201226210 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種印刷系統及其印刷方法；具體而 言，本發明係關於一種供精密印刷使用之印刷系統及其 印刷方法。 ^ 【先前技術】 網板印刷之印刷技術已為廣泛應用於電子產品中 之各類零件，如液晶面板。隨著人們對液晶面板等電子 產品的需求日益增強，網板印刷技術之成熟度也成為相 關產品具備競爭力與否的關鍵因素。相較於黃光製程， 網板印刷具有製程簡單’機台便宜，產距時間(takuime) 短等優點。 圖1A及圖1B所示為傳統之框膠網板印刷系統。 傳統的框膠網板印刷機包含有一印刷網板110，供於在一 基板100上印刷。基板100包含有設置於基板100上之 膜層101。印刷網板110包含有網板本體111及遮蔽層 120。網板本體111具有一内面120朝向基板100，而遮 蔽層120係設置於内面120上。一般遮蔽層120之形成 係藉由重複塗佈複數個感光乳劑層於網板本體111之内 面112,並一次曝光該複數個感光乳劑層形成一遮蔽層印 刷圖形。 201226210 如圖1B所示，傳統的框膠網板印刷機係藉由刮刀 140在網板本體111背向基板100之網板面113上，以一 刮印的壓力將印刷材料150刮印在基板100上。印刷材 料150之材質為框膠材質。如圖iB所示，印刷材料 通過網板本體m上未被遮蔽層120遮蔽之網眼，以形 成框膠160於基板1〇〇上。遮蔽層12〇具有一遮蔽層面 m ’朝向於基板100。當刮刀140對網板本體ui施加 到P壓力時，遮蔽層120之遮蔽層面121將接觸於基板 1〇〇上膜層101，刮刀140因此會在刮印過程中到傷膜層 卜如上所述，遮蔽層12〇係藉由—次曝光感光乳劑層 而形成’刮印過程中勢必會造成膜層1〇1刮傷，影響後 續製程良率。 θ 【發明内容】 本發月之個目的在於提供—種印刷彡統，達到避免 印刷製程巾造成基板上之襲顺之功效。 本發明之另—個目的在於提供—種印刷網板，供於一 基板上進行印刷，可降低損傷基板上膜層的機會。 本發明之另-個目的在於提供一種印刷模板，供於一 基板上進行印刷，可降低贿基板上的機會。 本發明之另-個目的在於提供—種_方法，供於印 刷系統使用，並可達_騎補程巾造成基板上之膜 層刮傷之功效。 201226210 印刷系統係包含基板及印刷網板；其中基板上具有形 成膜層。印刷網板具有網板本體、第一遮蔽層及第二遮 蔽層。網板本體上具有形成複數個網眼；第一遮蔽層係 设置於網板本體面向基板一内面，並部份遮蔽些網板本 體之網眼，並形成第一圖形開口。第二遮蔽層係設置於 .第—遮蔽層背向基板之一面，並且於第一遮蔽層之覆蓋 範圍形成一容置開口，以朝背向網板本體方向曝露第一 遮蔽層。第二遮蔽層上形成一第二圖形開口，第二圖形 開口係連通於第-圖形開σ。第—圖形開口及第二圖形 開口係供於印刷時，印刷材料可從網板本體之未被第一 遮敝層所覆蓋之網眼，透過第—圖形開口及第二圖形開 ρ刷至基板上。备第二遮蔽層接觸基板時，容置開口 係可容納基板上之_，可避免第二遮蔽層刮傷膜層。 隔系統之印刷模板具有—模板本體及—遮蔽層，其 j板本體上形翁複數個墨孔。該些墨孔係分佈形成 —居r Γ形’且該拉板本體具有—内面朝向該基板；遮 =係=該模板本體之該内面突起。其中該遮蔽層並於 分:!圍外形成一容置開口以曝露該模板 本體之該内面。其中，兮疮 連通該些墨孔。…蚊層並形成—第二圖形開口 印刷方法包含於—網板 部份遮蔽該網板本體上之複數網眼:並 口;於該第-遮蔽層被像該網板本體之二= 201226210 一遮蔽層及第二圖形開口’並於該第-遮蔽層之覆蓋範 圍形成-容置開口以朝背向該網板本體方向曝露該第一 遮蔽層；按壓該網板本體於該基板上，且該第二遮蔽層 接觸該基板，使該膜層容納於該容置開口中；按壓該網 板本體於該基板時使一印刷物透過第一圖形開口與第二 圖形開口印刷於該基板上。 具體而言，本發明係可利用兩次曝光方式形成網板本 • 體上之遮蔽層(第—遮蔽層及第二遮蔽層），以製作一容納 區域可容納基板上之模層，並避免在印刷過程中刮傷該 模層。 ^ 【實施方式】 本發明係提供一種印刷系統及其印刷方法。此外，本 發月亦包含使用於上述印刷系統之印刷網板及印刷模 板在較佳實施例中，上述印刷網板及印刷模板係可使 • 用於包含液晶面板框膠印刷機等之精密印刷設備及製程 中。 £ 圖2所示為本發明之一實施例。如圖2所示之一實施 例，印刷系統係包含基板1〇〇及印刷網板11〇。基板1〇〇 上具有形成之膜層101。膜層101較佳為半導體製程中形 成之各式材質膜層，並藉由各式製程形成為不同的電 子、電路單元或結鮮元。基板⑽可以為各式透明或 不透明基板’材質射為㈣、朗或其他材料。印刷 201226210 網板110具有網板本體111、第一遮蔽層220及第二遮蔽 層230。在此實施例中’網板本體ln上具有複數個網 眼。第一遮蔽層22(H系設置於朝向基才反1〇〇之網板本體 111的内面112，並部份遮蔽些網板本體U1之網眼。該 第二遮蔽層230係設置於該第一遮蔽層22〇朝向該基板 100之一面，並且於該第一遮蔽層22〇之覆蓋範圍形成一 容置開口 190以朝背向該網板本體ηι方向曝露該第一 遮蔽層220。第一遮蔽層220之形成係藉由曝光重複塗佈 複數個感光乳劑層而形成。第二遮蔽層23〇之形成係藉 由第一遮蔽層220形成後，曝光複數個感光乳劑層於第 一遮敝層220面向基板1〇〇之一面而形成。然而，第一 遮蔽層220及第二遮蔽層230亦可係以別種材質形成。 此外，第一遮蔽層220及第二遮蔽層230兩者可採用相 同或不相同材料。在較佳實施例中，第一遮蔽層220之 厚度係小於第一遮敝層之厚度；然而在其他實施例中， 第一遮蔽層220之厚度亦可大於或相當於第二遮蔽層 230之厚度。 在圖2所示之實施例中，亦可使該第二遮蔽層23〇 圍成該第二圖形開口 180之側緣伸入該第一遮蔽層220 之該第一圖形開口 170,並遮蔽該第一遮蔽層220圍成該 第一圖形開口 170之側緣，使該第二遮蔽層230形成之 第二圖形開口 180連通於第一圖形開口 170。換言之，該 第二圖形開口 180係形成於該第一圖形開口 17〇内。在 201226210 較佳實施例中，該第二圖形開口 180之平均孔徑係小於 該第一圖形開口 170之平均孔徑，並且該第二遮蔽層23〇 之厚度係大於該第一遮蔽層220之厚度。為在網板製程 對位時減少該印刷網板11〇與該基板100對位的移位 (shift)，該第二遮蔽層230之該第二圖形開口 18〇較佳為 基板100之寬口部181所具有之平均孔徑係大於該第二 圖型開口 180整體之平均孔徑。如圖2所示，寬口部181 φ 具有一第一厚度181W而第二圖形開口 180具有一第二 厚度180W。該第一厚度181W係小於第二厚度18〇w。 藉由此一設計，在印刷過程中不易產生溢墨狀況，並使 該框膠160的寬度較易控制。 如圖3之實施例所示，印刷網板11〇具有網板本體 U1、第一遮蔽層320及第二遮蔽層33〇。網板本體lu 上具有形成複數個網眼，網眼較佳可由交錯之纖維形 成，亦可由金屬板打孔形成。第一遮蔽層22〇係設置於 Φ 網板本體1U面向該基板100之一内面112,並部份遮蔽 些網板本體111之網眼。該第二遮蔽層33〇係設置於該 第一遮蔽層320朝向該基板1〇〇以上之一面，並且於該 第一遮蔽層320之覆蓋範圍形成一容置開口 190以朝背 向該網板本體111方向曝露該第-遮蔽層320。 第一遮蔽層320上具有形成第一圖形開口 17〇。第二 遮蔽層330上形成一第二圖形開口 180,第二圖形開口 180係連通於第—圖形開σ⑽。藉由第-圖形開口 170 201226210 及該第二圖形開口 18〇之設置，在印刷過程中，印刷材 料可自網板本體U1未被第—遮蔽層蓋之網眼，透 過該第-圖形開口 17G及該第二圖形開口⑽印刷至該 基板100上。