TW201334103A - Chip sorting apparatus - Google Patents

Abstract

A chip sorting apparatus is provided and includes a chip holder including a first surface and an opposite second surface, a wafer including a first chip adhering to a first position of the first surface, a first chip receiver including a third surface and an opposite fourth surface, wherein the third surface is opposite to the first surface, a pressurized device pressuring on the second surface according to the first position to adhere the first chip and the third surface with each other, and a separator decreasing the adhesion between the first chip and the first surface.

Description

Grain sorting device

The present invention relates to a grain sorting apparatus and a method of sorting same.

In a semiconductor process, each wafer is processed through several to hundreds of processes. The fabricated wafer has a plurality of defined regions that are cut into a plurality of chips. After the wafer process, these multiple areas are subjected to a series of tests before or after the die cutting. Taking the light-emitting diode as an example, after the epitaxial wafer is completed, an electrode is formed through an evaporation process, and then a yellow light and an etching process are used to open a dicing street, and the plurality of regions separated by the dicing road are crystal grains. . After these multiple regions are tested by the probe, the test results are written into the wafer map file by the classification code, and classified according to the wafer image file according to the customer or user requirements specifications. When sorting, the data on the wafer map corresponds to each die, and the required die is sorted by one of the wafers by the sorter, and then placed on another sorting platform (bin) Table) collects the film and repeats the sorting action until the classification is completed. However, in the process of sorting by the sorting machine, it takes a lot of time between the mechanical arm of the sorting machine to and from the wafer and the sorting platform. Taking the commercial sorting machine as an example, only about 4 crystal grains can be sorted per second. Taking 40,000 dies in a wafer as an example, it takes about 3 hours to complete the entire wafer sorting, which affects the manufacturing efficiency.

The present invention provides a die sorting apparatus including a die carrying portion having a first face and a second face opposite to the first face; a wafer including a first die attached to the first face a first grain receiving portion having a third surface and a fourth surface opposite to the third surface, the third surface being located opposite the first side of the die carrying portion; a pressure applicator Pressing the pressure device on the second surface corresponding to the first position, so that the first die and the third face of the first die receiving portion Attached to each other; and a separator that attenuates the adhesion between the first die and the first face by the separator.

A die sorting apparatus according to an embodiment of the present invention further includes a die locator having a function of grain positioning.

A die sorting apparatus according to an embodiment of the invention, wherein the die positioner comprises an image recognizer.

A die sorting apparatus according to an embodiment of the invention, wherein the wafer comprises a plurality of crystal grains.

A die sorting apparatus according to an embodiment of the present invention further includes a second die attached to a second position of the first face of the die carrying portion.

Another aspect of the present invention provides a method for classifying a die, comprising providing a die carrying portion having a first face and a second face opposite to the first face; attaching a wafer to the first of the die carrying portions In a first position, the wafer includes a first die; a first die receiving portion is provided, having a third face and a fourth face opposite to the third face; the moving die carrier or/and a die receiving portion, wherein the third surface of the first die receiving portion is located on a side opposite to the first surface of the die carrying portion; a pressure applying device is provided; and the driving pressure device is pressed on the second surface to correspond to the first surface Positioning such that the first die and the third face of the first die receiving portion are attached to each other; providing a separator; and driving the separator to act on the die carrying portion such that the first die and the first face The adhesion between the two is weakened.

The method for classifying a die according to an embodiment of the present invention further includes separating the first die from the die carrying portion.

The method for classifying a die according to an embodiment of the present invention further includes attaching a second die to a second position of the first surface of the die carrying portion; providing a second die receiving portion having a a fifth surface and a sixth surface opposite to the fifth surface; moving the die carrying portion or/and the second die receiving portion such that the fifth surface is located on the opposite side of the first surface; and driving the pressure device to apply pressure to the second surface The surface corresponds to the second position such that the second die and the fifth face are attached to each other; the driving splitter acts on the die carrying portion such that the adhesion force between the second die and the first face is weakened; Separating the second die from the die carrying portion.

