TW201836059A - Substrate holding device, photolithography device and manufacturing method for articles capable of preventing damage of a substrate when shortening driving time of a supporting member and a holding member - Google Patents

Abstract

The subject of the present invention is to prevent the damage of a substrate while shortening the driving time of a supporting member and a holding member. With the substrate holding device (500) of the present invention, the substrate (300) may be moved in toward the upper side of the holding surface (502b) or the substrate (300) may be moved out from the upper side of the holding surface (502b) in a state in which the supporting member (503) is protruded from the holding surface (502b). The substrate holding device (500) is provided with a driving means (501) for driving the supporting member (503) along the height direction, wherein the driving means (501) changes the height of the upper end of the supporting member (503) according to the bending state of the substrate (300) when the substrate (300) is being moved in or moved out.

Description

Substrate holding device, lithographic apparatus, and method of manufacturing articles

[0001] The present invention relates to a substrate holding device, a lithographic apparatus, and a method of manufacturing the article.

[0002] In recent years, in the diversification of processes of semiconductor devices and the like, the case of processing a substrate having a large curvature has increased. An example of a substrate that is easily bent is shown in FIG. A plurality of unit regions 106 are disposed on the substrate 100 shown in Fig. 13a, and Fig. 13b is an enlarged view of a portion of Fig. 13a. The unit area 106 has a configuration in which the semiconductor wafer 101 and the electrode pad 104 are connected via the wiring 103 on the molded material 102, and a plurality of the cut regions 105 are disposed under the cut-off region 105. Further, a thin substrate can also be exemplified as an example of a substrate that is easily bent. Such a substrate that is easily bent is likely to be greatly bent when supported by a conveyance hand and supported by a narrow contact area. A substrate holding device is described in Japanese Laid-Open Patent Publication No. 2013-191601, and is held while being planarly corrected by a substrate that is carried in a curved state. In the substrate holding device, each of the plurality of lift pins (support members) is gradually driven up until the substrate is contacted, and the lift pins are driven downward to transfer the substrate to the holding surface of the jig (holding member). . Further, it has been described that the lift pin stands by at the position which is the most lowered with respect to the holding surface before the lift pin is raised, that is, before the substrate is carried over the holding surface. [0004] In the technique disclosed in Japanese Laid-Open Patent Publication No. 2013-191601, the lifting pin is placed at a position that is lower than the holding surface, and the substrate and the lifting period during the period in which the substrate is carried over the holding surface can be prevented. Breakage of the pin and damage of the substrate due to collision. However, when all the substrates are raised from the most lowered position, the time required to contact the substrate depends on the amount of driving of the lift pins. Therefore, it takes a required time or more until the substrate holding device completes the holding of the substrate.

[0005] The present invention provides a substrate holding device capable of shortening a driving time of a supporting member and a holding member while preventing damage of the substrate. [0006] A substrate holding device as an aspect of the present invention has a holding member that holds a substrate with a holding surface, and the supporting member protrudes from the holding surface so as to be retained in the foregoing The substrate is supported above the surface; and the support member is protruded from the holding surface, and the substrate is loaded onto the holding surface or the substrate is lifted from above the holding surface; The driving means is driven by the driving means in the height direction; and the driving means changes the height of the upper end of the supporting member when the substrate is carried in or when the substrate is carried out, based on the bending state of the substrate. Further, a lithographic apparatus according to another aspect of the present invention includes a substrate holding device and a substrate forming pattern for holding the substrate holding device, wherein the substrate holding device has a holding member and a supporting member. The holding member is a holder that holds the substrate, and the supporting member protrudes from the holding surface to support the substrate above the holding surface; and in a state where the supporting member protrudes from the holding surface, Carrying in the substrate above the holding surface or carrying out the substrate from above the holding surface; driving means for driving the supporting member in the height direction; and the driving means for performing the substrate The height of the upper end of the support member at the time of loading or when the substrate is carried out is changed based on the curved state of the substrate. Further, a method of manufacturing an article according to another aspect of the present invention includes a forming program, a processing program, and a manufacturing program, wherein the forming program is formed on a substrate by using a lithography apparatus, and the processing program is in the foregoing A substrate for forming a pattern forming method for manufacturing an article including the substrate to be processed, wherein the lithographic apparatus includes a substrate holding device and a substrate forming pattern for holding the substrate holding device, and the forming means a substrate holding device having a holding member that holds a substrate with a holding surface that protrudes from the holding surface to support the substrate above the holding surface; The support member is carried out from the holding surface, and the substrate is loaded onto the holding surface or the substrate is lifted from above the holding surface; and the driving member is driven in the height direction. The driving means is to perform the loading of the substrate or to perform the substrate The height of the upper end of the support member at the time of carrying out is changed based on the bending state of the substrate. Further features of the present invention will become apparent from the following embodiments, with reference to the accompanying drawings.

