TW201620089A - Chip package member of IC card, panel package board for forming the same, and forming method thereof - Google Patents

Abstract

The present invention provides a chip package member of IC card, a panel package board for forming the same, and a forming method thereof, wherein a panel carrier board layer is applied to manufacture plural chip modules arranged at intervals, and each chip module comprises a chip circuit layer pattern formed on a first surface of the panel carrier board layer and a die mounted on the opposite side of second surface and connected correspondingly to the chip circuit layer pattern. Then, at least a plastic package layer is formed on the second surface of the panel carrier board layer and integrated with the panel carrier board layer, so as to manufacture the panel package board for forming. Afterwards, a singularizing cutting process is performed to produce plural chip package members, so that the chip module of an IC card forms a panel chip substrate to be easily embedded and placed in an open slot of the IC card body thereby forming an IC card. As a result, the manufacturing end can mass-produce the chip package member and the IC card body with separated manufacture processes, respectively, and then easily assemble them together, so as to not only prevent the limitation of the proprietary machine table required in the prior manufacture process, but also reduce the material cost of carrier board layer, thereby meeting the demanding of mass production and increasing the economic benefits of smart card manufacture process.

Description

Chip package for wafer card and sheet package board therefor and molding method thereof

The present invention relates to a chip package for a wafer card and a sheet package board and a molding method therefor, and more particularly to a chip module used for a wafer card as a one-piece chip package to serve as a wafer substrate. It is easily embedded in an open slot provided on a wafer card body to form a wafer card, thereby improving the economic efficiency of the wafer card manufacturing process.

Generally speaking, a wafer card refers to a card embedded with a chip module, such as a smart card (SIM card), a financial card or a credit card. The smart card refers to a Subscriber Identity Module (SIM). The smart card used to store the user identification data of the mobile phone service is generally referred to as a SIM card. Currently, the SIM card can be divided into a Mini (mini) SIM card, a Micro (micro) SIM card, and a Nano (Nai) SIM card, which are respectively set. It has a predetermined size. For example, the Mini SIM card is a rectangular small card body of 15mm x 25mm, the Micro SIM card is a rectangular small card body of 15mm x 12mm, and the Nano SIM card is a rectangular small card of 8.8mm x 12.3mm. The rectangular card body does not have a complete rectangular shape, and if it has a chamfered corner, it is not a matter of the present invention and does not affect the technology of the present invention, and therefore will not be described herein. In the case of the conventional SIM card structure, it utilizes a rectangular plastic small card body having the above-mentioned predetermined size, such as a 15 mm x 25 mm (Mini SIM card), 15 mm x 12 mm (Micro SIM card) or 8.8 mm x 12.3 mm ( Nano SIM card), and a concave recessed groove is preset on the rectangular small card body for embedding a chip module conforming to the function of the SIM card According to the related technology of the current SIM card, whether it is a Mini SIM card, a Micro SIM card or a Nano SIM card, the size of the chip modules embedded thereon can be designed to be the same or about the same, which is advantageous for the SIM. The process of manufacturing the card chip module or wafer card is not intended to limit the invention.

The chip card described below is illustrated by a smart card (SIM card), but not used. To limit the invention. Referring to Figures 1 and 2, respectively, it is a schematic perspective view of a combination and decomposition of a chip module and a card body of a SIM card in a card-card. The one-card one-core card 100 includes a smart card (wafer card) 200 and a card body 300 for carrying. The card body 300 is generally a rectangular plastic chip card of 85.6 mm x 53.98 mm. Since the chip card, such as a financial card or a credit card, has been a large number of articles manufactured and used for a long time, the card body 300 has become a wafer card related industry. The standardized film card, in other words, the mechanical equipment for making the 85.6mm x 53.98mm rectangular card body and its manufacturing process or related technology, are currently quite mature and mature, which is beneficial to the mass production and use in the industry, so The card body 300 is also extended by the related art to manufacture and/or store a SIM card having a smaller size. As shown in FIG. 1 and FIG. 2, the smart card 200 can select a currently existing SIM card type such as Mini SIM according to the needs of use. The size of the card is 15mm x 25mm, the size of the Micro SIM card is 15mm x 12mm or the size of the Nano SIM card is 8.8mm x 12.3mm. Figure 1 and 2 show the Mini SIM card as an example. The description is not limited. Since the manufacturing end is only provided with a single smart card 200 on the card body 300 for manufacturing, it is called a card and a core, but can also be made into a card with multiple cores without limitation (refer to Figure 12-16 shows ).

