JP2007299864A - Method and apparatus for holding, method and apparatus for forming pattern, and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a holding method capable of preventing deformation of a substrate for keeping the substrate in a desired state. <P>SOLUTION: The holding method includes an action of relatively moving a substrate and a holding member so that one of surfaces of the substrate is brought close to a holding surface of the holding member, so as to bring the one surface into contact with the holding surface. In at least part of a predetermined section during the movement, acceleration is varied in the relative moving direction of the substrate and the holding member. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a holding method and a holding apparatus for holding a substrate, a pattern forming method and a pattern forming apparatus for forming a pattern, and a device manufacturing method.

When manufacturing a microdevice such as a semiconductor device or an electronic device, a substrate is held by a holding device, and a device pattern is formed on the held substrate. The following patent document discloses an example of a technique related to a holding device that holds a substrate on which a device pattern is formed.
Japanese Patent Laid-Open No. 2005-12009

  In order to form a desired pattern on the substrate, it is necessary to suppress deformation of the substrate held by the holding device. When a micro device is formed by superimposing a plurality of patterns (layers) on a substrate, if the deformation state of the substrate held by the holding device is different for each pattern (layer) formed, the desired positional relationship is established. It becomes difficult to superimpose patterns (layers), and the performance of the manufactured device may deteriorate.

  This invention is made | formed in view of such a situation, Comprising: It aims at providing the holding | maintenance method and holding | maintenance apparatus which can hold | maintain a board | substrate in a desired state, suppressing a deformation | transformation of a board | substrate. It is another object of the present invention to provide a pattern forming method and a pattern forming apparatus that can satisfactorily form a pattern on a substrate held in a desired state, and a device manufacturing method using the pattern forming apparatus.

  In order to solve the above-described problems, the present invention employs the following configurations corresponding to the respective drawings shown in the embodiments. However, the reference numerals with parentheses attached to each element are merely examples of the element and do not limit each element.

  According to the first aspect of the present invention, there is provided a holding method for holding a substrate (P) with a holding member (1), wherein one surface (Pb) of the substrate (P) and a holding surface of the holding member (1). (10) has an operation of moving the substrate (P) and the holding member (10) relative to each other so as to be close to each other and bringing the one surface (Pb) and the holding surface (10) into contact with each other. A holding method is provided that changes the acceleration in the relative movement direction between the substrate (P) and the holding member (1) in at least a part of the predetermined section (K2).

  According to the first aspect of the present invention, the substrate can be held in a desired state.

  According to the second aspect of the present invention, the pattern forming method includes an operation of holding the substrate (P) by the holding member (1), and the holding operation is performed by the pattern forming method including the holding method of the above aspect. Provided.

  According to the 2nd aspect of this invention, a pattern can be favorably formed on the board | substrate hold | maintained in the desired state.

  According to the third aspect of the present invention, the holding device (1) is a holding device that holds the substrate (P) and has a holding surface (10) that can contact one surface (Pb) of the substrate (P). ), A support member (4) provided on the holding member (1) and capable of supporting a predetermined region of one surface (Pb) of the substrate (P), and holding one surface (Pb) of the substrate (P) In order to contact the holding surface (10) of the member (1), one surface (Pb) of the substrate (P) supported by the support member (4) and the holding surface (10) of the holding member (1) A drive device (5) capable of relatively moving the support member (4) supporting the substrate (P) and the holding member (1) so as to be close to each other, and at least a part of the movement by the drive device (5) In the predetermined section (K2), the drive device (5) is controlled so as to change the acceleration in the relative movement direction between the substrate (P) and the holding member (1). Controller (3) and holding device provided with a to (PST) is provided.

  According to the third aspect of the present invention, the substrate can be held in a desired state.

  According to a fourth aspect of the present invention, there is provided a pattern forming apparatus comprising a holding device for holding a substrate (P), wherein the holding device (PST) of the above aspect is used for the holding device. (EX) is provided.

  According to the 4th aspect of this invention, a pattern can be favorably formed on the board | substrate hold | maintained in the desired state.

  According to the fifth aspect of the present invention, there is provided a pattern forming apparatus including a holding member (21) for holding the substrate (M), the one surface (Mb) of the substrate (M) and the holding member (21). The driving device (H1) which makes the one surface (Mb) and the holding surface (20) contact each other by relatively moving the substrate (M) and the holding member (21) so as to be close to the holding surface (20). And the control for controlling the driving device (H1) so as to change the acceleration in the relative movement direction between the substrate (M) and the holding member (21) in at least a part of the predetermined section during the movement by the driving device (H1). A pattern forming apparatus (EX) comprising the apparatus (3) is provided.

  According to the fifth aspect of the present invention, the substrate can be held in a desired state, and the pattern can be satisfactorily formed on the substrate held in the desired state.

  According to the sixth aspect of the present invention, there is provided a device manufacturing method using the pattern forming apparatus (EX) of the above aspect.

  According to the sixth aspect of the present invention, a device can be manufactured using a pattern forming apparatus capable of forming a pattern on a substrate satisfactorily.

  ADVANTAGE OF THE INVENTION According to this invention, a board | substrate can be hold | maintained in a desired state, and a pattern can be favorably formed on the board | substrate hold | maintained in the desired state. Therefore, a device having a desired performance can be manufactured.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The predetermined direction in the horizontal plane is the X-axis direction, the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction, and the direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, the vertical direction) is the Z-axis direction. To do. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic configuration diagram showing a pattern forming apparatus according to this embodiment. In the present embodiment, an example will be described in which the pattern forming apparatus is an exposure apparatus that forms a pattern (device pattern) on a photosensitive substrate by irradiating exposure light onto the substrate.

  In FIG. 1, an exposure apparatus EX includes a mask stage MST that can move while holding a mask M having a pattern, a substrate stage PST that can move while holding a substrate P, and a mask M that is held on the mask stage MST. An illumination system IL that illuminates the exposure light EL, a projection optical system PL that projects an image of the pattern of the mask M illuminated by the exposure light EL onto the substrate P, and a control device 3 that controls the overall operation of the exposure apparatus EX. And. The substrate stage PST has a holding member 1 that holds the substrate P.

  The control device 3 is connected to a storage device 7 that stores information related to exposure processing and an input device 8 that inputs information related to exposure processing. The input device 8 includes a keyboard, a mouse, a touch panel, and the like, for example. Further, the exposure apparatus EX includes a mask transport apparatus H1 that transports the mask M to the mask stage MST, and a substrate transport apparatus H2 that transports the substrate P to the substrate stage PST.

  Here, the substrate includes a substrate in which a photosensitive material (photoresist) is applied on a base material such as a semiconductor wafer or a glass plate, and the mask includes a reticle on which a device pattern to be reduced and projected is formed on the substrate. . The mask has a predetermined pattern formed on a transparent plate member such as a glass plate using a light shielding film such as chromium. In this embodiment, a transmissive mask is used as a mask, but a reflective mask may be used. Further, in the present embodiment, a mask in which a pattern is formed using a light shielding film is used, but a phase shift mask including a phase shift portion (including a light reduction portion) that shifts the phase of the exposure light EL by, for example, π may be used. Good.

  The illumination system IL can emit the exposure light EL, and illuminates the mask M on which the pattern is formed with the emitted exposure light EL. The projection optical system PL projects an image of the pattern of the mask M onto the substrate P based on the exposure light EL from the pattern of the mask M, and forms a latent image of the pattern on the photosensitive material layer on the substrate P. The exposure apparatus EX emits exposure light EL from the illumination system IL, illuminates the mask M on which the pattern is formed with the exposure light EL, and is an image of the pattern of the mask M illuminated with the exposure light EL. By exposing the substrate P having a pattern, a pattern is formed on the substrate P.