[First Embodiment] (Configuration of Substrate Holding Device) A substrate holding device 500 (hereinafter referred to as a holding device 500) according to the first embodiment will be described with reference to Figs. 1 to 3 . In the following description, the axis in the vertical direction is the Z axis, and the two axes orthogonal to each other in the plane perpendicular to the Z axis are the X axis and the Y axis. In the entire drawings, the same members are denoted by the same reference numerals, and the same members will be omitted after the second time. 1a and 1b are diagrams showing the configuration of a holding device 500 for holding a substrate. Figure 1a is a view of a portion of the holding device 500 as seen from the +Z direction. Fig. 1b is a cross-sectional view taken along the dashed line A-A' of Fig. 1a. [0012] The jig (holding member) 502 has a holding surface 502b on the side (+Z direction side) on which the substrate is carried, and the holding surface 502b holds the substrate. Specifically, an opening (not shown) provided in the holding surface 502b is connected to an exhaust unit 505 including an exhausting means such as vacuum pumping, and the space between the holding surface 502b and the substrate is exhausted through the opening to be adsorbed. Hold the substrate. [0013] The lift pin 503 (hereinafter referred to as a pin 503) protrudes from the holding surface 502b so as to support the support member of the substrate. The pin 503 supports the substrate with its upper end. The pin 503 has an opening (not shown) that is connected to the exhaust portion 506 through the pipe 504 on the side where the substrate is carried. When the substrate is supported, the space between the upper end of the pin 503 and the substrate is exhausted through the opening so that the pin 503 temporarily adsorbs the substrate. Further, the adsorption of the substrate by the pin 503 and the adsorption of the substrate by the jig 502 may not be based on the vacuum suction force of the exhaust portions 505 and 506 by vacuum pumping or the like. For example, an electrostatic force can be utilized, or a mechanical presser can be used. [0015] The driving portion (first driving means) 501 drives the pin 503 in the height direction (Z-axis direction) to protrude the pin 503 from the holding surface 502b. The driving unit (second driving means) 507 drives the jig 502 in the height direction (the direction in which the pin 503 protrudes from the holding surface 502b). [0016] The driving portions 501 and 507 drive the pin 503 and the jig 502 in order to transfer the substrate between the pin 503 and the holding surface 502b. For example, the holding device 500 is configured to support the substrate by the pin 503 in a state where the pin 503 protrudes from the holding surface 502b, and gradually reduce the amount of protrusion from the holding surface 502b to transfer the substrate from the pin 503 to the jig 502. At least one of the drive system drive units 501 and 507 for projecting the pin 503 from the holding surface 502b may be used. When the amount of protrusion is large, the driving units 501 and 507 can drive the jig 502 and the pin 503 in parallel to shorten the driving time. [0017] The drive units 501 and 507 are each of various actuators such as a linear motor, an electromagnetic actuator, and a piezoelectric actuator. The driving unit 501 and the driving unit 507 may be the same type of actuators, or may be different types of actuators. [0018] The control unit 700 is connected to the drive units 501 and 507 and the exhaust units 505 and 506 by a wired or wireless communication line, and is controlled. FIG. 2 is a diagram for explaining the control of the holding device 500. In particular, the control for driving the jig 502 and the pin 503 will be described. [0019] The control unit 700 is connected to the detecting unit 900 that detects the bending state (bending state) of the substrate. FIG. 3 is a diagram showing the configuration of the detecting unit 900. The detecting unit 900 includes a detecting unit 901, a calculating unit 902, a hand 903, and a stage 904. [0020] The stage 904 includes a columnar member (columnar member) 904a for supporting the substrate 300. The member 904a supports the substrate 300 with its upper end (support portion). The substrate 300 supported by the member 904a is sometimes supported in a state of being bent into a convex or convex shape. [0021] The hand 903 is a moving member that moves in the plane perpendicular direction (Z-axis direction) of the substrate 300 based on an instruction from the command unit 701 of the control unit 700. The detecting unit 901 detects the contact of the hand 903 with the substrate 300 during the movement of the hand 903. [0022] The detecting unit 901 has a pressure sensor that measures the pressure on the exhaust unit and the exhaust path that are connected to an opening (not shown) provided on the upper surface of the hand 903. The detecting unit 901 detects that the contact between the hand 903 and the substrate 300 is detected by the pressure sensor from the atmospheric pressure to the negative pressure. [0023] In addition, the movement of the hand 903 is not limited to continuous movement but also includes intermittent movement. For example, the pressure detection is performed every time the hand 903 is driven up by a predetermined amount (100 μm or less). [0024] The calculation unit 902 calculates the amount of bending (bending amount) of the substrate which is the curved state of the substrate. The calculation unit 902 calculates the position D of the upper surface of the member 904a in the Z-axis direction and the difference D between the positions of the hand 903 at the time when the detecting unit 901 detects the contact of the hand 903 with the substrate 300. The calculation unit 902 outputs the calculated difference D to the determination unit 702 of the control unit 700 as the amount of bending of the substrate. Further, the calculation unit 902 may determine whether the substrate 300 is convex or downward convex from the determination result of the positive or negative of the difference D. Returning to the description of FIG. 2 . The control unit 700 includes a command unit 701 that inputs a drive command to the drive units 501 and 507 and the hand 903, a determination unit 702 that determines the drive command, and a storage unit 703. The determination unit 702 determines the drive profile of the pin 503 corresponding to the amount of bending of the substrate output from the detection unit 900 in accordance with the program 706 stored in the storage unit 703, and inputs it to the command unit 701. [0028] The