrounding the display area, and the display panel includes a first substrate, a second substrate, a dielectric layer, and a colloid layer. The first substrate and the second substrate are arranged oppositely, wherein the first substrate has a first area and a second area, the second area is located in the peripheral area and away from the display area relative to the first area, and the first substrate is on the surface of the second area The roughness is greater than the surface roughness of the first substrate in the first area. The dielectric layer is disposed on the first substrate and covers the first region. The boundary between the dielectric layer and the first substrate aligns the boundary between the first region and the second region. The colloid layer is disposed between the first substrate and the second substrate and covers the second area.

In some embodiments, the dielectric layer contacts the colloid layer, and the vertical projection of the interface between the dielectric layer and the colloid layer on the first substrate aligns the boundary between the first region and the second region.

In some embodiments, the display panel further includes a dielectric material. The dielectric material is filled between the dielectric layer and the colloid layer, and covers the second area together with the colloid layer.

In some embodiments, the surface roughness of the first substrate in the second area gradually increases away from the display area.

In some embodiments, the second area is completely covered by the colloid layer.

In some embodiments, the first substrate further has a third region, the second region is located between the first region and the third region, and the surface roughness of the first substrate in the second region is greater than the first substrate in the third region Surface roughness, in which the colloid layer more covers the third area.

In some embodiments, the surface roughness of the first substrate in the second region is R microns, and 0<R≦1.

In some embodiments, the display panel further includes organic light emitting diodes. The organic light emitting diode is arranged in the display area.

An embodiment of the disclosure provides a method for manufacturing a display panel, including the following steps. The display element is formed in the display area of the display panel. A dielectric layer is formed on the peripheral area of the display panel and the display area, and covers the display element, and the thickness of the dielectric layer in the peripheral area gradually decreases in a direction away from the display area. Removing the dielectric layer in the peripheral area to expose the area of the substrate located below the dielectric layer in the peripheral area, wherein the process of removing the dielectric layer in the peripheral area is anisotropic and causes The surface roughness of the area of the substrate increases.

In some embodiments, the manufacturing method of the display panel further includes forming a gel layer on the peripheral area of the display panel and covering the substrate area.

In some embodiments, the surface roughness of the substrate in the area gradually increases away from the display area.

In some embodiments, the step of removing the dielectric layer in the peripheral area includes emitting a laser beam to the dielectric layer in the peripheral area to remove the dielectric layer in the peripheral area, wherein the wavelength of the laser beam falls on Ultraviolet or infrared.

With the above configuration, when the display panel is in the manufacturing stage, the excess dielectric layer in the peripheral area can be removed from the first substrate, so that the subsequently formed colloid layer can be closer to the display area, so that the display panel can It is suitable for application as a narrow frame structure. On the other hand, in the process of removing the excess dielectric layer, the first substrate will increase the roughness due to the removal means and may be regarded as having a microstructure. When the formed colloid layer covers the microstructure, the contact area of the colloid layer with the first substrate can be increased to improve the adhesion ability of the colloid layer to the first substrate.

100A, 100B, 100C, 100D, 100E ‧‧‧ display panel

102‧‧‧Display area

104‧‧‧ surrounding area

110‧‧‧The first substrate

111‧‧‧Microstructure

112‧‧‧First dielectric layer

114‧‧‧flat layer

116‧‧‧Second dielectric layer

118‧‧‧third dielectric layer

120‧‧‧conductive layer

130‧‧‧Display element

132‧‧‧First electrode layer

134‧‧‧luminous layer

136‧‧‧Second electrode layer

140‧‧‧ Fourth dielectric layer

140A‧‧‧decreasing thickness

140B‧‧‧Other

150‧‧‧Colloid layer

160‧‧‧Second substrate

162‧‧‧Dielectric material

1B-1B’, 3B-3B’ ‧‧‧ line segment

A1‧‧‧The first area

A2‧‧‧Second area

A3‧‧‧The third area

L1‧‧‧Distance

TH‧‧‧Contact hole

T1, T2, T3, T4‧‧‧ Thickness

W1, W2, W3, W4, W5, W6, W7, W8‧‧‧Width

FIG. 1A is a schematic top view illustrating a manufacturing method of a display panel according to the first embodiment of the present disclosure in the manufacturing stage.

Fig. 1B is a schematic cross-sectional view taken along the line 1B-1B' of Fig. 1A.

