CN112464693B - Fingerprint recognition module and preparation method thereof, and intelligent terminal - Google Patents
Fingerprint recognition module and preparation method thereof, and intelligent terminal Download PDFInfo
- Publication number
- CN112464693B CN112464693B CN201910848279.1A CN201910848279A CN112464693B CN 112464693 B CN112464693 B CN 112464693B CN 201910848279 A CN201910848279 A CN 201910848279A CN 112464693 B CN112464693 B CN 112464693B
- Authority
- CN
- China
- Prior art keywords
- chip sensor
- circuit board
- flexible circuit
- groove
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000002360 preparation method Methods 0.000 title abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 43
- 229910052751 metal Inorganic materials 0.000 claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 229920006351 engineering plastic Polymers 0.000 claims abstract description 14
- 239000000853 adhesive Substances 0.000 claims description 25
- 230000001070 adhesive effect Effects 0.000 claims description 25
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 239000012945 sealing adhesive Substances 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 15
- 239000010408 film Substances 0.000 description 7
- 241000218202 Coptis Species 0.000 description 6
- 235000002991 Coptis groenlandica Nutrition 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- -1 polypropylene Polymers 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
Landscapes
- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
本发明涉及一种指纹识别模组及其制备方法、智能终端，指纹识别模组包括：基底，基底包括本体以及设置在本体内部的金属走线，本体采用工程塑料制备，本体具有第一表面，本体包括至少一个开口于第一表面的凹槽；芯片传感器，芯片传感器和凹槽一一对应，每一凹槽内绑定有一个芯片传感器；柔性电路板，柔性电路板绑定在第一表面的边缘，柔性电路板位于第一表面的区域在垂直方向的投影与芯片传感器相互间隔，金属走线电连接芯片传感器和柔性电路板；采用工程塑料制备的本体在较薄的厚度就能够较好地支撑芯片传感器和柔性电路板；而将芯片传感器绑定在凹槽内相比设置在表面上能够减少绑定后芯片传感器处指纹识别模组的厚度，有利于实现轻薄化。
The present invention relates to a fingerprint recognition module and a preparation method thereof, and an intelligent terminal. The fingerprint recognition module comprises: a substrate, the substrate comprises a body and a metal wiring arranged inside the body, the body is made of engineering plastic, the body has a first surface, and the body comprises at least one groove opening on the first surface; a chip sensor, the chip sensor and the groove correspond to each other, and a chip sensor is bound in each groove; a flexible circuit board, the flexible circuit board is bound to the edge of the first surface, the projection of the area of the flexible circuit board located on the first surface in the vertical direction is spaced from the chip sensor, and the metal wiring electrically connects the chip sensor and the flexible circuit board; the body made of engineering plastic can better support the chip sensor and the flexible circuit board at a relatively thin thickness; and binding the chip sensor in the groove can reduce the thickness of the fingerprint recognition module at the chip sensor after binding compared with arranging it on the surface, which is conducive to achieving lightness and thinness.
Description
Technical Field
The invention relates to the technical field of biological recognition, in particular to a fingerprint recognition module, a preparation method thereof and an intelligent terminal.
Background
In the technical field of biological recognition, fingerprint recognition modules, particularly optical fingerprint recognition modules, are increasingly popular due to the characteristics of strong penetrating power, good light path stability and the like, and in order to facilitate the fingerprint recognition modules to be assembled in the whole intelligent terminal, at present, the fingerprint recognition modules are connected by a circuit before being assembled and then are installed in slots preset in the whole intelligent terminal.
The conventional fingerprint identification module structure mainly comprises a flexible circuit board and a chip sensor bound on the flexible circuit board, and is characterized in that when the fingerprint identification module structure is specifically arranged, the chip sensor 02 is bound on the flexible circuit board 01 through an adhesive layer 04, and is electrically connected with the flexible circuit board 01 through a gold wire 05, the other surface of the flexible circuit board 01 is fixed with a reinforced steel plate 03 through a steel sheet adhesive 06 to improve the supporting strength, the chip sensor 02 is bound on the flexible circuit board 01 through the adhesive layer 04, and is electrically connected with the flexible circuit board 01 through the gold wire 05, and the other surface of the flexible circuit board 01 is fixed with the reinforced steel plate 03 through the adhesive layer 06, so that the supporting strength is improved, the fingerprint identification module is relatively thin, but the fingerprint identification module structure is not thin and good in the first mode and the second mode. Above-mentioned three kinds of fingerprint identification module thickness is all thicker, needs intelligent terminal to reserve great installation space, leads to intelligent terminal's size great, is unfavorable for realizing ultra-thinization to the great fingerprint identification module of thickness can not satisfy the structural design needs of the more intelligent terminal of partial size restriction.
