KR20230049547A - Positioning apparatus, lithography apparatus and article manufacturing method - Google Patents

Abstract

The positioning device includes a substrate support portion that supports the substrate in a non-contact state by ejecting gas from the lower surface of the substrate to lift the substrate, and a substrate support portion that suctions the lower surface of the substrate supported in a non-contact state by the substrate support portion to support the substrate. A plurality of suction holding portions for regulating displacement of the substrate in a direction parallel to the surface, a support member for supporting the plurality of suction holding portions, and rotation of the support member about an axis intersecting the substrate surface, and a rotation mechanism for rotating the substrate through the plurality of suction holding portions without rotating the substrate support portion.

Description

POSITIONING APPARATUS, LITHOGRAPHY APPARATUS AND ARTICLE MANUFACTURING METHOD

The present invention relates to positioning devices, lithographic devices and methods of manufacturing articles.

In a lithography apparatus such as an exposure apparatus, it is required to control the position of a substrate with high precision and at high speed. In recent years, with the increase in size and thickness of substrates, deformations occurring in substrates cannot be ignored more than before. Deformation of the substrate occurs during substrate transport, and may remain even after the substrate is loaded on the substrate loading unit or after the substrate is adsorbed after loading. If the substrate is exposed to light while the substrate is deformed, the result of exposure may also be deformed, and overlapping accuracy may be lowered. Further, it is conceivable to add a sequence for reducing the strain generated in the substrate, but such a sequence also leads to an increase in tact time.

Patent Literature 1 discloses a technique (θ correction drive) in which a substrate is suction-supported and rotated while the substrate is lifted by air. Patent Literature 2 discloses a technique in which a spoke-shaped adsorption-holding unit driven in a direction normal to the substrate adsorbs and holds the substrate upward to the substrate loading unit and rotates the substrate.

Japanese Unexamined Patent Publication No. 2013-221961 Japanese Unexamined Patent Publication No. 2000-100895

However, in the prior art, the substrate is rotated by suction holding the substrate or a central portion of the substrate mounting portion. Therefore, the load applied to the suction holding portion is large, and a displacement may occur between the substrate and the suction holding portion.

The present invention provides a positioning device that is advantageous for reducing the shift between a substrate and a suction holding member, for example.

According to a first aspect of the present invention, a substrate support portion supporting the substrate in a non-contact state by ejecting gas from the lower surface of the substrate to lift the substrate, and a lower surface of the substrate supported in a non-contact state by the substrate support portion. a plurality of suction holding portions for sucking the substrate and regulating displacement of the substrate in a direction parallel to the substrate surface; a support member supporting the plurality of suction holding portions; A positioning device characterized by having a rotation mechanism for rotating the substrate through the plurality of suction holding portions without rotating the substrate support portion by rotating the substrate support portion.

According to a second aspect of the present invention, there is provided a lithographic apparatus comprising a positioning device according to the first aspect, and configured to transfer a pattern of an original to a substrate positioned by the positioning device. .

According to a third aspect of the present invention, a step of transferring a pattern to a substrate using the lithography apparatus according to the second aspect, and a step of processing the substrate onto which the pattern is transferred, and manufacturing an article from the processed substrate. There is provided a method for manufacturing an article characterized in that.

ADVANTAGE OF THE INVENTION According to this invention, it is possible to provide a positioning device that is advantageous in reducing the shift between the substrate and the suction holding portion.

1 is a diagram showing the configuration of an exposure apparatus.
2A is a plan view of a substrate stage.
2B is a diagram showing the configuration of a θ correction drive mechanism.
Fig. 3 is a diagram showing the configuration of a suction holding unit;
Fig. 4 is a flowchart showing a θ correction driving method;
Fig. 5 is a diagram showing a control state in θ correction driving;
Fig. 6 is a diagram showing a control state in θ correction driving;
Fig. 7 is a diagram showing a control state in θ correction driving;
Fig. 8 is a diagram showing a control state in θ correction driving;
Fig. 9 is a diagram showing a control state in θ correction driving;
Fig. 10 is a diagram showing the configuration of a θ correction drive mechanism.
Fig. 11 is a diagram showing a configuration including a plurality of θ correction drive mechanisms.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. In addition, the following embodiment does not limit the invention concerning the claim. Although a plurality of features are described in the embodiment, not all of these features are essential to the invention, and a plurality of features may be combined arbitrarily. In addition, in the accompanying drawings, the same reference numerals are attached to the same or similar structures, and overlapping descriptions are omitted.