在較佳實施例中，該第二遮蔽層由較 該第-遮蔽層320硬度高之材質製成。在此實施例，該 第一遮蔽層320係由感光材質形成，而該第二遮蔽層33〇 係由金屬材質製成，如不銹鋼板等材質。然而，如圖3 所示，該第二遮蔽層330亦可係由其他材質製成，並具 有一外層331。該外層331較佳係以金屬材質形成(如不 銹鋼板專材質）。該第二遮蔽層320之厚度係大於該膜層 101之高度，使當該第二遮蔽層330接觸該基板1〇〇時， 該外層331不會接觸到該基板100上之該膜層101，且容 置開口 190可容納該基板上之該膜層101，並可避免第二 遮蔽層330刮傷膜層ιοί。 圖4A及圖4B所示為本發明之另一實施例。圖4B所 示為圖4A之上視示意圖。在此實施例中，印刷模板41〇 具有模板本體420及一遮蔽層421。該模板本體420具有 複數個墨孔182 ;該些墨孔182係分佈形成一第一圖形 183。模板本體420另具有一内面412朝向該基板1〇〇， 其中該遮蔽層421係自該模板本體420之内面412朝向 基板100凸起，並於該第一圖形183之分佈範圍外形成 一容置開口 190以曝露該模板本體420之該内面412。遮 蔽層421並形成一第二圖形開口 184連通該些墨孔182, 201226210 其中第二圖形開口 184係為第一圖形183相對應。與圖 2A、2B及圖3之前述實施例相比，在此實施例中，模板 本體420及遮蔽層421取代了網板本體111、第一遮蔽層 320及第二遮蔽層330,然而模板本體420之結構外型仍 可與前述實施例相似。在此實施例中，模板本體420係 可以蝕刻方式製作出遮蔽層421及容置開口 190,以保護 膜層101。模板本體420及遮蔽層421較佳為金屬材質製 春 成’如不鏽鋼板等材質。在較佳實施例中’容置開口 19〇 之深度係大於基板1〇〇上之膜層1〇1之高度，使當印刷 模板410接觸基板1〇〇時，設置於基板1〇〇上之膜層1〇1 可完全容納於容置開口 190,並避免膜層101受到刮傷痕 跡。 圖5所示為印刷方法之實施例流程圖。在較佳實施例 中，本發明之印刷方法係供於一基板上進行印刷，其中 基板上設置有膜層。然而，在其他實施例中，此印刷方 • 法亦可供於其他裝置上印刷。 如圖5所不，步驟1000包含於網板本體上形成第一 遮蔽層，以部分遮_板本體上之複_眼。第一遮蔽 層係設置於躺基板之峨本_面，並且部分覆蓋網 板本體内面上之複數網眼。藉此可防止在印刷過程中， 印刷材料被印刷在基板上欲印刷部分以外之處。如前 述’為控制基板上之印刷顧及_，第—遮蔽層上形 成有第一圖形開口。 201226210 步驟1100包含於該第一遮蔽層背向該網板本體之一 面上形成第二遮蔽層，並於該第一遮蔽層之覆蓋範圍形 成谷置開口以朝背向該網板本體方向曝露該第一遮蔽 層。在較佳實施例中，第二遮蔽層可伸入第一圖形開口， 並遮蔽第一遮蔽層，以圍成第一圖形開口之側緣。此外， 第二遮蔽層之厚度較佳可形成大於第一遮蔽層之厚度。 在較佳實施例中，第二圖形開口之平均孔徑係小於第一 圖形開口之平均孔徑。第二遮蔽層圍成第二圖形開口之 側緣係伸入第一圖形開口，並遮蔽第一遮蔽層圍成第一 圖形開口之側緣。該第二遮蔽層形成第二圖形開口，並 連通於第一圖型開口。第二遮蔽層之厚度可大於基板上 之膜層高度。 如圖5所示，步驟1200包含按壓網板本體於基板上， 並§第一遮敝層接觸基板時，使基板上之膜層容納於容 置開口中’並同時使印刷材料透過第一圖案開口與第二 圖案開口印刷於基板上。 本發明已由上述相關實施例加以描述，然而上述實施 例僅為實施本發明之範圍。必須指出的是，已揭露之實 施例並未限制本發明之範圍。相反地，包含於申請專利 範圍之精神及範圍之修改及均等設置均包含於本發明之 範圍内。 12 201226210 【圖式簡單說明】 圖1A及目1B $傳統液晶顯示農置之印刷系統之示意 圖2為印概統之實施例示意圖； 圖3為印刷系統之另-實施例之示意圖； 圖4A、圖4B為印刷系統之另 圖5為印刷方法之實施例流程 一實施例之示意圖 圖。 及201226210 VI. Description of the Invention: [Technical Field] The present invention relates to a printing system and a printing method thereof; in particular, the present invention relates to a printing system for precision printing and a printing method therefor. ^ [Prior Art] The printing technology of screen printing has been widely used in various parts of electronic products, such as liquid crystal panels. As the demand for electronic products such as liquid crystal panels increases, the maturity of stencil printing technology has become a key factor in the competitiveness of related products. Compared with the yellow light process, screen printing has the advantages of simple process, low machine, and short takuime. 1A and 1B show a conventional framed screen printing system. A conventional framed screen printing machine includes a printing screen 110 for printing on a substrate 100. The substrate 100 includes a film layer 101 disposed on the substrate 100. The printing stencil 110 includes a stencil body 111 and a shielding layer 120. The stencil body 111 has an inner surface 120 facing the substrate 100, and the shielding layer 120 is disposed on the inner surface 120. Generally, the shielding layer 120 is formed by repeatedly coating a plurality of emulsion layers on the inner surface 112 of the screen body 111, and exposing the plurality of emulsion layers at a time to form a masking pattern. 