The conventional smart card 200 includes a card body 201 and a smart card chip module 202. As shown in FIG. 2, the chip module 202 further includes a carrier plate, which is embedded and adhered to a predetermined slot (blind slot) 203 on a chip card body (200) disposed on the card body 201. A layer 204, a wafer circuit layer pattern 205 is disposed on the first side of the carrier layer 204 (as shown above) and a die 206 is assembled The opposite second side of the carrier layer 204 (the bottom surface as shown) can be correspondingly connected to the wafer circuit layer pattern 205.

In the current process technology of smart card (SIM card), here are shown in Figures 1 and 2. Taking a card as a core card as an example, the manufacturing end of the chip module 202 generally uses a continuous strip of flexible circuit board (FPC) as a carrier board (not shown), which is generally referred to as Roll to Roll FPC. Or a Reel to Reel FPC (reel mode) production method, and the long strip FPC is sequentially formed along its length direction (ie, the feeding direction) with a series of wafer modules (202) (including a wafer) continuously arranged at a predetermined pitch. a circuit layer pattern 205 and a die 206); and then, in conjunction with the manufacturing end of the card body 300 for carrying, a known dedicated machine device is used to perform the subsequent process of the smart card, including: taking out the long FPC The singulated card chip module (202) is assembled on the mating card body 300 one by one as shown in FIG. 2 to form the card-core card 100.

In the process of the conventional card-one card 100, it is required on each card body 300. The split line 207 of the smart card 200 is punched out for the user to conveniently remove the smart card 200 from the card-core card 100, and the router tool (router) is used on the surface of the card layer 201 of the smart card 200. The embedded slot 203 is configured to allow the smart card chip module 202 to be embedded therein, and the recessed groove 203 is further configured to form a central chamber 208 for accommodating the crystal on the bottom surface of the wafer module 202. The granules 206 and a stepped groove 209 can be adhered to the periphery of the bottom surface of the wafer module 202 by adhesive. In addition, the above processes are currently carried out by using special designed special machine equipment. Production.

As can be seen from the above, the conventional one card one core card 100 (or one card multi-core) process technology The process is limited by the special machine equipment, so that the manufacturing process of the wafer module 202 and the manufacturing end of the card body 300 is also limited. For example, in the conventional process, the wafer module 202 is fabricated to include each wafer circuit layer pattern 205. The forming operation and the installation work of each die 206 are performed to subsequent process operations such as The wafer module 202 is assembled on the card body 300, which is manufactured by Roll to Roll FPC or Reel to Reel FPC (reel method), because it is sequentially arranged on a long flexible circuit board (FPC). Therefore, the structure of the machine is not only cumbersome, but also the process is relatively slow, it is difficult to achieve mass production benefits, and the use of a flexible circuit board (FPC) as a carrier plate also increases the process and material costs, and even causes the wafer die. The manufacturing control between the manufacturing end of the group 202 and the manufacturing end of the card body 300 is troubled; in addition, the surface of the card layer 201 of the smart card 200 is required to be grounded by the router for the chip module 202 to be embedded. The special inlay 203 inside increases the difficulty and cost of the planing process. Therefore, the conventional process technology can not only achieve the mass production demand, but also the manufacturing cost is relatively improved, which does not meet the economic benefits of the production smart card.

It can be seen from the above that how to develop a process for the process of wafer card (smart card) The wafer card manufacturing process which meets the demand for mass production and enhances economic benefits is an object to be solved by the present invention, and the present invention is directed to the above-mentioned problem to be solved, and proposes a technical solution having novelty and progress.

The main object of the present invention is to provide a chip package for a wafer card and a sheet package board and a molding method thereof, which are formed by using a panel carrier layer to form a plurality of wafer modules arranged at intervals. Each of the wafer modules includes a chip circuit layer pattern formed on a first surface of the chip carrier layer and a die assembled on the opposite second surface and capable of correspondingly communicating the wafer circuit layer pattern, and then the sheet Forming at least one plastic encapsulation layer on the second side of the carrier layer and integrating the same, thereby forming the sheet-like package board for molding; and performing singulation cutting to form a plurality of chip packages for wafer card use Therefore, the chip package can be a wafer substrate and can be easily embedded in an open slot of a wafer card body to form a wafer card; The open process separately mass-produces the chip package and the wafer card body (or the card body for bearing) and combines them in a simple manner, which not only avoids the limitation of the special machine necessary for the conventional process technology, but also can Reducing the material cost of the carrier layer can meet the mass production requirements and improve the economic benefits of the wafer card process.