Disclosure of Invention
Based on the above, it is necessary to provide a fingerprint identification module, a manufacturing method thereof and an intelligent terminal, wherein the fingerprint identification module has a smaller thickness, which is beneficial to realizing the light and thin of the intelligent terminal.
A fingerprint identification module, comprising:
the substrate comprises a body and a metal wire arranged in the body, wherein the body is provided with a first surface, and comprises at least one groove which is opened on the first surface;
The chip sensors are in one-to-one correspondence with the grooves, and each groove is internally bound with one chip sensor;
the flexible circuit board is bound to the edge of the first surface, the projection of the area of the flexible circuit board, which is positioned on the first surface, in the vertical direction is mutually spaced from the chip sensor, and the metal wiring is electrically connected with the chip sensor and the flexible circuit board.
The fingerprint identification module comprises a chip sensor, a flexible circuit board, a metal wire, a substrate, a fingerprint module and a flexible circuit board, wherein the chip sensor is bound in the groove, the flexible circuit board is bound at the edge of the first surface, the metal wire in the body is electrically connected with the chip sensor and the flexible circuit board, so that the chip sensor can be connected with an external circuit, the groove is arranged on the first surface of the body, the chip sensor is bound in the groove, the substrate is directly arranged on the surface, the thickness of the fingerprint identification module at the position of the chip sensor after being bound can be reduced, meanwhile, the projection of the area of the flexible circuit board on the first surface in the vertical direction is mutually spaced from the chip sensor, the chip sensor and the flexible circuit board can be arranged separately, the thickness is prevented from being larger due to the superposition of the chip sensor and the flexible circuit board, namely, the whole thickness of the traditional fingerprint module is the thickness of the chip sensor plus the thickness of the substrate or the thickness of the substrate plus the thickness of the substrate.
In one embodiment, the first surface is provided with a first area and a second area arranged around the first area, the groove is opened in the first area, a first connecting end is formed at the groove bottom, and a second connecting end is formed at the second area;
The chip sensor is fixed in the groove and is electrically connected with the first connecting end, and the flexible circuit board is fixed in the second area and is electrically connected with the second connecting end;
Each first connecting end is electrically connected with the second connecting end through the metal wire.
Above-mentioned fingerprint identification module through setting up first link in the tank bottom of recess, and chip sensor fixes in the recess and is connected with first link electricity in order to bind chip sensor in the recess for fingerprint identification module's thickness is less.
In one embodiment, the chip sensor is electrically connected to the first connection end through a gold wire, and the gold wire is fully covered by the first sealing compound. The binding setting mode of chip sensor can have multiple, can realize the electric connection between optical sensor and the first link well through the gold thread, and the first encapsulation of gold thread outside coating can protect the gold thread, improves the stability of electric connection.
In one embodiment, the chip sensor is secured within the recess by a thin film adhesive. The chip sensor is fixed in the groove in various ways, and the chip sensor and the groove can be well fixedly connected by adopting a film adhesive.
In one embodiment, the body has a second surface connected to the first surface, the body further has a notch, the notch is opened in the second area and the second surface, the notch has a third surface parallel to the first surface, the third surface is formed with the second connection end, and the flexible circuit board is fixed on the third surface and electrically connected to the second connection end. The notch is arranged, so that the flexible circuit board can be placed on the body conveniently, the stability of fixed connection between the flexible circuit board and the body is guaranteed, and in addition, the thickness of the fingerprint identification module at the flexible circuit board can be reduced.
In one embodiment, the flexible circuit board is electrically connected with the second connection end through anisotropic conductive adhesive, and the anisotropic conductive adhesive is covered with second sealing adhesive. The mode of electric connection between flexible circuit board and the second link has multiple, and can realize the electric connection between flexible circuit board and the second link betterly through anisotropic conductive adhesive, and cover and have the second to seal the gluey flexible circuit board that can protect at anisotropic conductive adhesive, improve the stability of electric connection.