1 is a schematic diagram of an exposure apparatus 1 according to an embodiment. In this specification and drawings, directions are shown in an XYZ coordinate system in which the horizontal plane is the XY plane. In general, a substrate W, which is a substrate to be exposed, is placed on the substrate stage 5 so that its surface is parallel to a horizontal plane (XY plane). Therefore, below, directions orthogonal to each other in a plane along the surface of the substrate W are referred to as the X-axis and the Y-axis, and the direction perpendicular to the X-axis and the Y-axis is referred to as the Z-axis. In the following, directions parallel to the X axis, Y axis, and Z axis in the XYZ coordinate system are referred to as the X direction, Y direction, and Z direction, respectively, and the rotation direction around the X axis, the rotation direction around the Y axis, and the Z The directions of rotation around the axis are referred to as the θx direction, the θy direction, and the θz direction, respectively.

<First Embodiment>

In the embodiment, an example in which the substrate positioning device is used in a lithography device (exposure device, imprint device, etc.) that transfers a pattern of an original plate to a substrate will be described. An imprint apparatus forms a pattern on a substrate by curing the imprint material in a state where a mold (original plate) is brought into contact with the imprint material supplied on the substrate. The exposure apparatus forms a latent image corresponding to the pattern of the original plate on the photoresist by exposing the photoresist supplied on the substrate through an original plate (reticle) serving as an exposure mask. The substrate processed by these devices may be, for example, a silicon wafer, but may be a glass substrate, a copper substrate, a resin substrate, a SiC substrate, a sapphire substrate, or the like other than that. In the following, an example in which a lithographic apparatus is configured as an exposure apparatus will be described in order to provide a specific example.

(Configuration of Exposure Device)

1 schematically shows the configuration of exposure apparatus 1 to which the positioning apparatus of the present invention is applied. Exposure apparatus 1 is a pattern formed on a mask on a photosensitive substrate (for example, a glass plate having a photoresist layer formed thereon) through a projection optical system in a lithography process, which is a manufacturing process of semiconductor devices, liquid crystal display devices, and the like. It is a device that transfers The exposure apparatus 1 includes a light source unit L, an illumination optical system 2, a mask stage 3 supporting a mask M (original plate), a projection optical system 4, and a substrate stage supporting a substrate W. (5), a detector 19, and a control unit 6 may be provided. The control unit 6 is electrically connected to the light source unit L, the mask stage 3, the substrate stage 5, and the detector 19, and controls them. The controller 6 may be configured by, for example, a PLD such as an FPGA, an ASIC, a general-purpose computer with a built-in program, or a combination of all or part thereof. For example, the controller 6 may include a processor 6 and a memory 62 that stores programs and data.

The illumination optical system 2 uses light from the light source unit L to illuminate the mask M on which the transfer circuit pattern is formed. The illumination optical system 2 may have a function of uniformly illuminating the mask M or a modified illumination function. The light source unit L uses, for example, a laser. As the laser, an ArF excimer laser with a wavelength of about 193 nm, a KrF excimer laser with a wavelength of about 248 nm, or the like can be used, but the type of light source is not limited to the excimer laser. For example, an F2 laser with a wavelength of about 157 nm or extreme ultraviolet (EUV) light with a wavelength of 20 nm or less may be used.

The mask M is made of, for example, quartz, on which a circuit pattern to be transferred is formed, and supported and driven by the mask stage 3 . Diffracted light emitted from the mask M is projected onto the substrate W through the projection optical system 4 . The mask M and the substrate W are arranged so as to have an optically conjugated relationship. The pattern of the mask M is transferred onto the substrate W by scanning the mask M and the substrate W at a speed ratio equal to the reduction magnification ratio.

The mask stage 3 supports the mask M via a mask chuck (not shown) and is connected to a moving mechanism (not shown). The movement mechanism is composed of a linear motor or the like, and has a plurality of degrees of freedom (eg, 3 axes of X, Y, θz, preferably 6 axes of X, Y, Z, θx, θy, θz), The mask M can be moved by driving the mask stage 3 .