command unit 701 gives a drive command to the drive units 501 and 507 based on the drive profile determined by the transmission determination unit 702. The drive commands input to the drive units 501 and 507 are electrical signals such as current values required for control of the drive units 501 and 507. The memory unit 703 stores a table 704, a drive setting file 705 for displaying driving conditions in each transport mode, and a program 706 for determining a driving profile. An example of the table 704 is shown in FIG. 4a. In Table 704, the transport mode (row 11a), the range of the amount of bending of the substrate (row 11b), the presence or absence of the lift drive of the pin 503 when the substrate is carried in (line 11c), and the drive profile name (line 11d) are associated. data of. The unit of the numerical value described in the row 11b is arbitrary, for example, [mm]. In addition, the amount of bending as the threshold value in each of the transport modes shown in FIG. 4a is an example, and is not limited thereto. [0031] The drive setting file 705 shown in FIG. 4b displays information on the lifting and lowering driving of the jig 502 and the pin 503. Specifically, for example, it includes at least one of a relationship between time (time) and driving speed, a relationship between time and position, and a relationship between time and acceleration. (Method of Determining Drive Profile) When the substrate is carried over the holding surface 502b, if the retraction of the pin 503 is insufficient, the pin 03 collides with the substrate, and the substrate may be damaged. Therefore, the determination unit 702 determines the drive setting so as to change the distance between the carry-in/out path of the substrate and the pin 503 when the substrate is carried in, depending on the bending of the substrate. Thereby, the drive unit 501 drives the pin 503 such that the height of the upper end of the pin 503 changes based on the amount of bending of the substrate. [0033] The content of the program 706 executed by the determining unit 702 to achieve this result will be described using the flowchart 1000 of FIG. [0034] In S101, the determination unit 702 acquires the amount of bending of the substrate calculated by the calculation unit 902. Next, the determination unit 702 determines the optimal transport mode by circulating the processes of S102 to S105 in the transport mode included in the table 704. [0035] For example, in the first cycle, the determination unit 702 acquires the minimum value and the maximum value of the amount of bending of the substrate in the transport mode 1 in S103. Next, in S104, the determination unit 702 determines whether or not the "minimum value obtained in S103" and the amount of bending acquired in S101 <the maximum value obtained in S103" are satisfied. When it is determined as No in S104, S103 to S104 are similarly repeated in the next transfer mode. When there is no such transfer mode after repeating S103 to S104 several times in the transfer mode, the process proceeds to S106, and the determination unit 702 notifies the user of the error. The notification method can be the display of an error message to the user interface, and the lighting of the predetermined lamp. When the determination unit 702 determines that Yes is in S104, the process proceeds to S107. In S107, the determination unit 702 refers to the table 704, and acquires the profile name of the pin 503 corresponding to the current transport mode from the row 11d. In S108, among the plurality of drive setting files 705, the drive setting file of the setting file name acquired in S107 is acquired. [0038] In S109, the determination unit 702 notifies the acquired drive profile to the command unit 701. The above ends the program 706. (Pushing Method of Pin) Next, the driving of the pin 503 when the pin 503 is driven by the drive setting determined by the transmission determining unit 702 will be described with reference to FIGS. 6 to 8 . 6 , 7 , and 8 are the pin 503 and the jig 502 in the case where the amount of bending of the substrate is the first amount, the second amount, and the third amount (the first amount < the second amount < the third amount). The driver is shown in the diagram. 6 is a view showing the operation of the holding device 500 when the amount of bending of the substrate 300 is the first amount and the conveying mode 1 of the table 704. In other words, when the substrate 300 above the jig 502 is carried in, the pin 503 is not driven up and down (see the row 11c of FIG. 4). [0041] As shown in FIG. 6a, the driving portion 507 lowers the jig 502 to a predetermined height. 6b is a view showing a state in which the pin 503 is not driven in the Z-axis direction and the substrate 300 is carried over the jig 502 through the hand 400. The hand 400 conveys the substrate 300 along the carry-in/out path 400a when the substrate is loaded and unloaded. The height of the carry-in/out path 400a shown in the figure is the height of the hand 400. [0042] FIG. 6c shows how the substrate 300 is transferred to the pin 503 by a slight drop through the hand 400. At this time, the holding device 500 adsorbs the substrate 300 with the pin 503 by the exhaust portion 506a. FIG. 6d shows a state in which the jig 502 is raised to the original position and the hand 400 is retracted. Thereafter, the holding device 500 adsorbs and holds the substrate 300 with the holding surface 502b by the exhaust portion 505. As described above, when the amount of bending of the transport mode 1 based substrate 300 is less than the allowable value, the pin 503 is not lowered when the substrate 300 is carried in. In this case, the collision of the pin 503 with the substrate 300 and the breakage of the substrate can be avoided. [0044] FIG. 7 is a view showing the operation of the holding device 500 when the amount of bending of the substrate 300 is the second amount and the transport mode 2 of the table 704. In other words, when the substrate 300 above the jig 502 is carried in, it is necessary to drive the pin 503 up and down. [0045] As shown in FIG. 7a, the driving portion 507 lowers the jig 502 to a predetermined height. Next, as shown in Fig. 7b, the drive unit 501 lowers the pin 503 by the distance D1. FIG. 7c is a view showing a state in which the substrate 300 is carried over the jig 502 through the hand 400. Thereafter, the driving portion 501 raises the pin 503 by the distance D1 as shown in Fig. 7d, and as shown in Fig. 7e, the substrate 300 is slightly lowered through the hand 400 to transfer the substrate 300 to the pin 503. 7d shows a state in which the jig 502 is raised to the original position and the hand 400 is retracted. 