TW202130239A - Electronic component mounting device - Google Patents

Abstract

The present invention provides an electronic component mounting device capable of suppressing an increase in the size or complexity of the device and flexibly coping with the increase in the size or complexity of the device even when an anisotropic conductive film is adhered to either the display panel side or the electronic component side. According to one embodiment, the electronic component mounting device includes: a bonding device that bonds an anisotropic conductive film to a display panel or an electronic component; a temporary crimping device for temporarily crimping the display panel or the electronic component to which the anisotropic conductive film has been adhered to the other of the display panel or the electronic component via the anisotropic conductive film; a formal crimping device, which is used for formally crimping the display panel and the electronic part which are temporarily crimped; a display panel conveying device for selectively conveying the display panel to the bonding device and the temporary crimping device; and an electronic component transport device that selectively transports the electronic components to the bonding device and the temporary crimping device.

Description

Mounting device for electronic parts

The invention relates to a mounting device for electronic parts.

In the manufacturing steps of liquid crystal displays or organic electroluminescent (Electroluminescent, EL) displays, it is known to combine film-like electronic parts such as Chip on Film (COF) or Flexible Printed Circuit (FPC) The process of assembling a panel mounted on a display panel made of glass or resin.

In the assembling step of the panel, firstly, the plurality of leads formed on the display panel and the plurality of leads formed on the electronic parts are mounted on the display panel via an anisotropic conductive film (ACF).

In addition, in recent years, in small display panels used in mobile devices such as smartphones, other electronic components such as FPCs are further mounted on the display panel such as COF via ACF.

In this type of assembly process, the mainstream used to mount electronic components through the ACF adhered to the display panel.

However, in recent years, due to the diversification of the above-mentioned mounting forms, the adhesion forms of ACFs are also diversified. For example, there are ACFs that are not only adhered to the display panel, but also adhered to the COF or FPC, and the ACF adheres to the display panel. The form of the installed COF, etc.

Therefore, a mounting device capable of flexibly coping with such diverse ACF adhesion forms is required. [Prior Art Literature]

[Patent Literature] [Patent Document 1] Japanese Patent Laid-Open No. 2006-135082

[The problem to be solved by the invention] The present invention provides an electronic component mounting device that can suppress the increase in size or complexity of the device and flexibly respond even when an anisotropic conductive film is adhered to either the display panel side or the electronic component side . [Technical means to solve the problem]

The mounting device of this embodiment is an electronic component mounting device that mounts electronic components on a display panel via an anisotropic conductive film, and includes: Bonding device for bonding the anisotropic conductive film to the display panel or the electronic component; Temporary crimping device for bonding the display panel or the electronic component with the anisotropic conductive film to the display panel or the electronic component via the bonding device via the anisotropic conductive film The other is temporarily crimped; A formal crimping device for officially crimping the display panel and the electronic component temporarily crimped by the temporary crimping device; A display panel conveying device, which selectively conveys the display panel to the bonding device and the temporary crimping device; and An electronic component conveying device selectively conveys the electronic component to the bonding device and the temporary crimping device. [Effects of the invention]

According to the present invention, even when the anisotropic conductive film is adhered to either the display panel side or the electronic component side, it is possible to suppress the increase in size or complexity of the device and to flexibly respond.

Hereinafter, an embodiment of the present invention (hereinafter referred to as an "embodiment") will be described with reference to FIGS. 1 to 3. Furthermore, the drawings are schematic drawings, and the relationship between the thickness and the plane size, the position and size of each structural part, etc. are merely convenient expressions for easy understanding of the structure, and sometimes differ from reality.

1 is a plan view showing the structure of the mounting device 1 of this embodiment, FIG. 2 is a front view showing the structure of the bonding device included in the mounting device 1, and FIG. 3 is a view showing that the mounting device 1 of this embodiment is used as a mounting object Schematic diagram of the installation method of the display panel and the electronic parts.

As shown in FIG. 1, the mounting device 1 mounts the electronic component W on the display panel P via the anisotropic conductive film F, and includes the following components: a bonding device 10, a temporary crimping device 20, a formal crimping device 30, Display panel supply unit 40, electronic component supply unit 50, first display panel conveying device 60, second display panel conveying device 70, first electronic component conveying device 80, second electronic component conveying device 90, first display panel inverted The device 100, the second display panel inverting device 110, the first electronic component inverting device 120, the second electronic component inverting device 130, the electronic component rotating device 140, the discharge unit 150, and the control device 160.