201226210 As shown in FIG. 1B, the conventional framed screen printing machine scrapes the printing material 150 on the substrate by a doctor blade 140 on the screen surface 113 of the substrate 100 facing away from the substrate 100 by a doctor blade. 100 on. The material of the printing material 150 is made of a frame material. As shown in Fig. iB, the printing material passes through the mesh of the stencil body m which is not covered by the shielding layer 120 to form the sealant 160 on the substrate 1A. The shielding layer 12A has a shielding layer m' facing the substrate 100. When the blade 140 applies the P pressure to the stencil body ui, the shielding layer 121 of the shielding layer 120 will contact the upper layer 101 of the substrate 1 , and the blade 140 will thus be in the process of squeegee to the wound layer as described above. The masking layer 12 is formed by the first exposure of the emulsion layer. The scratching process will inevitably cause the film layer 1〇1 to be scratched, which affects the subsequent process yield. θ [Summary of the Invention] The purpose of this month is to provide a printing system to avoid the effect of the printing process towel on the substrate. Another object of the present invention is to provide a printing screen for printing on a substrate to reduce the chance of damaging the film layer on the substrate. Another object of the present invention is to provide a print template for printing on a substrate that reduces the chance of bribing the substrate. Another object of the present invention is to provide a method for use in a printing system that achieves the effect of scratching the film on the substrate by riding a backup towel. The 201226210 printing system comprises a substrate and a printing screen; wherein the substrate has a film layer formed thereon. The printing stencil has a stencil body, a first shielding layer and a second shielding layer. A plurality of meshes are formed on the stencil body; the first shielding layer is disposed on the inner surface of the stencil body facing the substrate, and partially shields the meshes of the stencil bodies, and forms a first graphic opening. The second shielding layer is disposed on the one surface of the first shielding layer facing away from the substrate, and forms a receiving opening in the coverage of the first shielding layer to expose the first shielding layer toward the back of the screen body. A second pattern opening is formed on the second shielding layer, and the second pattern opening is connected to the first pattern opening σ. When the first pattern opening and the second pattern opening are for printing, the printing material can be brushed from the mesh of the stencil body not covered by the first concealing layer to the substrate through the first pattern opening and the second pattern opening ρ on. When the second shielding layer contacts the substrate, the receiving opening can accommodate the substrate, and the second shielding layer can be prevented from scratching the film layer. The printing template of the partition system has a template body and a shielding layer, and the j-plate body has a plurality of ink holes. The ink holes are distributed to form a r-shaped shape and the pull plate body has an inner surface facing the substrate; a mask = the inner surface of the template body. Wherein the shielding layer forms a receiving