In an embodiment of the invention, the at least one plastic encapsulation layer utilizes lamination A method of lamination or injection molding is formed on the second side of the sheet-like carrier layer and integrated into one.

In an embodiment of the invention, the chip package is formed into a chip package The board comprises: a sheet-shaped carrier layer, wherein a plurality of spaced-apart wafer modules are disposed, wherein each of the wafer modules further comprises a chip circuit layer pattern formed on the first surface of the sheet-shaped carrier layer and The die is assembled at a corresponding position on the second surface of the first surface to correspondingly conduct the wafer circuit layer pattern; and at least one plastic encapsulation layer is formed on the second surface of the sheet-like carrier layer and combined Integrating and maintaining the connection and function of the die and the corresponding chip circuit layer pattern in each chip module.

In an embodiment of the invention, the chip package comprises: a chip module The method further includes forming a chip circuit layer pattern formed on the first surface of the one-layer carrier layer and a die is assembled on the second surface opposite to the first surface and located at a position corresponding to the pattern of the circuit layer of the wafer to The corresponding chip circuit layer pattern is turned on; and at least one plastic encapsulation layer is formed on the second surface of the chip-shaped carrier layer and integrated, and the die and the corresponding chip are held in each chip module. Communication and function between wafer circuit layer patterns.

In an embodiment of the invention, the chip module comprises a mini SIM card (Mini SIM card), micro SIM card (Micro SIM card) or Nai SIM card (Nano SIM card) Wafer module.

In an embodiment of the invention, the chip package comprises a chip package for use in accordance with a Mini SIM card, a Micro SIM card, and a Nano SIM card.

10‧‧‧Sheet carrier layer

10a‧‧‧Sheet packaging board

11‧‧‧ first side

12‧‧‧ second side

20‧‧‧ wafer module

21‧‧‧ Wafer circuit layer pattern

22‧‧‧ Grain

30‧‧‧Plastic encapsulation layer

31‧‧‧ double-sided adhesive layer

311‧‧‧ chamber

32‧‧‧First plastic layer

321‧‧‧ chamber

33‧‧‧Second plastic layer

40‧‧‧ wafer card chip package

50‧‧‧Injection molding die

51‧‧‧Upper mold

52‧‧‧ Lower mold

53‧‧‧ cavity

54‧‧‧Injection

60‧‧‧ card body

60a‧‧‧ card body

60b‧‧‧ card body

60c‧‧‧ card body

60d‧‧‧ card body

60e‧‧‧ card body

61‧‧‧break line

70‧‧‧Mini SIM card

71‧‧‧First open slot

72‧‧‧Fracture line

80‧‧‧Micro SIM card

81‧‧‧Second open slot

82‧‧‧Fracture line

90‧‧‧Nai SIM

(previous technology)

100‧‧‧One card one core card

200‧‧‧Smart Card

201‧‧‧ card body

202‧‧‧Smart Card Chip Module

203‧‧‧ slotted

204‧‧‧Package layer

205‧‧‧ wafer circuit layer pattern

206‧‧‧ grain

207‧‧‧break line

208‧‧‧Central Chamber

209‧‧‧step trough

300‧‧‧ card body

Figure 1-2 is a schematic view showing the combination and decomposition of the chip module and the card body in a conventional card-one core card.

3 is a plan view showing an embodiment of a first surface of a wafer carrier layer of the present invention having a plurality of spaced apart wafer modules (having a plurality of wafer circuit layer patterns).

Figure 4 is a plan view showing the second side of the sheet-like carrier layer of Figure 3 (with a plurality of crystal grains).

5-7 are schematic diagrams showing the steps of a method for molding a chip package for forming a chip package of a wafer card (smart card) according to the present invention.

8 is a schematic view showing the at least one plastic encapsulation layer in the present invention by a lamination process on the second side of the sheet-like carrier layer.

9 is a schematic view showing the at least one plastic encapsulation layer formed on the second surface of the sheet-like carrier layer by an injection molding method in the present invention.

10-11 are exploded and assembled perspective views of an embodiment of a chip card (smart card) of the present invention embedded in a card body for use as a card and a card.

12 to 16 are respectively embedded in a carrier card body to form a card two-core card, a card four-core card, a card four-core card, a card six-core card and a card. A three-dimensional schematic diagram of a combination of nine-core card embodiments.

In order to make the present invention more clear and detailed, the technical features of the present invention will be described in detail below with reference to the preferred embodiments.