First, the bonding device 10 bonds the anisotropic conductive film F to the display panel P or the electronic component W. The temporary crimping device 20 uses the adhesive force of the anisotropic conductive film F to bond the display panel P or the electronic component W with the anisotropic conductive film F bonded to the other (the display panel P and the electronic component W are not bonded with One of the anisotropic conductive film F) is temporarily crimped. The formal crimping device 30 officially crimps the temporarily crimped display panel P and the electronic component W. The bonding device 10, the temporary crimping device 20, and the full crimping device 30 are arranged in a row in the horizontal direction in the order described above. In this embodiment, the direction along the arrangement direction is set to the X direction, the direction orthogonal to the X direction in the horizontal direction is set to the Y direction, and the direction along the arrangement direction is bonded The device 10 side is referred to as the upstream side, and the main crimping device 30 side is referred to as the downstream side.

With respect to the bonding device 10, the temporary crimping device 20, and the full crimping device 30 arranged as described above, they are arranged along the X direction on the near side in the direction (Y direction) orthogonal to the arrangement direction (X direction) The first display panel conveying device 60 and the second display panel conveying device 70 have a first electronic component conveying device 80 and a second electronic component conveying device 90 arranged on the back side along the X direction.

The display panel supply unit 40 is arranged on the upstream side of the end where the bonding device 10 of the first display panel transport device 60 is located.

The electronic component supply unit 50 is arranged on the upstream side of the end where the bonding device 10 of the first electronic component conveying device 80 is located.

The discharge portion 150 is arranged on the downstream side of the end of the second display panel conveying device 70 where the main crimping device 30 is located.

In addition, the first display panel inverting device 100 is arranged at a position between the display panel supply unit 40 and the first display panel conveying device 60. The second display panel inverting device 110 is arranged at a position between the first display panel conveying device 60 and the second display panel conveying device 70.

Furthermore, the first electronic component inverting device 120 is arranged at a position between the electronic component supply unit 50 and the first electronic component conveying device 80. The second electronic component reversing device 130 and the electronic component rotating device 140 are arranged between the first electronic component conveying device 80 and the second electronic component conveying device 90.

In addition, here, the mounting form of the display panel P and the electronic component W is demonstrated using FIG. 3. FIG. As the display panel P, a display panel made of glass or resin such as a liquid crystal display (LCD) or an organic EL panel (organic LED display (OLED)) can be used. In addition, the electronic parts can use film-like electronic parts such as FPC (Flexible printed circuits) or COF (Chip on Film).

FIG. 3(A) is a form in which the display panel P and the electronic component W are crimped through the anisotropic conductive film F bonded to the display panel P. FIG. 3(B) is a form in which the display panel P and the electronic component W are crimped through the anisotropic conductive film F bonded to the electronic component W. FIG. 3(C) is a form in which the electronic component W2 such as FPC is crimped to the electronic component W1 such as COF mounted on the display panel P, and the electronic component W1 and the electronic component W2 are pressed through the anisotropic conductive film F In the connection form, the anisotropic conductive film F is bonded to the surface of the electronic component W1 on the opposite side to the surface mounted on the display panel P. Fig. 3(D) is a form in which the electronic component W2 such as FPC is crimped onto the electronic component W1 such as COF mounted on the display panel P. The component W1 and the electronic component W2 are crimped to the surface of the electronic component W1 on the opposite side to the surface mounted on the display panel P. 3(E) is a form in which electronic components W2 such as FPC are crimped onto the electronic components W1 such as COF mounted on the display panel P, and each of the surfaces mounted on the display panel P is bonded to the electronic components W1. A form in which the electronic component W1 and the electronic component W2 are pressure-bonded to the anisotropic conductive film F. Fig. 3(F) is a form in which the electronic component W2 such as FPC is crimped to the electronic component W1 such as COF mounted on the display panel P. The component W1 and the electronic component W2 are crimped to the surface of the electronic component W1 mounted on the display panel P.

In this way, there are various forms of mounting the display panel P and the electronic component W, and there are other than the form where the electronic component W is directly mounted on the display panel P (FIG. 3(A) and FIG. 3(B)). A form in which the electronic component W2 is indirectly mounted via the electronic component W1 mounted on the display panel P (FIG. 3(C), FIG. 3(D), FIG. 3(E), and FIG. 3(F))). Therefore, in the specification of the present application, the display panel P is not only referred to as the display panel P, but the display panel P on which the electronic component W1 is mounted is also referred to as the display panel P.

Hereinafter, the structure of the mounting device 1 of the present embodiment will be described in detail.

