TWI788202B - Electronic component heating and pressure treatment furnace rapid preparation device - Google Patents

Abstract

A rapid preparation device for heating and pressurizing a furnace for electronic components, comprising an accommodating space in the furnace; at least one heating device installed in the accommodating space to adjust the temperature in the accommodating space to a predetermined temperature; at least one a pressurizing device, used to adjust the pressure in the accommodating space to a predetermined pressure greater than 1 atm; at least one replaceable thermal insulation liner, including an outer layer and an inner layer; and a fan, arranged in the accommodating space , and is connected to a drive motor through a transmission shaft protruding out of the cavity, whereby the contaminated and clean replacement heat insulation liners can be replaced quickly, and multiple radial expansion structures and multiple C-type The ring is tight in the furnace, so that the maintenance work can be completed quickly, the shutdown maintenance time is greatly shortened, and the production efficiency and production capacity are effectively increased.

Description

Electronic component heating and pressure treatment furnace rapid preparation device

The present invention provides a technical field of an electronic component processing furnace, especially a rapid preparation device for a heating and pressurizing processing furnace for electronic components. The polluted and clean replacement heat insulation linings can be quickly replaced.

According to, in the process of manufacturing electronic components, a treatment furnace with heating and pressurization functions is often used, and some process chemicals in the heating process of the known heating and pressurization function of the treatment furnace will be due to volatilization or Evaporate and diffuse in the processing chamber. When the process is cooled, the gaseous process chemicals floating in the processing chamber condense and form pollutants that adhere to the inner wall of the chamber, causing the machine to be shut down for cleaning and maintenance after a period of time. In this way, the cleaning and maintenance of the furnace is costly and time-consuming, resulting in reduced production time and a decrease in production capacity. However, in the processing of electronic components, it is not allowed to stop for too long, which may easily cause the entire production line to fail to operate smoothly. In addition to low efficiency , It also seriously affects the production capacity, so it is known that the cleaning work has been shut down for too long, and there is a need for improvement.

Therefore, in view of the problems existing in the above-mentioned conventional structures, how to develop a more ideal and practical innovative structure is what consumers are eagerly looking forward to, and it is also the goal and direction that related businesses must work hard to develop breakthroughs.

In view of this, the inventor has been engaged in the manufacture, development and design of related products for many years. After careful design and careful evaluation for the above-mentioned goals, he finally obtained a practical invention.

The main purpose of the present invention is to provide a rapid preparation device for heating and pressurizing a furnace for electronic components, in which pollutants will adhere during the production process in the furnace. Lining, so when its contaminants adhere to make it a contaminated replacement thermal insulation liner, only need to replace the clean replacement thermal insulation liner, and then continue the production operation, so that the downtime can be compressed to a very short time Time, which can increase production efficiency and capacity.

In order to achieve the above purpose, the present invention provides a rapid preparation device for heating and pressurizing a furnace for electronic components. a heating device, arranged in the accommodating space, and used to adjust the temperature in the accommodating space to a predetermined temperature; at least one pressurizing device, used to adjust the pressure in the accommodating space to be greater than 1 atm a predetermined pressure; at least one replaceable thermal insulation liner, comprising an outer layer and an inner layer, wherein the distance between the outer layer and the inner layer is greater than 1 μm; and a fan, arranged in the accommodating space, and via A transmission shaft protruding from the barrel body is connected to a drive motor. According to this, the polluted and clean replacement heat insulation linings can be quickly replaced, and can be pressed tightly in the furnace by using multiple radially expanding structures and multiple C-shaped rings, so that the maintenance work can be completed quickly and the shutdown maintenance The time is greatly shortened, and the production efficiency and production capacity are effectively increased.

Regarding the technology, means and effects used in the present invention, a preferred embodiment will be described in detail in conjunction with the drawings. It is believed that the above-mentioned purpose, structure and characteristics of the present invention can be gained a deep and specific understanding. .