FIG. 2A is a schematic cross-sectional view illustrating a manufacturing method of a display panel according to the first embodiment of the present disclosure in the manufacturing stage.

FIG. 2B is an enlarged schematic view of a part of the second region of the first substrate in FIG. 2A

FIG. 3A is a schematic top view illustrating a manufacturing method of a display panel during a manufacturing stage according to some embodiments of the present disclosure.

Fig. 3B is a schematic cross-sectional view taken along the line 3B-3B' of Fig. 3A.

FIG. 4 is a schematic cross-sectional view of a display panel according to a second embodiment of the present disclosure.

FIG. 5 is a schematic cross-sectional view of a display panel according to a third embodiment of the present disclosure.

FIG. 6 is a schematic cross-sectional view of a display panel according to a fourth embodiment of the present disclosure.

FIG. 7 is a schematic cross-sectional view of a display panel according to a fifth embodiment of the present disclosure.

In the following, a plurality of embodiments of the content of the disclosure will be disclosed in a diagram. For the sake of clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this disclosure. That is to say, in some implementations of the content of this disclosure, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventional structures and elements will be shown in a simple schematic manner in the drawings. In this article, the terms first, second, third, etc. are used to identify different elements, regions, and layers, not to limit the content of this disclosure.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. Throughout the specification, the same reference numerals denote the same elements. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected" to another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connections.

As used herein, "about" or "substantially" includes the stated value and the average value within the acceptable deviation range of the specific value determined by those of ordinary skill in the art, taking into account the measurement in question and the measurement-related errors. A certain number (ie, the limitation of the measurement system). For example, "about" or "substantially" may mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%.

It should be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers, and/or portions, these elements, components, regions, and/or Or part should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Therefore, the "first element", "component", "region", "layer" or "portion" discussed below may be referred to as a second element, component, region, layer or section without departing from the teachings herein.

The display panel of the present disclosure can remove part of the layer during the manufacturing process, so that the glue layer for bonding the substrate can be formed at a position closer to the display area, so that the completed display panel can be suitable for narrow applications Border structure.

Please see FIGS. 1A and 1B. FIG. 1A is a schematic top view illustrating the manufacturing method of the display panel 100A according to the first embodiment of the present disclosure during the manufacturing stage, and FIG. 1B is along FIG. 1A A schematic cross-sectional view of the line segment 1B-1B'. The display panel 100A has a display area 102 and a peripheral area 104 surrounding the display area 102. In order not to make the drawing too complicated, the display area 102 in FIG. 1A is not drawn with a mesh bottom. The display panel 100A includes a first substrate 110, where the first substrate 110 may be a light-transmitting substrate, such as, for example, a glass substrate. In the manufacturing stage depicted in FIGS. 1A and 1B, a first dielectric layer 112, a flat layer 114, a second dielectric layer 116, and a third dielectric layer 118 are formed on the first substrate 110 of the display panel 100A , The conductive layer 120, the display element 130 and the fourth dielectric layer 140.

The first dielectric layer 112 is formed on the first substrate 110, and the flat layer 114 is formed on the first dielectric layer 112, and the formed first dielectric layer 112 and the flat layer 114 can be located at least in the display area 102 . The first dielectric layer 112 may be a single-layer structure or a composite layer structure, which includes organic or inorganic materials, such as polyimide, silicon oxide, silicon nitride, silicon oxynitride, other suitable materials, or the above materials The combination. The flat layer 114 may be a single-layer structure or a composite layer structure, which includes an organic material, such as polyimide.

The second dielectric layer 116, the third dielectric layer 118 and the conductive layer 120 are formed on the flat layer 114, wherein the second dielectric layer 116 is located between the flat layer 114 and the third dielectric layer 118, and the second The dielectric layer 116 may extend to cover the sidewalls of the first dielectric layer 112 and the flat layer 114 and the first substrate 110. The second dielectric layer 116 and the third dielectric layer 118 can be used together to define the location of the pixel area of the display panel 100A. For example, the second dielectric layer 116 and the third dielectric layer 118 can be used to define the settings The boundary position of the display element 130 inside the display panel 100A. In addition, the second dielectric layer 116 and the third dielectric layer 118 may have a contact hole TH, which is beneficial to the layout of the internal circuit of the display panel 100A. For example, the conductive layer 120 may be formed in the contact hole TH and used as a display The internal circuit of panel 100A is used. The second dielectric layer 116 and the third dielectric layer 118 may include organic or inorganic materials, such as polyimide, silicon oxide, silicon nitride, silicon oxynitride, other suitable materials, or a combination of the foregoing materials.

