TW201929321A - Multi-frequency antenna package structure providing a size-reduced structure with multiple frequencies that are used at the same time - Google Patents

Abstract

The present invention provides a multi-frequency antenna package structure, the structure comprising a first redistribution layer, an integrated circuit layer, a second redistribution layer and an antenna unit layer. A plurality of openings that can communicate with each other are provided on the first redistribution layer, integrated circuit layer, second redistribution layer and antenna unit layer, and each of the openings is filled with a conductive material, thereby achieving the purpose of electrical connection between the layers and reducing the structure of the multi-frequency antenna package.

Description

Multi-frequency antenna package structure

The present invention relates to an antenna package structure, and more particularly to a multi-frequency antenna package structure.

The antenna is an important part of the communication device and can radiate radio frequency signals. One prior connection method for electrically connecting an antenna system to a wafer system is wire bonding, wherein the antenna includes an antenna disposed on the substrate and another antenna disposed on the wafer. However, wire bonding not only significantly causes power consumption of the radio frequency signal, but also occupies a large space due to electrode pads for obtaining high quality input/output.

In order to reduce the use of wire bonding, the design of an integrated antenna in a package structure has been disclosed by a public paper. However, the package structure is not a stacked package structure that electrically connects the multi-frequency antenna to the system. Compared with the existing advanced manufacturing process, the manufacturing process of the package structure is not stable, the mold composite vias are inconsistent, and due to the influence of warpage A non-contact joint occurs.

In view of the above disadvantages of the prior art, it is a primary object of the present invention to provide a multi-frequency antenna package structure with a reduced structure.

Another object of the present invention is to provide a different use at the same time Frequency multi-frequency antenna package structure.

It is still another object of the present invention to provide a method of fabricating a multi-frequency antenna.

It is still another object of the present invention to provide a communication device using a multi-frequency antenna.

To achieve the above objective, the present invention provides a multi-frequency antenna package structure including a first redistribution layer, an integrated circuit layer, a second redistribution layer, and an antenna unit layer, the first redistribution layer The method includes a first dielectric material layer having a plurality of openings, and a plurality of metal layers disposed in the plurality of openings of the first dielectric material layer, the integrated circuit layer being disposed on the first redistribution layer, At least one metal via, at least one metal pillar, an integrated circuit wafer, and a molding layer, the second redistribution layer is disposed on the integrated circuit layer, including a first a second dielectric material layer and a plurality of second metal layers formed in the plurality of openings of the second dielectric material layer, the first antenna unit layer being disposed on the second redistribution layer, including a first a dielectric layer and a plurality of third metal layers formed in the plurality of openings of the first dielectric layer, wherein the metal pillar and the integrated circuit wafer are disposed on the first redistribution layer, the metal pillar electrically connecting the metal pillar An integrated circuit chip and one of the first metal layers, the one And at least one of the third metal layers is electrically connected to one of the second metal layers, and the third metal layer forms a first antenna unit, wherein the first antenna unit is a multi-input Outputting a phase antenna, and the height of the integrated circuit wafer layer is the same as or smaller than the height of the metal through hole, thereby reducing the multi-frequency day The purpose of the line encapsulation structure.

100‧‧‧Integrated circuit chip

101‧‧‧Bump ball

102‧‧‧First protective layer

103‧‧‧First redistribution layer

104‧‧‧Integrated circuit layer

105‧‧‧Second redistribution layer

106‧‧‧First shield

107‧‧‧First antenna layer

108‧‧‧Second protective layer

109‧‧‧First dielectric material layer

110‧‧‧First metal layer

111‧‧‧Metal column

112‧‧‧Second antenna unit

113‧‧‧Electrical mat

114‧‧‧ integrated circuit

115‧‧‧Semiconductor materials

116‧‧‧Molded layer

117‧‧‧Metal through hole

118‧‧‧Second dielectric material layer

119‧‧‧Second metal layer

120‧‧‧Second dielectric layer

121‧‧‧Fourth metal layer

122‧‧‧ Third metal layer

123‧‧‧First dielectric layer

FIG. 1 is a schematic diagram of a multi-frequency antenna package structure of the present invention.