The wafer card described below is exemplified by a smart card (SIM card), but is not intended to limit the present invention. The method for molding a chip package for forming a chip package of a wafer card according to the present invention comprises the following steps: Step 1: using a sheet-like carrier layer 10 to form a plurality of wafer modules 20 arranged at intervals as shown in FIGS. As shown, the sheet-like carrier layer 10 can be a rectangular sheet-shaped carrier, but is not limited, and is formed using a general standard printed circuit board (PCB), which is different from a conventional flexible circuit board (FPC). The material of the board 10 and the manufacturing cost thereof; wherein a plurality of spaced-apart wafer circuit layer patterns 21 are formed on the first surface 11 of the sheet-like carrier layer 10, wherein the spacing arrangement can be designed as shown in FIG. Array mode has a total of 288 chip circuit layer patterns 21, but is not intended to limit the present invention; and on the second surface 12 opposite the first surface 11 on the corresponding first surface 11 of each of the wafer circuit layer patterns 21 A die 22 is assembled at each of the opposite positions so that the die 22 can pass through a circuit (not shown) provided in the chip carrier layer 10 to communicate with the corresponding wafer circuit layer pattern 21, thereby A plurality of wafer modules 20 are formed on the sheet carrier layer 10, and each of the wafer modules 20 includes one The chip circuit layer pattern 21 is disposed on the first surface 11 and a die 22 is disposed on the second surface 12 and is in communication with the chip circuit layer pattern 21; in the embodiment, the chip module 20 includes various SIMs. The card uses a card chip module such as a Mini SIM card, a Micro SIM card, or a Nano SIM card, and the size of the chip modules 20 of the various SIM cards is considered the same but is not intended to limit the present invention; the next step 2 is performed thereafter.

Step 2: forming at least one plastic encapsulation layer 30 on the second surface 12 of the sheet-like carrier layer 10 (as shown in FIG. 5), as shown in FIGS. 5 and 6, wherein the at least one plastic encapsulation layer 30 is formed. Over The process can be integrated with the second surface 12 of the sheet-like carrier layer 10, but the die 22 and the circuit layer pattern in each of the wafer modules 20 disposed on the chip-like carrier layer 10 can be maintained. The connection and function between the two are used to form the sheet-like package board 10a for molding of the present invention, and the chip package 10a for molding has been formed with a plurality of spaced-apart wafer packages 40 as shown in FIG. As shown in the example of the sheet-like carrier layer 10 of FIGS. 3 and 4, the sheet-like package board 10a for molding has 280 chip packages of chip cards (smart cards) arranged in an array of 12×24 arrays. 40, but not intended to limit the invention.

After step 2, the next step 3 is carried out: the sheet package board for molding 10a performing singulation cutting as shown in FIG. 6 by dicing cutting with a dicing line A to form a plurality of wafer packages 40 of the wafer card of the present invention as shown in FIG. 7; For example, the 280-layer chip package 40 can be formed through the step 3, but is not used to limit the present invention. In the present invention, the chip package 40 is a wafer module 20 The wafer structure formed by combining at least one plastic encapsulation layer 30 and having a suitable thickness is as shown in FIGS. 7 and 10, and the chip package 40 is formed by the increased thickness and rigidity of the at least one plastic encapsulation layer 30. Having sufficient mechanical strength to be embedded in a matching carrier card body 60 or an open slot 81 provided on a wafer card body (shown as 70 or 80 in the figure) with a certain degree of tightness As shown in FIGS. 10 and 11, the chip package 40 of the chip card (smart card) can be stably embedded in the opening slot 81 of the card body 60 for carrying the card, and is not easily detached, but the user only needs to apply the finger. The force can be split to remove the wafer package 40 from the card body 60.

Taking the SIM card shown in Figures 7, 10 and 11 as an example, the main features of the present invention are described. Therefore, one of the SIM cards, such as a Mini SIM card (70), a Micro SIM card (80), and a Nano SIM card (90), is specified, and the chip module 20 used in the SIM card is formed into a one-chip chip package 40. Used as a wafer substrate to enable the chip package 40 (wafer substrate) to be easily embedded in a The card body 60 is provided with an open slot 81 to form a desired SIM card, that is, when the chip module 20 is designed to conform to one of the Mini SIM card, the Micro SIM card, and the Nano SIM card. When the chip module is used, the chip package 40 formed is a chip package 40 used in accordance with one of the Mini SIM card, the micro SIM card, and the Nano SIM card, so when the chip package 40 is treated as When a wafer substrate is embedded in an open slot provided in the card body 60, the open slot 81 shown in FIGS. 10 and 11 can constitute one of a Mini SIM card, a Micro SIM card, and a Nano SIM card. The SIM card (wafer card) is a Mini SIM card 70 or a Micro SIM card 80 or a Nano SIM card 90 as shown in FIGS.