The illumination system IL illuminates the illumination area on the mask M held by the mask stage MST with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as a bright line (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, Vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm) is used. In the present embodiment, ArF excimer laser light is used as the exposure light EL.

  The mask stage MST is movable in the X-axis, Y-axis, and θZ directions while holding the mask M by driving a mask stage driving device MD including an actuator such as a linear motor. Position information of the mask stage MST (and thus the mask M) is measured by the laser interferometer MK. Laser interferometer MK measures positional information of mask stage MST using a reflective surface provided on mask stage MST. The control device 3 drives the mask stage driving device MD based on the measurement result of the laser interferometer MK, and controls the position of the mask M held on the mask stage MST.

  The projection optical system PL projects an image of the pattern of the mask M onto the substrate P at a predetermined projection magnification, has a plurality of optical elements, and these optical elements are held by a lens barrel. In the present embodiment, the projection optical system PL is a reduction system having a projection magnification of, for example, 1/4, 1/5, or 1/8. The projection optical system PL may be either a reduction system or an equal magnification system. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element.

  The substrate stage PST is driven by a substrate stage driving device PD including an actuator such as a linear motor, and holds the substrate P, and the X axis, the Y axis, the Z axis, θX, θY, and θZ on the base member BP. It can move in the direction of 6 degrees of freedom. The position information of the substrate stage PST (and consequently the substrate P) is measured by the laser interferometer PK. The laser interferometer PK measures position information regarding the X axis, the Y axis, and the θZ direction of the substrate stage PST using a reflection surface provided on the substrate stage PST. Further, the surface position information (position information regarding the Z axis, θX, and θY directions) of the surface of the substrate P held on the substrate stage PST is detected by a focus / leveling detection system (not shown). The control device 3 drives the substrate stage driving device PD based on the measurement result of the laser interferometer PK and the detection result of the focus / leveling detection system, and controls the position of the substrate P held on the substrate stage PST.

  Next, the substrate stage PST according to this embodiment will be described. 2 and 3 are side sectional views showing the substrate stage PST according to this embodiment, and FIG. 4 is a plan view of the holding member 1 of the substrate stage PST as viewed from above. 2 corresponds to a cross-sectional view taken along line AA in FIG. 4, and FIG. 3 corresponds to a cross-sectional view taken along line BB in FIG. 2 shows a state where the substrate P is held by the holding member 1, and FIGS. 3 and 4 show a state where the substrate P is not held.

  2, 3, and 4, the substrate stage PST includes a holding member (substrate holder) 1 having a holding surface 10 that can contact the lower surface (back surface) Pb of the substrate P, and a holding member 1 by, for example, vacuum suction. And a table member 2 that supports the table. The holding surface 10 of the holding member 1 is the upper surface of the holding member 1 that faces the lower surface Pb of the substrate P, and includes an upper surface 11A of the base material 11, an upper surface 12A of the pin member 12, and a peripheral wall member (rim portion) 13 described later. The upper surface 13 </ b> A and the upper surface 17 </ b> A of the peripheral wall member 17 are included.

  The substrate stage PST of this embodiment is provided on the holding member 1, a support member 4 that can support a predetermined region of the lower surface Pb of the substrate P, and a drive device 5 that can move the support member 4 relative to the holding member 1. It has. The support member 4 is a pin-shaped member, and a plurality of support members 4 are provided. In the present embodiment, three support members 4 are provided. The base material 11 of the holding member 1 is formed with a plurality (three) of holes 1H in which the support member 4 is disposed. The support member 4 and the hole 1H corresponding to the support member 4 are provided at positions corresponding to substantially the apexes of the equilateral triangle in the vicinity of the center of the upper surface of the base member 11 of the holding member 1.

  The support member 4 is provided so as to be movable in the Z-axis direction, that is, capable of moving up and down. The driving device 5 is disposed inside the substrate stage PST, and is connected to a plate member 4B that supports the lower ends of the plurality of supporting members 4. The drive device 5 can move the plurality of support members 4 by the same distance in the Z-axis direction almost simultaneously by moving the plate member 4B in the Z-axis direction. The control device 3 can control the drive device 5 to move the support member 4 with respect to the holding member 1 in the Z-axis direction.

  A suction port 6 capable of sucking gas is provided on each upper surface 4A of the support member 4. The controller 3 sucks the lower surface Pb of the substrate P with the upper surface 4A of the support member 4 by performing the suction operation of the suction port 6 in a state where the upper surface 4A of the support member 4 and the lower surface Pb of the substrate P are in contact with each other. Can be held.

  In the present embodiment, the support member 4 provided in the vicinity of the center of the upper surface of the base material 11 of the holding member 1 supports a predetermined region substantially at the center of the lower surface Pb of the substrate P. The support member 4 is movable in the Z-axis direction with its upper surface 4A supporting a predetermined region of the lower surface Pb of the substrate P. The control device 3 can control the driving device 5 to move the support member 4 supporting the lower surface Pb of the substrate P in the Z-axis direction with respect to the holding member 1.

  Further, the control device 3 can control the driving device 5 to control the movement state of the support member 4 that supports the substrate P. The movement state includes the position, speed, and acceleration (deceleration) of the support member 4 in the Z-axis direction. The control device 3 controls the drive device 5 to control the movement of the support member 4 so that at least the relative position, relative speed, and relative acceleration of the substrate P supported by the support member 4 with respect to the holding member 1 are controlled. One can be adjusted.

  The holding member 1 includes a pin member 12 and a peripheral wall member 13 which are formed on the base material 11 and can support the lower surface Pb of the substrate P, and a suction port 14 which is formed on the base material 11 and can suck gas. Yes. The base material 11 of the holding member 1 has a shape corresponding to the substrate P. In the present embodiment, the substrate P is substantially circular in the XY plane, and the base material 11 is also formed in a substantially circular shape in the XY plane.

  A plurality of pin members 12 are formed on the upper surface 11 </ b> A of the substrate 11. The peripheral wall member 13 is formed so as to surround the plurality of pin members 12. The peripheral wall member 13 is formed in a substantially annular shape according to the outer shape of the substrate P, and a plurality of pin members 12 are uniformly formed inside the peripheral wall member 13.

  The pin member 12 has an upper surface 12A that faces the lower surface Pb of the substrate P. The upper surface 12A of the pin member 12 is flat. Each of the upper surfaces 12A of the plurality of pin members 12 is provided at substantially the same height.

  The peripheral wall member 13 has an upper surface 13A that faces the lower surface Pb of the substrate P. The upper surface 13A of the peripheral wall member 13 is flat and has a predetermined width. The peripheral wall member 13 is formed on the periphery of the base material 11, and the upper surface 13 </ b> A of the peripheral wall member 13 is provided so as to face the peripheral region of the lower surface Pb of the substrate P held by the holding member 1. That is, the peripheral wall member 13 has an outer diameter slightly smaller than the outer diameter of the substrate P.

  In the present embodiment, the upper surface 12A of the pin member 12 and the upper surface 13A of the peripheral wall member 13 are provided at substantially the same height. That is, the upper surface 12A of the plurality of pin members 12 and the upper surface 13A of the peripheral wall member 13 are located on substantially the same plane and are flush with each other. The upper surface 12A of the pin member 12 and the upper surface 13A of the peripheral wall member 13 can contact the lower surface Pb of the substrate P. When the lower surface Pb of the substrate P is in contact with the upper surface 12A of the pin member 12 and the upper surface 13A of the peripheral wall member 13, the lower surface Pb side of the substrate P is surrounded by the substrate P, the peripheral wall member 13, and the base material 11. A space 15 is formed.