8 is a view showing the operation of the holding device 500 when the bending amount of the substrate 300 is the third amount and the conveyance mode 3 of the table 704. In other words, when the substrate 300 above the jig 502 is carried in, it is necessary to drive the pin 503 up and down. [0048] As shown in FIG. 8a, the driving portion 507 lowers the jig 502 to a predetermined height. Next, as shown in Fig. 8b, the drive unit 501 lowers the pin 503 by the distance D2. Here, the relationship between the distance D1 and the distance D2 is D1 < D2, and the height of the upper end of the pin 503 is lower than the transfer mode 2. [0049] FIG. 8c is a view showing a state in which the substrate 300 is carried over the jig 502 through the hand 400. Thereafter, as shown in FIG. 8d, the driving portion 501 raises the pin 503 by a distance D2, and as shown in FIG. 8e, the substrate 300 is slightly lowered to transmit the substrate 300 to the pin 503. [0050] FIG. 8d shows a state in which the grip 502 is raised to the original position and the hand 400 is retracted. As shown in FIG. 7 and FIG. 8, when the substrate 300 is bent by a predetermined amount or more, the pin 503 is lowered when the substrate 300 along the carry-in/out path 400a is carried in. In the control unit 700, the determination unit 702 determines the drive profile based on the detection result of the detection unit 900, and drives the drive unit 501 based on the drive profile. Specifically, when the substrate 300 having the second bending amount larger than the first bending amount is carried in, the driving unit 501 lowers the height of the upper end of the pin 503 than when the substrate 300 of the first bending amount is carried. Therefore, when the height of the first bending amount substrate 300 and the second bending amount substrate 300 when the substrate 300 is carried over the holding surface 502b is equal to each other, the distance from the pin 503 to the carry-in path 400a is second. The amount of the substrate 300 is large when it is carried in. [0052] Thereby, the collision of the pin 503 with the substrate 300 can be avoided, and the damage of the substrate 300 can be prevented. In addition, when the height of the upper end of the pin 503 is set to a constant value regardless of the amount of bending of the substrate 300, the undesired driving time of the pin 503 when the substrate 300 is carried in can be shortened. Thereby, the time until the substrate 300 is held by the jig 502 can be shortened. For example, in the transport mode 1 and the transport mode 3, there is a difference of about 400 milliseconds between the drop and the rise of the pin 503, and this time can be shortened by one load per substrate 300. [0054] The present embodiment is an embodiment in which the substrate 300 is likely to interfere with other members when the carry-in/out path 400a is biased to the +Z direction side. Further, the present embodiment is an embodiment in which the variability of the amount of bending of the substrate 300 to be carried in is large. (Modification of First Embodiment) Hereinafter, a modification of the holding device 500 will be described. When the holding device 500 has no driving unit 507, the driving unit 501 can also raise the pin 503 to protrude the pin 503 from the holding surface 502b. [0057] The curved state of the substrate input to the determining portion 702 may include the substrate 300 having an upward convex shape or a downward convex shape. In this case, when the substrate 300 has a downward convex shape (a shape curved in a direction opposite to the shape shown in FIGS. 7 and 8), the determining unit 702 regards the amount of bending of the substrate 300 to be zero. In addition, when the transport mode 1 is selected so as not to drive the lowering of the pin 503 when the substrate 300 above the jig 502 is carried in, the undesired driving time of the pin 503 can be shortened. [0058] The holding device 500 can be performed in the reverse order of the operations shown in FIGS. 7a and 7b, or can be performed in parallel. Similarly, the holding device 500 can be performed in the reverse order of the operations shown in Figs. 8a and 8b, the operations shown in Figs. 7e and 7d, and the operations shown in Figs. 8e and 8d. Can be done in parallel. [0059] The curved state of the substrate detected by the detecting unit 900 may not necessarily be the amount of bending of the substrate 300. For example, when the row 11b of the table 704 is defined by the position in the height direction of the hand 903, the detecting unit 900 can output the position of the hand 903 in the height direction when the hand 903 comes into contact with the substrate 300 without passing through the calculation unit 902. . The shape of the substrate 300 when the detection unit 900 detects the amount of bending of the substrate 300 and the shape of the substrate 300 when being carried by the hand 400 may vary depending on the method of holding. When the amount of bending of the substrate 300 when supported by the stage 904 is larger than the amount of bending of the substrate 300 when the hand 400 is carried in, the collision between the substrate 300 and the pin 503 can be prevented. Alternatively, when the curved state of the substrate 300 when the hand 400 is carried in is predicted from the curved state of the substrate 300 when the stage 904 is supported, the substrate 300 that is predicted based on the detected amount of bending can be used. The shape is curved to change the height of the upper end of the pin 503. The detecting means for detecting the curved state of the substrate is not limited to the above-described detecting portion 900. For example, a measuring means for measuring the distance to the substrate 300 by a capacitance sensor, an eddy current sensor, a laser interferometer or the like may be provided, and the bending state of the substrate 300 may be detected based on the measurement result of the measuring means. Further, these detection means are not necessarily required to be provided in the holding device 500, and may be provided outside the holding device 500. In this case, the determination unit 702 receives the information of the bending state of the substrate 300 detected by the external detecting means via the communication line, and determines the driving profile based on the received information to change the height of the upper end of the pin 503. When the transfer of the pin 503 and the lowering of the hand 400 are performed in parallel when the substrate 300 is transferred from the hand 400 to the pin 503, when the pin 503 strongly collides with the substrate 300, the positional deviation of the substrate 300 may occur. Damaged, etc. Therefore, it is preferable to set the drive setting value of the transport mode 3 so that the absolute value of the acceleration of the pin 503 immediately before the contact with the substrate 300 becomes equal to or smaller than the predetermined value α regardless of the driving amount of the pin 503. 