In terms of conventional SIM card technology, Mini SIM card, Micro SIM card or Nano The size of the wafer module used in the SIM card can be designed to be the same or approximately the same as the wafer module 20 shown in FIGS. 3 and 4, so in the embodiment shown in FIGS. 10 and 11, the chip package is The 40 size is in accordance with the chip package used in the Mini SIM card, Micro SIM card or Nano SIM card. In addition, the size of the currently known SIM card is reduced from 15mm x 25mm for mini SIM card (Mini SIM card) to 15mm x 12mm for micro SIM card (Micro SIM card), and further reduced to Nano SIM card (Nano SIM card) 8.8 mm x 12.3 mm, so in the embodiment shown in Figures 10 and 11, the chip package 40 is directly made of a Nano SIM card size of 8.8 mm x 12.3 mm for use as a wafer substrate. However, it is not intended to limit the invention. The thickness of the chip package 40 is preferably equal to the thickness of the mating card body 60 (as shown in FIG. 10), such as 0.3 mm to 0.85 mm, that is, when the card body 60 for carrying is known. When the conventional card body 300 of a card-core card 100 (shown in FIGS. 1 and 2) is formed, the thickness of the smart card chip package 40 is preferably equal to the thickness of the card body 300 (60), and is carried. The size and shape of the open slot 81 (shown in Figures 10 and 11) on the card body 60 (300) also fits the size of the wafer card chip package 40 to The wafer card chip package 40 is firmly fitted and does not protrude from the card body 60 (300) when embedded in an open slot 81 (shown in FIGS. 10 and 11) of the card body 60 (300). The surface is shown in Figure 11.

In this step 1, the invention utilizes surface adhesion techniques (SMT, Surface-mount technology) assembling the die 22 of each wafer card (SIM card) packaged by WLCSP (Wafer Level Wafer Size Package) on the second face 12 of the chip carrier layer 10 and corresponding to the The wafer circuit layer pattern 21 on one side 11 is used to achieve mass production benefits. However, the WLCSP packaging method of each of the crystal grains 22 or the SMT assembly process thereof is not intended to limit the present invention.

In addition, in the step 2, the at least one plastic encapsulation layer 30 is laminated. One of the lamination or injection molding methods is formed on the second side 12 of the sheet-like carrier layer 10 and combined to form a one-piece wafer substrate (40), but the lamination method and ejection The molding method is not intended to limit the present invention, and is further described as follows: Referring to FIG. 8, in the step 2, the at least one plastic encapsulation layer 30 is formed by a lamination process to form a second layer of the sheet-like carrier layer 10. When the surface 12 is combined and formed into a one-piece wafer substrate (40), a double-sided adhesive layer 31, a first plastic layer 32 and a first layer are stacked one on another on the second surface 12 of the sheet-like carrier layer 10. a second plastic layer 33, which is further laminated by a lamination process, the first plastic layer 32 and the second plastic layer 33 to be integrated to form the at least one plastic encapsulation layer 30 and simultaneously in the lamination process It is integrated with the second surface 12 of the sheet-like carrier layer 10.

A plurality of chambers 311 are preset on the double-sided adhesive layer 31, and the first plastic layer 32 is A plurality of chambers 321 are preset, and the chambers 311 and 321 are respectively corresponding to the respective crystal grains 22 assembled on the second surface 12 of the sheet-like carrier layer 10, so that the respective crystal grains 22 are After lamination, it can be accommodated in each of the chambers 311, 321 and provided in the outermost layer by the second plastic layer 33 to form a closed state. In addition, The material of the first and second plastic layers 32, 33 may be PVC (polyvinyl chloride) or ABS resin (Acrylonitrile Butadiene Styrene), but is not limited. Since the laminating method used in the present invention includes material selection or temperature and pressure control, etc., which can be achieved by the conventional techniques of the laminating method in the mechanical field, and the lamination method is not the focus of the present invention, it will not be described again. .