The method for classifying a die according to an embodiment of the present invention further includes providing a die locator for performing die positioning by a die locator.

110‧‧‧Classification device

10‧‧‧ wafer

11‧‧‧ grain

12‧‧‧Central grain

13‧‧‧ grain

20‧‧‧Grade carrier

30‧‧‧ Grain Locator

40‧‧‧First platform

50‧‧‧Grade receiving department

60‧‧‧second platform

70‧‧‧ Pressure device

71‧‧‧ Pressure pen

72‧‧‧ Pressure pen

80‧‧‧Separator

81‧‧‧Go to peptizer

110‧‧‧Graph Classification Device

201‧‧‧Grade carrier

501‧‧‧Grade Receiving Department

601‧‧‧Second platform

602‧‧‧ Current controller

801‧‧‧Separator

1 is a top view of a die sorting apparatus according to an embodiment of the present invention; FIG. 2 is a top view showing a die sorting apparatus according to an embodiment of the present invention; and FIG. 3 is a view showing a die sorting apparatus according to an embodiment of the present invention; FIG. 4A-4F is a flow chart showing a method of classifying a crystal grain according to an embodiment of the present invention; FIG. 5 is a top view showing a die sorting apparatus according to an embodiment of the present invention; and FIG. 6 is a view showing implementation according to the present invention; An example of a top view of a die sorting apparatus; and Figs. 7-10 show a flow chart of a method of classifying a die according to an embodiment of the present invention.

Referring to FIG. 1-6, FIG. 4A is a schematic diagram of a die sorting apparatus 110 according to an embodiment of the present invention. The die sorting apparatus 110 includes a wafer 10 and a die carrying portion 20, A first die receiving portion 50, a pressure applicator 70, and a separator 80. FIG. 1 is a partial top view of the die sorting device 110. The wafer 10 further includes a plurality of die defining regions. The plurality of die defining regions are defined by a yellow light lithography process in the front process. The cutting step forms a plurality of independent crystal grains 11. A central chip 12 is located in the middle of the wafer, and a pattern on the central die can be used as a positioning mark in subsequent processes. The diced wafer 10 is placed on the die carrying portion 20, which is typically a viscous adhesive such as a blue film tape or an ultraviolet tape. In this embodiment, a blue film tape is selected as the die bearing portion. The aforementioned cutting step can also be performed after the wafer 10 is attached to the tape. In the sorting device 110, the position coordinates of each of the crystal grains define the X/Y coordinate position of the crystal grains with the central crystal grain 12 as an origin; the photoelectric characteristics of each crystal grain, such as wavelength, brightness, operating voltage, or current Etc., it was built and stored in the wafer image file during the previous test. Therefore, the positions of the crystal grains on the blue film tape are arranged on the tape according to the relative position defined in the test phase. The face on which the die 11 is attached to the tape may be the front side or the back side of the die.

Refer to Figures 2 and 3. 2 is a partial top view of the die sorting device 110, and FIG. 3 is a partial side view of the die sorting device 110; after the wafer 10 is pasted with the tape, The first platform 40 is a hollow ring-shaped sub-ring structure connected to the die carrier 20 to expose the wafer 10 and the wafer 10 Attached die carrier 20 . The die sorting device 110 further includes a die locator 30 for adjusting the wafer to the positioning point for subsequent processing. In this embodiment, the die locator is an image recognizer, and the image recognizer can be used. The dies on wafer 10 are positioned. The image recognizer is placed above the die carrying portion 20. The surface of the wafer 10 that is not adhered to the tape is flipped down to a first platform 40, and the signal sent by the die positioner 30 drives the first platform 40 to move the wafer 10 to the positioning point, and the central die 12 is used as the origin of the coordinate identification to further position the die 11.

In another embodiment, the first platform 40, such as a sub-mother ring, is fixed within a range identifiable by the die positioner 30, and the die carrier 20 is fixed by the sub-ring and then by the die. The positioner 30 identifies the location of the central die 12 and the relative positions of the other die 11 to complete the positioning of the die.