  An annular peripheral wall member 17 having an upper surface 17A having substantially the same height as the upper surface 12A of the pin member 12 is also provided around the hole 1H. When the lower surface Pb of the substrate P is in contact with the upper surface 12A of the pin member 12 and the upper surface 13A of the peripheral wall member 13, the lower surface Pb of the substrate P and the upper surface 17A of the peripheral wall member 17 are also in contact.

  The suction port 14 is for sucking and holding the substrate P, and is provided at a plurality of predetermined positions other than the pin member 12 on the upper surface 11 </ b> A of the base material 11 inside the peripheral wall member 13. In the present embodiment, as shown in FIG. 4, the suction port 14 extends from the vicinity of the center of the upper surface 11 </ b> A of the base material 11 in the radial direction (the directions of six radii having a central angle interval of approximately 60 °). Two are formed, and formed in 12 places in total.

  As shown in FIG. 2, each of the suction ports 14 is connected to a suction device 9 including a vacuum system provided outside the holding member 1 via a flow path 16. At least a part of the flow path 16 that connects each of the suction ports 14 and the suction device 9 is formed inside the base material 11. In the present embodiment, a part of the flow path 16 is also formed on the table member 2.

  The suction device 9 can make negative pressure in the space 15 surrounded by the substrate P, the peripheral wall member 13 and the base material 11. In the present embodiment, the holding member 1 has a pin member 12 and includes a so-called pin chuck mechanism. The control device 3 drives the suction device 9 to suck the gas in the space 15 surrounded by the substrate P, the peripheral wall member 13 and the base material 1 to make the space 15 have a negative pressure. The pin member 12 is sucked and held by the holding surface 10 including the upper surface 12A of the pin member 12, the upper surface 13A of the peripheral wall member 13, and the upper surface 17A of the peripheral wall member 17.

  The control device 3 controls the driving device 5 and moves (lifts and lowers) the support member 4 in the Z-axis direction during loading (loading) and unloading (unloading) of the substrate P with respect to the holding member 1. It moves in the Z-axis direction while supporting the lower surface Pb of P or supporting the lower surface Pb of the substrate P.

  Next, a method of holding the substrate P by the holding member 1 of the substrate stage PST having the above-described configuration will be described with reference to the schematic diagrams of FIGS. 5 to 7 and FIG.

  As shown in FIG. 5, the substrate P is loaded onto the holding member 1 by the substrate transport device H2. The control device 3 controls the driving device 5 before the substrate P is loaded (or in a state where the substrate P is disposed above the holding member 1), so that the upper surface 4A of the support member 4 is at least a pin member. The support member 4 is raised so as to be positioned above (+ Z side) the upper surface 12A of the twelve.

  The substrate P held by the substrate transport apparatus H2 is delivered to the support member 4 of the substrate stage PST by the lowering of the substrate transport apparatus H2 or the lifting of the support member 4. As shown in FIG. 6, the support member 4 supports a predetermined region substantially at the center of the lower surface Pb of the substrate P delivered from the substrate transport apparatus H2 by the upper surface 4A. The control device 3 performs a suction operation of the suction port 6 and sucks and holds the lower surface Pb of the substrate P with the upper surface 4 </ b> A of the support member 4.

  The control device 3 starts an operation for holding the lower surface Pb of the substrate P delivered from the substrate transport device H2 by the holding surface 10 of the holding member 1. The control device 3 holds the lower surface Pb of the substrate P supported by the support member 4 and the holding member 1 using the driving device 5 in order to bring the lower surface Pb of the substrate P into contact with the holding surface 10 of the holding member 1. The operation of moving the support member 4 supporting the substrate P with respect to the holding member 1 so as to approach the surface 10 is started. The control device 3 controls the driving device 5 to bring the lower surface Pb of the substrate P and the holding surface 10 of the holding member 1 into contact, so that the lower surface Pb of the substrate P and the holding surface 10 of the holding member 1 approach each other. Next, the substrate P supported by the support member 4 is moved.

  That is, in the present embodiment, the control device 3 brings the lower surface Pb of the substrate P close to the holding surface 10 of the holding member 1 in a state where the support member 4 supports a predetermined area at the center of the lower surface Pb of the substrate P. The operation is performed to bring the lower surface Pb of the substrate P into contact with the holding surface 10 of the holding member 1. Further, in the present embodiment, the control device 3 performs the suction operation of the suction port 14 provided in the holding surface 10 at least immediately before the time when the lower surface Pb of the substrate P and the holding surface 10 of the holding member 1 come into contact. Start. Accordingly, the control device 3 can quickly suck and hold the lower surface Pb of the substrate P by the holding surface 10 of the holding member 1 after the lower surface Pb of the substrate P and the holding surface 10 of the holding member 1 are in contact with each other.

  The control device 3 relatively moves the holding member 1 and the substrate P in the Z-axis direction so that the lower surface Pb of the substrate P and the holding surface 10 of the holding member 1 are brought closer to each other. In the present embodiment, the position of the holding member 1 is fixed, the holding surface 10 of the holding member 1 faces upward (+ Z side), and the lower surface Pb of the substrate P faces downward (−Z side). In order to bring the lower surface Pb of the substrate P and the holding surface 10 of the holding member 1 into contact, the control device 3 brings the lower surface Pb of the substrate P close to the lower surface Pb of the substrate P and the holding surface 10 of the holding member 1. In a state in which is directed downward, the driving device 5 is controlled to move the substrate P supported by the support member 4 in the −Z direction.

  In the present embodiment, the control device 3 changes the acceleration in the relative movement direction of the substrate P and the holding member 1 in at least some predetermined sections during the operation of moving the holding member 1 and the substrate P relatively. Let As described above, in the present embodiment, the substrate P is moved in the Z-axis direction, and the control device 3 performs the substrate P in at least a predetermined section during the movement of the substrate P in the Z-axis direction by the driving device 5. The driving device 5 is controlled so as to change the acceleration in the Z-axis direction.

  FIG. 7 is a diagram illustrating a state in which the acceleration of the substrate P is changed in a predetermined section during the operation in which the driving device 5 moves the substrate P so as to approach the holding member 1. In the present embodiment, the control device 3 changes the acceleration in the Z-axis direction of the substrate P in a predetermined section including a time point when the lower surface Pb of the substrate P and the holding surface 10 of the holding member 1 are in contact with each other. The control device 3 starts changing the acceleration of the substrate P immediately before the lower surface Pb of the substrate P and the holding surface 10 of the holding member 1 come into contact with each other.

  In order to adjust the shape of the substrate P when the substrate P is held by the holding member 1, the control device 3 changes the acceleration of the substrate P in a predetermined section while the substrate P is moving in the −Z direction. In the present embodiment, the substrate P is moved in the −Z direction with the lower surface Pb of the substrate P facing downward, and the control device 3 moves the substrate P in the direction in which the substrate P and the holding member 1 approach each other in a predetermined section. Accelerate. That is, the control device 3 starts an operation of increasing the acceleration in the −Z direction of the substrate P moving in the −Z direction immediately before the lower surface Pb of the substrate P contacts the holding surface 10 of the holding member 1.