Referring to FIG. 9, when the step 2 is used, the at least one plastic encapsulation layer 30 is utilized. When an injection molding method is formed on the second surface 12 of the sheet-like carrier layer 10 and combined to form a one-piece wafer substrate (40), it is provided with a sheet of a plurality of wafer modules 20. The carrier layer 10 is first positioned and embedded in an injection molding die 50, and is first positioned and embedded in the lower mold 52 of the injection molding die 50 as shown in FIG. 9, and then covered with a matching upper mold 51 to make Forming a cavity 53 equal to the space occupied by the at least one plastic encapsulation layer 30 between the lower molds 51 and 52, and facing the second surface 12 of the sheet-like carrier layer 10 toward the cavity 53; The material (30) for forming the plastic encapsulating layer 30 is used as an injection material to be injected into the cavity 53 by the injection port 54 of the injection molding die 50 at a suitable pressure, which is directly in the sheet-like carrier layer 10. The plastic encapsulation layer 30 is injection molded on the second side 12 and can be integrated with the second side 12 of the sheet-like carrier layer 10 by temperature and pressure control during injection molding. The injection molding method used in the present invention includes material selection or temperature and pressure control, or the like, or another spacer (not shown) is used to cover the upper surface of each of the crystal grains 22 on the second surface 12 to be capable of being formed after injection molding. Forming and having the accommodating effect of the chambers 311 and 321 as shown in FIG. 8 can be achieved by using the conventional techniques of the injection molding method in the mechanical field, and the injection molding method is not the focus of the invention, so Let me repeat.

Referring again to Figures 10 and 11, respectively, the wafer card chip package of the present invention The three-dimensional decomposition and combination of an embodiment of the member 40 embedded in a matching card body 60 intention. As mentioned above, the size of the currently known SIM card is reduced from 15mm x 25mm for the Mini SIM card to 15mm x 12mm for the Micro SIM card, and further reduced to the SIM card ( The Nano SIM card is 8.8 mm x 12.3 mm, so in the embodiment shown in Figures 10 and 11, the chip package 40 is directly made up of a Nano SIM card size of 8.8 mm x 12.3 mm, in Figure 10 The chip package 40 of 11, is not only used as a wafer substrate but also as a Nano SIM card 90, but is not intended to limit the present invention. In the present embodiment, the card body 60 for the carrier is formed by using the conventional card body 300 of the conventional card-card 100 (shown in FIGS. 1 and 2), but is not intended to limit the present invention (ie, may also be a The card multi-card, which will be described later, and the manufacturing end of the card body 60 (300) can be formed on the carrier card body 60 (300) by a pre-punched break line 61 to form a Mini SIM card. Mini SIM card (ie, chip card body for Mini SIM card) of size (15mm x 25mm). In this embodiment, a break line 72 can be further formed in the card range of the mini SIM card 70 to form a narrowed first open slot 71 and a micro SIM card conforming to the size of the micro SIM card (15 mm x 12 mm) ( That is, the wafer card body 80 of the micro SIM card enables the wafer card body (80) of the micro SIM card to be embedded in the first opening slot 71 with a certain degree of tightness; this embodiment is further on the micro SIM card. A break line 82 is further formed in the card range of 80 to form a second open slot 81 and a SIM card conforming to the size of the Nano SIM card (8.8 mm x 12.3 mm) (ie, the Nano SIM card). The wafer card body 90 is as shown in FIGS. 10-11, so that the SIM card 90 can be embedded in the second opening slot 81 with a certain degree of tightness. In the embodiment shown in FIGS. 10 and 11, the The chip package 40 is directly formed in a size of 8.8 mm x 12.3 mm of a Nano SIM card, so that the chip package 40 is simultaneously made into a Nano SIM card 90, but is not intended to limit the present invention.

In addition, in the embodiment shown in FIGS. 10 and 11, the card of one card and one core mode Although the chip body 60 (300) is provided with only a second opening slot 81 for embedding a chip package 40, the card body 60 (300) of the card-core mode can be selected by the manufacturing end to carry the mini SIM card. 70. Any one of three different SIM card types, such as a micro SIM card 80 or a SIM card 90, that is, when the manufacturing end of the card body 60 is in a core as shown in FIGS. In the case of the card body 60 (300) of the mode, the mini SIM card 70, the micro SIM card 80 or the SIM card 90 can be selected and combined according to actual needs, for example, on the card body 60 (300). Forming only a mini SIM card (card body) 70 and a second opening slot 81 for embedding a chip package 40 (such as one of the mini SIM cards 70 in FIG. 14) for use with the mini SIM card 70; or The card body 60 (300) is formed with a micro SIM card 80 and a second opening slot 81 for embedding a chip package 40 (such as one of the micro SIM cards 80 in FIG. 15) for use with the micro SIM card 80; Or a card SIM card 90 and a second opening slot 81 are formed on the card body 60 (300) for embedding a chip package 40 for use with the SIM card 90 (as shown in the figure). One of the 16 SIM cards 90), wherein in the present embodiment, the chip package 40 is a SIM card 90. In other words, regardless of the carrier card body 60 (300) being designated to carry one of the mini SIM card 70, the micro SIM card 80, and the SIM card 90 (40), the card body 60 for the carrier (300) The manufacturing end of the card can be provided with a second open slot 81 of a shared size within the card range of the SIM card (eg, 70, 80) provided on the card body 60 (300) for mounting a SIM corresponding to the SIM card. The chip can use and share the size of the chip package 40 (the SIM card 90 shown in FIGS. 10 and 11), and the manufacturing end of the wafer card (smart card) chip package 40 of the present invention can be mass-produced first. The chip package 40 of the wafer card (smart card) is formed so that the chip package 40 can be used as a wafer substrate for embedding the SIM card (70, 80, 90) provided in the card body 60 (300). In the open slot (81) in the card range, a use pattern of the SIM card (70, 80, 90) can be formed. Therefore, the manufacturing end of the present invention can be mass-produced separately in two separate processes. The chip package 40 and the card body 60 for carrying the same can not only avoid the limitation of the special machine necessary for the conventional process technology, but also reduce the material cost of the carrier layer and meet the mass production requirements, thereby effectively improving the smart card. The economic benefits of the process are the advantages of the technology of the present invention.