The display element 130 is formed on the flat layer 114, and the formed display element 130 is disposed at least in the display area 102 of the display panel 100A. The display element 130 may be a light emitting diode, such as an organic light emitting diode, and includes a first electrode layer 132, a light emitting layer 134, and a second electrode layer 136. The light emitting layer 134 may include an organic material having electroluminescent properties. In some embodiments, the light-emitting layer 134 may be a composite layer structure, for example, the light-emitting layer 134 may further include a stacked electron transport layer, electron injection layer, electron blocking layer, hole transport layer, hole injection layer, or hole blocking Floor. The materials of the first electrode layer 132 and the second electrode layer 136 may be different. For example, the first electrode layer 132 may be a non-transparent conductive material, such as metal, alloy, or other suitable materials, and the second electrode layer 136 may be Transparent conductive materials, such as indium tin oxide, indium zinc oxide, zinc oxide, carbon nanotubes, indium gallium zinc oxide, or other suitable materials. In some embodiments, the first electrode layer 132 and the conductive layer 120 may be formed by patterning the same metal layer, and after patterning, they are separated from each other (ie, electrically isolated). In some embodiments, the order of forming the first electrode layer 132 and the conductive layer 120 may be earlier than the order of forming the second dielectric layer 116, and the order of forming the light emitting layer 134 may be later than the order of forming the second dielectric layer 116 .

The first electrode layer 132 is located between the flat layer 114 and the light-emitting layer 134, and the second electrode layer 136 covers the light-emitting layer 134, and the second electrode layer 136 can extend into the contact hole TH and connect with the conductive layer 120. In addition, at the end of some embodiments, a plurality of thin film transistors (not shown) can be formed on the first substrate 110 in the display area 102 of the display panel 100A, wherein the first electrode layer 132 of the display element 130 is electrically conductive It is connected to the thin film transistor, and the conductive layer 120 can be connected to a voltage supply terminal (not shown). Therefore, when the thin film transistor is driven, the first electrode layer 132 and the second electrode layer 136 can provide light emission therebetween The layer 134 is biased so that the light-emitting layer 134 emits light by electroluminescence. However, the disclosure is not limited to this. In other embodiments, the thin film transistor can be omitted and the driving circuit can be used to control the light emission of the display element 130, such as the first electrode layer 132 and the conductive layer 120 Connect to the drive circuit.

The fourth dielectric layer 140 is formed on the flat layer 114, and the fourth dielectric layer 140 is formed in the display area 102 and the peripheral area 104 of the display panel 100A and covers the second dielectric layer 116 and the third dielectric Layer 118 and display element 130. The fourth dielectric layer 140 can be used as a passivation layer to prevent the layer body or element between it and the first substrate 110 from being damaged by external influences. The fourth dielectric layer 140 may include organic or inorganic materials, such as polyimide, silicon oxide, silicon nitride, silicon oxynitride, other suitable materials, or a combination of the foregoing materials. The fourth dielectric layer 140 may be formed by deposition, for example, by chemical vapor deposition (CVD).

In the case where the fourth dielectric layer 140 is formed by deposition, the thickness of the fourth dielectric layer 140 in the peripheral region 104 gradually decreases in a direction away from the display region 102. For the convenience of description, a dotted line is shown to separate the thickness decreasing portion 140A of the fourth dielectric layer 140 from the other portions 140B. The fourth dielectric layer 140 of decreasing thickness will cover a portion of the second dielectric layer 116. In some embodiments, the decreasing width W1 of the fourth dielectric layer 140 is approximately between 650 μm and 750 μm, such as 700 μm, and the distance L1 from the third dielectric layer 118 is approximately 150 μm Between 250μm, like 200μm.

Please refer to FIG. 2A again. FIG. 2A is a schematic cross-sectional view illustrating the manufacturing method of the display panel 100A according to the first embodiment of the present disclosure at the manufacturing stage, wherein the cross-sectional position of FIG. 2A is the same as that of FIG. 1B, And the production stage depicted in FIG. 2A is subsequent to the production stage of FIGS. 1A and 1B.