  FIG. 8 is a view for explaining a moving state of the substrate P moving in a direction approaching the holding member 1 according to the present embodiment. 8A is a diagram showing the relationship between the position of the substrate P in the Z-axis direction and time, FIG. 8B is a diagram showing the relationship between the velocity of the substrate P in the Z-axis direction and time, and FIG. ) Is a diagram showing the relationship between the acceleration of the substrate P in the Z-axis direction and time. As shown in FIG. 8, in the present embodiment, the substrate P approaches the holding member 1 in a predetermined section K2 including a time point Ta where the lower surface Pb of the substrate P and the holding surface 10 of the holding member 1 are in contact with each other. That is, it is accelerated in the −Z direction. A time point Tb at which acceleration is started, that is, a time point Tb at which an increase in acceleration in the −Z direction is started is set immediately before the lower surface Pb of the substrate P and the holding surface 10 of the holding member 1 come into contact with each other. Further, in the section before the predetermined section K2, that is, in the section K1 in which the support member 4 moves the substrate P closer to the holding member 1 after the substrate P is transferred from the substrate transport apparatus H2, Except immediately after the start of the movement, the substrate P is moved in a direction approaching the holding member 1 at substantially constant speed (with no acceleration).

  The shape of the substrate P when the substrate P is held by the holding member 1 can be adjusted by accelerating the substrate P in the direction approaching the holding member 1 (−Z direction) in the predetermined section K2. By accelerating the substrate P in the −Z direction in the predetermined section K2 (see the arrow Za in FIG. 7), the inertial force in the + Z direction acts on the peripheral region of the substrate P as indicated by the arrow Zi in FIG. . The control device 3 can cause the holding member 1 to hold the substrate P in a desired state by applying an inertial force in the + Z direction to the peripheral region of the substrate P immediately before being held by the holding member 1.

  FIG. 9 is a schematic diagram showing a comparative example, and FIG. 10 is a diagram for explaining the movement state of the substrate P showing the comparative example. As shown in the schematic diagram of FIG. 9, the substrate P that is supported by the support member 4 at a predetermined region at the center of the lower surface Pb can be deformed so that the peripheral region bends downward due to, for example, its own weight (gravity action). (See arrow Zb in FIG. 9). In addition, after the lower surface Pb of the substrate P comes into contact with the holding surface 10 of the holding member 1, the lower surface Pb of the substrate P and the holding member are used to quickly suck and hold the lower surface Pb of the substrate P with the holding surface 10 of the holding member 1. When the suction operation of the suction port 14 provided in the holding surface 10 is started at least immediately before the time when the one holding surface 10 comes into contact, the peripheral region of the substrate P is also affected by pressure fluctuations due to the suction operation. Deformation that bends downward may occur. In particular, immediately before the lower surface Pb of the substrate P and the holding surface 10 of the holding member 1 come into contact with each other, the lower surface Pb of the substrate P and the holding surface 10 of the holding member 1 are close to each other. The bending deformation of the substrate P due to the suction operation of the suction port 14 may be significant. As shown in FIGS. 9 and 10, the acceleration of the substrate P is not changed and the holding of the lower surface Pb of the substrate P is maintained even in a predetermined section including the time when the lower surface Pb of the substrate P contacts the holding surface 10 of the holding member 1. When the substrate P is moving at a constant speed (instant) at the time of contact with the holding surface 10 of the member 1, the peripheral region of the substrate P is deformed so as to bend downward (the substrate P is convexly deformed upward). ) May be held by the holding member 1.

  In the present embodiment, as shown in FIGS. 7 and 8, the substrate P is accelerated in the direction approaching the holding member 1 (−Z direction) in the predetermined section K <b> 2, and the + Z direction is increased in the peripheral region of the substrate P. By applying the inertial force, it is possible to correct the deformation in which the peripheral region of the substrate P is bent downward, and to make the substrate P substantially flat. As described above, in the present embodiment, the predetermined section K2 includes a point in time when the lower surface Pb of the substrate P and the holding surface 10 of the holding member 1 are in contact, and the lower surface Pb of the substrate P and the holding surface 10 of the holding member 1. At the time point (instant) at which the substrate P contacts, the substrate P moves in an accelerating manner.

  In this embodiment, the control device 3 moves the substrate P supported by the support member 4 in the −Z direction while increasing the acceleration in the −Z direction in the predetermined section K <b> 2. The lower surface Pb and the holding surface 10 of the holding member 1 are brought into contact with each other. Since the control device 3 starts the suction operation of the suction port 14 at least immediately before the time when the lower surface Pb of the substrate P and the holding surface 10 of the holding member 1 are in contact, the lower surface Pb of the substrate P is held on the holding member 1. The holding surface 10 can be quickly adsorbed and held. The holding member 1 can adsorb and hold the substrate P in a substantially flat desired state. The substrate P is sucked and held by the holding member 1 in a substantially flat state. Further, the control device 3 moves the support member 4 in the −Z direction even after the lower surface Pb of the substrate P is attracted and held by the holding surface 10 of the holding member 1, so that the lower surface Pb of the substrate P and the support member 4 are moved. Can be separated from the upper surface 4A.

  In this embodiment, the release of the adsorption of the substrate P by the support member 4 is performed simultaneously with or just before the contact between the lower surface Pb of the substrate P and the holding surface 10 of the holding member 1. In the case where the suction force of the support member 4 is so weak that the support member 4 does not give the substrate P, the support member 4 may cancel the suction of the substrate P after the contact between the lower surface Pb of the substrate P and the holding surface 10 of the holding member 1. Good.

  The optimum acceleration information corresponding to the substrate P is stored in the storage device 7 in advance. That is, the shape of the substrate P when the substrate P is held by the holding member 1, such as how much the substrate P should be moved to hold the substrate P on the holding member 1 in a desired state, is the desired state. The optimum acceleration information for making the data is stored in the storage device 7 in advance. A plurality of different substrates P are sequentially loaded on the holding member 1, and the holding member 1 sequentially holds the plurality of different substrates P. In these plurality of substrates P, for example, the deformation state of the substrates P differs from each other according to the pattern (layer) already formed before being loaded on the holding member 1, or the substrate P when the substrate P is accelerated. May have different behaviors (shapes). Further, even when various process conditions (for example, heat treatment conditions) are applied to the substrate P, the deformation state of the substrate P before being loaded on the holding member 1 and the behavior when accelerated may be different from each other.

  In the storage device 7, optimum acceleration information corresponding to each of the plurality of substrates P is stored in advance. The optimum acceleration information stored in the storage device 7 can be obtained in advance by at least one of experiment and simulation. For example, the substrate P is moved at various accelerations and is held by the holding member 1, the substrate P is test-exposed, and the optimum acceleration of the substrate P that can be satisfactorily exposed can be obtained based on the test exposure result. . Based on the storage information of the storage device 7, the control device 3 sets the optimum acceleration corresponding to the substrate P that is loaded on the holding member 1 and is held by the holding member 1, and the predetermined acceleration is used for the predetermined interval. The substrate P is accelerated at K2.

  It should be noted that the plurality of substrates P in the same lot may have substantially the same deformation state and behavior at the time of acceleration. In this case, the optimum acceleration information is stored in the storage device 7 for each lot. Also good.

  Note that the acceleration (velocity) of the substrate P at the end of the predetermined section K2, that is, the acceleration (velocity) when the substrate P is in contact with the holding member 1, is allowed to generate foreign matter and contaminants (contamination) at the time of contact. It is preset to such an extent that it can be suppressed below the level.

  Further, information regarding the substrate P held by the holding member 1 is input by the input device 8. That is, information on the substrate P to be loaded on the holding member 1, for example, what pattern (layer) has already been formed, what kind of process conditions have been transferred to the holding member 1, etc. Information relating to the substrate P held by the member 1 can be input by the input device 8 by an operator, for example. Based on the input information of the input device 8 and the storage information of the storage device 7, the control device 3 is optimal for bringing the shape of the substrate P into a desired state when the substrate P is held by the holding member 1. Acceleration can be set.

  Note that the operator may input optimum acceleration information instead of information relating to the substrate P. For example, information relating to the substrate P or optimum acceleration information may be input via a LAN or the like from a host computer that manages the device manufacturing process. It is good to do.