10: Cavity

11: door

12: cylinder body

13:Accommodating space

14: Drive shaft

15: Drive motor

20: Heating device

30: Replacement heat insulation bushing

31: outer layer

32: inner layer

33:Enclosed and insulated space

35: slot

351: radial expansion structure

36: C-shaped ring

37: Stretching structure

30a: Replacement thermal insulation bushing

31a: outer layer

32a: inner layer

33a: Enclosing an insulated space

35a: slot

351a: radial expansion structure

36a: C-shaped ring

37a: Stretched structure

38a: plate group

41: The first pressurizing device

42: Second pressurizing device

50: fan

60: Particle detector

70:Separator

[Fig. 1] is a three-dimensional schematic diagram of an embodiment of the present invention.

[Fig. 2] is a schematic plan view of the front view of one embodiment of the present invention.

[Fig. 3] is a schematic cross-sectional view of A-A in Fig. 2.

[Fig. 3A] is a partially enlarged view of Fig. 3.

[Fig. 4] is a cross-sectional view showing the action of replacing the replaceable heat-insulating bushing in one embodiment of the present invention.

[Fig. 5] is a three-dimensional schematic diagram of a replaceable heat-insulating bushing according to one embodiment of the present invention.

[Fig. 6] is a schematic side sectional view of a replaceable heat-insulating bushing according to an embodiment of the present invention.

[Fig. 7] is a schematic side sectional view of another embodiment of the present invention.

[Fig. 7A] is a partially enlarged view of Fig. 7.

[Fig. 8] is a three-dimensional schematic diagram of a replaceable heat-insulating bushing according to another embodiment of the present invention.

[Fig. 9] is a schematic side sectional view of a replacement heat-insulation bushing according to another embodiment of the present invention.

[Fig. 10] is a schematic side sectional view of yet another embodiment of the present invention.

[Fig. 11] is a schematic side sectional view of yet another embodiment of the present invention.

The present invention provides a designer of a rapid preparation device for heating and pressurizing a furnace for electronic components.

In order to enable your review committee members to have a further understanding and understanding of the purpose, characteristics and effects of the present invention, the detailed description of the implementation and drawings is as follows: refer to Figures 1 to 6, an embodiment of the present invention provides A rapid preparation device for heating and pressurizing a furnace for electronic components, which includes: a cavity 10, the cavity 10 includes a door 11 and a cylinder body 12, and an accommodation space 13 is formed inside the cylinder body 12; at least one heating device 20, set in the accommodating space 13, and used to adjust the temperature in the accommodating space 13 to a predetermined temperature; At least one replaceable heat insulating liner 30 is set to present a C-shape in cross-section, comprising an outer layer 31 and an inner layer 32, wherein the outer layer 31 is arranged on the inner wall of the cylinder body 12, and the inner layer 32 is opposite The outer layer 31 is arranged inside the accommodating space 13 to form an enclosed heat-insulating space 33 between the outer layer 31 and the inner layer 32, and the distance between the outer layer 31 and the inner layer 32 is greater than 1 μm, the thickness of the inner layer 32 is less than the thickness of the cylinder body 12 corresponding to the replaceable heat-insulating bushing 30, and the replacement-type heat-insulating bushing 30 is disconnected in a slot 35 to allow shaft The radial expansion structure 351 is arranged in a row, so that the replacement heat insulation bushing 30 is supported by radial expansion force, and can be fixed in the cylinder body 12, or the replacement heat insulation bushing 30 can be reversely detached from the inner wall of the cylinder body 12. a heat-insulating bushing 30; a first pressurizing device 41, which is used to adjust the pressure in the accommodating space 13 to a predetermined pressure greater than 1 atm; and a fan 50, which is arranged in the accommodating space 13, and It is connected to a driving motor 15 through a transmission shaft 14 protruding from the cylinder body 12 , and the fan 50 is driven to rotate through the driving motor 15 to promote the temperature regulation efficiency of the heating device 20 to the accommodating space 13 .