The embodiments of the present invention are described by way of specific examples, and those skilled in the art can understand the other advantages and advantages of the present invention from the disclosure of the present disclosure.

1 is a schematic diagram of a multi-frequency antenna package structure according to the present invention. As shown, the structure includes a first redistribution layer 103, an integrated circuit layer 104, and a second redistribution layer. 105. A first shielding layer 106, a first antenna layer 107, a first protective layer 102, a second protective layer 108, and a plurality of bump balls 101. The first redistribution layer 103 includes a first dielectric material layer 109, and a plurality of first metal layers 110 formed in the plurality of openings of the first dielectric material layer 109, the integrated circuit layer 104 being formed on the first redistribution layer 103, The integrated circuit layer 104 includes at least one metal via 117, at least one metal pillar 111, an integrated circuit wafer 100, and a molding layer 116, wherein the molding layer 116 is used to fill the a plurality of openings formed by the metal vias 117, the metal pillars 111 and the integrated circuit wafer 100 are disposed on the first redistribution layer 103, the metal vias 117 electrically connecting the first metal layers 110, the metal pillars 111 Electrically connecting the integrated circuit wafer 100 and the plurality of first metal layers 110, The integrated circuit wafer 100 includes a second antenna unit 112 on the integrated circuit 114 of the integrated circuit wafer 100, and a plurality of conductive pads 113.

The second redistribution layer 105 is formed on the integrated circuit layer 104. The second redistribution layer 105 includes a second dielectric material layer 118 and is formed in each of the openings of the second dielectric material layer 118. a second metal layer 119, wherein the metal via 117 is electrically connected to the plurality of second metal layers 119, the first shielding layer 106 is disposed on the first antenna unit layer 107, and the second redistribution layer 105 The first shielding layer 106 includes a first dielectric layer 120 and a plurality of fourth metal layers 121 formed in the plurality of openings of the second dielectric layer 120. The fourth metal layer 121 is electrically connected to the first metal layer 121. A plurality of third metal layers 122 of the first antenna unit layer 107, and a portion of the second metal layer 119.

The above-described embodiments are merely illustrative of the features and functions of the present invention, and are not intended to limit the scope of the technical scope of the present invention. Modifications and variations of the above-described embodiments can be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the scope of the claims described below.

Claims (16)