opening outside the sub-! to expose the inner surface of the template body. Among them, hemorrhoids connect the ink holes. The second pattern opening printing method comprises: the stencil portion partially shielding the plurality of meshes on the stencil body: a parallel port; wherein the first occlusion layer is like the stencil body 2 = 201226210 The shielding layer and the second pattern opening 'and forming a receiving opening in the coverage of the first shielding layer to expose the first shielding layer toward the back of the screen body; pressing the screen body on the substrate, and The second shielding layer contacts the substrate, and the film layer is received in the receiving opening. When the mesh body is pressed on the substrate, a printed matter is printed on the substrate through the first graphic opening and the second graphic opening. Specifically, the present invention can form a shielding layer (the first shielding layer and the second shielding layer) on the stencil body by using two exposure methods to form a receiving area for accommodating the molding layer on the substrate, and avoiding The mold layer is scratched during the printing process. [Embodiment] The present invention provides a printing system and a printing method thereof. In addition, the present month also includes a printing screen and a printing template for use in the above printing system. In a preferred embodiment, the printing screen and the printing template can be used for precision printing including a liquid crystal panel seal printing machine. Equipment and process. FIG. 2 shows an embodiment of the present invention. In one embodiment, as shown in Figure 2, the printing system comprises a substrate 1 and a printing screen 11". A film layer 101 is formed on the substrate 1A. The film layer 101 is preferably a film layer of various materials formed in a semiconductor process, and is formed into different electrons, circuit units or junction elements by various processes. The substrate (10) may be made of a variety of transparent or opaque substrates. The material is (4), lang or other materials. Printing 201226210 The stencil 110 has a stencil body 111, a first shielding layer 220, and a second shielding layer 230. In this embodiment, the 'stencil body ln has a plurality of meshes. The first shielding layer 22 is disposed on the inner surface 112 of the stencil body 111 facing the base, and partially shields the mesh of the stencil body U1. The second shielding layer 230 is disposed on the first shielding layer A shielding layer 22 is facing the one surface of the substrate 100, and a receiving opening 190 is formed in the coverage of the first shielding layer 22 to expose the first shielding layer 220 toward the back of the screen body η. The formation of the shielding layer 220 is formed by repeatedly coating a plurality of emulsion layers by exposure. The second shielding layer 23 is formed by the first shielding layer 220, and then exposing a plurality of emulsion layers to the first concealer. The layer 220 is formed on one side of the substrate 1 . However, the first shielding layer 220 and the second shielding layer 230 may be formed of other materials. In addition, the first shielding layer 220 and the second shielding layer 