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TW201142410A - Liquid crystal substrate bonding system - Google Patents

Liquid crystal substrate bonding system Download PDF

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Publication number
TW201142410A
TW201142410A TW100105238A TW100105238A TW201142410A TW 201142410 A TW201142410 A TW 201142410A TW 100105238 A TW100105238 A TW 100105238A TW 100105238 A TW100105238 A TW 100105238A TW 201142410 A TW201142410 A TW 201142410A
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TW
Taiwan
Prior art keywords
substrate
chamber
liquid crystal
bonding
vacuum
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Application number
TW100105238A
Other languages
Chinese (zh)
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TWI444703B (en
Inventor
Hisashi Ichimura
Takuya Kaizu
Yukinori Nakayama
Takeshi Ishida
Hiroaki Takeda
Original Assignee
Hitachi Plant Technologies Ltd
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Priority claimed from JP2010037597A external-priority patent/JP5495845B2/en
Priority claimed from JP2010078630A external-priority patent/JP5512349B2/en
Application filed by Hitachi Plant Technologies Ltd filed Critical Hitachi Plant Technologies Ltd
Publication of TW201142410A publication Critical patent/TW201142410A/en
Application granted granted Critical
Publication of TWI444703B publication Critical patent/TWI444703B/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1341—Filling or closing of cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202—LCD, i.e. liquid crystal displays
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1341—Filling or closing of cells
    • G02F1/13415—Drop filling process

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Liquid Crystal (AREA)

Abstract

There is provided a bonding system with a simple configuration structure, so as to construct a system for reducing the manufacturing time of liquid crystal panel and also suppressing the generation of dusts. To solve the problem, the system of the present invention includes: a first movement line (5) formed by a roller transmission belt for moving a lower substrate, a paste coater (7) for coating sealing agent on the first movement line (5), a coater (8) arranged at a downstream side of the paste coater (7) for forming a short-circuit electrode, a liquid crystal drip device (9) for dripping liquid crystal material, and a first inspection room (10) for inspecting the status of the lower substrate (1), that are arranged in a series connection manner; a second movement line (6) formed by a roller transmission belt for moving an upper substrate (2) in parallel with the first movement line (5); a substrate reversal device for arranging reversal substrates in a fan-shaped manner so as to reverse the upper substrate at the terminal part of the second movement line; and a third movement line (20) formed by a roller transmission belt connected to the first movement line (5) at a junction point of the first movement line (5) and the second movement line (6). On the third movement line (20), a transfer room (12), a substrate bonding room (15), an ultraviolet ray illuminating room (17), and a panel inspection room (18) are arranged in a series connection manner.