The projection optical system 4 has a function of forming an image of a light flux from an object surface onto an image surface, and forms an image of diffracted light passing through a pattern formed on a mask M onto a substrate W. The projection optical system 4 includes an optical system including a plurality of lens elements, an optical system including a plurality of lens barriers and at least one concave mirror (catadiotric optical system), a plurality of lens elements and at least one kinoform, and the like. An optical system having a diffractive optical element of , and the like may be used.

The substrate stage 5 has a plurality of degrees of freedom (for example, three axes of X, Y, and θz, preferably six axes of X, Y, Z, θx, θy, and θz), and the substrate W move the In the present embodiment, the substrate stage 5 includes a drive mechanism 13 for moving the substrate W in a direction parallel to the substrate surface (XY direction), and an axis of the substrate W intersecting the substrate surface ( For example, a θ correction drive mechanism 14 (rotation mechanism) that performs rotation (θ correction drive) around the Z axis is provided. The substrate stage 5 is driven by θ correction drive mechanism 14 while moving the substrate W in the XY direction to the exposure start position by drive mechanism 13 after loading the substrate W from the receiving position to the substrate loading unit. can do

The detector 19 detects the X, Y, and θ positions of the substrate W. In one example, the detector 19 may include a light irradiation unit for irradiating light to the side surface of the substrate (W) and a detection unit for detecting light reflected from the side surface of the substrate (W). As shown in FIG. 2A, a plurality of detectors 19 may be arranged. The controller 6 obtains the positions of X, Y, and θ of the substrate W based on the detection result of each detector 19 .

First, a conventional θ correction driving method will be described. Conventionally, θ correction driving is performed by rotating a substrate mounting portion holding a substrate in the θz direction. During the θ correction drive, the substrate loading unit is brought into a state in which frictional resistance is reduced or non-contacted by ejection of compressed gas from an air pad configured on an upper surface of a holding unit supporting the substrate mounting unit from below. After the θ correction drive, the air pad is switched to suction so that the substrate loading portion is restrained by the holding portion. A series of operations from the above θ correction drive to the restraint of the substrate mounting unit are performed in parallel with the XY drive of the substrate stage.

However, when the substrate stage is driven XY in a state where the restraining force (frictional force between the air pads) by the air pads does not reach the inertial force generated in XY driving, the inertial force causes the substrate mounting portion to shift. As a result, alignment accuracy of the substrate may deteriorate and exposure performance may deteriorate. Therefore, after the substrate stage moves to the exposure start position, it takes time to wait for complete restraint by the air pad, which hinders shortening of the tact time.

Since displacement of the substrate mounting portion is the cause of this problem, a countermeasure is conceived of rotating the substrate while the substrate mounting portion is fixed by the holding portion. As a technique for correcting θ of a substrate on a substrate stage, there is a method in which the substrate is adsorbed, held, and rotated on the upper side of the substrate loading unit. However, in the conventional substrate θ correction mechanism, since the substrate is sucked at one central location, the load applied to the suction holding portion is large, and there is a risk of displacement between the substrate and the suction holding portion.

In addition, since the conventional suction holding unit is a mechanism that simply moves up and down, when the substrate mounting unit adsorbs the substrate after the θ correction drive, the substrate is deformed by the height at which the suction holding unit protrudes from the substrate mounting unit. . In order not to leave deformation on the substrate, a sequence is required in which the substrate mounting unit adsorbs the substrate, the suction holding unit drives the substrate mounting unit downward, and then the compressed gas is ejected to the entire lower surface of the substrate. However, since the substrate is not constrained during the sequence of blowing compressed gas, the substrate flows (moves in the horizontal direction) when the substrate stage is driven horizontally.

Then, in this embodiment, XY drive of a substrate stage and θ correction|amendment drive of a board|substrate are implemented in parallel using the mechanism as shown below, and shortening of tact time is enabled.

