TW201411027A - Light-emitting device - Google Patents
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Abstract
Description
本發明係一種發光裝置，尤指一種將具半導體發光單元之透明基板而形成的發光板/發光片以立設的方式，透過黏接或插接而耦接於承載結構的發光裝置。
The present invention relates to a light-emitting device, and more particularly to a light-emitting device in which a light-emitting panel/light-emitting sheet formed by a transparent substrate having a semiconductor light-emitting unit is coupled to a load-bearing structure through a bonding or plugging manner.
在照明技術的領域中，近代對於光源多以兼顧成本、環保以及節電等方向進行發展，以訴求在耗費較少能源的條件下獲得較佳的照明效益，這使得發光二極體在此發展歷程中扮演著重要的角色。
發光二極體除了耗電低、不含汞、壽命長以及二氧化碳排放量低等優勢外，其已普遍應用於3C產品指示器與顯示裝置之上；而再隨著發光二極體生產良率的提高，單位製造成本也已大幅降低，因此發光二極體的需求持續增加。
而若要將發光二極體或類似的發光單元實際應用於照明燈具，則仍有許多發展的空間。過去在利用發光二極體做為光源時，大多為將數個發光二極體晶片或是發光二極體排列佈置於一平面且為單方向出光，或是更進一步在晶片底部設置光學反射層，以提高單個發光二極體本身的出光效率。
然而，這種佈置方式對於製作大照明角度的燈具並不是很有利，因為發光二極體本身所產生的光當中，僅有部份得以往照明的方向行進，另一部份的光能則被吸收於燈具底座或是在反射的過程中損失，因此需要設置更多的發光二極體來做彌補。
再者，過往的發光二極體燈具多是以平面的基板作為承載發光二極體的底座，因此侷限了在佈置發光二極體於其上的靈活性。若其將基板製作非為平面時，平躺於基板表面的發光二極體所產生的光將會因基板不平整的結構而受到些許遮蔽或是阻礙，這對於減少耗能和降低成本都有不利的影響。因此，發光二極體在做為照明燈具的應用上，仍然有改進的空間存在。
In the field of lighting technology, modern light sources have developed in the direction of cost, environmental protection and power saving, in order to obtain better lighting benefits under the condition of less energy, which makes the development of light-emitting diodes. Play an important role.
In addition to low power consumption, mercury-free, long life and low carbon dioxide emissions, the LEDs have been widely used in 3C product indicators and display devices, and with the production yield of LEDs. The increase in unit manufacturing costs has also been greatly reduced, so the demand for light-emitting diodes continues to increase.
However, if a light-emitting diode or a similar light-emitting unit is actually applied to a lighting fixture, there is still much room for development. In the past, when a light-emitting diode was used as a light source, a plurality of light-emitting diode chips or light-emitting diodes were arranged in a plane and unidirectionally emitted, or an optical reflective layer was further disposed at the bottom of the wafer. In order to improve the light-emitting efficiency of the single light-emitting diode itself.
However, this arrangement is not very advantageous for making lamps with large illumination angles, because only part of the light generated by the light-emitting diode itself travels in the direction of the previous illumination, and the other part of the light energy is Absorbed in the base of the lamp or lost during the reflection process, so more LEDs need to be set to make up.
Moreover, the conventional light-emitting diode lamps mostly use a flat substrate as a base for carrying the light-emitting diodes, thus limiting the flexibility in arranging the light-emitting diodes thereon. If the substrate is made non-planar, the light generated by the light-emitting diode lying on the surface of the substrate will be slightly obscured or hindered by the uneven structure of the substrate, which has the advantages of reducing energy consumption and reducing cost. negative effect. Therefore, there is still room for improvement in the application of the light-emitting diode as a lighting fixture.
