CN105023918A - Flexible lamp strip and machining method thereof - Google Patents
Flexible lamp strip and machining method thereof Download PDFInfo
- Publication number
- CN105023918A CN105023918A CN201410339784.0A CN201410339784A CN105023918A CN 105023918 A CN105023918 A CN 105023918A CN 201410339784 A CN201410339784 A CN 201410339784A CN 105023918 A CN105023918 A CN 105023918A
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- China
- Prior art keywords
- led luminescence
- luminescence chip
- lamp strip
- negative electrode
- positive
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- 238000000034 method Methods 0.000 title abstract description 13
- 238000003754 machining Methods 0.000 title abstract 4
- 229910052751 metal Inorganic materials 0.000 claims abstract description 34
- 239000002184 metal Substances 0.000 claims abstract description 34
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052709 silver Inorganic materials 0.000 claims abstract description 22
- 239000004332 silver Substances 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 16
- 238000005245 sintering Methods 0.000 claims abstract description 13
- 238000007747 plating Methods 0.000 claims abstract description 11
- 238000004020 luminiscence type Methods 0.000 claims description 61
- 239000002002 slurry Substances 0.000 claims description 20
- 239000003292 glue Substances 0.000 claims description 16
- 229920003023 plastic Polymers 0.000 claims description 13
- 239000004033 plastic Substances 0.000 claims description 13
- 239000012790 adhesive layer Substances 0.000 claims description 11
- 238000004806 packaging method and process Methods 0.000 claims description 10
- 238000003672 processing method Methods 0.000 claims description 8
- 238000005253 cladding Methods 0.000 claims description 7
- 239000010410 layer Substances 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- 238000005286 illumination Methods 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
- 241000218202 Coptis Species 0.000 description 4
- 235000002991 Coptis groenlandica Nutrition 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The invention discloses a flexible lamp strip and a machining method thereof. The machining method of the flexible lamp strip comprises the steps of: plating or sintering a metal layer on a strip-shaped bracket made of flexible materials by adopting an electroplating method or a sintering method, and engraving positive and negative electrode conductive connection points on the bracket; adhering positive and negative electrodes of a plurality of inverted LED light emitting chips with the positive and negative electrode conductive connection points through a silver paste, and curing the silver paste through high-temperature baking to form a series circuit of at least one LED light emitting chip, or a parallel circuit of at least two LED light emitting chips or a series and parallel mixed circuit of a plurality of the LED light emitting chips; and fully wrapping the bracket, the metal layer and the plurality of LED light emitting chips by using a prepared fluorescent adhesive in a plastic-package fully wrapping manner. The flexible lamp strip can be bent into various shapes, light emitting intensities of 6 surfaces of the LED light emitting chips are even and the illumination at each corner is identical when the flexible lamp strip is bent and lightened, the machining method increases a binding force and thermal conductivity of the chips and the bracket, omits metal wire welding process, saves cost and increases product reliability.
Description
Technical field
The present invention relates to a kind of lamp bar, espespecially a kind of flexible lamp strip and processing method thereof.
Background technology
LED (Lighting emitting diode) is a kind of light-emitting diode, is the solid-state semiconductor device of visible ray by electric energy conversion.It is the green light source of a kind of high energy-conservation, high life, specular removal, environmental protection.
The support that current LED industry does 360 ° of light-emitting filaments is all that harder material (as metal, glass, pottery etc.) is as filament support, limit shape and the assembling mode of finished product lamp because of the characteristic of object when doing finished product, do not reach aesthetic, more limit the lighting angle of lamp and the uniformity of luminescence, the intensity not reaching each angular light is consistent, cause the angular intensity that has low, illumination is little, does not reach 360 ° of illumination effects.
Current Packaging Industry is all utilize gold thread that common luminescence chip and support circuitry are coupled together, and operation adds the expense of gold thread, complex process, and the procedure being Packaging Industry easily goes wrong most like this.