  Then, after holding the substrate P with the holding member 1 in a state where deformation of the substrate P is suppressed, the control device 3 starts an operation of forming a pattern on the substrate P held by the holding member 1. The mask M is loaded on the mask stage MST by the mask transport device H1, and the control device 3 emits the exposure light EL from the illumination system IL and illuminates the mask M on which the pattern is formed with the exposure light EL. . The pattern image of the mask M illuminated with the exposure light EL is projected onto the photosensitive substrate P by the projection optical system PL. A latent image of the pattern is formed on the photosensitive material layer on the substrate P. Then, the control device 3 unloads the exposed substrate P from the holding member 1 by using the substrate transport device H2. The substrate P unloaded from the holding member 1 is transferred to a peripheral device such as a developer device and subjected to predetermined processing such as development processing and etching processing. As a result, a pattern corresponding to the pattern of the mask M is formed on the substrate P.

  As described above, in the present embodiment, holding is performed by changing the acceleration of the substrate P so as to cancel the bending deformation of the substrate P in the predetermined section K2 immediately before the substrate P is held by the holding member 1. The deformation of the substrate P held by the member 1 can be suppressed, and the substrate P in a state adjusted to a substantially flat desired shape can be held by the holding member 1. Therefore, even when a microdevice is formed by superimposing a plurality of patterns (layers) on the substrate P, the shape of the substrate P held by the holding member 1 is desired every time each pattern (layer) is exposed. The patterns (layers) can be overlapped with each other in a desired positional relationship.

  In particular, position information of alignment marks formed corresponding to some typical shot areas among a plurality of shot areas formed on the substrate P, and design information (array information) of known shot areas. Based on the above, positional information of each shot region on the substrate P is obtained by so-called EGA (Enhanced Global Alignment) processing that derives the regularity of the arrangement of all shot regions on the substrate P by statistical calculation processing. If the deformation state of the substrate P held by the holding member 1 is different every time each pattern (layer) is exposed, it is difficult to superimpose the patterns (layers) in a desired positional relationship. The EGA processing is disclosed in, for example, Japanese Patent Application Laid-Open No. 61-44429.

  According to the present embodiment, even when position information of each shot area on the substrate P is obtained by EGA processing, the patterns (layers) can be overlapped with each other in a desired positional relationship, and desired performance can be obtained. Can be manufactured.

  Then, in a predetermined section K2 including a time point when the lower surface Pb of the substrate P and the holding surface 10 of the holding member 1 are in contact with each other, the acceleration of the substrate P is changed, so that the substrate P when held by the holding member 1 is desired. It can be made into a shape.

  Further, by starting the change in acceleration immediately before the lower surface Pb of the substrate P and the holding surface 10 of the holding member 1 come into contact with each other, the substrate P when held by the holding member 1 is further shaped into a desired shape. can do. Moreover, the impact when the board | substrate P and the holding member 1 contact can also be suppressed.

  In the above-described embodiment, the support member 4 holds a predetermined region substantially at the center of the lower surface Pb of the substrate P, and the peripheral region of the substrate P may be deformed so as to bend downward. Although the acceleration in the predetermined section K2 is changed so as to cancel the downward bending deformation, even if the support member supports the peripheral area of the lower surface Pb of the substrate P, for example, the predetermined section The substrate P can be brought into a desired state by changing the acceleration at K2. That is, when the supporting member supports the peripheral region of the lower surface Pb of the substrate P, the center region of the substrate P is deformed so that the center region of the substrate P bends downward due to its own weight or the suction operation of the suction port 14. May be convexly deformed). Even in such a case, by accelerating the substrate P toward the holding member 1 in the predetermined section K2, the bending deformation of the substrate P is corrected, and the substrate P is held by the holding member 1 in a desired state. Can do.

  Further, in the above-described embodiment, the case where the bending deformation of the substrate P due to the weight of the substrate P or the suction operation of the suction port 14 is corrected has been described as an example. There is a possibility that the substrate P has already been deformed, for example, due to thermal deformation, before being loaded onto the holding member 1. Even in such a deformation, the deformation of the substrate P can be corrected by changing the acceleration of the predetermined section K2, and the substrate P in a desired state can be held by the holding member 1. For example, if the substrate P is deformed upward before being loaded onto the holding member 1, the substrate P is deformed by accelerating the substrate P in a direction closer to the holding member 1 in a predetermined section K2. Can be corrected. In addition, before the substrate P is loaded onto the holding member 1, for example, when the substrate P is deformed downwardly, the substrate P is decelerated in the predetermined section K2 in a direction approaching the holding member 1, or the predetermined section K2 is used. The deformation of the substrate P can be corrected by changing the acceleration of the substrate P in the predetermined section K2, such as by accelerating the substrate P in a direction away from the holding member 1.

Second Embodiment
Next, a second embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  In the first embodiment described above, the position of the holding member 1 is fixed, and when the substrate P is loaded onto the holding member 1, the driving device 5 is controlled with the lower surface Pb of the substrate P facing downward. The substrate P supported by the support member 4 is moved in the −Z direction. As shown in the schematic diagram of FIG. 11, the position of the support member 4 that supports the substrate P is fixed, and the lower surface of the substrate P is fixed. The holding member 1 may be moved in the + Z direction so that Pb and the holding surface 10 of the holding member 1 approach each other.

  Further, both the substrate P supported by the support member 4 and the holding member 1 may be moved in the Z-axis direction so that the lower surface Pb of the substrate P and the holding surface 10 of the holding member 1 approach each other.

  Even in this case, the relative relationship between the substrate P and the holding member 1 for bringing the substrate P and the holding member 1 into contact with each other so that the shape of the substrate P when the substrate P is held by the holding member 1 is in a desired state. In a predetermined section during movement, the acceleration in the Z-axis direction of at least one of the substrate P and the holding member 1 can be appropriately changed. Thereby, for example, even if the substrate P is bent and deformed due to the suction operation of the suction port 14 or process conditions, the deformation can be corrected.

<Third Embodiment>
In the first and second embodiments described above, the support member 4 provided on the holding member 1 (substrate stage PST) supports the lower surface Pb of the substrate P, and the lower surface Pb of the substrate P and the holding surface 10 of the holding member 1. Although at least one of the support member 4 and the holding member 1 is moved so as to be close to each other, the substrate P is directly attached to the holding surface 10 of the holding member 1 by, for example, the substrate transport device H2 without using the support member 4. You may make it mount. Even in this case, the acceleration of the substrate P is changed by controlling the movement of the substrate transport device H2 in a predetermined section during the relative movement of the substrate P and the holding member 1 for bringing the substrate P and the holding member 1 into contact with each other. Can be made.

<Fourth embodiment>
Further, as shown in FIG. 12, the substrate P is attached to the holding member 1 ′ using a substrate support device (tray) T as disclosed in, for example, Japanese Patent Application Laid-Open Nos. 2001-1001809 and 2003-258078. Even when loading, a transport device H2 ′ that transports the tray T together with the substrate P in a predetermined section during the relative movement between the substrate P and the holding member 1 ′ for bringing the substrate P into contact with the holding member 1 ′. The movement of the substrate P can be controlled to change the acceleration of the substrate P. In FIG. 12, the substrate P is rectangular, and the holding member 1 ′ is also rectangular according to the substrate P. Further, a groove 1M in which the tray T after the substrate P is transferred to the holding member 1 is formed in the holding member 1 ′, and at least a part of the conveying device H2 ′ is arranged in the groove 1M. The tray T is separated and retracted.