本發明之主要目的，係提供一種發光裝置，其係將承載有多方向出光之半導體發光單元的透明基板做為發光板，並將之立設於基板、電路板等承載結構之上，以做為一種具照明功能的發光裝置。
本發明之另一目的，係提供一種發光裝置，其係在插接承載有多方向出光之半導體發光單元的透明基板於承載結構之上時，可依需求而採用單插式或雙插式結構，具有靈活性。
本發明之再一目的，係提供一種發光裝置，其承載結構可為非為平面而具有翹曲之結構，使承載有多方向出光之半導體發光單元的透明基板設置於承載結構之上時，可依翹曲之程度而直接使透明基板以及承載結構非翹曲部分之間具有特定之夾角。
為了達成目的，本發明揭示了一種發光裝置，其係包含：一承載結構，其具有至少一接合區；至少一透明基板，與該些接合區相耦接；以及至少一多方向出光之半導體發光單元，設置於該透明基板之一發光面，其所發出之光線至少部分穿透該透明基板中相對應該發光面之一透光面；其中，該透明基板與該接合區相耦接之方式係選自於黏接以及插接所組成之群組其中之一者。如此架構之下，發光裝置在製作方法上的靈活度高、製程簡單且可靠度高，還同時兼具了發光效果佳、低耗電量以及出光均勻等優點。
The main object of the present invention is to provide a light-emitting device that uses a transparent substrate carrying a semiconductor light-emitting unit that emits light in multiple directions as a light-emitting panel, and erects it on a substrate, a circuit board, or the like, to make It is a lighting device with illumination function.
Another object of the present invention is to provide a light-emitting device that can be used in a single-inserted or double-inserted structure when a transparent substrate carrying a semiconductor light-emitting unit that emits light in multiple directions is inserted over a load-bearing structure. , with flexibility.
A further object of the present invention is to provide a light-emitting device, wherein the load-bearing structure can be a non-planar structure having a warp structure, and the transparent substrate carrying the semiconductor light-emitting unit with multi-directional light output can be disposed on the load-bearing structure. The specific angle between the transparent substrate and the non-warped portion of the load-bearing structure is directly caused by the degree of warpage.
In order to achieve the object, the present invention discloses a light emitting device comprising: a carrier structure having at least one bonding region; at least one transparent substrate coupled to the bonding regions; and at least one multi-directional light emitting semiconductor light emitting The unit is disposed on a light emitting surface of the transparent substrate, and the light emitted by the transparent substrate is at least partially penetrates a light transmitting surface of the corresponding light emitting surface of the transparent substrate; wherein the transparent substrate is coupled to the bonding region It is selected from one of the group consisting of bonding and plugging. Under such a structure, the illuminating device has high flexibility in the manufacturing method, simple process and high reliability, and also has the advantages of good illuminating effect, low power consumption and uniform light emission.
本發明之特徵及所達成之功效以較佳之實施例及配合詳細之說明，說明如後：
首先，請參考第一圖，此圖是本發明之發光裝置的結構示意；如圖所示，發光裝置1係包含：一承載結構11；至少一透明基板12；至少一發光面121；至少一透光面122；至少一多方向出光之半導體發光單元13以及至少一接合區110。