In one embodiment, the body is an engineering plastic. Because engineering plastics have the advantages of strong rigidity, good mechanical property, strong heat resistance, good electrical insulation property, long-term use in harsh environment and the like, the body prepared from the engineering plastics can better support the chip sensor and the flexible circuit board at a thinner thickness.
In addition, the invention also provides a preparation method of the fingerprint identification module, which comprises the following steps:
Providing a substrate master plate, wherein the substrate master plate comprises a plurality of substrates distributed in an array, each substrate comprises a body and metal wires arranged in the body, the body is prepared from engineering plastics, the body is provided with a first surface, and the body comprises at least one groove which is opened on the first surface;
binding a chip sensor in each groove;
Cutting the substrate master bonded with the chip sensors to form a single-grain structure, wherein the single-grain structure is provided with one substrate and at least one chip sensor;
And binding a flexible circuit board on the edge of the first surface in the single-particle structure, wherein the projection of the area of the flexible circuit board on the first surface in the vertical direction is mutually spaced from the chip sensor, and the metal wire is electrically connected with the chip sensor and the flexible circuit board.
According to the preparation method of the fingerprint identification module, the chip sensors are bound in the grooves on the base mother plate, then the base mother plate after the chip sensors are bound is cut to form the single-particle structures, and finally binding of the flexible circuit board is carried out on each single-particle structure to complete preparation of the fingerprint identification module.
In addition, the invention also provides an intelligent terminal, which comprises a display screen, a middle frame and at least one fingerprint identification module set in the middle frame, wherein the fingerprint identification module set and the display screen are stacked and fixedly connected with the display screen through a bonding layer.
Above-mentioned intelligent terminal, fingerprint identification module inlays and establishes in the center to through glued layer and display screen fixed connection, with the fixed of realizing the relative intelligent terminal of fingerprint identification module, because the thickness of fingerprint identification module is less, consequently, the thickness of the intelligent terminal that has this fingerprint identification module is less, can realize the frivolity of intelligent terminal.
In one embodiment, the intelligent terminal further comprises a lifting layer, wherein the lifting layer is arranged in the second area and located outside the first area. The middle frames with different sizes can be matched through the arrangement of the heightening layer, so that the universality of the fingerprint identification module is improved.
Drawings
FIG. 1 is a schematic diagram of a conventional fingerprint recognition module;
FIG. 2 is a schematic diagram of another structure of a conventional fingerprint recognition module;
FIG. 3 is a schematic diagram of another structure of a conventional fingerprint recognition module;
fig. 4 is a schematic structural diagram of a fingerprint identification module provided by the present invention;
FIG. 5 is an exploded view of the fingerprint recognition module of FIG. 4;
FIG. 6 is a schematic flow chart of a method for manufacturing a fingerprint identification module according to the present invention;
FIG. 7 is a schematic view of the structure of the substrate master provided in FIG. 6;
FIG. 8 is a schematic diagram of a structure of a module formed by binding the substrate master to the chip sensor in FIG. 6;
Fig. 9 is a schematic structural diagram of an intelligent terminal provided by the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
The following describes the technical scheme provided by the embodiment of the invention with reference to the accompanying drawings.
Embodiment one;
Referring to fig. 4 and 5, fig. 4 shows a specific structure of the fingerprint recognition module 10, and fig. 5 shows a connection relationship of each structure in the fingerprint recognition module 10, the fingerprint recognition module 10 includes a substrate 100, a chip sensor 200, and a flexible circuit board 300.
The substrate 100 includes a body 110 and metal wires 120 disposed inside the body 110, where an end of the metal wire 120 may be located on a surface of the body 110 or may be exposed from the surface of the body 110 so as to be electrically connected, the body 110 has a first surface 111, the body 110 includes at least one groove 112 that is open to the first surface 111, and in a specific arrangement, the number of the grooves 112 may be one or more, for any groove 112, one end of the metal wire 120 is led out from the surface of the groove 112 or exposed from the surface of the groove 112, and the other end of the metal wire 120 is led out from the first surface 111 or exposed from the first surface 111;
The chip sensors 200 are bound in the grooves 112, the chip sensors 200 are in one-to-one correspondence with the grooves 112, one chip sensor 200 is bound in each groove 112, and the chip sensors 200 are connected with one end of the metal wire 120;
The flexible circuit board 300 is bound to the edge of the first surface 111, and the projection of the area of the flexible circuit board 300 located on the first surface 111 in the vertical direction is spaced from the chip sensor 200, and the flexible circuit board 300 is connected with the other end of the metal trace 120, so that the metal trace 120 is electrically connected with the chip sensor 200 and the flexible circuit board 300.