A multi-frequency antenna package structure comprising: a first redistribution layer comprising a first dielectric material layer having a plurality of openings; and a plurality of openings disposed in the plurality of openings of the first dielectric material layer a metal layer; an integrated circuit layer disposed on the first redistribution layer, the integrated circuit layer including at least one metal via, at least one metal pillar, an integrated circuit wafer, and a molding layer, wherein the molding layer is filled in a plurality of openings formed by the metal via hole, and the metal pillar and the integrated circuit wafer are disposed on the first redistribution layer, the metal via hole Electrically connecting one of the first metal layers, the metal post electrically connecting one of the integrated circuit wafer and the first metal layers; and a second redistribution layer formed on the integrated circuit layer The second redistribution layer includes a second dielectric material layer and a plurality of second metal layers formed in the plurality of openings of the second dielectric material layer, wherein the metal vias electrically connect the second metal One of the layers; and a first antenna element layer, the package a first dielectric layer and a plurality of third metal layers formed in the plurality of openings of the first dielectric layer, wherein at least one of the third metal layers is electrically connected to one of the second metal layers And the third metal layer forms a first antenna unit, wherein the first antenna unit is a multiple input multiple output phase antenna, and the height of the integrated circuit wafer is the same or smaller than the metal through hole height. The multi-frequency antenna package structure according to claim 1, wherein the integrated circuit chip comprises a second antenna unit located on an integrated circuit of the integrated circuit chip. The multi-frequency antenna package structure of claim 1, further comprising: a first shielding layer formed between the first antenna unit layer and the second redistribution layer, the first shielding layer comprising Forming a first dielectric layer and a plurality of fourth metal layers formed in the plurality of openings of the second dielectric layer, wherein the fourth metal layers electrically connect the third metal layers and the second of the portions Metal layer. The multi-frequency antenna package structure of claim 3, further comprising: a first protective layer, wherein the first redistribution layer is disposed on the first protective layer; and a second protective layer is formed thereon a first antenna unit layer; and a plurality of bump balls, wherein the multi-frequency antenna package structure is mounted on a substrate through the bump balls. The multi-frequency antenna package structure of claim 1, further comprising: a second antenna unit layer comprising a second dielectric layer and a plurality of openings formed in the second dielectric layer a fourth metal layer, wherein at least one of the fourth metal layers is electrically connected to one of the first metal layers, the fourth metal layer forms the second antenna unit, and the A redistribution layer is formed on the second antenna element layer. The multi-frequency antenna package structure according to claim 5, further comprising: a first shielding layer formed on the first antenna unit layer and the second rewiring Between the layers, the first shielding layer includes a third dielectric layer and a plurality of fifth metal layers formed in the plurality of openings of the third dielectric layer, wherein the fifth metal layers are electrically connected to the first a third metal layer and a portion of the second metal layer; and a second shielding layer formed between the second antenna unit layer and the first redistribution layer, the second shielding layer comprising a fourth dielectric layer And a plurality of sixth metal layers formed in the plurality of openings of the fourth dielectric layer, the sixth metal layers electrically connecting the fourth metal layers and a portion of the first metal layers. The multi-frequency antenna package structure of claim 6, further comprising: a first protective layer, wherein the first redistribution layer is located on the first protective layer; and a second protective layer is formed on the first An antenna unit layer; and a plurality of bump balls, wherein the multi-frequency antenna package structure is mounted on a substrate through the bump balls. The multi-frequency antenna package structure according to claim 5, wherein the second antenna unit is a multi-input multi-output phase antenna. A method for fabricating a multi-frequency antenna package structure includes: providing a first temporary substrate having a first adhesive layer; forming a first dielectric material layer on the first adhesive layer, and forming the first dielectric layer on the first adhesive layer Forming a plurality of first metal patterns in the plurality of openings of the material layer; forming at least one metal via hole on one of the first metal patterns; forming at least one metal pillar on the portion of the first metal patterns And providing an integrated circuit chip on the metal post; Forming a molding layer to cover the metal post, the metal via and the integrated circuit wafer; thinning down the molding layer to expose the metal via to form the mold layer, the metal pass a hole, the metal post and an integrated circuit wafer layer of the integrated circuit wafer; forming a first redistribution layer on the integrated circuit wafer layer, wherein the first redistribution layer comprises a second dielectric material layer And a plurality of second metal patterns, wherein the second patterns are formed in the plurality of openings of the second dielectric material layer; forming a first antenna unit layer on the first redistribution layer, wherein the first The antenna unit layer includes a first dielectric layer and a plurality of third metal patterns formed in the plurality of