Summary of the invention
Main purpose of the present invention is to provide a kind of flexible lamp strip and processing method thereof, this lamp bar bendable is converted into various shape, and bending lights that 6 luminous intensities of rear LED luminescence chip are even and the illumination of each angle the same, this processing method adds cohesive force and the thermal conductivity of chip and support, decrease weldering metallization line process, both save cost, also add product reliability.
To achieve these goals, technical solution of the present invention is: a kind of flexible lamp strip, comprising the bar shaped support be made up of flexible material and multiple inverted LED luminescence chip, described rack outer surface is provided with metal level and just, negative electrode conducting connection point, described LED luminescence chip just, negative pole with just, negative electrode conducting connection point connects, form the string of the series circuit of at least one LED luminescence chip or the parallel circuits of at least two LED luminescence chips or multiple LED luminescence chip, parallel mixing circuit, described support, the overall outer surface of metal level and multiple LED luminescence chip is enclosed with fluorescent adhesive layer.
Flexible lamp strip of the present invention, wherein said rack outer surface is connected with metal level by plating or sintering processing.
Flexible lamp strip of the present invention, wherein said positive and negative electrode conducting connection point is bonded together with the positive and negative electrode of LED luminescence chip by silver slurry, and is cured silver slurry by high-temperature baking.
Flexible lamp strip of the present invention, wherein said fluorescent adhesive layer entirely wraps up mode by plastic packaging or support, metal level and multiple LED luminescence chip entirety are wrapped up by some glue mode.
Flexible lamp strip of the present invention, wherein said support is made up of the flexible material of plastics or silica gel.
Flexible lamp strip of the present invention, wherein said LED luminescence chip is blue chip or red light chips or green glow chip or purple light chip.
Flexible lamp strip of the present invention, wherein said fluorescent glue is allocated by least one color fluorescence powder and glue and is formed.
A kind of flexible lamp strip processing method, it comprises the steps:
(1) metal cladding or sintered metal layer in the strip-shaped bracket first utilizing plating mode or sintering processing to make at flexible material according to the LED luminescence chip size of upside-down mounting, and on support, carve positive and negative electrode conducting connection point;
(2) after, the positive and negative electrode of multiple inverted LED luminescence chip is bonded together with positive and negative electrode conducting connection point by silver slurry, and by high-temperature baking, silver slurry is cured, form the series and parallel hybrid circuit of the series circuit of at least one LED luminescence chip or the parallel circuits of at least two LED luminescence chips or multiple LED luminescence chip;
(3) finally by plastic packaging mode of entirely wrapping up, support, metal level and multiple LED luminescence chip entirety are wrapped up entirely with the fluorescent glue prepared, form fluorescent adhesive layer.
After adopting such scheme, flexible lamp strip of the present invention and processing method thereof, plating mode or sintering processing metal cladding or sintered metal layer on support is utilized by the LED luminescence chip size of upside-down mounting, and just arrange on support, negative electrode conducting connection point, the LED luminescence chip of upside-down mounting just, negative pole by silver slurry with just, negative electrode conducting connection point is bonding, and by high-temperature baking, silver slurry is cured, do the cohesive force and thermal conductivity that namely add LED luminescence chip and support like this, also reduce this procedure of welded wire, not only save gold thread cost, other costs such as equipment cost, also add the reliability of product, and pass through with other all flexible materials such as plastics or organosilicon as support material, metal cladding or sintered metal layer on support with plating mode or sintering processing, the LED luminescence chip of upside-down mounting just, negative pole is just adhesively fixed on by silver slurry, on negative electrode conducting connection point, and by high-temperature baking, silver slurry is cured, form various circuit, and the fluorescent glue prepared is wrapped up mode to support entirely by plastic packaging, metal level and multiple LED luminescence chip entirety are wrapped up entirely, the various shape of the encapsulation bent formation of back light bar, the reflection of principle of luminosity that each LED luminescence chip on after-poppet utilizes it special and fluorescent adhesive layer (fluorescent material and glue) is lighted in bending, refraction, 6 luminous intensities of each LED luminescence chip can be made even and the illumination of each angle.
Accompanying drawing explanation
Fig. 1 is the structural representation of flexible lamp strip of the present invention.