230 may be used. In the preferred embodiment, the thickness of the first shielding layer 220 is smaller than the thickness of the first concealing layer; however, in other embodiments, the thickness of the first shielding layer 220 may be greater than or equivalent to The thickness of the second shielding layer 230. In Figure 2 In the embodiment, the second shielding layer 23 can be formed so that the side edge of the second pattern opening 180 protrudes into the first pattern opening 170 of the first shielding layer 220, and the first shielding layer 220 is shielded. Enclosing the side edge of the first pattern opening 170, the second pattern opening 180 formed by the second shielding layer 230 is connected to the first pattern opening 170. In other words, the second pattern opening 180 is formed in the first pattern opening. In a preferred embodiment, the average aperture of the second pattern opening 180 is smaller than the average aperture of the first pattern opening 170, and the thickness of the second mask layer 23 is greater than the first mask layer. The thickness of 220. In order to reduce the displacement of the printed screen 11 aligning with the substrate 100 when the stencil process is aligned, the second pattern opening 18 该 of the second shielding layer 230 is preferably a substrate. The wide aperture portion 181 of 100 has an average aperture diameter greater than the average aperture of the second pattern opening 180. As shown in Fig. 2, the wide mouth portion 181 φ has a first thickness 181W and the second pattern opening 180 has a The second thickness is 180 W. The first thickness is 181 W It is smaller than the second thickness of 18 〇w. With this design, the ink overflow condition is not easily generated in the printing process, and the width of the sealant 160 is relatively easy to control. As shown in the embodiment of Fig. 3, the printing stencil 11〇 The stencil body U1, the first shielding layer 320 and the second shielding layer 33. The stencil body lu has a plurality of meshes formed thereon, and the mesh is preferably formed by interlaced fibers or by metal plate punching. A shielding layer 22 is disposed on the inner surface 112 of the stencil body 1U facing the substrate 100, and partially shields the meshes of the stencil bodies 111. The second shielding layer 33 is disposed on the first shielding layer 320 facing one side of the substrate 1 and forms a receiving opening 190 in the coverage of the first shielding layer 320 to face the stencil The first shielding layer 320 is exposed in the direction of the body 111. The first shielding layer 320 has a first pattern opening 17〇 formed thereon. A second pattern opening 180 is formed on the second shielding layer 330, and the second pattern opening 180 is connected to the first pattern opening σ (10). By the arrangement of the first pattern opening 170 201226210 and the second pattern opening 18 ,, during the printing process, the printing material may be from the mesh body U1 without the mesh of the first shielding layer, through the first graphic opening 17G And the second pattern opening (10) is printed onto the substrate 100. In a preferred embodiment, the second masking layer is made of a material having a higher hardness than the first masking layer 