The fingerprint identification module 10 is characterized in that the chip sensor 200 is bound in the groove 112, the flexible circuit board 300 is bound at the edge of the first surface 111, the metal wiring 120 in the body 110 is electrically connected with the chip sensor 200 and the flexible circuit board 300, so that the chip sensor 200 can be connected with an external circuit, the groove 112 is arranged on the first surface 111 of the body 110, the thickness of the fingerprint identification module 10 at the position of the chip sensor 200 after binding can be reduced by directly arranging the chip sensor 200 in the groove 112, meanwhile, the flexible circuit board 300 is bound at the edge of the first surface 111, the projection of the area of the flexible circuit board 300 on the first surface 111 in the vertical direction is mutually spaced from the chip sensor 200, the chip sensor 200 and the flexible circuit board 300 can be separately arranged, and the situation that the thickness is larger due to the superposition of the chip sensor 200 and the flexible circuit board 300 is avoided, namely the thickness of the chip sensor is added with the thickness of the substrate, and the thickness of the substrate is added with the thickness of the fingerprint module, and the thickness of the whole fingerprint module is the thickness of the chip sensor 200 or the thickness of the substrate 100 is added with the thickness of the substrate 100, and the fingerprint module is lighter and thinner, and the fingerprint identification module 10 is realized.
With continued reference to fig. 5, in order to facilitate binding of the chip sensor 200 and the flexible circuit board 300, in a preferred embodiment, the first surface 111 has a first region 113 and a second region 114 disposed around the first region 113, the recess 112 is open to the first region 113, one end of the metal trace 120 is led out from the bottom 115 or is exposed to the bottom 115 of the trench, the other end of the metal trace 120 is led out from the second region 114 or is exposed to the second region 114, the bottom 115 of the trench is formed with a first connection end 116, the first connection end 116 is exposed to the bottom 115 of the trench, and the first connection end 116 is electrically connected to one end of the metal trace 120, the second region 114 is formed with a second connection end 117, the second connection end 117 is exposed to the second region 114, and the second connection end 117 is electrically connected to the other end of the metal trace 120;
Each of the first connection terminals 116 and the second connection terminals 117 are electrically connected to the flexible circuit board 300 through the metal trace 120, that is, the second connection terminals 117 are common connection objects of the first connection terminals 116. The chip sensor 200 is fixed in the groove 112 through an adhesive layer, and the chip sensor 200 is electrically connected with the first connecting end 116, the flexible circuit board 300 is fixed in the second area 114, and the golden finger 310 of the flexible circuit board 300 is electrically connected with the second connecting end 117;
In the fingerprint identification module 10, the first connection end 116 is arranged at the bottom 115 of the groove 112, the first connection end 116 is connected with the metal wiring 120, the chip sensor 200 can be conveniently and rapidly bound in the groove 112 by directly connecting the chip sensor 200 with the first connection end 116, and the binding effect is good by adopting the mode of connecting the chip sensor 200 with the first connection end 116 relative to the mode of directly connecting the chip sensor 200 with the metal wiring 120, so that the product yield is high; similarly, by arranging the second connection end 117 in the second area 114, the second connection end 117 is connected with the metal wiring 120, the flexible circuit board 300 can be bound in the second area 114 conveniently and rapidly, and is directly connected with the metal wiring 120 relative to the flexible circuit board 300, the binding effect is good by adopting the mode that the flexible circuit board 300 is connected with the second connection end 117, the product yield is high, meanwhile, since the first area 113 of the second area 114 is arranged, the chip sensor 200 is bound in the groove 112 of the first area 113, the flexible circuit board 300 is bound in the second area 114, the chip sensor 200 and the flexible circuit board 300 are staggered, and the non-stacked arrangement mode can enable the thickness of the fingerprint identification module 10 to be small.
With continued reference to fig. 5, the chip sensor 200 may be disposed in a plurality of binding manners, specifically, the chip sensor 200 is electrically connected to the first connection terminal 116 through the gold wire 400, and the gold wire 400 is fully covered by the first molding compound 500.