9A is a diagram showing a drive setting file when the pin 503 which is once lowered is raised in the conveyance mode 2. Fig. 9b is a diagram showing a drive profile when the once-decreasing pin 503 is raised in the transport mode 3. In Figs. 9a and 2b, the horizontal axis represents time, the vertical axis represents velocity, and the positive direction of velocity is +Z direction. As shown in FIG. 9a, the drive unit 501 accelerates the pin 503 at the highest acceleration from time t0 to t1, and rises at a constant speed from time t1 to time t2. At the time t2 to t3, the acceleration is decelerated while the absolute value is equal to or less than the predetermined value α. As shown in FIG. 9b, the drive unit 501 accelerates the pin 503 at the highest acceleration from time t0 to t1, and rises at the constant speed at time t1 to t2 and decelerates at the highest acceleration at time t2 to t3. Then, the substrate 300 is damaged when the pin 503 is in contact with the substrate 300 while the maximum acceleration is continuously decelerated. Therefore, the drive unit 501 sets the pin 503 at a constant speed from time t3 to time t4, and the absolute value becomes equal to or lower than the predetermined value α at time t4 to t4. The acceleration rises while decelerating. In the transport mode 3, the absolute value of the acceleration of the pin 503 during deceleration is changed in multiple stages, so that the absolute value of the acceleration of the pin 503 immediately before the substrate 300 is equal to or less than the predetermined value α. According to this, it is possible to prevent the drive unit 501 from driving the pin 503 to the collision between the pin 503 and the substrate 300 and the damage of the substrate 300 during the period in which the pin 503 is approaching the direction in which the input/receiving path 400a is moved. [Second Embodiment] In the first embodiment, the amount of drop of the pin 503 when the substrate 300 is carried in is the same as the amount of increase of the pin 503 thereafter. However, when the amount of bending of the substrate 300 is large, the height of the center portion of the substrate 300 may be high. For this reason, sometimes it takes time to transfer from the hand 400 to the pin 503. Therefore, in the holding device 500 of the present embodiment, a drive setting file is set, and the amount of bending of the drive setting substrate 300 is increased, and the amount of the pin 503 after the substrate 300 above the jig 502b is moved is increased. The bigger. Thereby, in addition to the effects similar to those of the first embodiment, after the substrate 300 is carried over the jig 502, the time required to transfer the substrate 300 from the hand 400 to the pin 503 can be shortened. [Third Embodiment] The holding device 500 according to the third embodiment relates to control at the time of carrying out the substrate 300. The loading and unloading of the substrate 300 is performed in the reverse order of the loading and holding of the substrate 300 described in the first embodiment. When the hand 400 carries out the substrate 300 from above the holding surface 502b along the carry-in/out path 400a, when the upper end of the pin 503 is at a high position, the outer peripheral portion of the substrate 300 collides with the pin 503. Therefore, the holding device 500 according to the present embodiment determines the drive profile by the height of the upper end of the pin 503 based on the amount of bending of the substrate received from the detecting unit 900. Thereby, after the substrate 300 is transferred from the pin 503 to the hand 400, the hand 400 is moved in the horizontal direction along the carry-in/out path 400a so that the upper end of the pin 503 does not interfere with the substrate 300. The determining unit 702 can determine the height of the upper end of the pin 503 when the substrate 300 is carried out to be the same as the height of the upper end of the pin 503 when the substrate 300 is loaded above the holding surface 502. In the case where the substrate 300 is deformed during the period from the loading of the substrate 300 to the time of carrying out, and the amount of bending is changed, the determining unit 702 can determine the driving profile of the pin 503 so as to have a height corresponding to the amount of bending after the change. The amount of bending of the substrate 300 at the time of carrying out can be detected every time the substrate 300 is carried out. Alternatively, the amount of warpage of the representative substrate 300 may be detected after the representative substrate 300 is carried out, and the result may be regarded as the amount of bending of the substrate 300 to be held later. [0073] Thereby, the collision between the pin 503 and the substrate 300 when the substrate 300 is carried out can be avoided, and the damage of the substrate 300 can be prevented. In addition, when the height of the upper end of the pin 503 is set to a constant value regardless of the amount of bending of the substrate 300, the undesired driving time of the pin 503 when the substrate 300 is carried out can be shortened. Thereby, the time required for the substrate 300 to be carried out from above the jig 502 can be shortened. [Fourth Embodiment] The holding device 500 according to the fourth embodiment performs the exchange operation of the substrate 300 in order to change the relative position of the jig 502 and the rotation direction of the substrate 300. In the state in which the substrate 300 is held by the jig 502, the pin 503 is protruded from the holding surface 502b, and the substrate 300 is rotated by the holding surface 502b while being held by the pin 503, and then held. At the clamp 502. In the memory unit 703, in addition to the table 704, another table is stored, and the table is exchanged, the range of the amount of bending of the substrate, the presence or absence of the lifting and lowering of the pin 503 accompanying the swapping operation, and the drive profile name are associated. By. Further, in the storage unit 703, the drive profile name corresponding to each of the exchange modes is stored. The determination unit 702 determines the driving profile of the jig 502 and the pin 503 corresponding to the amount of bending of the substrate 300 based on the bending state