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TW201518665A - Heating and pressurizing treatment oven for manufacturing electronic devices - Google Patents

Heating and pressurizing treatment oven for manufacturing electronic devices Download PDF

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Publication number
TW201518665A
TW201518665A TW102140932A TW102140932A TW201518665A TW 201518665 A TW201518665 A TW 201518665A TW 102140932 A TW102140932 A TW 102140932A TW 102140932 A TW102140932 A TW 102140932A TW 201518665 A TW201518665 A TW 201518665A
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pressure
accommodating space
heating
space
outer layer
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TW102140932A
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Chinese (zh)
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TWI524045B (en
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Shu-Hui Hung
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Ablego Technology Co Ltd
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Publication of TWI524045B publication Critical patent/TWI524045B/en

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Abstract

This invention relates to a heating and pressurizing treatment oven for manufacturing electronic devices. The heating and pressurizing treatment oven includes: a chamber having inner walls configured to form an accommodating space; at least one heating device provided in the accommodating space, and configured to modulate the temperature in the accommodating space to a predetermined temperature; a pressurizing device configured to modulate the pressure in the accommodating space to a predetermined pressure which is more than 1 atm; at least one thermal insulation liner including an outer layer and an inner layer, wherein the outer layer is provided on the inner walls of the chamber, and the inner layer is provided toward the interior of the accommodating space with respect to the outer layer, to form an enclosed thermal insulation space between the outer layer and the inner layer, and wherein the gap between the outer layer and the inner layer is more than 1 [mu]m; and a fan provided in the accommodating space, and connected to a driving motor via a transmission shaft extending out of the chamber.

Description

用於製造電子元件的加熱與加壓處理爐 Heating and pressure treatment furnace for manufacturing electronic components

本發明係關於一種用於製造電子元件的加熱與加壓處理爐。 The present invention relates to a heating and pressurizing furnace for manufacturing electronic components.

在製造電子元件的過程中經常會使用到具有加熱與加壓功能的處理爐。此處理爐之腔體一般可由不銹鋼所製成。為了安全考量(例如防爆),此處理爐之腔體的厚度必須符合法律所規範的厚度範圍,故此厚度往往比一般不具有加熱與加壓功能之處理爐的厚度更厚。在具有此種厚度的情況下,於處理爐的升溫期間,大部分所提供的熱可能會被處理爐的腔體所吸收,直到處理爐之腔體的吸熱達到平衡之後,後續所提供的熱才會對腔體內部進行加熱,因此導致處理爐的升溫速率變慢;相反地,於處理爐的降溫期間,處理爐的腔體會持續放熱,直到處理爐之腔體的放熱達到平衡之後,才會對腔體內部進行冷卻,因此導致處理爐的降溫速率變慢。因此,亟需一種用於製造電子元件的加熱與加壓處理爐,此處理爐能夠在不改變其腔體厚度的情況下增加升溫與降溫速率。 A processing furnace having a heating and pressurizing function is often used in the process of manufacturing electronic components. The chamber of the furnace is generally made of stainless steel. For safety reasons (eg, explosion proof), the thickness of the chamber of the furnace must conform to the thickness range specified by law, so the thickness tends to be thicker than the thickness of a furnace that generally does not have a heating and pressurizing function. In the case of such a thickness, during the temperature rise of the treatment furnace, most of the supplied heat may be absorbed by the cavity of the treatment furnace until the heat absorption of the cavity of the treatment furnace reaches equilibrium, and the subsequent heat is supplied. The inside of the cavity is heated, thus causing the heating rate of the processing furnace to be slowed down; conversely, during the cooling of the processing furnace, the cavity of the processing furnace is continuously exothermic until the heat release of the cavity of the processing furnace reaches equilibrium. The inside of the chamber is cooled, which results in a slower rate of cooling of the furnace. Therefore, there is a need for a heating and pressurizing furnace for manufacturing electronic components that can increase the rate of temperature rise and fall without changing the thickness of the cavity.

為解決上述問題,依照本發明之一實施例,提供一種用於製造電子元件的加熱與加壓處理爐,包含:一腔體,具有用以形成一容置空間的內壁;至少一加熱裝置,設置在該容置空間中,並且用以將該容置空間內的溫度調變至一預定溫度;一加壓裝置,用以將該容置空間內的壓力調變至大於1 atm(1大氣壓力)的一預定壓力;至少一隔熱襯層,包含一外層以及一內層,其中該外層係設置於該腔體的該內壁上,以及該內層係相對於該外層而往該容置空間內部設置,以在該外層與該內層之間形成一圍閉隔熱空間(enclosed thermal insulation space),以及其中該外層與該內層之間的間距係大於1 μm,該內層的厚度係小於與該隔熱襯層相對應之該腔體部分的厚度,該隔熱襯層設有用以使該圍閉隔熱空間與該容置空間連通的至少兩個通孔,以使該圍閉隔熱空間內之壓力與該容置空間內之壓力實質相同,藉以防止該隔熱襯層在該容置空間內之壓力改變時產生變形;以及一風扇,設置在該容置空間中,並且經由凸伸出該腔體的一傳動軸而連接至一驅動馬達,透過該驅動馬達驅動該風扇轉動,以促進該加熱裝置對該容置空間的溫度調變效率。 In order to solve the above problems, according to an embodiment of the present invention, a heating and pressure treatment furnace for manufacturing an electronic component is provided, comprising: a cavity having an inner wall for forming an accommodation space; and at least one heating device Provided in the accommodating space, and used to modulate the temperature in the accommodating space to a predetermined temperature; a pressing device for adjusting the pressure in the accommodating space to be greater than 1 a predetermined pressure of atm (at atmospheric pressure); at least one thermal insulation liner comprising an outer layer and an inner layer, wherein the outer layer is disposed on the inner wall of the cavity, and the inner layer is opposite to the outer layer And disposed inside the accommodating space to form an enclosed thermal insulation space between the outer layer and the inner layer, and wherein a distance between the outer layer and the inner layer is greater than 1 μm, The thickness of the inner layer is smaller than the thickness of the cavity portion corresponding to the thermal insulation lining, and the thermal insulation lining is provided with at least two through holes for communicating the enclosed thermal insulation space with the accommodating space. So that the pressure in the enclosed heat insulating space is substantially the same as the pressure in the accommodating space, thereby preventing deformation of the heat insulating lining layer when the pressure in the accommodating space is changed; and a fan disposed at the The accommodating space is connected to a driving motor via a transmission shaft protruding from the cavity, and the fan is driven to rotate by the driving motor to promote the temperature modulation efficiency of the heating device to the accommodating space.

依照本發明之另一實施例,提供一種用於製造電子元件的加熱與加壓處理爐,包含:一腔體,具有用以形成一容置空間的內壁;至少一加熱裝置,設置在該容置空間中,並且用以將該容置空間內的溫度調變至一預定溫度;至少一隔熱襯層,包含一外層以及一內層,其中該外層係設置於該腔體的該內壁上,以及該內層係相對於該外層而往該容置空間內部設置,以在該外層與該內層之間形成一圍閉隔熱空間,以及其中該外層與該內層之間的間距係大於1 μm,該內層的厚度係小於與該隔熱襯層相對應之該腔體部分的厚度,該隔熱襯層設有至少一個第一通孔;一加壓裝置,用以將該容置空間內的壓力調變至大於1 atm的一預定壓力,並且透過該隔熱襯層的該至少一個第一通孔,將該隔熱襯層之該圍閉隔熱空間內的壓力調變至與該容置空間內之壓力實質相同的一壓力,藉以防止該隔熱襯層在該容置空間內之壓力改變時產生變形;以及一風扇,設置在該容置空間中,並且經由凸伸出該腔體的一傳動軸而連接至一驅動馬達,透過該驅動馬達驅動該風扇轉動,以促進該加熱裝置對該容置空間的溫度調變效率。 According to another embodiment of the present invention, there is provided a heating and pressure processing furnace for manufacturing an electronic component, comprising: a cavity having an inner wall for forming an accommodating space; at least one heating device disposed at the The accommodating space is configured to modulate the temperature in the accommodating space to a predetermined temperature; the at least one thermal insulation lining comprises an outer layer and an inner layer, wherein the outer layer is disposed in the cavity a wall, and the inner layer is disposed inside the accommodating space with respect to the outer layer to form a closed insulating space between the outer layer and the inner layer, and wherein the outer layer and the inner layer are The spacing is greater than 1 μm, the thickness of the inner layer is less than the thickness of the cavity portion corresponding to the thermal insulation lining, the thermal insulation lining is provided with at least one first through hole; Adjusting the pressure in the accommodating space to a predetermined pressure greater than 1 atm, and passing through the at least one first through hole of the thermal insulation lining, enclosing the thermal insulation lining in the insulated space The pressure is adjusted to be substantially the same as the pressure in the accommodating space a pressure for preventing deformation of the thermal insulation lining when the pressure in the accommodating space is changed; and a fan disposed in the accommodating space and connected to the one via a transmission shaft protruding from the cavity The driving motor drives the fan to rotate through the driving motor to promote the temperature modulation efficiency of the heating device to the accommodating space.