Embodiment
As shown in Figure 1, flexible lamp strip of the present invention, comprising the bar shaped support 1 made with the flexible material such as plastics or organosilicon and multiple inverted LED luminescence chip 2, LED luminescence chip 2 is blue chip or red light chips or green glow chip or purple light chip.The outer surface of support 1 is electroplated by plating mode or sintering processing or sintering has metal level 3.Support 1 is also provided with positive and negative electrode conducting connection point (not shown), the positive and negative electrode of multiple LED luminescence chip 2 is bonded together with positive and negative electrode conducting connection point by silver slurry, and is cured silver slurry by high-temperature baking.Form the series and parallel hybrid circuit of the series circuit of at least one LED luminescence chip 2 or the parallel circuits of at least two LED luminescence chips 2 or multiple LED luminescence chip 2, the overall outer surface of support 1, metal level 3 and multiple LED luminescence chip 2 is enclosed with fluorescent adhesive layer 4.Fluorescent adhesive layer 4 entirely wraps up mode by plastic packaging or the entirety of support 1, metal level 3 and multiple LED luminescence chip 2 is wrapped up by some glue mode.Fluorescent glue is allocated by least one color fluorescence powder and glue and is formed.
The process steps of this flexible lamp strip is:
(1) metal cladding 3 or sintered metal layer 3 in the strip-shaped bracket 1 first utilizing plating mode or sintering processing to make at flexible material according to LED luminescence chip 2 size of upside-down mounting, and positive and negative electrode conducting connection point is carved on support 1;
(2) after, the positive and negative electrode of multiple inverted LED luminescence chip 2 is bonded together with positive and negative electrode conducting connection point by silver slurry, and by high-temperature baking, silver slurry is cured, form the series and parallel hybrid circuit of the series circuit of at least one LED luminescence chip 2 or the parallel circuits of at least two LED luminescence chips 2 or multiple LED luminescence chip 2;
(3) finally by plastic packaging mode of entirely wrapping up, support 1, metal level 3 and multiple LED luminescence chip 2 entirety are wrapped up entirely with the fluorescent glue prepared, form fluorescent adhesive layer 4.
Flexible lamp strip of the present invention and processing method thereof, plating mode or sintering processing metal cladding 3 or sintered metal layer 3 on support 1 is utilized by LED luminescence chip 2 size of upside-down mounting, and just arrange on support 1, negative electrode conducting connection point, the LED luminescence chip 2 of upside-down mounting just, negative pole by silver slurry with just, negative electrode conducting connection point is bonding, and by high-temperature baking, silver slurry is cured, do the cohesive force and thermal conductivity that namely add LED luminescence chip 2 and support 1 like this, also reduce this procedure of welded wire, not only save gold thread cost, other costs such as equipment cost, also add the reliability of product, and pass through by the material of other all flexible materials such as plastics or organosilicon as support 1, metal cladding 3 or sintered metal layer 3 on support 1 with plating mode or sintering processing, the LED luminescence chip 2 of upside-down mounting just, negative pole is just adhesively fixed on by silver slurry, on negative electrode conducting connection point, and by high-temperature baking, silver slurry is cured, form various circuit, and the fluorescent glue prepared is wrapped up mode to support 1 entirely by plastic packaging, metal level 3 and multiple LED luminescence chip 2 entirety are wrapped up entirely, the various shape of the encapsulation bent formation of back light bar, the reflection of principle of luminosity that each LED luminescence chip 2 on after-poppet 1 utilizes it special and fluorescent adhesive layer 3 (fluorescent material and glue) is lighted in bending, refraction, 6 luminous intensities of each LED luminescence chip 2 can be made even and the illumination of each angle.
The above embodiment is only be described the preferred embodiment of the present invention; not scope of the present invention is limited; under not departing from the present invention and designing the prerequisite of spirit; the various distortion that the common engineers and technicians in this area make technical scheme of the present invention and improvement, all should fall in protection range that claims of the present invention determine.