Referring to Figures 1 and 7 to 9, another embodiment of the present invention provides a rapid preparation device for heating and pressurizing a furnace for electronic components, which includes: a cavity 10, which includes a door 11 and a barrel body 12, forming an accommodating space 13 inside the cylinder body 12; at least one heating device 20 is arranged in the accommodating space 13, and is used to adjust the temperature in the accommodating space 13 to a predetermined temperature; at least A replaceable heat-insulating bushing 30a, which is set to present a C-shape in section, includes an outer layer 31a and an inner layer 32a, wherein the outer layer 31a is arranged on the inner wall of the cylinder body 12, and the inner layer 32a is opposite to The outer layer 31a is disposed inside the accommodating space 13 to form an enclosed heat-insulating space 33a between the outer layer 31a and the inner layer 32a, and wherein the outer layer The distance between 31a and the inner layer 32a is greater than 1 μm, and the thickness of the inner layer 32a is smaller than the thickness of the part of the cylinder body 12 corresponding to the replacement heat-insulation bushing 30a; the replacement heat-insulation bushing 30a A plate group 38a protruding toward the accommodating space 13 is provided at the slot 35a that is disconnected at both ends. The plate group 38a is combined with a radial expansion structure 351a, so that the replaceable heat-insulating bushing 30a has radial Expansion force support can be fixed on the inner wall of the cylinder body 12, or the replacement heat insulating liner 30a can be detached reversely from the inner wall of the cylinder body 12; a first pressurizing device 41 is used for the accommodating space The pressure in 13 is adjusted to a predetermined pressure greater than 1 atm; and a fan 50 is arranged in the accommodating space 13 and is connected to a drive motor 15 through a transmission shaft 14 protruding from the cylinder body 12, The fan 50 is driven to rotate by the driving motor 15 to promote the temperature regulation efficiency of the heating device 20 to the accommodating space 13 .

Referring to Figures 1 to 6, the described electronic component heating and pressure treatment furnace rapid preparation device, wherein the enclosed heat insulation space 33 is non-sealed, and the first pressurization device 41 enables the replacement The pressure in the closed insulation space 33 of the type heat insulation liner 30 is adjusted to a pressure that is substantially the same as the pressure in the accommodating space 13, thereby preventing the replacement type heat insulation liner 30 from entering the accommodating space. Deformation occurs when the pressure in 13 changes.

Referring to Figures 1 to 6, the rapid preparation device for heating and pressurizing a furnace for electronic components, wherein the inner layer 32 is axially arranged with several C-shaped rings 36 toward the accommodating space 13, and the C-shaped ring A stretching structure 37 can be locked at both ends of the ring 36 to stretch and fix the replacement heat-insulation bushing 30 or reversely detach the C-shaped ring 36 from the replacement heat-insulation bushing 30. The stretching structure 37. Depending on the compressive strength of the replaceable heat-insulating liner 30, the stretching and fixing force can be adjusted, so that the C-shaped ring 36 can fasten the replaceable heat-insulating liner 30 to the surface of the inner layer 32, and by strengthening the replacement The fixing effect of type thermal insulation bushing 30.

Referring to Figures 1 to 6, the described electronic component heating and pressure treatment furnace Quick preparation device, wherein one end of the stretching structure 37 is provided with a right-handed thread, and the other end is provided with a left-handed thread, by fast locking or loosening the C-shaped ring 36 .

Referring to Figures 1 to 6, the described electronic component heating and pressure treatment furnace rapid preparation device, wherein each of the C-shaped rings 36 is evenly arranged, so that each of the C-shaped rings 36 is insulated from the replacement The bushing 30 exerts force evenly to fasten the replaceable heat-insulating bushing 30 to the surface of the inner layer 32 , thereby strengthening the fixing effect of the replaceable heat-insulating bushing 30 .