<Fifth Embodiment>
Next, a fifth embodiment will be described. In the first to fourth embodiments described above, the case where the substrate P irradiated with the exposure light EL from the projection optical system PL is held by the holding member 1 of the substrate stage PST has been described as an example. In the embodiment, when the mask M and the mask stage MST are relatively moved in order to bring one surface of the mask M irradiated with the exposure light EL from the illumination system IL into contact with the holding surface of the mask stage MST. Next, a case where the acceleration in the relative movement direction is changed will be described.

  As shown in FIG. 13, the mask M is loaded onto the mask stage MST by the mask transfer device H1. The mask stage MST includes a holding member 21 having a holding surface 20 that can come into contact with the lower surface (back surface) Mb of the mask M. The holding surface 20 of the holding member 21 is the upper surface of the holding member 21 that faces the lower surface Mb of the mask M, and faces upward (+ Z direction).

  As shown in FIG. 14, the holding member 21 of the mask stage MST of the present embodiment is formed on the base material 21B, the pin member 22 and the peripheral wall member 23 that can support the lower surface Mb of the mask M, and the base material 21B. And is provided with a suction port 24 capable of sucking gas. The base material 21 </ b> B of the holding member 21 has a shape corresponding to the mask M. In the present embodiment, the mask M and the base material 21B are substantially rectangular in the XY plane.

  In the center of the holding member 21, a rectangular opening 21K through which the exposure light EL passes is formed. The pair of peripheral wall members 23 are formed on both sides in the Y-axis direction of the opening 21K on the upper surface of the base material 21B. A plurality of pin members 22 are formed inside the peripheral wall member 23 on the upper surface of the base material 21B.

  The holding surface 20 of the holding member 21 includes the upper surface of the base material 21 </ b> B, the upper surface of the pin member 22, and the upper surface of the peripheral wall member 23. The upper surface of the pin member 22 and the upper surface of the peripheral wall member 23 can contact the lower surface Mb of the mask M. By contacting the lower surface Mb of the mask M with the upper surface of the pin member 22 and the upper surface of the peripheral wall member 23, a space surrounded by the mask M, the peripheral wall member 23, and the base material 21B is formed on the lower surface Mb side of the mask M. It is formed.

  The suction port 24 is for holding the mask M by suction, and is provided inside the peripheral wall member 23 at a predetermined position other than the pin member 22 on the upper surface of the base material 21B. Each of the suction ports 24 is connected to a suction device including a vacuum system provided outside the holding member 21 through a flow path. The suction device connected to the suction port 24 can create a negative pressure in the space surrounded by the mask M, the peripheral wall member 23, and the base material 21B. In the present embodiment, the holding member 21 has a pin member 22 and includes a so-called pin chuck mechanism. The control device 3 drives the suction device connected to the suction port 24, sucks the gas in the space surrounded by the substrate P, the peripheral wall member 23, and the base material 21B, and makes this space negative pressure. The mask M is sucked and held by the holding surface 20 including the upper surface of the pin member 22 and the upper surface of the peripheral wall member 23. FIG. 15 shows a state in which the mask M is sucked and held by the holding member 21, and a contact portion between the mask M and the holding member 21 is shown by hatching.

  In order to load the mask M onto the holding member 21, the control device 3 moves the holding member 21 and the mask M relative to each other in the Z-axis direction so that the lower surface Mb of the mask M and the holding surface 20 of the holding member 21 are brought closer to each other. Move to. In the present embodiment, the position of the holding member 21 is fixed, the holding surface 20 of the holding member 21 faces upward (+ Z side), and the lower surface Mb of the mask M faces downward (−Z side). The control device 3 makes the lower surface Mb of the mask M close to the lower surface Mb of the mask M and the holding surface 20 of the holding member 21 in order to bring the lower surface Mb of the mask M into contact with the holding surface 20 of the holding member 21. With the mask facing downward, the mask transfer device H1 holding the mask M is controlled to move the mask M held by the mask transfer device H1 in the -Z direction.

  The control device 3 can control the movement state of the mask transport device H1 holding the mask M. The control device 3 can adjust at least one of a relative position, a relative speed, and a relative acceleration of the mask M held by the mask transfer device H1 with respect to the holding member 21 by controlling the movement of the mask transfer device H1. is there.

  The control device 3 changes the acceleration in the relative movement direction of the mask M and the holding member 21 in at least a predetermined section during the operation of moving the holding member 21 and the mask M relatively. The control device 3 controls the mask transport device H1 so as to change the acceleration of the mask M in the Z-axis direction at least in a predetermined section during the movement of the mask M in the Z-axis direction by the mask transport device H1. The control device 3 accelerates in a direction in which the mask M and the holding member 21 approach each other for a predetermined time including a point in time when the lower surface Mb of the mask M and the holding surface 20 of the holding member 21 come into contact with each other. In the present embodiment, the control device 3 performs an operation of increasing the acceleration in the −Z direction of the mask M that moves in the −Z direction immediately before the lower surface Mb of the mask M contacts the holding surface 20 of the holding member 21. Start. Thereby, the shape of the mask M when the mask M is held by the holding member 21 can be adjusted, and the mask M can be held by the holding member 21 in a desired state.

  Also in this embodiment, the mask M and the holding member 21 for bringing the mask M and the holding member 21 into contact with each other so that the shape of the mask M when the mask M is held by the holding member 21 is in a desired state. For example, the acceleration of the mask M may be changed as appropriate, for example, by decelerating the mask M in a direction approaching the holding member 21 or accelerating the mask M in a direction away from the holding member 21. it can.

<Sixth Embodiment>
Next, a sixth embodiment will be described. In the fifth embodiment described above, the holding surface 20 of the holding member 21 faces upward (+ Z side), and the lower surface Mb of the mask M faces downward (−Z side). In order to bring the lower surface Mb of the mask M and the holding surface 20 of the holding member 21 into contact, the mask M held by the mask transfer device H1 is moved in the −Z direction. However, as shown in FIG. The holding surface 20 of 21 may face downward (-Z side). In this case, the holding surface 20 of the holding member 21 holds a surface (upper surface) Ma facing upward (+ Z side) of the mask M.

  For example, when a reflective mask is used as a mask, such as an EUV (Extreme Ultra Violet) exposure apparatus, the upper surface Ma of the mask M having a pattern formed on the lower surface is held by a holding member 21 as shown in FIG. The exposure light may be applied to the mask M from below M.

  In the present embodiment, the control device 3 brings the upper surface Ma of the mask M and the holding surface 20 of the holding member 21 closer to bring the upper surface Ma of the mask M and the holding surface 20 of the holding member 21 into contact with each other. With the upper surface Ma of the mask M facing upward, the mask transport device H1 holding the mask M is controlled to move the mask M held by the mask transport device H1 in the + Z direction.

  Also in this embodiment, the mask M and the holding member 21 for bringing the mask M and the holding member 21 into contact with each other so that the shape of the mask M when the mask M is held by the holding member 21 is in a desired state. In a predetermined section during relative movement, the acceleration of the mask M is increased, for example, by accelerating or decelerating the mask M in a direction approaching the holding member 21 or accelerating the mask M in a direction away from the holding member 21. It can be changed appropriately.

  In the fifth and sixth embodiments described above, the mask transport device H1 is moved in the Z direction, but the holding member 21 may be moved in the Z direction instead of or in combination with it. Further, a support member for the mask M is provided in the same manner as the support member 4 described above, and the mask M is transferred between the mask transport device H1 and the holding member 21 by this support member, and instead of the mask transport device H1. Alternatively, the support member may be moved in the Z direction, and the acceleration of the mask M may be appropriately changed by controlling the movement.