依照本發明之又另一實施例,提供一種用於製造電子元件的加熱與加壓處理爐,包含:一腔體,具有用以形成一容置空間的內壁;至少一加熱裝置,設置在該容置空間中,並且用以將該容置空間內的溫度調變至一預定溫度;一第一加壓裝置,用以將該容置空間內的壓力調變至大於1 atm的 一預定壓力;至少一隔熱襯層,包含一外層以及一內層,其中該外層係設置於該腔體的該內壁上,以及該內層係相對於該外層而往該容置空間內部設置,以在該外層與該內層之間形成一圍閉隔熱空間,以及其中該外層與該內層之間的間距係大於1 μm,該內層的厚度係小於與該隔熱襯層相對應之該腔體部分的厚度,該隔熱襯層設有至少一個第一通孔;一第二加壓裝置,透過該至少一個第一通孔,將該圍閉隔熱空間內的壓力調變至與該容置空間內之壓力實質相同的一壓力,藉以防止該隔熱襯層在該容置空間內之壓力改變時產生變形;以及一風扇,設置在該容置空間中,並且經由凸伸出該腔體的一傳動軸而連接至一驅動馬達,透過該驅動馬達驅動該風扇轉動,以促進該加熱裝置對該容置空間的溫度調變效率。 According to still another embodiment of the present invention, there is provided a heating and pressure treatment furnace for manufacturing an electronic component, comprising: a cavity having an inner wall for forming an accommodation space; at least one heating device disposed at The accommodating space is configured to modulate the temperature in the accommodating space to a predetermined temperature; a first pressing device for adjusting the pressure in the accommodating space to be greater than 1 atm a predetermined pressure; at least one thermal insulation lining comprising an outer layer and an inner layer, wherein the outer layer is disposed on the inner wall of the cavity, and the inner layer is opposite to the outer space of the accommodating space Providing a closed insulating space between the outer layer and the inner layer, and wherein a spacing between the outer layer and the inner layer is greater than 1 μm, the inner layer having a thickness less than the thermal insulation liner Corresponding to the thickness of the cavity portion, the thermal insulation lining is provided with at least one first through hole; and a second pressing device transmits the pressure in the enclosed thermal insulation space through the at least one first through hole Modulating to a pressure substantially the same as the pressure in the accommodating space, thereby preventing the thermal insulation lining from being deformed when the pressure in the accommodating space is changed; and a fan disposed in the accommodating space, and Connected to a drive motor via a drive shaft protruding from the cavity, the fan is driven to rotate by the drive motor to promote temperature modulation efficiency of the heating device to the accommodating space.

本發明之其他實施樣態以及優點可從以下與用以例示本發明原理範例之隨附圖式相結合的詳細說明而更顯明白。此外,為了不對本發明造成不必要的混淆,在本說明書中將不再贅述為人所熟知的元件與原理。 Other embodiments and advantages of the present invention will become more apparent from the detailed description of the accompanying drawings. In addition, elements and principles that are well known will not be described in the present specification in order to avoid obscuring the present invention.

在本發明之隨附圖式中,相同的元件係以相同的參考符號加以表示。 In the accompanying drawings, the same elements are denoted by the same reference numerals.

1‧‧‧加熱與加壓處理爐 1‧‧‧heating and pressure treatment furnace

1a‧‧‧內壁 1a‧‧‧ inner wall

3‧‧‧筒身 3‧‧‧

5‧‧‧門 5‧‧‧

7‧‧‧容置空間 7‧‧‧ accommodating space

9‧‧‧隔熱襯層 9‧‧‧Insulation lining

9'‧‧‧隔熱襯層 9'‧‧‧Insulation lining

11‧‧‧加熱裝置 11‧‧‧ heating device

13‧‧‧加壓裝置 13‧‧‧Pressure device

15‧‧‧風扇 15‧‧‧fan

17‧‧‧傳動軸 17‧‧‧Drive shaft

19‧‧‧驅動馬達 19‧‧‧Drive motor

20‧‧‧開口 20‧‧‧ openings

21‧‧‧開口 21‧‧‧ openings

22‧‧‧開口 22‧‧‧ openings

23‧‧‧控制閥 23‧‧‧Control valve

25‧‧‧微粒偵測器 25‧‧‧Particle detector

27‧‧‧第一加壓裝置 27‧‧‧First pressurizing device

29‧‧‧第二加壓裝置 29‧‧‧Second pressurizing device

31‧‧‧分隔件 31‧‧‧Parts

91‧‧‧中段隔熱襯層 91‧‧‧ Middle insulation lining

91a‧‧‧外層 91a‧‧‧ outer layer

91b‧‧‧內層 91b‧‧‧ inner layer

91c‧‧‧通孔 91c‧‧‧through hole

91'‧‧‧中段隔熱襯層 91'‧‧‧ Middle insulation lining

92‧‧‧前段隔熱襯層 92‧‧‧ Front insulation lining

92a‧‧‧外層 92a‧‧‧ outer layer

92b‧‧‧內層 92b‧‧‧ inner layer

92'‧‧‧前段隔熱襯層 92'‧‧‧ front insulation lining

93‧‧‧後段隔熱襯層 93‧‧‧After thermal insulation lining

93a‧‧‧外層 93a‧‧‧ outer layer

93b‧‧‧內層 93b‧‧‧ inner layer

93c‧‧‧開口 93c‧‧‧ openings

93'‧‧‧後段隔熱襯層 93'‧‧‧After thermal insulation lining

94‧‧‧第一通孔 94‧‧‧First through hole

95‧‧‧第二通孔 95‧‧‧Second through hole

100‧‧‧加熱與加壓處理爐 100‧‧‧heating and pressure treatment furnace

200‧‧‧加熱與加壓處理爐 200‧‧‧heating and pressure treatment furnace

G1‧‧‧間距 G1‧‧‧ spacing

G2‧‧‧間距 G2‧‧‧ spacing

G3‧‧‧間距 G3‧‧‧ spacing

S1‧‧‧圍閉隔熱空間 S1‧‧‧Enclosed insulation space

S2‧‧‧圍閉隔熱空間 S2‧‧‧Enclosed insulation space

S3‧‧‧圍閉隔熱空間 S3‧‧‧Enclosed insulation space

圖1顯示依照本發明之一實施例之用於製造電子元件之加熱與加壓處理爐的立體圖;圖2顯示圖1之加熱與加壓處理爐的前視圖;圖3顯示沿著圖2之A-A線的橫剖面圖;圖4顯示圖3之橫剖面的簡化視圖,於其中說明各隔熱襯層的位置;圖5顯示圖4中之隔熱襯層的立體分解圖;圖6顯示圖4之範圍B的放大視圖;圖7顯示圖4之範圍C的放大視圖;圖8顯示圖4之範圍D的放大視圖;圖9A顯示圖5中之中段隔熱襯層的前視圖;圖9B顯示圖9A之範圍E的放大視圖;圖10顯示依照本發明之另一實施例之用於製造電子元件之加熱與加壓處理爐的橫剖面圖;圖11顯示依照本發明之又另一實施例之用於製造電子元件之加熱與加 壓處理爐的橫剖面圖;圖12顯示包含分隔件之圖4之範圍B的放大視圖;圖13顯示包含分隔件之圖4之範圍C的放大視圖;及圖14顯示包含分隔件之圖4之範圍D的放大視圖。 1 is a perspective view showing a heating and pressure treatment furnace for manufacturing an electronic component according to an embodiment of the present invention; FIG. 2 is a front view of the heating and pressure treatment furnace of FIG. 1; A cross-sectional view of the AA line; FIG. 4 is a simplified view of the cross section of FIG. 3, illustrating the position of each of the thermal insulation linings; FIG. 5 is an exploded perspective view of the thermal insulation lining of FIG. 4; 4 is an enlarged view of the range B; FIG. 7 shows an enlarged view of the range C of FIG. 4; FIG. 8 shows an enlarged view of the range D of FIG. 4; FIG. 9A shows a front view of the intermediate insulating liner of FIG. 5; An enlarged view of a range E of FIG. 9A is shown; FIG. 10 is a cross-sectional view showing a heating and pressurizing furnace for manufacturing an electronic component according to another embodiment of the present invention; and FIG. 11 is a view showing still another embodiment of the present invention. For example, heating and adding of electronic components Cross-sectional view of the pressure treating furnace; Fig. 12 shows an enlarged view of the range B of Fig. 4 including the partition; Fig. 13 shows an enlarged view of the range C of Fig. 4 including the partition; and Fig. 14 shows Fig. 4 including the partition An enlarged view of the range D.