As shown in Figures 1 and 2, the bonding device 10 includes: a pair of stages 11A and 11B arranged side by side in the X direction; and a bonding unit 12 that bonds the anisotropic conductive film F to the stage 11A , The display panel P or the electronic component W supported by the stage 11B. In addition, in FIG. 1, the moving destinations of the carrier 11A, carrier 11B, carrier 32A, carrier 32B, panel carrier 22, and transport arm 61 are indicated by broken lines, and the structure and installation are indicated by solid lines and dashed lines. The display panel P and electronic components W of each device of the device 1.

The stage 11A and the stage 11B are each supported so as to be movable in the Y direction by the Y-direction driving portion 11a. Thereby, the stage 11A and the stage 11B can move between the first display panel conveying device 60 and the first electronic component conveying device 80. That is, it is possible to move between the position L on the side of the first display panel conveying device 60 shown by the solid line in FIG. 1 and the position M on the side of the first electronic component conveying device 80 shown by the broken line. The stage 11A and the stage 11B can deliver the display panel P between the position L and the first display panel conveying device 60, and the electronic component W can be delivered between the position M and the first electronic component conveying device 80.

In addition, the stage 11A and the stage 11B include an X-direction drive portion 11b and a rotation (θ)-direction drive portion 11c, and position adjustment is also possible in the X direction and the rotation direction in the horizontal plane.

It is configured to be able to mount two display panels P and electronic components W on these stage 11A and stage 11B, respectively. Furthermore, the stage 11A and the stage 11B are configured to be replaceable, the stage 11A and the stage 11B for the display panel P are mounted when the display panel P is supported, and the stage 11A for the electronic part W is mounted when the electronic part W is supported , Carrier 11B.

The bonding unit 12 is supported by a door-shaped frame 13 which is arranged at a position approximately in the middle of the first display panel conveying device 60 and the first electronic component conveying device 80 along the X direction. In more detail, the X-direction drive unit 14 is provided on the lower surface of the horizontal portion 13 a of the frame 13. The bonding unit 12 is supported in a manner that its main body 12a hangs down to the X-direction driving portion 14. Thereby, the bonding unit 12 can be moved to each position where a total of four display panels P or the anisotropic conductive film F of the electronic component W supported on the stage 11A and the stage 11B are bonded.

The main body portion 12a of the bonding unit 12 is provided with a crimping joint 12b, a supply reel 12c, a recovery nozzle 12d, and a conveying portion 12e. The crimping joint 12b is arranged at the center of the lower part of the main body portion 12a, and includes a crimping tool 12b1 and a pressure driving portion 12b2 such as an air cylinder.

The supply spool 12c is provided on the upper right side of the crimping joint 12b. In the supply reel 12c, a tape-shaped anisotropic conductive film F is wound integrally with the release paper, and the anisotropic conductive film F can be sequentially rolled out together with the release paper and supplied.

The recovery nozzle 12d is a nozzle that sucks and recovers the release paper that is supplied from the supply reel 12c and is left after the anisotropic conductive film F is crimped to the display panel P or the electronic component W through the crimping joint 12b Release paper. The recovery nozzle 12d is provided adjacent to the left side of the supply reel 12c, and is connected to a vacuum pump not shown, so that the sucked release paper can be recovered to a recovery part not shown.

The conveyance part 12e includes a pair of guide rollers 12e1, which are provided on both sides of the crimping tool 12b1, and a feed roller 12e2, which is arranged on the lower side of the recovery nozzle 12d. Thereby, the anisotropic conductive film F unwound from the supply reel 12c can be conveyed to the lower side of the crimping tool 12b1.

The temporary crimping device 20 temporarily crimps the electronic component W to the display panel P using the adhesive force of the anisotropic conductive film F. As shown in FIG. 1, the temporary crimping device 20 includes a temporary crimping joint 21, a panel stage 22, a parts conveying part 23, a second electronic part conveying device 90, and an electronic part rotating device 140. The temporary crimping head 21 is arranged in a position substantially in the middle of the first display panel conveying device 60 and the first electronic component conveying device 80 so as to be lifted and lowered. The temporary crimping joint 21 is a member that heats and presses the electronic component W to the display panel P via the anisotropic conductive film F, and includes a heating unit and a pressurizing drive unit (not shown).