In addition, as shown in FIGS. 10 and 11, the card body 60 for the carrier is only an embodiment of the card-core mode, but is not intended to limit the present invention, that is, the card body 60 (300) of the card-core can be based on the figure. The technical features shown in FIGS. 10 and 11 are analogized to the card body of one card and multiple cores, respectively as follows: as shown in FIG. 12, which is a card two-core card body 60a carrying one of two SIM cards, wherein the two The SIM card may be one of a mini SIM card 70, a micro SIM card 80, and a SIM card 90, wherein the number of SIM cards carried may be set according to the size of the SIM card.

As shown in FIG. 13, it is a card-loaded four-core card body 60b, wherein the four SIM cards can be one of a mini SIM card 70, a micro SIM card 80, and a SIM card 90. The number of SIM cards carried can be set according to the size of the SIM card.

As shown in FIG. 14, it is a card card four-core card body 60c carrying one of four SIM cards, wherein the four SIM cards can be one of a mini SIM card 70 and a SIM card 90, wherein the SIM card carried therein The number can be set according to the size of the SIM card.

As shown in FIG. 15, it is a card six-core card body 60d carrying one of six SIM cards, wherein the six SIM cards may be one of a micro SIM card 80 and a SIM card 90, wherein the SIM card carried therein The number can be set according to the size of the SIM card.

As shown in FIG. 16, it is a card six-core card body 60e carrying one of nine SIM cards, wherein the nine SIM cards are SIM cards 90, wherein the number of SIM cards carried can be based on the size of the SIM card. And set.

The above is only the preferred embodiments of the present invention, and is intended to be illustrative, and not restrictive, and it is understood by those of ordinary skill in the art that Many changes, modifications, and even equivalents may be made without departing from the scope of the invention.

40‧‧‧Chip package

60‧‧‧ card body

61‧‧‧break line

70‧‧‧Mini SIM card

71‧‧‧First open slot

72‧‧‧Fracture line

80‧‧‧Micro SIM card

81‧‧‧Second open slot

82‧‧‧Fracture line

90‧‧‧Nai SIM

Claims (17)