Description

201142410 六、發明說明： 【發明所屬之技術領域】 本發明係關於基板貼合系統，特別是關於謀求縮短直 到貼合結束爲止的時間’同時極力減少在系統中之利用機 械臂的基板的遞送之基板貼合系統。 【先前技術】 於液晶顯示面板之製造，有著預先於一方基板滴下液 晶’使設有透明電極或薄膜電晶體陣列之2枚玻璃基板具 有數A m程度之非常接近的間隔，而以設在基板周緣部的 黏接劑（以下也稱爲密封劑）貼合（以後，將貼合後之基 板稱爲液晶面板），於藉其形成的空間密封液晶的工程。 於此液晶之密封，例如有將液晶滴下至以不設注入口 的方式把密封劑描繪成封閉圖案的下基板上，於真空室內 使被形成TFT (薄膜電晶體；Thin Film Transistor)或彩 色濾光片等之上基板之TFT或彩色濾光片等被形成的面對 向配置，使上下基板接近而貼合等方法。爲了將基板搬入 /搬出此真空室而設有預備室，使真空室內成爲與預備室 相同的氛圍而進行基板的搬進搬出之技術已揭示於特開 2001 -305563號公報。又，於特開200 1 -305 5 63號公報，係 爲上基板與下基板係載置於搬送治具，由預備室往貼合室 搬送於輥輸送帶上而分別被收授至上工作台與下工作台的 構成。在此方式，於搬送治具搭載上下基板時’成爲以機 械手（robot hand )設置於搬送治具。此外，往工作台的 -5- 201142410 基板的收授，也是在把上基板保持於上工作台後，把下基 板由搬送治具抬起，使搬送治具退避至預備室後設置於下 工作台上的構成。 此外，於特開2003-0 1 5 1 0 1號公報，揭示著使下基板 由第1裝載室往間隔件散布裝置、密封材塗布裝置、液晶 注入裝置、第1預備整列裝置、組裝裝置搬送，而使上基 板由第2裝載室經第2預備整列室經預備室搬送至前述組裝 裝置，在組裝裝置貼合2枚基板後，經過密封材硬化裝置 、熱處理裝置、基板切斷裝置而將基板送至卸載裝置的系 統。 在前述特開200 1 -305563號公報，於液晶基板組裝系 統使基板於供貼合的貼合室進行基板的搬進搬出時，爲使 預備室與真空室內成爲相同氛圍，將貼合的2枚基板搬入 一方側之預備室內，結束2枚基板的貼合後由設於另一方 的預備室排出，所以裝置的配置很長而必須要有大的設置 面積。此外，必須要使分別之預備室及貼合室成爲真空狀 態，所以必須配置相應的裝置，而且抽真空至真空狀態爲 止的時間很長要縮短生產節拍有其限度。此外，對於與其 前步驟之關係並沒有任何記載。進而，於由預備室往貼合 室之上下基板的搬送使用搬送治具，所以會有往搬送治具 進行基板的收授等很花時間的課題。 此外，在特開2003 -0 1 5 1 0 1號公報，僅記載著以移動 手段使基板移動於各裝置間而已，使用甚麼樣的搬送手段 搬送基板，於各裝置收授之記載並沒有任何揭示。 -6- 201142410 然而’在把上基板搬送至貼合裝置的場合，亦有使 TFT或彩色濾光片形成面朝上使用輥輸送帶進行搬送的情 形。在此場合，搬入貼合裝置時，有必要使上基板反轉。 於特開平6-485 54號公報揭示著保持實裝電子零件的 基板’旋轉180度進行反轉的裝置。在此裝置係使保持基 板的框之中央部旋轉而進行反轉的構成。 此外’在特開2006-2271 8 1號公報，揭示著爲了照射 UV使基板間的密封劑硬化，反轉貼合後的面板，照射uV 光之用的反轉裝置。 在前述特開平6-48 5 54號公報，爲以框夾住基板予以 保持’使該框的中央部迴轉1 80度而使基板反轉的構造。 同樣在特開2006-227 1 8 1號公報，揭示著爲了在液晶 面板貼合後密封劑尙未硬化的狀態使其反轉，而在按壓兩 面板間的狀態進行反轉。在此反轉方法也與專利文獻〗同 樣，使用在空中使基板旋轉180度的方法。因此，以此方 法組裝面板之前（貼合前）的狀態使基板反轉的話，周圍 空氣會混亂，捲起落於搬送線等的粉塵，而該粉塵掉入液 晶面板內而成爲動作不良或品質降低的重要原因。 【發明內容】 本發明之目的在於提供爲了謀求系統全體的小型化， 極力減少根據機械手之基板收授處所，使往根據輥輸送帶 的搬送以及被搬送的基板之往被設於各個裝置的工作台上 的載置可以精度佳地進行，可以實現縮短位置對準的時間 201142410 或上下基板之往貼合室搬入所花費的時間之系統。進而， 本發明之其他目的，在於提供使上基板反轉時極力抑制粉 塵等的捲起之基板反轉裝置及使用彼之液晶面板貼合系統 〇 由搬送下基板的輥輸送帶或皮帶輸送帶所構成的第1 搬送線、對前述第1搬送線上塗佈密封劑之糊狀物塗佈機 、被配置於前述糊狀物塗佈機的下游側之短路用電極形成 用塗佈機、滴下液晶材之液晶滴下裝置、以及檢查下基板 的狀態之第1檢查室被串聯配置；於第1搬送線上倂列地形 成搬送上基板之輥輸送帶或皮帶輸送帶所構成的第2搬送 線，在前述第1搬送線與第2搬送線之合流點，設有被連接 於第1搬送線的輥輸送帶或皮帶輸送帶所構成的第3搬送線 ，於前述第3搬送線上被串聯地配置移載室、貼合裝置、 UV照射室及面板檢查室。 此外，於貼合室約略同時搬入上下基板的構成，在輥 輸送帶或皮帶輸送帶上於搬送中補正下基板之傾斜。 塗布供基板的貼合之密封劑的塗布裝置起使貼合裝置 或密封劑硬化裝置（UV照射裝置）等約略配置爲直列， 同時於下基板或完成貼合的液晶面板的搬送使用左右分別 驅動的方式之輥輸送帶進行搬送，可以在各裝置之前補正 基板的傾斜，而且於貼合裝置或貼合室可以同時地搬入上 下基板，所以可以大幅縮短液晶面板的製作時間，而且在 裝置之前進行基板的傾斜補正，可以提高塗布或貼合精度 -8- 201142410 進而此外，搬送上基板的輥輸送帶的終端部側的上基 板反轉裝置，係由使架台上朝上被搬送來的上基板在朝上 的狀態由輥輸送帶承接的具備複數之指部的活動梁（ Walking Beam)，及於指部具備複數真空吸附墊，活動梁 係於一端側之上下移動構件與另一端側之水平移動部所構 成，使設於架台上的移動用柱藉由前述上下移動構件上下 移動而水平移動部沿著線性導軌於水平方向上移動而反轉 基板的構成。 此外，使上基板於搬送板上保持朝上而搬送於輥輸送 帶上，在上基板反轉裝置上連結前述板之連結機構，與設 於構成上基板反轉裝置的反轉機構之迴轉腕的連結部，使 迴轉腕半迴轉而使搬送板與被保持於彼之上基板反轉的構 成。 藉由作成上述構成可以在反轉時使基板不描繪圓弧而 反轉180度，而採使基板之一端部爲垂直狀態，使另一端 部水平移動的動作之反轉，所以可使基板反轉時描繪的移 動軌跡的面積爲最小，因基板反轉而產生的空氣騷動的面 積變少，可極力抑制揚塵的發生。此外，可以抑制裝置的 大型化。亦即，於使用此基板反轉裝置的系統，可以防止 塵埃落下至其他裝置，使貼合的液晶面板的精度降低，可 謀求裝置的小型化。 【實施方式】 以下，根據圖面說明本發明之液晶面板組裝系統之一 -9- 201142410 實施例。 圖1係顯示根據本發明的液晶面板組裝系統之全體配 置之平面圖，1爲下基板，2爲上基板’ 3爲基板搬入機械 臂，4爲整列機構，5爲第1搬送線（主線），6爲第2搬送 線（側線），7爲糊狀物塗布機（密封劑分配器），8爲短 路用電極形成用塗布機，9爲液晶滴下裝置’ 10爲第1檢查 室，11爲基板反轉裝置，12爲移載室，13爲機械手，I4爲 前處理室，15爲基板貼合室（真空室），16爲後處理室， 1 7爲紫外線照射室，1 8爲第2檢查室（面板檢查室），1 9 爲貼合基板（液晶面板），20爲第3搬送線。 於該圖，設有搬送下基板1之第1搬送線（主線）5, 及搬送被形成TFT (薄膜電晶體：Thin Film Transistor) 等的上基板2之第2搬送線（側線）6。搬送被洗淨的上基 板2及下基板1的第1搬送線5及第2搬送線6，以輥輸送帶或 皮帶輸送帶構成。輥輸送帶或皮帶輸送帶，被配置爲對基 板移動方向分割爲左右方向，以可以分別以不同的驅動機 構來驅動控制的方式被構成。以下，說明以輥輸送帶來構 成。上下基板分別被搬送於輥輸送帶上。 第1搬送線5之前，設有把被洗淨的下基板1搬入此系 統的基板搬入機械臂3，與由基板搬入機械臂3使下基板1 整齊排列之用的整列機構4。下基板1由整列機構4遞送至 第1搬送線5，於第1搬送線5上，下基板1使貼合面朝上移 動於箭頭方向。於此第1搬送線5的途中，設有在下基板1 上將密封劑（黏接劑）塗布爲閉環狀之糊狀物塗布機（密 -10- 201142410 封劑分配器）7。與此糊狀物塗布機7排成直線，被配置有 將導電性糊點狀塗布的短路用電極形成用塗布機8。 進而，於此短路用電極形成用塗布機8的下游側，被 配置著在如前所述塗布的密封劑之環內使液晶滴下所要量 的液晶滴下裝置9。於此液晶滴下裝置9的下游側，被配置 著檢查被塗布的密封劑或滴下的液晶材等的狀態之第1檢 查室10。在第1檢查室10檢査的下基板1，藉由設於移載室 12的機械手13，遞送往設於前處理室14與第2檢查室18之 間的第3搬送線20。此第3搬送線20，也以輥輸送帶形成。 藉由此第3搬送線20，首先使下基板1被搬入基板搬入側的 前處理室14內。進而，以第2搬送線6搬送來的上基板2, 在基板反轉裝置U被表背反轉後，藉由設於移載室12的機 械手13，被搬入前處理室14內。關於此基板反轉裝置11將 於稍後詳述。 於圖6顯示說明由前處理室14將上下基板搬入基板貼 合室15進行貼合，於後處理室16搬出貼合的基板的狀態之 圖。 於前處理室14，也設有保持上基板2而搬入基板貼合 室（真空室）15的機械手62，及搬送下基板1的輥輸送帶 6 1。此外，於此前處理室1 4，設有使輥輸送帶6 1伸縮之輸 送帶伸縮機構60，係以打開設於前處理室14與基板貼合室 15之間的閘閥69時，可以藉由此輸送帶伸縮機構60’使輥 輸送帶61越過閘閥69而接續基板貼合室15的輥輸送帶66的 方式構成的。 -11 - 201142410 上下兩基板1、2被搬入前處理室14時，關閉設於前處 理室1 4的基板搬入側的入口之閘閥（未圖示），前處理室 14內，藉由未圖示的真空泵，排氣至特定的真空度（ 150Torr程度，以下稱之爲半真空）爲止。前處理室14內 成爲半真空狀態時，打開與基板貼合室1 5之間的閘閥69， 輥輸送帶61藉由輸送帶伸縮機構60伸往基板貼合室15側而 接續於基板貼合室15之輥輸送帶66。於此輥輸送帶61，66 上使下基板1被搬入基板貼合室15內，此外，藉由機械手 62，使上基板2被搬入基板貼合室15內。此時，基板貼合 室15內成爲半真空狀態。於此前處理室14，設有成爲接取 下基板1而搬送至基板貼合室15的下工作台65的第3搬送線 20之輥輸送帶61，與接取上基板2而遞送至基板貼合室15 的上工作台（加壓板）21之用的機械手62。又，基板貼合 室1 5之基板1、2的接取之細節於稍後敘述。 結束在基板貼合室15之兩基板1、2的遞送，於該上下 兩工作台21、65分別保持這些上下基板1、2時，由前處理 室14伸展的輥輸送帶61縮回前處理室14內，前述閘閥69被 關閉。其後，基板貼合室1 5內被排氣至高真空（約5 X 1 〇_3 T〇rr )。其後，進行上下兩基板1、2之位置對準同時使上 工作台2 1下降而實行上基板2之往下基板1的貼合。此貼合 結束時，基板貼合室1 5內回到半真空，基板貼合室1 5與後 處理室16之間的閘閥70被開放。此時，後處理室16成爲半 真空狀態。 於後處理室16，也設有輸送帶伸縮機構68，在與基板 -12- 201142410 貼合室15之間的閘閥70打開時，設於後處理室16的此輸送 帶伸縮機構68動作，輥輸送帶67由後處理室16伸展而接續 於基板貼合室15之輥輸送帶66。於後處理室16被搬入上下 基板1、2被貼合而成的貼合基板（亦即，液晶面板）19後 ，輥輸送帶縮回後處理室16內，後處理室16與基板貼合室 1 5之間的閘閥被關閉，使後處理室1 6內爲大氣狀態。後處 理室1 6內成爲大氣狀態時，後處理室1 6與紫外線照射室1 7 之間的閘閥（未圖示）被打開，藉由設於後處理室1 6的輸 送帶伸縮機構（未圖示），被接續於紫外線照射室17的輥 輸送帶。其後，在相關的輥輸送帶上使液晶面板19被搬入 紫外線照射室1 7內，在該處對密封劑照射紫外線使密封劑 硬化。密封劑的硬化結束時，液晶面板1 9被搬送於輥輸送 帶上，被運往第2檢查室（面板檢查室）18進行其檢查。 如此，使各處理室14〜18排列爲幾乎直線狀，一部分 使用機械手，但幾乎全體的基板搬送是使用輥輸送帶的構 成，所以可以使裝置的設置面積抑制於最小限度。 圖2係顯示在圖1之基板貼合室15內之上工作台的具體 例之槪略構成之圖，該圖（a)顯示黏接栓（黏接墊）方 式，該圖（b)顯示於上工作台面安裝黏接片的方式，21 爲上工作台，22爲黏接墊安裝板，23爲黏接栓（黏接墊） ’ 24爲黏接構件，25爲基底板，26爲彈性體，27爲按壓栓 安裝構件’ 28爲按壓栓，29爲彈性構件，30爲黏接片，又 ’對應於圖1的部分賦予同一符號而省略重複的說明。此 外’此處主要以採用黏接栓方式者來進行說明。 -13- 201142410 採用圖2(a)所示的黏接栓（黏接墊）方式之上工作 台21，於基底板25與彈性體26之層積體，設有被安裝於黏 接墊安裝板22的複數黏接栓23的構成，於這些黏接栓23的 先端部設有黏接構件24。亦即，藉由使用未圖示的驅動機 構使黏接墊安裝板22上下移動，使各黏接栓23的先端部由 上工作台21的下面（亦即，彈性體26的下面）突出，以黏 接保持上基板2的方式構成。進而，此黏接栓（以下，稱 爲黏接墊）23，成爲於其先端部設有黏接構件24,於其中 央部設有真空吸附用的真空吸附口（未圖示）的構成。使 用此黏接墊23由前述之機械手接收上基板2，拉抬至上工 作台21的下面直接在黏接墊23上保持上基板2。 此外，上工作台2 1，以可以藉由未圖示的工作台驅動 機構，而上下移動的方式構成。又，貼合結束而由這些黏 接墊23剝離貼合基板（液晶面板）1 9 (圖1 )時，在以工 作台驅動機構將上工作台21按壓於此貼合基板19的狀態， 由黏接墊23的中央部的真空吸附口將氣體吹噴於此貼合基 板19之面同時使黏接墊23由上工作台21的下面拉起，而可 以由貼合基板1 9剝下黏接構件24。 根據安裝圖2(b)所示的黏接片的方式之上工作台21 ，於上工作台21的基底板25之幾乎全面設黏接片30,進而 ，由上工作台21至黏接片30的貼附面（吸附面）爲止貫通 設複數之真空吸附口（未圖示），藉由使上工作台21降低 至以先前的機械手保持之上基板2的面附近，以根據此真 空吸附口之真空吸附使此上基板2吸起於吸附片3 0之黏接 -14- 201142410 面予以黏接保持的構成。一般而言，即使讓真空室內爲真 空狀態而設置真空吸附機構，也因爲真空吸附力變小而無 法發揮作用，但在此具體例，收取上基板2，直到保持此 上基板2爲止真空室（基板貼合室（圖1) ) 15內爲半真空 狀態，所以可以使真空吸附力作用。 又，黏接片30的黏接面，如圖所示，設有網目狀之凹 凸。進而，在此構成由上工作台21通過黏接片30使用複數 可以上下動的真空吸附墊，藉此使上基板2抬起至黏接片 30之黏接面的作法亦可。 此黏接片方式的場合’爲了在上下基板1、2之貼合結 束後，由黏接片3〇剝離上基板2，設有具備上下驅動的驅 動機構之按壓栓安裝構件27。於此按壓栓安裝構件27，設 有複數之按壓栓28。又，於按壓栓28的先端部，被設有彈 性構件29，即使將按壓栓28按壓於上基板2之面，也不會 在此上基板2的面上造成傷痕。藉由將此按壓栓28按壓於 上基板2同時使上工作台21上升，可以使上基板2由黏接片 3 0剝離。 又，預先設置對按壓栓28及彈性構件29的中央部吹噴 氣體用的氣體流路或者孔，在上基板2之面上按壓著按壓 栓28時，藉由對此面吹噴氣體，可以使上基板2容易由上 工作台21剝離。 回到圖1，於基板貼合室1 5，上下基板1、2貼合形成 的液晶面板1 9，如前所述，由上工作台2 1 (圖2 )剝離而 成爲載置下工作台65 (圖6)上的狀態，此液晶面板19由 -15- 201142410 此下工作台65遞送至輥輸送帶66上被搬送至後處理室16。 液晶面板被搬入後處理室16時，基板貼合室15與後處理室 16之間的閘閥70關閉，後處理室16內回到大氣狀態。 後處理室16內成爲大氣狀態時，液晶面板19被搬入紫 外線照射室1 7，在該處對密封劑照射UV光（紫外線）使 密封劑硬化。密封劑硬化的液晶面板1 9，被搬送至第2檢 查室（亦即，面板檢査室）18，在該處進行檢査。 以以上的系統構成製造液晶面板1 9，但在此實施型態 的液晶基板貼合系統，基板1、2的搬送線，大部分是藉由 輥輸送帶進行的，所以與從前之根據機械手的搬送比較， 上下基板1、2的位置對準的精度有降低之虞。因此，有必 要防止在搬送路上停止的場合發生之基板的位置偏離，使 在各處理裝置收授上下基板1、2時成爲沒有位置偏離的狀 態。因此，在此實施型態，於往各處理裝置遞送上下基板 1、2之前被配置著供進行位置對準之用的檢測感測器。 圖3係顯示在圖1之第1搬送線5之檢測感測器的配置與 其動作之一具體例之槪略構成圖，該圖（a)係基板（在 此，以下基板1爲例）以正常的姿勢搬送的狀態，該圖（b )顯示在基板旋轉的狀態被搬送的狀態，31a、31b爲輥， 32a、32b爲動力傳達軸，33a、33b爲驅動馬達，34a、34b 爲基板檢測感測器，對應於前出圖面的部份被賦予相同符 號而省略重複的說明。又，在其他的搬送線（第2〜第3 ) 當然也同樣能使基板的姿勢修正爲正常的狀態。 於該圖，分別的輥輸送帶，於其左右分別被配置輥 -16- 201142410 31a、31b，中介著動力傳達源32a、32b被連接於供驅動分 別的左右之輥31a、31b之用的驅動馬達33a、33b。驅動馬 達33a、33b的驅動力透過動力傳達源32a、32b被傳達至輥 31a、31b，藉此，輥31a、31b被旋轉驅動。藉由在這些輥 31a、31b上被載置下基板1的狀態使這些輥31a、31b旋轉 驅動，下基板1被搬送往箭頭方向。 相關的第1搬送線5，於對搬送方向的直角方向（左右 方向），被配置檢測下基板1的左右兩邊部的通過之基板 檢測感測器34a、34b。下基板1被搬送來漿狀物塗布機7 ( 圖1)之工作台（未圖示）之前時，藉由設在此第1搬送線 5的基板檢測感測器34a、34b檢測出此下基板1的左右兩邊 部。以在左右各側的基板檢測感測器34a、34b之中的任一 方檢測到下基板1的邊部時，使檢測到之側的驅動馬達3 3 a 或33b停止的方式，由未圖示的控制手段進行控制。基板 檢測感測器34a、34b同時檢測到下基板1之分別的邊部的 先端時，控制手段判定下基板1係以正確的狀態被搬送， 使驅動馬達33a、33b保持原狀旋轉驅動而搬送下基板1。 此處，如圖3(b)所示，下基板1由前進方向來看（ 以下，也相同）旋轉於反時針方向（傾斜）而被搬送（亦 即，下基板1的左邊部側比右邊部側更晚被搬送）的話， (由前進方向來看）被配置於左右側的基板檢測感測器 3 4a、3 4b無法同時檢測出下基板1，於其檢測會產生時間 差。下基板1以圖3 ( b )所示的方式傾斜的場合，右側的 基板檢測感測器34b最先檢測出下基板I，使驅動基板檢測 -17- 201142410 感測器34b側的輥輸送帶的驅動馬達33b停止。此時’未檢 測出下基板1的左邊部側的基板檢測感測器3 4a側的驅動馬 達33a繼續動作，輥31a繼續旋轉。因此’下基板1的左邊 側變成保持於移動狀態。如此般對於對搬送方向傾斜的狀 態下之下基板1，基板檢測感測器3 4b檢測到下基板1時， 驅動馬達33b停止。此時，另一方之驅動馬達33 a被旋轉驅 動，下基板1的左邊部側被搬送。以藉由此動作使下基板1 的左邊部側前進的方式使下基板1旋轉。藉由此旋轉動作 使下基板1的左邊部側成爲以基板檢測感測器34a檢測到的 狀態，下基板1的左邊部之先端成爲與右邊部的先端相同 的位置，補正了下基板1的傾斜。如此，下基板1的傾斜被 補正而基板檢測感測器34a、3 4b都成爲檢測出下基板1的 左右邊部的先端的狀態時，右側的驅動馬達33b被再起動 ，在傾斜被補正的狀態再度搬送下基板1。 又，關於此點更詳細說明的話，未圖示的控制手段， 觀察左右之基板檢測感測器34a、34b之檢測的計時差而檢 測出基板的旋轉（傾斜）狀態，同時使驅動馬達3 3 a、3 3 b 逆轉而再度使下基板1回到檢測前的特定位置。其後，再 度使兩驅動馬達3 3 a、3 3 b順方向地旋轉驅動使輥3 1 a、3 1 b 往搬送方向旋轉，使下基板1移動於箭頭的搬送方向。藉 此，藉由基板檢測感測器3 4 a、3 4b檢測出下基板1的左右 兩邊部的先端而可以確認傾斜消除了。在下基板1的傾斜 未被充分補正的場合，反覆相關的動作進行補正同時進行 驅動馬達3 3 a、3 3 b之停止處理求取檢測時間差。控制手段 -18- 201142410 判斷出檢測時間差在特定的範圍內的場合，認識爲下基板 1是在正常的搬送狀態下搬送，將下基板1搬送至糊狀物塗 布機7的塗布工作台之下，於該處停止。 糊狀物塗布機7的塗布工作台係可上下移動地被構成 ，成爲藉由使此塗布工作台上升，而由輥輸送帶上網此塗 布工作台上接取下基板1的構成。如此，於搬送線5的途中 的左右方向配置基板檢測感測器34a、34b，因應於這些基 板檢測感測器34a、3 4b的檢測結果使檢測出下基板1的邊 部的先端之側的驅動馬達停止，同時求出這些基板檢測感 測器34a、3 4b的檢測時間差，可以檢測出下基板1的傾斜 狀態。此外，直到基板檢測感測器34a、34b的檢測時間差 成爲特定範圍內爲止反覆下基板1的左右兩邊部的先端的 檢測，進行下基板1的傾斜的補正。藉此，沒有必要爲了 下基板1的傾斜的補正而另設工作台，進而也沒有必要設 機械手，可以抑制系統的大型化。又，針對相關的傾斜的 補正，係以下基板1爲例來說明，帶關於搬送於第2搬送線 6(圖1)上的上基板2也可以進行同樣的補正。 第1搬送線5的輥輸送帶，在整列機構4、糊狀物塗布 機7、短路用電極形成用塗布機8、液晶滴下裝置9、第1檢 查室10及移載裝置12之各裝置間被區分’在分別的區間內 實行與前述同樣的位置對準的控制。又’在前述之控制方 法，藉由逆轉驅動輥輸送帶直到回到特定位置爲止反覆下 基板1的左右邊部的先端部的檢測’而進行下基板1的傾斜 的補正，但是預先求出檢測時間之差與補正量的關係，記 -19- 201142410 憶該關係，而因應於檢測時間差，驅動控制一方側的驅動 馬達以進行補正的方式亦爲可能。如此，沒有必要爲了在 搬送線上進行下基板1的位置補正，而進行載置於工作台 上的下基板1的位置對準，可以縮短載置於工作台上時之 位置對準的時間，同時提高分別的工作台上的作業精度。 又，於前述之各裝置，設有供進行分別的處理之用的 工作台，於各工作台，爲了規定下基板1的停止位置，具 備基板定位機構。此基板定位機構，係以對基板搬送方向 ，於直角方向上規定下基板1的左右兩邊部側的進行之上 下移動的2根限制栓來構成的。下基板1在裝置內被搬送來 輥輸送帶上時，此限制栓係以停止下基板1的移動的方式 突出到比輥輸送帶更爲上方，停止此下基板1的前進之物 〇 此外，前述裝置之各工作台，係以可以藉由未圖示的 驅動機構而上下移動的方式構成，藉由輥輸送帶下基板1 被搬送來此工作台上停止輥輸送帶時，藉由使此工作台上 升’可以由輥輸送帶將下基板1接取到工作台面上。又， 設於工作台部的輥輸送帶設有上下移動機構，可以使輥輸 送帶移動至比工作台面更爲下方而遞送基板。 圖4係顯示圖1之根據本發明的基板反轉裝置Η與其基 板反轉方法之一實施例的構成圖，該圖（a)係顯示此一 例的全體構成之槪略構成圖，該圖（b)爲該圖（a)之活 動梁（Walking Beam)的構成圖，40爲架台，41爲移動用 柱，42爲活動梁，43爲水平移動部，44爲上下移動構件， -20- 201142410 45爲指部，46爲真空吸附墊。 於形成第2搬送線6的輥輸送帶上，使彩色濾光片形成 面朝上，載置上基板2而搬送至基板反轉裝置11。設於基 板反轉裝置11之反轉機構部的輥輸送帶，係以可以上下動 的方式構成。 於圖4(a)，於此基板反轉裝置11，具備在架台40上 對上基板2的搬送方向伸於直角（寬幅）方向的複數指部 45 (圖4(b))之活動梁42等所構成的反轉機構。 活動梁42，如圖4(b)所示，成爲於旋轉軸設有複數 指部45的構成，於這些指部45，吸附上基板2的複數真空 吸附墊46設爲比指部45的面還高上特定高度。於真空吸附 墊46，雖省略圖示，但被連接著來自供給負壓的負壓源之 配管。 此反轉機構，如圖4 ( a )所示，於活動梁42的指部45 ，藉由真空吸附墊46，吸附保持上基板2，抬起活動梁42 的一端側的上下移動構件44往垂直方向移動，成爲藉由使 另一端側的水平移動構件43於基板搬送方向上由架台40之 一方邊側往另一方邊側移動，而使上基板2上下反轉之構 成。 此處，活動梁42的指部45，設置於設在反轉機構部的 輥輸送帶之輥與輥間。在架台40之基板搬送方向之約略中 央部，且係上基板2之端部側，設有使活動梁42之一端側 的上下移動構件44上升下降之用的移動用柱41。於移動用 柱41的部分，設有使設於活動梁42的一端部側的上下移動 -21 - 201142410 構件44上下移動之用的驅動馬達（未圖示）。成爲藉由此 驅動馬達，上下移動構件44沿著移動用柱41移動於上下方 向的構成。此外，雖未圖示，但上下移動構件44以繩索連 接著平衡重（counter weight)，減低驅動馬達的驅動力 。於活動梁42的另一端側之水平移動構件43，以使容易移 動於線性導軌的方式具備滾動機構。 說明此例之基板反轉裝置1 1的動作。 首先，上基板2抵達基.板反轉裝置1 1上時，停止輥輸 送帶，使輥輸送帶移動往下方向。藉由使輥輸送帶下降， 於輥與輥間具備的活動梁42之指部45上被遞送上基板2。 被遞送至指部45上的上基板2，藉由設於指部45的真空吸 附墊46被真空吸附而保持。上基板2被吸附保持時，活動 梁42之一端側的上下移動構件44沿著移動用柱41上升，與 此同時，活動梁42之另一端側的水平移動構件43沿著線性 導軌移動於水平方向。接著，在上下移動構件44達到最高 點之前，水平移動構件43於水平方向以特定的速度移動而 可以通過移動用柱4 1的中心移動於其相反側。 又，於水平移動構件43設驅動用馬達，將其旋轉力提 供給水平移動構件43而驅動於水平方向的構成亦可。 活動梁42成爲垂直狀態時，使上下移動構件44的上升 變更控制爲下降方向。藉由使其進行以上的動作，可以使 上基板2上下反轉。 水平移動構件4 3移動於移動用柱4 1的相反側使活動梁 42成爲水平狀態，上基板2成爲上下反轉的狀態時，使此 -22- 201142410 基板反轉裝置11之次一移載室12的機械手13(圖1)伸至 偏離活動梁42的指部45的位置，以設於機械手側的指部之 真空吸附墊吸附保持上基板2。藉此，上基板2由基板反轉 裝置11的活動梁42遞送至移載室12的機械手13。 如此，在此基板反轉裝置11，使上基板2之一端側上 下移動，使另一端水平移動，所以上基板2以活動梁42的 上下移動構件44爲頂點，成爲以此頂點爲中心以接近約略 半扇形的形狀移動，與180度旋轉的場合相比移動面積變 小。因此，不會攪亂周圍的空氣，可以使塵埃的發生抑制 於最小限度，對於周圍的裝置之塵埃的影響也可以抑制於 最小限度。 又，在此例，係活動梁42的指部45之上起伸展機械手 的真空吸附墊而承接上基板2，但預先伸展設於活動梁42 的指部45的真空吸附墊46的足部，於上基板2與指部45之 間插入機械手1 3的指部，進行上基板2的遞送亦可，以這 樣的構成方式可提高作業效率。 圖5係顯示圖1之根據本發明的基板反轉裝置1丨與其基 板反轉方法之其他實施例的構成圖，該圖（a)係顯示此 其他例的全體構成之槪略構成圖，該圖（b)爲該圖（a) 之上基板搬送板的構成圖，50爲架台，51爲上基板搬送板 ’ 52爲迴轉腕，53爲驅動機構’ 54爲連結部，55爲棧，56 爲真空吸附墊，57爲連結機構。 於圖5 (a) ’在此基板反轉裝置11，係於架台50上設 置由搬送板51等所構成的使上基板2上下反轉的反轉機構 •23- 201142410 。此反轉機構，將上基板2載置於搬送板51上，藉由支撐 而旋轉搬送板51的中央部，使上基板2上下反轉。 以下，使用顯示上基板搬送板之一具體例之圖5(b) ，說明圖5 (a)之基板反轉裝置11的反轉機構。 在搬送板51之平行於上基板2的搬送方向的兩邊側的 中央部，以可以鉸接於反轉機構的連結部54的方式具備連 結機構57 (圖5 ( b ))。此外，搬送板5 1，如圖5 ( b )所 示，係以複數之棧55來形成，於此棧55的上部以可以插入 機械手的指部的方式設有特定長度的真空吸附墊56。 於此基板反轉裝置11，於其中央部設有板迴轉驅動機 構。在此板迴轉驅動機構，於在第1搬送線5的上基板2的 搬送方向的兩側設有迴轉腕52，於迴轉腕52的一端側（迴 轉中心側），設有使迴轉腕52迴轉之用的驅動機構53，於 迴轉腕52的先端部側，設有供連結於搬送板51的連結部54 〇 於第2搬送線6(圖1)，設有搬送板51，由基板搬入 機械臂3 (圖1)使上基板2以使彩色濾光片面朝上的方式 載於搬送板51而被搬送。此時，上基板2，以設於圖5(b )所示的搬送板51的棧55之真空吸附墊56來真空吸附。上 基板2於此第2搬送線6上與搬送板51—起’被運至基板反 轉裝置1 1。 搬送板51到達基板反轉裝置11上時’設於其反轉機構 的迴轉腕52的先端部之連結部54，藉由設於搬送板51的中 央部的連結機構57連結。迴轉腕52的先端的連結部54連結 -24- 201142410 於搬送板51的連結機構57時，迴轉腕52藉由驅動機構53旋 轉，使上基板2上下反轉。進而，迴轉腕52的連結部54被 構成爲可轉動，對迴轉腕52而言在與搬送板51之連結機構 5 7之間成爲可以轉動，伴隨著迴轉腕5 2之往箭頭A方向的 旋轉，使搬送板51往圖示的箭頭B、C方向旋轉。迴轉腕52 往箭頭A方向旋轉1 8 0度時，上基板2來到搬送板5 1的下側 上基板2，以由搬送板51的下部垂下的狀態，遞送至 移載室12的機械手13。亦即，機械手13的指部插入搬送板 51的真空吸附墊56之間，以設於機械手13的指部之真空吸 附墊保持上基板2，停止被設於搬送板51的棧55之真空吸 附墊56的真空吸附。其後，機械手由搬送板51部使上基板 2離開，將上基板2搬入前處理室14。搬送板51藉由基板反 轉裝置1 1的反轉機構再度迴轉，於設了真空吸附墊之側朝 上回到第2搬送線6，回到基板搬入機械臂3的位置。 如以上所述，於其他實施例，也是在基板反轉裝置1 1 ，使上基板2不是完全旋轉180度上下反轉，而是藉由一端 側移動於約略水平方向，另一端側移動於垂直方向，使上 基板2的基板反轉的移動儘可能抑制於最小的範圍，所以 可抑制伴隨著上基板2的反轉之塵埃發生以及揚起，可以 抑制塵埃對周圍裝置的影響。 圖6係顯示在圖1之基板貼合室15之從前處理室14的基 板搬入及往後處理室16之基板搬出動作之縱剖面圖，60爲 輸送帶伸縮機構，61爲輥輸送帶，62爲機械手，63爲指部 -25- 201142410 ，64爲吸附墊，69爲閘閥，65爲下工作台，66爲基板遞送 用之輥輸送帶，70爲閘閥，68爲輸送帶伸縮機構，67爲輥 輸送帶，對應於圖〗、圖2的部分賦予同一符號省略重複的 說明。 於該圖，在前處理室14(圖1)，於其下側，設有具 備伸縮的輸送帶伸縮機構60之輥輸送帶6 1，於其屋頂側， 設有機械手62。基板貼合室15與前處理室14之間設有閘閥 69，基板貼合室15內，通常，被保持於特定的真空度。又 ，於基板貼合室1 5與後處理室1 6 (圖1 )之間，也設有閘 閥70。基板貼合室15，如圖所示，成爲真空室，於其中設 有保持下基板1的下工作台65與保持上基板2的上工作台21 〇 於前處理室14的輥輸送帶61 ’設有輸送帶伸縮機構60 ，係以基板貼合室15與前處理室Η之間的閘閥69打開時’ 藉由輸送帶伸縮機構60’前處理室14之輥輸送帶61伸展而 被接續於基板貼合室15的輥輸送帶’下基板1可以搬入下 工作台65上的方式構成。於基板貼合時’藉由未圖示的驅 動機構，使上工作台21移動至下工作台65側進行下基板1 與上基板2的貼合。 於設在前處理室14的機械手62的指部63 ’設有複數之 吸附墊6 4。此外，如先前所說明的’於基板貼合室1 5之上 工作台2 1側’也如圖2 ( a )所示’設有複數可自由伸縮的 黏接墊（黏接栓）23，可以使上工作台21側的黏接墊23下 降至機械手62的指部63之間而黏接保持上基板2 °於這些 -26- 201142410 吸附墊64及黏接墊23的中心部，設有供給負壓的供給口（ 未圖示），藉由對此供給口供給負壓，而吸附上基板2» 又，關於負壓源或供給配管在圖示中省略。此外，吸附墊 64,僅設有此根據負壓之保持機構，沒有設置黏接保持的 機構。 如前所述，遞送上基板2時，以可以藉負壓吸附的方 式，使前處理室14及基板貼合室15內爲半真空狀態，對各 吸附墊64、各黏接墊23供給的負壓係比其真空度更高。 上基板2之由前處理室14往基板貼合室15遞送時，在 機械手62側的吸附墊64與上工作台21側的吸附墊23之雙方 保持上基板2後，停止機械手62側的吸附墊64的負壓供給 ，使機械手62及伸展的輥輸送帶61退避至前處理室14。其 後，上基板2以黏接墊23抬起至上工作台21之面，且以這 些之複數的黏接墊23予以保持的方式構成。亦即，即使提 高真空度，也可以藉黏接力保持上基板2，不會落下。 下基板1與上基板2之貼合結束後，藉由在將上工作台 21按壓於上基板2的狀態把黏接墊23抬起至比此上工作台 21之面更爲上側，可以由上基板2之面剝下黏接墊23。又 ，此時，藉由從設於黏接墊23的中央部的負壓供給口吹噴 正壓之氣體，可以容易剝下黏接墊23。 又，於下工作台65，設未圖示的黏接片（黏接構件） 與複數之負壓供給口，以下基板1不移動的方式予以保持 。由下基板1拉剝開此黏接構件的場合，下工作台65不移 動，而由設在黏接片的中央部的負壓供給口供給壓縮氣體 -27- 201142410 進行剝離。此外，於負壓供給口的中央部預設上下栓，藉 由以此上下栓壓起下基板1，可以由下基板1剝離黏接構件 〇 設於前處理室14的輥輸送帶61，爲可以藉由伸縮機構 60，伸縮至基板貼合室15側的構造，前處理室14與基板貼 合室1 5之間的閘閥69關閉時，被縮至前處理室1 4側，閘閥 69打開而將下基板1搬送往基板貼合室1 5內時，伸至基板 貼合室15側，對接於設在基板貼合室15的基板遞送用之輥 輸送帶66，以下基板1平順地遞送至基板貼合室15的下工 作台65的方式構成。下工作台65設於作爲承接輸送帶的左 右之輥輸送帶66之間，以可上下移動的方式設驅動機構。 此外，於後處理室16，藉由設於該處的輸送帶伸縮機 構68，設有可伸縮至基板貼合室15側的輥輸送帶67，下基 板1與上基板2之貼合結束而打開後處理室16與基板貼合室 15之間的閘閥70時，輥輸送帶67伸至基板貼合室15側接續 於基板遞送用的輥輸送帶66，由此輥輸送帶66透過輥輸送 帶67，由基板貼合室1 5搬出藉由基板貼合而形成的液晶面 板19，搬送至後處理室16。 又，在此，往基板貼合室15之上下基板1、2的搬入與 往上下工作台21、65之載置保持可以幾乎同時地進行，藉 此，可以大幅縮短液晶面板的組裝時間。 如前所述，上下基板1、2分別由前處理室14保持於基 板貼合室15的上工作台21、下工作台65時，閘閥69關閉。 又，於基板貼合室15與後處理室16之間的閘閥70原爲關閉 •28- 201142410 的狀態。閘閥69關閉時，使基板貼合室1 5內由半真空狀態 抽真空成高真空狀態而進行上下基板1、2的貼合。雖未圖 示，但在基板貼合室15的室外，設有使上工作台21上下移 動的驅動機構或使黏接墊23上下移動的驅動機構，設於這 些驅動機構的傳動軸連接於上工作台21或黏接墊23，藉由 使相關的驅動機構動作而使黏接墊23或上工作台21上下地 移動，進行上下基板1、2之貼合。此貼合時，使上工作台 21往下工作台65側移動。 上下基板1、2之貼合結束時，如先前所述，使基板貼 合室15內爲半真空狀態，使預先爲半真空狀態的後處理室 1 6爲高真空狀態。基板貼合室1 5內成爲半真空狀態時，閘 閥7 0打開，輥輸送帶67由後處理室16伸展置基板貼合室15 內而基板遞送用之輥輸送帶66上的上下基板1、2被貼合， 成爲液晶面板19之製作物被搬出至後處理室16»液晶面板 19被搬入後處理室16時，閘閥70關閉，後處理室16內回到 大氣狀態。藉由後處理室1 6內回到大氣，液晶面板1 9全體 被均勻地施加大氣壓，上下基板1、2間的間隔成爲正規的 間隔。而後，於圖1，藉由構成第3搬送線20的輥輸送帶， 使液晶面板1 9被搬送至紫外線照射室1 7。在該處，藉由對 密封劑紫外線照射而使密封劑硬化。密封劑的硬化結束後 ，藉由同一輥輸送帶，使液晶面板19被送至面板檢查室18 ，檢查其狀態而被送至未圖示的次一步驟。 其次，說明根據本發明的液晶基板貼合室之第2實施 例。 -29 - 201142410 先前的第1實施例，因爲使基板貼合室15內的狀態反 覆於半真空狀態與高真空狀態，所以於其前後設前處理室 14與後處理室1 6，藉由於該側分別設閘閥69、70進行開閉 ，而進行上下基板1、2之收取以及貼合後的液晶面板1 9的 送出之構成。如此，藉由反覆半真空狀態與高真空狀態， 可以謀求縮短使基板貼合室1 5內成爲真空狀態的時間，同 時可以防止基板貼合室15內的清淨度降低。 在接下來說明的第2實施例，係成爲與圖1所示的構成 同樣的構成，但省略前處理室14與後處理室16，係由移載 室12直接往基板貼合室15搬入上下基板1、2，此外，把在 基板貼合室1 5形成的液晶面板1 9直接搬出至紫外線照射室 17的構成。 圖7係顯示在相關的第2實施例之基板貼合室15的部分 之槪略構成圖，15’爲基板貼合裝置，76爲上真空室，77 爲下真空室，78爲上工作台，78a爲基底板，78b爲黏接構 件，79爲下工作台，79a爲基底板，79b爲彈性體，80爲橫 壓機構，81爲驅動馬達，82爲滾珠螺桿，83爲線性導軌， 84爲支撐柱，85爲密封環，86爲柱狀構件，87爲密封構件 ，88爲下工作台支撐柱，89爲密封構件，90a、90b爲真空 排氣管，91爲上框，92爲上下驅動部，93爲架台，94爲接 頭機構，對應於前出圖面的部份被賦予同一符號而省略重 複的說明。 於該圖，在此第2實施例，相當於圖1的基板貼合室i 8 的基板貼合裝置18’，成爲形成其之真空室被分割爲上真 -30- 201142410 空室76與下真空室77之2分割構造’由移載室12(圖1)使 上基板2被搬入上真空室76內的上工作台78，下基板1被搬 入下真空室77的下工作台79，此外，這些上下基板1、2被 貼合而成的液晶面板1 9 (圖1 )被搬出至紫外線照射室1 7 (圖1)。又，於此第2實施型態’雖未圖示，但也是於移 載室12及紫外線照射室17設置供伸縮搬送上下基板1、2或 液晶面板1 9之用的輥輸送帶的伸縮機構。 下真空室77爲幾乎被固定於架台93側的支撐柱84a、 8 4b的狀態，於下真空室77內設有基板遞送用的輥輸送帶 (未圖示），以可於此輥輸送帶間上下移動的方式設有下 工作台79。此下工作台79的上下移動範圍只要是可以移動 至承接前述輥輸送帶上的下基板1，不與輥輸送帶接觸的 位置即可。下工作台79成爲於基底板79a設彈性體79b的構 成，此彈性體79b的部分接於被搬入的下基板1。 下工作台79設於下真空室77內，藉由設於架台93上的 上下驅動部92之複數下工作台支撐柱88來支撐。下工作台 支撐柱88與下真空室77之間，設有密封構件89，藉由上真 空室76與下真空室77形成的真空室內抽真空時，使空氣不 能進入。 此外，在此第2實施型態，設有使下工作台79移動於 水平方向而進行上基板2與下基板1之位置對準之用的橫壓 機構80。 上工作台78’成於於基底板78a設黏接構件78b的構成 ，與先前說明的第1實施型態同樣，具備複數可上下動之 -31 - 201142410 真空吸附墊（未圖示），於移載室12(圖1)之機械手13 (圖1 )使以該真空吸附墊保持得上基板2以設於上工作台 78的真空吸附墊承接，抬高至上工作台78的基板保持面。 於上工作台78之面，被配置著複數之真空吸附口（未圖示 )與黏接構件7 8b，以這些來真空吸附藉由上工作台7 8側 的真空吸附墊抬高的上基板2，同時最終成爲黏接保持。 上工作台7 8之此真空吸附墊，在基板1、2之貼合後， 用於剝離被黏接保持於上工作台78之面的液晶面板19的上 基板2。亦即，基板1、2的貼合結束後，把上工作台78由 貼合基板（液晶面板）1 9之面剝離時，藉由在以真空吸附 墊按壓貼合基板19之面的狀態使上工作台78上升，可以由 上工作台78之面剝離液晶面板1 9之上基板2。此時，藉由 從設於上工作台78之面的真空吸附口對液晶面板19之面吹 噴氣體，可以容易剝離此液晶面板〗9的上基板2。 上真空室76，透過接頭機構（未圖示）被連接於上框 91，上工作台78以複數之柱狀構件86接續於上框91。柱狀 構件86與上真空室76之間，設有密封構件87，藉由上真空 室76與下真空室77形成的真空室內抽真空時，使空氣不能 進入此真空室內。 上真空室76與上工作台78，藉由爲了使上框91上下驅 動之用而設在裝置4角落的驅動馬達81與滾珠螺桿82與線 性導軌83所構成的上框上下驅動機構而上下移動。於上真 空室76與下真空室77之接續部，設有以橡膠形成的密封環 85。上真空室76與下真空室77合體而形成真空室時，藉由 -32- 201142410 此密封環85保持此真空室內的氣密性。 又，下基板1的傾斜之補正’與先前的第1實施型態同 樣，如在圖3所說明的’係使用配置於輥輸送帶的特定位 置之檢測出基板通過的感測器的檢測値來進行。在基板貼 合裝置15’，上基板2與下基板1約略同時被搬入’約略同 時遞送至上工作台78與下工作台79。此時，上真空室76與 下真空室77是離開的，成爲大氣狀態。 如先前所說明的，上基板2 ’如圖6所說明般地進行處 理，使用設於上真空是76側的上工作台78的真空吸附墊’ 由移載室12(圖1)之機械手13 (圖1)來承接，使用真空 吸附與黏接保持機構保持於上工作台78。下基板1，以設 於下真空室77側的如圖6所示的承接用的輥輸送帶66承接 於下工作台上，使下工作台79上升而把下基板1載置於下 工作台79上。被載置於下工作台79的下基板1，使用設於 下工作台79的複數之真空吸附口來真空吸附，同時藉由被 配置複數之黏接構件被黏接保持著。又，於下工作台79, 爲了上基板2與下基板1之位置對準，設有可於水平方向移 動的工作台驅動機構。此移動量，如前所述，預先在搬送 線之輥輸送帶上補正基板1、2的傾斜等，所以可以使其爲 微小’可以以相關的微小移動進行基板1、2間的位置對準 〇 上下基板1、2被保持於上工作台78與下工作台79時， 使上真空室76下降至下真空室77側而使這些上真空室76與 下真空室77合體，形成真空室。形成真空室時，雖未詳細 -33- 201142410 圖示，但連接上框91與上真空室76的接頭機構94脫離，藉 由上框上下驅動機構而僅使上工作台78上下移動。 如此進行，形成真空室時，由分別設於上真空室7 6側 與下真空室77側的真空排氣管90a、90b排出真空室內的氣 體而形成爲高真空狀態（約5xl(T3T〇rr )。在此狀態，藉 由攝影機（未圖示）觀測設於上基板2與下基板1之位置對 準標記而求出這些上下基板1、2間的位置偏移量，使下工 作台79驅動於水平方向進行位置對準。於位置對準結束時 ，藉由上框上下驅動機構，使上工作台78移動至下工作台 79側進行上下基板1、2的貼合。藉此，形成液晶面板1 9 ( 圖1)。此時之貼合按壓力，藉由設在驅動上工作台78的 驅動軸之壓力感測器來側量而按壓至預先設定的壓力爲止 〇 上下基板1、2之貼合結束時，使上工作台78上升而剝 下黏接保持著的液晶面板1 9。在剝下此黏接保持著的液晶 面板19的場合，如先前所說明的，藉由以基板承接用的真 空吸附墊按壓液晶面板19的基板面同時使上工作台78上升 ，可以剝下此黏接著的液晶面板1 9。真空吸附墊貼附於液 晶面板1 9的基板面的場合，藉由替代供給負壓而供給正壓 的氣體，可以簡單地剝離。又，由上工作台78剝離被黏接 保持著的液晶面板19時，藉由從設於上工作台78之面的真 空吸附口供給正壓的氣體，可以縮短剝下此黏接構件，亦 即液晶面板19的上基板2之時間。 上下基板1、2之貼合後’結束把上工作台7 8由液晶面 -34- 201142410 板1 9之上基板2剝離後，使下基板1側的黏接構件，亦即’ 使液晶面板1 9的下基板1由下工作台79剝離。在此場合’ 藉由使設於下工作台79側的複數基板支撐栓上升至比下工 作台79之面更高而使下工作台79移動至比輥輸送帶更爲下 方，可以把液晶面板1 9之下基板1側由保持此之下工作台 49之面剝離。