The panel stage 22 is a stage that supports the display panel P. The panel stage 22 can move the supported display panel P between the first display panel conveying device 60, the parts conveying portion 23, and the second display panel conveying device 70 by an XY direction drive unit not shown. Specifically, in FIG. 1, it can be moved to the receiving position G of the display panel P from the first display panel conveying device 60 shown by the solid line on the side of the first display panel conveying device 60, and on the side of the parts conveying section 23. The temporary crimping position H indicated by the broken line and the handover position K of the display panel P with respect to the second display panel conveying device 70 indicated by the broken line on the second display panel conveying device 70 side.

The component conveying unit 23 includes a stage 23a on which the electronic component W is placed, and a Y-direction drive unit 23b that moves the stage 23a in the Y direction. The component conveying unit 23 drives the Y-direction driving unit 23 b to move the stage 23 a on which the electronic component W is placed under the temporary crimping joint 21.

The final crimping device 30 heats and presses the electronic component W temporarily crimped to the display panel P, and then crimps the electronic component W temporarily. The formal crimping device 30 includes a formal crimping unit 31 and a pair of stages 32A and 32B. On the stage 32A and the stage 32B, two display panels P (hereinafter, simply referred to as “display panels P”) to which the electronic components W are temporarily crimped in each are respectively mounted.

The main crimping head unit 31 is arranged at a position substantially in the middle of the second display panel conveying device 70 and the second electronic component conveying device 90 in the Y direction. The full crimping unit 31 includes four full crimping contacts 31a arranged along the X direction. A spare tool (not shown) is arranged directly below each main crimping joint 31a. In this way, when performing the formal crimping with the formal crimping joint 31a, the lower surface of the display panel P is supported by a spare tool. The four main crimping joints 31a are respectively provided with a heating unit (not shown) that heats the main crimping joint 31a and a pressurizing drive unit (not shown) that applies pressure to the main crimping joint 31a. These four formal crimping joints 31a formally crimp the electronic components W temporarily crimped to the display panel P supported by the stage 32A and the stage 32B.

The stage 32A and the stage 32B are each provided so as to be movable in the Y direction by a Y-direction drive unit not shown. Thereby, the display panel P can be transferred to and from the second display panel conveying device 70 at the position N on the side of the second display panel conveying device 70 shown by the solid line, and the display panel P can be transferred to the actual pressure joint shown by the broken line. The actual pressure bonding position Q on the side of the unit 31 is supplied to the display panel P.

The display panel supply unit 40 supplies the display panel P transported from the previous step to the first display panel transport device 60. The display panel supply unit 40 includes: a mounting table 41 for mounting the display panel P transported in the previous step; a relay station 42 for transferring the display panel P to the first display panel transport device 60; and a transport unit 43 for transporting the display panel P is transported from the mounting table 41 to the relay station 42. The mounting table 41 and the relay station 42 can respectively place two display panels P arranged side by side at a predetermined interval in the X direction.

The conveying section 43 includes a conveying arm 43a that sucks and holds the display panel P from above, and an X-direction driving section 43b that moves the conveying arm 43a in the X direction. The conveyance arm 43a has a pair of arms and is configured so as to simultaneously hold the display panels P arranged at a predetermined interval.

Here, the relay station 42 is additionally provided with a processing device 42a that performs adhesion of the anisotropic conductive film F to the portion of the display panel P where the electronic component W is mounted (hereinafter referred to as "mounting portion") Improved treatment. The relay station 42 is installed so as to be movable in the X direction by an X-direction drive unit (not shown). On the movement trajectory of the installation site of the display panel P generated by the movement of the relay station 42 in the X direction, the processing device 42a is arranged to face the installation site. Thereby, by moving the relay station 42 in the X direction, the mounting location of the display panel P can be sequentially opposed to the processing device 42a to perform processing. The treatment for improving the adhesiveness of the anisotropic conductive film F is, for example, a cleaning treatment or a roughening treatment, and can be performed by wiping with a brush or irradiating plasma. In this embodiment, a brush is used. Therefore, the processing device 42a includes a rotating brush having a cylindrical outer shape and a drive unit (neither of which is shown) that rotates the rotating brush around an axis along the Y direction.

The electronic component supply unit 50 supplies the electronic components W stored in the tray T to the first electronic component transport device 80. The electronic component supply unit 50 includes: a supply/discharge device not shown, which supplies a tray T containing electronic components W, and discharges the tray T from which the electronic components W have been taken out and empty; and a relay station 51 for discharging the electronic components W It is delivered to the first electronic component conveying device 80; The relay station 51 can place two electronic components W side by side at a predetermined interval in the X direction. The not-shown transfer unit sucks and takes out the electronic components W one by one from the tray T, and transfers them to the relay station 51.