其中，呈薄片狀的透明基板12具有一定厚度並係立設於承載結構11，且兩者之間具有夾角θ，此夾角θ係介於30°~150°，使得透明基板12並非平躺於承載結構11之上。而發光面121和透光面122係指透明基板12本身相互對應的兩面，且發光面121上設置了該半導體發光單元13。透明基板12係耦接於承載結構11的接合區110，耦接的方式則可為黏接/焊接或是插接。
於本發明中，承載結構11是用以兼具承載、供電以及散熱等功能的基座，其材質可選用鋁製基板、金屬基印刷電路板、玻璃纖維板，或是氮化鋁基板、氧化鋁基板等，而外形也不限定為第一圖中所示之矩形，其亦可為圓形、多邊形，甚至為具有中空之圓形、多邊形等，只要能讓透明基板12立於其上即可。
於本發明中，透明基板12係設計為厚度大於200微米(μm)以有最佳化之可靠度與成本效益，同時設計該基板於該發光單元之光線波長範圍大於或等於420奈米(nm)，以及光線波長範圍小於或等於470奈米(nm)時，透光率大於或等於70%，如此可使本發明之發光裝置有最均勻之發光效果；另外本發明中之透明基板的材質係可選擇自氧化鋁、玻璃、塑膠或橡膠等半透明或全透明材料。
半導體發光單元13是一種多方向出光之發光二極體，係設置於透明基板12的其中一面，使該面形成一個發光面121，同時因為從該發光單元所發出之部分的光可以穿透過透明基板12，使基板12相對應發光面的另一面成為透光面122。
於本發明中，透明基板12係設置於承載結構11的接合區110，而此接合區110具有與該半導體發光單元13電性耦接，而使外部電源對之供電的功能，其可包含有一個以上的插孔111。請參考第二A以及第二B圖，其係為透過單孔式插接透明基板12於承載結構11上之結構示意圖。此時透明基板12上的發光單元13為了要與承載結構11電性耦接，因此透明基板12的表面具有線路與該發光單元電性連接，並於基板邊緣形成具有複數個導電觸片123的金手指結構，也就是電性連接埠。而接合區110的插孔111則具有電極，讓透明基板12插入後使該電極與該導電觸片123電性耦接，再透過基板線路使得該發光單元13可透過該承載結構11接收供電，同時透明基板12也被固定於承載結構11的接合區110。
接著，請參考第三A以及第三B圖，其係為透過雙孔式插接透明基板12於承載結構11上之結構示意圖。此時透明基板12具有雙插腳結構，使電性連接於發光單元13之線路之一端分別設置，其中一個插腳為正極，另一個則為負極，兩處皆為具有導電觸片123作為連接埠。而相對應地，在承載結構11的接合區110則具有兩個與插腳大小相等的插孔111，使得透明基板12可以順利接合於承載結構11之上，並讓發光單元13獲得供電。
請參考第四A以及第四B圖，其係改以黏接或焊接的方式將透明基板12直接接合於承載結構11的接合區110。在黏接的過程中，可以透過金、錫、銦、鉍、銀等金屬材料做焊接輔助而接合，或是使用具導電性的矽膠輔助固定透明基板12。
另外，請參考第五圖，位於透明基板12上的複數個半導體發光單元13分別具有一發光表面131，此些發光表面131係指在發光單元13的結構中，與透明基板12的發光面121大體上呈平行且暴露出的一面。於本發明中，透明基板12的發光面121之面積係為該些發光表面131之總面積的五倍以上，此係兼顧到發光效率以及散熱等條件而為較佳的配置比例。
如前所述，於本發明中，呈薄片狀的透明基板12與承載結構11之間具有夾角θ，使得透明基板12並非平躺於承載結構11之上。緣此，透明基板12在黏接或是插接於承載結構11的接合區110時，請分別參考第六圖以及第七圖，在黏接的場合中，係將透明基板12與承載結構11調整至適當的夾角θ後，利用金、錫、銦、鉍、銀或是導電矽膠等黏接物14的固化而使透明基板12固定住；而在插接的場合中，則是將接合區110的插孔111預設為與承載結構11之間具有夾角θ，使得插接於插孔111的透明基板12可直接與承載結構11具有夾角θ。
由於發光單元13的發光過程中會產生熱量，因此除了承載結構11本身的散熱功能之外，請參考第八圖，本發明之發光裝置1還可進一步於承載結構11的表面設置散熱層15，以提升散熱的功能。此散熱層15的是由高散熱材質所製成。
請參考第九A、第九B以及第九C圖，本發明中的承載結構11亦可設計為非平面結構，其可具有至少一翹曲體112，係位於承載結構的表面或是側邊，而此時接合區110則係位於翹曲體112的位置上。由於承載結構11具有翹曲體112，因此增加了在應用時的靈活性，有利於針對不同場合的需求而推出具有變化性的發光裝置1。當承載結構11具有翹曲體112時，透明基板12係可透過黏接的方式與翹曲體112相耦接，也就是藉由黏接物14的輔助而將透明基板12固定於承載結構11，並與承載結構11非翹曲的部分的表面維持具有夾角θ；另外，透明基板12亦可透過插接的方式與翹曲體112相耦接，也就是藉由連接器（圖未示）的輔助而將透明基板12固定於承載結構11，而與承載結構11非翹曲的部分的表面維持具有夾角θ。
最後，請參考第十圖，其係揭示本發明的導電路徑中，除了透過前述基於承載結構11的接合區110來與發光單元13做電性耦接以外，也可透過導線3直接電性耦接於該發光單元，並經過承載結構11後再匯集至下方的底座2，而與外部電源相耦接，使得發光單元13得以獲得電能而發光。此底座2即為一般尋常之燈泡底座，讓本發明可以輕易地和此些燈泡底座搭配而為安裝與拆卸，在替換和升級上具有便利性。
藉由本發明所揭示之發光裝置的結構，將多方向出光之半導體發光單元設置於透明基板上而形成的發光板/發光片可獲致有效且充分的靈活運用；並且透明基板的兩個主要面方向皆可出光，因此能在最少的供電之下獲得最大的出光效率，並且藉著透明基板與承載結構之間不同的耦接方式，也增加了在設計和應用上的靈活性，無論是在應用於燈泡、燈管、廣告看板等領域，皆可展現其發光效果佳、低耗電量以及出光均勻等優點，為具經濟和實用價值的發光裝置。
惟以上所述者，僅為本發明之較佳實施例而已，並非用來限定本發明實施之範圍，舉凡依本發明申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾，均應包括於本發明之申請專利範圍內。
The features of the present invention and the achievable effects are described in the preferred embodiments and in conjunction with the detailed description.