320. In this embodiment, the first shielding layer 320 is formed of a photosensitive material, and the second shielding layer 33 is made of a metal material such as a stainless steel plate. However, as shown in FIG. 3, the second shielding layer 330 may also be made of other materials and has an outer layer 331. The outer layer 331 is preferably formed of a metal material (e.g., a stainless steel plate material). The thickness of the second shielding layer 320 is greater than the height of the film layer 101, so that when the second shielding layer 330 contacts the substrate 1 , the outer layer 331 does not contact the film layer 101 on the substrate 100. And the receiving opening 190 can accommodate the film layer 101 on the substrate, and can prevent the second shielding layer 330 from scratching the film layer ιοί. 4A and 4B show another embodiment of the present invention. Figure 4B is a top plan view of Figure 4A. In this embodiment, the print template 41 has a template body 420 and a masking layer 421. The template body 420 has a plurality of ink holes 182; the ink holes 182 are distributed to form a first pattern 183. The template body 420 further has an inner surface 412 facing the substrate 1 , wherein the shielding layer 421 is convex from the inner surface 412 of the template body 420 toward the substrate 100 and forms an accommodation outside the distribution of the first pattern 183 . Opening 190 exposes inner surface 412 of template body 420. The masking layer 421 and a second pattern opening 184 are connected to the ink holes 182, 201226210, wherein the second pattern opening 184 corresponds to the first pattern 183. Compared with the foregoing embodiments of FIG. 2A, FIG. 2B and FIG. 3, in this embodiment, the template body 420 and the shielding layer 421 replace the stencil body 111, the first shielding layer 320 and the second shielding layer 330, but the template body The structural form of the 420 can still be similar to the previous embodiment. In this embodiment, the mask body 420 can be etched to form the shielding layer 421 and the receiving opening 190 to protect the film layer 101. The template body 420 and the shielding layer 421 are preferably made of a metal material such as a stainless steel plate. In the preferred embodiment, the depth of the receiving opening 19 is greater than the height of the film layer 1〇1 on the substrate 1〇〇, so that when the printing template 410 contacts the substrate 1〇〇, it is disposed on the substrate 1〇〇. The film layer 1〇1 can be completely accommodated in the accommodating opening 190, and the film layer 101 is prevented from being scratched. Figure 5 is a flow chart showing an embodiment of a printing method. In a preferred embodiment, the printing method of the present invention is applied to a substrate for printing, wherein a film layer is disposed on the substrate. However, in other embodiments, this printing method is also available for printing on other devices. As shown in FIG. 5, step 1000 includes forming a first shielding layer on the body of the stencil to partially cover the complex eye on the body of the slab. The first shielding layer is disposed on the surface of the substrate, and partially covers the plurality of meshes on the inner surface of the mesh body. Thereby, it is possible to prevent the printed material from being printed on the substrate other than the portion to be printed during the printing process. As described above, the print on the control substrate takes care of the first pattern opening on the first mask layer. 