Here, similarly to the mounting table 41 of the display panel supply unit 40, the relay station 51 is additionally provided with a processing device 51a that performs various directions on the mounting position between the electronic component W and the display panel P Treatment to improve the adhesion of the opposite conductive film F.

Therefore, like the mounting table 41, the relay station 51 is installed so that it can move in the X direction by the X direction drive part which is not shown in figure. The processing apparatus 51a is provided with the plasma irradiation part (not shown). The processing by the processing device 51a can be performed in the same manner as the mounting table 41.

The first display panel conveying device 60 performs the display panel P on the mounting table 41 of the display panel supply unit 40, the mounting table 11A and the mounting table 11B of the bonding device 10, and the panel mounting table 22 (position G) of the temporary crimping device 20 Handover. The first display panel transport device 60 has the same structure as the transport section 43. That is, the first display panel transport device 60 includes a transport arm 61 having a pair of arms that suck and hold two display panels P from above, and an X-direction drive unit 62 that moves the transport arm 61 in the X direction. The X-direction drive unit 62 can move the transport arm 61 between the relay station 42 and the panel stage 22 (position G) positioned at the receiving position of the display panel P from the first display panel transport device 60. Thereby, the first display panel transport device 60 can transport the display panel P from the relay station 42 to the carrier 11A and the carrier 11B, from the relay station 42 to the panel carrier 22 (position G), and from the carrier 11A to the carrier The stage 11B is transferred to the panel stage 22 (position G).

The second display panel transport device 70 transfers the display panel P to the panel stage 22 of the temporary crimping device 20 (position K), the stage 32A of the final crimping device, the stage 32B (position N), and the discharge unit 150. Similar to the first display panel transport device 60, the second display panel transport device 70 includes: a transport arm 71 having a pair of arms that suck and hold two display panels P from above; and an X-direction drive unit 72 that makes the transport arm 71 moves in the X direction. The X-direction drive unit 72 can move the transport arm 71 between the panel stage 22 (position K) and the discharge unit 150 positioned at the transfer position of the display panel P with respect to the second display panel transport device 70. Thereby, the second display panel transfer device 70 can transfer the display panel P from the panel stage 22 (position K) to the stage 32A and stage 32B (position N), and from the stage 32A and stage 32B to the discharge section 150. In addition, the discharge portion 150 is adjacently arranged on the side opposite to the temporary crimping device 20 with respect to the main crimping device 30.

The first electronic component transport device 80 transfers the display panel P to the relay station 51 of the electronic component supply unit 50, the stage 11A and the stage 11B of the bonding device 10, and the electronic component rotation device 140 described in detail later. Similar to the first display panel conveying device 60, the first electronic component conveying device 80 includes: a conveying arm 81 having a pair of arms for sucking and holding two electronic components W from above; 81 moves in the X direction. The X-direction driving unit 82 moves the transfer arm 81 between the relay station 51 and the electronic component rotation device 140. Thereby, the first electronic component transfer device 80 can transfer the electronic component W from the relay station 51 to the stage 11A and the stage 11B, from the relay station 51 to the electronic component rotation device 140, and from the stage 11A and the stage 11B To the electronic part rotating device 140.

The second electronic component transfer device 90 transfers the electronic component W from the electronic component rotation device 140 to the component transfer portion 23 of the temporary crimping device 20. The second electronic component transport device 90 includes a transport arm 91 that sucks and holds the electronic components W one by one from above, and an X-direction drive unit 92 that moves the transport arm 91 in the X direction. The X-direction driving unit 92 can move the transport arm 91 between the electronic component rotating device 140 and the component transport unit 23. Thereby, the second electronic component transfer device 90 can transfer the electronic component W from the electronic component rotation device 140 to the stage 23 a of the component transfer section 23.

The first display panel inverting device 100, the second display panel inverting device 110, the first electronic component inverting device 120, and the second electronic component inverting device 130 invert the front and back of the display panel P or the electronic component W, respectively. The first display panel inverting device 100 is provided corresponding to the relay station 42 of the display panel supply unit 40, and the second display panel inverting device 110 corresponds to the panel stage 22 of the temporary crimping device 20, and the display panel P is opposite to The delivery position K of the second display panel conveying device 70 is provided. In addition, the first electronic component reversing device 120 is provided corresponding to the relay station 51 of the electronic component supply unit 50, and the second electronic component reversing device 130 is provided corresponding to the electronic component rotating device 140. These inverting device 100, inverting device 110, inverting device 120, and inverting device 130 share the same structure. Therefore, only the structure of the first display panel inverting device 100 will be described, and other inverting devices 110 and inverting devices will be omitted. 120. Description of the structure of the inversion device 130.