Referring to Figures 7 to 9, the described electronic component heating and pressure treatment furnace rapid preparation device, wherein the enclosed heat insulation space 33a is non-sealed, and the first pressurization device 41 makes the replacement The pressure in the closed insulation space 33a of the type heat insulation liner 30a is adjusted to a pressure that is substantially the same as the pressure in the accommodating space 13, so as to prevent the replacement type heat insulation liner 30a from entering the accommodating space. Deformation occurs when the pressure in 13 changes.

Referring to Figures 7 to 9, the described electronic component heating and pressure treatment furnace rapid preparation device, wherein the inner layer 32a is axially arranged with several C-shaped rings 36a toward the accommodating space 13, and the C-shaped ring A stretching structure 37a can be locked at both ends of the ring 36a to stretch and fix the replacement heat-insulating bushing 30a or detach the C-shaped ring 36a from the replacement heat-insulating bushing 30a in reverse. 37a can adjust the stretching and fixing force according to the compressive strength of the replacement heat insulation bushing 30a, so that the C-shaped ring 36a can fasten the replacement heat insulation bushing 30a to the surface of the inner layer 32a, by strengthening the replacement The fixed setting effect of type thermal insulation bushing 30a.

Referring to Figures 3, 3A, 7 and 7A, the described electronic component heating and pressure treatment furnace rapid preparation device, wherein the first pressurizing device 41 is to make the pressure in the accommodating space 13 and the enclosure The pressure in the heat insulation spaces 33, 33a is substantially simultaneously adjusted to the predetermined pressure to operate.

Referring to Figures 1 to 6 and Figure 11, the described electronic component heating and pressure treatment furnace rapid preparation device further includes a second pressurization device 42, and the enclosed heat insulation space 33 is sealed, and the second pressurizing device 42 operates in such a way that the pressure in the accommodating space 13 and the pressure in the enclosed heat-insulating space 33 are substantially simultaneously adjusted to the predetermined pressure.

Referring to Figures 3, 3A, 10 and Figure 11, the described electronic component heating and pressure treatment furnace rapid preparation device further includes a particle detector 60 connected to the enclosed heat-insulating space 33 to Detect the particle content discharged from the enclosed heat insulation space 33 to judge whether it is necessary to supplement or replace the filling material in the enclosed heat insulation space 33 to quickly replace the replaceable heat insulation liner 30 .

Referring to Fig. 6 and Fig. 9, the above-mentioned electronic component heating and pressure treatment furnace rapid preparation device, wherein the enclosed heat insulation space 33, 33a is filled with a substance with a thermal conductivity lower than 16W/mK .

Said electronic component heating and pressure treatment furnace rapid preparation device, wherein the substance is gas.

Said electronic component heating and pressurizing furnace rapid preparation device, wherein the gas is air or nitrogen.

Said electronic component heating and pressure treatment furnace rapid preparation device, wherein the substance is carbon, glass, Teflon or water.

Referring to Figures 5 to 9, the rapid preparation device for heating and pressurizing a furnace for electronic components, wherein the replacement heat-insulating bushings 30, 30a are made of metal.

Referring to Figures 3, 4, 6, 10 and 11, the rapid preparation device for the heating and pressure treatment furnace of electronic components further includes at least one partition 70 for separating the enclosed heat-insulating space 33 into a plurality of area.

Referring to Figures 3, 4, 6, 10 and 11, the described electronic component heating and pressure treatment furnace rapid preparation device, wherein the separator 70 is made of metal.

From the above, it can be seen that the rapid preparation device for heating and pressurizing the electronic component furnace of the present invention is indeed the first in the industry and meets the novelty requirements of the invention patent, and its comprehensive innovative design meets the progressive requirements of the invention patent. Wherein, there will be pollutants attached during the production process in the furnace, and the heat-insulating bushing on the surrounding surface of the accommodating space of the present invention is set as a replaceable heat-insulated bushing, so when the pollutants adhere to it, it becomes a polluted replacement insulation When heating the liner, only need to replace the clean replacement heat-insulating liner, and the production operation can be continued, so that the downtime can be reduced to a very short time, which can increase the production efficiency and production capacity, which is in line with the better industrial utilization.