依照本發明之一實施例,圖1顯示用於製造電子元件之加熱與加壓處理爐1的立體圖,圖2顯示圖1之加熱與加壓處理爐1的前視圖,以及圖3顯示沿著圖2之A-A線的橫剖面圖。如圖1-3所示,加熱與加壓處理爐1包含筒身3與門5。門5能夠以可動方式進行開啟與關閉。門5與筒身3可形成一腔體,此腔體具有用以形成容置空間7的內壁1a。此外,加熱與加壓處理爐1可包含:加熱裝置11,設置在容置空間7中,並且用以將容置空間7內的溫度調變至一預定溫度;加壓裝置13,用以將容置空間7內的壓力調變至大於1 atm的一預定壓力;以及風扇15,設置在容置空間7中,並且經由凸伸出此腔體的傳動軸17而連接至驅動馬達19,透過驅動馬達19驅動風扇15轉動,以促進加熱裝置11對容置空間7的溫度調變效率。筒身3以及門5可例如由不銹鋼等材料所製成。 1 shows a perspective view of a heating and pressurizing furnace 1 for manufacturing electronic components, FIG. 2 shows a front view of the heating and pressurizing furnace 1 of FIG. 1, and FIG. 3 shows along the front view of FIG. Figure 2 is a cross-sectional view taken along line AA. As shown in FIGS. 1-3, the heating and pressurizing furnace 1 includes a barrel 3 and a door 5. The door 5 can be opened and closed in a movable manner. The door 5 and the barrel 3 can form a cavity having an inner wall 1a for forming the accommodating space 7. In addition, the heating and pressure treatment furnace 1 may include: a heating device 11 disposed in the accommodating space 7 and configured to modulate the temperature in the accommodating space 7 to a predetermined temperature; and a pressurizing device 13 for The pressure in the accommodating space 7 is adjusted to a predetermined pressure greater than 1 atm; and the fan 15 is disposed in the accommodating space 7 and connected to the driving motor 19 via the transmission shaft 17 protruding from the cavity, through The drive motor 19 drives the fan 15 to rotate to promote the temperature modulation efficiency of the heating device 11 with respect to the accommodating space 7. The barrel 3 and the door 5 may be made of, for example, a material such as stainless steel.

在本發明之一實施例中,筒身3可例如具有圓柱形的形狀,但本發明並不限於此。此外,雖然在圖3中顯示3個加熱裝置11,但實際上加熱與加壓處理爐1可僅包含1個或2個加熱裝置11或者包含3個以上的加熱裝置11(例如4個、5個、6個加熱裝置11等等),且加熱裝置11的排列方式亦不限於圖3所示之排列方式,只要使加熱裝置11能夠對容置空間7內的溫度進行均勻調變即可。在本發明之實施例中,加熱裝置11可例如為加熱器,以及加壓裝置13可例如為加壓幫浦。 In an embodiment of the invention, the barrel 3 may have, for example, a cylindrical shape, but the invention is not limited thereto. Further, although three heating devices 11 are shown in FIG. 3, the heating and pressure treatment furnace 1 may include only one or two heating devices 11 or three or more heating devices 11 (for example, four or five). The arrangement of the heating means 11 and the arrangement of the heating means 11 are not limited to the arrangement shown in FIG. 3, as long as the heating means 11 can uniformly modulate the temperature in the accommodating space 7. In an embodiment of the invention, the heating device 11 may for example be a heater, and the pressing device 13 may for example be a pressurized pump.

加熱與加壓處理爐1可包含隔熱襯層9。為說明之目的,在本發明之圖式中顯示隔熱襯層9可包含前段隔熱襯層92、中段隔熱襯層91、以及後段隔熱襯層93,但本發明並不限於此,亦即,雖然在本發明之圖式中顯示隔熱襯層9包含3個區段(即,前段隔熱襯層92、中段隔熱襯層91、以及後段隔熱襯層93),但實際上隔熱襯層9可僅包含1個或2個區段或者包含3個 以上的區段(例如4個、5個、6個區段等等)。 The heating and pressurizing treatment furnace 1 may comprise a thermal insulation lining 9. For purposes of illustration, the thermal insulation liner 9 is shown in the drawings of the present invention to include a front insulation liner 92, a mid-section insulation liner 91, and a rear insulation liner 93, although the invention is not limited thereto. That is, although the heat insulating lining 9 is shown in the drawings of the present invention to include three sections (i.e., the front section insulating lining 92, the middle section insulating lining 91, and the rear section insulating lining 93), the actual The upper thermal insulation lining 9 may comprise only 1 or 2 sections or 3 The above sections (for example, 4, 5, 6 sections, etc.).

圖4顯示圖3之橫剖面的簡化視圖,於其中說明前段隔熱襯層92、中段隔熱襯層91、以及後段隔熱襯層93的位置;圖5顯示圖4中之隔熱襯層9的立體分解圖;圖6顯示圖4之範圍B的放大視圖;圖7顯示圖4之範圍C的放大視圖;以及圖8顯示圖4之範圍D的放大視圖。 Figure 4 shows a simplified view of the cross section of Figure 3, illustrating the position of the front insulating liner 92, the mid-span insulating liner 91, and the rear insulating liner 93; Figure 5 shows the insulating liner of Figure 4. Fig. 6 shows an enlarged view of the range B of Fig. 4; Fig. 7 shows an enlarged view of the range C of Fig. 4; and Fig. 8 shows an enlarged view of the range D of Fig. 4.

在本發明之實施例中,前段隔熱襯層92、中段隔熱襯層91、以及後段隔熱襯層93可為各自獨立,或者可為相互連通,或者可為其組合(即,部分獨立、部分連通)。 In an embodiment of the present invention, the front heat insulation liner 92, the middle heat insulation liner 91, and the rear heat insulation liner 93 may be independent of each other, or may be in communication with each other, or may be combined (ie, partially independent). , partially connected).

例如,在圖5所示之實施例中,中段隔熱襯層91可具有圓柱形的形狀,其可為一體成型或多段連接成型;以及後段隔熱襯層93可具有一或多個開口93c。 For example, in the embodiment illustrated in FIG. 5, the mid-section insulating liner 91 may have a cylindrical shape that may be integrally formed or multi-segmented; and the rear insulating liner 93 may have one or more openings 93c. .