The first display panel inverting device 100 includes: a pair of left and right holding parts 101, 101, which suck and hold the display panel P; a rotation driving part 102, a rotation driving part 102, so that the holding part 101 and the holding part 101 are aligned along the Y direction The shaft is rotated at the center; the lift drive unit 103 moves the holding unit 101 and the holding unit 101 together with the rotation drive unit 102 and the rotation drive unit 102 up and down; and the Y-direction drive unit 104 makes the holding unit 101 and the holding unit 101 and the rotation drive The section 102, the rotation drive section 102, and the elevation drive section 103 move together in the Y direction. The Y-direction driving unit 104 can move the holding unit 101 and the holding unit 101 to a position on the relay station 42 and a position to retract from the relay station 42.

In the case where the display panel P supplied from the display panel supply part 40 needs to be reversed front and back, the first display panel reversing device 100 operates as follows.

First, the holding unit 101 and the holding unit 101 are moved to positions on the relay station 42. In this position, the two display panels P conveyed by the conveying section 43 are received on the upper surfaces of the holding section 101 and the holding section 101. After the display panel P is sucked and held by the holding portion 101 and the holding portion 101, the front and back of the holding portion 101 and the holding portion 101 are reversed by the rotation drive portion 102 and the rotation drive portion 102, that is, reversed 180°. Thereby, the display panel P is reversed from the front and back. After that, the holding part 101 and the holding part 101 are lowered by the raising and lowering drive part 103, and the display panel P is placed on the relay station 42. Finally, the Y-direction driving unit 104 is used to retract the holding unit 101 and the holding unit 101 from the relay station 42. In the above operation, the other reversing device 110, the reversing device 120, and the reversing device 130 are also the same.

The electronic component rotation device 140 is a device that rotates the orientation of the electronic component W transported from the bonding device 10 to the temporary crimping device 20 by 180° in a horizontal plane. The electronic component rotating device 140 doubles as a relay station for the electronic component W transported from the bonding device 10 to the temporary crimping device 20. The electronic component rotating device 140 includes a mounting table 141 capable of placing two electronic components W arranged at a predetermined interval in the X direction; and a rotation drive unit (not shown) capable of placing the mounting table 141 at an arbitrary angle in the horizontal plane. Spin. Thereby, when rotation of the orientation of the electronic component W is required, the electronic component rotation device 140 can rotate the orientation of the electronic component W by 180° by rotating the mounting table 141 on which the electronic component W is placed.

The discharge unit 150 is a relay unit for conveying the display panel P (display panel P with electronic components W) after the main pressure bonding is completed to a subsequent step. As described above, the discharge portion 150 is arranged adjacent to the main crimping device 30 on the side opposite to the temporary crimping device 20 in the X direction. The discharge unit 150 includes a mounting table 151 on which two display panels P can be arranged and mounted at a predetermined interval in the X direction.

The control device 160 controls the bonding device 10, the temporary crimping device 20, the formal crimping device 30, the display panel supply unit 40, the electronic component supply unit 50, the first display panel conveying device 60, the second display panel conveying device 70, and the An electronic component conveying device 80, a second electronic component conveying device 90, a first display panel inverting device 100, a second display panel inverting device 110, a first electronic component inverting device 120, and a second electronic component inverting device 130 And the operation of each of the electronic component rotating device 140 is controlled.

Next, the operation of the mounting device 1 of this embodiment will be described.

In addition, in this embodiment, the form in which the electronic component W is not mounted on the display panel P, ie, the form of FIG. 3 (A) or FIG. 3 (B), is mainly demonstrated. In addition, the following operations are executed based on the control of the control device 160.

First, the two display panels P conveyed from the previous step are sucked and held on the mounting table 41 of the display panel supply unit 40 by the conveying arm 43 a of the conveying unit 43, and are transferred to the relay station 42. At this time, in the case where the front and back of the display panel P needs to be inverted, such as the surface of the display panel P with the electronic components W being transported to the mounting table 41 facing downwards, the display panel P is displayed by the first display panel inverting device 100. After being reversed, it is handed over to the repeater 42.

When the display panel P is handed over at the relay station 42, the processing device 42a performs processing to improve the adhesion to the anisotropic conductive film F.