In the manufacturing stage depicted in FIG. 2A, the decreasing thickness of the fourth dielectric layer 140 in the peripheral region 104 may be removed, wherein the process of removing the decreasing thickness of the fourth dielectric layer 140 is anisotropic . For example, in some embodiments, the fourth dielectric layer 140 with a decreasing thickness can be removed from the first substrate 110 by emitting a laser beam into the peripheral region 104. The wavelength of the laser beam may fall in the ultraviolet range, such as using a laser beam with a wavelength of about 365 nm, or it may fall in the infrared range, such as using a laser beam with a wavelength of about 1064 nm. In other embodiments, a photomask process may also be used, so that the fourth dielectric layer 140 of decreasing thickness is removed by anisotropic etching. In addition, in the process of removing the fourth dielectric layer 140 of decreasing thickness, the second dielectric layer 116 covered by the fourth dielectric layer 140 of decreasing thickness may also be removed from the first substrate 110.

For convenience of description, the first area A1, the second area A2, and the third area A3 are marked on the first substrate 110, where the first area A1 is the first substrate 110 still formed by the first dielectric layer after the removal process 112 and the area covered by the second dielectric layer 116, the second area A2 is the area where the first substrate 110 is exposed due to the removal process, and the third area A3 is the area where the first substrate 110 is not before the removal process The area covered by the first dielectric layer 112, the second dielectric layer 116, and the fourth dielectric layer 140, wherein the second area A2 and the third area A3 are located in the peripheral area 104 and away from the display area relative to the first area A1 102, and the second area A2 is located between the first area A1 and the third area A3.

After the removal process, the decreasing thickness of the fourth dielectric layer 140 and the second dielectric layer 116 covered by it can expose the second area A2 of the first substrate 110, while the remaining second dielectric layer 116 remains It is located on the first substrate 110 and covers at least the first area A1. Specifically, the boundary between the second dielectric layer 116 and the first substrate 110 will cut the boundary between the first area A1 and the second area A2.

Since the removed fourth dielectric layer 140 has a decreasing thickness, the second area A2 of the first substrate 110 is gradually exposed in a direction away from the display area 102 during the removal process. That is to say, during the removal process, before the fourth dielectric layer 140 of decreasing thickness is not completely removed, even if a part of the second area A2 of the first substrate 110 has been exposed first, the removal process will continue get on. In other words, in the removal process, in addition to removing the fourth dielectric layer 140, the removal method used (such as using a laser beam) will irradiate the second area A2 of the first substrate 110, and The second area A2 of the first substrate 110 is changed. For example, when the laser beam irradiates the second area A2 of the first substrate 110, the laser beam slightly damages the surface of the second area A2 of the first substrate 110 and causes the surface of the second area A2 of the first substrate 110 The roughness increases. In some embodiments, after the removal process is completed, the surface roughness of the first substrate 110 in the second area A2 is about R microns, and 0<R≦1.

On the other hand, during the removal process, since the surface of the first substrate 110 in the first area A1 is covered by at least one dielectric layer, the surface roughness of the first substrate 110 in the first area A1 does not occur As the second area A2 changes, the surface roughness of the first substrate 110 in the second area A2 is greater than the surface roughness of the first substrate 110 in the first area A1. In addition, during the removal process, a laser beam directed toward the third area A3 of the first substrate 110 may be shielded by the mask so that the surface roughness of the first substrate 110 in the third area A3 will not be generated as the second area The change of A2 causes the surface roughness of the first substrate 110 in the second area A2 to be greater than the surface roughness of the first substrate 110 in the third area A3. Since the second area A2 of the first substrate 110 is gradually exposed away from the display area 102, the second area A2 of the first substrate 110 is exposed to light in the direction away from the display area 102 It will also increase gradually, which will cause the surface roughness of the first substrate 110 in the second area A2 to increase gradually away from the display area 102, for example, see FIG. 2B, which is the first substrate of FIG. 2A An enlarged schematic view of a part of the second area A2 of 110. To help understanding, the ups and downs ratio shown in Figure 2 has been increased. This is only for illustration and description, not for limiting the content of this disclosure. As shown in FIG. 2B, the surface roughness of the first substrate 110 in the second area A2 will gradually increase along the right-to-left direction in FIG. 2B (that is, the direction away from the display area 102 in FIG. 2A), or The degree of undulation is gradually increasing.