First, please refer to the first figure, which is a schematic structural view of the light-emitting device of the present invention; as shown, the light-emitting device 1 includes: a load-bearing structure 11; at least one transparent substrate 12; at least one light-emitting surface 121; at least one The light transmissive surface 122; the at least one multi-directional light emitting semiconductor light emitting unit 13 and the at least one bonding region 110.
The transparent substrate 12 having a thickness of a sheet has a certain thickness and is erected on the supporting structure 11 with an included angle θ therebetween. The angle θ is between 30° and 150°, so that the transparent substrate 12 is not lying flat. Above the load-bearing structure 11. The light-emitting surface 121 and the light-transmissive surface 122 refer to two surfaces of the transparent substrate 12 that correspond to each other, and the semiconductor light-emitting unit 13 is disposed on the light-emitting surface 121. The transparent substrate 12 is coupled to the joint region 110 of the load-bearing structure 11, and the coupling manner may be adhesion/welding or plugging.
In the present invention, the load-bearing structure 11 is a base for carrying functions of carrying, power supply, and heat dissipation, and the material thereof may be an aluminum substrate, a metal-based printed circuit board, a fiberglass board, or an aluminum nitride substrate or an alumina. The substrate and the like are not limited to the rectangular shape shown in the first figure, and may be circular, polygonal, or even have a hollow circle, a polygon, etc., as long as the transparent substrate 12 can be placed thereon. .
In the present invention, the transparent substrate 12 is designed to have a thickness greater than 200 micrometers (μm) for optimized reliability and cost effectiveness, and the substrate is designed to have a light wavelength range of greater than or equal to 420 nm (nm) in the light emitting unit. When the light wavelength range is less than or equal to 470 nanometers (nm), the light transmittance is greater than or equal to 70%, so that the light-emitting device of the present invention has the most uniform light-emitting effect; and the material of the transparent substrate of the present invention It can be selected from translucent or fully transparent materials such as alumina, glass, plastic or rubber.
The semiconductor light-emitting unit 13 is a multi-directional light-emitting diode disposed on one side of the transparent substrate 12 such that the surface forms a light-emitting surface 121, and at the same time, the light emitted from the light-emitting unit can penetrate through the transparent surface. The substrate 12 has the other surface of the substrate 12 corresponding to the light-emitting surface as the light-transmissive surface 122.
In the present invention, the transparent substrate 12 is disposed on the bonding region 110 of the carrying structure 11, and the bonding region 110 has a function of electrically coupling the semiconductor light emitting unit 13 to power the external power source, which may include More than one jack 111. Please refer to the second A and second B diagrams, which are schematic diagrams of the transparent substrate 12 being inserted into the supporting structure 11 through a single hole. In this case, the light-emitting unit 13 on the transparent substrate 12 is electrically coupled to the supporting structure 11 , so that the surface of the transparent substrate 12 has a line electrically connected to the light-emitting unit, and a plurality of conductive contacts 123 are formed on the edge of the substrate. The gold finger structure, that is, the electrical connection. The socket 111 of the lands 110 has an electrode, and the transparent substrate 12 is inserted to electrically couple the electrode to the conductive contact 123, and then the substrate is traversed to enable the illuminating unit 13 to receive power through the carrying structure 11. At the same time, the transparent substrate 12 is also fixed to the land 110 of the carrier structure 11.
Next, please refer to the third A and third B diagrams, which are schematic diagrams of the transparent substrate 12 being inserted into the supporting structure 11 through the two-hole type. At this time, the transparent substrate 12 has a double-pin structure, and one end of the circuit electrically connected to the light-emitting unit 13 is respectively disposed. One of the pins is a positive electrode and the other is a negative electrode, and both of them have a conductive contact piece 123 as a connection port. Correspondingly, the joint region 110 of the load-bearing structure 11 has two sockets 111 of the same size as the pins, so that the transparent substrate 12 can be smoothly joined over the load-bearing structure 11 and the light-emitting unit 13 can be powered.