On the other hand, in the tray T, the mounting position of the electronic component W via the anisotropic conductive film F is set to the back side of the mounting device 1, and the electronic component W is stored with the mounted surface facing upward. . In the electronic component supply unit 50, the electronic components W stored in the tray T are taken out one by one by a transfer unit (not shown), and the two electronic components W are delivered to the relay station 51. At this time, when the front and back of the electronic part W needs to be reversed, such as the surface of the electronic part W accommodated in the tray T, which is mounted on the display panel P, faces downward, the electronic part W passes through the front and back of the first electronic part reversing device 120 After being reversed, it is handed over to the relay station 51.

When the electronic component W is delivered to the relay station 51, the processing device 51a performs processing for improving the adhesion to the anisotropic conductive film F.

Thereafter, the display panel P is transported from the relay station 42 by the first display panel transport device 60, the electronic component W is transported from the relay station 51 by the first electronic component transport device 80, and the anisotropic conductive film F is bonded to the display In the case of the panel P and in the case of bonding the anisotropic conductive film F to the electronic component W, the following operations are selectively performed.

First, the case where the anisotropic conductive film F is adhered to the display panel P will be described (FIG. 3(A) ). In this case, the first display panel transport device 60 transports the display panel P on the relay station 42 to the stage 11A and the stage 11B of the bonding device 10 positioned at the position L shown by the solid line in FIG. 1 So that the mounting part of the display panel P where the anisotropic conductive film F is bonded is located on the back side. Furthermore, with respect to one relay station 42, there are two stages 11A and 11B. Therefore, the first display panel conveying device 60 is controlled to alternately convey two display panels to the two stages 11A and 11B. P.

On the other hand, the first electronic component conveying device 80 is controlled so that the electronic component W on the relay station 51 is directly transferred through the bonding device 10 to the mounting table 141 of the electronic component rotating device 140.

Here, when the display panel P is transported and placed on the stage 11A and the stage 11B, the stage 11A and the stage 11B are moved so that the mounting position of the display panel P is located in each direction by the bonding unit 12 Adhesive position of the opposite conductive film F. In this state, the bonding unit 12 is moved to each display panel P on the stage 11A and the stage 11B by the X-direction drive unit 14 (refer to FIG. 3), and is controlled to bond the anisotropic conductive film F Connect to the installation location of each display panel P. When the bonding of the anisotropic conductive film F is completed, the stage 11A and the stage 11B move to the position L shown by the solid line in FIG.

Thereafter, the display panel P on the stage 11A and the stage 11B is transported by the first display panel transport device 60 to the panel stage 22 of the temporary crimping device 20 positioned at the position G indicated by the solid line in FIG. 1.

On the other hand, the electronic component W transported to the mounting table 141 is rotated by 180° in the horizontal direction by the electronic component rotating device 140. That is, in the electronic component W transported to the mounting table 141, the part to be mounted via the anisotropic conductive film F is the back side of the mounting device 1, and the mounting part is to be the front side (the display panel side) of the mounting device 1 , And rotate 180°. In addition, in the tray T, when the position where the electronic component W is mounted via the anisotropic conductive film F is set to the front side of the mounting device 1 and the electronic component W is accommodated, the electronic component rotating device 140 does not perform any operation . After that, the electronic component W on the mounting table 141 is conveyed to the mounting table 23 a of the component conveying section 23 of the temporary crimping device 20 by the second electronic component conveying device 90.

Next, the case where the anisotropic conductive film F is bonded to the electronic component W will be described (FIG. 3(B)). In this case, the first display panel transport device 60 is controlled to transport the display panel P on the relay station 42 through the bonding device 10 to the temporary pressure positioned at the position G shown by the solid line in FIG. 1 Connect the panel carrier 22 of the device 20. On the other hand, the first electronic component transport device 80 is controlled to transport the electronic components W on the relay station 51 to the stage 11A of the bonding device 10 positioned at the position M indicated by the dotted line in FIG. On the carrier 11B.

Here, the operation performed by the bonding device 10 and the operation performed by the electronic component rotating device 140 are the same as those in the case of bonding the anisotropic conductive film F to the display panel P, so the description here is omitted. In the mounting device of the embodiment, the location of the electronic component W where the anisotropic conductive film F is bonded is positioned and placed on the back side of the stage 11A and the stage 11B of the bonding device 10 so as to be bonded to the electronic components. The anisotropic conductive film F of the component W and the anisotropic conductive film F bonded to the display panel P are bonded with the same precision.

When the adhesion of the anisotropic conductive film F to the electronic component W is completed, the electronic component W is transported to the mounting table 141 of the electronic component rotating device 140 by the first electronic component transport device 80, and is moved by the electronic component rotating device 140 The orientation in the horizontal direction is rotated by 180° as described above. After that, the electronic component W on the mounting table 141 is conveyed to the mounting table 23 a of the component conveying section 23 of the temporary crimping device 20 by the second electronic component conveying device 90.