There is a die receiving portion 50 under the wafer 10, and the die receiving portion 50 is disposed on a second platform 60 as a viscous adhesive such as a blue film tape or an ultraviolet tape. In this embodiment, a blue film tape is selected as the die receiving portion to collect the classified crystal grains in a subsequent process. The area of the blue film tape must be greater than or equal to the area of the wafer 10, and its location is below the wafer 10 in this embodiment, enabling it to completely collect the crystals sorted from the wafer 10 in a later process. grain.

In another embodiment, the difference from the above embodiment is that the die receiving portion 50 and the platform 60 can be transparent or translucent devices; the image identifier can also be placed under the die receiving portion 50 and the platform 60, and the crystal can be seen through the crystal. The pellet receiving portion 50 and the stage 60 position the wafer 10.

In another embodiment, the first platform 40 is fixed at a predetermined position and must be located within the identification range of the locator 30; the die carrier 20 is transferred to the first platform 40, and the die carrier 20 is adjusted. After being placed within the identification range of the grain locator 30, it is fixed to the first platform 40. Then, the position of the central wafer 12 and the relative positions of the other crystal grains and the central die 12 are recognized by the die positioner 30 to complete the positioning of the respective crystal grains.

The die sorting device 110 further includes a presser 70 and a separator 80. As shown in FIG. 4A, the presser 70 includes two press pens 71, 72 in this embodiment. In the grain classification process, the wafer pattern generated during the spot measurement in the front part of the grain process includes the photoelectric characteristics of each grain. According to the customer's needs, the crystals that meet the requirements are screened out, and then the data corresponding to the positions corresponding to the customer's requirements are transmitted from the die positioner 30 to the pressure applicator 70 to drive the pressure. The device 70 is pressed against the surface of the die carrying portion 20 corresponding to the desired die so that the die does not contact the die carrying portion 20 and the die receiving portion 50. In this embodiment, a blue film tape is provided. , attached to each other. The pressure applicator 70 selects different sizes of pressure pens according to the size of the grain to be classified to apply pressure. When the grain size to be classified is large, the large size pen 72 is selected to operate, and when the grain size to be classified is small , select a small size pen 71 to operate.

Next, the adhesion force between the die 11 and the die pad 20 can be weakened by the separator 80. In the present embodiment, the separator 80 is a liquid coating device, such as a syringe, which can apply a degumming solvent 81, such as acetone, to a portion of the pressure applied by the pressure device to make the desired crystal grains and grains. The adhesion between the load-bearing portions is weakened, and then the die-bearing portion 20 is moved to separate the die and the die-bearing portion 20, for example, a blue film tape. The separated crystal grains 13 are attached to the blue film tape as the crystal grain receiving portion 50, that is, the first classification is completed.

4A-4F illustrates a method of grain classification of the present invention, comprising the steps of first providing a wafer 10, which in one embodiment comprises a substrate for fabricating a light emitting diode, such as sapphire, The material of the bismuth, gallium phosphide, gallium arsenide, or gallium nitride series; in this embodiment, the wafer 10 is a 2-inch gallium nitride wafer, comprising a plurality of crystal grains 11; Surrounded by a plurality of scribe lines, a central die 12 is included at the center of the wafer 10. The wafer 10 is placed on the die-receiving portion 20. In this embodiment, the blue film tape is used as the die-bearing portion, and the die 10 and the blue film tape are attached to each other by the attaching force. Then, the die positioner 30 performs the die positioning. In this embodiment, the die positioner is an image identifier, and the surface of the wafer 10 that is not adhered to the tape is turned down and connected to the first platform 40. The signal of the identifier drives the first platform 40, so that the central die 12 is located at the positioning point, and the relative positions of the respective crystal grains are recognized to complete the step of locating the die. Next, the die receiving portion 50 is provided below the wafer 10 after positioning. In this embodiment, a blue film tape is selected as the die receiving portion.