Claims (8)
1. a flexible lamp strip, it is characterized in that: comprise the bar shaped support and multiple inverted LED luminescence chip be made up of flexible material, described rack outer surface is provided with metal level and positive and negative electrode conducting connection point, the positive and negative electrode of described LED luminescence chip is connected with positive and negative electrode conducting connection point, form the series and parallel hybrid circuit of the series circuit of at least one LED luminescence chip or the parallel circuits of at least two LED luminescence chips or multiple LED luminescence chip, the overall outer surface of described support, metal level and multiple LED luminescence chip is enclosed with fluorescent adhesive layer.
2. flexible lamp strip as claimed in claim 1, is characterized in that: described rack outer surface is connected with metal level by plating or sintering processing.
3. flexible lamp strip as claimed in claim 1, is characterized in that: described positive and negative electrode conducting connection point is bonded together with the positive and negative electrode of LED luminescence chip by silver slurry, and is cured silver slurry by high-temperature baking.
4. flexible lamp strip as claimed in claim 1, is characterized in that: described fluorescent adhesive layer entirely wraps up mode by plastic packaging or support, metal level and multiple LED luminescence chip entirety are wrapped up by some glue mode.
5. flexible lamp strip as claimed in claim 1, is characterized in that: described support is made up of the flexible material of plastics or silica gel.
6. flexible lamp strip as claimed in claim 1, is characterized in that: described LED luminescence chip is blue chip or red light chips or green glow chip or purple light chip.
7. flexible lamp strip as claimed in claim 1, is characterized in that: described fluorescent glue is allocated by least one color fluorescence powder and glue and formed.
8. a flexible lamp strip processing method, is characterized in that: comprise the steps:
(1) metal cladding or sintered metal layer in the strip-shaped bracket first utilizing plating mode or sintering processing to make at flexible material according to the LED luminescence chip size of upside-down mounting, and on support, carve positive and negative electrode conducting connection point;
(2) after, the positive and negative electrode of multiple inverted LED luminescence chip is bonded together with positive and negative electrode conducting connection point by silver slurry, and by high-temperature baking, silver slurry is cured, form the series and parallel hybrid circuit of the series circuit of at least one LED luminescence chip or the parallel circuits of at least two LED luminescence chips or multiple LED luminescence chip;
(3) finally by plastic packaging mode of entirely wrapping up, support, metal level and multiple LED luminescence chip entirety are wrapped up entirely with the fluorescent glue prepared, form fluorescent adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410339784.0A CN105023918A (en) | 2014-07-17 | 2014-07-17 | Flexible lamp strip and machining method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410339784.0A CN105023918A (en) | 2014-07-17 | 2014-07-17 | Flexible lamp strip and machining method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105023918A true CN105023918A (en) | 2015-11-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410339784.0A Pending CN105023918A (en) | 2014-07-17 | 2014-07-17 | Flexible lamp strip and machining method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105023918A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106299081A (en) * | 2016-08-05 | 2017-01-04 | 张恒钦 | A kind of preparation method containing fluorescent material flexible LED filament base plate for packaging |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202839732U (en) * | 2012-08-01 | 2013-03-27 | 佛山市国星光电股份有限公司 | LED bracket and LED device produced therefrom |
| CN103545437A (en) * | 2013-10-11 | 2014-01-29 | 杭州恒诚光电科技有限公司 | Bendable LED lighting components |
| CN203979983U (en) * | 2014-07-17 | 2014-12-03 | 王志根 | Flexible lamp strip |
-
2014
- 2014-07-17 CN CN201410339784.0A patent/CN105023918A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202839732U (en) * | 2012-08-01 | 2013-03-27 | 佛山市国星光电股份有限公司 | LED bracket and LED device produced therefrom |
| CN103545437A (en) * | 2013-10-11 | 2014-01-29 | 杭州恒诚光电科技有限公司 | Bendable LED lighting components |
| CN203979983U (en) * | 2014-07-17 | 2014-12-03 | 王志根 | Flexible lamp strip |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106299081A (en) * | 2016-08-05 | 2017-01-04 | 张恒钦 | A kind of preparation method containing fluorescent material flexible LED filament base plate for packaging |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151104 |