The fingerprint identification module 10 described above, the connection between the chip sensor 200 and the first connection terminal 116 may be achieved by the gold wire 400, as a common connection manner, the gold wire 400 may conveniently and rapidly achieve the connection between the chip and the first connection terminal 116, and the connection between the gold wire 400 may ensure the reliability of the electrical connection between the chip sensor 200 and the first connection terminal 116, so that the electrical connection between the optical sensor and the first connection terminal 116 may be better achieved by the gold wire 400. Because the use of fingerprint identification module 10 can unavoidably exist pollution such as steam, probably exists the condition of collision even striking moreover, can protect gold thread 400 through covering first encapsulation 500 on gold thread 400, avoid corroding gold thread 400 such as steam, guarantee the stability of assembly, improve the stability of electricity connection.
There are various ways to fix the chip sensor 200 in the groove 112, and the chip sensor 200 may be fixedly connected by a glue layer, more specifically, the chip sensor 200 is fixed in the groove 112 by a film adhesive 600.
The fingerprint identification module 10 has various fixing modes of the chip sensor 200 in the groove 112, is not limited to the fixing mode of the cementing agent, and can also adopt other fixing connection modes capable of meeting the requirements, the cementing agent can be a film adhesive 600, the film adhesive 600 is used as the cementing agent in the common semiconductor industry, the bonding effect of the film adhesive 600 is good, the fixing connection of the chip sensor 200 and the groove 112 can be better realized by adopting the film adhesive 600 with a thinner thickness, the fixing effect is better, and the product yield is improved.
For convenience of understanding, the fingerprint recognition module in the prior art is compared with the fingerprint recognition module 10 provided in the embodiment of the present invention, the fingerprint recognition module 10 is applicable to the same intelligent terminal, and referring to table 1, the thicknesses of different fingerprint recognition modules 10 are shown in table 1.
As can be seen from table 1, compared with the fingerprint recognition modules in the first and second modes, the thickness of the fingerprint recognition module 10 provided by the embodiment of the invention is reduced by more than 50%, and compared with the fingerprint recognition module in the third mode, the thickness of the fingerprint recognition module 10 provided by the embodiment of the invention is reduced by more than 30%, so that compared with the fingerprint recognition module in the prior art, the thickness of the fingerprint recognition module 10 provided by the embodiment of the invention is obviously reduced. It should be noted that, in table 1, the depth of the groove 112 is set to be 0.03mm, and in the limit case, the depth of the groove 112 is close to 0mm, and the thickness of the fingerprint recognition module 10 is close to 0.263mm, at this time, compared with the fingerprint recognition modules of the first and second modes, the thickness of the fingerprint recognition module 10 provided by the embodiment of the invention is reduced by more than 40%, and compared with the fingerprint recognition module of the third mode, the thickness of the fingerprint recognition module 10 provided by the embodiment of the invention is reduced by more than 20%, therefore, compared with the fingerprint recognition module of the prior art, the thickness of the fingerprint recognition module 10 provided by the embodiment of the invention is obviously reduced even when the depth of the groove 112 is smaller, and the thickness of the fingerprint recognition module 10 can be controlled by changing the depth of the groove 112, and the specific depth of the groove 112 is selected according to the actual condition of the fingerprint recognition module 10.
With continued reference to fig. 5, the flexible circuit board 300 may be disposed in a plurality of binding manners, specifically, the body 110 has a second surface 118 connected to the first surface 111, the body 110 further has a notch 130, the notch 130 is opened on the second area 114 and the second surface 118, the notch 130 has a third surface 119 parallel to the first surface 111, the metal trace 120 is led out of the second area 114 or exposed out of the second area 114, a second connection terminal 117 is formed on the third surface 119, the second connection terminal 117 is electrically connected with the metal trace 120, the flexible circuit board 300 is fixed on the third surface 119, and the golden finger 310 of the flexible circuit board 300 is electrically connected with the second connection terminal 117.
The fingerprint identification module 10, the flexible circuit board 300 is placed on the body 110, the golden finger 310 of the flexible circuit board 300 is placed on the third surface 119, the notch 130 is arranged to facilitate placement of a flexible circuit, and the flexible circuit board 300 can be positioned, so that the golden finger 310 of the flexible circuit board 300 can be matched with the second connecting end 117 well, meanwhile, stability of fixed connection between the flexible circuit board 300 and the body 110 is ensured, in addition, the thickness of the stacked arrangement of the flexible circuit board 300 and the substrate 100 is reduced due to the arrangement of the notch 130, and accordingly the thickness of the fingerprint identification module 10 at the position of the flexible circuit board 300 can be reduced.