隔熱襯層9可包含一外層以及一內層,其中外層係設置於腔體的內壁上,以及內層係相對於外層而往容置空間內部設置,以在外層與內層之間形成一圍閉隔熱空間(enclosed thermal insulation space),且外層與內層之間的間距可大於1 μm,內層之厚度可小於與隔熱襯層相對應之腔體部分的厚度。具體而言,如圖6所示,前段隔熱襯層92可包含外層92a以及內層92b,其中外層92a係設置於腔體的內壁1a上,以及內層92b係相對於外層92a而往容置空間7內部設置,以在外層92a與內層92b之間形成圍閉隔熱空間S2,且外層92a與內層92b之間的間距G2可大於1 μm,內層92b之厚度可小於門5(即,與前段隔熱襯層92相對應之腔體部分)的厚度;如圖7所示,中段隔熱襯層91可包含外層91a以及內層91b,其中外層91a係設置於腔體的內壁1a上,以及內層91b係相對於外層91a而往容置空間7內部設置,以在外層91a與內層91b之間形成圍閉隔熱空間S1,且外層91a與內層91b之間的間距G1可大於1 μm,內層91b之厚度可小於筒身3(即,與中段隔熱襯層91相對應之腔體部分)的厚度;以及如圖8所示,後段隔熱襯層93可包含外層93a以及內層93b,其中外層93a係設置於腔體的內壁1a上,以及內層93b係相對於外層93a而往容置空間7內部設置,以在外層93a與內層93b之間形成圍閉隔熱空間S3,且外層93a與內層93b之間的間距G3可大於1 μm,內層93b之厚度可小於筒身3(即,與後段隔熱襯 層93相對應之腔體部分)的厚度。在本發明之實施例中,間距G1、G2、G3的距離可為相等或不相等,以及圍閉隔熱空間S1、S2、S3的容積可為相等或不相等。在本發明之一實施例中,隔熱襯層9可例如由金屬所製成,即前段隔熱襯層92、中段隔熱襯層91、以及後段隔熱襯層93可例如由金屬所製成。在一範例中,此金屬可例如為不銹鋼。 The thermal insulation lining 9 may include an outer layer and an inner layer, wherein the outer layer is disposed on the inner wall of the cavity, and the inner layer is disposed inside the accommodating space relative to the outer layer to form between the outer layer and the inner layer. An enclosed thermal insulation space, and the spacing between the outer layer and the inner layer may be greater than 1 μm, and the thickness of the inner layer may be less than the thickness of the cavity portion corresponding to the thermal insulation lining. Specifically, as shown in FIG. 6, the front insulating liner 92 may include an outer layer 92a and an inner layer 92b, wherein the outer layer 92a is disposed on the inner wall 1a of the cavity, and the inner layer 92b is opposed to the outer layer 92a. The accommodating space 7 is internally disposed to form a closed insulating space S2 between the outer layer 92a and the inner layer 92b, and the spacing G2 between the outer layer 92a and the inner layer 92b may be greater than 1 μm, and the inner layer 92b may be smaller than the door. 5 (ie, the cavity portion corresponding to the front insulating liner 92); as shown in FIG. 7, the middle insulating liner 91 may include an outer layer 91a and an inner layer 91b, wherein the outer layer 91a is disposed in the cavity The inner wall 1a and the inner layer 91b are disposed inside the accommodating space 7 with respect to the outer layer 91a to form a closed heat insulating space S1 between the outer layer 91a and the inner layer 91b, and the outer layer 91a and the inner layer 91b The spacing G1 may be greater than 1 μm, and the thickness of the inner layer 91b may be less than the thickness of the barrel 3 (ie, the portion of the cavity corresponding to the middle insulating liner 91); and as shown in FIG. The layer 93 may comprise an outer layer 93a and an inner layer 93b, wherein the outer layer 93a is disposed on the inner wall 1a of the cavity, and the inner layer 93b is opposite to the outer layer 9 3a is disposed inside the accommodating space 7 to form a closed heat insulating space S3 between the outer layer 93a and the inner layer 93b, and a gap G3 between the outer layer 93a and the inner layer 93b may be greater than 1 μm, and the thickness of the inner layer 93b Can be smaller than the barrel 3 (ie, with the rear section insulation lining The thickness of the corresponding portion of the layer 93). In an embodiment of the invention, the distances of the spacings G1, G2, G3 may be equal or unequal, and the volumes of the enclosed insulated spaces S1, S2, S3 may be equal or unequal. In an embodiment of the invention, the thermal insulation lining 9 can be made, for example, of metal, that is, the front thermal insulation lining 92, the middle thermal insulation lining 91, and the rear thermal insulation lining 93 can be made, for example, of metal. to make. In an example, the metal can be, for example, stainless steel.

此外,在圖8所示之實施例中,筒身3可具有開口20、21、22,以及這些開口20、21、22可分別對應於後段隔熱襯層93的開口93c。舉例來說,參考圖3與圖8,可透過開口20以及與開口20相對應之後段隔熱襯層93的開口93c,使加壓裝置13對容置空間7進行加壓;可藉由使傳動軸17穿過開口22以及與開口22相對應之後段隔熱襯層93的開口93c,而將風扇15連接至驅動馬達19;可經由開口21以及與開口21相對應之後段隔熱襯層93的開口93c,使容置空間7內的氣體排出加熱與加壓處理爐1。在本發明之其他實施例中,前段隔熱襯層92及/或中段隔熱襯層91亦可設有與後段隔熱襯層93之開口93c相似的開口。 Furthermore, in the embodiment shown in Figure 8, the barrel 3 can have openings 20, 21, 22, and these openings 20, 21, 22 can correspond to the openings 93c of the rear insulating liner 93, respectively. For example, referring to FIG. 3 and FIG. 8 , the pressing device 13 can pressurize the accommodating space 7 through the opening 20 and the opening 93 c of the thermal insulating lining 93 corresponding to the opening 20; The drive shaft 17 passes through the opening 22 and the opening 93c of the heat insulating lining 93 corresponding to the opening 22, and connects the fan 15 to the drive motor 19; the rear lining can be provided via the opening 21 and the opening 21 corresponding to the opening 21 The opening 93c of the 93 discharges the gas in the accommodating space 7 to the heating and pressure treatment furnace 1. In other embodiments of the invention, the front insulating liner 92 and/or the mid-span insulating liner 91 may also be provided with openings similar to the opening 93c of the rear insulating liner 93.

隔熱襯層9可設有用以使其圍閉隔熱空間與容置空間連通的至少兩個通孔,以使其圍閉隔熱空間內之壓力與容置空間內之壓力實質相同,藉以防止隔熱襯層9在容置空間內之壓力改變時產生變形。圖9A顯示圖5中之中段隔熱襯層91的前視圖;以及圖9B顯示圖9A之範圍E的放大視圖。如圖3、9A以及9B所示,中段隔熱襯層91設有用以使其圍閉隔熱空間與容置空間連通的至少兩個通孔91c,以使其圍閉隔熱空間內之壓力與容置空間內之壓力實質相同,藉以防止中段隔熱襯層91在容置空間內之壓力改變時產生變形。在本發明之實施例中,通孔91c可例如為鑽孔、狹縫、或者用以使兩個區域相通的結構特徵部。此外,在本發明之其他實施例中,前段隔熱襯層92以及後段隔熱襯層93亦可分別設有與中段隔熱襯層91之通孔91c相似的通孔,以使前段隔熱襯層92之圍閉隔熱空間內的壓力以及後段隔熱襯層93之圍閉隔熱空間內的壓力可與容置空間內之壓力實質相同,藉以防止前段隔熱襯層92以及後段隔熱襯層93在容置空間內之壓力改變時產生變形。由上述內容可知,因為隔熱襯層9的圍閉隔熱空間可透過至少兩個通孔91c而與容置空間7連通,所以容置空間7內的氣體可流入隔 熱襯層9的圍閉隔熱空間內。 The heat insulation lining 9 may be provided with at least two through holes for communicating the enclosed heat insulating space with the accommodating space, so that the pressure in the enclosed heat insulating space is substantially the same as the pressure in the accommodating space. The heat insulating lining 9 is prevented from being deformed when the pressure in the accommodating space is changed. Figure 9A shows a front view of the mid-span insulation liner 91 of Figure 5; and Figure 9B shows an enlarged view of the range E of Figure 9A. As shown in FIGS. 3, 9A and 9B, the middle insulating lining 91 is provided with at least two through holes 91c for communicating the enclosed heat insulating space with the accommodating space so as to enclose the pressure in the heat insulating space. The pressure in the accommodating space is substantially the same as the pressure in the accommodating space, thereby preventing deformation of the middle insulating lining 91 when the pressure in the accommodating space is changed. In an embodiment of the invention, the through hole 91c may be, for example, a bore, a slit, or a structural feature to communicate the two regions. In addition, in other embodiments of the present invention, the front insulating lining 92 and the rear insulating lining 93 may also be respectively provided with through holes similar to the through holes 91c of the middle insulating lining 91 to insulate the front section. The pressure in the enclosed insulating space of the lining layer 92 and the pressure in the enclosed insulating space of the rear insulating lining 93 may be substantially the same as the pressure in the accommodating space, thereby preventing the front insulating lining 92 and the rear section from being separated. The thermal lining 93 is deformed when the pressure in the accommodating space is changed. As can be seen from the above, since the enclosed heat insulating space of the heat insulating lining 9 can communicate with the accommodating space 7 through the at least two through holes 91c, the gas in the accommodating space 7 can flow into the partition. The heat lining 9 is enclosed in an insulated space.