Then, the grain classification is performed. As described above, the wafer pattern is generated during the spot measurement in the front stage of the grain processing, and the photoelectric data of each die in the wafer pattern is screened according to the customer's requirements to select the photoelectric characteristics according to the customer's requirements. The crystal grains are collected in the crystal grain receiving portion 50. In this embodiment, the die that meets the customer's requirements is screened by the wafer image file, represented by BIN1; If there is another crystal characteristic of the photoelectric characteristics, the crystal grains conforming to the second photoelectric characteristics are selected from the photoelectric characteristics of each of the crystals recorded in the wafer pattern, and expressed by BIN2. As shown in Fig. 4B-4C and Fig. 5, wherein Fig. 5 is a top view of Fig. 4B, the position corresponding to the BIN1 die is supplied to the pressure applicator 70, and the pressure applicator 70 judges BIN1 based on the input data. The grain size is driven by a pressure applicator to select a suitable pressure pen to apply pressure to the position of the blue film tape as the die bearing portion 20 corresponding to the BIN1 grain so that the die does not adhere to the die bearing portion 20. The pressure pen is attached to the blue film tape as the die receiving portion 50.

Referring to FIG. 4D-4E, the die carrier 20 and the die 10 are then separated by a separator 80. In the present embodiment, the separator 80 is a liquid coating device that applies a degumming solvent 81, such as acetone, to a portion of the pressure applicator 70 that is pressed against the die carrying portion 20, and the acetone penetrates into the die carrying portion. The attachment surface of the die and the die is such that the adhesion between the BIN1 die and the blue film tape of the die carrier 20 is weakened; then the second platform 60 carrying the die receiving portion is moved, due to the die receiving portion 50 and the crystal The adhesion between the particles is stronger than the adhesion between the crystal grain bearing portion 20 and the crystal grains after the application of acetone, so that the crystal grain and the crystal grain bearing portion 20 can be easily separated by moving the second stage 60. The separated BIN1 crystal grains 13 are attached to the blue film tape of the die receiving portion 50, that is, the first classification is completed.

Referring to Figures 4F and 6, Figure 6 is a top view of Figure 4F. Then, by moving the second platform 60 carrying the die receiving portion 50, replacing the new blue film tape, the above-described grain sorting step is repeated to perform subsequent BIN2 grain classification. If the crystal grains of the third type of photoelectric characteristics are further separated according to the customer's requirements, the crystal grains corresponding to the photoelectric characteristics of the remaining crystal grains on the crystal grain carrying portion 20 are screened out, and the step of repeating the grain classification needs to be performed. The order provides three pieces of blue film tape as the die receiving portion, and repeats the aforementioned steps of grain classification to complete the classification. The number of the die receiving portions 50 is determined in accordance with the amount of the class to be classified by the die.

In another embodiment, the difference from the above embodiment is that after the step of applying acetone, the adhesion between the BIN1 crystal grains and the blue film tape of the crystal grain bearing portion 20 is weakened, and the crystal can be directly removed by hand, for example. The blue film tape of the grain carrying portion 20, or the blue film tape of the die receiving portion 50 is removed. At this time, the BIN1 die is attached to the blue film tape of the die receiving portion 50, and the remaining crystal grains remain in the grain bearing. On the blue film tape of the part 20, the classification is completed, and the classification of the next stage is performed.

Referring to FIG. 7, a schematic diagram of a die sorting apparatus 710 according to another embodiment of the present invention is disclosed, wherein the die carrying portion 201 is an ultraviolet tape, and the die receiving portion 501 It is better to use a non-ultraviolet tape to reduce the adhesion without ultraviolet light. In addition, the bonding force between the die carrying portion 201 and the die 11 must be greater than the bonding force between the die receiving portion 501 and the die 11. In this embodiment, the die receiving portion 501 is disposed on a second platform 601. The second platform 601 is a liquid crystal panel with liquid crystal material sandwiched between two pieces of conductive glass, and includes a current controller 602.