(Configuration of θ correction drive mechanism)

2A is a plan view of the substrate stage 5 (view from above in the Z direction). FIG. 2B is a cross-sectional view along the line A-A shown in FIG. 2A (a cross-sectional view viewed from the X direction), and shows the configuration of the θ correction drive mechanism 14. As shown in FIG. The substrate stage 5 has a substrate support portion 7 that supports the substrate W. The substrate support portion 7 may be called a substrate mounting portion or a substrate chuck. The substrate support unit 7 can support the substrate W in a non-contact state by ejecting gas from the lower surface of the substrate W to lift the substrate W. The substrate support portion 7 can also suck gas under the substrate W to support the substrate W in a contact state. The control unit 6 can switch between non-contact support and contact support of the substrate W by the substrate support unit 7 .

A plurality of holes 28 penetrating the upper and lower surfaces of the substrate support portion 7 are formed. A plurality of holes 28 communicate with the passage 33 in succession. The passage 33 is connected to the first pressure regulator 29 .

As shown in FIG. 2A , the θ correction driving mechanism 14 is disposed under the substrate support 7 . The θ correction drive mechanism 14 may include a plurality of suction holding portions 24 . The plurality of suction holding portions 24 suck the lower surface of the substrate W supported by the substrate support portion 7 in a non-contact state, in a direction parallel to the substrate surface (first direction) (typically in the XY direction) It regulates the displacement of the substrate W to the . The plurality of suction holding portions 24 are supported by a supporting member 23 . As will be described later, the support member 23 is rotatably supported around an axis intersecting the substrate surface by a rotating portion 25 . In the example of FIG. 2A and FIG. 2B, the four suction holding parts 24 are arrange|positioned at the position spaced apart from the rotation center of the support member 23. As shown in FIG. The position spaced apart from the center of rotation may be determined according to the size of the gap provided in the center of the substrate support part 7, the driving amount required for θ correction of the substrate, and the like. In addition, the number of suction holding portions 24 is the coefficient of friction between the pad 24g (FIG. 3) and the substrate W and the vacuum source relative to the inertial force at the time of XYθ driving of the substrate stage 17 of the substrate W. (30) can be determined by the applied pressure. In the example of FIG. 2A , the supporting member 23 may be a long member that passes through the center of the substrate supporting portion 7 and extends in the Y direction in a plan view of the substrate supporting portion 7 from above.

3, an example of the structure of the suction holding|maintenance part 24 is shown. The suction holding portion 24 includes a shaft 24d extending in the Z direction, and a pad 24g which is a contact member provided at an upper end of the shaft 24d and brought into contact with the lower surface of the substrate W. The shaft 24d is a hollow member formed with an air flow path for vacuuming the substrate W via the pad 24g, and is also a member for vertically moving the pad 24g. The shaft 24d is free to move in the Z direction while being guided by a guide portion 24e formed in the holder 24f. The shaft 24d (that is, the pad 24g) is driven in the +Z direction by the actuator 24a. The actuator 24a may be composed of an air cylinder, a linear motor, a servo motor, or the like. Even if the pad 24g is driven by the actuator 24a to a position where it can contact the substrate W and the actuator 24a is returned to the standby position after the pad 24g is adsorbed to the substrate W, the guide 24e Due to the action of the pad 24g can be continuously adsorbed to the substrate (W). At this time, since there is no pressing force from the suction holding portion 24 to the substrate W, it is possible to load and adsorb the substrate W to the substrate support portion 7 from the θ correction drive in a state in which the smoothness is high. can As a result, the pad 24g can be displaced following the displacement of the substrate W in the direction (second direction) crossing the substrate surface (typically the Z direction).

The center of the support member 23 that supports the plurality of suction holding portions 24 is connected to the fixing member 18 arranged below the support member 23 via the rotating portion 25 . By means of the rotating part 25, the supporting member 23 is rotatable in the θz direction with respect to the fixing member 18. Further, the end of the fixing member 18 and the end of the supporting member 23 are connected via the θ drive source 15. When the θ driving source 15 drives the supporting member 23 in the driving direction 21 , the supporting member 23 can rotate in the θz direction with the rotating part 25 as the rotation center. That is, the θ correction drive is performed by rotating the support member 23 with respect to the fixing member 18 by the θ drive source 15 . Therefore, it may be understood that the rotation unit 25 constitutes the rotation support unit, and the rotation unit is constituted by the rotation support unit and the θ drive source 15 .