With continued reference to fig. 5, there are various ways of electrically connecting the flexible circuit board 300 and the second connection terminal 117, and more specifically, the flexible circuit board 300 is electrically connected to the second connection terminal 117 through the anisotropic conductive adhesive 700, and the anisotropic conductive adhesive 700 is covered with the second sealing adhesive 800.
Above-mentioned fingerprint identification module 10, the electric connection between flexible circuit board 300 and the second link 117 can be realized through anisotropic conductive adhesive 700, as special conductive adhesive, anisotropic conductive adhesive 700 can make two closely conductive connection points can not produce the short circuit between the circuit, thereby guarantee the stability of electric connection, and can conveniently and rapidly realize the electric connection between flexible circuit board 300 and the second link 117, consequently, can realize the electric connection between flexible circuit board 300 and the second link 117 better through anisotropic conductive adhesive 700, because the unavoidable pollution such as steam that can exist in the use of fingerprint identification module 10, and probably there is the condition of collision even striking, through covering the golden finger 310 that has second seal 800 to protect flexible circuit board 300 on anisotropic conductive adhesive 700, avoid corroding golden finger 310 such as steam, protect flexible circuit board 300, guarantee the stability of assembly, improve the stability of electric connection.
In a preferred embodiment, the body 110 is an engineering plastic. Because engineering plastics have the advantages of strong rigidity, good mechanical properties, strong heat resistance, good electrical insulation properties, long-term use in harsh environments, etc., the body 110 made of engineering plastics can better support the chip sensor 200 and the flexible circuit board 300 at a thinner thickness.
In some preferred embodiments, the engineering plastic may be a high molecular polypropylene.
The fingerprint identification module 10 is used as a common engineering material, the body 110 made of high-molecular polypropylene has the advantages of strong rigidity, good mechanical property, good electrical insulation property, long-term use in harsh environments and the like, so that the body 110 can better support the chip sensor 200 and the flexible circuit board 300 with a smaller thickness, the engineering plastic can be high-molecular polypropylene, and can also be other materials capable of meeting requirements, such as PE (polyethylene), PVC (polyvinyl chloride), ABS (acrylonitrile butadiene styrene) and the like, and when the fingerprint identification module is specifically arranged, the specific engineering material for preparing the body 110 is selected according to the mechanical properties and corresponding cost of various materials.
Embodiment two;
Based on the first embodiment, the second embodiment of the present invention further provides a method for preparing a fingerprint identification module 10, which is used for preparing the fingerprint identification module 10 of the first embodiment, the method for preparing the fingerprint identification module 10 is shown in fig. 6, fig. 6 shows a flow for preparing the fingerprint identification module 10, and the method for preparing the fingerprint identification module 10 includes:
in step S601, as shown in fig. 7, a substrate master 20 is provided.
The substrate master 20 includes a plurality of substrates 100 distributed in an array, and in particular, in order to facilitate subsequent dicing, a channel may be disposed between two adjacent substrates 100, each substrate 100 includes a body 110 and a metal trace 120 disposed inside the body 110, the body 110 is made of engineering plastic, the body 110 has a first surface 111, and the body 110 includes at least one groove 112 opened on the first surface 111;
Step S602, as shown in FIG. 8, binding a chip sensor 200 in each groove 112, fixing the chip sensor 200 in the groove 112 by a film adhesive 600, and electrically connecting the chip sensor 200 with the metal wires 120 in the body by gold wires 400, wherein the outer sides of the metal wires 120 are coated with a first sealing adhesive 600;
Step S603, cutting the substrate master 20 bound with the chip sensors 200 along the channels to form a single-grain structure having one substrate 100 and at least one chip sensor 200;
In step S604, the flexible circuit board 300 is bonded to the edge of the first surface 111 in the single-particle structure, and the metal traces 120 electrically connect the chip sensor 200 and the flexible circuit board 300.
The preparation method of the fingerprint identification module 10 comprises the steps of firstly binding a chip sensor 200 in a groove 112 on a substrate mother board 20 provided in the step S601, connecting the chip sensor 200 with one end of a metal wiring 120, then cutting the substrate mother board 20 after binding of the chip sensor 200 to form a single-grain structure in the step S603, wherein each single-grain structure is provided with one substrate 100 and at least one chip sensor 200, finally binding a flexible circuit board 300 to the edge of a first surface 111 in the single-grain structure in the step S604, and connecting the flexible circuit board 300 with the other end of the metal wiring 120, thereby realizing that the metal wiring 120 is electrically connected with the chip sensor 200 and the flexible circuit board 300 so as to complete the preparation of the fingerprint identification module 10.