Please see FIGS. 3A and 3B. FIG. 3A is a schematic top view illustrating the manufacturing method of the display panel 100A according to some embodiments of the present disclosure during the manufacturing stage, and FIG. 3B is along FIG. 3A. A schematic cross-sectional view of the line segment 3B-3B', and the manufacturing stage depicted in FIGS. 3A and 3B is continued after the manufacturing stage of FIG. 2A.

In the manufacturing stage depicted in FIGS. 3A and 3B, a colloid layer 150 may be formed on the peripheral area 104 of the display panel 100A, where the colloid layer 150 is located on the first substrate 110 and covers the second of the first substrate 110 Area A2 and third area A3. After part of the fourth dielectric layer 140 is removed, the colloid layer 150 may be formed closer to the display area 102. Specifically, if the fourth dielectric layer 140 with a decreasing thickness is not removed, the formation position of the colloid layer 150 will be limited to the third area A3 of the first substrate 110. In this regard, after the fourth dielectric layer 140 of decreasing thickness is removed, the colloid layer 150 can be formed to cover the third area A3 of the first substrate 110 in addition to the third area A3 of the first substrate 110. On the second area A2, it is closer to the display area 102. Since the colloid layer 150 can be formed closer to the display area 102, the third area A3 of the first substrate 110 can be designed to have a smaller width, so that the display panel 100A can be suitably used as a narrow frame structure. In addition, if the fourth dielectric layer 140 whose thickness is gradually reduced is not removed, the formed colloid layer 150 may also cover the fourth dielectric layer 140 and cause poor adhesion.

In some embodiments, after the removal process, the size configuration in the peripheral area 104 may be: the width W2 of the third area A3 not covered by the colloid layer 150 is approximately between 150 μm and 250 μm, such as 200 μm; The width W3 of the colloid layer 150 is about 1800 μm to 2200 μm, like 2000 μm; the fourth dielectric layer 140 covers the width W4 of the second dielectric layer 116 about 150 μm-2 to 0 μm, like 200μm; the width W5 of the third dielectric layer 118 covered by the fourth dielectric layer 140 is about 150μm to 250μm, like 200μm; the width W6 of the contact hole TH is about 700μm to 900μm, like 800 μm; the width W7 of the third dielectric layer 118 covered by the second electrode layer 136 is approximately between 400 μm and 600 μm, like 500 μm. The width W8 of the peripheral region 104 may be between about 3300 μm and 4500 μm, such as 3900 μm.

On the other hand, since the surface roughness of the first substrate 110 in the second area A2 is greater than the surface roughness of other areas, it can be considered that the surface of the first substrate 110 in the second area A2 has a microstructure 111, and this microstructure The 111 series will be covered by at least the colloid layer 150. Through the microstructure 111, the contact area of the colloid layer 150 to the first substrate 110 can be increased, so as to enhance the adhesion ability of the colloid layer 150 to the first substrate 110. The colloid layer 150 may partially cover the second area A2 of the first substrate 110, that is, a part of the second area A2 may not be covered by the colloid layer 150, and the colloid layer 150 may be combined with the remaining fourth dielectric layer 140 is separated by a distance to prevent unexpected results due to process variations.

The second substrate 160 can be assembled on the first substrate 110, that is, the first substrate 110 and the second substrate 160 are disposed oppositely, so that the colloid layer 150 is disposed between the first substrate 110 and the second substrate 160 and can be used In order to fix the second substrate 160 on the first substrate 110. The second substrate 160 may be a light-transmitting substrate, such as, for example, a glass substrate. In addition, a dielectric material 162 can be filled between the first substrate 110 and the second substrate 160 to enhance the structural strength of the display panel 100A and protect the layer body between the first substrate 110 and the second substrate 160 Damaged by outside influence. Since the colloid layer 150 and the remaining fourth dielectric layer 140 are separated by a distance, the dielectric material 162 is also filled between the colloid layer 150 and the remaining fourth dielectric layer 140, and the dielectric material 162 and the colloid The layer 150 may collectively cover the second area A2 to prevent the second area A2 exposed by the fourth dielectric layer 140 of decreasing thickness from being undesirably damaged.