The above is a specific description of the technical characteristics of the present invention for the preferred embodiments of the present invention; however, those who are familiar with this technology should be able to change and modify the present invention without departing from the spirit and principles of the present invention. Such changes and modifications shall all be covered in the scope defined by the scope of the patent application as follows.

In summary, the present invention provides a rapid preparation device for heating and pressurizing furnaces for electronic components, which has indeed achieved all the objectives of the present invention, and the spatial form of its combined structure has not been seen in similar products, nor has it been disclosed before the application , has complied with the provisions of the Patent Law, and filed an application according to the law.

12: cylinder body

30: Replacement heat insulation bushing

31: outer layer

32: inner layer

33:Enclosed and insulated space

36: C-shaped ring

37: Stretching structure

351: radial expansion structure

70:Separator

Claims (18)

A rapid preparation device for heating and pressurizing a furnace for electronic components, comprising: a cavity, the cavity includes a door and a cylinder body, and an accommodating space is formed inside the cylinder body; at least one heating device is arranged in the accommodating space , and is used to adjust the temperature in the accommodating space to a predetermined temperature; at least one replaceable thermal insulation liner is set to have a C-shaped cross-section, including an outer layer and an inner layer, wherein the outer layer is arranged on On the inner wall of the cylinder body, and the inner layer is arranged inside the accommodating space relative to the outer layer, so as to form an enclosed and heat-insulating space between the outer layer and the inner layer, and the thickness of the inner layer is less than The thickness of the barrel part corresponding to the replaceable heat-insulating liner, in a slot where the replaceable heat-insulate liner is disconnected, several radial expansion structures are arranged in the axial direction, so that the replaceable heat-insulate liner The sleeve is supported by radial expansion force, so that it can be fixed in the barrel, or detach the replaceable heat-insulating liner from the inner wall of the barrel in reverse; a first pressurizing device is used to The pressure is adjusted to a predetermined pressure greater than 1 atm; and a fan is arranged in the accommodating space and is connected to a drive motor through a transmission shaft protruding from the barrel, and the fan is driven by the drive motor Rotate to promote the temperature regulation efficiency of the heating device to the accommodating space. The rapid preparation device for heating and pressurizing a furnace for electronic components as described in Claim 1, wherein the enclosed heat-insulating space is not sealed, and the enclosure of the replaceable heat-insulating liner is made possible by the first pressurizing device The pressure in the closed heat insulation space is adjusted to a pressure that is substantially the same as the pressure in the accommodating space, so as to prevent the replacement heat insulation liner from being deformed when the pressure in the accommodating space changes. The rapid preparation device for heating and pressurizing a furnace for electronic components as described in claim 1, which further includes a second pressurizing device, and the enclosed heat-insulating space is hermetically sealed. The second pressurizing device operates in such a way that the pressure in the accommodating space and the pressure in the enclosed heat-insulating space are adjusted to the predetermined pressure substantially simultaneously. The rapid preparation device for heating and pressurizing a furnace for electronic components as described in Claim 1, wherein several C-shaped rings are axially arranged on the inner layer toward the accommodating space, and a stretcher can be locked at both ends of the C-shaped ring structure, which can be stretched to fix the replacement thermal insulation liner or reversely detach the C-ring from the replacement thermal insulation liner. The rapid preparation device for heating and pressurizing a furnace for electronic components as described in Claim 4, wherein one end of the stretching structure is provided with a right-handed thread, and the other end is provided with a left-handed thread, and the C-shaped ring is quickly locked or loosened. The rapid preparation device for heating and pressurizing a furnace for electronic components as described in Claim 4 or 5, wherein each of the C-shaped rings is uniformly arranged, so that each of the C-shaped rings exerts a uniform force on the replaceable