of the bending amount of the substrate 300 input from the detecting unit 900 or the like. Then, the determined drive profile is input to the command unit 701. The holding device 500 according to the present embodiment includes a driving unit 501 and a driving unit 507 as driving means for driving at least one of the jig 502 and the pin 503 from the holding surface 502b in the direction in which the pin 503 protrudes. [0078] In the holding device 500 according to the present embodiment, the driving unit 501 also has a function as a rotating means for rotating the jig 502 and the substrate 300 along the holding surface 502b. In addition, the opening 502a is configured to be larger than the circle of the diameter of the pin 503. [0079] FIG. 10 is a diagram showing a state of the exchange action. FIG. 10a shows how the jig 502 adsorbs and holds the substrate 300. Next, as shown in FIG. 10b, based on the drive command determined by the determination unit 702, the drive unit 507 lowers the jig 502, and the drive unit 501 raises the pin 503. Thereby, the pin 503 is protruded from the holding surface 502b by the amount D3. [0080] Here, the determination unit 702 determines a drive profile for changing the amount of protrusion of the pin 503 based on the amount of bending of the substrate 300 received from the detection unit 900. In other words, the driving portions 501 and 507 are larger in the amount of protrusion when the substrate 300 having the second bending amount larger than the first bending amount is held, and the amount of protrusion when the substrate 300 of the first bending amount is held is larger than the jig 502 and the pin 503. Drive. Further, the driving unit 501 rotates the substrate 300 with respect to the holding surface 502b by supporting the substrate 300 under the pin 503. The rotation operation described here is an operation in which the center of gravity of the three pins 503 in the in-plane direction of the holding surface 502b is the center of rotation, and three positions are maintained without changing the relative positional relationship of the three pins 503. The pin 503 is rotated in the in-plane direction of the holding surface 502b. When the desired amount of rotation is not obtained in the movable range once, the substrate 300 is once transferred to the jig 502, and the adsorption of the substrate 300 under the pin 503 is released, and the position of the three pins 503 in the horizontal direction is returned. To the position before the rotation drive. Thereafter, the drive unit 501 again causes the pin 503 to protrude from the holding surface 502b, and rotationally drives the three pins 503. These actions can also be repeated until the desired amount of rotation is obtained. Thereby, even in the case where the substrate 300 has a curvature, the collision of the substrate 300 and the jig 502 when the substrate 300 is rotated can be prevented. Further, since the amount of protrusion of the pin 503 is changed by the amount of bending of the substrate 300, the replacement operation is performed with a predetermined amount of protrusion amount of the mating substrate 300, and the pin 503 can be shortened from the holding surface 502b. The time required for the action. [0084] Further, the rotating means for rotating the jig 502 and the substrate 300 may be a mechanism for rotating the jig 502 with respect to the pin 503 along the holding surface 502b. The present embodiment is suitable, for example, in a case where the holding device 500 is mounted on a lithography apparatus such as an exposure device. The exposure apparatus has an alignment system for detecting a mark disposed around each processing area, and the mark sometimes does not fall into the alignment when the arrangement of the processing area formed on the substrate 300 once held is largely shifted from the prediction. The system detects the field of view. The exchange operation performed in such a case is performed by the holding device 500 according to the present embodiment, whereby the time required for the alignment measurement can be shortened. (Modification of Fourth Embodiment) Hereinafter, a modification of the holding device 500 will be described. The holding device 500 is not limited to one of the driveable portions 501 and 507 as long as the pin 503 can be protruded from the holding surface 502b. [0087] The curved state of the substrate may include the substrate 300 being convex or downward convex. In this case, the determination unit 702 selects the amount of protrusion of the substrate 300 to be 0 when the substrate 300 has a downward convex shape (a shape that is curved in a direction opposite to the shape shown in FIG. 10), and selects the amount of protrusion to be the lower limit value. Exchange mode. The detecting means for detecting the curved state of the substrate 300 is not necessarily required to be provided in the holding device 500, and may be provided outside the holding device 500. In this case, the determination unit 702 receives the information of the bending state of the substrate 300 detected by the external detecting means via the communication line, and determines the driving profile based on the received information. Further, the holding devices 500 according to the first to fourth embodiments described above may be implemented in combination as appropriate. [Fifth Embodiment] In the fifth embodiment, an exposure apparatus 600 according to an embodiment of a lithographic apparatus in which a substrate 300 is patterned will be described. The exposure device 600 has a holding device 500. [0091] FIG. 11 is a diagram showing the configuration of the exposure apparatus 600. In Fig. 11, the optical axis of the projection optical system 610 is parallel to the Z axis. The holding device 500 has the functions of at least one of the first to fourth embodiments. Among the holding devices 500, the configuration other than the jig 502 and the pin 503 is omitted. The exposure apparatus 600 according to the present embodiment has the following configuration as a forming means for forming a pattern on the substrate 300 in addition to the holding device 500. The illumination light 603 is illuminating the reticle (original) 602 via the illumination optical system 601, and the image formed on the pattern of the reticle 602 to be illuminated is projected onto the substrate 300 via the projection optical system 610. The stage 606 holds the reticle 602 and scans it in the X-axis direction. The stage 607 moves the substrate 300 held by the jig 502 through a drive mechanism (not shown) such as a linear motor mounted thereon. The stage 607 may also include a coarse movement stage and a fine