結束由下工作台79剝離液晶面板19時，藉由 使基板支撐栓下降至比下工作台79之面更爲下方，使此液 晶面板19如圖6所示遞送於基板遞送用之輥輸送帶66上。 於此輥輸送帶66上遞送液晶面板時，於真空室內導入大氣 。真空室內成爲與大氣壓相同的狀態時，上真空室76藉由 真空室上下驅動機構往上升，上真空室76由下真空室77分 離，輥輸送帶由紫外線照射室1 7 (圖1 )延伸而與基板貼 合室15’內的基板遞送用的輥輸送帶66接續。其次，液晶 面板1 9被送至紫外線照射室1 7，於該處對密封劑照射紫外 線使密封劑硬化。密封劑的硬化結束時，藉由輥輸送帶， 送往第2檢查裝置之面板檢查室18進行檢查。 如以上所述，在此第2實施型態，於基板貼合裝置1 5 ’ 使上下基板1、2幾乎同時搬入而保持於上工作台78與下工 作台79，所以與從前使上、下基板1、2分別搬入的場合相 比，可以縮短基板貼合所需要的時間。 此外，使進行基板的貼合之前的步驟之各處理室的配 置成約略直線狀，爲在上下基板1、2的搬送使用輥輸送帶 的構成，所以在各處理裝置之工作台的構成可爲約略相同 ，可縮小裝置的設置面積，而且可縮短生產週期。 -35- 201142410 進而，於極不願意發生塵埃的基板反轉裝置，藉由使 成爲極力抑制基板的移動範圍之反轉機構，可以抑制塵埃 對系統全體的影響。 【圖式簡單說明】 圖1係顯示根據本發明的液晶基板貼合系統的全體配 置之平面圖。 圖2係圖1之基板貼合室內的上工作台之具體例之槪略 構成圖。 圖3係顯示在圖1之第1搬送線的檢測感測器的配置及 其動作之一具體例之槪略構成圖。 圖4係顯示圖1之根據本發明的基板反轉裝置的構成之 一例之構成圖。 圖5係顯示圖1之根據本發明的基板反轉裝置的構成之 其他例之構成圖。 圖6係在圖1之基板貼合室之由前處理室的基板搬入以 及朝向後處理室的基板搬出動作之縱剖面圖。 圖7係顯示根據本發明之液晶基板貼合系統的基板貼 合室之其他例的槪略構成圖。 【主要元件符號說明】 1 :下基板 2 :上基板 3 :基板搬入機械臂 -36- 201142410 4 :整列機構 5 z第1搬送線（主線） 6 :第2搬送線（側線） 7 :糊狀物塗佈機（密封劑分配器） 8:短路用電極形成用塗佈機 9 =液晶滴下裝置 1 〇 :第1檢查室 1 1 :基板反轉裝置 12 :移載室 1 3 ：機械手(robot hand) 1 4 :前處理室 15:基板貼合室（真空室） 1 6 :後處理室 1 7 :紫外線照射室 18:第2檢查室（面板檢查室） 1 9 :貼合基板（液晶面板） 2 0 :第3搬送線 -37-201142410 VI. OBJECTS OF THE INVENTION: TECHNICAL FIELD The present invention relates to a substrate bonding system, particularly to shortening the time until the end of bonding, while minimizing the delivery of substrates using robotic arms in the system. Substrate bonding system. [Prior Art] In the manufacture of a liquid crystal display panel, liquid crystal is dropped on one substrate in advance, and two glass substrates provided with a transparent electrode or a thin film transistor array have a very close interval of several mA, and are provided on the substrate. The bonding agent (hereinafter also referred to as a sealing agent) of the peripheral portion is bonded (hereinafter, the bonded substrate is referred to as a liquid crystal panel), and the liquid crystal is sealed in the space formed by the bonding. In the liquid crystal sealing, for example, a liquid crystal is dropped onto a lower substrate in which a sealant is drawn in a closed pattern so as not to have an injection port, and a TFT (Thin Film Transistor) or a color filter is formed in a vacuum chamber. A method in which a TFT or a color filter of a substrate such as a light sheet is formed to face each other, and the upper and lower substrates are brought close to each other and bonded. In order to carry out the loading and unloading of the substrate into the vacuum chamber, a pre-chamber is provided, and the vacuum chamber is placed in the same atmosphere as the pre-chamber to carry out the loading and unloading of the substrate, and is disclosed in Japanese Laid-Open Patent Publication No. 2001-305563. In the above-mentioned publication, the upper substrate and the lower substrate are placed on the transport jig, and are transported to the roll conveyor by the preliminary chamber to the bonding chamber, and are respectively transferred to the upper table. With the composition of the lower workbench. In this manner, when the upper and lower substrates are mounted on the transport jig, the robot is placed on the transport jig by a robot hand. In addition, the transfer of the -5-201142410 substrate to the workbench is also carried out after the upper substrate is held on the upper workbench, and the lower substrate is lifted by the transport jig, so that the transport jig is retracted to the preparatory room and then placed under work. The composition of the stage. Japanese Patent Publication No. 2003-0 1 5 1 0 discloses that the lower substrate is transported from the first loading chamber to the spacer spreading device, the sealing material coating device, the liquid crystal injection device, the first preliminary alignment device, and the assembly device. The upper substrate is transferred from the second loading chamber to the assembly device through the preliminary chamber through the second preliminary alignment chamber, and after bonding the two substrates to the assembly device, the sealing material curing device, the heat treatment device, and the substrate cutting device are passed through. The substrate is sent to the system of the unloading device. In the liquid crystal substrate assembly system, when the substrate is loaded and unloaded in the bonding chamber to be bonded to the liquid crystal substrate assembly system, the bonding chamber and the vacuum chamber have the same atmosphere, and the bonding is performed. When the substrates are placed in one of the preparation chambers, the two substrates are bonded together and then discharged from the other preliminary chamber. Therefore, the arrangement of the devices is long and a large installation area is required. In addition, it is necessary to make the respective preparation chambers and the bonding chambers in a vacuum state, so that it is necessary to arrange the corresponding devices, and it takes a long time to evacuate the vacuum to a vacuum state, and there is a limit to shorten the production cycle. In addition, there is no record of the relationship with its previous steps. Further, since the jig is transported by the transfer from the preliminary chamber to the upper and lower substrates, it is a problem that it takes time to transport the jig to the transfer jig. In Japanese Patent Laid-Open Publication No. 2003-0 1 5 1 0, only the movement of the substrate between the devices is described, and the substrate is transported by any means of transport, and the description of each device is not included. reveal. -6- 201142410 However, when the upper substrate is transferred to the bonding apparatus, the TFT or the color filter is formed to face up using a roller conveyor. In this case, when the bonding device is carried in, it is necessary to invert the upper substrate. Japanese Laid-Open Patent Publication No. Hei 6-485-54 discloses a device for reversing the substrate of a mounted electronic component by 180 degrees. In this device, the central portion of the frame holding the substrate is rotated to reverse the configuration. In addition, Japanese Laid-Open Patent Publication No. 2006-2271-8 discloses an inverting device for irradiating uV light in order to cure the sealant between the substrates by irradiation with UV, and to reverse the bonded panel. Japanese Laid-Open Patent Publication No. Hei 6-48 5 54 discloses a structure in which a substrate is held by a frame, and a central portion of the frame is rotated by 180 degrees to reverse the substrate. In the same manner as in the state in which the sealant is not cured after the liquid crystal panel is bonded, the state in which the sealant is not hardened is reversed, and the state between the two panels is reversed. The inversion method is also the same as the patent document, and a method of rotating the substrate by 180 degrees in the air is used. Therefore, if the substrate is reversed before the panel is assembled by this method (before bonding), the surrounding air may be disordered, and the dust may be caught on the transport line or the like, and the dust may fall into the liquid crystal panel to cause malfunction or deterioration in quality. The important reason. SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate for a robot to be transported to a substrate, and to transport the substrate to and from the roller conveyor to each device. The placement on the stage can be performed with high precision, and the system can be shortened by the time of the alignment of 201142410 or the time taken for the upper and lower substrates to move into the bonding chamber. Further, another object of the present invention is to provide a substrate reversing device that suppresses the winding up of dust or the like when the upper substrate is reversed, and a roller conveyor belt or a belt conveyor belt that transports the lower substrate using the liquid crystal panel bonding system. a first transfer line, a paste coater that applies a sealant to the first transfer line, a coating machine for forming a short-circuit electrode that is disposed on the downstream side of the paste coater, and a drip The liquid crystal dropping device of the liquid crystal material and the first inspection chamber in which the state of the lower substrate is inspected are arranged in series, and the second conveying line formed by the roller conveyor belt or the belt conveyor that conveys the upper substrate is formed in the first conveying line. A third transport line including a roller conveyor belt or a belt conveyor connected to the first transport line is provided at a junction of the first transport line and the second transport line, and is arranged in series on the third transport line. Transfer chamber, laminating device, UV irradiation chamber and panel inspection room. Further, the configuration in which the upper and lower substrates are carried in at the same time in the bonding chamber is performed, and the inclination of the lower substrate is corrected on the roller conveyor belt or the belt conveyor during conveyance. The coating device for applying the sealing agent to which the substrate is bonded is disposed such that the bonding device or the sealant curing device (UV irradiation device) is arranged in an in-line manner, and is driven separately for the transfer of the lower substrate or the completed liquid crystal panel. The roller conveyor belt is transported, and the inclination of the substrate can be corrected before each device, and the upper and lower substrates can be simultaneously loaded in the bonding device or the bonding chamber, so that the production time of the liquid crystal panel can be greatly shortened, and the device can be performed before the device. The slanting correction of the substrate can improve the coating or bonding accuracy -8-201142410. Further, the upper substrate reversing device on the end portion side of the roller conveyor that transports the upper substrate is the upper substrate that is transported upward from the gantry. In the upward state, a walking beam with a plurality of fingers is supported by a roller conveyor belt, and a plurality of vacuum suction pads are provided on the finger portion, and the movable beam is attached to the upper and lower sides of the movable member and the other end side. The moving portion is configured such that the moving column provided on the gantry moves horizontally by the vertical moving member A linear guide in the horizontal direction of the substrate is reversed configuration. Further, the upper substrate is transported to the roller conveyor belt while being held upward on the conveyance plate, and the connection mechanism of the plate is coupled to the upper substrate reversing device and the rotary wrist of the reversing mechanism provided to the upper substrate reversing device. The connecting portion is configured such that the turning arm is half-turned to reverse the transfer plate and the substrate held thereon. According to the above configuration, the substrate can be reversed by 180 degrees without drawing an arc at the time of reversal, and the end of one of the substrates can be made vertical, and the other end can be reversed horizontally, so that the substrate can be reversed. The area of the movement trajectory drawn at the time of turning is the smallest, and the area of the air turbulence caused by the reverse rotation of the substrate is reduced, and the occurrence of dust can be suppressed as much as possible. In addition, it is possible to suppress an increase in size of the device. In other words, in the system using the substrate inverting device, dust can be prevented from falling to other devices, and the accuracy of the bonded liquid crystal panel can be lowered, and the size of the device can be reduced. [Embodiment] Hereinafter, an embodiment of a liquid crystal panel assembly system of the present invention -9-201142410 will be described based on the drawings. 1 is a plan view showing the entire arrangement of a liquid crystal panel assembly system according to the present invention, wherein 1 is a lower substrate, 2 is an upper substrate '3 is a substrate loading robot, 4 is an alignment mechanism, and 5 is a first conveying line (main line), 6 is a second transfer line (side line), 7 is a paste coater (sealant dispenser), 8 is a short-circuit electrode forming coater, 9 is a liquid crystal dropping device '10 is a first inspection chamber, and 11 is a substrate. Inverting device, 12 is a transfer chamber, 13 is a robot, I4 is a pre-treatment chamber, 15 is a substrate bonding chamber (vacuum chamber), 16 is a post-processing chamber, 17 is an ultraviolet irradiation chamber, and 18 is the second In the inspection room (panel inspection room), 1 9 is a bonded substrate (liquid crystal panel), and 20 is a third transfer line. In the figure, a first transport line (main line) 5 for transporting the lower substrate 1 and a second transport line (side line) 6 for transporting the upper substrate 2 such as a TFT (Thin Film Transistor) are provided. The first transfer line 5 and the second transfer line 6 for transporting the washed upper substrate 2 and the lower substrate 1 are constituted by a roll belt or a belt conveyor. The roller conveyor belt or the belt conveyor belt is configured to be divided into left and right directions in the direction in which the substrate is moved, so as to be configured to be driven and controlled by different driving mechanisms, respectively. Hereinafter, the description will be made of a roller conveyor belt. The upper and lower substrates are respectively conveyed on the roller conveyor. Before the first transfer line 5, the substrate loading robot 3 for carrying the cleaned lower substrate 1 into the system is provided, and the alignment mechanism 4 for arranging the lower substrate 1 in alignment with the substrate carrying robot 3 is provided. The lower substrate 1 is transported to the first transport line 5 by the alignment mechanism 4, and the lower substrate 1 moves the bonding surface upward in the direction of the arrow in the first transport line 5. In the middle of the first transfer line 5, a paste coater (tight -10-201142410 sealant dispenser) 7 which applies a sealant (adhesive) to the lower substrate 1 in a closed loop shape is provided. The paste coater 7 is arranged in a line, and a short-circuit electrode forming coater 8 for applying a conductive paste is disposed. Further, on the downstream side of the short-circuit electrode forming coater 8, a liquid crystal dropping device 9 for dropping a liquid crystal in a ring of a sealant applied as described above is disposed. On the downstream side of the liquid crystal dropping device 9, the first inspection chamber 10 in which the applied sealant or the dropped liquid crystal material or the like is inspected is disposed. The lower substrate 1 inspected in the first inspection chamber 10 is delivered to the third conveyance line 20 provided between the pretreatment chamber 14 and the second inspection chamber 18 by the robot 13 provided in the transfer chamber 12. This third conveyance line 20 is also formed by a roll conveyor. By the third transfer line 20, the lower substrate 1 is first carried into the pretreatment chamber 14 on the substrate transfer side. Further, the upper substrate 2 conveyed by the second conveyance line 6 is moved back into the pretreatment chamber 14 by the robot 13 provided in the transfer chamber 12 after the substrate reversing device U is reversed. This substrate inverting device 11 will be described in detail later. Fig. 6 is a view showing a state in which the upper and lower substrates are carried into the substrate bonding chamber 15 by the pretreatment chamber 14, and the bonded substrates are carried out in the post-processing chamber 16. In the pretreatment chamber 14, a robot hand 62 that holds the upper substrate 2 and carries the substrate bonding chamber (vacuum chamber) 15 and a roller conveyor belt 6 that transports the lower substrate 1 are also provided. Further, in the previous processing chamber 14, a conveyor belt telescopic mechanism 60 for expanding and contracting the roller conveyor belt 61 is provided, and when the gate valve 69 provided between the pretreatment chamber 14 and the substrate bonding chamber 15 is opened, This belt stretching mechanism 60' is configured such that the roller conveyor belt 61 passes over the gate valve 69 and continues the roller conveyor belt 66 of the substrate bonding chamber 15. -11 - 201142410 When the upper and lower substrates 1 and 2 are carried into the pretreatment chamber 14, the gate valve (not shown) provided at the inlet of the substrate loading side of the pretreatment chamber 14 is closed, and the inside of the pretreatment chamber 14 is not shown. The vacuum pump shown is vented to a specific degree of vacuum (about 150 Torr, hereinafter referred to as semi-vacuum). When the inside of the pretreatment chamber 14 is in a semi-vacuum state, the gate valve 69 between the substrate bonding chamber 15 and the substrate bonding chamber 15 is opened, and the roller conveyor belt 61 is extended to the substrate bonding chamber 15 side by the belt stretching mechanism 60 to continue the substrate bonding. Roll conveyor belt 66 of chamber 15. The lower substrate 1 is carried into the substrate bonding chamber 15 on the roller conveyor belts 61, 66, and the upper substrate 2 is carried into the substrate bonding chamber 15 by the robot 62. At this time, the inside of the substrate bonding chamber 15 is in a semi-vacuum state. In the previous processing chamber 14, a roll conveyor belt 61 that picks up the lower substrate 1 and transports it to the third transfer line 20 of the lower table 65 of the substrate bonding chamber 15 is provided, and the upper substrate 2 is picked up and delivered to the substrate. A robot 62 for the upper table (pressurizing plate) 21 of the chamber 15. Further, the details of the substrate 1 and 2 of the substrate bonding chamber 15 will be described later. The delivery of the two substrates 1 and 2 in the substrate bonding chamber 15 is completed, and when the upper and lower tables 21 and 65 hold the upper and lower substrates 1 and 2, respectively, the roller conveyor belt 61 stretched by the pretreatment chamber 14 is retracted. In the chamber 14, the aforementioned gate valve 69 is closed. Thereafter, the inside of the substrate bonding chamber 15 is evacuated to a high vacuum (about 5 X 1 〇_3 T〇rr ). Thereafter, the upper and lower substrates 1 and 2 are aligned, and the upper stage 21 is lowered to perform bonding of the upper substrate 2 to the lower substrate 1. At the end of this bonding, the inside of the substrate bonding chamber 15 is returned to the half vacuum, and the gate valve 70 between the substrate bonding chamber 15 and the post-processing chamber 16 is opened. At this time, the post-treatment chamber 16 is in a semi-vacuum state. In the post-processing chamber 16, a conveyor belt telescopic mechanism 68 is also provided. When the gate valve 70 is opened between the bonding chamber 15 and the substrate -12-201142410, the conveyor belt telescopic mechanism 68 provided in the post-processing chamber 16 operates. The conveyor belt 67 is extended by the post-treatment chamber 16 and continues to the roller conveyor belt 66 of the substrate bonding chamber 15. After the post-processing chamber 16 is carried into the bonded substrate (that is, the liquid crystal panel) 19 in which the upper and lower substrates 1 and 2 are bonded together, the roll belt is retracted into the post-processing chamber 16, and the post-processing chamber 16 is bonded to the substrate. The gate valve between chambers 15 is closed, leaving the post-treatment chamber 16 in an atmospheric state. When the inside of the post-treatment chamber 16 is in an atmospheric state, a gate valve (not shown) between the post-treatment chamber 16 and the ultraviolet irradiation chamber 17 is opened, and the belt stretching mechanism provided in the post-treatment chamber 16 (not As shown in the figure, the roller conveyor belt is connected to the ultraviolet irradiation chamber 17. Thereafter, the liquid crystal panel 19 is carried into the ultraviolet irradiation chamber 17 on the relevant roll conveyor, and the sealant is irradiated with ultraviolet rays to harden the sealant. When the curing of the sealant is completed, the liquid crystal panel 19 is transported to the roll conveyor and transported to the second inspection room (panel inspection room) 18 for inspection. In this manner, the processing chambers 14 to 18 are arranged in a substantially linear shape, and a part of the processing chambers are used. However, since almost all of the substrate conveyance is constituted by the roller conveyor belt, the installation area of the apparatus can be minimized. 