heat-insulating bushing, The replacement insulating liner is fastened to the inner surface. The rapid preparation device for heating and pressurizing a furnace for electronic components as described in claim 1 further includes at least one partition for dividing the enclosed heat-insulating space into a plurality of areas. The rapid preparation device for heating and pressurizing a furnace for electronic components according to claim 7, wherein the separator is made of metal. A rapid preparation device for heating and pressurizing a furnace for electronic components, comprising: a cavity, the cavity includes a door and a cylinder body, and an accommodating space is formed inside the cylinder body; at least one heating device is arranged in the accommodating space , and is used to adjust the temperature in the accommodating space to a predetermined temperature; at least one replaceable thermal insulation liner is set to have a C-shaped cross-section, including an outer layer and an inner layer, wherein the outer layer is arranged on On the inner wall of the cylinder body, and the inner layer is arranged inside the accommodating space relative to the outer layer, so as to form an enclosed and heat-insulating space between the outer layer and the inner layer, and the thickness of the inner layer is less than with this replacement thermal liner The sleeve corresponds to the thickness of the barrel part. A plate group protruding into the accommodating space is provided at the gap at both ends of the replaceable heat-insulating bushing. The plate group is combined with a radial expansion structure , so that the replaceable heat insulating liner is supported by radial expansion force, and can be fixed on the inner wall of the cylinder body, or reversely detach the replaceable heat insulating liner from the inner wall of the cylinder body; a first pressurizing device , used to adjust the pressure in the accommodating space to a predetermined pressure greater than 1 atm; and a fan, arranged in the accommodating space, and connected to a drive via a transmission shaft protruding from the cylinder body The motor is used to drive the fan to rotate through the driving motor, so as to promote the temperature regulation efficiency of the heating device to the accommodating space. The rapid preparation device for heating and pressurizing a furnace for electronic components as described in Claim 9, wherein the enclosed heat insulation space is not sealed, and the enclosure of the replaceable heat insulation liner is made possible by the first pressurizing device The pressure in the closed heat insulation space is adjusted to a pressure that is substantially the same as the pressure in the accommodating space, so as to prevent the replacement heat insulation liner from being deformed when the pressure in the accommodating space changes. The rapid preparation device for heating and pressurizing a furnace for electronic components as described in Claim 9, wherein the inner layer is axially arranged with several C-shaped rings toward the accommodating space, and a stretcher can be locked at both ends of the C-shaped ring structure, which can be stretched to fix the replacement thermal insulation liner or reversely detach the C-ring from the replacement thermal insulation liner. The rapid preparation device for heating and pressurizing a furnace for electronic components according to claim 9, wherein the first pressurizing device is to adjust the pressure in the accommodating space and the pressure in the enclosed heat-insulating space substantially simultaneously To the predetermined pressure to operate. The rapid preparation device for heating and pressurizing a furnace for electronic components as described in claim 2 or 3 further includes a particle detector connected to the enclosed heat-insulating space to detect particles discharged from the enclosed heat-insulating space content. According to claim 1 or 9, the rapid preparation device for heating and pressurizing a furnace for electronic components, wherein a material having a thermal conductivity lower than 16W/mK is filled in the enclosed heat-insulating space. The rapid preparation device for heating and pressurizing a furnace for electronic components according to claim 14, wherein the substance is gas. The rapid preparation device for heating and pressurizing a furnace for electronic components as described in claim 15, wherein the gas is air or nitrogen. The rapid preparation device for heating and pressurizing a furnace for electronic components according to claim 14, wherein the substance is carbon, glass, Teflon or water. The rapid preparation device for heating and pressurizing a furnace for electronic components according to claim 1 or 9, wherein the replaceable heat-insulating bushing is made of metal.

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