Please refer to the fourth A and fourth B drawings, which are to directly bond the transparent substrate 12 to the joint region 110 of the load-bearing structure 11 by bonding or welding. In the process of bonding, the metal material such as gold, tin, indium, antimony or silver may be used for soldering assistance, or the conductive transparent substrate 12 may be fixed by using a conductive silicone.
In addition, referring to FIG. 5 , the plurality of semiconductor light emitting units 13 on the transparent substrate 12 respectively have a light emitting surface 131 , and the light emitting surfaces 131 are in the structure of the light emitting unit 13 and the light emitting surface 121 of the transparent substrate 12 . The sides are generally parallel and exposed. In the present invention, the area of the light-emitting surface 121 of the transparent substrate 12 is five times or more the total area of the light-emitting surfaces 131. This is a preferred arrangement ratio in consideration of conditions such as luminous efficiency and heat dissipation.
As described above, in the present invention, the transparent substrate 12 in the form of a sheet has an angle θ with the load-bearing structure 11, so that the transparent substrate 12 is not lying on the support structure 11. Therefore, when the transparent substrate 12 is bonded or inserted into the bonding region 110 of the supporting structure 11, please refer to the sixth and seventh figures respectively. In the case of bonding, the transparent substrate 12 and the supporting structure 11 are used. After adjusting to an appropriate angle θ, the transparent substrate 12 is fixed by curing of the adhesive 14 such as gold, tin, indium, antimony, silver or conductive silicone; and in the case of plugging, the bonding area is The insertion hole 111 of the 110 is preset to have an angle θ with the load-bearing structure 11, so that the transparent substrate 12 inserted into the insertion hole 111 can directly have an angle θ with the load-bearing structure 11.
The light-emitting device 1 of the present invention may further provide a heat dissipation layer 15 on the surface of the load-bearing structure 11 in addition to the heat dissipation function of the load-bearing structure 11 in addition to the heat dissipation function of the light-emitting unit 13 . To enhance the function of heat dissipation. The heat dissipation layer 15 is made of a high heat dissipation material.
Referring to the ninth, ninth, and ninth C, the load-bearing structure 11 of the present invention may also be designed as a non-planar structure, which may have at least one warp body 112 on the surface or side of the load-bearing structure. At this time, the land 110 is located at the position of the warp body 112. Since the load-bearing structure 11 has the warp body 112, the flexibility in application is increased, and it is advantageous to introduce the illuminating device 1 having variability for the needs of different occasions. When the supporting structure 11 has the warping body 112, the transparent substrate 12 can be coupled to the warping body 112 by means of bonding, that is, the transparent substrate 12 is fixed to the supporting structure 11 by the aid of the adhesive 14. The surface of the non-warped portion of the load-bearing structure 11 is maintained at an angle θ; in addition, the transparent substrate 12 can also be coupled to the warp body 112 by means of plugging, that is, by a connector (not shown). The transparent substrate 12 is fixed to the load-bearing structure 11 while being assisted, and the surface of the portion of the load-bearing structure 11 that is not warped is maintained at an angle θ.
Finally, please refer to the tenth figure, which discloses that the conductive path of the present invention is electrically coupled to the light-emitting unit 13 through the joint region 110 based on the load-bearing structure 11 , and can be directly electrically coupled through the wire 3 . The light-emitting unit is connected to the lower base 2 through the load-bearing structure 11 and coupled to the external power source, so that the light-emitting unit 13 can obtain electric energy to emit light. The base 2 is a conventional bulb base, so that the present invention can be easily assembled and disassembled with the bulb bases, and is convenient for replacement and upgrade.
According to the structure of the light-emitting device disclosed by the present invention, the light-emitting panel/light-emitting sheet formed by disposing the multi-directional light-emitting semiconductor light-emitting unit on the transparent substrate can be effectively and fully utilized; and the two main faces of the transparent substrate are It can emit light, so it can get the maximum light-emitting efficiency with the least power supply, and by the different coupling between the transparent substrate and the load-bearing structure, it also increases the flexibility in design and application, whether in application. In the fields of light bulbs, lamps, advertising billboards, etc., it can exhibit the advantages of good luminous effect, low power consumption and uniform light emission, and is an economical and practical light-emitting device.