201226210 Step 1100 includes forming a second shielding layer on a surface of the first shielding layer facing away from the stencil body, and forming a valley opening in a coverage area of the first shielding layer to expose the opaque direction toward the stencil body. The first shielding layer. In a preferred embodiment, the second shielding layer can extend into the first graphic opening and shield the first shielding layer to enclose the side edge of the first graphic opening. In addition, the thickness of the second shielding layer is preferably formed to be larger than the thickness of the first shielding layer. In a preferred embodiment, the average aperture of the second pattern opening is less than the average aperture of the first pattern opening. The second shielding layer encloses the side edge of the second pattern opening into the first pattern opening, and shields the first shielding layer from enclosing the side edge of the first pattern opening. The second masking layer forms a second pattern opening and is in communication with the first pattern opening. The thickness of the second masking layer can be greater than the height of the film layer on the substrate. As shown in FIG. 5, step 1200 includes pressing the stencil body on the substrate, and § when the first concealing layer contacts the substrate, accommodating the film layer on the substrate in the accommodating opening while simultaneously transmitting the printing material through the first pattern. The opening and the second pattern opening are printed on the substrate. The present invention has been described by the above-described related embodiments, but the above embodiments are only intended to implement the scope of the present invention. It must be noted that the disclosed embodiments do not limit the scope of the invention. On the contrary, the modifications and equivalents of the spirit and scope of the invention are included in the scope of the invention. 12 201226210 [Simple description of the drawings] FIG. 1A and FIG. 1B are schematic diagrams of a conventional liquid crystal display printing system of the agricultural system; FIG. 3 is a schematic view of another embodiment of the printing system; FIG. 4B is a schematic diagram of an embodiment of a flow of an embodiment of a printing method. FIG. and
【主要元件符號說明】 100基板 101膜層 102膜層面 110印刷網板 m、411網板本體 112内面 120、420遮蔽層 121遮蔽層面 140刮刀 150印刷材料 160框膠 170第一圖形開口 180、184第二圖形開口 182墨孔 183圖形 190容置開口 220'320第一遮蔽層 230、330第二遮蔽層 410印刷模板 412内面 420模板本體 421第一遮蔽層 13[Main component symbol description] 100 substrate 101 film layer 102 film layer 110 printing stencil m, 411 stencil body 112 inner surface 120, 420 shielding layer 121 shielding layer 140 blade 150 printing material 160 frame glue 170 first graphic opening 180, 184 Second graphic opening 182 ink hole 183 graphic 190 accommodating opening 220 320 first shielding layer 230, 330 second shielding layer 410 printing template 412 inner surface 420 template body 421 first shielding layer 13