圖10顯示依照本發明之另一實施例之用於製造電子元件之加熱與加壓處理爐100的橫剖面圖。圖10之加熱與加壓處理爐100係類似於圖3之加熱與加壓處理爐1。同樣地,為說明之目的,在圖10中顯示加熱與加壓處理爐100的隔熱襯層9'可包含前段隔熱襯層92'、中段隔熱襯層91'、以及後段隔熱襯層93',但本發明並不限於此,亦即,雖然在本發明之圖式中顯示隔熱襯層9'包含3個區段(即,前段隔熱襯層92'、中段隔熱襯層91'、以及後段隔熱襯層93'),但實際上隔熱襯層9'可僅包含1個或2個區段或者包含3個以上的區段(例如4個、5個、6個區段等等)。 Figure 10 is a cross-sectional view showing a heating and pressurizing furnace 100 for manufacturing electronic components in accordance with another embodiment of the present invention. The heating and pressure treatment furnace 100 of Fig. 10 is similar to the heating and pressure treatment furnace 1 of Fig. 3. Similarly, for purposes of illustration, the thermal insulation liner 9' of the heating and pressurizing treatment furnace 100 is shown in FIG. 10 to include a front insulation liner 92', a mid-section insulation liner 91', and a rear insulation liner. Layer 93', but the invention is not limited thereto, that is, although in the drawings of the present invention, the thermal insulation lining 9' is shown to comprise three sections (i.e., the front section of the thermal insulation lining 92', the middle section of the thermal insulation lining Layer 91', and rear insulating lining 93'), but in practice the insulating lining 9' may comprise only one or two sections or more than three sections (eg 4, 5, 6 Sections, etc.).

隔熱襯層9'可設有至少一個第一通孔94;在圖10所示之實施例中,第一通孔94係設置在中段隔熱襯層91',然而,在本發明之其他實施例中,第一通孔94可設置在前段隔熱襯層92'或後段隔熱襯層93'。如上所述,隔熱襯層9'可包含一外層以及一內層,其中外層係設置於腔體的內壁上,以及內層係相對於外層而往容置空間內部設置,以在外層與內層之間形成圍閉隔熱空間,且外層與內層之間的間距可大於1 μm。具體而言,如同圖6-8所示之實施例,圖10所示之前段隔熱襯層92'、中段隔熱襯層91'、以及後段隔熱襯層93'亦可分別包含一外層以及一內層,其中外層係設置於腔體的內壁上,以及內層係相對於外層而往容置空間內部設置,以在外層與內層之間形成圍閉隔熱空間,且外層與內層之間的間距可大於1 μm,內層之厚度可小於與隔熱襯層相對應之腔體部分的厚度。 The thermal insulation lining 9' may be provided with at least one first through hole 94; in the embodiment shown in Fig. 10, the first through hole 94 is disposed in the middle thermal insulation lining 91', however, in the other aspect of the invention In an embodiment, the first through hole 94 may be disposed in the front insulating liner 92' or the rear insulating liner 93'. As described above, the thermal insulation lining 9' may include an outer layer and an inner layer, wherein the outer layer is disposed on the inner wall of the cavity, and the inner layer is disposed inside the accommodating space relative to the outer layer to A closed insulating space is formed between the inner layers, and the spacing between the outer layer and the inner layer may be greater than 1 μm. Specifically, as in the embodiment shown in FIGS. 6-8, the previous section of the thermal insulation lining 92', the middle thermal insulation lining 91', and the rear thermal insulation lining 93' may also each comprise an outer layer. And an inner layer, wherein the outer layer is disposed on the inner wall of the cavity, and the inner layer is disposed inside the accommodating space relative to the outer layer to form a closed insulating space between the outer layer and the inner layer, and the outer layer is The spacing between the inner layers may be greater than 1 μm and the thickness of the inner layer may be less than the thickness of the cavity portion corresponding to the thermal insulation liner.

為說明與簡潔之目的,在圖10中未描繪出加熱裝置11、風扇15、傳動軸17、以及驅動馬達19,但吾人可瞭解圖10之加熱與加壓處理爐100可包含上述該等元件。 For the purpose of illustration and brevity, the heating device 11, the fan 15, the drive shaft 17, and the drive motor 19 are not depicted in FIG. 10, but it will be understood that the heating and pressurizing furnace 100 of FIG. 10 may include the above-described components. .

在本發明之實施例中,前段隔熱襯層92'、中段隔熱襯層91'、以及後段隔熱襯層93'可為各自獨立,或者可為相互連通,或者可為其組合(即,部分獨立、部分連通)。中段隔熱襯層91'可具有圓柱形的形狀,其可為一體成型或多段連接成型。在本發明之一實施例中,隔熱襯層9'可例如由金屬所製成,即前段隔熱襯層92'、中段隔熱襯層91'、以及後段隔熱襯層93'可例如由金屬所製成。在一範例中,此金屬可例如為不銹鋼。 In the embodiment of the present invention, the front heat insulation liner 92', the middle heat insulation liner 91', and the rear heat insulation liner 93' may be independent of each other, or may be connected to each other, or may be combined (ie, , partially independent, partially connected). The mid-section thermal insulation lining 91' may have a cylindrical shape, which may be integrally formed or multi-segmented. In an embodiment of the invention, the thermal insulation lining 9' may be made, for example, of metal, ie the front insulation liner 92', the mid-span insulation 91', and the rear insulation liner 93' may for example Made of metal. In an example, the metal can be, for example, stainless steel.

吾人可從圖10觀看到,加壓裝置13可透過第一通孔94,將中段隔熱襯層91'之圍閉隔熱空間內的壓力調變至與容置空間7內之壓力實質相同的壓力,藉以防止中段隔熱襯層91'在容置空間7內之壓力改變時產生變形。在此實施例中,加壓裝置13可透過控制閥23使容置空間7內之壓力與中段隔熱襯層91'之圍閉隔熱空間內之壓力實質上同時調變至預定壓力。在圖10所示之實施例中,前段隔熱襯層92'、中段隔熱襯層91'、以及後段隔熱襯層93'可為相互連通,因此加壓裝置13透過設置在中段隔熱襯層91'的第一通孔94,即可將前段隔熱襯層92'、中段隔熱襯層91'、以及後段隔熱襯層93'之圍閉隔熱空間內的壓力調變至與容置空間7內之壓力實質相同的壓力。 As can be seen from FIG. 10, the pressing device 13 can pass through the first through hole 94 to adjust the pressure in the enclosed heat insulating space of the middle insulating liner 91' to be substantially the same as the pressure in the accommodating space 7. The pressure is applied to prevent deformation of the middle insulating liner 91' when the pressure in the accommodating space 7 is changed. In this embodiment, the pressurizing device 13 can modulate the pressure in the accommodating space 7 and the pressure in the enclosed heat insulating space of the middle insulating lining 91' to the predetermined pressure substantially simultaneously through the control valve 23. In the embodiment shown in FIG. 10, the front heat insulating lining 92', the middle heat insulating lining 91', and the rear heat insulating lining 93' may be in communication with each other, so that the pressing device 13 is disposed through the middle portion of the heat insulating layer. The first through hole 94 of the lining 91' can adjust the pressure in the enclosed heat insulating space of the front insulating lining 92', the middle insulating lining 91', and the rear insulating lining 93' to The pressure is substantially the same as the pressure in the accommodating space 7.

在本發明之另一實施例中,前段隔熱襯層92'、中段隔熱襯層91'、以及後段隔熱襯層93'皆設有第一通孔94,加壓裝置13可透過分別設置在前段隔熱襯層92'、中段隔熱襯層91'、以及後段隔熱襯層93'的第一通孔94,並且藉由個別控制閥的控制,將前段隔熱襯層92'、中段隔熱襯層91'、以及後段隔熱襯層93'每一者之圍閉隔熱空間內的壓力分別調變至與容置空間7內之壓力實質相同的壓力,藉以防止前段隔熱襯層92'、中段隔熱襯層91'、以及後段隔熱襯層93'在容置空間7內之壓力改變時產生變形;並且使容置空間7內之壓力與前段隔熱襯層92'、中段隔熱襯層91'、以及後段隔熱襯層93'之圍閉隔熱空間內之壓力實質上同時調變至預定壓力。 In another embodiment of the present invention, the front heat insulating lining 92', the middle heat insulating lining 91', and the rear heat insulating lining 93' are all provided with a first through hole 94, and the pressing device 13 can transmit respectively The first through hole 94 is disposed in the front insulating lining 92', the middle insulating lining 91', and the rear insulating lining 93', and the front insulating lining 92' is controlled by an individual control valve. The pressure in the enclosed heat insulating space of each of the middle insulating lining 91' and the rear insulating lining 93' is respectively adjusted to a pressure substantially equal to the pressure in the accommodating space 7, thereby preventing the front section from being separated. The thermal lining 92', the middle insulating lining 91', and the rear insulating lining 93' are deformed when the pressure in the accommodating space 7 is changed; and the pressure in the accommodating space 7 and the front insulating lining The pressure in the enclosed insulating space of the 92', the middle insulating lining 91', and the rear insulating lining 93' is substantially simultaneously modulated to a predetermined pressure.

