CN204288266U - The wafer package part of chip card and molding sheet shape package board thereof - Google Patents

Abstract

The utility model provides a chip package of a chip card and a sheet packaging board for molding thereof, which uses a sheet carrier layer to manufacture a plurality of chip modules arranged at intervals, and each chip module includes a chip circuit layer pattern formed On the first surface of the sheet-shaped carrier layer and a crystal grain is assembled on the second surface of the opposite side and can communicate with the pattern of the chip circuit layer; and then formed on the second surface of the sheet-shaped carrier layer At least one plastic packaging layer is combined into one, so that the molding sheet packaging board is made; and then singulated and cut to make a plurality of chip packages, so that the chip module used by a chip card is formed in one piece The chip substrate can be easily embedded in an opening groove provided on a chip card body to form a chip card. The utility model can reduce the material cost of the carrier board layer, meet the demand for mass production and improve the economic benefits of the smart card manufacturing process.

Description

Chip package for chip card and chip packaging board for molding thereof

technical field

The utility model relates to a chip package of a chip card and a sheet packaging plate for molding thereof and a molding method, in particular to a chip module used in a chip card made into a one-piece chip package to be used as a chip base for supplying It can be easily embedded in an opening groove provided on a chip card body to form a chip card, so as to improve the economic benefit of the chip card manufacturing process.

Background technique

The chip card generally referred to refers to a card embedded with a chip module, such as a smart card (SIM card), a financial card or a credit card, etc., wherein the smart card refers to a Subscriber Identity Module (Subscriber Identity Module, SIM), which is used to save mobile phones. Smart cards for user identification data are commonly referred to as SIM cards. At present, SIM cards can be divided into Mini (mini) SIM cards, Micro (micro) SIM cards and Nano (Nano) SIM cards, each of which has a predetermined size For example, the Mini SIM card is a small rectangular card body of 15mmx25mm, the Micro SIM card is a small rectangular card body of 15mmx12mm, and the Nano SIM card is a small rectangular card body of 8.8mmx12.3mm. Although the above rectangular card bodies are not complete For example, there is a cut corner on one corner, but since it is not the focus of this case and does not affect the technology of this case, it will not be described here. In terms of the existing SIM card structure, it utilizes a small rectangular plastic card body with the above-mentioned predetermined size such as 15mmx25mm (Mini SIM card), 15mmx12mm (Micro SIM card) or 8.8mmx12.3mm (Nano SIM card), And a recessed slot is preset on the rectangular small card body for embedding a chip module that meets the function of the SIM card; Or Nano SIM card, the size of the embedded chip module can be designed to be the same or approximately the same, which is beneficial to the manufacturing process of the SIM card chip module or chip card, but not to limit the utility model.

The chip card described below is illustrated by taking a smart card (SIM card) as an example, but it is not intended to limit the present invention. With reference to Fig. 1, 2, it is respectively the three-dimensional schematic diagram of the combination and disassembly of the chip module of the SIM card and the card body in the existing one-card-one-core card. The one-card-one-core card 100 includes a smart card (chip card) 200 and a card body 300 for carrying. The card body 300 is generally a rectangular plastic chip card of 85.6mmx53.98mm. Since chip cards such as financial cards or credit cards have been produced and used in large quantities for a long time, the card body 300 has become recognized by the industry related to chip cards. In other words, the mechanical equipment used to make the 85.6mmx53.98mm rectangular card body and its manufacturing process or related technologies are quite complete and mature at present, which is conducive to mass production and use in the industry. Therefore, the card body 300 has also been extended and used by related industries to make and/or store SIM cards with smaller sizes. As shown in Figures 1 and 2, the smart card 200 can be selected from existing SIM card types such as Mini SIM card specifications according to the needs of use. The size is 15mmx25mm, the size of the Micro SIM card is 15mmx12mm, or the size of the Nano SIM card is 8.8mmx12.3mm. As shown in Figure 1 and 2, the Mini SIM card is used as an example to illustrate but not limit, due to manufacturing When the end is made, only a single smart card 200 is set on a card body 300 for carrying, so it is called one card and one core, but it can also be made into one card with multiple cores without limitation (shown in Figs. 12-16).

This existing smart card 200 comprises a card body 201 and a smart card chip module 202 embedded and bonded in the pre-set groove (blind groove) 203 on a chip card body (200) provided on the card body 201 such as As shown in FIG. 2, the chip module 202 further includes a carrier layer 204, a chip circuit layer pattern 205 is arranged on the first surface of the carrier layer 204 (the upper side as shown in the figure) and a die 206 assembly On the opposite second surface of the carrier layer 204 (the bottom surface as shown in the figure), it can be correspondingly connected to the wafer circuit layer pattern 205 .

Taking the current smart card (SIM card) manufacturing technology as an example, the one-card-one-core card shown in Figures 1 and 2 is used as an example. The manufacturing end of the chip module 202 generally uses a continuous strip-shaped flexible circuit Board (FPC) is used as a carrier board (not shown), which is generally known as Roll to Roll FPC or Reel to Reel FPC (reel mode) production method, and the strip-shaped FPC is along its length direction (that is, the feeding direction) A series of chip modules (202) (comprising a chip circuit layer pattern 205 and a crystal grain 206) (including a chip circuit layer pattern 205 and a crystal grain 206) are formed in sequence; A device is used to carry out the follow-up process of the smart card, including: taking out the single card chip module (202) from the strip-shaped FPC, and then assembling each chip module (202) one by one on the matching card body 300 as shown in the figure 2, to make the one-card-one-core card 100.

With regard to the manufacturing process of the existing one-card-one-core card 100, the fracture line 207 of the smart card 200 must be punched out on each card body 300 for the convenience of the user to take out the smart card 200 from the one-card-one-core card 100. On the surface of the card layer 201 of the smart card 200, the inlay groove 203 must be carved out by means of a router for the smart card chip module 202 to be embedded in it, and the inlay groove 203 must be routered to form a central The cavity 208 is used to accommodate the crystal grain 206 provided on the bottom surface of the chip module 202 and a stepped groove 209 for the surrounding edges of the bottom surface of the chip module 202 to be fixed in the embedded groove 203 by means of glue; moreover, the above process is currently All can only be produced by using specially designed special machine equipment.

It can be seen from the above that the existing one-card-one-core card 100 (or one-card multi-core) process technology will be limited by special machine equipment, so that the manufacturing process of the chip module 202 and the card body 300 are also limited. For example, in the present In some manufacturing processes, from the production of the chip module 202 including the formation of each chip circuit layer pattern 205 and the installation of each chip 206 to the subsequent manufacturing operations such as assembling the chip module 202 on the card body 300, Roll The production and processing methods of to Roll FPC or Reel to Reel FPC (reel method) are carried out sequentially on a long flexible circuit board (FPC), so the machine structure is not only complicated, but also the manufacturing process is relatively long. Slow, it is difficult to achieve mass production benefits, and using a flexible printed circuit board (FPC) as a carrier board also relatively increases the manufacturing process and material costs, and causes production control between the chip module 202 manufacturing end and the card body 300 manufacturing end In addition, on the surface of the card layer 201 of the smart card 200, the special slot 203 for the chip module 202 to be embedded must be cut out by means of a router, which further increases the difficulty of the routing process and cost. Therefore, the existing process technology not only fails to meet the demand for mass production, but also relatively increases the manufacturing cost, which is not in line with the economic benefits of producing smart cards.

Utility model content

As can be seen from the above, for the manufacturing process of chip cards (smart cards), how to develop a chip card manufacturing process that can meet the needs of mass production and improve economic benefits is the problem that the utility model wants to solve urgently, and the utility model is aimed at the above-mentioned To solve the problem, and propose a novel and progressive technical solution.

In order to achieve the above object, the technical scheme adopted by the utility model includes:

A sheet packaging board for molding a chip package of a chip card, characterized in that the sheet packaging board includes:

A sheet-shaped carrier layer is provided with a plurality of chip modules arranged at intervals, wherein each smart card chip module also includes: a chip circuit layer pattern formed on the first surface of the sheet-shaped carrier layer; and a Die, which is assembled on the second surface opposite to the first surface and located at the opposite position corresponding to the circuit layer pattern of the chip, so as to conduct conduction with the circuit layer pattern of the corresponding chip through the sheet carrier layer; and

At least one plastic encapsulation layer is formed on the second surface of the sheet-shaped carrier layer and integrated with the second surface of the sheet-shaped carrier layer, and holds the crystal grains in each smart card chip module and the corresponding The function of the wafer circuit layer pattern.

In order to achieve the above object, the technical solution adopted by the utility model also includes:

A chip package for a chip card, which is a sheet-type chip base formed by singly cutting the above-mentioned sheet packaging board for molding, characterized in that the chip package includes:

A chip module, which includes: a chip circuit layer pattern formed on a first surface of a sheet carrier layer; and a crystal grain assembled on a second surface opposite to the first surface and located corresponding to the chip circuit At the relative position of the layer pattern, energy is supplied through the sheet carrier layer to conduct with the corresponding chip circuit layer pattern; and

At least one plastic encapsulation layer is formed on the second surface of the sheet-shaped carrier layer and integrated with the second surface of the sheet-shaped carrier layer, and holds the crystal grains in each smart card chip module and the corresponding The connection and function between the chip circuit layer patterns;

Wherein the chip package is formed by the at least one plastic packaging layer and combined with the increased thickness on the second surface of the chip carrier layer, so that the chip package has sufficient mechanical strength to be tightly embedded in a In an opening groove provided on the matching chip card body.

Wherein, the chip module includes a chip module compatible with a Mini SIM card, a Micro SIM card or a Nano SIM card.

Wherein, the chip package includes a chip package compatible with a Mini SIM card, a Micro SIM card or a Nano SIM card.

Wherein, the chip card body is a card body having the size of one of the SIM cards of Mini SIM card, Micro SIM card or Nano SIM card.

Wherein, the chip card body is set on a rectangular card body with a dimension of 85.6mmx53.98mm.

Wherein, the thickness of the chip package composed of a chip module and at least one plastic packaging layer is 0.3-0.85mm.

In this way, the manufacturing end can mass-produce the chip package and the chip card body (or the card body for carrying) with separate processes, and then easily combine them into one body, which can not only avoid the special machine necessary for the existing process technology It can meet the requirement of mass production and improve the economic benefit of the chip card manufacturing process.

Description of drawings

Fig. 1-Fig. 2 are the combined and disassembled three-dimensional schematic diagrams of the chip module and the card body in the existing one-card-one-core card;

3 is a schematic plan view of an embodiment of the first surface (with a plurality of chip circuit layer patterns) provided with a plurality of chip modules arranged at intervals on the sheet carrier layer of the present invention;

Fig. 4 is a schematic plan view of the second surface (with a plurality of crystal grains) of the sheet carrier layer of Fig. 3;

Fig. 5-Fig. 7 is respectively the step schematic diagram of the molding method of the chip package of the chip card (smart card) of the present utility model with sheet packaging board;

8 is a schematic view of the at least one plastic encapsulation layer formed on the second surface of the sheet-shaped carrier layer by a lamination method in the present invention;

9 is a schematic view of the at least one plastic encapsulation layer formed on the second surface of the sheet carrier layer by injection molding in the present invention;

Fig. 10-Fig. 11 are the disassembled and combined three-dimensional schematic diagrams of the chip package of the chip card (smart card) of the present invention embedded in a carrier card body to become a card with one card and one core respectively;

Fig. 12-Fig. 16 respectively show that in the present utility model, the chip package is embedded on a carrier card body to become a card with two cores, a card with four cores, a card with four cores, a card with six cores and a card with six cores. A three-dimensional schematic diagram of the embodiment of one card with several cores.

Explanation of reference signs: 10 sheet carrier layer; 10a sheet packaging board; 11 first side; 12 second side; 20 chip module; 21 chip circuit layer pattern; 22 grain; 30 plastic packaging layer; 31 double-sided Adhesive layer; 311 cavity; 32 first plastic layer; 321 cavity; 33 second plastic layer; 40 chip card chip package; 50 injection molding mold; 51 upper mold; 52 lower mold; 53 mold cavity; 54 injection port ;60 card body; 60a card body; 60b card body; 60c card body; 60d card body; 60e card body; 61 fold line; 70 mini SIM card; 71 first opening slot; 72 break line; 81 second opening slot; 82 break line; 90 Nai SIM card; (prior art); 100 one-card-one-core card; 200 smart card; 201 card body; 202 smart card chip module; Chip circuit layer pattern; 206 crystal grains; 207 fold lines; 208 central cavity; 209 stepped groove; 300 card body.

Detailed ways

In order to make the utility model clearer and more detailed, the preferred embodiments are listed hereby together with the following diagrams, and the technical features of the utility model are described in detail as follows.

The chip card described below is illustrated by taking a smart card (SIM card) as an example, but it is not intended to limit the present invention. The molding method of the sheet package plate used for the molding of the chip package of the chip card of the utility model comprises the following steps:

Step 1: Use a sheet carrier layer 10 to make a plurality of chip modules 20 arranged at intervals, as shown in Figures 1 and 2, the sheet carrier layer 10 can be a rectangular sheet carrier but not limited, it is It is formed by using a general standard printed circuit board (PCB), which is different from a traditional flexible circuit board (FPC), so the material and manufacturing cost of the carrier board 10 can be reduced; wherein on the first surface 11 of the sheet carrier layer 10 A plurality of wafer circuit layer patterns 21 arranged at intervals are formed, wherein the interval arrangement can be designed as a 12×24 array as shown in FIG. 1 and there are a total of 288 wafer circuit layer patterns 21, but this is not intended to limit the utility model; On the second surface 12 opposite to the first surface 11, a crystal grain 22 is respectively assembled at the relative position of each chip circuit layer pattern 21 on the corresponding first surface 11, so that the crystal grain 22 can pass through the chip carrier. The circuit (not shown) provided on the plate layer 10 communicates with the corresponding chip circuit layer pattern 21, so that a plurality of chip modules 20 are made on the sheet carrier layer 10, and each chip module 20 includes a chip The circuit layer pattern 21 is arranged on the first surface 11 and a crystal grain 22 is arranged on the second surface 12 and communicates with the circuit layer pattern 21 of the chip; Such as the card chip module of Mini SIM card, Micro SIM card, Nano SIM card, and the size of the chip module 20 of various SIM cards is regarded as the same but not in order to limit the utility model; then proceed to the next step 2.

Step 2: Form at least one plastic encapsulation layer 30 on the second surface 12 of the sheet carrier layer 10 (as shown in FIG. 5 ), as shown in FIGS. 5 and 6, wherein the at least one plastic encapsulation layer 30 is In the process, it can be integrated with the second surface 12 of the sheet carrier layer 10, but still maintain the crystal grains 22 and the circuit layer pattern 21 in each chip module 20 set on the sheet carrier layer 10. In this way, the molding chip packaging board 10a of this utility model has been made, and a plurality of chip packages 40 arranged at intervals have been made on the molding sheet packaging board 10a as shown in FIG. 7 As shown, taking the sheet carrier layer 10 of FIGS. , but not to limit the utility model.

After step 2, the next step 3 must be carried out: performing individualized cutting of the molding sheet packaging board 10a as shown in FIG. The chip package 40 of the utility model chip card is as shown in Figure 7; taking the sheet carrier layer 10 of Figures 3 and 4 as an example, two or eight chip packages 40 can be made through step 3 but are not used for To limit the utility model; in the utility model, the chip package 40 is a chip-type structure composed of a chip module 20 and at least one plastic packaging layer 30 and has a suitable thickness, as shown in Figures 7 and 10, And by virtue of the increased thickness and rigidity of the at least one plastic encapsulation layer 30, the chip package 40 must have sufficient mechanical strength to be embedded in a matching carrier card body 60 or on it with a certain degree of tightness. As shown in Figures 10 and 11 in the opening slot 81 provided on a chip card body (as shown in 70 or 80 among the figures), that is, the chip package 40 of the chip card (smart card) can be firmly embedded in the carrier The opening slot 81 on the card body 60 is not easy to disengage, but the user can break it apart with a little force from the card body 60 to take out the chip package 40 from the card body 60 .

Taking the SIM card shown in Fig. 7, 10, 11 as an example, the utility model is characterized in that: specify a kind of SIM card such as Mini SIM card (70), Micro SIM card (80), Nano SIM card (90) In one of them, the chip module 20 used by the SIM card is made into a one-piece chip package 40 for use as a chip base, so that the chip package 40 (chip base) can be easily embedded in a carrier card body 60 is set in an opening slot 81 to form a desired SIM card, that is, when the chip module 20 is designed to meet the chip module used by one of the SIM cards of Mini SIM card, Micro SIM card and Nano SIM card When, the formed chip package 40 is the chip package 40 used by one of Mini SIM card, Micro SIM card and Nano SIM card, so when the chip package 40 is used as a chip substrate and embedded In the open slot 81 shown in Figures 10 and 11 in the open slot provided on a card body 60 for carrying, then a kind of SIM card (chip card) of Mini SIM card, Micro SIM card and Nano SIM card can be formed. ) Mini SIM card 70 or Micro SIM card 80 or Nano SIM card 90 as shown in Figures 10 and 11.

As far as the existing SIM card technology is concerned, the size of the chip module used by the Mini SIM card, Micro SIM card or Nano SIM card can be designed to be the same or roughly the same as the chip module 20 shown in Figures 3 and 4, so in In the embodiment shown in FIGS. 10 and 11 , the size of the chip package 40 is a chip package that is compatible with a Mini SIM card, a Micro SIM card or a Nano SIM card. In addition, the size of the currently known SIM card is reduced from 15mmx25mm of the Mini SIM card (Mini SIM card) to 15mmx12mm of the Micro SIM card (Micro SIM card), and then further reduced to 8.8 mm of the Nano SIM card (Nano SIM card). mmx12.3mm, so in the embodiment shown in Figures 10 and 11, the chip package 40 is directly made of the size 8.8mmx12.3mm of the Nano SIM card for use as a chip substrate, but not for limitation The utility model. And the thickness of the chip package 40 is preferably equal to the thickness of the matching card body 60 (as shown in FIG. 10 ), such as 0.3 mm to 0.85 mm. When the existing card body 300 of the card-core card 100 (as shown in Figures 1 and 2) is made, the thickness of the smart card chip package 40 is preferably equal to the thickness of the card body 300 (60), and it is suitable for carrying The size and shape of the opening groove 81 (as shown in FIGS. 10 and 11 ) on the card body 60 (300) are also matched with the size of the chip card chip package 40, so that the chip card chip package 40 is embedded in the chip card chip package. The card body 60 (300) is firmly fitted in an opening groove 81 (as shown in FIGS. 10 and 11 ) and does not protrude from the surface of the card body 60 (300 ) as shown in FIG. 11 .

In this step 1, the utility model utilizes surface-mount technology (SMT, surface-mount technology) to utilize WLCSP (wafer-level chip size package) the crystal grain 22 of each chip card (SIM card) packaged on the package On the second surface 12 of the chip carrier layer 10 and corresponding to each chip circuit layer pattern 21 on the first surface 11, in order to achieve mass production efficiency, but the WLCSP packaging method or SMT assembly process of each of the above-mentioned crystal grains 22 is not In order to limit the utility model.