<Seventh embodiment>
In each of the above-described embodiments, the case where the mask M on which the pattern is formed or the substrate P having photosensitivity is held by the holding member is described as an example. A measuring member for bringing the measuring member and the holding device into contact with each other so that the shape of the measuring member when the measuring member is held by the holding device is in a desired state. In a predetermined section during relative movement with the holding device, the acceleration of the measurement member can be appropriately changed.

  In FIG. 17, a recess 51 is formed in a part of the predetermined member CST, and a holding device 60 that holds the measurement member 50 by suction is provided inside the recess 51. The predetermined member CST is a member that is disposed on the image plane side (light emission side) of the projection optical system PL and is movable on the image plane side. The holding device 60 includes a pin chuck mechanism including a pin member 64, a peripheral wall member, and a suction port. The holding device 60 can detach the measuring member 50, and the measuring member 50 can be exchanged for the holding device 60.

  The measurement member 50 includes a reference mark measured by, for example, a VRA (Visual Reticle Alignment) type alignment system or an FIA (Field Image Alignment) type alignment system. The reference mark is formed on the upper surface of the measurement member 50. A VRA (Visual Reticle Alignment) type alignment system is disclosed in, for example, Japanese Patent Laid-Open No. 7-176468, and an FIA (Field Image Alignment) type alignment system is disclosed in, for example, Japanese Patent Laid-Open No. 4-65603. Has been. Further, a recess 53 is formed on the lower surface 50 b of the measuring member 50.

  A support member 54 made of a pin member can be arranged inside the holding device 60. The support member 54 is driven by a drive device such as a pneumatic cylinder, and is movable (can be raised and lowered) in the Z-axis direction. The support member 54 can be inserted into the recess 53 of the measurement member 50.

  As described above, the measuring member 50 is provided so as to be replaceable with respect to the holding device 60. Hereinafter, an example of an operation of attaching the measurement member 50 to the holding device 60 of the predetermined member CST will be described with reference to FIGS. 17 (A) to 17 (C).

  As shown in FIG. 17A, the measurement member 50 is transported to the holding device 60 of the predetermined member CST by a transport device (not shown). When the measuring member 50 is transported to the holding device 60, the control device 3 drives a driving device such as a pneumatic cylinder to raise the support member 54, and the tip (upper end) of the support member 54 is moved to the upper surface of the pin member 64. It arranges above (+ Z direction). Then, as shown in FIG. 17B, the control device 3 fits the tip of the support member 54 and the recess 53 of the measurement member 50. Next, the control device 3 lowers the support member 54 together with the measurement member 50 in a state where the tip of the support member 54 and the recess 53 of the measurement member 50 are fitted together. The control device 3 lowers the measurement member 50 and the support member 54 together to bring the lower surface 50b of the measurement member 50 into contact with the holding surface including the upper surface of the pin member 64 of the holding device 60. Thereby, as shown in FIG. 17C, the measuring member 50 is held by the holding device 60.

  Even when the measurement device 50 is held by the holding device 60, the control device 3 is configured so that the shape of the measurement member 50 when the measurement member 50 is held by the holding device 60 is in a desired state. By controlling the drive device that drives the support member 54 in a predetermined section during the relative movement between the measuring member 50 for bringing the holding device 60 into contact with the holding device 60, the acceleration of the measuring member 50 is appropriately changed. be able to.

  The measurement member 50 may be irradiated with the exposure light EL, and an opening (transmission window) that can transmit the exposure light EL may be provided in a part of the measurement member 50. Then, in the space below the measurement member 50 held by the holding device 60, for example, an aerial image measuring instrument as disclosed in Japanese Patent Application Laid-Open No. 2002-14005 and Japanese Patent Application Laid-Open No. 2002-198303 can be arranged. it can. The exposure light EL irradiated to the measuring member 50 can enter the aerial image measuring device through the opening (transmission window).

  Further, the predetermined member CST provided with the measuring member 50 and the holding device 60 that holds the measuring member 50 may be at least a part of the substrate stage PST, for example, Japanese Patent Laid-Open No. 11-135400 and Japanese Patent Laid-Open No. 2000. It may be at least part of a measurement stage (calibration stage) that is movable by mounting a measurement instrument (including a reference member and various photoelectric sensors) related to exposure, as disclosed in Japanese Patent No. 164504 / .

  An exposure apparatus provided with a substrate stage and a measurement stage can be applied as the exposure apparatus of the first to sixth embodiments described above.

  In the first to sixth embodiments described above, the suction device is connected to the holding member (1, 21) via the flow path. However, the present invention is not limited to this, for example, the mask M, After the substrate P is sucked and the flow path of the holding member is closed so that the suction is maintained, the connection with the suction device may be released.

  In the first to fourth embodiments described above, the holding member 1 and the substrate stage PST (table member 2) are configured separately, and the holding member 1 is fixed on the substrate stage PST by vacuum suction or the like. For example, the holding member 1 may be formed integrally with a part of the substrate stage PST (table member 2 or the like). In the holding member 1, the outer diameter of the peripheral wall member 13 is slightly smaller than the outer diameter of the substrate P. However, the holding member 1 is not limited to this and may be the same as or slightly larger than the outer diameter of the substrate P. Further, in the holding member 1, the upper surfaces 13A and 17A of the peripheral wall members 13 and 17 are the same height as the upper surface 12A of the pin member 12. However, the present invention is not limited to this, and the upper surfaces 13A and 17A of the peripheral wall members 13 and 17, for example. May be slightly lower than the upper surface 12A of the pin member 12, and furthermore, a pin member whose tip is disposed in the same plane as the upper surface 12A of the pin member 12 may be provided on the upper surfaces 13A and 17A. . In addition, the holding member 1 is configured such that the plurality of pin members 12 are surrounded by one peripheral wall member 13. However, the holding member 1 is not limited to this. For example, the holding surface 10 of the holding member 1 is divided into a plurality of blocks. The pin member 12 may be surrounded by a peripheral wall member.

  In the first to seventh embodiments described above, the substrate P is moved while increasing the acceleration in the Z direction in a predetermined section. However, the present invention is not limited to this, and the acceleration is kept constant after the acceleration is changed. It may be maintained. Further, the holding members 1 and 21 and the holding device 60 each have a pin chuck mechanism. However, the present invention is not limited to this. For example, a mechanism having a plurality of concentric convex portions instead of the pin member may be used. Furthermore, although the holding members 1 and 21 and the holding device 60 are each of the vacuum suction method, the invention is not limited to this, and for example, an electrostatic suction method may be used.

  In the first to seventh embodiments described above, for example, a liquid immersion method as disclosed in International Publication No. 99/49504 pamphlet or the like may be applied. That is, a liquid immersion area may be formed on the substrate P so as to cover the projection area of the projection optical system PL, and exposure light may be irradiated onto the substrate P through the liquid. As the liquid, water (pure water) may be used, or a material other than water, for example, a fluorinated fluid such as perfluorinated polyether (PFPE) or fluorinated oil, or cedar oil may be used. Good. As the liquid, a liquid having a higher refractive index with respect to exposure light than water, for example, a liquid with a refractive index of about 1.6 to 1.8 may be used.