Embodiment three;
In addition, the present invention further provides an intelligent terminal, where the fingerprint recognition module 10 provided in the foregoing embodiment may be used in various intelligent terminals, the intelligent terminal may be a smart phone, a smart bracelet, etc., as shown in fig. 9, and fig. 9 shows a specific structure of the intelligent terminal, where the intelligent terminal includes a display screen 30 and a middle frame 40, the display screen 30 may be an OLED (Organic Light-Emitting Diode) display screen 30, and may also be other display screens 30, and the intelligent terminal further includes at least one fingerprint recognition module 10 according to any one of the foregoing embodiments, where the fingerprint recognition module 10 is disposed in the middle frame 40, and the fingerprint recognition module 10 is fixedly connected to the display screen 30 through an adhesive layer 50.
Above-mentioned intelligent terminal, this glued layer 50 can be the double faced adhesive tape, also can be other adhesive that can satisfy the requirement, when specifically setting up, can inlay fingerprint identification module 10 and establish in center 40 to through glued layer 50 and display screen 30 fixed connection, with the fixed of realizing fingerprint identification module 10 relative intelligent terminal, because the thickness of fingerprint identification module 10 is less, consequently, the thickness of intelligent terminal that has this fingerprint identification module 10 is less, can realize the frivolousization of intelligent terminal, has practiced thrift the complete machine space. When specifically setting up, can also splice a plurality of fingerprint identification modules 10, form the ultra-thin fingerprint identification module 10 of large tracts of land to improve intelligent terminal's fingerprint identification effect.
To accommodate the different sizes of the middle frame 40, as shown in fig. 9, the smart terminal further includes a raised layer 60, where the raised layer 60 is disposed at the second area 114 and outside the first area 113.
According to the intelligent terminal, the thickness and the position of the heightening layer 60 are adjusted to enable the fingerprint identification module 10 to be matched with the middle frames 40 with different sizes, so that the universality of the fingerprint identification module 10 is improved, when the intelligent terminal is specifically arranged, the heightening layer 60 is arranged in the second area 114 and is positioned on the outer side of the first area 113, the influence of the heightening layer 60 on the chip sensor 200 and the flexible circuit board 300 is avoided, the heightening layer 60 can be a gasket or a plurality of gaskets, adjacent gaskets are fixed through adhesives, and the thickness of the heightening layer 60 can be determined according to the actual condition of the intelligent terminal.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910848279.1A CN112464693B (en) | 2019-09-09 | 2019-09-09 | Fingerprint recognition module and preparation method thereof, and intelligent terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910848279.1A CN112464693B (en) | 2019-09-09 | 2019-09-09 | Fingerprint recognition module and preparation method thereof, and intelligent terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112464693A CN112464693A (en) | 2021-03-09 |
| CN112464693B true CN112464693B (en) | 2025-03-21 |
Family
ID=74807368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910848279.1A Active CN112464693B (en) | 2019-09-09 | 2019-09-09 | Fingerprint recognition module and preparation method thereof, and intelligent terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112464693B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113642458B (en) * | 2021-08-12 | 2023-07-07 | 业成科技（成都）有限公司 | Fingerprint identification sensor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106991383A (en) * | 2017-03-13 | 2017-07-28 | 广东欧珀移动通信有限公司 | Fingerprint module, display screen and mobile terminal |
| CN109075141A (en) * | 2018-07-26 | 2018-12-21 | 深圳市汇顶科技股份有限公司 | Chip-packaging structure, method and terminal device |
| CN109154986A (en) * | 2017-05-01 | 2019-01-04 | 深圳市汇顶科技股份有限公司 | Ultrasonic fingerprint induction and sensor manufacture |
| CN110071994A (en) * | 2019-04-25 | 2019-07-30 | Oppo广东移动通信有限公司 | Electronic device |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104217198A (en) * | 2014-08-26 | 2014-12-17 | 南昌欧菲生物识别技术有限公司 | Fingerprint identifying device and terminal apparatus |