In addition, in the step 2, the at least one plastic encapsulation layer 30 is formed on the second surface of the sheet carrier layer 10 by one of lamination or injection molding. 12 and combined to form a one-piece wafer substrate (40), but the lamination method and the injection molding method are not used to limit the utility model, further explained as follows:

Referring to Fig. 8, when the at least one plastic encapsulation layer 30 is formed on the second surface 12 of the sheet carrier layer 10 by a lamination method in step 2 and combined to form a one-piece chip base (40) At the same time, it is to stack a double-sided adhesive layer 31, a first plastic layer 32 and a second plastic layer 33 one by one on the second surface 12 of the sheet carrier layer 10, and then laminate the The double-sided adhesive layer 31, the first plastic layer 32 and the second plastic layer 33 are combined to form the at least one plastic encapsulation layer 30 and are simultaneously bonded to the second surface 12 of the sheet carrier layer 10 during the lamination process. combined into one.

A plurality of cavities 311 are preset on the double-sided adhesive layer 31, and a plurality of cavities 321 are preset on the first plastic layer 32, and the provided cavities 311, 321 respectively correspond to the sheet-shaped Each crystal grain 22 assembled on the second surface 12 of the carrier layer 10, so that each crystal grain 22 can be accommodated in each chamber cavity 311, 321 after lamination, and is set by means of the second plastic layer 33 In the outermost layer to form a closed state. In addition, the material of the first and second plastic layers 32 and 33 can be PVC (polyvinyl chloride) or ABS resin (acrylonitrile butadiene styrene copolymer, Acrylonitrile Butadiene Styrene), but not limited. Since the lamination method used in the utility model includes material selection or temperature and pressure control, etc., it can be achieved by using the existing technology of the lamination method in the mechanical field, and the lamination method is not the focus of the utility model, so it is not Let me repeat.

Referring to FIG. 9, when the at least one plastic encapsulation layer 30 is formed on the second surface 12 of the sheet carrier layer 10 by injection molding (injection molding) in the step 2 and combined to form a one-piece chip When the substrate (40) is used, it is to position and embed the sheet carrier layer 10 that has been provided with a plurality of chip modules 20 in an injection molding mold 50, as shown in FIG. In the lower mold 52 of 50, cover a matched upper mold 51 so that a mold cavity 53 that is identical to the space occupied by the at least one plastic packaging layer 30 is formed between the upper and lower molds 51, 52, and the The second surface 12 of the sheet carrier layer 10 faces the mold cavity 53; a material (30) used to form the plastic encapsulation layer 30 is used as an injection material to be injected from the injection port 54 of the injection molding mold 50 with a Appropriate pressure is injected into the mold cavity 53, and the plastic encapsulation layer 30 can be directly injection molded on the second surface 12 of the sheet carrier layer 10, and it can be controlled with the sheet shape by virtue of the temperature and pressure control during injection molding. The second surface 12 of the carrier layer 10 is integrated into one body. Since the injection molding method adopted in the present invention includes material selection or temperature and pressure control, etc., or another interval shielding sheet (not shown) is used to cover the top of each crystal grain 22 on the second surface 12 to prevent the injection molding process after injection molding. The accommodating effect of the chambers 311 and 321 that can be formed and have the cavity 311, 321 as shown in Fig. 8 can be achieved by using the existing technology of the injection molding method in the mechanical field, and the injection molding method is not the focus of the present utility model. Therefore, no further details.