2 is a schematic view showing a schematic configuration of a specific example of a table above the substrate bonding chamber 15 of FIG. 1, wherein (a) shows a bonding plug (adhesive pad) mode, and (b) shows The method of installing the bonding piece on the upper working surface, 21 is the upper working table, 22 is the bonding pad mounting plate, 23 is the bonding bolt (bonding pad) '24 is the bonding member, 25 is the base plate, 26 is the elastic The body 27 is a pressing plug mounting member '28 is a pressing plug, 29 is an elastic member, 30 is an adhesive piece, and the same reference numerals are given to portions corresponding to those in FIG. 1 and overlapping description will be omitted. In addition, the description here is mainly made by using a bonding plug. -13- 201142410 Using the bonding plug (bonding pad) method shown in Fig. 2(a), the upper table 21 is laminated on the base plate 25 and the elastic body 26, and is mounted on the bonding pad. The plurality of adhesive plugs 23 of the plate 22 are formed with adhesive members 24 at the leading ends of the adhesive plugs 23. That is, the bonding pad mounting plate 22 is moved up and down by using a driving mechanism (not shown) so that the tip end portions of the respective bonding pins 23 are protruded from the lower surface of the upper table 21 (that is, the lower surface of the elastic body 26). It is configured to adhere and hold the upper substrate 2. Further, the adhesive plug (hereinafter referred to as "adhesive pad" 23 is provided with a bonding member 24 at its tip end portion and a vacuum suction port (not shown) for vacuum suction at its central portion. The upper substrate 2 is received by the aforementioned robot using the bonding pad 23, and is pulled up to the lower surface of the upper working table 21 to directly hold the upper substrate 2 on the bonding pad 23. Further, the upper table 2 1 is configured to be movable up and down by a table driving mechanism (not shown). When the bonding substrate (liquid crystal panel) 19 (FIG. 1) is peeled off by the bonding pads 23, the bonding mechanism presses the upper table 21 against the bonding substrate 19 by the table driving mechanism. The vacuum suction port at the central portion of the bonding pad 23 blows a gas onto the surface of the bonding substrate 19 while the bonding pad 23 is pulled up from the lower surface of the upper table 21, and can be peeled off by the bonding substrate 19. The member 24 is connected. According to the mounting table 21 in the manner of attaching the bonding sheet shown in FIG. 2(b), the bonding sheet 30 is provided almost entirely on the base plate 25 of the upper table 21, and further, from the upper table 21 to the bonding sheet. A plurality of vacuum suction ports (not shown) are formed through the attachment surface (adsorption surface) of 30, and the upper table 21 is lowered to the vicinity of the surface of the upper substrate 2 by the previous robot, in accordance with the vacuum. The vacuum adsorption of the adsorption port causes the upper substrate 2 to be sucked up and adhered to the surface of the adhesive sheet 30 to be bonded to the surface of the adhesive sheet - 201142410. In general, even if the vacuum suction mechanism is provided in a vacuum state in the vacuum chamber, the vacuum suction force becomes small and cannot function. However, in this specific example, the upper substrate 2 is taken up until the upper substrate 2 is held (the vacuum chamber) In the substrate bonding chamber (Fig. 1), the inside of the substrate 15 is in a semi-vacuum state, so that the vacuum suction force can be applied. Further, the bonding surface of the bonding sheet 30 is provided with a mesh-like concave projection as shown in the drawing. Further, it is also possible to form a vacuum suction pad which can be moved up and down by the upper table 21 through the bonding sheet 30, whereby the upper substrate 2 can be lifted up to the bonding surface of the bonding sheet 30. In the case of the bonding sheet method, in order to bond the upper and lower substrates 1 and 2, the upper substrate 2 is peeled off by the bonding sheets 3, and a pressing plug mounting member 27 having a driving mechanism for driving up and down is provided. Here, the plug mounting member 27 is pressed, and a plurality of pressing plugs 28 are provided. Further, the elastic member 29 is provided at the tip end portion of the pressing pin 28, and even if the pressing pin 28 is pressed against the surface of the upper substrate 2, no scratches are formed on the surface of the upper substrate 2. By pressing the pressing pin 28 against the upper substrate 2 and raising the upper table 21, the upper substrate 2 can be peeled off from the bonding sheet 30. Further, a gas flow path or a hole for blowing the gas to the central portion of the pressing plug 28 and the elastic member 29 is provided in advance, and when the pressing plug 28 is pressed against the surface of the upper substrate 2, the gas can be blown on the surface. The upper substrate 2 is easily peeled off from the upper table 21. Referring back to Fig. 1, in the substrate bonding chamber 15, the liquid crystal panel 19 which is formed by laminating the upper and lower substrates 1 and 2 is peeled off from the upper table 2 1 (Fig. 2) to be placed on the lower stage. In the state on 65 (Fig. 6), the liquid crystal panel 19 is delivered to the roll conveyor belt 66 by the lower stage 65 of -15-201142410 and conveyed to the post-treatment chamber 16. When the liquid crystal panel is carried into the post-processing chamber 16, the gate valve 70 between the substrate bonding chamber 15 and the post-processing chamber 16 is closed, and the inside of the post-processing chamber 16 is returned to the atmosphere. When the inside of the post-treatment chamber 16 is in an atmospheric state, the liquid crystal panel 19 is carried into the ultraviolet irradiation chamber 17 where the sealant is irradiated with UV light (ultraviolet rays) to cure the sealant. The liquid crystal panel 129 which is hardened by the sealant is transported to the second inspection room (i.e., the panel inspection room) 18 where it is inspected. The liquid crystal panel 1 is manufactured by the above system configuration. However, in the liquid crystal substrate bonding system of the embodiment, most of the transfer lines of the substrates 1 and 2 are carried by the roll conveyor belt, so that the former robot is based on the former. In the comparison of the conveyance, the accuracy of the alignment of the upper and lower substrates 1 and 2 is lowered. Therefore, it is necessary to prevent the positional deviation of the substrate which occurs when the conveyance path is stopped, so that the position of the upper and lower substrates 1 and 2 is not changed when the respective processing apparatuses receive the upper and lower substrates. Therefore, in this embodiment, a detection sensor for positional alignment is disposed before the upper and lower substrates 1, 2 are delivered to the respective processing devices. 3 is a schematic structural view showing a specific example of the arrangement of the detecting sensor and the operation of the first transport line 5 of FIG. 1, and the (a)-based substrate (herein, the following substrate 1 is taken as an example) In the normal posture transport state, the figure (b) shows the state in which the substrate is transported, 31a and 31b are rollers, 32a and 32b are power transmission shafts, 33a and 33b are drive motors, and 34a and 34b are substrate detection. In the sensor, portions corresponding to the front surface are given the same reference numerals, and overlapping descriptions are omitted. Further, in other transport lines (second to third), of course, the posture of the substrate can be corrected to a normal state. In the figure, the respective roller conveyor belts are disposed on the right and left sides of the rollers 16-201142410 31a and 31b, and the power transmission sources 32a and 32b are connected to the driving for driving the left and right rollers 31a and 31b. Motors 33a, 33b. The driving forces of the driving motors 33a and 33b are transmitted to the rollers 31a and 31b through the power transmission sources 32a and 32b, whereby the rollers 31a and 31b are rotationally driven. The rollers 31a and 31b are rotationally driven in a state in which the lower substrate 1 is placed on the rollers 31a and 31b, and the lower substrate 1 is conveyed in the direction of the arrow. In the first transport line 5, the substrate detecting sensors 34a and 34b that pass the left and right sides of the lower substrate 1 are disposed in the right-angle direction (left-right direction) of the transport direction. When the lower substrate 1 is transferred to the stage (not shown) of the slurry coating machine 7 (FIG. 1), the substrate detecting sensors 34a and 34b provided in the first transfer line 5 detect the next. The left and right sides of the substrate 1. When the side of the lower substrate 1 is detected by any one of the substrate detecting sensors 34a and 34b on the left and right sides, the driving motor 3 3 a or 33b on the detected side is stopped. Control means to control. When the substrate detecting sensors 34a and 34b simultaneously detect the leading ends of the respective side portions of the lower substrate 1, the control means determines that the lower substrate 1 is transported in the correct state, and drives the drive motors 33a and 33b to rotate in the original state and transport them. Substrate 1. Here, as shown in FIG. 3(b), the lower substrate 1 is rotated in the counterclockwise direction (inclined) as viewed in the forward direction (that is, the same), that is, the left side of the lower substrate 1 is larger than the right side. When the part side is transported later, the substrate detecting sensors 34a and 34b disposed on the left and right sides (in the direction of the forward direction) cannot simultaneously detect the lower substrate 1, and a time difference is generated in the detection. When the lower substrate 1 is inclined in the manner shown in FIG. 3(b), the substrate detecting sensor 34b on the right side first detects the lower substrate I, and causes the driving substrate to detect the roller conveyor belt on the side of the sensor 34b on the -17-201142410 side. The drive motor 33b is stopped. At this time, the drive motor 33a on the side of the substrate detecting sensor 34a on the left side of the lower substrate 1 is not detected to continue to operate, and the roller 31a continues to rotate. Therefore, the left side of the lower substrate 1 is kept in a moving state. When the lower substrate 1 is detected by the substrate detecting sensor 34b in the substrate 1 under the tilted direction of the transport direction, the drive motor 33b is stopped. At this time, the other drive motor 33a is rotationally driven, and the left side of the lower substrate 1 is conveyed. The lower substrate 1 is rotated to advance the left side portion of the lower substrate 1 by this operation. By the rotation operation, the left side portion of the lower substrate 1 is in a state detected by the substrate detecting sensor 34a, and the front end of the left side portion of the lower substrate 1 is at the same position as the tip end of the right side portion, and the lower substrate 1 is corrected. tilt. When the inclination of the lower substrate 1 is corrected and the substrate detecting sensors 34a and 34b are in the state in which the leading ends of the left and right sides of the lower substrate 1 are detected, the drive motor 33b on the right side is restarted and corrected in the tilt. The state is again transferred to the lower substrate 1. Further, as will be described in more detail, the control means (not shown) observes the timing difference between the detection of the left and right substrate detecting sensors 34a and 34b, detects the rotation (tilt) state of the substrate, and simultaneously drives the motor 3 3 . a, 3 3 b is reversed and the lower substrate 1 is again returned to a specific position before the detection. Thereafter, the two drive motors 3 3 a and 3 3 b are rotationally driven in the forward direction to rotate the rollers 3 1 a and 3 1 b in the conveyance direction, and the lower substrate 1 is moved in the conveyance direction of the arrow. As a result, it is confirmed that the tilt is eliminated by detecting the leading ends of the left and right sides of the lower substrate 1 by the substrate detecting sensors 34a, 34b. When the inclination of the lower substrate 1 is not sufficiently corrected, the subsequent operations are corrected and the stop processing of the drive motors 3 3 a and 3 3 b is performed to obtain the detection time difference. Control means -18-201142410 When it is judged that the detection time difference is within a specific range, it is recognized that the lower substrate 1 is transported in a normal transport state, and the lower substrate 1 is transported to the coating table of the paste coater 7. , stop there. The coating stage of the paste coater 7 is configured to be movable up and down, and the coating stage is raised, and the lower stage 1 is attached to the coating table by the roll conveyor. In this manner, the substrate detecting sensors 34a and 34b are disposed in the left-right direction in the middle of the transport line 5, and the side of the tip end of the side portion of the lower substrate 1 is detected in response to the detection results of the substrate detecting sensors 34a and 34b. When the drive motor is stopped and the detection time difference between the substrate detecting sensors 34a and 34b is obtained, the tilt state of the lower substrate 1 can be detected. Further, until the detection time difference between the substrate detecting sensors 34a and 34b is within a specific range, the detection of the tip end of the left and right sides of the lower substrate 1 is repeated, and the tilt of the lower substrate 1 is corrected. Therefore, it is not necessary to separately provide a table for the correction of the inclination of the lower substrate 1, and it is not necessary to provide a robot, and it is possible to suppress an increase in size of the system. Further, the correction of the relevant tilt is described by taking the following substrate 1 as an example, and the same correction can be performed on the upper substrate 2 carried on the second transport line 6 (Fig. 1). The roller conveyor belt of the first conveyance line 5 is interposed between the apparatus of the alignment mechanism 4, the paste coating machine 7, the short-circuit electrode forming coating machine 8, the liquid crystal dropping device 9, the first inspection chamber 10, and the transfer device 12. It is distinguished that 'the control of the same position alignment as described above is performed in the respective sections. In the above-described control method, the inclination of the lower substrate 1 is corrected by reversing the detection of the tip end portion of the left and right side portions of the lower substrate 1 until the specific position is reversed, but the detection of the inclination of the lower substrate 1 is performed. The relationship between the time difference and the correction amount is recorded in -19-201142410. It is also possible to drive the control motor on one side to correct the change in response to the detection time difference. In this way, it is not necessary to perform the positional alignment of the lower substrate 1 placed on the table in order to correct the position of the lower substrate 1 on the transport line, and it is possible to shorten the positional alignment time when placed on the table, and at the same time Improve the accuracy of the work on the separate workbench. Further, in each of the above-described apparatuses, a table for performing respective processes is provided, and in each of the stages, a substrate positioning mechanism is provided in order to define a stop position of the lower substrate 1. In the substrate positioning mechanism, two restriction plugs that move up and down on the left and right side portions of the lower substrate 1 in the direction perpendicular to the substrate are defined. When the lower substrate 1 is transported onto the roll transport belt in the apparatus, the restriction plug protrudes above the roller conveyor belt to stop the movement of the lower substrate 1, and stops the advancement of the lower substrate 1. Each of the stages of the apparatus is configured to be vertically movable by a drive mechanism (not shown), and the roller conveyor belt lower substrate 1 is transported to stop the roller conveyor belt on the table. The table rises 'the lower substrate 1 can be taken up to the work surface by a roller conveyor. Further, the roller conveyor provided on the table portion is provided with a vertical movement mechanism for moving the roller conveyor belt to a lower level than the table surface to deliver the substrate. 