In addition, a plurality of air pads 22 are disposed on the upper surface of the fixing member 18, and a plurality of pads 27 are disposed on the lower surface of the support member 23 so as to face the plurality of air pads 22. . The plurality of air pads 22 are configured to eject gas against the lower surface (pad 27 ) of the support member 23 . In addition, the plurality of air pads 22 are configured to suck gas under the support member 23 so that the air pad 22 and the pad 27 are adsorbed. Gas injection or suction by the air pad 22 can be switched by the control unit 6 . The θ correction drive is performed in a state where compressed gas is ejected from the air pad 22 and the support member 23 and the air pad 22 are not in contact or in a state where the frictional resistance is reduced. Since the member of the θ correction drive mechanism 14 configured upwardly from the fixed member 18 is moved in the Z direction by the ejection and adsorption operation of the compressed gas of the air pad 22, the rotating part 25 is driven by a leaf spring. etc., it may be configured to be able to expand and contract in the Z direction along such movement in the Z direction. Thereby, deformation of the support member 23 is prevented.

The pad 24g of the suction holding portion 24 is connected via a shaft 24d to a vacuum source 30 such as a vacuum pump so that gas flow is possible. When the suction holding portion 24 supports the substrate W, gas is sucked (evacuated) by the vacuum source 30, so that the pad 24g can be adsorbed to the lower surface of the substrate W. The upper part (contact portion) of the pad 24g is preferably made of a material (for example, resin) that conforms to the substrate W when in contact with the substrate W.

The first pressure regulator 29 is configured to supply compressed gas to the hole 28 (ejection), release the hole 28 to the atmosphere by connecting the hole 28 and the atmospheric space (outside), and release the hole 28 from the air. Which of the suction of the gas is performed. These operations can be performed by the controller 6 switching an unillustrated solenoid valve. The first pressure regulator 29 sucks in gas to exhaust the space between the substrate W and the substrate support 7 and adsorbs the substrate W. The flatness of the surface of the substrate W can be adjusted by changing the strength of gas suction at this time.

The second pressure adjusting unit 31 supplies compressed gas to the air pad 22 (ejection), releases the air pad 22 to the atmosphere by connecting the air pad 22 to the atmospheric space (external), and air pad Either suction of gas from (22) is performed. These operations can be performed by the controller 6 switching an unillustrated solenoid valve.

(Regarding the θ compensation drive method of the board)

The θ correction drive method of the substrate W by the θ correction drive mechanism 14 will be described. [theta] correction drive is performed by the control part 6 executing the program which follows the flowchart shown in FIG. 5 to 9 are diagrams each showing a holding process of the substrate W. In FIGS. 5 to 9, the same reference numerals are given to the same members as those in FIGS. 1, 2A and 2B, and detailed explanations are omitted.

At the start of the program, the substrate stage 5 is stopped at the substrate receiving position. Regarding the θ correction drive mechanism 14, the pad 24g is positioned below the upper surface of the substrate support 7, and the pad 24g is not adsorbed to the substrate W (S101). Compressed gas is ejected in the +Z direction through the hole 28 (S102). In addition, the air pad 22 ejects compressed gas, and is in a non-contact state or a state in which frictional resistance is reduced.

In S103, the actuator 24a of the suction holding portion 24 pushes the holder 24f up in the +Z direction, so that the pad 24g moves upward from the substrate support portion 7. At this time, the position of the tip or edge of the pad 24g is the height at which the dynamic pressure of the compressed gas ejected from the hole 28 toward the substrate W acts, and the weight of the substrate W is It is a position that can be received from the compressed gas and suction holding portion 24.

In step S104, suction of the substrate W to the pad 24g is started by the vacuum source 30 after or immediately before the substrate W is placed on the pad 24g. Accordingly, displacement of the substrate W in the horizontal direction is restricted. 5 shows an aspect at the end of step S104.