隔熱襯層9'設有至少一個第二通孔95,其中透過至少一個第二通孔95,使圍閉隔熱空間與腔體的外部連通;在圖10所示之實施例中,第二通孔95係設置在中段隔熱襯層91',然而,在本發明之其他實施例中,第二通孔95可設置在前段隔熱襯層92'或後段隔熱襯層93'。 The heat insulation lining 9' is provided with at least one second through hole 95, wherein the at least one second through hole 95 is passed through to communicate the enclosed heat insulating space with the outside of the cavity; in the embodiment shown in FIG. The two through holes 95 are disposed in the middle insulating lining 91'. However, in other embodiments of the present invention, the second through holes 95 may be disposed in the front insulating lining 92' or the rear insulating lining 93'.

在本發明之實施例中,可在隔熱襯層9與9'的圍閉隔熱空間中,即,在前段隔熱襯層92與92'、中段隔熱襯層91與91'、以及後段隔熱襯層93與93'的圍閉隔熱空間中,填充具有低於16W/mK之導熱係數的一物質(其可被稱為「填充材料」)。在本發明之一實施例中,此物質可為氣體,例如空氣或氮氣。此外,在本發明之其他實施例中,此物質可為碳、玻璃、或水。 In an embodiment of the invention, in the enclosed insulating space of the insulating linings 9 and 9', that is, in the front insulating linings 92 and 92', the middle insulating linings 91 and 91', and In the enclosed heat insulating space of the rear insulating lining layers 93 and 93', a substance (which may be referred to as "filling material") having a thermal conductivity lower than 16 W/mK is filled. In one embodiment of the invention, the substance can be a gas such as air or nitrogen. Moreover, in other embodiments of the invention, the substance can be carbon, glass, or water.

在本發明之實施例中,此加熱與加壓處理爐可更包含微粒偵測器25,其可與至少一個第二通孔95連接,以偵測排出隔熱襯層9'之圍閉隔熱空間(即,前段隔熱襯層92'、中段隔熱襯層91'、以及後段隔熱襯層93'之圍閉隔熱空間)的微粒含量,例如偵測上述碳、玻璃、或水之填充材料排出圍閉隔熱空間的量,藉以判斷是否需要補充或更換圍閉隔熱空間中的填充材料。 In an embodiment of the present invention, the heating and pressure treatment furnace may further include a particle detector 25 connectable to the at least one second through hole 95 to detect the enclosure of the discharge insulation liner 9'. The content of particles in the thermal space (ie, the front insulating lining 92', the middle insulating lining 91', and the enclosed insulating space of the rear insulating lining 93', for example, detecting the carbon, glass, or water The filling material discharges the amount of the enclosed heat insulating space, thereby judging whether it is necessary to supplement or replace the filling material in the enclosed heat insulating space.

圖11顯示依照本發明之又另一實施例之用於製造電子元件之加熱與加壓處理爐200的橫剖面圖。圖11之加熱與加壓處理爐200係類似於圖10之加熱與加壓處理爐100。此外,為說明與簡潔之目的,在圖11中未描繪出加熱裝置11、風扇15、傳動軸17、以及驅動馬達19,但吾人可瞭解圖11之加熱與加壓處理爐200可包含上述該等元件。 Figure 11 is a cross-sectional view showing a heating and pressurizing furnace 200 for manufacturing electronic components in accordance with still another embodiment of the present invention. The heating and pressurizing furnace 200 of Fig. 11 is similar to the heating and pressurizing furnace 100 of Fig. 10. Moreover, for the purpose of illustration and brevity, the heating device 11, the fan 15, the drive shaft 17, and the drive motor 19 are not depicted in FIG. 11, but it is understood that the heating and pressurizing furnace 200 of FIG. 11 may include the above-described And other components.

如圖11所示,加熱與加壓處理爐200可包含第一加壓裝置27以及第二加壓裝置29。第一加壓裝置27可用以將容置空間7內的壓力調變至大於1 atm的一預定壓力。在本發明之實施例中,第一加壓裝置27以及第二加壓裝置29可例如為加壓幫浦。第二加壓裝置29可透過第一通孔94,將中段隔熱襯層91'之圍閉隔熱空間內的壓力調變至與容置空間7內之壓力實質相同的壓力,藉以防止中段隔熱襯層91'在容置空間7內之壓力改變時產生變形。 As shown in FIG. 11, the heating and pressurizing treatment furnace 200 may include a first pressurizing device 27 and a second pressurizing device 29. The first pressing device 27 can be used to modulate the pressure in the accommodating space 7 to a predetermined pressure greater than 1 atm. In an embodiment of the invention, the first pressurizing device 27 and the second pressurizing device 29 may, for example, be pressurized pumps. The second pressing device 29 can pass through the first through hole 94 to change the pressure in the enclosed heat insulating space of the middle insulating layer 91' to substantially the same pressure as the pressure in the accommodating space 7, thereby preventing the middle portion. The heat insulating lining 91' is deformed when the pressure in the accommodating space 7 is changed.

在圖11所示之實施例中,前段隔熱襯層92'、中段隔熱襯層91'、以及後段隔熱襯層93'可為相互連通,因此第二加壓裝置29透過設置在中段隔熱襯層91'的第一通孔94,即可將前段隔熱襯層92'、中段隔熱襯層91'、以及後段隔熱襯層93'之圍閉隔熱空間內的壓力調變至與容置空間7內之壓力實質相同的壓力。 In the embodiment shown in FIG. 11, the front insulating lining 92', the middle insulating lining 91', and the rear insulating lining 93' may be in communication with each other, so that the second pressing device 29 is disposed in the middle The first through hole 94 of the heat insulating lining 91' can adjust the pressure in the enclosed heat insulating space of the front insulating lining 92', the middle insulating lining 91', and the rear insulating lining 93'. It is changed to a pressure substantially the same as the pressure in the accommodating space 7.

在本發明之另一實施例中,前段隔熱襯層92'、中段隔熱襯層91'、以及後段隔熱襯層93'皆設有第一通孔94,第二加壓裝置29可透過分別設置在前段隔熱襯層92'、中段隔熱襯層91'、以及後段隔熱襯層93'的第一通孔94,將前段隔熱襯層92'、中段隔熱襯層91'、以及後段隔熱襯層93'每一者之圍閉隔熱空間內的壓力分別調變至與容置空間7內之壓力實質相同的壓力,藉以防止前段隔熱襯層92'、中段隔熱襯層91'、以及後段隔熱襯層93'在容置空間7內之壓力改變時產生變形。第一加壓裝置27與第二加壓裝置29 係以使容置空間7內之壓力與圍閉隔熱空間內之壓力實質上同時調變至預定壓力的方式來進行操作。又,在本發明之另一實施例中,前段隔熱襯層92'、中段隔熱襯層91'、以及後段隔熱襯層93'可透過各自的第一通孔94而與各自相對應的加壓裝置(例如加壓幫浦)連接;並且可透過第一加壓裝置27以及與前段隔熱襯層92'、中段隔熱襯層91'、以及後段隔熱襯層93'各自相對應的加壓裝置,使容置空間7內的壓力與前段隔熱襯層92'、中段隔熱襯層91'、以及後段隔熱襯層93'每一者之圍閉隔熱空間內的壓力實質上同時調變至預定壓力。 In another embodiment of the present invention, the front insulating lining 92', the middle insulating lining 91', and the rear insulating lining 93' are all provided with a first through hole 94, and the second pressing device 29 is The front insulating lining 92' and the middle insulating lining 91 are provided through the first through holes 94 respectively disposed in the front insulating lining 92', the middle insulating lining 91', and the rear insulating lining 93'. ', and the pressure in the enclosed insulating space of each of the rear insulating linings 93' is respectively adjusted to a pressure substantially the same as the pressure in the accommodating space 7, thereby preventing the front insulating lining 92', the middle section The heat insulating lining 91' and the rear insulating lining 93' are deformed when the pressure in the accommodating space 7 is changed. First pressing device 27 and second pressing device 29 The operation is performed such that the pressure in the accommodating space 7 and the pressure in the enclosed heat insulating space are substantially simultaneously adjusted to a predetermined pressure. Moreover, in another embodiment of the present invention, the front insulating lining 92', the middle insulating lining 91', and the rear insulating lining 93' are permeable to each other through the respective first through holes 94. Pressing device (such as a pressurized pump) is connected; and is permeable to the first pressing device 27 and to the front insulating liner 92', the middle insulating liner 91', and the rear insulating liner 93'. Corresponding pressing device, the pressure in the accommodating space 7 is in the enclosed heat insulating space of each of the front insulating lining 92', the middle insulating lining 91', and the rear insulating lining 93' The pressure is substantially simultaneously modulated to a predetermined pressure.