The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and the variations, modifications, and modifications of the shapes, structures, features, and spirits described in the claims of the present invention. All should be included in the scope of the patent application of the present invention.
1．．．發光裝置1. . . Illuminating device
11．．．承載結構11. . . Load bearing structure
110．．．接合區110. . . Junction area
111．．．插孔111. . . Jack
112．．．翹曲體112. . . Warp
12．．．透明基板12. . . Transparent substrate
121．．．發光面121. . . Luminous surface
122．．．透光面122. . . Translucent surface
123．．．導電觸片123. . . Conductive contact
13．．．半導體發光單元13. . . Semiconductor light emitting unit
131．．．發光表面131. . . Luminous surface
14．．．黏接物14. . . Adhesive
15．．．散熱層15. . . Heat sink
2．．．底座2. . . Base
3．．．導線3. . . wire
θ．．．夾角θ. . . Angle
第一圖：其係為本發明之一較佳實施例之發光裝置結構示意圖；
第二A圖：其係為本發明之一較佳實施例之單孔插接式透明基板結構示意圖；
第二B圖：其係為本發明之一較佳實施例之單孔插接透明基板於承載結構示意圖；
第三A圖：其係為本發明之一較佳實施例之雙孔插接式透明基板結構示意圖；
第三B圖：其係為本發明之一較佳實施例之雙孔插接透明基板於承載結構示意圖；
第四A圖：其係為本發明之一較佳實施例之黏接式透明基板結構示意圖；
第四B圖：其係為本發明之一較佳實施例之黏接透明基板於承載結構示意圖；
第五圖：其係為本發明之一較佳實施例之發光面與發光表面之示意圖；
第六圖：其係為本發明之一較佳實施例之斜向黏接透明基板於承載結構示意圖；
第七圖：其係為本發明之一較佳實施例之斜向插接透明基板於承載結構示意圖；
第八圖：其係為本發明之一較佳實施例之散熱層示意圖；
第九A圖：其係為本發明之再一較佳實施例之具翹曲體位於側邊之承載結構示意圖；
第九B圖：其係為本發明之另一較佳實施例之具翹曲體位於側邊之承載結構示意圖；
第九C圖：其係為本發明之再一較佳實施例之具翹曲體位於表面之承載結構示意圖；以及
第十圖：其係為本發明之再一較佳實施例之導線以及底座示意圖。
The first figure is a schematic structural view of a light-emitting device according to a preferred embodiment of the present invention;
2A is a schematic structural view of a single-hole plug-in transparent substrate according to a preferred embodiment of the present invention;
2B is a schematic view showing a bearing structure of a single-hole plugged transparent substrate according to a preferred embodiment of the present invention;
3A is a schematic structural view of a double-hole plug-in transparent substrate according to a preferred embodiment of the present invention;
FIG. 3B is a schematic view showing a bearing structure of a double-hole plugged transparent substrate according to a preferred embodiment of the present invention;
4A is a schematic structural view of a bonded transparent substrate according to a preferred embodiment of the present invention;
FIG. 4B is a schematic view showing a bonding structure of a bonded transparent substrate according to a preferred embodiment of the present invention;
Figure 5 is a schematic view showing a light-emitting surface and a light-emitting surface according to a preferred embodiment of the present invention;
Figure 6 is a schematic view showing a load-bearing structure of a diagonally bonded transparent substrate according to a preferred embodiment of the present invention;
Figure 7 is a schematic view showing a load-bearing structure of a diagonally inserted transparent substrate according to a preferred embodiment of the present invention;
Figure 8 is a schematic view showing a heat dissipation layer of a preferred embodiment of the present invention;
Figure 9 is a schematic view showing a bearing structure of a warped body on a side of a further preferred embodiment of the present invention;
FIG. IB is a schematic view showing a bearing structure of a warped body on a side of another preferred embodiment of the present invention;
FIG. 9 is a schematic view showing a bearing structure of a warped body on a surface according to still another preferred embodiment of the present invention; and a tenth drawing, which is a wire and a base of still another preferred embodiment of the present invention; schematic diagram.