| CN105608406B (en) * | 2014-11-20 | 2019-05-28 | 上海箩箕技术有限公司 | Fingerprint sensor |
| CN105512645A (en) * | 2016-01-19 | 2016-04-20 | 上海箩箕技术有限公司 | Optical fingerprint sensor module |
| US10551951B2 (en) * | 2016-08-16 | 2020-02-04 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Input assembly with fingerprint identification chip arranged between a touch panel and flexible circuit board |
| CN206249351U (en) * | 2016-12-09 | 2017-06-13 | 信利光电股份有限公司 | A kind of novel finger print recognizes module and electronic equipment |
| CN107066946B (en) * | 2017-03-13 | 2019-10-01 | Oppo广东移动通信有限公司 | Fingerprint mould group, display screen and mobile terminal |
| CN206788883U (en) * | 2017-04-10 | 2017-12-22 | 信利光电股份有限公司 | A kind of fingerprint recognition module and terminal device |
| EP3438798B1 (en) * | 2017-05-05 | 2020-08-19 | Shenzhen Goodix Technology Co., Ltd. | Fingerprint module and mobile terminal |
| CN109117728A (en) * | 2018-07-11 | 2019-01-01 | 维沃移动通信有限公司 | A kind of fingerprint recognition mould group and mobile terminal |
| EP3699809A4 (en) * | 2018-12-29 | 2020-11-04 | Shenzhen Goodix Technology Co., Ltd. | Fingerprint identification device and electronic device |
-
2019
- 2019-09-09 CN CN201910848279.1A patent/CN112464693B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106991383A (en) * | 2017-03-13 | 2017-07-28 | 广东欧珀移动通信有限公司 | Fingerprint module, display screen and mobile terminal |
| CN109154986A (en) * | 2017-05-01 | 2019-01-04 | 深圳市汇顶科技股份有限公司 | Ultrasonic fingerprint induction and sensor manufacture |
| CN109075141A (en) * | 2018-07-26 | 2018-12-21 | 深圳市汇顶科技股份有限公司 | Chip-packaging structure, method and terminal device |
| CN110071994A (en) * | 2019-04-25 | 2019-07-30 | Oppo广东移动通信有限公司 | Electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112464693A (en) | 2021-03-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11114426B2 (en) | Bendable panel and method of fabricating same | |
| CN111966241B (en) | Touch display device | |
| TW200638520A (en) | Multilevel semiconductor module and method for fabricating the same | |
| US9056765B2 (en) | Semiconductor package and manufacturing method thereof | |
| CN109460731B (en) | Display device and fingerprint module attaching method | |
| US20090084432A1 (en) | Injection-molded housing of plastic for taking up electrical and/or electronic built-in components or installed devices | |
| CN111128022B (en) | Display panel, preparation method thereof and display device | |
| CN110597416B (en) | Flexible circuit board, touch display panel and touch display device | |
| JP2016110858A (en) | Planar light emission module | |
| CN112464693B (en) | Fingerprint recognition module and preparation method thereof, and intelligent terminal | |
| CN112331639A (en) | Substrate for manufacturing LED light source, manufacturing method and LED light source assembly | |
| CN113506818A (en) | Electronic device and method for manufacturing the same | |
| US8217507B1 (en) | Edge mount semiconductor package | |
| CN111653212A (en) | Miniature light-emitting diode display panel, manufacturing method thereof, and display device | |
| CN217819122U (en) | Pressure sensor, circuit board and consumer electronics | |
| CN106505121A (en) | Solar cell module | |
| CN213693794U (en) | Display components and mobile terminals | |
| WO2013132815A1 (en) | Module with embedded electronic components, electronic device, and method for manufacturing module with embedded electronic components | |
| CN210778599U (en) | Luminous biological identification chip packaging structure | |
| US9516742B2 (en) | Electric device | |
| US20210111109A1 (en) | Flat no-lead package with surface mounted structure | |
| CN109117695A (en) | Fingerprint mould group and electronic equipment equipped with the fingerprint mould group | |
| CN106790843A (en) | Horn assembly and mobile terminal | |
| CN221529397U (en) | Flexible display module and display device | |
| CN110188677B (en) | Fingerprint module and mobile terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| CB02 | Change of applicant information |
Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330029 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Country or region after: China Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Oufei Microelectronics (Nanchang) Co.,Ltd. Address before: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant before: Jiangxi OMS Microelectronics Co.,Ltd. Country or region before: China |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |