CN105430904A - Bendable filament for light emitting device and manufacturing method thereof - Google Patents

Abstract

The invention discloses a flexible lamp filament for a light emitting device and a fabrication method of the flexible lamp filament. The flexible lamp filament comprises a flexible substrate, a conductive layer, a first group of light emitting units and wrapping layers, wherein the flexible substrate has a predetermined length, a predetermined width and a predetermined thickness and is provided with an upper surface and a lower surface, the conductive layer is arranged on the upper surface of the substrate, the first group of light emitting units are arranged on the upper surface of the substrate and pass through the conductive layer to form electric connection, and the wrapping layers are arranged on the upper surface of the substrate and completely cover the first group of light emitting units. The lamp filament disclosed by the invention can be randomly bent, has a wider light emitting angle, and is beneficial for design and fabrication of the light emitting device which is attractive and free.

Description

Bendable filament for light emitting device and manufacturing method thereof

technical field

The invention relates to devices in the field of photoelectric lighting, in particular to a bendable filament for a light emitting device and a manufacturing method thereof.

Background technique

Light-emitting diodes are a widely used light source in semiconductor components, and have the advantages of environmental protection, energy saving, and long life. Therefore, it has become a mainstream trend to use light-emitting diodes in traditional lighting fixtures. However, since the light-emitting angle of LEDs is smaller than that of traditional light sources, and LED components are made of hard materials, traditional LED component packaging requires optical components such as lenses or diffusers to increase the lighting range, and the appearance variability is limited. , but cannot meet the needs of the society in the existing new era for more beautiful and more free lamps and lanterns, so as to be suitable for the needs of changing indoor designs and environments. Therefore, in the prior art, there is a lack of a bendable filament that can be bent and built into various shapes at will, so as to meet the requirements of lamp design and manufacturing with a higher degree of freedom.

Contents of the invention

In order to solve the problems in the background technology, the present invention provides a filament that can be bent at will and used in any shape in a lamp to meet the needs of different lighting lamps and its manufacturing method.

The bendable filament of the present invention comprises: a bendable substrate having a predetermined length, a predetermined width, a predetermined thickness, and an upper surface and a lower surface; a conductive layer is disposed on the upper surface of the substrate, and A circuit pattern is formed; the first group of light emitting units is arranged on the upper surface of the substrate, and an electrical connection is formed between the first group of light emitting units through the conductive layer; and the cladding layer is transparent Light and extensible, disposed on the upper surface of the substrate, and completely cover the first group of light-emitting units; wherein, the thickness of the substrate is less than 0.08mm, and the width of the substrate is the width of the substrate 4 to 200 times the thickness.

Further, at least one of the upper surface and the lower surface of the bendable substrate of the bendable filament of the present invention is flat or has wrinkles.

Further, the thickness of the bendable substrate of the bendable filament of the present invention preferably ranges from 0.01mm to 0.05mm.

Further, the ratio of the width of the bendable substrate of the bendable filament of the present invention to the thickness of the bendable substrate preferably ranges from 10 to 100.

Further, the bendable substrate of the bendable filament of the present invention is light-transmittable, and the material of the bendable substrate includes a polyester material, and the polyester material is selected from polyimide, polycarbonate, polyparaffin At least one of ethylene terephthalate, polymethyl methacrylate, or polyethylene naphthalate.

The bendable filament of the present invention may further include a second group of light-emitting units, which are arranged on the upper surface of the bendable substrate, and are electrically connected between the second group of light-emitting units through a conductive layer, and are connected to the first group of light-emitting units. The groups of light emitting units are alternately arranged along the length direction of the bendable substrate.

Further, one side of each light-emitting unit of the first group and the second group of light-emitting units of the bendable filament of the present invention is adjacent to the conductive layer in the width direction of the bendable substrate, and the other opposite side is adjacent to the bendable substrate. is not adjacent to the conductive layer in the width direction.

The bendable substrate of the bendable filament of the present invention may further include a deformable layer, wherein the deformable layer is arranged along the length direction of the bendable substrate, and the material of the deformable layer includes at least one of plastically deformable metal or shape memory alloy.

The present invention also provides a method for manufacturing a bendable filament, the steps of which include: providing a bendable substrate, the substrate has a predetermined thickness, and an upper surface and a lower surface; laying a conductive layer on the upper surface of the substrate , and forming a circuit pattern; baking the substrate and the conductive layer; bonding a plurality of light-emitting units on the conductive layer, and the plurality of light-emitting units are electrically connected through the conductive layer; covering the cladding layer on the upper surface of the substrate, wherein the cladding layer is light-transmissive and extensible, and completely covers the plurality of light-emitting units; and cutting the substrate so that the substrate has a predetermined length and a predetermined width; wherein, the thickness of the substrate is less than 0.08 mm, and the width of the substrate is 4 to 200 times the thickness of the substrate.

Further, in the manufacturing method of the bendable filament of the present invention, wherein the material of the bendable substrate comprises a polyester material, and the polyester material is selected from polyimide, polycarbonate, polyethylene terephthalic acid At least one of ethylene glycol, polymethyl methacrylate or polyethylene naphthalate; wherein the material of the conductive layer contains at least one of silver or copper; and wherein said baking The baking temperature of the substrate and the conductive layer is between 180°C and 240°C.

The beneficial effects of the present invention are:

The filament of the present invention can be bent at will to build various shapes to meet the needs of different lighting fixtures and to realize applications in various occasions, which is beneficial to the design and manufacture of more beautiful and more free lighting fixtures.

The filament of the present invention can form a preset shape, and no additional components are needed to keep the filament in the preset shape when the bulb is assembled.

Moreover, the luminous angle of the lamp formed by the present invention can reach 300 degrees, which is larger and wider than the 120-260-degree luminous angle of the traditional light bulb, and has a larger irradiation range, and can be applied to wall lamps, ceiling lamps, bedside lamps, decorative Lamps, fluorescent lamps, cabinet lights, table lamps, canopy lights, spotlights, emergency lighting, billboard lights and other lighting fixtures.

Description of drawings

Fig. 1a is a schematic front view of the filament of the present invention.

Fig. 1b is a schematic cross-sectional view along line AA' of Fig. 1a.

Fig. 1c is another schematic cross-sectional view along line AA' of Fig. 1a.

Fig. 2 is a schematic diagram of the filament manufacturing process of the present invention.

Fig. 3 is a schematic side view of the light bulb mechanism of the present invention.

FIG. 4 is a schematic side view of the lighting device of the present invention formed by assembling the light bulb mechanism in FIG. 3 and the filament in FIG. 1 .

Fig. 5 is a schematic side view of another light emitting device of the present invention.

Fig. 6 is a schematic side view of another light emitting device of the present invention.

7 to 9 are schematic diagrams of the arrangement implementation of the bendable substrate and the deformable layer of the present invention.

Explanation of main drawing symbols:

10: The first group of light-emitting units; 20: The second group of light-emitting units; 40, 41: cladding layer; 60, 60', 60": bendable substrate; 61, 61': upper surface of the substrate; 63, 63': Substrate lower surface; 70: deformation layer; 80: filament pin; 81: pin opening; 90: conductive layer; 93: isolation layer; 95: gap; 100, 100': bendable filament; 300: light bulb mechanism; 320, 520, 620: electrical connector; 330, 530, 630: lamp housing; 340, 540, 640: lamp holder; 350, 550, 650: lamp post; 360, 370, 560, 570, 660, 670: filament wire ; 400, 500, 600: lighting device; 510: main body of light bulb; 690: branch of lamp post.

detailed description

It should be understood that the following disclosure provides many different embodiments, or examples, for implementing different elements of the various embodiments. Specific examples of components and arrangements are described below to simplify the present disclosure. These are of course examples only and are not intended to be limiting. For example, the formation of a first component over or on a second component in the following description may include embodiments in which the first and second components are formed in direct contact, and may also include embodiments in which the first and second components may be formed in direct contact. An embodiment in which an additional part is formed between the second part so that the first part and the second part may not be in direct contact. Furthermore, the terms "upper surface," "lower surface," "beneath," "above," etc. are used for convenience and are not meant to limit the scope of the embodiments to any particular orientation. Various features may be arbitrarily drawn in different scales for simplicity and clarity. In addition, the present invention may repeat reference numerals and/or letters in each example. This repetition is for the purposes of brevity and clarity only and does not in itself necessarily dictate a relationship between the various embodiments and/or structures discussed. The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

As shown in Figures 1a and 1b, it is a bendable filament 100 of one of the specific embodiments of the present invention. The filament 100 includes at least one set of light emitting units 10 or 20, at least one cladding layer 40, a bendable substrate 60, two Filament pin 80 and conductive layer 90 . Wherein, the bendable substrate 60 has a preset length L, a preset width W, a preset thickness T, an upper surface 61 and a lower surface 63; the conductive layer 90 is disposed on the upper surface 61 of the bendable substrate 60 and formed as The circuit pattern shown in FIG. 1a; two filament pins 80 are respectively arranged at both ends of the bendable substrate 60, and the two filament pins 80 protrude from the bendable substrate 60 along the length L direction of the bendable substrate 60, and the two Each filament pin 80 is electrically connected to the conductive layer 90 respectively; a group of light-emitting units 10 or 20 is a plurality of light-emitting units, and the plurality of light-emitting units 10 or 20 are dispersedly arranged on the upper surface 61 of the bendable substrate 60 and pass through the conductive layer. The layer 90 forms an electrical connection between the light-emitting units, for example, a plurality of light-emitting units 10 are connected in series, parallel or series-parallel, or a plurality of light-emitting units 10 and 20 are connected in series, parallel or series-parallel; the cladding layer 40 To be transparent and extensible, the cladding layer 40 is disposed on the upper surface 61 of the bendable substrate 60 and completely covers at least one group of light emitting units 10 or 20 . According to the research of the present invention, there are many factors that affect whether the filament is bendable, the degree of bendability, the manufacturing yield and quality, including the selection of the light emitting unit, the combination method of the light emitting unit and the bendable substrate, the covering method of the cladding layer, etc. , but the research of the present invention finds that the material of the bendable substrate and the proportional relationship between the width and the thickness have the greatest influence. Therefore, in the embodiment of the present invention, the material of the flexible substrate 60 includes a polyester material selected from polyimide, polycarbonate, polyethylene terephthalate, polymethyl At least one of methyl acrylate or polyethylene naphthalate, etc., and it is light-transmissive, and the preset thickness T of the flexible substrate 60 is less than 0.08mm, and the width W is 4 to 200 of the thickness T. times, where the width W cannot be too large, otherwise it will limit the degree of bending of the filament 100 in different directions, but the width W can not be too small, otherwise the filament 100 may not be able to be loaded or easily peeled off after being loaded during the manufacturing process. question. Further, taking an embodiment of the present invention as an example, the material of the flexible substrate 60 preferably includes polyimide or polyethylene naphthalate. Further, taking an embodiment of the present invention as an example, the preset thickness T of the bendable substrate 60 is preferably in the range of 0.01 mm to 0.05 mm, and is optimally preset in the range of 0.02 mm to 0.03 mm, such as about 0.025 mm. In addition to the advantage of being easy to bend, when the conductive layer 90 is subsequently laid on the substrate 60 , a better bonding effect between the conductive layer 90 and the substrate 60 can also be achieved. Further, taking an embodiment of the present invention as an example, the ratio of the width W to the thickness T of the bendable substrate 60 preferably ranges from 10 to 100, and the optimal ratio ranges from 70 to 90, such as about 80.

In addition, taking an embodiment of the present invention as an example, the filament 100 has a first group of light-emitting units 10 and a second group of light-emitting units 20 that are electrically connected in series by a plurality of light-emitting units 10 and 20 through the conductive layer 90, and the first The group of light emitting units 10 and the second group of light emitting units 20 are electrically connected in parallel, as shown in FIG. 10 are respectively connected in parallel with each light emitting unit 20 of the second group of light emitting units 20, so that the light emitting units are electrically connected in series and parallel. Wherein the first group of light-emitting units 10 and the second group of light-emitting units 20 are arranged alternately along the length L direction of the flexible substrate 60, and one side of each light-emitting unit 10 or 20 of the first group and the second group of light-emitting units is in the bendable The substrate 60 is adjacent to the conductive layer 90 in the width W direction of the flexible substrate 60 , and the other opposite side is not adjacent to the conductive layer 90 in the width W direction of the flexible substrate 60 , so as to optimize the area utilization efficiency of the substrate 60 Advantages, it can further reduce the probability that the conductive layer 90 will be peeled off from the bendable substrate 60 during the bending process. In addition, the light-emitting unit 10 or 20 in the present invention can be a semiconductor light-emitting chip, such as a light-emitting diode (LED), an organic light-emitting diode (OLED) or other semiconductor light-emitting elements. There are positive and negative electrodes in the direction of the layer 90, and the material of the conductive layer 90 includes at least one of silver or copper, so that the semiconductor light-emitting chip in the present invention can be directly bonded to the conductive layer 90 through solder or anisotropic conductive glue. Wire bonding is avoided, and the situation that the light-emitting unit 10 or 20 may be peeled off from the substrate 60 or the circuit is disconnected due to the bending of the filament 100 can be further avoided, as shown in FIG. 1b, wherein each light-emitting unit 10 or 20 is arranged on the conductive layer 90 and each light-emitting unit 10 or 20 has two ends of electrodes bonded to the conductive layer 90 to form an electrical connection, and at the same time, there is an isolation layer 93 between the light-emitting unit 10 or 20 and the conductive layer 90, and the isolation layer 93 can be air or other such as Silicone, resin and other insulating materials are used to improve the error tolerance of the bonding process between the light emitting unit 10 or 20 and the conductive layer 90 to avoid possible short circuit problems. In an embodiment of the present invention, the isolation layer 93 can further have adhesiveness or adsorption, so that the light emitting unit 10 or 20 can be adhered or adsorbed on the substrate 60 to facilitate the subsequent bonding process. Meanwhile, in the aforementioned embodiment of the present invention, since the first group of light emitting units 10 and the second group of light emitting units 20 are alternately arranged along the length L direction of the flexible substrate 60, as shown in FIG. There is also a gap 95 between the 10 and the adjacent light-emitting unit 20 , so that the circuit pattern formed by the conductive layer 90 will not be accidentally short-circuited when the filament 100 is bent or twisted.

In the aforementioned embodiment of the present invention, the flexible substrate 60 is a light-transmitting substrate, so that part of the light emitted from the light emitting units 10 and 20 can be emitted from the lower surface 63 of the substrate 60, so the filament 100 of the present invention is at least Will shine in two opposite directions. Further, the light-emitting units 10 and 20 in the present invention can emit light of the same light color, for example, both emit UV light, purple light, blue light, green light, red light, IR light or white light, etc., or can emit Light of different light colors, such as one blue-red or one green-red, etc., wherein the cladding layer can further contain wavelength conversion materials, such as phosphors activated by rare earth elements or quantum dot phosphors, and can be arranged at The position for receiving the light emitted from the light emitting units 10 and 20, as shown in FIG. 1b or 1c, the cladding layers 40 and 41 are respectively arranged on the upper surface 61/61' of the light-transmitting flexible substrate 60/61' On the lower surface 63/63', the cladding layer 40 also covers the upper surface and side surface of each light-emitting unit 10 and 20, so as to absorb part of the short-wavelength light emitted from each light-emitting unit 10 and 20 and emit long-wavelength light For light, light of various colors is mixed in the cladding layer 40/41 to emit light, so that the bendable filament 100/100' of the present invention can emit light with different effects such as white light, cool white light, or warm white light according to requirements. Among them, the main difference between FIG. 1c and FIG. 1b is that the upper surface 61 and the lower surface 63 of the flexible substrate 60 of the filament 100 shown in the embodiment shown in FIG. At least one of the upper surface 61 ′ and the lower surface 63 ′ of the substrate 60 ′ is an uneven surface, that is, has wrinkles, bumps or roughness, so that the bonding area between the flexible substrate 60 ′ and the conductive layer 90 can be increased. , so that the conductive layer 90 is not easy to peel off from the substrate 60 during the manufacturing process or bending of the bendable filament 100 ′ of the present invention, further improving the yield and quality of the bendable filament of the present invention. In addition, the upper surface 61' and the lower surface 63' of the flexible substrate 60' of the filament 100' shown in FIG. 63' is more uneven, such as more wrinkles, and vice versa, so that light can have different light extraction rates on different surfaces of the flexible substrate 60', so that the light output effects of the filament 100' of the present invention in different directions can be controlled. control to be the same or different.

In the filament 100 of each embodiment of the present invention, the two filament pins 80 are respectively used as the positive and negative poles of the filament 100 to be electrically connected to the power supply assembly, so that the power supply can be directly introduced into the conductive wire of the filament 100 through the filament pins 80 . The layer 90 and the light emitting unit 10/20 drive the filament 100 to emit light. Further, in an embodiment of the present invention, the filament pin 80 may also include a pin opening 81, so that the power supply component can be connected to the filament pin 80 through the pin opening 81, so that the filament 100 can be connected with other The bonding between the components can be stronger, and the filament 100 can be easily disassembled from other components for easy replacement. However, the filament 100 in an embodiment of the present invention may not have the filament pin 80 , and the power supply component may be directly connected to the conductive layer 90 to supply power to drive the filament 100 .

As shown in Figure 2, it is the manufacturing method of the bendable filament of the present invention, wherein the process includes:

Step S1, to provide a bendable substrate 60/60'/60", wherein the bendable substrate 60/60'/60" has a predetermined thickness T, and an upper surface 61/61' and a lower surface 63/63', And the thickness T is less than 0.08mm;

Step S3 is to lay a conductive layer 90 on the upper surface 61/61' of the flexible substrate 60/60'/60" after step S1, and form a circuit pattern;

Step S5 is to bake the bendable substrate 60/60'/60" and the conductive layer 90 after step S3;

Step S7, after step S3 or S5, bonding a plurality of light emitting units 10/20 on the conductive layer 90, so that the plurality of light emitting units 10/20 are electrically connected through the conductive layer 90;

Step S9 is to cover the cladding layer 40 on the upper surface 61/61' of the bendable substrate 60/60'/60" after the step S7, wherein the cladding layer 40 is light-transmittable and extensible, and completely covering the upper surfaces and side surfaces of the plurality of light emitting units 10/20; and

Step S11 is to cut the bendable substrate 60/60'/60" after step S5 and step S9 so that the bendable substrate 60/60'/60" has a predetermined length L and a predetermined width W; wherein, The width W of the bendable substrate 60/60'/60" is 4 to 200 times the thickness T of the bendable substrate 60/60'/60"; wherein, in another embodiment of the present invention, the preset length L is preset Make it twice or more than the width W.

Among them, in the aforementioned method of the present invention, details of technical features such as the material and width of the bendable substrate 60/60'/60", and the ratio of width to thickness are as described in other embodiments of the present invention, and will not be repeated here.

In the aforementioned step S3, the method of laying the conductive layer 90 on the flexible substrate 60/60'/60" can be carried out by printing or bonding; Conductive material, such as silver paste or copper paste, is directly printed on the flexible substrate 60/60'/60", and after the printing process is completed, the conductive layer 90 has formed a circuit pattern; and in another embodiment of the present invention , is to first coat the adhesive material on the flexible substrate 60/60'/60", such as silver glue, resin or silica gel, and then stick the copper conductive layer 90, such as copper foil, through the transparent adhesive material. Paste on the flexible substrate 60/60'/60", and then form a circuit pattern on the conductive layer 90 through a yellow photolithography process. In addition, the filament pin 80 can be selected to be bonded to the bendable substrate 60/60'/60" in this step S3, or added in a subsequent process.

In the aforementioned step S7, the method of bonding a plurality of light-emitting units 10/20 on the conductive layer 90 can be through pressing or welding; anisotropic conductive adhesive, and then connect the electrodes of the light-emitting unit 10/20 with the anisotropic conductive adhesive, and then bond the light-emitting unit 10/20 to the conductive layer 90 through thermocompression molding; and in another implementation of the present invention In an example, solder paste is firstly provided on the conductive layer 90 , and then the electrodes of the light emitting unit 10 / 20 are connected to the solder paste, and then the light emitting unit 10 / 20 is bonded to the conductive layer 90 through reflow soldering.

In the aforementioned step S5, taking an embodiment of the present invention as an example, in order to strengthen the bonding strength between the flexible substrate 60/60'/60" and the conductive layer 90, the baking temperature range is preferably 180 degrees Celsius to 240 degrees Celsius In between, the optimal baking temperature can be around 200 degrees to avoid deterioration of the bendable substrate 60/60'/60" caused by too high a temperature, or insufficient bonding strength caused by too low a temperature. In yet another embodiment of the present invention, step S5 can be performed after step S7 or step S9, so that the bonding between the flexible substrate 60/60'/60" and the conductive layer 90, and the light emitting unit 10 can be performed at the same time. The connection between the /20 and the conductive layer 90, or the connection between the cladding layer 40 and the flexible substrate 60/60'/60" is strengthened to save part of the manufacturing process.

In the aforementioned step S9, taking an embodiment of the present invention as an example, it may further include providing a cladding layer 41 on the lower surface 63/63' of the bendable substrate 60/60'/60", wherein the cladding layer 40 and 41 is a corresponding setting, and has substantially the same outer contour, and covers the same range; and in yet another embodiment of the present invention, the cladding layer 41 may also have a different outer contour or cover different from the cladding layer 40. For example, the cladding layer 41 can cover to the edge of the lower surface 63/63' of the bendable substrate 60/60'/60", while the cladding layer 40 covers a distance of 60/60'/60" from the bendable substrate There is a certain distance from the edge of the lower surface 63/63'. In addition, in the method of covering the cladding layer 40/41 on the surface 61/61'/63/63' of the bendable substrate 60/60'/60" in the present invention, The covering layer 40/41 in liquid, jelly or sheet form can be disposed on the surface 61 of the bendable substrate 60/60'/60" through dispensing, gluing, printing, molding or patching /61'/63/63' and light-emitting unit 10/20, and necessary curing methods such as baking or UV light are added to achieve.

After the bendable filament of the present invention is formed through the aforementioned steps S1 to S11, the present invention further proposes a light emitting device, which can bend the bendable filament of the present invention according to a preset shape and join with the lamp post of the light bulb mechanism, and at the same time The electrode of the bendable filament is electrically connected with the filament wire of the bulb mechanism, and then the light-emitting device of the present invention is formed by sealing the bulb and covering the lamp housing, thus the present invention realizes more bendable light sources of any shape, and the light-emitting device can have a 300-degree The wide-angle irradiation range is larger than the traditional light bulb's 120-260-degree irradiation range.

The light emitting device of the present invention can be various lighting fixtures, such as bulb lamps, candle lamps, craft lamps or retro lamps, etc. Invented light emitting device. The lighting device of the present invention includes a light bulb mechanism and a filament, as shown in Figure 3 and Figure 4, Figure 3 shows a light bulb mechanism 300 according to an embodiment of the present invention, Figure 4 shows a bendable filament 100 or 100' is combined with the light bulb mechanism 300 shown in FIG. 3 to form a light emitting device 400 according to an embodiment of the present invention; the light bulb mechanism 300 includes an electrical connector 320, a lamp housing 330, a lamp holder 340, a lamp post 350 and filament wires 360/370, Wherein, the lamp post 350 is arranged on the lamp holder 340, and the lamp holder 340 and the lamp post 350 can be light-transmitting materials, such as glass, resin, rubber or plastic, etc., the lamp holder 340 and the lamp post 350 can be integrated, and the lamp holder 340 and the lamp post 350 are arranged between the electrical connector 320 and the lamp housing 330, and the lamp post 350 has a certain height relative to the electrical connector 320, so that the bendable filament 100/100' can climb and twist, as shown in FIG. 4 . The filament wires 360/370 are arranged in the integrated lamp holder 340 and lamp post 350, and one end of each filament wire 360/370 passes through the integrated lamp holder 340 lamp post 350 to connect the filament 100/100', for example, through Connect through the pin opening 81 of the filament pin 80 of the filament 100/100', or connect by directly welding with the filament pin 80 of the filament 100/100', the other end of the filament wire 360/370 Electrically connected with the electrical connector 320 , the external power supply can provide driving power for the filament 100 / 100 ′ through conduction of the power supply components such as the electrical connector 320 , the driving circuit, the filament wire 360 / 370 and the filament pin 80 . The above embodiment is an example of the present invention, but not limited thereto. For example, in a variant embodiment of the present invention, the lamp holder 340 and the lamp post 350 can be independent components, or the lamp holder 340 and the lamp post 350 At least one of them can be made of opaque material, and its surface can be made of metal materials such as copper, aluminum, silver, gold or alloys. By increasing light reflection, the luminous efficiency and lighting effect of the light emitting device of the present invention can be improved. The number of filaments 100/100' shown in Fig. 4 can be 2, one of which is represented by a dotted line. In one embodiment of the present invention, these 2 filaments have the same or similar light intensity, light color, required voltage or current and other photoelectric characteristics, but not limited thereto, in another embodiment of the present invention, bendable filaments with photoelectric characteristics such as different light intensity, light color, required voltage or current can also be set in the light emitting device to enrich the lighting The variability of the effect; in addition, the two filaments 100/100' can be electrically connected in series or in parallel, and the embodiment shown in Figure 4 is to connect the two filaments 100/100' in parallel, wherein the filament wire 360 is There is a T-shaped assembly with three terminals. The two ends of the filament wire 360 are respectively connected to two filaments, and one end is electrically connected to the electrical connector 320, but it is not limited thereto. In another variation embodiment of the present invention, the two filaments are 100/100 'can be connected in series, at this time one of the filament wires 360 or 370 is an inline component with two ends, and the two ends are respectively connected to two filaments 100/100' without connecting the electrical connector 320, and viewed from one side, The filament wire with both ends connected to the filament 100/100' forms a T-shaped, cross-shaped or 〦-shaped relationship with the lamp post 350 . The lamp housing 330 is made of a light-transmitting material, such as glass, resin, rubber or plastic; Welded together, the bendable filament of the present invention is sealed in the bulb mechanism to avoid deterioration due to external environmental pollution, and the life of the light emitting device 400 of the present invention can be improved.

Fig. 5 and Fig. 6 respectively show several variant embodiments of the present invention. The light-emitting device 500 of the embodiment shown in FIG. 5 includes a bendable filament 100 or 100', a bulb body 510, an electrical connector 520, a lamp housing 530, a lamp holder 540, a lamp post 550 and filament wires 560/570, as shown in FIG. 4 Compared with the light-emitting device 400 of the embodiment, the main difference is that the light-emitting device 500 includes a bulb body 510 disposed between the electrical connector 520 and the lamp housing 530, and there is a space in the bulb body 510 to accommodate the driving circuit components of the filament 100, such as a transformer. , electrolytic capacitor, PCB, etc., the bendable filament 100 , the lamp holder 540 , the lamp post 550 and the filament wire 560 / 570 are arranged between the lamp housing 530 and the bulb body 510 . The lamp post 550 is made of light-transmitting material, such as glass, resin, rubber or plastic, etc. The filament wires 560/570 are arranged in the lamp post 550, and one end of each filament wire 560/570 passes through the lamp post 550 to connect the filament 100/570. 100', the other end is electrically connected with the drive circuit assembly and the electrical connector 320, so that the external power supply can provide the filament 100/100' through the conduction of the power supply assembly such as the electrical connector 320, the drive circuit and the filament wire 560/570, and the filament pin 80. electricity. The lamp holder 540 has a central platform and a reflective slope. The lamp post 550 is arranged on the central platform of the lamp holder 540. The reflective slope of the lamp holder 540 is inclined outward from the central platform to reflect the light source, thereby improving the light output efficiency and lighting effects. As for other components with the same names and technical features, they are the same as those described in other embodiments of the present invention, so they will not be repeated here.

The light-emitting device 600 of the embodiment shown in FIG. 6 includes a bendable filament 100 or 100', an electrical connector 620, a lamp housing 630, a lamp holder 640, a lamp post 650, a filament wire 660/670 and a lamp post branch 690, which is the same as that shown in FIG. Compared with the light-emitting device 400 of the illustrated embodiment, the main difference is that the lamp post 650 of the light-emitting device 600 has an outwardly branching structure, so that the bendable filament 100 or 100' can change the winding direction, resulting in the implementation of the present invention previously described. Different luminous effects of the luminous device of the present invention, wherein viewed from the side, the lamp post 650 can include T-shaped, Y-shaped, 1-shaped or cross-shaped structures, and can respectively make the luminous device of the present invention have different luminous effects and visual artistic effects . The embodiment shown in FIG. 6 may optionally include a lamp post branch 690. As shown by the dotted line, the lamp post branch 690 may be a different component or integrated with the lamp post 650. In one embodiment of the present invention, the lamp post branch 690 may be Bending metal, such as iron, copper or aluminum material, one side of which is connected to the lamp holder 640 or the lamp post 650, and the other side is connected to the bending part of the bendable filament 100, so as to support the bending shape of the bendable filament 100 in the light emitting device 600 It will not be deformed when subjected to external physical impact, and the part where the lamp post branch 690 is connected to the bending part of the bendable filament 100 can be in the shape of a hook or a ring, and can be adjusted according to the required support strength. As for other components with the same names and technical features, they are the same as those described in other embodiments of the present invention, so they will not be repeated here.

In addition, since the filament 100 or 100' in each of the aforementioned embodiments of the present invention may be extremely soft and difficult to shape, for example, when the preset length of the filament 100 or 100' is too long, it is easily bent due to gravity or other external forces. Specific angle or degree of distortion, so the present invention further proposes a bendable substrate 60", as shown in Figures 7 to 9, the bendable substrate 60" may further include a deformable layer 70, the material of which includes plastically deformable metal or At least one of shape memory alloys, such as copper, aluminum, iron, silver, gold, or nickel-titanium alloys, copper-nickel alloys, copper-aluminum alloys, copper-zinc alloys, or iron alloys, and the deformable layer 70 It can be arranged along the length direction of the bendable substrate 60", as shown in the front view of 7A, 8A or 9A. Among them, the deformation layer 70 of the embodiment shown in 7A is only one layer and is arranged in the center of the bendable substrate 60". 7B to 7E are cross-sectional views of different embodiments along the width direction of the bendable substrate 60" shown in 7A; the deformable layer 70 of the embodiment shown in 7B is disposed on the surface of the bendable substrate 60"; 7C The deformable layer 70 of the illustrated embodiment is partially embedded in the bendable substrate 60", and partially protrudes from the bendable substrate 60"; the deformable layer 70 of the embodiment shown in 7D is embedded in the bendable substrate 60", and has an upper surface and The upper surface of the bendable substrate 60" is coplanar; the deformable layer 70 of the embodiment shown in 7E is completely embedded in the bendable substrate 60". Wherein, the number of deformable layers 70 of the embodiment shown in 8A has 2 layers and is spaced from each other Arranged in parallel on the bendable substrate 60", 8B to 8E are cross-sectional views of different embodiments along the width direction of the bendable substrate 60" shown in 8A; the deformable layer 70 of the embodiment shown in 8B is arranged on the bendable substrate 60"; the deformable layer 70 of the embodiment shown in 8C is partially embedded in the bendable substrate 60", and partly protrudes from the bendable substrate 60"; the deformable layer 70 of the embodiment shown in 8D is embedded in the bendable substrate 60", and the upper surface is coplanar with the upper surface of the bendable substrate 60"; the deformable layer 70 of the embodiment shown in 8E is completely embedded in the bendable substrate 60". Among them, the deformable layer of the embodiment shown in 9A 70 has 2 layers and is arranged on opposite sides of the bendable substrate 60", 9B to 9E are cross-sectional views of different embodiments along the width direction of the bendable substrate 60" shown in 9A; implementation shown in 9B The deformable layer 70 of the example is arranged on the surface of the bendable substrate 60 ″; the deformable layer 70 of the embodiment shown in 9C is partially embedded in the bendable substrate 60 ″, and partly protrudes from the bendable substrate 60 ″, wherein the deformable layer 70 One side surface is coplanar with one side surface of the bendable substrate 60 ″; the deformable layer 70 in the embodiment shown in 9D is embedded in the bendable substrate 60 ″, and except one side surface is coplanar with one side surface of the bendable substrate 60 ″ In addition to the plane, it also has an upper surface that is coplanar with the upper surface of the bendable substrate 60 ″; the deformable layer 70 in the embodiment shown in 9E has one side surface that is coplanar with the side surface of the bendable substrate 60 ″, and the rest are embedded in the Bendable substrate 60". In this way, through the technical combination of the bendable substrate 60" of different embodiments of the present invention and the bendable filaments or light-emitting devices of the above-mentioned embodiments of the present invention, the bendable filament of the present invention can not only be soft and bendable, but also have further features. Different degrees and characteristics of the shape-setting effect, for example, disposing the deformable layer 70 on opposite sides of the bendable substrate 60 ″ will make the bendable substrate 60 ″ have a better twist-setting effect.

Several embodiments of the present invention and the components of the embodiments have been discussed above, so that those skilled in the art can better understand the subsequent detailed description, but the present invention is not limited thereto. The above-mentioned embodiments of the present invention and the components of the embodiments Or the combination between components is also a part of the content of the present invention, for example, the combination of the technical features of the embodiment shown in Figure 1a, Figure 1c and Figure 3 or the technical features of any embodiment in Figure 9 and the embodiment shown in Figure 1a Any combination can be regarded as another embodiment of the present invention. Those skilled in the art should understand that they can easily use the present invention as a basis to design or modify other processes and structures for achieving the same purpose and/or realizing the same advantages as the embodiments described herein. Those skilled in the art should also realize that these equivalent structures do not depart from the spirit and scope of the present invention, and that various changes, substitutions and alterations can be made therein without departing from the spirit and scope of the present invention. .

Claims (10)

1. A bendable filament, characterized in that, comprising: The bendable substrate has a predetermined length, a predetermined width, a predetermined thickness, and an upper surface and a lower surface; a conductive layer disposed on the upper surface of the substrate and forming a circuit pattern; a first group of light-emitting units, disposed on the upper surface of the substrate, and electrically connected between the first group of light-emitting units through the conductive layer; and A cladding layer, which is light-transmitting and extensible, is disposed on the upper surface of the substrate and completely covers the first group of light-emitting units; Wherein, the thickness of the substrate is less than 0.08 mm, and the width of the substrate is 4 to 200 times the thickness of the substrate. 2. The bendable filament according to claim 1, wherein at least one of the upper surface and the lower surface of the substrate is a plane or an uneven surface. 3. The bendable filament according to claim 1, wherein the thickness of the substrate preferably ranges from 0.01 mm to 0.05 mm. 4. The bendable filament according to claim 3, wherein the ratio of the width of the substrate to the thickness of the substrate preferably ranges from 10 to 100. 5. The bendable filament according to claim 1, wherein the substrate is light-transmittable, and the material of the substrate comprises a polyester material, and the polyester material is selected from polyimide At least one of amine, polycarbonate, polyethylene terephthalate, polymethyl methacrylate, or polyethylene naphthalate. 6. The bendable filament according to any one of claims 1 to 5, further comprising a second group of light-emitting units disposed on the upper surface of the substrate and passing through the conductive layer in the The second group of light emitting units are electrically connected and arranged alternately with the first group of light emitting units along the length direction of the substrate. 7. The bendable filament according to claim 6, wherein one side of each light-emitting unit of the first group and the second group of light-emitting units is in contact with the conductive layer in the width direction of the substrate adjacent, and the other opposite side is not adjacent to the conductive layer in the width direction of the substrate. 8. The bendable filament according to claim 6, wherein the substrate further comprises a deformable layer, wherein the deformable layer is arranged along the length direction of the substrate, and the material of the deformable layer comprises a plastically deformable metal Or at least one of them such as shape memory alloy. 9. A method for manufacturing a bendable filament, characterized in that the steps include: providing a bendable substrate, the substrate has a predetermined thickness, and an upper surface and a lower surface; laying a conductive layer on the upper surface of the substrate, and forming a circuit pattern; baking the substrate and the conductive layer; bonding a plurality of light-emitting units on the conductive layer, and forming an electrical connection between the plurality of light-emitting units through the conductive layer; Covering the cladding layer on the upper surface of the substrate, wherein the cladding layer is light-transmissive and extensible, and completely covers the plurality of light-emitting units; and cutting the substrate so that the substrate has a predetermined length and a predetermined width; Wherein, the thickness of the substrate is less than 0.08 mm, and the width of the substrate is 4 to 200 times the thickness of the substrate. 10. The manufacturing method of the filament according to claim 9, wherein the material of the substrate comprises a polyester material, and the polyester material is selected from polyimide, polycarbonate, polyparaffin At least one of ethylene phthalate, polymethyl methacrylate or polyethylene naphthalate; wherein the material of the conductive layer contains at least one of silver or copper; and wherein the The baking temperature for baking the substrate and the conductive layer is between 180°C and 240°C.