In S105, the substrate stage 5 starts XY driving. Parallel to that, in S106, the detector 19 detects the positions of X, Y, and θ of the substrate W. Further, in S107, the actuator 24a is driven in the -Z direction with the pad 24g adhering to the substrate W and moved to the standby position. At this time, only the compressed gas from the hole 28 applies force to the substrate W in the +Z direction, and since the substrate W is adsorbed by the pad 24g, the displacement in the horizontal direction is It doesn't happen. In addition, the substrate W receives its own weight from the pad 24g and the shaft 24d. When the actuator 24a moves to the standby position, deformation of the substrate W generated by receiving force from the suction holding portion 24 can be reduced. Since the pad 24g is made of a material that follows the substrate W, the upper portion of the pad 24g slightly expands and contracts, so that the substrate W can follow even if it moves slightly in the Z direction. Fig. 6 is a diagram showing the state at the end of step S107.

In S108, the θ correction drive of the substrate W is performed based on the detection result by the detector 19. As described above, the θ correction drive is performed by rotating the θ drive source 15 in the drive direction 21 to rotate about the rotating portion 25 . During the ? In this embodiment, as a countermeasure against the factor that the θ correction accuracy by this shift|offset|difference falls, the suction holding|maintenance part 24 can be arrange|positioned at the position away from the center of rotation as much as possible. Thereby, the load applied to the rotating part 25 is reduced. In addition, by arranging the suction holding portion 24 at a position away from the center of rotation, the resolution of the θ correction drive is higher than that near the center of rotation, and the effect of the displacement caused by the deformation of the pad 24g on the θ correction accuracy is reduced by a small or It can be done at a negligible level.

In S109, the first pressure regulator 29 is opened to the atmosphere through the hole 28. As a result, the air supplied to the substrate support portion 7 of the substrate W is discharged to the atmosphere almost uniformly through the hole 28 . Thereby, the substrate W is placed on the substrate support 7 in a state of high smoothness. When the substrate W is placed on the substrate support 7, the substrate W is lowered in the -Z-axis direction by the height at which it was lifted by the compressed gas. At this time, the pad 24g adsorbed to the substrate W descends while being guided by the guide 24e as the substrate W descends. Fig. 7 shows the state at the end of step S109.

Next, in S110, the first pressure regulator 29 starts vacuuming through the hole 28, and adsorption of the substrate W starts. In S110, the vacuum source 30 stops adsorption of the substrate W to the pad 24g. That is, the exhaust operation is stopped.

In S111, by stopping the exhaust operation in S110, the pad 24g is lowered to the stand-by position while being guided by the guide 24e until it becomes the same height as the holder 24f with the weight of the pad 24g and the shaft 24d. do. 8 shows the state at the end of step S111.

In step S112, the pad 22 is adsorbed to the fixing member 18 by the second pressure regulator 31. 9 shows the state at the end of step S112.

In this way, after the rotation of the support member 23 is finished in S108, the substrate support 7 switches to support the substrate in a contact state in S110, and the air pad 22 switches to support the substrate in a contact state in S112 ( 23) switch to support.

As a result of the above, the θ correction drive of the substrate W is completed. In S113, the substrate W is moved to the exposure start position by the substrate stage 5.

In this way, a plurality of suction holding portions 24 are disposed at positions away from the rotation center, and θ correction drive is performed in a state where all the suction holding portions 24 are supported by one support member. This makes it possible to realize θ correction drive with high accuracy even under the condition where the inertial force generated by the XY drive of the substrate stage 17 acts. Further, the above-described operation can be performed without leaving deformation on the substrate.

<Second Embodiment>

10 shows the configuration of the θ correction drive mechanism 14 in the second embodiment. In the θ correction drive mechanism 14 of the second embodiment, each of the plurality of suction holding portions 24 is not provided with an actuator 24a. Instead, an actuator 32 is disposed on the fixing member 23 such that a force acts on the supporting member 23 . The actuator 32 moves each of the plurality of suction holding portions 24 up and down by driving the support member 23 in the Z direction.

<Third Embodiment>

In some cases, the exposure apparatus 1 simultaneously handles a plurality of substrates. In that case, the substrate stage 5 may include a plurality of θ correction drive mechanisms 14 corresponding to each substrate, as shown in FIG. 11 .

<Fourth Embodiment>

In FIG. 2A , the support member 23 is shown as a long member that passes through the center of the substrate support 7 and extends in the Y direction in a plan view of the substrate support 7 from above. However, the direction in which the support member 23 extends is not limited to the Y direction. The direction in which the support member 23 extends may be set according to the exposure layout or shape of the substrate W, for example.