Referring to FIGS. 8 and 9, all the crystal grains are bonded to the die receiving portion 501 by the presser 70, and the die 11 is also bonded to the die carrying portion 201 at the same time. An ultraviolet light emitter is disposed under the liquid crystal panel as the separator 801. The position coordinates corresponding to the BIN1 die are transmitted to the current controller 602, and the controller controls the position where the two conductive glasses are energized, thereby controlling the rotation angle of the liquid crystal material, so that the liquid crystal material corresponding to the BIN1 grain position under the BIN1 die is controlled. It will rotate to a direction perpendicular to the glass, showing an open area with no liquid crystal barrier. Then, after the ultraviolet light is emitted from the ultraviolet light emitter, the light passes through the liquid crystal material under the BIN1 grain position without being blocked by the liquid crystal material, passes through the glass, the crystal grain receiving portion 501, the BIN1 crystal grain, and then irradiates to the crystal grain bearing portion. 201, the viscosity of the crystal grain bearing portion 201 formed by the ultraviolet light tape is weakened by illumination. Referring to FIG. 10, the die other than BIN1 is removed from the die receiving portion 501 together with the die carrying portion 201 by removing the die carrying portion 201, for example, by hand, the ultraviolet light of the die carrying portion 201 is removed by hand. In the tape, since the bonding force between the ultraviolet light tape which is not irradiated with the ultraviolet light and the crystal grain 11 is larger than the bonding force between the crystal grain receiving portion 501 and the crystal grain 11, the ultraviolet light tape is torn up, other than the BIN1. The crystal grains are also separated from the die receiving portion 501 by the ultraviolet light tape, and only the crystal grains of BIN1 remain on the die receiving portion 501, that is, the first classification is completed. The tape of the die receiving portion 501 is then updated for subsequent BIN2 grain classification.

The examples of the invention are intended to be illustrative only and not to limit the scope of the invention. Any changes or modifications of the present invention to those skilled in the art will be made without departing from the spirit and scope of the invention. .

110‧‧‧Classification device

11‧‧‧ grain

20‧‧‧Grade carrier

30‧‧‧ Grain Locator

50‧‧‧Grade receiving department

60‧‧‧second platform

70‧‧‧ Pressure device

71‧‧‧ Pressure pen

72‧‧‧ Pressure pen

80‧‧‧Separator

Claims (10)

A method for classifying a crystal grain includes: providing a die carrying portion having a first surface; providing a plurality of crystal grains on the first surface; and providing a die receiving portion having a second surface, wherein the second surface Located on the opposite side of the first surface; attaching the plurality of crystal grains to the second surface; weakening the adhesion force between the plurality of crystal grains and the first surface; and weakening the plurality of crystal grains and the After the step of attaching force between the first faces, the plurality of grains are separated from the first face. The method for classifying a grain according to claim 1, wherein the die bearing portion comprises a viscous rubber material. The method for classifying a grain according to claim 1, wherein the die receiving portion comprises a viscous adhesive. The method for classifying a grain according to claim 1, wherein the step of attaching the plurality of crystal grains to the second surface comprises: applying pressure to the die carrying portion to correspond to the plurality of crystal grains Positioning the plurality of dies on the second side. The method for classifying a grain according to claim 1, wherein the step of weakening the adhesion between the plurality of grains and the first surface comprises coating a solvent on the die bearing portion to weaken the The adhesion between the plurality of grains and the first face. The method for classifying a grain according to claim 1, wherein the step of weakening the adhesion between the plurality of grains and the first surface comprises irradiating a light to the die bearing portion to attenuate the plurality Adhesion between the die and the first face. The method for classifying a grain according to claim 1, wherein the step of separating the plurality of dies and the first surface comprises moving the die carrying portion and/or moving the die receiving portion to separate the A plurality of dies and the first side. The method of classifying a grain according to claim 1, wherein the plurality of grains meet the requirements of the same photoelectric characteristics. The method of classifying a grain according to claim 8, wherein the photoelectric property comprises brightness, an emission wavelength, an operating voltage, or a current. The method for classifying a grain according to claim 1, wherein the step of attaching the plurality of crystal grains to the second surface further comprises positioning the plurality of crystal grains.