The above-mentioned process of removing the fourth dielectric layer 140 of decreasing thickness can be applied to at least one side of the peripheral region 104 of the display panel 100A. In some embodiments, the process of removing the fourth dielectric layer 140 of decreasing thickness may be applied to a pair of opposite sides of the peripheral region 104 of the display panel 100A, so that a pair of opposite borders of the display panel 100A Can be designed to be a narrow border. In other embodiments, the process of removing the fourth dielectric layer 140 of decreasing thickness can be applied to the three sides of the peripheral area 104 of the display panel 100A, so that the three frames of the display panel 100A can be suitable for design It is a narrow frame, and the remaining unused single frame can be used to configure the driving element or other electrical elements.

Please refer to FIG. 4, which is a schematic cross-sectional view illustrating a display panel 100B according to the second embodiment of the present disclosure, wherein the cross-sectional position of FIG. 4 is the same as that of FIG. 1B. At least one difference between this embodiment and the first embodiment is that the colloid layer 150 of this embodiment contacts the second dielectric layer 116 and the fourth dielectric layer 140, wherein the intersection of the second dielectric layer 116 and the colloid layer 150 The vertical projection of the interface on the first substrate 110 cuts the boundary between the first area A1 and the second area A2, and the vertical projection of the interface of the fourth dielectric layer 140 and the colloid layer 150 on the first substrate 110 is also The boundary between the first area A1 and the second area A2 will be cut. In addition, the second area A2 of the first substrate 110 can be completely covered by the colloid layer 150, thereby enhancing the adhesion ability of the colloid layer 150 to the first substrate 110 through the microstructure 111 formed on the surface of the second area A2 by the first substrate 110 . Since the adhesion structure can be improved through the microstructure 111, the coverage area of the colloid layer 150 can be adjusted and reduced to further narrow the frame of the display panel 100B.

FIG. 5 is a schematic cross-sectional view of a display panel 100C according to a third embodiment of the present disclosure, wherein the cross-sectional position of FIG. 5 is the same as FIG. 1B. At least one difference between this embodiment and the first embodiment is that the colloid layer 150 of this embodiment does not cover the third area A3, that is, the vertical projection of the colloid layer 150 on the first substrate 110 falls within the second area A2 . Since the colloid layer 150 can improve the adhesion ability to the first substrate 110 through the microstructure 111, the covering position of the colloid layer 150 can be adjusted adaptively if the adhesion ability allows, so as to prevent unexpected changes due to process variation result.

FIG. 6 is a schematic cross-sectional view of a display panel 100D according to a fourth embodiment of the present disclosure, wherein the cross-sectional position of FIG. 6 is the same as FIG. 1B. At least one difference between this embodiment and the first embodiment is that the colloid layer 150 of this embodiment contacts the second dielectric layer 116 and the fourth dielectric layer 140, and the vertical projection system of the colloid layer 150 on the first substrate 110 It coincides with the second area A2. Furthermore, the vertical projection boundary of the colloid layer 150 on the first substrate 110 will coincide with the boundary of the distribution area of the microstructure 111. Since the colloid layer 150 can improve the adhesion ability to the first substrate 110 through the microstructure 111, the covering position of the colloid layer 150 can be adjusted adaptively when the adhesion ability allows, so that the display panel 100D can be adapted to different Production requirements.

FIG. 7 is a schematic cross-sectional view of a display panel 100E according to a fifth embodiment of the present disclosure, wherein the cross-sectional position of FIG. 7 is the same as FIG. 1B. At least one difference between this embodiment and the first embodiment is that the light-emitting layer 134 of the display element 130 of this embodiment can be formed on the first electrode layer 132 through an ink-jet printing (IJP) process. The light-emitting layer 134 formed by inkjet printing will have a gradual thickness. For example, the thickness T1 at the edge of the light-emitting layer 134 will be greater than the thickness T2 in the middle region of the light-emitting layer 134, and the thickness from the edge of the light-emitting layer 134 to the middle region will be It is gradually thin. The second electrode layer 136 formed on the light-emitting layer 134 may be formed by evaporation and has a relatively uniform thickness for the light-emitting layer 134. For example, the thickness T3 of the second electrode layer 136 corresponding to the edge of the light-emitting layer 134 will be substantially It is equal to the thickness T4 of the middle region of the corresponding light-emitting layer 134.