movement stage that moves in a shorter stroke than the coarse movement stage. The exposure device 600 forms a latent image pattern of the resist layer applied to the substrate 300 while scanning the reticle 602 and the substrate 300 through the stages 606 and 607. The interferometer 608 irradiates the mirror 609 with laser light, and the interferometer 604 irradiates the mirror 611 with laser light, and receives the reflected light to detect the position of the mask 602 and the substrate 300. The detection system 612 detects an alignment mark (not shown) formed on the substrate 300, a reference mark (not shown) provided on the stage 607, and the like. [0095] The control unit 615 is connected to the stages 606 and 607, the detection system 612, the interferometers 608 and 610, and the holding device 500, and is generally controlled as such. For example, at the time of exposure processing, the formation position of the pattern is determined based on the detection result of the detection system 612, and the stages 606 and 607 are controlled based on the position information obtained from the interferometers 608 and 610. The control unit 615 controls the holding device 500 when the substrate 300 is carried in and out. Further, the control unit 615 may be formed in a casing of a member other than the accommodation control unit 615, or may be formed in a casing other than the frame system. As long as these control functions are provided, they may be formed on the same control substrate or on different control substrates. Further, the exposure apparatus 600 has a transport system 4 for transporting the substrate 300 to the stage 607. FIG. 12 is a view showing the configuration of the transport system 4. [0098] The substrate 300 to which the resist layer is applied by an external coating and developing machine is temporarily placed on the columnar member 402 of the stage 403. The hand 405 transports the substrate 300 from the mounting table 403 to the pre-alignment stage 404. The pre-alignment stage 404 rotates the substrate 300 along the holding surface of the pre-alignment stage 404 to adjust the position of the substrate 300 in the rotational direction. The hand 400 receives the substrate 300 from the pre-alignment stage 404 and carries the substrate 300 above the jig 502. The stage 607 positions the substrate 300 below the projection optical system 610 to perform exposure to the substrate 300. [0099] Here, the stage 403 and the hand 405 can be used to detect the bent state of the substrate 300 as in the above-described detecting unit 900. In addition, it is possible to determine the presence or absence of a possibility of collision between the substrate 300 and other members during the conveyance of the substrate 300 to the jig 502, or to change the height of the hands 400 and 405 during transportation based on the determination result. Control of the transport system 4. In the exposure apparatus 600, the driving time of the pin 503 and the jig 502 when at least one of the substrate 300 is carried in and the substrate 300 is carried out can be shortened compared to the prior art. Thereby, the number of exposures (processing amount) of the substrate per unit time can be improved while preventing damage of the substrate. [0101] The exposure device 600 is not limited to an exposure device (scanning exposure machine) that performs exposure by a step-and-scan method, and may be an exposure device (stepper) that performs exposure in a step-and-repeat manner. Further, the light for exposure can be selected, for example, from various light rays such as a g line (wavelength 436 nm), an i line (wavelength 365 nm), ArF laser light (wavelength 193 nm), and EUV light (wavelength 13 nm). [0102] The lithographic apparatus is not limited to the exposure apparatus 600 and can be applied to other apparatuses that form a pattern on a substrate. The lithography apparatus may be, for example, a drawing device that transmits a charged particle beam or a laser beam to form a latent image pattern on a substrate. Alternatively, it may be an imprint apparatus that forms a concavo-convex pattern that is cured on a substrate by using a mold. [0103] The holding device 500 may be mounted on a processing device that performs predetermined processing on the substrate 300 other than the exposure device. For example, the processing device can also be an etching device. [Method for Producing Article] The pattern of the cured product formed by the imprint apparatus or the pattern of the cured product remaining after development of the substrate on which the latent image pattern is formed by another photolithography apparatus is used for various articles for a long time. At least part of it, or temporarily used to make various items. [0105] The article is a circuit component, an optical component, a MEMS, a recording component, a sensor or a mold, or the like. The circuit components are, for example, DRAM, SRAM, flash memory, volatile or nonvolatile semiconductor memory of MRAM, LSI, CCD, image sensor, semiconductor component of FPGA, and the like. Examples of the mold are molds for imprinting and the like. [0106] The manufacturing method of these articles includes a forming program for forming a pattern on a substrate by a lithography apparatus, and a processing program for processing a substrate on which a pattern is formed for the production of an article. The pattern of the cured product formed by the formation process is used as a material of at least a part of the article, or temporarily used as a resist mask. After the etching process, ion implantation, or the like is performed in the processing program, the resist mask is removed. [0107] The processing program may further include other well-known processing procedures (development, oxidation, film formation, vapor deposition, planarization, resist peeling, dicing, bonding, encapsulation, etc.). The preferred embodiments of the present invention are described above, but the present invention is not limited to the embodiments, and various changes and modifications can be made therein. According to the present invention, it is possible to shorten the driving time of the supporting member and the member while preventing the damage of the substrate. The present invention has been described with reference to the embodiments, but it should be understood that the invention is not limited to the disclosed embodiments. The broadest interpretation of the scope of the patent application is intended to cover various modifications, equivalent structures and functions. The case is based on the priority of 2007-051818, which was filed on March 16, 2017, and the overall content is used here.