依照本發明之一實施例,加熱與加壓處理爐可更包含至少一分隔件,其可用以將隔熱襯層的圍閉隔熱空間分隔成複數區域。舉例來說,以圖4之隔熱襯層9為例,圖12顯示包含分隔件31之圖4之範圍B的放大視圖,其中,分隔件31將前段隔熱襯層92的圍閉隔熱空間S2分隔成複數區域;圖13顯示包含分隔件31之圖4之範圍C的放大視圖,其中,分隔件31將中段隔熱襯層91的圍閉隔熱空間S1分隔成複數區域;以及圖14顯示包含分隔件31之圖4之範圍D的放大視圖,其中,分隔件31將後段隔熱襯層93的圍閉隔熱空間S3分隔成複數區域。雖然在圖12-14中僅顯示一個分隔件31,但實際上本發明之加熱與加壓處理爐可包含一個以上的分隔件31。此外,雖然圖式中未顯示,但分隔件31亦可被應用在圖10-11所示之隔熱襯層9'上,以將隔熱襯層9'的圍閉隔熱空間分隔成複數區域,例如可利用分隔件31將前段隔熱襯層92'、中段隔熱襯層91'、以及後段隔熱襯層93'至少其中一者的圍閉隔熱空間分隔成複數區域。在本發明之實施例中,分隔件31可例如由金屬所製成。在一範例中,此金屬可例如為不銹鋼。 In accordance with an embodiment of the present invention, the heating and pressurizing treatment furnace may further comprise at least one separator that may be used to divide the enclosed insulating space of the insulating liner into a plurality of regions. For example, taking the thermal insulation lining 9 of FIG. 4 as an example, FIG. 12 shows an enlarged view of the range B of FIG. 4 including the partitioning member 31, wherein the partitioning member 31 thermally insulates the front insulating lining 92. The space S2 is divided into a plurality of regions; FIG. 13 shows an enlarged view of the range C of FIG. 4 including the partition member 31, wherein the partition member 31 divides the enclosed heat insulating space S1 of the middle insulating layer 91 into a plurality of regions; 14 shows an enlarged view of the range D of FIG. 4 including the partition member 31, wherein the partition member 31 divides the enclosed heat insulating space S3 of the rear stage insulating lining 93 into a plurality of regions. Although only one partition member 31 is shown in Figs. 12-14, the heat and pressure treatment furnace of the present invention may actually include more than one partition member 31. In addition, although not shown in the drawings, the partition member 31 may also be applied to the heat insulating lining 9' shown in FIGS. 10-11 to separate the enclosed heat insulating space of the heat insulating lining 9' into plural numbers. In the region, for example, the partition insulating space of at least one of the front insulating liner 92', the middle insulating liner 91', and the rear insulating liner 93' may be partitioned into a plurality of regions by means of a spacer 31. In an embodiment of the invention, the spacer 31 may be made, for example, of metal. In an example, the metal can be, for example, stainless steel.

雖然本發明已參考較佳實施例及圖式詳加說明,但熟習本項技藝者可瞭解在不離開本發明之精神與範圍的情況下,可進行各種修改、變化以及等效替代,然而這些修改、變化以及等效替代仍落入本發明之申請專利範圍內。 While the invention has been described herein with reference to the preferred embodiments of the embodiments of the invention Modifications, variations, and equivalent substitutions are still within the scope of the invention.

1‧‧‧加熱與加壓處理爐 1‧‧‧heating and pressure treatment furnace

1a‧‧‧內壁 1a‧‧‧ inner wall

3‧‧‧筒身 3‧‧‧

5‧‧‧門 5‧‧‧

7‧‧‧容置空間 7‧‧‧ accommodating space

9‧‧‧隔熱襯層 9‧‧‧Insulation lining

11‧‧‧加熱裝置 11‧‧‧ heating device

13‧‧‧加壓裝置 13‧‧‧Pressure device

15‧‧‧風扇 15‧‧‧fan

17‧‧‧傳動軸 17‧‧‧Drive shaft

19‧‧‧驅動馬達 19‧‧‧Drive motor

91‧‧‧中段隔熱襯層 91‧‧‧ Middle insulation lining

92‧‧‧前段隔熱襯層 92‧‧‧ Front insulation lining

93‧‧‧後段隔熱襯層 93‧‧‧After thermal insulation lining

Claims (15)