4 is a view showing a configuration of an embodiment of the substrate inverting device Η and the substrate reversing method thereof according to the present invention, and FIG. 4(a) is a schematic structural view showing the overall configuration of the example. b) is the composition diagram of the moving beam of the figure (a), 40 is the gantry, 41 is the moving column, 42 is the movable beam, 43 is the horizontal moving part, 44 is the moving part up and down, -20- 201142410 45 is the finger and 46 is the vacuum suction pad. On the roll conveyor belt on which the second conveyance line 6 is formed, the color filter is formed to face upward, and the upper substrate 2 is placed and conveyed to the substrate inverting device 11. The roller conveyor belt provided in the reversing mechanism portion of the substrate reversing device 11 is configured to be movable up and down. In FIG. 4(a), the substrate inverting device 11 includes a movable beam of a plurality of fingers 45 (FIG. 4(b)) extending in a direction perpendicular to the width direction (width) of the upper substrate 2 on the gantry 40. Inverting mechanism composed of 42 etc. As shown in FIG. 4(b), the movable beam 42 has a configuration in which a plurality of fingers 45 are provided on the rotating shaft, and the plurality of vacuum suction pads 46 that adsorb the upper substrate 2 are used as the faces of the fingers 45. Also high above a certain height. The vacuum suction pad 46 is connected to a pipe from a negative pressure source that supplies a negative pressure, although not shown. As shown in FIG. 4(a), the reversing mechanism sucks and holds the upper substrate 2 on the finger portion 45 of the movable beam 42 by the vacuum suction pad 46, and lifts the upper and lower moving members 44 on one end side of the movable beam 42 toward In the vertical direction, the horizontal movement member 43 on the other end side is moved from one side to the other side of the gantry 40 in the substrate conveyance direction, and the upper substrate 2 is vertically inverted. Here, the finger portion 45 of the movable beam 42 is provided between the roller and the roller provided in the roller conveyor belt of the reversing mechanism portion. A moving column 41 for raising and lowering the vertical moving member 44 on one end side of the movable beam 42 is provided on the end portion side of the substrate 2 in the substrate transfer direction of the gantry 40. A portion of the moving column 41 is provided with a drive motor (not shown) for moving the member 44 up and down on the one end side of the movable beam 42 up and down. By the drive motor, the vertical movement member 44 is moved in the upper and lower directions along the movement column 41. Further, although not shown, the vertical moving member 44 is connected to the rope by the rope, thereby reducing the driving force of the drive motor. The horizontal moving member 43 on the other end side of the movable beam 42 is provided with a rolling mechanism so as to be easily moved to the linear guide. The operation of the substrate inverting device 1 1 of this example will be described. First, the upper substrate 2 reaches the base. When the plate reversing device 1 is mounted, the roller conveyor belt is stopped to move the roller conveyor belt downward. By lowering the roller conveyor belt, the upper substrate 2 is delivered onto the finger 45 of the movable beam 42 provided between the roller and the roller. The upper substrate 2, which is delivered onto the finger portion 45, is held by vacuum suction by the vacuum suction pad 46 provided on the finger portion 45. When the upper substrate 2 is suction-held, the vertical moving member 44 on one end side of the movable beam 42 rises along the moving column 41, and at the same time, the horizontal moving member 43 on the other end side of the movable beam 42 moves horizontally along the linear guide. direction. Next, before the upper and lower moving members 44 reach the highest point, the horizontal moving member 43 moves at a specific speed in the horizontal direction and can be moved to the opposite side by the center of the moving column 4 1 . Further, the horizontal moving member 43 may be provided with a driving motor, and the rotational force may be supplied to the horizontal moving member 43 to be driven in the horizontal direction. When the movable beam 42 is in the vertical state, the rising change of the vertical moving member 44 is controlled to the downward direction. By performing the above operation, the upper substrate 2 can be reversed upside down. When the horizontal moving member 43 moves to the opposite side of the moving column 4 1 to make the movable beam 42 horizontal, and the upper substrate 2 is vertically inverted, the next transfer of the substrate inverting device 11 of the -22-201142410 is performed. The robot 13 (Fig. 1) of the chamber 12 extends to a position deviating from the finger 45 of the movable beam 42, and the vacuum adsorption pad provided on the finger of the robot side sucks and holds the upper substrate 2. Thereby, the upper substrate 2 is delivered to the robot 13 of the transfer chamber 12 by the movable beam 42 of the substrate inverting device 11. As described above, in the substrate inverting device 11, the one end side of the upper substrate 2 is moved up and down, and the other end is horizontally moved. Therefore, the upper substrate 2 has the upper and lower moving members 44 of the movable beam 42 as the apex, and is centered on the vertex. The shape of the approximately semi-fan shape moves, and the moving area becomes smaller as compared with the case where the rotation is 180 degrees. Therefore, the surrounding air is not disturbed, the occurrence of dust can be suppressed to a minimum, and the influence of dust on the surrounding device can be suppressed to a minimum. Further, in this example, the vacuum suction pad of the robot is extended on the finger 45 of the movable beam 42 to receive the upper substrate 2, but the foot of the vacuum suction pad 46 provided on the finger 45 of the movable beam 42 is previously extended. The finger of the robot 1 3 is inserted between the upper substrate 2 and the finger portion 45, and the delivery of the upper substrate 2 may be performed. With such a configuration, work efficiency can be improved. Fig. 5 is a view showing a configuration of another embodiment of the substrate inverting device 1 and its substrate inversion method according to the present invention of Fig. 1, and Fig. 5(a) is a schematic structural view showing the overall configuration of the other example. Figure (b) is a structural view of the substrate transfer plate on the upper side of the figure (a), 50 is a gantry, 51 is an upper substrate transfer plate '52 is a swing wrist, 53 is a drive mechanism '54 is a joint portion, 55 is a stack, 56 For the vacuum adsorption pad, 57 is a connection mechanism. In Fig. 5 (a), the substrate inverting device 11 is provided with a reversing mechanism 23 to 201142410 which is formed by the transfer plate 51 and the like to vertically reverse the upper substrate 2. In this reversing mechanism, the upper substrate 2 is placed on the transporting plate 51, and the central portion of the transporting plate 51 is rotated by the support to vertically reverse the upper substrate 2. Hereinafter, the inversion mechanism of the substrate inverting device 11 of Fig. 5(a) will be described using Fig. 5(b) showing a specific example of the upper substrate transfer plate. In the center portion on both sides of the transporting plate 51 parallel to the transport direction of the upper substrate 2, the connecting mechanism 57 is provided so as to be hinged to the connecting portion 54 of the reversing mechanism (Fig. 5(b)). Further, the transfer plate 5 1, as shown in Fig. 5(b), is formed by a plurality of stacks 55, and a vacuum suction pad 56 of a specific length is provided on the upper portion of the stack 55 so as to be insertable into the fingers of the robot. . In the substrate inverting device 11, a plate rotation driving mechanism is provided at a central portion thereof. In the plate rotation drive mechanism, the swing arm 52 is provided on both sides in the conveyance direction of the upper substrate 2 of the first conveyance line 5, and the rotation arm 52 is provided on one end side (rotation center side) of the swing arm 52. The drive mechanism 53 for use is provided with a connecting portion 54 that is coupled to the transport plate 51 to the second transport line 6 (FIG. 1) on the distal end side of the swing arm 52, and a transport plate 51 is provided to carry the transport mechanism from the substrate. The arm 3 (FIG. 1) carries the upper substrate 2 on the transport plate 51 so that the color filter faces upward, and is transported. At this time, the upper substrate 2 is vacuum-adsorbed by the vacuum suction pad 56 provided on the stack 55 of the transfer plate 51 shown in FIG. 5(b). The upper substrate 2 is transported to the substrate reversing device 1 1 on the second transfer line 6 together with the transfer plate 51. When the transfer plate 51 reaches the substrate inverting device 11, the connecting portion 54 provided at the tip end portion of the turning arm 52 of the reversing mechanism is coupled by a connecting mechanism 57 provided at the center portion of the conveying plate 51. When the connecting portion 54 of the distal end of the turning arm 52 is coupled to the connecting mechanism 57 of the transporting plate 51, the turning arm 52 is rotated by the driving mechanism 53, and the upper substrate 2 is vertically inverted. Further, the connecting portion 54 of the turning arm 52 is configured to be rotatable, and the turning arm 52 is rotatable between the connecting mechanism 57 of the transfer plate 51 and the rotation of the turning arm 52 in the direction of the arrow A. The conveying plate 51 is rotated in the directions of arrows B and C shown in the drawing. When the turning arm 52 is rotated by 180 degrees in the direction of the arrow A, the upper substrate 2 comes to the lower substrate 2 of the transporting plate 51, and is delivered to the transfer chamber 12 by the lower portion of the transporting plate 51. 13. That is, the fingers of the robot 13 are inserted between the vacuum suction pads 56 of the transfer plate 51, and the upper substrate 2 is held by the vacuum suction pad provided on the fingers of the robot 13, and the stack 55 provided on the transfer plate 51 is stopped. Vacuum adsorption of the vacuum adsorption pad 56. Thereafter, the robot moves the upper substrate 2 away from the conveying plate 51, and carries the upper substrate 2 into the pretreatment chamber 14. The conveyance plate 51 is rotated again by the reversing mechanism of the substrate reversing device 1 and returns to the second conveyance line 6 on the side where the vacuum suction pad is provided, and returns to the position where the substrate is loaded into the robot arm 3. As described above, in other embodiments, also in the substrate inverting device 1 1 , the upper substrate 2 is not completely rotated 180 degrees up and down, but is moved by the one end side in the approximate horizontal direction, and the other end side is moved in the vertical direction. In the direction, the movement of the substrate inversion of the upper substrate 2 is suppressed to the minimum extent as much as possible. Therefore, generation and lifting of dust accompanying the reversal of the upper substrate 2 can be suppressed, and the influence of dust on the surrounding device can be suppressed. 6 is a longitudinal cross-sectional view showing the substrate loading operation of the substrate bonding chamber 15 of FIG. 1 from the substrate processing of the front processing chamber 14 and the substrate processing operation of the processing chamber 16, 60 being a conveyor belt telescopic mechanism, 61 being a roller conveyor belt, 62 For the robot, 63 is the finger-25-201142410, 64 is the adsorption pad, 69 is the gate valve, 65 is the lower table, 66 is the roller conveyor belt for substrate delivery, 70 is the gate valve, 68 is the conveyor belt telescopic mechanism, 67 In the case of the roller conveyor belt, the same reference numerals will be given to the same reference numerals in the drawings, and the description will be omitted. In the figure, a pre-treatment chamber 14 (Fig. 1) is provided on the lower side thereof, and a roller conveyor belt 161 having a telescopic conveyor belt telescopic mechanism 60 is provided, and a robot hand 62 is provided on the roof side. A gate valve 69 is provided between the substrate bonding chamber 15 and the pretreatment chamber 14, and the substrate bonding chamber 15 is normally held at a specific degree of vacuum. Further, a gate valve 70 is also provided between the substrate bonding chamber 15 and the post-processing chamber 16 (Fig. 1). The substrate bonding chamber 15, as shown in the drawing, serves as a vacuum chamber in which a lower table 65 for holding the lower substrate 1 and a lower table 21 for holding the upper substrate 2 are disposed, and a roller conveyor belt 61' for the front processing chamber 14 is provided. A conveyor belt telescopic mechanism 60 is provided, which is connected by the roller conveyor belt 61 of the front processing chamber 14 of the conveyor belt retracting mechanism 60' when the gate valve 69 between the substrate bonding chamber 15 and the pretreatment chamber 打开 is opened. The roll conveyor belt 'the lower substrate 1 of the substrate bonding chamber 15 can be configured to be carried into the lower table 65. When the substrate is bonded, the upper stage 21 is moved to the lower stage 65 side by a driving mechanism (not shown) to bond the lower substrate 1 and the upper substrate 2. A plurality of adsorption pads 64 are provided in the fingers 63' of the robot 62 provided in the pretreatment chamber 14. In addition, as described above, 'on the substrate bonding chamber 15 above the table 2 1 side' is also provided with a plurality of freely stretchable bonding pads (adhesive plugs) 23 as shown in FIG. 2( a ). The bonding pad 23 on the upper table 21 side can be lowered between the fingers 63 of the robot 62 to adhere and hold the upper substrate 2° to the center portions of the -26-201142410 adsorption pad 64 and the bonding pad 23, A supply port (not shown) for supplying a negative pressure is supplied with a negative pressure to the supply port to adsorb the upper substrate 2», and the negative pressure source or the supply pipe is omitted in the drawing. Further, the adsorption pad 64 is provided only with the holding mechanism according to the negative pressure, and the mechanism for the adhesion holding is not provided. As described above, when the upper substrate 2 is delivered, the pretreatment chamber 14 and the substrate bonding chamber 15 can be placed in a semi-vacuum state by means of negative pressure adsorption, and supplied to each of the adsorption pads 64 and the respective bonding pads 23. The negative pressure system is higher than its vacuum. When the upper substrate 2 is delivered from the pretreatment chamber 14 to the substrate bonding chamber 15, the upper substrate 2 is held on both the adsorption pad 64 on the robot 62 side and the adsorption pad 23 on the upper table 21 side, and the robot 62 side is stopped. The negative pressure supply of the adsorption pad 64 causes the robot 62 and the extended roller conveyor belt 61 to retreat to the pretreatment chamber 14. Thereafter, the upper substrate 2 is lifted up to the surface of the upper table 21 by the bonding pad 23, and is constituted by a plurality of the bonding pads 23 held therein. That is, even if the degree of vacuum is raised, the upper substrate 2 can be held by the adhesive force without falling. After the bonding between the lower substrate 1 and the upper substrate 2 is completed, the bonding pad 23 is lifted up to the upper side of the upper table 21 by pressing the upper table 21 against the upper substrate 2, and The bonding pad 23 is peeled off from the surface of the upper substrate 2. Further, at this time, the adhesive pad 23 can be easily peeled off by blowing a positive pressure gas from a negative pressure supply port provided at the central portion of the bonding pad 23. Further, the lower table 65 is provided with an adhesive sheet (adhesive member) (not shown) and a plurality of negative pressure supply ports, and the lower substrate 1 is held so as not to move. When the adhesive member is pulled and peeled off by the lower substrate 1, the lower table 65 is not moved, and the compressed gas is supplied from the negative pressure supply port provided at the central portion of the adhesive sheet, and is peeled off. Further, the upper and lower plugs are preset at the central portion of the negative pressure supply port, and by pressing the lower substrate 1 up and down, the lower substrate 1 can be peeled off from the roller conveyor 61 of the pre-treatment chamber 14 by the adhesive member. The telescopic mechanism 60 can be stretched to the side of the substrate bonding chamber 15 side, and when the gate valve 69 between the pretreatment chamber 14 and the substrate bonding chamber 15 is closed, it is retracted to the front processing chamber 14 side, and the gate valve 69 is opened. When the lower substrate 1 is transported into the substrate bonding chamber 15 and extends to the substrate bonding chamber 15 side, it is butted to the roller transfer belt 66 for substrate transfer provided in the substrate bonding chamber 15, and the lower substrate 1 is smoothly delivered. The structure is configured to the lower stage 65 of the substrate bonding chamber 15. The lower table 65 is provided between the left and right roller conveyor belts 66 as receiving conveyor belts, and is provided with a drive mechanism so as to be movable up and down. Further, in the post-processing chamber 16, a belt conveyance belt 67 that is stretchable to the side of the substrate bonding chamber 15 is provided by the belt stretching mechanism 68 provided there, and the bonding of the lower substrate 1 and the upper substrate 2 is completed. When the gate valve 70 between the post-processing chamber 16 and the substrate bonding chamber 15 is opened, the roller conveyor belt 67 extends to the substrate bonding chamber 15 side to continue to the roller conveyor belt 66 for substrate conveyance, whereby the roller conveyor belt 66 is conveyed through the roller. The tape 67 is carried out by the substrate bonding chamber 15 to carry out the liquid crystal panel 19 formed by bonding the substrates, and is transported to the post-processing chamber 16. Here, the loading of the lower substrates 1 and 2 into the substrate bonding chamber 15 and the mounting of the upper and lower stages 21 and 65 can be performed almost simultaneously, whereby the assembly time of the liquid crystal panel can be greatly shortened. As described above, when the upper and lower substrates 1 and 