Referring again to FIGS. 10 and 11 , they are perspective exploded and assembled diagrams of an embodiment of the present invention in which the chip card chip package 40 is embedded in a matching carrier card body 60 . As mentioned earlier, the size of the currently known SIM card is reduced from 15mmx25mm of the Mini SIM card (Mini SIM card) to 15mmx12mm of the Micro SIM card (Micro SIM card), and then further reduced to the size of the Nano SIM card (Nano SIM card). ) of 8.8mmx12.3mm, so in the embodiment shown in Figures 10 and 11, the chip package 40 is directly made with the size 8.8mmx12.3mm of the Nano SIM card, the wafer in Figures 10 and 11 The package 40 is not only used as a chip substrate but also is made into a Nano SIM card 90, but it is not intended to limit the present utility model. In this embodiment, the carrying card body 60 is made by utilizing the existing card body 300 of the existing one-card-one-core card 100 (as shown in FIGS. A multi-core card, which will be described later), and the manufacturing end of the card body 60 (300) must be formed on the carrier card body 60 (300) by virtue of the pre-punched break line 61 to form a Mini SIM A mini SIM card (that is, the chip card body of the MiniSIM card) 70 with a card specification size (15mmx25mm). In this embodiment, a break line 72 can be further opened in the card range of the mini SIM card 70 to form a smaller first opening groove 71 and a micro SIM card (that is, a micro SIM card that meets the Micro SIM card size (15mmx12mm) Micro SIM card (chip card body) 80, the chip card body (80) of this micro SIM card can be embedded in this first opening groove 71 with certain compactness; Present embodiment is further in this micro SIM card 80 Open a fracture line 82 again in the card range to form a second opening groove 81 and a nano SIM card (that is, the chip card body of the Nano SIM card) that meets the specifications of the Nano SIM card (Nano SIM card) size (8.8mmx12.3mm). ) 90 as shown in Figures 10-11, so that the Nano SIM card 90 can be embedded in the second opening groove 81 with a certain degree of tightness, in the embodiment shown in Figures 10 and 11, the chip package 40 is directly made with the size 8.8mmx12.3mm of the Nano SIM card, so the chip package 40 is made into a Nano SIM card 90 at the same time, but it is not used to limit the utility model.

In addition, in the embodiment shown in Figures 10 and 11, although the card body 60 (300) of the one-card-one-core mode is only provided with a second opening groove 81 for embedding a chip package 40, the one The card body 60 (300) of the one-core card mode can be selected by the manufacturer to carry any SIM card in three different SIM card types such as the mini SIM card 70, the micro SIM card 80 or the nano SIM card 90, and also That is, when the manufacturing end of the card body 60 is making the card body 60 (300) of the one-card-one-core mode as shown in Figures 10 and 11, the above-mentioned mini SIM card 70, micro SIM Card 80 or Chennai SIM card 90 three are selected and combined, for example: on this card body 60 (300), only molding is provided with a mini SIM card (card body) 70 and a second opening groove 81 for embedding a conforming mini SIM card. A chip package 40 used by the SIM card 70 (such as a mini SIM card 70 in Figure 14); or on the card body 60 (300), only a micro SIM card 80 and a second open groove 81 are formed for embedding A chip package 40 (such as a micro SIM card 80 in Figure 15) that meets the use of the micro SIM card 80; or only a nano SIM card 90 and a second opening groove 81 are formed on the card body 60 (300) A chip package 40 for embedding a Nano-SIM card 90 (such as a Nano-SIM card 90 in FIG. 16 ), wherein the chip package 40 is the Nano-SIM card 90 in this embodiment. In other words, regardless of which type of SIM card the card body 60 (300) for carrying is designated to carry the mini SIM card 70, the micro SIM card 80, and the SIM card 90 (40), the card body 60 (300) for carrying 300) manufacturing end all can offer a second opening groove 81 that can share the size in the card scope of the set SIM card (as 70,80) on the card body 60 (300) for embedding a conforming to this kind SIM card uses and can share the chip package 40 of size again (as shown in Fig. 10,11 shown in the SIM card 90), and the manufacturing end of the chip card (smart card) chip package 40 of the present utility model promptly can measure first Produce and make the chip package 40 of this chip card (smart card), so that this chip package 40 can be used as a chip base for embedding the SIM card (70,80,90) set in the card body 60 (300) ) in the opening slot (81) within the card range, so that a usage pattern of a SIM card (70, 80, 90) can be formed. Therefore, the manufacturing end of the present invention can mass-produce the chip package 40 and the carrying card body 60 respectively by two separate processes, which can not only avoid the limitation of special machines necessary for the existing process technology, but also can The material cost of the carrier layer is reduced and meets the requirements of mass production, so the economic benefits of the smart card manufacturing process can be effectively improved, which is the advantage of the technology of the utility model.