1．．．發光裝置1. . . Illuminating device
11．．．承載結構11. . . Load bearing structure
110．．．接合區110. . . Junction area
12．．．透明基板12. . . Transparent substrate
121．．．發光面121. . . Luminous surface
122．．．透光面122. . . Translucent surface
13．．．半導體發光單元13. . . Semiconductor light emitting unit
θ．．．夾角θ. . . Angle
Claims (16)
一承載結構，其具有至少一接合區；
至少一透明基板，與該接合區相耦接；以及
至少一多方向出光之半導體發光單元，設置於該透明基板之一發光面；
其中，該發光單元所發出之光線至少部分穿透該透明基板，而從相對應該發光面之一透光面出光。A light emitting device comprising:
a load bearing structure having at least one joint region;
At least one transparent substrate coupled to the bonding region; and at least one multi-directional light emitting semiconductor light emitting unit disposed on one of the light emitting surfaces of the transparent substrate;
The light emitted by the light emitting unit at least partially penetrates the transparent substrate, and the light is emitted from a light transmitting surface corresponding to one of the light emitting surfaces.
Priority Applications (52)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101132185A TWI577919B (en) | 2012-09-04 | 2012-09-04 | Light emitting device |
| US13/834,246 US9166116B2 (en) | 2012-05-29 | 2013-03-15 | Light emitting device |
| US13/845,160 US9065022B2 (en) | 2012-05-29 | 2013-03-18 | Light emitting apparatus |
| CN201310191943.2A CN103456728B (en) | 2012-05-29 | 2013-05-22 | Light-emitting component and light-emitting device thereof |
| CN201310191955.5A CN103453357B (en) | 2012-05-29 | 2013-05-22 | Light emitting assembly |
| CN201310191944.7A CN103456863B (en) | 2012-05-29 | 2013-05-22 | light emitting device |
| CN2013202827787U CN203325967U (en) | 2012-05-29 | 2013-05-22 | Light emitting device |
| CN2013202827664U CN203300693U (en) | 2012-05-29 | 2013-05-22 | Light emitting diode chip capable of emitting light in multiple directions and light emitting device thereof |
| CN2013202827772U CN203277380U (en) | 2012-05-29 | 2013-05-22 | Light-emitting component and light-emitting device thereof |
| CN2013202827946U CN203277485U (en) | 2012-05-29 | 2013-05-22 | Light-emitting device, light-emitting diode chip for forming multi-directional light emission and sapphire substrate thereof |
| CN201610696438.7A CN106252491A (en) | 2012-05-29 | 2013-05-22 | Light emitting device |
| CN2013202827433U CN203322771U (en) | 2012-05-29 | 2013-05-22 | Light emitting assembly |
| CN201310191958.9A CN103456869B (en) | 2012-05-29 | 2013-05-22 | Light-emitting device, light-emitting diode chip for forming multi-directional light emission and sapphire substrate thereof |
| CN2013202827950U CN203277498U (en) | 2012-05-29 | 2013-05-22 | Light-emitting component and device base of light-emitting device thereof |
| JP2013111835A JP6367526B2 (en) | 2012-05-29 | 2013-05-28 | Sapphire substrate, light emitting diode chip, and light emitting device for forming a light emitting diode chip capable of emitting light in a plurality of directions |
| JP2013112370A JP6504739B2 (en) | 2012-05-29 | 2013-05-28 | Light emitting element, light emitting device and base for device |
| US13/903,998 US20130320363A1 (en) | 2012-05-29 | 2013-05-28 | Sapphire substrate configured to form light emitting diode chip providing light in multi-directions, light emitting diode chip, and illumination device |
| EP13169790.6A EP2669946B1 (en) | 2012-05-29 | 2013-05-29 | Illumination device |
| KR1020130061002A KR20130133696A (en) | 2012-05-29 | 2013-05-29 | Sapphire substrate configured to form light emitting diode chip providing light in multi-directions, light emitting diode chip and illumination device |
| DE202013012698.1U DE202013012698U1 (en) | 2012-05-29 | 2013-05-29 | Light-emitting element, lighting device and its device frame |
| DE202013012729.5U DE202013012729U1 (en) | 2012-05-29 | 2013-05-29 | Light-emitting element, lighting device and its device frame |
| EP18196452.9A EP3454369A1 (en) | 2012-05-29 | 2013-05-29 | Illumination device and device frame thereof |
| KR1020130061001A KR102129533B1 (en) | 2012-05-29 | 2013-05-29 | Light emitting element, illumination device and foundation thereof |