2 are held by the pretreatment chamber 14 in the upper table 21 and the lower table 65 of the substrate bonding chamber 15, the gate valve 69 is closed. Further, the gate valve 70 between the substrate bonding chamber 15 and the post-processing chamber 16 was originally closed from 28 to 201142410. When the gate valve 69 is closed, the substrate bonding chamber 15 is evacuated to a high vacuum state in a semi-vacuum state, and the upper and lower substrates 1 and 2 are bonded together. Although not shown, a drive mechanism for moving the upper table 21 up and down or a drive mechanism for moving the adhesive pad 23 up and down is provided outside the substrate bonding chamber 15, and the drive shafts of the drive mechanisms are connected to the drive shaft. The table 21 or the bonding pad 23 moves the bonding pad 23 or the upper table 21 up and down by operating the relevant driving mechanism to bond the upper and lower substrates 1 and 2. At the time of this bonding, the upper table 21 is moved to the lower table 65 side. When the bonding of the upper and lower substrates 1 and 2 is completed, as described above, the inside of the substrate bonding chamber 15 is in a semi-vacuum state, and the post-processing chamber 16 which is in a semi-vacuum state in advance is in a high vacuum state. When the inside of the substrate bonding chamber 15 is in a semi-vacuum state, the gate valve 70 is opened, and the roller conveyor belt 67 is extended by the post-processing chamber 16 in the substrate bonding chamber 15 and the upper and lower substrates 1 on the roller conveyor belt 66 for substrate delivery are When the product of the liquid crystal panel 19 is carried out to the post-processing chamber 16 and the liquid crystal panel 19 is carried into the post-processing chamber 16, the gate valve 70 is closed, and the post-processing chamber 16 is returned to the atmosphere. By returning to the atmosphere in the post-treatment chamber 16, the entire liquid crystal panel 19 is uniformly applied with atmospheric pressure, and the interval between the upper and lower substrates 1 and 2 becomes a regular interval. Then, in FIG. 1, the liquid crystal panel 19 is transported to the ultraviolet irradiation chamber 17 by the roll belt constituting the third transport line 20. At this point, the sealant is hardened by ultraviolet irradiation of the sealant. After the curing of the sealant is completed, the liquid crystal panel 19 is sent to the panel inspection chamber 18 by the same roller conveyor, and the state is inspected and sent to the next step (not shown). Next, a second embodiment of the liquid crystal substrate bonding chamber according to the present invention will be described. -29 - 201142410 In the first embodiment, since the state in the substrate bonding chamber 15 is reversed to the semi-vacuum state and the high vacuum state, the pretreatment chamber 14 and the post-treatment chamber 1 are provided in front and rear. On the side, the gate valves 69 and 70 are opened and closed, and the upper and lower substrates 1 and 2 are collected and the liquid crystal panel 19 is bonded to the bonded body. By repeating the semi-vacuum state and the high vacuum state, it is possible to shorten the time period in which the inside of the substrate bonding chamber 15 is brought into a vacuum state, and at the same time, it is possible to prevent the deterioration of the degree of cleanness in the substrate bonding chamber 15. In the second embodiment described below, the configuration is the same as that of the configuration shown in Fig. 1. However, the pretreatment chamber 14 and the post-treatment chamber 16 are omitted, and the transfer chamber 12 is directly carried into the substrate bonding chamber 15 The substrates 1 and 2 are configured to directly carry out the liquid crystal panel 19 formed in the substrate bonding chamber 15 to the ultraviolet irradiation chamber 17. Fig. 7 is a schematic structural view showing a portion of the substrate bonding chamber 15 of the second embodiment, 15' is a substrate bonding apparatus, 76 is an upper vacuum chamber, 77 is a lower vacuum chamber, and 78 is an upper table. 78a is the base plate, 78b is the bonding member, 79 is the lower table, 79a is the base plate, 79b is the elastic body, 80 is the transverse pressing mechanism, 81 is the drive motor, 82 is the ball screw, 83 is the linear guide, 84 For the support column, 85 is a sealing ring, 86 is a columnar member, 87 is a sealing member, 88 is a lower table support column, 89 is a sealing member, 90a, 90b are vacuum exhaust pipes, 91 is an upper frame, 92 is upper and lower The drive unit, 93 is a gantry, and 94 is a joint mechanism, and the same reference numerals are given to the portions corresponding to the front surface, and the overlapping description will be omitted. In the second embodiment, in the second embodiment, the substrate bonding apparatus 18' corresponding to the substrate bonding chamber i8 of Fig. 1 is divided into the upper chamber -30-201142410 empty chamber 76 and the lower portion. In the two-part structure of the vacuum chamber 77, the upper substrate 2 is carried into the upper table 78 in the upper vacuum chamber 76 by the transfer chamber 12 (FIG. 1), and the lower substrate 1 is carried into the lower table 79 of the lower vacuum chamber 77. The liquid crystal panel 19 (FIG. 1) in which the upper and lower substrates 1 and 2 are bonded together is carried out to the ultraviolet irradiation chamber 17 (FIG. 1). In addition, although the second embodiment is not shown, a telescopic mechanism for providing a roller conveyor for telescopic transport of the upper and lower substrates 1 and 2 or the liquid crystal panel 19 is provided in the transfer chamber 12 and the ultraviolet irradiation chamber 17. . The lower vacuum chamber 77 is in a state of being almost fixed to the support columns 84a and 84b on the gantry 93 side, and a roller conveyor belt (not shown) for substrate transfer is provided in the lower vacuum chamber 77 so as to be able to be used for the roller conveyor belt. A lower table 79 is provided in a manner of moving up and down. The up-and-down movement range of the lower table 79 may be a position that can be moved to the lower substrate 1 on the roller conveyor belt and not in contact with the roller conveyor belt. The lower table 79 has a structure in which an elastic body 79b is provided on the base plate 79a, and a portion of the elastic body 79b is connected to the lower substrate 1 to be carried in. The lower table 79 is provided in the lower vacuum chamber 77, and is supported by a plurality of lower table support columns 88 provided on the upper and lower drive portions 92 of the gantry 93. Between the support table 88 and the lower vacuum chamber 77, a sealing member 89 is provided, and when the vacuum chamber is formed by the upper vacuum chamber 76 and the lower vacuum chamber 77, air is prevented from entering. Further, in the second embodiment, a lateral pressure mechanism 80 for moving the lower table 79 in the horizontal direction and positioning the upper substrate 2 and the lower substrate 1 is provided. The upper table 78' has a configuration in which the bonding member 78b is provided on the base plate 78a. As in the first embodiment described above, the upper table 78' has a plurality of vacuum suction pads (not shown) that can be moved up and down. The robot 13 (Fig. 1) of the transfer chamber 12 (Fig. 1) is held by the vacuum adsorption pad to hold the substrate 2 to be received by the vacuum adsorption pad provided on the upper table 78, and raised to the substrate holding surface of the upper table 78. . On the upper surface of the upper table 78, a plurality of vacuum suction ports (not shown) and a bonding member 78b are disposed to vacuum-adsorb the upper substrate raised by the vacuum adsorption pad on the upper stage 78 side. 2, at the same time eventually become bonded to maintain. The vacuum suction pad of the upper stage 7 8 is used to peel off the upper substrate 2 of the liquid crystal panel 19 adhered to the surface of the upper stage 78 after bonding of the substrates 1 and 2. In other words, when the upper stage 78 is peeled off from the surface of the bonded substrate (liquid crystal panel) 19 after the bonding of the substrates 1 and 2 is completed, the surface of the bonded substrate 19 is pressed by the vacuum suction pad. The upper stage 78 is raised, and the substrate 2 above the liquid crystal panel 19 can be peeled off from the surface of the upper stage 78. At this time, the upper substrate 2 of the liquid crystal panel 9 can be easily peeled off by blowing a gas onto the surface of the liquid crystal panel 19 from the vacuum suction port provided on the upper surface of the upper stage 78. The upper vacuum chamber 76 is connected to the upper frame 91 via a joint mechanism (not shown), and the upper table 78 is connected to the upper frame 91 by a plurality of columnar members 86. Between the columnar member 86 and the upper vacuum chamber 76, a sealing member 87 is provided, and when the vacuum chamber is formed by the upper vacuum chamber 76 and the lower vacuum chamber 77, air is prevented from entering the vacuum chamber. The upper vacuum chamber 76 and the upper table 78 are moved up and down by a drive motor 81 provided at a corner of the device 4 for driving the upper frame 91 up and down, and an upper frame upper and lower drive mechanism constituted by the ball screw 82 and the linear guide 83. . A sealing ring 85 formed of rubber is provided at a joint portion between the upper vacuum chamber 76 and the lower vacuum chamber 77. When the upper vacuum chamber 76 and the lower vacuum chamber 77 are combined to form a vacuum chamber, the airtightness in the vacuum chamber is maintained by the sealing ring 85 of -32-201142410. Further, the correction of the inclination of the lower substrate 1 is the same as in the first embodiment, and the detection of the sensor that detects the passage of the substrate by using the specific position disposed on the roller conveyor as described in FIG. Come on. In the substrate bonding apparatus 15', the upper substrate 2 and the lower substrate 1 are carried into the upper table 78 and the lower table 79 at about the same time. At this time, the upper vacuum chamber 76 and the lower vacuum chamber 77 are separated from each other and are in an atmospheric state. As explained earlier, the upper substrate 2' is processed as illustrated in Fig. 6, using the vacuum suction pad of the upper table 78 provided on the upper side of the upper side of the vacuum 76' by the transfer chamber 12 (Fig. 1). 13 (Fig. 1) is taken up and held on the upper table 78 using a vacuum suction and adhesion holding mechanism. The lower substrate 1 is supported by the lower roller table 66 as shown in FIG. 6 provided on the lower vacuum chamber 77 side, so that the lower table 79 is raised and the lower substrate 1 is placed on the lower table. 79. The lower substrate 1 placed on the lower stage 79 is vacuum-adsorbed using a plurality of vacuum suction ports provided in the lower stage 79, and is held by being bonded by a plurality of bonded members. Further, in the lower stage 79, in order to align the positions of the upper substrate 2 and the lower substrate 1, a table driving mechanism that can be moved in the horizontal direction is provided. As described above, since the inclination of the substrates 1 and 2 is corrected in advance on the roll belt of the transport line, the amount of movement can be made small, and the positional alignment between the substrates 1 and 2 can be performed with a related minute movement. When the upper and lower substrates 1 and 2 are held by the upper table 78 and the lower table 79, the upper vacuum chamber 76 is lowered to the lower vacuum chamber 77 side, and the upper vacuum chamber 76 and the lower vacuum chamber 77 are combined to form a vacuum chamber. When the vacuum chamber is formed, the upper frame 91 is disconnected from the joint mechanism 94 of the upper vacuum chamber 76, and the upper frame 78 is moved up and down by the upper frame upper and lower drive mechanisms. In this way, when the vacuum chamber is formed, the vacuum chambers 90a and 90b provided on the upper vacuum chamber 76 side and the lower vacuum chamber 77 side respectively discharge the gas in the vacuum chamber to form a high vacuum state (about 5x1 (T3T〇rr). In this state, the positional deviation marks between the upper and lower substrates 1 and 2 are obtained by observing the alignment marks provided on the upper substrate 2 and the lower substrate 1 by a camera (not shown), so that the lower stage 79 is obtained. The drive is aligned in the horizontal direction. When the alignment is completed, the upper table 78 is moved to the lower table 79 by the upper frame upper and lower drive mechanisms to bond the upper and lower substrates 1 and 2. The liquid crystal panel 1 9 (Fig. 1), at this time, the pressing force is applied to the upper and lower substrates by the pressure sensor provided on the drive shaft of the upper table 78 and pressed to a predetermined pressure. When the bonding of 2 is completed, the upper table 78 is raised to peel off the liquid crystal panel 19 which is adhered and held. When the liquid crystal panel 19 which is adhered and held is peeled off, as described above, The vacuum adsorption pad for receiving the substrate presses the substrate of the liquid crystal panel 19 At the same time, the upper stage 78 is raised, and the adhered liquid crystal panel 19 can be peeled off. When the vacuum suction pad is attached to the substrate surface of the liquid crystal panel 19, a positive pressure gas can be supplied instead of supplying a negative pressure. Further, when the liquid crystal panel 19 that is adhered and held is peeled off by the upper table 78, the positive pressure gas can be supplied from the vacuum suction port provided on the surface of the upper table 78, so that the peeling can be shortened. The bonding member, that is, the time of the upper substrate 2 of the liquid crystal panel 19. After the bonding of the upper and lower substrates 1, 2, the end of the upper table 7 is separated from the substrate 2 on the liquid crystal surface - 34 - 201142410 board 19 The bonding member on the lower substrate 1 side, that is, the lower substrate 1 of the liquid crystal panel 19 is peeled off from the lower table 79. In this case, the plurality of substrate supporting pins provided on the lower table 79 side are raised to the ratio The lower surface of the lower table 79 is higher, so that the lower table 79 is moved lower than the roller conveyor belt, and the side of the substrate 1 below the liquid crystal panel 19 can be peeled off from the surface holding the lower table 49. When the table 79 peels off the liquid crystal panel 19, the substrate is supported under the bolt Lowering below the lower surface of the table 79, the liquid crystal panel 19 is delivered to the roll conveyor belt 66 for substrate transfer as shown in Fig. 6. When the liquid crystal panel is delivered on the roll conveyor 66, in the vacuum chamber When the vacuum chamber is in the same state as the atmospheric pressure, the upper vacuum chamber 76 is raised by the upper and lower driving mechanisms of the vacuum chamber, and the upper vacuum chamber 76 is separated by the lower vacuum chamber 77. The roller conveyor belt is irradiated by the ultraviolet irradiation chamber 17 (Fig. 1) The extension is continued to the substrate transfer belt 66 for substrate transfer in the substrate bonding chamber 15'. Next, the liquid crystal panel 19 is sent to the ultraviolet irradiation chamber 17 where the sealing agent is irradiated with ultraviolet rays to harden the sealant. At the end of the hardening of the sealant, it is sent to the panel inspection chamber 18 of the second inspection device for inspection by a roller conveyor. As described above, in the second embodiment, the upper and lower substrates 1 and 2 are carried into the upper table 78 and the lower table 79 at substantially the same time in the substrate bonding apparatus 15 5', so that the upper and lower sides are moved forward. When the substrates 1 and 2 are respectively carried in, the time required for the substrate to be bonded can be shortened. In addition, since the processing chambers in the steps before the bonding of the substrates are arranged in a substantially linear shape, and the roller conveyor belts are used for the conveyance of the upper and lower substrates 1 and 2, the configuration of the table in each processing device may be Approximately the same, the installation area of the device can be reduced, and the production cycle can be shortened. Further, in the substrate inverting device which is extremely unwilling to generate dust, it is possible to suppress the influence of dust on the entire system by making the reversing mechanism for suppressing the movement range of the substrate as much as possible. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing the overall configuration of a liquid crystal substrate bonding system according to the present invention. Fig. 2 is a schematic block diagram showing a specific example of the upper table in the substrate bonding chamber of Fig. 1. Fig. 3 is a schematic block diagram showing a configuration of a detection sensor of the first transport line of Fig. 1 and a specific example of the operation thereof. Fig. 4 is a block diagram showing an example of the configuration of the substrate inverting apparatus of Fig. 1 according to the present invention. Fig. 5 is a block diagram showing another example of the configuration of the substrate inverting apparatus of Fig. 1 according to the present invention. Fig. 6 is a longitudinal cross-sectional view showing the substrate carrying operation of the substrate processing chamber of Fig. 1 carried out by the substrate of the pretreatment chamber and the substrate carrying operation toward the post processing chamber. Fig. 7 is a schematic block diagram showing another example of the substrate bonding chamber of the liquid crystal substrate bonding system according to the present invention. [Description of main component symbols] 1 : Lower substrate 2 : Upper substrate 3 : Substrate loading robot arm - 36 - 201142410 4 : Alignment mechanism 5 z 1st conveying line (main line) 6 : 2nd conveying line (side line) 7 : Paste Coating machine (sealant dispenser) 8: coating machine for short-circuit electrode formation 9 = liquid crystal dropping device 1 〇: first inspection chamber 1 1 : substrate reversing device 12 : transfer chamber 1 3 : robot ( Robot hand) 1 4 : Pre-treatment chamber 15: Substrate bonding chamber (vacuum chamber) 1 6 : Post-treatment chamber 1 7 : Ultraviolet irradiation chamber 18: Second inspection chamber (panel inspection room) 1 9 : Laminated substrate (liquid crystal) Panel) 2 0 : 3rd conveyor line -37-