A method for molding a chip package board for forming a chip package of a wafer card comprises the following steps: Step 1: using a sheet-like carrier layer to form a plurality of wafer modules forming a wafer card arranged at intervals, wherein Forming a plurality of spaced-apart wafer circuit layer patterns on the first surface of the sheet-like carrier layer, and respectively on opposite sides of the first surface of the first surface on the corresponding first surface of each of the wafer circuit layer patterns Forming a die to pass through the chip carrier layer to communicate with the corresponding chip circuit layer pattern, thereby fabricating a plurality of chip modules, wherein each of the chip modules includes a chip circuit layer pattern disposed on the first surface and a die is disposed on the second surface and in communication with the pattern of the circuit layer of the wafer; Step 2: forming at least one plastic encapsulation layer on the second surface of the sheet-like carrier layer, the at least one plastic encapsulation layer and the sheet The second side of the carrier layer is integrated and maintains the communication and function between the die and the corresponding chip circuit layer pattern in each smart card chip module, thereby completing the arrangement with a plurality of intervals Chip package Chip package board. The molding method of claim 1, wherein after the step 2, the following steps are further included: Step 3: singulating and cutting the sheet-like packaging board for molding to complete a plurality of smart card chip packages. Each smart card chip package is a body molded body formed by a smart card chip module and at least one plastic packaging layer. The molding method according to claim 1, wherein in the step 2, the at least one plastic encapsulation layer is formed on the sheet-like carrier by one of a lamination method or an injection molding method. The second side of the layer is combined to form an integrally formed body. The molding method according to claim 3, wherein when the laminating method is used in the step 2, a double-sided adhesive layer and a first plastic are stacked one on another on the second side of the sheet-like carrier layer. Layer and one The second plastic layer is laminated to form the at least one plastic encapsulation layer and integrated with the second side of the sheet-like carrier layer. The molding method of claim 4, wherein a plurality of chambers are preset on the double-sided adhesive layer and the first plastic layer, wherein each of the chambers respectively corresponds to the second surface of the sheet-like carrier layer The assembled crystal grains are provided for the respective crystal grains to be accommodated in the respective chambers. The molding method according to claim 4, wherein the material of the first plastic layer and the second plastic layer comprises PVC (polyvinyl chloride), ABS resin (acrylonitrile-butadiene-styrene copolymer, Acrylonitrile Butadiene Styrene). The molding method according to claim 3, wherein when the injection molding method is used in the step 2, the sheet-shaped carrier layer is first embedded in the injection molding die, and then used to form the plastic package. The material of the layer is used as an injection material to directly form and mold the plastic encapsulation layer on the second surface of the sheet-like carrier layer by the injection molding die and to be integrated with the second surface of the sheet-like carrier layer. The molding method according to claim 1 or 2, wherein the chip module comprises a wafer die that is used in accordance with a mini SIM card, a micro SIM card, a nano SIM card, and a nano SIM card. group. The molding method of claim 1 or 2, wherein the chip package comprises a chip package for use with a mini SIM card, a micro SIM card, a nano SIM card, or a nano SIM card. Pieces. The molding method of claim 1 or 2, wherein the chip package comprises a wafer module and at least one plastic encapsulation layer having a thickness of 0.3 to 0.85 mm. A sheet-like encapsulating sheet for forming a chip package of a wafer card, which is produced by the molding method according to any one of claims 1 to 10, wherein the sheet-like package board comprises: a sheet-like package a board layer having a plurality of spaced apart wafer modules thereon, wherein each smart card chip The module further includes: a chip circuit layer pattern formed on the first surface of the chip carrier layer; and a die mounted on the second surface opposite the first surface and located on the corresponding chip circuit layer pattern The opposite position is transmitted through the sheet-like carrier layer to be electrically connected to the corresponding chip circuit layer pattern; and at least one plastic encapsulation layer is formed on the second surface of the sheet-like carrier layer and the sheet-shaped carrier The second side of the layer is integrated and maintains the function of the die and the corresponding chip circuit layer pattern in each smart card chip module. A chip package for a wafer card, which is formed by singulating and cutting a chip-type package substrate formed by using a sheet-like package sheet according to claim 11 of the patent application, wherein the chip package comprises: a wafer mold The group includes: a wafer circuit layer pattern formed on a first side of the one-piece carrier layer; and a die assembled on a second side opposite the first surface and located opposite the corresponding circuit layer pattern of the wafer Providing a position through the sheet-like carrier layer to be electrically connected to the corresponding chip circuit layer pattern; and at least one plastic encapsulation layer formed on the second side of the sheet-like carrier layer and with the sheet-shaped carrier The second side of the layer is integrated and maintains the communication and function between the die and the corresponding chip circuit layer pattern in each smart card chip module; wherein the chip package is formed by the at least one plastic package layer Forming and bonding the increased thickness on the second side of the sheet-like carrier layer such that the chip package has sufficient mechanical strength to be closely embedded in an opening of a mating wafer card body In the slot. The chip package of claim 12, wherein the chip module comprises a chip module for use with a mini SIM card, a micro SIM card, a nano SIM card, or a nano SIM card. . The chip package of claim 12, wherein the chip package comprises a mini SIM A chip package for use with a card (Mini SIM card), a micro SIM card (Micro SIM card), and a SIM card (Nano SIM card). The chip package of claim 12, wherein the chip card system has one of a mini SIM card (Mini SIM card), a micro SIM card (Micro SIM card), and a SIM card (Nano SIM card). Size card body. The chip package of claim 15 wherein the wafer card system is disposed on a rectangular card body having a size of 85.6 mm x 53.98 mm. The chip package of claim 12, wherein the chip package comprises a wafer module and at least one plastic encapsulation layer having a thickness of 0.3 to 0.85 mm.