Further, the support member 23 is not limited to a long rectangular shape. The supporting member 23 may have, for example, a radial shape, a lattice shape, or a circular shape.

<Other embodiments>

The actuator 24a in the first embodiment or the actuator 32 in the second embodiment may be omitted. For example, the initial position of the pad 24g is placed as close as possible to the upper surface of the substrate support 7, and the pad 24g is raised by the vacuum pressure of the vacuum source 30 to be adsorbed to the substrate W. A configuration similar to that may be employed.

<Embodiment of method for manufacturing an article>

The article manufacturing method in the embodiment of the present invention is suitable for manufacturing articles such as microdevices such as semiconductor devices and elements having a fine structure, for example. The article manufacturing method of the present embodiment includes a step of transferring a pattern of an original plate to a substrate using the above-mentioned lithography device (exposure device, imprint device, drawing device, etc.), and a step of processing the substrate on which the pattern is transferred in this step. includes In addition, this manufacturing method includes other well-known processes (oxidation, film formation, vapor deposition, doping, planarization, etching, resist removal, dicing, bonding, packaging, etc.). Compared with conventional methods, the method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article.

The invention is not limited to the above embodiments, and various changes and modifications are possible without departing from the spirit and scope of the invention. Accordingly, the claims are appended to disclose the scope of the invention.

7: substrate support
14: θ correction drive mechanism
23: support member
24: suction holding support
25: rotating part

Claims (12)

a substrate support portion for supporting the substrate in a non-contact state by ejecting gas from the lower surface of the substrate to lift the substrate;
a plurality of suction holding portions for sucking a lower surface of the substrate supported by the substrate support portion in a non-contact state and regulating displacement of the substrate in a first direction parallel to the substrate surface;
a support member for supporting the plurality of suction holding portions;
A rotating portion for rotating the substrate through the plurality of suction holding portions without rotating the substrate supporting portion by rotating the supporting member about an axis intersecting the substrate surface.
A positioning device characterized in that it has. The positioning device according to claim 1, wherein the plurality of suction holding portions are disposed at a plurality of positions spaced apart from a rotation center of the support member. 3. The positioning device according to claim 2, wherein the support member is a long member passing through a center of the substrate support portion and extending in the first direction when viewed from above in a plane view of the substrate support portion. The method of claim 1, wherein each of the plurality of suction holding portions has a contact member that contacts the lower surface of the substrate by suction of gas, and the contact member moves the substrate in a second direction intersecting the substrate surface. A positioning device characterized in that it is configured to displace by following the displacement of. 5. The positioning device according to claim 4, wherein each of the plurality of suction holding portions has an actuator for bringing the contact member into contact with the lower surface of the substrate. 5. The positioning device according to claim 4, further comprising an actuator for driving the support member so as to bring the contact member into contact with the lower surface of the substrate. The method of claim 1, further comprising a drive mechanism for moving the substrate in the first direction,
In parallel with the movement of the substrate by the driving mechanism, rotating the support member
Positioning device, characterized in that. The method of claim 7, further comprising a fixing member disposed below the support member,
The rotating part is arranged to be fixed on the fixing member to rotate the support member,
further comprising an air pad disposed on the fixing member and ejecting gas to a lower surface of the support member;
The air pad ejects gas to rotate the support member in a non-contact state or reduced frictional resistance between the support member and the air pad.
Positioning device, characterized in that. 9. The method of claim 8, wherein the substrate support is further configured to suck gas under the substrate to support the substrate in a contact state,
The air pad is further configured to suck gas under the support member to support the support member in a contact state;
After completion of the rotation of the support member, the substrate support portion switches to support of the substrate in the contact state, and the air pad switches to support of the support member in the contact state.
Positioning device, characterized in that. Equipped with the positioning device according to any one of claims 1 to 9,
A lithographic apparatus, characterized in that it is configured to transfer the pattern of the original to the substrate positioned by said positioning device. A lithographic apparatus according to claim 10, characterized in that it is configured as an exposure device or an imprint device. a step of transferring a pattern to a substrate using the lithography apparatus according to claim 10;
A process of processing the substrate on which the pattern is transferred
and manufacturing an article from the processed substrate.

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