Claims (1)

201142410 七、申請專利範圍： 1.一種液晶基板貼合系統，其特徵爲： 由搬送下基板的輥輸送帶所構成的第1搬送線、對前 述第1搬送線上塗佈密封劑之糊狀物塗佈機、被配置於前 述糊狀物塗佈機的下游側之短路用電極形成用塗佈機、滴 下液晶材之液晶滴下裝置、以及檢査下基板的狀態之第1 檢查室與移載室被串聯配置； 於第1搬送線上倂列地形成搬送上基板之輥輸送帶所 構成的第2搬送線，於前述第2搬送線的終端側設有基板反 轉裝置，作爲於反轉裝置的下游側的合.流點，設有移載室 j 在前述第1搬送線與第2搬送線之合流點，設有被連接 於第1搬送線的輥輸送帶所構成的第3搬送線，於前述第3 搬送線上被串聯地配置移載室、前處理室、基板貼合室、 後處理室、紫外線照射室及面板檢查室。 2 ·如申請專利範圍第1項之液晶基板貼合系統，其中 前述基板反轉裝置， 具備於架台上使朝上搬送來的前述上基板以朝上的狀 態由輥輸送帶承接保持之複數指部的活動梁， 前述活動梁，於一端側設上下移動構件，於另一端側 設水平移動部，爲前述上下移動構件沿著設於前述架台上 的移動用柱上下移動，同時前述水平移動部沿著線性導軌 移動於水平方向的構成。 3 .如申請專利範圍第2項之液晶基板貼合系統，其中 -38- 201142410 於前述基板反轉裝置之前述活動梁之複數指部之各個 ，設有吸附保持前述上基板之複數真空吸附墊，前述真空 吸附墊具備比前述指部之面更高上特定高度的足部。 4 ·如申請專利範圍第1項之液晶基板貼合系統，其中 前述基板反轉裝置， 以被設有連結部的迴轉腕構成反轉機構， 使前述上基板保持朝上而使在前述輥輸送帶上搬送而 來的搬送板之連結機構連結於該迴轉腕的連結部，爲使前 述迴轉腕半迴轉而使前述搬送板與被保持於彼之前述上基 板上下反轉之構成。 5. 如申請專利範圍第4項之液晶基板貼合系統，其中 前述基板反轉裝置，係以使前述搬送板反轉時，在前 述搬送板與前述迴轉腕之連結部之間前述搬送板可以轉動 的方式構成。 6. 如申請專利範圍第1項之液晶基板貼合系統，其中 於前述前處理室，設有由輥輸送帶所構成的前述第3 搬送線與機械手， 於前述基板貼合室以設於機械手的真空吸附墊來保持 /搬送前述上基板，以設於前述基板貼合室的上工作台之 複數吸附墊接收，以設於前述上工作台的保持面之複數黏 接墊黏接保持， 以前述第3搬送線搬送前述下基板，於前述基板貼合 室之下工作台收授前述下基板，以前述機械手與前述第3 搬送線將前述上基板與前述下基板約略同時地搬入基板貼 -39- 201142410 合室。 7. 如申請專利範圍第6項之液晶基板貼合系統，其中 於設在前述第1搬送線上的前述糊狀物塗佈機與前述 短路用電極形成用塗佈機與前述液晶滴下裝置與前述第1 檢查室之分別的裝置前方的輥輸送帶，以及前述第2搬送 線的基板反轉裝置前方的輥輸送帶，在對基板搬送方向的 直角方向之左右配置檢測基板的左右邊部的先端部之第1 、第2檢測感測器， 前述第1、第2檢測感測器之中之任一方的檢測感測器 檢測到基板通過時，使檢測到基板通過的前述檢測感測器 側之前述輥輸送帶停止，直到未檢測到基板通過的另一方 檢測感測器檢測到前述基板的通過爲止，繼續前述另一方 的檢測側之輥輸送帶的驅動。 8. 如申請專利範圍第1項之液晶基板貼合系統，其中 於設在前述第1搬送線上的前述糊狀物塗佈機與前述 短路用電極形成用塗佈機與前述液晶滴下裝置與前述第1 檢查室的工作台部，設置了供規定基板的停止位置之用的 在工作台側對搬送方向爲直角方向且使基板的兩端部側的 先端部停止的可上下動之定位機構。 9. 如申請專利範圍第1項之液晶基板貼合系統，其中 設於前述基板貼合室的前述上工作台，成爲在基底板 之前述上基板接觸之側被設有彈性體， 設置複數個由前述基底板對前述彈性體的表面供給負 壓的負壓供給口，同時貫通前述基底板與前述彈性體使複 -40- 201142410 數之黏接墊可以上下地設置之構成。 1 〇.如申請專利範圍第7項之液晶基板貼合系統’其中 設於前述基板貼合室的前述上工作台’成爲在基底板 之前述上基板接觸之側被設有黏接構件， 設置複數個由前述基底板對前述黏接構件的表面供給 負壓的負壓供給口，同時爲了由前述上基板之面剝離前述 黏接構件，而貫通前述基底板與前述黏接構件使複數之按 壓銷可以上下地設置之構成。 11.一種液晶基板貼合系統，其特徵爲： 由搬送下基板的輥輸送帶所構成的第1搬送線、對前 述第1搬送線上塗佈密封劑之糊狀物塗佈機、被配置於前 述糊狀物塗佈機的下游側之短路用電極形成用塗佈機、滴 下液晶材之液晶滴下裝置、以及檢查下基板的狀態之第1 檢查室被串聯配置； 於前述第1搬送線上倂列地形成搬送上基板之輥輸送 帶所構成的第2搬送線， 在前述第1搬送線與前述第2搬送線之合流點，設有被 連接於前述第1搬送線的輥輸送帶所構成的第3搬送線，於 前述第3搬送線上被串聯地配置移載室、基板貼合裝置、 紫外線照射室及面板檢查室。 1 2 ·如申請專利範圍第1 1項之液晶基板貼合系統，其 中 前述基板貼合裝置，具備：被分割爲上工作台設於內 側的上真空室、與下工作台設於內側的下真空室之2個的 -41 - 201142410 真空處理室； 前述真空處理室在被分割爲前述上真空室與前述下真 空室的狀態，約略同時地收授前述上基板於前述上工作台 ，收授前述下基板於前述下工作台，保持分別的基板之後 ，使前述上真空室下降結合於前述下真空室形成前述真空 處理室，使前述真空處理室內爲高真空狀態進行前述上下 基板之貼合。 1 3 .如申請專利範圍第1 1項之液晶基板貼合系統，其 中 於設在前述第1搬送線上的前述糊狀物塗佈機、與前 述短路用電極形成用塗佈機、與前述液晶滴下裝置、與前 述第1檢查室之分別的裝置前方的輥輸送帶部，在對基板 搬送方向的直角方向之左右配置檢測基板的左右兩邊部的 先端部之第1、第2檢測感測器， 前述第1、第2檢測感測器之中之任一方的檢測感測器 檢測到基板通過時，使檢測到基板通過的前述檢測感測器 側之前述輥輸送帶停止，直到未檢測到基板通過的另一方 檢測感測器檢測到前述基板的通過爲止，繼續前述另一方 的檢測側之輥輸送帶的驅動。 I4.一種液晶基板的貼合方法，其爲： 將下基板搬送於第1搬送線上，以前述第1搬送線上的 糊狀物塗布機塗布密封劑，使被塗布前述密封劑的下基板 以配置在前述糊狀物塗布機的下游側的短路用電極形成用 塗布機形成短路用電極後，以被配置在短路用電極形成用 -42- 201142410 塗布機的下游側的液晶滴下裝置滴下液晶材’在第1檢查 室檢查下基板的狀態而搬送至移載室， 倂列於第1搬送線而設的輥輸送帶所構成的第2搬送線 上使貼合面朝上搬送上基板，以設於前述第2搬送線的終 端側的基板反轉裝置反轉後，搬送至移載室，由移載室將 上下基板搬入貼合室，進行貼合；其特徵爲： 於輥輸送帶上使朝上搬送來的基板反轉之基板反轉方 法，係藉由於形成第2搬送路的輥輸送帶上保持搬送來的 上基板，使前述上基板之一端側移動於垂直方向’使前述 上基板之另一端側移動於約略水平方向，而使前述上基板 上下反轉。 1 5 .如申請專利範圍第1 4項之液晶基板的貼合方法， 其中 藉由使在前述第2搬送路之輥輸送帶上搬送來的上基 板承接於活動梁，使前述活動梁之一端側沿著垂直設於架 台上的移動柱移動，使前述活動梁之另一端側沿著設於架 台上的線性導軌移動，而使前述上基板上下反轉。 16.如申請專利範圍第14項之液晶基板的貼合方法， 其中 使前述上基板的貼合面保持朝上，使在前述輥輸送帶 上被搬送而來的搬送板之連結機構連結於迴轉腕的連結部 ，使前述迴轉腕半迴轉而使前述搬送板與被保持於彼之前 述上基板上下反轉。 -43-201142410 VII. Patent application scope: 1. A liquid crystal substrate bonding system characterized by: a first conveyance line formed by a roll conveyance belt that conveys a lower substrate, and a paste that applies a sealant to the first conveyance line The coater, the short-circuit electrode forming coater disposed on the downstream side of the paste coater, the liquid crystal dropping device that drops the liquid crystal material, and the first inspection chamber and transfer chamber in a state in which the lower substrate is inspected The second transport line formed by the roller transport belt that transports the upper substrate is formed on the first transport line, and the substrate reversal device is provided on the terminal side of the second transport line as the inverting device. At the junction point of the downstream side, a transfer chamber j is provided at a junction point of the first transport line and the second transport line, and a third transport line formed by a roller conveyor connected to the first transport line is provided. The transfer chamber, the pretreatment chamber, the substrate bonding chamber, the post processing chamber, the ultraviolet irradiation chamber, and the panel inspection chamber are arranged in series on the third transfer line. The liquid crystal substrate bonding system according to the first aspect of the invention, wherein the substrate inverting device is provided with a plurality of fingers which are supported by the roller conveyor belt in an upward state in which the upper substrate is transported upwards on the gantry In the movable beam, the movable beam is provided with a vertical moving member on one end side, and a horizontal moving portion is provided on the other end side, and the horizontal moving portion is moved up and down along the moving column provided on the gantry. A configuration that moves in a horizontal direction along a linear guide. 3. The liquid crystal substrate bonding system of claim 2, wherein -38 to 201142410, each of the plurality of fingers of the movable beam of the substrate inverting device, is provided with a plurality of vacuum adsorption pads for adsorbing and holding the upper substrate. The vacuum suction pad has a foot portion having a higher specific height than the surface of the finger portion. 4. The liquid crystal substrate bonding system according to claim 1, wherein the substrate inverting device comprises a reversing mechanism by a rotating wrist provided with a coupling portion, and the upper substrate is held upward to be conveyed on the roller The connecting mechanism of the transporting plate that is transported is connected to the connecting portion of the turning arm, and the transfer plate and the upper substrate are held upside down and reversed so that the rotating arm is half-turned. 5. The liquid crystal substrate bonding system according to claim 4, wherein the substrate inverting device is configured such that when the conveying plate is reversed, the conveying plate between the conveying plate and the connecting portion of the turning arm may be The way of turning. 6. The liquid crystal substrate bonding system according to claim 1, wherein the third processing line and the robot comprising a roller conveyor are provided in the pretreatment chamber, and the substrate bonding chamber is provided in the substrate bonding chamber. The vacuum adsorption pad of the robot is used to hold/transport the upper substrate, and is received by a plurality of adsorption pads provided on the upper table of the substrate bonding chamber, and the plurality of bonding pads disposed on the holding surface of the upper working table are adhered and held. The lower substrate is transported by the third transport line, and the lower substrate is received by the table below the substrate bonding chamber, and the upper substrate and the lower substrate are carried into the lower substrate by the robot and the third transfer line. Substrate paste -39- 201142410 Combined room. 7. The liquid crystal substrate bonding system according to the sixth aspect of the invention, wherein the paste coating machine and the short-circuit electrode forming coating machine and the liquid crystal dropping device are provided on the first transfer line The roller conveyor belt in front of the device in the first inspection chamber and the roller conveyor belt in front of the substrate inverting device of the second conveyor line are disposed at the apex of the left and right side portions of the detection substrate in the right-angle direction in the direction in which the substrate is conveyed. In the first and second detection sensors of the first detection sensor, when the detection sensor of one of the first and second detection sensors detects the passage of the substrate, the detection sensor side that detects the passage of the substrate is detected. The roller conveyor belt is stopped until the other detection sensor that has not detected the passage of the substrate detects the passage of the substrate, and the driving of the roller conveyor belt on the other detection side is continued. 8. The liquid crystal substrate bonding system according to the first aspect of the invention, wherein the paste coating machine and the short-circuit electrode forming coating machine and the liquid crystal dropping device are provided on the first transfer line The table portion of the first inspection chamber is provided with a positional mechanism for the predetermined position of the predetermined substrate, which is a vertical position on the table side in the direction of the conveyance direction, and stops the tip end portions on both end sides of the substrate. 9. The liquid crystal substrate bonding system according to claim 1, wherein the upper stage provided in the substrate bonding chamber is provided with an elastic body on a side of the base plate where the upper substrate is in contact with each other, and a plurality of A negative pressure supply port for supplying a negative pressure to the surface of the elastic body is formed by the base plate, and the base plate and the elastic body are inserted through the base plate so that the number of the bonding pads of the composite number can be set up and down. 1. The liquid crystal substrate bonding system of the seventh aspect of the invention, wherein the upper working table provided in the substrate bonding chamber is provided with a bonding member on a side of the base plate contacting the upper substrate, and is provided. a plurality of negative pressure supply ports for supplying a negative pressure to the surface of the bonding member by the base plate, and for detaching the bonding member from the surface of the upper substrate, penetrating the base plate and the bonding member to press the plurality of pressing members The pin can be configured to be placed up and down. A liquid crystal substrate bonding system characterized in that: a first conveyance line formed by a roll conveyance belt that conveys a lower substrate, and a paste coating machine that applies a sealant to the first conveyance line; The coating device for forming a short-circuiting electrode on the downstream side of the paste coater, the liquid crystal dropping device for dropping the liquid crystal material, and the first inspection chamber in a state in which the lower substrate is inspected are arranged in series; on the first conveying line A second transport line formed by a roller conveyor that transports the upper substrate is formed, and a roll conveyor belt connected to the first transport line is provided at a junction of the first transport line and the second transport line. In the third transport line, the transfer chamber, the substrate bonding apparatus, the ultraviolet irradiation chamber, and the panel inspection chamber are arranged in series on the third transfer line. The liquid crystal substrate bonding system according to the first aspect of the invention, wherein the substrate bonding apparatus includes an upper vacuum chamber that is divided into an upper table and an inner table that is disposed on the inner side. a vacuum chamber in which the vacuum chamber is divided into the upper vacuum chamber and the lower vacuum chamber, and the upper substrate is received on the upper table at about the same time. After the lower substrate is held by the lower stage, the upper vacuum chamber is lowered and coupled to the lower vacuum chamber to form the vacuum processing chamber, and the vacuum processing chamber is placed in a high vacuum state to bond the upper and lower substrates. The liquid crystal substrate bonding system according to the first aspect of the invention, wherein the paste coating machine, the short-circuit electrode forming coating machine, and the liquid crystal are provided on the first transfer line. The first and second detection sensors for detecting the tip end portions of the left and right sides of the substrate are disposed on the left and right sides of the substrate in the direction perpendicular to the substrate transport direction in the roller conveyor belt portion in front of the device and the first inspection chamber. When the detection sensor of one of the first and second detection sensors detects that the substrate passes, the roller conveyor belt on the detection sensor side that detects the passage of the substrate is stopped until the detection is not detected. The other detection sensor that passes the substrate detects the passage of the substrate, and continues the driving of the roller conveyor on the other detection side. I4. A method of bonding a liquid crystal substrate, wherein: a lower substrate is transported to a first transport line, and a sealant is applied to a paste coater on the first transfer line to dispose a lower substrate to which the sealant is applied After the short-circuiting electrode is formed by the short-circuiting electrode forming coating machine on the downstream side of the paste coater, the liquid crystal material is dropped by the liquid crystal dropping device disposed on the downstream side of the short-circuit electrode forming-42-201142410 coater. In the first inspection room, the state of the lower substrate is inspected and transported to the transfer chamber, and the second transfer line formed by the roll conveyor provided on the first transport line is used to transport the upper substrate to the bonding surface. The substrate reversing device on the terminal side of the second transfer line is reversed, and then transferred to the transfer chamber, and the upper and lower substrates are carried into the bonding chamber by the transfer chamber, and are bonded together. In the substrate inversion method in which the substrate is reversed, the upper substrate is held by the roller conveyor that forms the second conveyance path, and one end side of the upper substrate is moved in the vertical direction to make the upper base The other end of the movement in the approximate horizontal direction, so that the upper substrate is turned upside down. The method of bonding a liquid crystal substrate according to claim 14 wherein the upper substrate conveyed on the roller conveyor belt of the second conveyance path is supported by the movable beam, and one end of the movable beam is provided. The side moves along the moving column vertically disposed on the gantry, and the other end side of the movable beam is moved along the linear guide provided on the gantry to reverse the upper substrate. 16. The method of bonding a liquid crystal substrate according to claim 14, wherein the bonding surface of the upper substrate is held upward, and the connecting mechanism of the conveying plate conveyed on the roller conveyor is coupled to the rotation. The connecting portion of the wrist rotates the turning arm halfway to reverse the transfer plate and the upper substrate held by the upper and lower sides. -43-
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI619191B (en) * 2015-03-31 2018-03-21 Aimechatec Ltd Substrate assembly device and substrate assembly method using the same
TWI668497B (en) * 2017-03-27 2019-08-11 Hirata Corporation Manufacturing system and manufacturing method