  The substrate P in each of the above embodiments is not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Further, as the exposure apparatus EX, a reduced image of the first pattern is projected with the first pattern and the substrate P being substantially stationary (for example, a refraction type projection optical system that does not include a reflecting element at 1/8 reduction magnification). The present invention can also be applied to an exposure apparatus that performs batch exposure on the substrate P using the above. In this case, after that, with the second pattern and the substrate P substantially stationary, a reduced image of the second pattern is collectively exposed onto the substrate P by partially overlapping the first pattern using the projection optical system. It can also be applied to a stitch type batch exposure apparatus. Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in the pamphlet of International Publication No. 2001/035168, an exposure apparatus that exposes a line-and-space pattern on the substrate P by forming interference fringes on the substrate P, for example, JP-T-2004-2004 As disclosed in US Pat. No. 51,850 (corresponding US Pat. No. 6,611,316), a pattern of two masks is synthesized on a substrate via a projection optical system, and is scanned on the substrate by one scanning exposure. The present invention can also be applied to an exposure apparatus that double-exposes one shot area almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  The present invention also relates to a multi-stage type exposure apparatus having a plurality of substrate stages as disclosed in JP-A-10-163099, JP-A-10-214783, JP-T 2000-505958, and the like. It can also be applied to.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD) ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In the above-described embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in US Pat. No. 6,778,257, an electronic mask (also referred to as a variable shaping mask, for example, a non-uniform mask) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. A DMD (Digital Micro-mirror Device) that is a kind of light-emitting image display element (spatial light modulator) may be used.

  As described above, the exposure apparatus EX according to the present embodiment maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 18, a microdevice such as a semiconductor device includes a step 201 for designing the function and performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate which is a base material of the device. Manufacturing step 203, substrate processing step 204 including an exposure process for exposing the mask pattern onto the substrate by the exposure apparatus EX of the above-described embodiment, and a developing process for developing the exposed substrate, a device assembly step (dicing process, (Including a bonding process and a packaging process) 205, an inspection step 206, and the like.

  In the above-described embodiment, the pattern forming apparatus is described as an example of an exposure apparatus that forms a pattern on a substrate by irradiating exposure light onto the photosensitive substrate. The holding method and holding apparatus of the invention can be applied to various pattern forming apparatuses for forming a pattern on a substrate. As such a pattern forming apparatus, for example, an ink jet apparatus that forms a pattern on a substrate by ejecting ink droplets onto the substrate, or an original plate on which a concavo-convex pattern is formed and a substrate coated with an organic material are used. Examples include a nanoimprint apparatus that presses while heating to a temperature higher than the glass transition temperature of the substrate, then separates the original from the substrate and cools the substrate to transfer the pattern of the original onto the substrate. When a holding device that holds a substrate is provided in these apparatuses, the substrate can be held in a desired state by holding the substrate using the holding method and the holding device of the present invention.

It is a schematic block diagram which shows one Embodiment of exposure apparatus. It is side sectional drawing which shows a substrate stage. It is side sectional drawing which shows a substrate stage. It is the top view which looked at the holding member from the upper part. It is a figure for demonstrating one Embodiment of the holding method of a board | substrate. It is a figure for demonstrating one Embodiment of the holding method of a board | substrate. It is a figure for demonstrating one Embodiment of the holding method of a board | substrate. It is a figure for demonstrating the movement state of the board | substrate which concerns on this embodiment. It is a figure for demonstrating a comparative example. It is a figure for demonstrating the movement state of the board | substrate which concerns on a comparative example. It is a figure for demonstrating another embodiment of the holding method of a board | substrate. It is a figure for demonstrating another embodiment of the holding method of a board | substrate. It is a figure for demonstrating another embodiment of the holding method of a board | substrate. It is a perspective view which shows a mask stage. It is a perspective view which shows a mask stage. It is a figure for demonstrating another embodiment of the holding method of a board | substrate. It is a figure for demonstrating another embodiment of the holding method of a board | substrate. It is a flowchart figure which shows an example of the manufacturing process of a microdevice.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Holding member, 3 ... Control apparatus, 4 ... Support member, 5 ... Drive apparatus, 7 ... Memory | storage device, 8 ... Input device, 10 ... Holding surface, 14 ... Suction port, 50 ... Measuring member, H1 ... Mask conveyance apparatus , H2 ... substrate transport device, EL ... exposure light, EX ... exposure device, M ... mask, MST ... mask stage, P ... substrate, Pb ... bottom surface, PST ... substrate stage

Claims (19)

A holding method for holding a substrate with a holding member,
An operation of bringing the one surface and the holding surface into contact with each other by relatively moving the substrate and the holding member so that the one surface of the substrate and the holding surface of the holding member are brought close to each other;
A holding method of changing an acceleration in a relative movement direction between the substrate and the holding member in at least a predetermined section during the movement.   The holding method according to claim 1, wherein the acceleration is changed in order to adjust a shape of the substrate when the substrate is held by the holding member.   The holding method according to claim 1, wherein the predetermined section includes a time point at which the one surface and the holding surface are in contact with each other.   The holding method according to any one of claims 1 to 3, wherein a change in the acceleration is started immediately before the one surface and the holding surface come into contact with each other.   The holding method according to claim 1, wherein the substrate and the holding member are accelerated in a direction in which the substrate and the holding member approach in the predetermined section.   The holding method according to claim 5, wherein the substrate is moved with one surface of the substrate facing downward. The holding surface is provided with a suction port capable of sucking gas,
The holding method according to any one of claims 1 to 6, wherein a suction operation of the suction port is started at least immediately before a point in time when the one surface and the holding surface are in contact with each other. Supporting a predetermined region of one surface of the substrate with a predetermined support member;
The holding method according to claim 1, wherein the one surface and the holding surface are brought close to each other in a state where a predetermined region of the one surface of the substrate is supported by the support member. A pattern forming method including an operation of holding a substrate with a holding member,
The pattern forming method including the holding method according to claim 1, wherein the holding operation is performed.   The pattern forming method according to claim 9, wherein the substrate includes a substrate irradiated with exposure light. The substrate is at least one of a first substrate on which a pattern is formed and a photosensitive second substrate,
The pattern is formed on the second substrate by illuminating the first substrate with exposure light and exposing the second substrate with an image of the pattern of the first substrate illuminated with the exposure light. The pattern formation method as described. A holding device for holding a substrate,
A holding member having a holding surface that can contact one surface of the substrate;
A support member provided on the holding member and capable of supporting a predetermined region of one surface of the substrate;
In order to bring one surface of the substrate into contact with the holding surface of the holding member, the substrate is supported so that the one surface of the substrate supported by the support member and the holding surface of the holding member are brought close to each other. A driving device capable of relatively moving the support member and the holding member;
A holding device comprising: a control device that controls the driving device so as to change an acceleration in a relative movement direction between the substrate and the holding member in at least a predetermined section during movement by the driving device. A pattern forming apparatus comprising a holding device for holding a substrate,
A pattern forming apparatus in which the holding device according to claim 12 is used as the holding device. A pattern forming apparatus provided with a holding member for holding a substrate,
A driving device that relatively moves the substrate and the holding member so as to bring the one surface of the substrate and the holding surface of the holding member closer to each other and contacts the one surface with the holding surface;
A pattern forming apparatus comprising: a control device that controls the driving device so as to change an acceleration in a relative movement direction between the substrate and the holding member in at least a predetermined section during movement by the driving device. The holding member sequentially holds a plurality of different substrates,
A storage device storing optimum acceleration information corresponding to each of the plurality of substrates;
The pattern forming apparatus according to claim 13, wherein the control device sets the acceleration according to a substrate held by the holding member among the plurality of substrates based on stored information of the storage device. An input device capable of inputting information about a substrate held by the holding member among the plurality of substrates;
The pattern forming apparatus according to claim 15, wherein the control device sets the acceleration based on input information of the input device and storage information of the storage device.   The pattern forming apparatus according to claim 13, wherein the substrate includes a substrate irradiated with exposure light. The substrate is at least one of a first substrate on which a pattern is formed and a photosensitive second substrate,
18. A pattern is formed on the second substrate by illuminating the first substrate with exposure light and exposing the second substrate with an image of the pattern of the first substrate illuminated with the exposure light. The pattern forming apparatus as described.   The device manufacturing method using the pattern formation apparatus as described in any one of Claims 13-18.

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