一種用於製造電子元件的加熱與加壓處理爐,包含:一腔體,具有用以形成一容置空間的內壁;至少一加熱裝置,設置在該容置空間中,並且用以將該容置空間內的溫度調變至一預定溫度;一加壓裝置,用以將該容置空間內的壓力調變至大於1 atm的一預定壓力;至少一隔熱襯層,包含一外層以及一內層,其中該外層係設置於該腔體的該內壁上,以及該內層係相對於該外層而往該容置空間內部設置,以在該外層與該內層之間形成一圍閉隔熱空間(enclosed thermal insulation space),以及其中該外層與該內層之間的間距係大於1 μm,該內層的厚度係小於與該隔熱襯層相對應之該腔體部分的厚度,該隔熱襯層設有用以使該圍閉隔熱空間與該容置空間連通的至少兩個通孔,以使該圍閉隔熱空間內之壓力與該容置空間內之壓力實質相同,藉以防止該隔熱襯層在該容置空間內之壓力改變時產生變形;及一風扇,設置在該容置空間中,並且經由凸伸出該腔體的一傳動軸而連接至一驅動馬達,透過該驅動馬達驅動該風扇轉動,以促進該加熱裝置對該容置空間的溫度調變效率。一種用於製造電子元件的加熱與加壓處理爐,包含:一腔體,具有用以形成一容置空間的內壁;至少一加熱裝置,設置在該容置空間中,並且用以將該容置空間內的溫度調變至一預定溫度;至少一隔熱襯層,包含一外層以及一內層,其中該外層係設置於該腔體的該內壁上,以及該內層係相對於該外層而往該容置空間內部設置,以在該外層與該內層之間形成一圍閉隔熱空間(enclosed thermal insulation space),以及其中該外層與該內層之間的間距係大於1 μm,該內層的厚度係小於與該隔熱襯層相對應之該腔體部分的厚度,該隔熱襯層設有至少一個第一通孔;一加壓裝置,用以將該容置空間內的壓力調變至大於1 atm的一預定壓 力,並且透過該隔熱襯層的該至少一個第一通孔,將該隔熱襯層之該圍閉隔熱空間內的壓力調變至與該容置空間內之壓力實質相同的一壓力,藉以防止該隔熱襯層在該容置空間內之壓力改變時產生變形;及一風扇,設置在該容置空間中,並且經由凸伸出該腔體的一傳動軸而連接至一驅動馬達,透過該驅動馬達驅動該風扇轉動,以促進該加熱裝置對該容置空間的溫度調變效率。 A heating and pressure processing furnace for manufacturing an electronic component, comprising: a cavity having an inner wall for forming an accommodating space; at least one heating device disposed in the accommodating space, and configured to The temperature in the accommodating space is adjusted to a predetermined temperature; a pressing device is used to modulate the pressure in the accommodating space to a predetermined pressure greater than 1 atm; at least one insulating lining includes an outer layer and An inner layer, wherein the outer layer is disposed on the inner wall of the cavity, and the inner layer is disposed inside the accommodating space relative to the outer layer to form a circumference between the outer layer and the inner layer An enclosed thermal insulation space, wherein a spacing between the outer layer and the inner layer is greater than 1 μm, the inner layer having a thickness less than a thickness of the cavity portion corresponding to the thermal insulation lining The heat insulation lining is provided with at least two through holes for communicating the enclosed heat insulating space with the accommodating space, so that the pressure in the enclosed heat insulating space is substantially the same as the pressure in the accommodating space. In order to prevent the thermal insulation lining from being placed in the space Deformation occurs when the pressure is changed; and a fan is disposed in the accommodating space, and is connected to a driving motor via a driving shaft protruding from the cavity, and the fan is driven to rotate by the driving motor to promote The heating device adjusts the temperature of the accommodating space. A heating and pressure processing furnace for manufacturing an electronic component, comprising: a cavity having an inner wall for forming an accommodating space; at least one heating device disposed in the accommodating space, and configured to The temperature in the accommodating space is modulated to a predetermined temperature; the at least one insulating lining comprises an outer layer and an inner layer, wherein the outer layer is disposed on the inner wall of the cavity, and the inner layer is opposite to the inner layer The outer layer is disposed inside the accommodating space to form an enclosed thermal insulation space between the outer layer and the inner layer, and wherein a spacing between the outer layer and the inner layer is greater than 1 Μm, the inner layer has a thickness smaller than a thickness of the cavity portion corresponding to the thermal insulation lining, the thermal insulation lining is provided with at least one first through hole; and a pressing device is used for the accommodating The pressure in the space is modulated to a predetermined pressure greater than 1 atm And modulating the pressure in the enclosed insulating space of the thermal insulation liner to a pressure substantially equal to the pressure in the accommodating space through the at least one first through hole of the thermal insulation lining And preventing the thermal insulation lining from being deformed when the pressure in the accommodating space is changed; and a fan disposed in the accommodating space and connected to the driving device via a transmission shaft protruding from the cavity The motor drives the fan to rotate through the drive motor to promote temperature modulation efficiency of the heating device in the accommodating space. 一種用於製造電子元件的加熱與加壓處理爐,包含:一腔體,具有用以形成一容置空間的內壁;至少一加熱裝置,設置在該容置空間中,並且用以將該容置空間內的溫度調變至一預定溫度;一第一加壓裝置,用以將該容置空間內的壓力調變至大於1 atm的一預定壓力;至少一隔熱襯層,包含一外層以及一內層,其中該外層係設置於該腔體的該內壁上,以及該內層係相對於該外層而往該容置空間內部設置,以在該外層與該內層之間形成一圍閉隔熱空間(enclosed thermal insulation space),以及其中該外層與該內層之間的間距係大於1 μm,該內層的厚度係小於與該隔熱襯層相對應之該腔體部分的厚度,該隔熱襯層設有至少一個第一通孔;一第二加壓裝置,透過該至少一個第一通孔,將該圍閉隔熱空間內的壓力調變至與該容置空間內之壓力實質相同的一壓力,藉以防止該隔熱襯層在該容置空間內之壓力改變時產生變形;及一風扇,設置在該容置空間中,並且經由凸伸出該腔體的一傳動軸而連接至一驅動馬達,透過該驅動馬達驅動該風扇轉動,以促進該加熱裝置對該容置空間的溫度調變效率。 A heating and pressure processing furnace for manufacturing an electronic component, comprising: a cavity having an inner wall for forming an accommodating space; at least one heating device disposed in the accommodating space, and configured to The temperature in the accommodating space is adjusted to a predetermined temperature; a first pressing device is used to adjust the pressure in the accommodating space to a predetermined pressure greater than 1 atm; at least one thermal insulation lining includes a An outer layer and an inner layer, wherein the outer layer is disposed on the inner wall of the cavity, and the inner layer is disposed inside the receiving space relative to the outer layer to form between the outer layer and the inner layer An enclosed thermal insulation space, wherein a spacing between the outer layer and the inner layer is greater than 1 μm, the inner layer having a thickness less than the portion of the cavity corresponding to the thermal insulation lining The thickness of the insulating lining is provided with at least one first through hole; a second pressing device transmits the pressure in the enclosed insulating space to the accommodating through the at least one first through hole The pressure in the space is essentially the same pressure, to prevent The heat insulation lining is deformed when the pressure in the accommodating space is changed; and a fan is disposed in the accommodating space and connected to a driving motor via a transmission shaft protruding from the cavity The drive motor drives the fan to rotate to promote temperature modulation efficiency of the heating device to the accommodating space. 如申請專利範圍第2項所述之用於製造電子元件的加熱與加壓處理爐,其中,該加壓裝置係以使該容置空間內之壓力與該圍閉隔熱空間內之壓力實質上同時調變至該預定壓力的方式來進行操作。 The heating and pressure treatment furnace for manufacturing an electronic component according to claim 2, wherein the pressing device is configured to make a pressure in the accommodating space and a pressure in the enclosed heat insulating space substantially The operation is performed by simultaneously adjusting to the predetermined pressure. 如申請專利範圍第3項所述之用於製造電子元件的加熱與加壓處理爐,其中,該第一加壓裝置與該第二加壓裝置係以使該容置空間內之壓力與該圍閉隔熱空間內之壓力實質上同時調變至該預定壓力的方式來進行操作。 The heating and pressure treatment furnace for manufacturing an electronic component according to claim 3, wherein the first pressing device and the second pressing device are configured to cause a pressure in the accommodating space and the The operation is performed in such a manner that the pressure in the enclosed heat insulating space is substantially simultaneously modulated to the predetermined pressure. 如申請專利範圍第2項所述之用於製造電子元件的加熱與加壓處理爐,其中,該隔熱襯層設有至少一個第二通孔,其中透過該至少一個第二通孔,使該圍閉隔熱空間與該腔體的外部連通。 The heating and pressure treatment furnace for manufacturing an electronic component according to claim 2, wherein the thermal insulation lining is provided with at least one second through hole, wherein the at least one second through hole is passed through The enclosed insulated space is in communication with the exterior of the cavity. 如申請專利範圍第3項所述之用於製造電子元件的加熱與加壓處理爐,其中,該隔熱襯層設有至少一個第二通孔,其中透過該至少一個第二通孔,使該圍閉隔熱空間與該腔體的外部連通。 A heating and pressure treatment furnace for manufacturing an electronic component according to claim 3, wherein the thermal insulation lining is provided with at least one second through hole through which the at least one second through hole is passed The enclosed insulated space is in communication with the exterior of the cavity. 如申請專利範圍第6項所述之用於製造電子元件的加熱與加壓處理爐,更包含:一微粒偵測器,與該至少一個第二通孔連接。 The heating and pressure processing furnace for manufacturing an electronic component according to claim 6, further comprising: a particle detector connected to the at least one second through hole. 如申請專利範圍第7項所述之用於製造電子元件的加熱與加壓處理爐,更包含:一微粒偵測器,與該至少一個第二通孔連接。 The heating and pressure treatment furnace for manufacturing an electronic component according to claim 7, further comprising: a particle detector connected to the at least one second through hole. 如申請專利範圍第1至9項其中任一項所述之用於製造電子元件的加熱與加壓處理爐,其中,在該圍閉隔熱空間中填充具有低於16W/mK之導熱係數的一物質。 The heating and pressure treatment furnace for manufacturing an electronic component according to any one of claims 1 to 9, wherein the enclosed heat insulating space is filled with a thermal conductivity of less than 16 W/mK. a substance. 如申請專利範圍第10項所述之用於製造電子元件的加熱與加壓處理爐,其中,該物質為氣體。 A heating and pressure treatment furnace for manufacturing an electronic component according to claim 10, wherein the substance is a gas. 如申請專利範圍第11項所述之用於製造電子元件的加熱與加壓處理爐,其中,該氣體為空氣或氮氣。 A heating and pressure treatment furnace for manufacturing an electronic component according to claim 11, wherein the gas is air or nitrogen. 如申請專利範圍第10項所述之用於製造電子元件的加熱與加壓處理爐,其中,該物質為碳、玻璃、或水。 A heating and pressure treatment furnace for manufacturing an electronic component according to claim 10, wherein the substance is carbon, glass, or water. 如申請專利範圍第1至3項其中任一項所述之用於製造電子元件的加熱與加壓處理爐,其中,該隔熱襯層係由金屬所製成。 A heating and pressure treatment furnace for manufacturing an electronic component according to any one of claims 1 to 3, wherein the thermal insulation lining is made of metal. 如申請專利範圍第1至3項其中任一項所述之用於製造電子元件的加熱與加壓處理爐,更包含:至少一分隔件,用以將該圍閉隔熱空間分隔成複數區域。 The heating and pressure treatment furnace for manufacturing an electronic component according to any one of claims 1 to 3, further comprising: at least one partition member for dividing the enclosed heat insulating space into a plurality of regions . 如申請專利範圍第15項所述之用於製造電子元件的加熱與加壓處理爐,其中,該分隔件係由金屬所製成。 A heating and pressure treatment furnace for manufacturing an electronic component according to claim 15, wherein the separator is made of metal.
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Publication number Priority date Publication date Assignee Title
TWI788202B (en) * 2022-01-24 2022-12-21 印能科技股份有限公司 Electronic component heating and pressure treatment furnace rapid preparation device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI788202B (en) * 2022-01-24 2022-12-21 印能科技股份有限公司 Electronic component heating and pressure treatment furnace rapid preparation device

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