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101247900B1 (en) * 2010-02-23 2013-03-26 가부시키가이샤 히타치플랜트테크놀로지 Liquid crystal substrate bonding system
US9132578B2 (en) * 2011-11-29 2015-09-15 Corning Incorporated Apparatus and method for skinning articles
CN103579056B (en) * 2013-10-23 2016-12-07 苏州均华精密机械有限公司 The device of adhesion semiconductor chip
CN105460287B (en) * 2015-12-18 2019-06-11 轻工业西安机械设计研究院有限公司 Packaging box piece conveying device and delivery method
KR102701612B1 (en) * 2016-11-11 2024-09-03 주식회사 탑 엔지니어링 Apparatus and method for bonding panels
JP6733966B2 (en) * 2018-07-09 2020-08-05 Ａｉメカテック株式会社 Board assembly apparatus and board assembly method
CN109822583B (en) * 2019-01-09 2021-01-05 温州大学瓯江学院 UV glue automatic coating equipment for electronic products

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002107524A (en) * 2000-09-27 2002-04-10 Matsushita Electric Ind Co Ltd Method and apparatus for manufacturing color filter, and substrate for color filter
KR100490048B1 (en) * 2001-06-19 2005-05-17 삼성전자주식회사 In-line system for manufacturing liquid crystal display and method of manufacturing liquid crystal display using the same
KR100831282B1 (en) 2002-03-18 2008-05-22 엘지디스플레이 주식회사 Manufacturing apparatus and manufacturing method of liquid crystal display device
KR100720419B1 (en) * 2002-03-22 2007-05-22 엘지.필립스 엘시디 주식회사 Fastening device
JP4373136B2 (en) * 2002-10-15 2009-11-25 芝浦メカトロニクス株式会社 Substrate assembly method and substrate assembly apparatus
KR100617034B1 (en) 2003-12-23 2006-08-30 엘지.필립스 엘시디 주식회사 Bonding apparatus for manufacturing liquid crystal display device and loading method using same
JP2007047304A (en) * 2005-08-08 2007-02-22 Sharp Corp Manufacturing apparatus and method of liquid crystal display apparatus, and liquid crystal display apparatus
JP4379435B2 (en) * 2006-05-17 2009-12-09 株式会社日立プラントテクノロジー Board assembly apparatus and board assembly method using the same
JP5104257B2 (en) * 2007-12-03 2012-12-19 株式会社日立プラントテクノロジー Substrate bonding system
KR101247900B1 (en) * 2010-02-23 2013-03-26 가부시키가이샤 히타치플랜트테크놀로지 Liquid crystal substrate bonding system

Cited By (3)

* Cited by examiner, † Cited by third party
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TWI619191B (en) * 2015-03-31 2018-03-21 Aimechatec Ltd Substrate assembly device and substrate assembly method using the same
TWI668497B (en) * 2017-03-27 2019-08-11 Hirata Corporation Manufacturing system and manufacturing method
US10684501B2 (en) 2017-03-27 2020-06-16 Hirata Corporation Manufacturing system and manufacturing method

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CN201984258U (en) 2011-09-21
CN102169253B (en) 2015-04-01
CN102169253A (en) 2011-08-31
TWI444703B (en) 2014-07-11
KR101247900B1 (en) 2013-03-26
KR20110097632A (en) 2011-08-31

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