| US13/904,038 US9123868B2 (en) | 2012-05-29 | 2013-05-29 | Light emitting element and illumination device thereof |
| DE202013012554.3U DE202013012554U1 (en) | 2012-05-29 | 2013-05-29 | Light-emitting element, lighting device and its device frame |
| DE202013012711.2U DE202013012711U1 (en) | 2012-05-29 | 2013-05-29 | Light-emitting element, lighting device and its device frame |
| EP13169803.7A EP2669947B1 (en) | 2012-05-29 | 2013-05-29 | Illumination device comprising light emitting diode chip providing light in multi-directions |
| DE202013012548.9U DE202013012548U1 (en) | 2012-05-29 | 2013-05-29 | Light-emitting element, lighting device and its device frame |
| EP21186715.5A EP3961706A1 (en) | 2012-05-29 | 2013-05-29 | Illumination device |
| DE202013012509.8U DE202013012509U1 (en) | 2012-05-29 | 2013-05-29 | Light-emitting element, lighting device and its device frame |
| EP21197696.4A EP3951869A1 (en) | 2012-05-29 | 2013-05-29 | Illumination device |
| EP18185878.8A EP3415807B1 (en) | 2012-05-29 | 2013-05-29 | Illumination device |
| DE202013012707.4U DE202013012707U1 (en) | 2012-05-29 | 2013-05-29 | Light-emitting element, lighting device and its device frame |
| US14/089,708 US9368483B2 (en) | 2012-05-29 | 2013-11-25 | Illumination device capable of decreasing shadow of lighting effect |
| US14/218,944 US20180006199A9 (en) | 2012-05-29 | 2014-03-18 | Semiconductor light emitting element with dispersive optical unit and illumination device comprising the same |
| US14/218,869 US9488321B2 (en) | 2012-05-29 | 2014-03-18 | Illumination device with inclined light emitting element disposed on a transparent substrate |
| US14/340,574 US9711490B2 (en) | 2012-05-29 | 2014-07-25 | Illumination device |
| US14/886,787 US9741699B2 (en) | 2012-05-29 | 2015-10-19 | Light emitting device |
| US15/631,482 US10030857B2 (en) | 2012-05-29 | 2017-06-23 | Illumination device |
| US15/663,125 US10247395B2 (en) | 2012-05-29 | 2017-07-28 | Light emitting device |
| JP2018002356A JP6629359B2 (en) | 2012-05-29 | 2018-01-11 | Light emitting element, light emitting device and device base |
| US16/016,401 US10281123B2 (en) | 2012-05-29 | 2018-06-22 | Illumination device |
| JP2018128212A JP6680834B2 (en) | 2012-05-29 | 2018-07-05 | Light emitting device |
| US16/365,115 US10670244B2 (en) | 2012-05-29 | 2019-03-26 | Light emitting device |
| US16/404,187 US10655826B2 (en) | 2012-05-29 | 2019-05-06 | Illumination device |
| KR1020190145749A KR102139291B1 (en) | 2012-05-29 | 2019-11-14 | Illumination device |
| JP2020049778A JP7050841B2 (en) | 2012-05-29 | 2020-03-19 | Light emitting device |
| US16/876,987 US10989396B2 (en) | 2012-05-29 | 2020-05-18 | Illumination device |
| US16/887,948 US11255524B2 (en) | 2012-05-29 | 2020-05-29 | Light emitting device |
| KR1020200078506A KR102246243B1 (en) | 2012-05-29 | 2020-06-26 | Light emitting element, illumination device and foundation thereof |
| KR1020200091689A KR102287651B1 (en) | 2012-05-29 | 2020-07-23 | Illumination device |
| US17/651,891 US11808436B2 (en) | 2012-05-29 | 2022-02-21 | Light emitting apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101132185A TWI577919B (en) | 2012-09-04 | 2012-09-04 | Light emitting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201411027A true TW201411027A (en) | 2014-03-16 |
| TWI577919B TWI577919B (en) | 2017-04-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW101132185A TWI577919B (en) | 2012-05-29 | 2012-09-04 | Light emitting device |
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| TW (1) | TWI577919B (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201105885A (en) * | 2009-08-10 | 2011-02-16 | Taiwan Epi Technology Ind Inc | Illumination apparatus using LED |
| TWM400098U (en) * | 2010-09-03 | 2011-03-11 | Hsiang-Wei Liu | Omni-directional light emitting device |
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- 2012-09-04 TW TW101132185A patent/TWI577919B/en active
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| TWI577919B (en) | 2017-04-11 |
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