In summary, during the manufacturing stage of the display panel of the present disclosure, the excess dielectric layer in the peripheral area can be removed from the first substrate, so that the subsequently formed colloid layer can be closer to the display area, so that The display panel can be suitably applied as a narrow frame structure. On the other hand, in the process of removing the excess dielectric layer, the first substrate will increase the roughness due to the removal means and may be regarded as having a microstructure. When the formed colloid layer covers the microstructure, the contact area of the colloid layer with the first substrate can be increased to improve the adhesion ability of the colloid layer to the first substrate. In addition, during the manufacturing stage of the display panel, the covering position of the colloid layer can be adjusted adaptively, so that the display panel can be adapted to different manufacturing needs.

Although this disclosure has been disclosed in various ways as above, it is not intended to limit this disclosure. Anyone who is familiar with this skill can make various changes and retouching without departing from the spirit and scope of this disclosure. The scope of protection of the content of this disclosure shall be subject to the scope defined in the appended patent application.

102‧‧‧Display area

104‧‧‧ surrounding area

110‧‧‧The first substrate

111‧‧‧Microstructure

112‧‧‧First dielectric layer

114‧‧‧flat layer

116‧‧‧Second dielectric layer

118‧‧‧third dielectric layer

120‧‧‧conductive layer

130‧‧‧Display element

132‧‧‧First electrode layer

136‧‧‧Second electrode layer

140‧‧‧ Fourth dielectric layer

150‧‧‧Colloid layer

160‧‧‧Second substrate

162‧‧‧Dielectric material

A1‧‧‧The first area

A2‧‧‧Second area

A3‧‧‧The third area

TH‧‧‧Contact hole

W2, W3, W4, W5, W6, W7‧‧‧Width

134‧‧‧luminous layer

3B-3B’‧‧‧ line

Claims (12)

A display panel has a display area and a peripheral area surrounding the display area, including: a first substrate and a second substrate, oppositely arranged, wherein the first substrate has a first area and a second area, the first The two areas are located in the peripheral area and away from the display area relative to the first area, and the surface roughness of the first substrate in the second area is greater than the surface roughness of the first substrate in the first area; The electrical layer is disposed on the first substrate and covers the first region, wherein the interface boundary between the dielectric layer and the first substrate aligns between the first region and the second region The boundary line; and a colloidal layer disposed between the first substrate and the second substrate and covering the second area. The display panel as described in item 1 of the patent application range, wherein the dielectric layer contacts the colloid layer, and the vertical projection of the interface between the dielectric layer and the colloid layer on the first substrate aligns the first region with The boundary between the second areas. The display panel as described in item 1 of the patent application scope further includes a dielectric material filled between the dielectric layer and the colloid layer and covering the second area together with the colloid layer. The display panel as described in item 1 of the patent application range, wherein the surface roughness of the first substrate in the second area gradually increases away from the display area. The display panel according to item 1 of the patent application scope, wherein the second area is completely covered by the colloid layer. The display panel according to item 1 of the patent application scope, wherein the first substrate further has a third area, the second area is located between the first area and the third area, and the first substrate is located at the The surface roughness of the second area is greater than the surface roughness of the first substrate in the third area, wherein the colloid layer further covers the third area. The display panel as described in item 1 of the patent application range, wherein the surface roughness of the first substrate in the second region is R microns, and 0<R≦1. The display panel as described in item 1 of the patent application scope further includes an organic light emitting diode, which is arranged in the display area. A manufacturing method of a display panel includes: forming a display element in a display area of a display panel; forming a dielectric layer on a peripheral area of the display panel and the display area, and covering the display element, and the peripheral area The thickness of the dielectric layer decreases gradually away from the display area; and the dielectric layer in the peripheral area is removed to expose one of the substrates under the dielectric layer in the peripheral area The area in which the process of removing the dielectric layer in the peripheral area is anisotropic and causes the surface roughness of the area of the substrate to increase. The method for manufacturing a display panel as described in item 9 of the patent application scope further includes: forming a gel layer on the peripheral area of the display panel and covering the area of the substrate. The method for manufacturing a display panel as described in item 9 of the patent application range, wherein the surface roughness of the substrate in the area gradually increases in a direction away from the display area. The method for manufacturing a display panel as described in item 9 of the patent application scope, wherein the step of removing the dielectric layer in the peripheral area includes: emitting a laser beam to the dielectric layer in the peripheral area to remove Except for the dielectric layer in the peripheral area, the wavelength of the laser beam falls in the ultraviolet range or the infrared range.

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