openings of the first dielectric layer, wherein at least one of the third metal patterns electrically connects the first One of the two metal patterns, and the third metal patterns form a first antenna unit; a first protective layer is formed on the first antenna unit layer to form a first stacked structure; The first temporary substrate of the first adhesive layer, and flipping the first Stacking the structure to adhere the first stacked structure to a second temporary substrate having a second adhesive layer; forming a second redistribution layer by processing the first dielectric material layer and the first metal patterns The second redistribution layer includes the processed first dielectric material layer and the processed first metal patterns; forming a second protective layer on the second redistribution layer; Forming a plurality of bump balls on the second protective layer to form a second stack structure; and removing the second temporary substrate having the second adhesive layer, and flipping the second stacked structure to pass the convex The bulk ball mounts the second stack structure on a substrate; wherein the first antenna unit is a multiple input multiple output phase antenna, and the height of the integrated circuit wafer is the same as or smaller than the height of the metal through hole. The method of fabricating a multi-frequency antenna package structure according to claim 9, wherein the integrated circuit chip comprises a second antenna unit located on an integrated circuit of the integrated circuit chip. The method for manufacturing a multi-frequency antenna package structure according to claim 10, further comprising: Forming a first shielding layer on the first redistribution layer before forming the first antenna unit layer, the first shielding layer comprising a second dielectric layer and a plurality of openings formed in the second dielectric layer And a plurality of fourth metal patterns electrically connecting the third metal patterns and a portion of the second metal patterns. The method of manufacturing the multi-frequency antenna package structure of claim 9, further comprising: forming a second antenna element layer on the second redistribution layer before forming the second protection layer, wherein the The two antenna unit layer includes a second dielectric layer and a plurality of fourth metal patterns formed in the plurality of openings of the second dielectric layer, The fourth metal patterns are electrically connected to one of the first metal patterns, and the fourth metal patterns form a second antenna unit. The method for manufacturing a multi-frequency antenna package structure according to claim 12, further comprising: forming a first shielding layer on the first redistribution layer before forming the first antenna unit layer, the first The shielding layer includes a third dielectric layer and a plurality of fifth metal patterns formed in the plurality of openings of the third dielectric layer, the fifth metal patterns electrically connecting the third metal patterns and the portions of the a second metal layer; and a second shielding layer formed on the second redistribution layer, the second shielding layer comprising a fourth dielectric layer and formed on the fourth medium a plurality of sixth metal patterns of the plurality of openings of the layer, the sixth metal patterns being electrically connected to the fourth metal patterns and a portion of the first metal patterns. A communication device comprising: a multi-frequency antenna package structure comprising: a first redistribution layer comprising a first dielectric material layer and a plurality of first ones formed in the plurality of openings of the first dielectric material layer a metal pattern; an integrated circuit layer formed on the first redistribution layer, the integrated circuit layer including at least one metal via, at least one metal pillar, an integrated circuit wafer, and a mold layer, wherein the mold Forming a plurality of openings formed by the metal vias, the metal pillars and the integrated circuit chip being disposed on the first redistribution The metal via is electrically connected to one of the first metal patterns, the metal post electrically connecting the integrated circuit chip and one of the first metal patterns; and a second redistribution layer is formed On the integrated circuit layer, the second redistribution layer includes a second dielectric material layer and a plurality of second metal patterns formed in the plurality of openings of the second dielectric material layer, wherein the metal vias Electrically connecting one of the second metal patterns; and a first antenna unit layer including a first dielectric layer and a plurality of third metals formed in the plurality of openings of the first dielectric layer a pattern, wherein at least one of the third metal patterns is electrically connected to one of the second metal patterns, and the third metal patterns form a first antenna unit; wherein the integrated circuit wafer has An integrated circuit of the processing circuit, and the integrated circuit chip has a second antenna unit located on the integrated circuit, or the integrated circuit chip does not include the second antenna unit, but the plurality The frequency antenna package structure further includes: a second day The unit layer includes a second dielectric layer and a plurality of fourth metal patterns formed in the plurality of openings of the second dielectric layer, wherein at least one of the fourth metal patterns is electrically connected to the first One of the metal patterns, the fourth metal pattern forms the second antenna unit, and the first redistribution layer is formed on the second antenna unit layer; wherein the first antenna unit is a A multi-input multi-output phase antenna, and the height of the integrated circuit wafer is the same as or smaller than the height of the metal via. The communication device of claim 14, wherein the communication device is an encrypted communication device or a frequency conversion device.