In addition, as shown in Figures 10 and 11, the carrying card body 60 is only an embodiment of the one-card-one-core model, but it is not intended to limit the present utility model, that is, the one-card-one-core card body 60 (300) can be based on The technical features shown in Figures 10 and 11 are analogized to the card body with multiple cores in one card, and are explained as follows:

As shown in Figure 12, it is a one-card two-core card body 60a carrying two SIM cards, wherein the two SIM cards can be one of a mini-SIM card 70, a micro-SIM card 80, and a nano-SIM card 90, The number of SIM cards carried therein can be set according to the size of the SIM card.

As shown in Figure 13, it is a four-core card body 60b carrying four SIM cards, wherein the four SIM cards can be one of a mini SIM card 70, a micro SIM card 80, and a nano SIM card 90, The number of SIM cards carried therein can be set according to the size of the SIM card.

As shown in Figure 14, it is a four-core card body 60c carrying four SIM cards, wherein the four SIM cards can be one of the mini-SIM card 70 and the Nano-SIM card 90, and the SIM cards carried therein The number of cards can be set according to the size of the SIM card.

As shown in Figure 15, it is a six-core card body 60d carrying six SIM cards, wherein the six SIM cards can be one of a micro SIM card 80 and a nano SIM card 90, and the SIM cards carried therein The number of cards can be set according to the size of the SIM card.

As shown in Figure 16, it is a card six-core card body 60e carrying nine SIM cards, wherein the nine SIM cards are Nai SIM cards 90, wherein the number of SIM cards carried can be determined according to the size of the SIM card And set.

The above description is only illustrative, rather than restrictive, of the present utility model. Those of ordinary skill in the art understand that many modifications, changes or equivalents can be made without departing from the spirit and scope defined in the claims. But all will fall within the protection scope of the present utility model.

Claims (7)

1. A sheet packaging board for molding of a chip package of a chip card, characterized in that, the sheet packaging board comprises: A sheet-shaped carrier layer is provided with a plurality of chip modules arranged at intervals, wherein each smart card chip module also includes: a chip circuit layer pattern formed on the first surface of the sheet-shaped carrier layer; and a Die, which is assembled on the second surface opposite to the first surface and located at the opposite position corresponding to the circuit layer pattern of the chip, so as to conduct conduction with the circuit layer pattern of the corresponding chip through the sheet carrier layer; and At least one plastic encapsulation layer is formed on the second surface of the sheet-shaped carrier layer and integrated with the second surface of the sheet-shaped carrier layer, and holds the crystal grains in each smart card chip module and the corresponding The function of the wafer circuit layer pattern. 2. A chip package for a chip card, which is a chip-type chip base formed by singulation cutting using the sheet packaging board for molding as claimed in claim 1, characterized in that the chip package Include: A chip module, which includes: a chip circuit layer pattern formed on a first surface of a sheet carrier layer; and a crystal grain assembled on a second surface opposite to the first surface and located corresponding to the chip circuit At the relative position of the layer pattern, energy is supplied through the sheet carrier layer to conduct with the corresponding chip circuit layer pattern; and At least one plastic encapsulation layer is formed on the second surface of the sheet-shaped carrier layer and integrated with the second surface of the sheet-shaped carrier layer, and holds the crystal grains in each smart card chip module and the corresponding The connection and function between the chip circuit layer patterns; Wherein the chip package is formed by the at least one plastic packaging layer and combined with the increased thickness on the second surface of the chip carrier layer, so that the chip package has sufficient mechanical strength to be tightly embedded in a In an opening groove provided on the matching chip card body. 3. The chip package according to claim 2, wherein the chip module includes a chip module compatible with a Mini SIM card, a Micro SIM card or a Nano SIM card. 4. The chip package according to claim 2, wherein the chip package includes a chip package compatible with a Mini SIM card, a Micro SIM card or a Nano SIM card. 5. The chip package as claimed in claim 2, wherein the chip card body is a card body having the size of one of a Mini SIM card, a Micro SIM card or a Nano SIM card. 6 . The chip package as claimed in claim 5 , wherein the chip card body is disposed on a rectangular card body with a size of 85.6 mm×53.98 mm. 7 . The chip package as claimed in claim 2 , wherein the chip package is composed of a chip module and at least one plastic packaging layer and has a thickness of 0.3-0.85 mm.