[0109]

300‧‧‧Substrate

400‧‧‧Transportation Department

500‧‧‧holding device (substrate holding device)

501‧‧‧Driver (drive means, rotation means)

507‧‧‧ Drive Department (Driver)

502‧‧‧Clamps (holding members)

502b‧‧‧ Keep face

503‧‧ ‧ pin (support member)

1a and 1b are views showing a configuration of a holding device according to a first embodiment. FIG. 2 is a view for explaining control of the holding device according to the first embodiment. FIG. 3 is a view for explaining a memory unit according to the first embodiment. 4a and 4b are diagrams showing the configuration of a detecting unit according to the first embodiment. Fig. 5 is a flowchart related to the first embodiment. 6a to 6d are views for explaining the driving of the pin in the case of the first bending amount. 7a to 7f are views for explaining the driving of the pin in the case of the second bending amount. 8a to 8f are diagrams for explaining the driving of the pin in the case of the third bending amount. 9a and 9b are drive setting profiles of the pin according to the first embodiment. 10a to 10c are views for explaining the exchange operation of the substrate according to the fourth embodiment. Fig. 11 is a view showing the configuration of an exposure apparatus according to a fifth embodiment. FIG. 12 is a view showing a configuration of a transport system according to a fifth embodiment. 13a and 13b are views showing the configuration of a substrate that is easily bent.

Claims (12)

A substrate holding device having a holding member that holds a substrate with a holding surface, the support member protruding from the holding surface to support the substrate above the holding surface, When the support member protrudes from the holding surface, the substrate is carried into the substrate or the substrate is lifted from above the holding surface, and the support member is driven in the height direction. In the above-described driving means, the height of the upper end of the support member when the substrate is carried in or when the substrate is carried out is changed based on the curved state of the substrate. The substrate holding device according to claim 1, wherein the driving means is to carry in or carry out a substrate having a second bending amount larger than the first bending amount, and the height of the upper end is higher than the substrate of the first bending amount It is low when moving in. The substrate holding device of claim 2, wherein the height of the substrate of the first bending amount and the height of the substrate of the second bending amount are equal to each other when being carried over the holding surface or being carried out from above the holding surface . The substrate holding device according to claim 1, wherein the driving means drives the support member in a direction approaching the substrate after the substrate is carried in to drive the support member in the approaching direction. The support member is driven so that the absolute value of the acceleration of the support member when the substrate is in contact with the substrate is equal to or less than a predetermined value. The substrate holding device according to claim 4, wherein the driving means is higher after the loading of the substrate having the second bending amount larger than the first bending amount by the height of the supporting member than when the substrate having the first bending amount is carried in. The method drives the aforementioned support member in the aforementioned approaching direction. The substrate holding device according to claim 1, wherein the driving means is a first driving means, and includes a second driving means for driving the holding member in the height direction, and the second driving means is associated with the substrate The loading or unloading drives the holding member in a direction away from the loading/unloading path of the substrate. A substrate holding device having a holding member, a supporting member, a driving means, and a rotating means for holding a substrate by a holding surface, the supporting member protruding from the holding surface so as to be above the holding surface And supporting the substrate, wherein the driving means drives the at least one of the holding member and the supporting member in a height direction, wherein the rotating means drives the at least one of the members to drive the After the support member protrudes from the holding surface, the holding member and the substrate are relatively rotated along the holding surface in a state where the supporting member supports the substrate, and the driving means is configured by the rotating means The amount of protrusion of the support member from the holding surface when the member is rotated relative to the substrate is changed based on the bending state of the substrate. The substrate holding device according to claim 7, wherein the driving means is the protrusion amount when the substrate having the second bending amount is supported by the substrate having the second bending amount larger than the first bending amount A large way drives at least one of the aforementioned members. The substrate holding device of claim 7, wherein the rotating means moves the support member in an in-plane direction of the holding surface. The substrate holding device of claim 1, which has a detecting means for detecting a bending amount of the substrate, the detecting means having a moving member and a detecting means, wherein the moving member is moved to the substrate supported by the supporting portion In the vertical direction, the detecting means detects the contact of the moving member with the substrate, and the position of the moving member when the substrate is detected by the detecting means in the vertical direction of the surface is The bending state is detected. A lithographic apparatus comprising: a substrate holding device; and a substrate forming means for holding the substrate holding device, wherein the substrate holding device has a holding member and a supporting member, wherein the holding member holds the substrate with a holding surface In the member holding the member, the support member protrudes from the holding surface to support the substrate above the holding surface, and the support member protrudes from the holding surface to the upper side of the holding surface. The loading of the substrate or the removal of the substrate from above the holding surface has a driving means for driving the supporting member in a height direction, and the driving means is for carrying out the substrate or carrying out the substrate. The height of the upper end of the aforementioned support member at the time is changed based on the bending state of the aforementioned substrate. A method for manufacturing an article, comprising: a forming program, a processing program, and a manufacturing program, wherein the forming program is a pattern forming on a substrate by a lithography apparatus, wherein the processing program is to process a substrate on which the pattern is formed by the forming process, the manufacturing The procedural device includes a substrate holding device and a substrate forming pattern for holding the substrate holding device, and the substrate holding device has a holding member and a supporting member. The holding member is a holder that holds the substrate, and the support member protrudes from the holding surface to support the substrate above the holding surface, and the support member protrudes from the holding surface. Carrying in the substrate above the holding surface or carrying out the substrate from above the holding surface, and driving means for driving the supporting member in the height direction, wherein the driving means is to perform the substrate When moving in or performing the aforementioned substrate The height of the upper end of the support member at a configuration, based on the bending state of the substrate is changed.