When the display panel P is conveyed to the panel stage 22 (position G) of the temporary crimping device 20 and the electronic component W is conveyed to the stage 23 a of the component conveying unit 23, the temporary crimping by the temporary crimping device 20 is performed. First, the stage 23 a of the component conveying unit 23 is moved below the temporary crimping joint 21, and the electronic component W on the stage 23 a is positioned under the temporary crimping joint 21. In this state, the temporary crimping joint 21 descends, and the electronic component W on the stage 23a is sucked and held by the temporary crimping joint 21. The temporary crimping joint 21 lifts up after the electronic component W is sucked and held. Then, after the stage 23a is retracted to the position shown by the solid line in FIG. 1, the panel stage 22 moves to the temporary crimping position H shown by the dotted line in FIG. At the temporary crimping position H, the display panel P and the electronic component W are temporarily crimped through the anisotropic conductive film F by the temporary crimping joint 21. After the temporary crimping is completed, the temporary crimping head 21 releases the suction hold of the electronic component W and rises. The panel stage 22 moves to the handover position K shown by the dotted line in FIG. 1.

When the panel stage 22 moves to the delivery position K, the display panel P is transported by the second display panel transport device 70 to the carrier 32A at the delivery position N shown by the solid line in FIG. Taiwan 32B. In addition, there is one panel stage 22. In contrast, there are two stages 32A and 32B. Therefore, the second display panel conveying device 70 is controlled to alternately convey each of the two stages 11A, 11B. Two display panels P.

Here, in the case where the display panel P whose temporary crimping is completed needs to be reversed before the actual crimping, the display panel P on the panel stage 22 at the handover position is replaced by the second display panel inverting device 110 The case back is reversed. In this case, the display panel P is conveyed from the second display panel reversing device 110 by the second display panel conveying device 70.

When the display panel P is transported to the stage 32A and the stage 32B, the final crimping device 30 performs the final crimping. That is, the stage 32A and the stage 32B are moved to the final crimping position Q shown by the broken line in FIG. Then, the full crimping is performed by the full crimping joint 31a at a predetermined time, a predetermined temperature, and a pressure. When the actual pressure bonding is completed, the stage 32A and the stage 32B move to the transfer position N shown by the solid line in FIG. 1 with the second display panel conveying device 70.

When the stage 32A and the stage 32B move to the transfer position N, the display panel P on the stage 32A and the stage 32B is transferred to the stage 151 of the discharge unit 150 by the second display panel transfer device 70, and is supplied to the rear step.

By repeatedly performing such operations, the electronic components W are mounted on the plurality of display panels P.

The mounting device 1 according to the present embodiment includes: a first display panel transport device 60 that selectively transports the display panel P to the bonding device 10 and the temporary crimping device 20; and a first electronic component transport device 80, The electronic component W is selectively transported to the bonding device 10 and the temporary crimping device 20.

Therefore, when the electronic component W is mounted on the display panel P via the anisotropic conductive film F, when the anisotropic conductive film F is adhered to the display panel P, both when the anisotropic conductive film F is adhered to the electronic component W Able to respond flexibly. In addition, the first display panel conveying device 60 and the first electronic component conveying device 80 are configured to convey the display panel P and the electronic component W to the common bonding device 10, and it is not necessary to install dedicated devices on the display panel P and the electronic component W. The bonding device 10 can therefore prevent the mounting device 1 from increasing in size or complexity.

In addition, it is assumed that when bonding the anisotropic conductive film F to the display panel P, the control device 160 controls the first display panel conveying device 60 so that the display panel P is conveyed to the bonding device 10, and the The display panel P with the anisotropic conductive film F adhered to the bonding device 10 is transported to the temporary crimping device 20, and the control device 160 controls the first electronic component transport device 80 to transport the electronic components without going through the bonding device 10 W is transported to the temporary crimping device 20, and when the anisotropic conductive film F is bonded to the electronic component W, the control device 160 controls the first electronic component transport device 80 so that the electronic component W is transported to the bonding device 10 , And the electronic component W with the anisotropic conductive film F bonded by the bonding device 10 is transported to the temporary crimping device 20, and the control device 160 controls the first display panel transport device 60 so as not to pass through the bonding device 10 Then, the display panel P is transported to the temporary crimping device 20.

Thereby, even in the case where the anisotropic conductive film F is bonded to any one of the display panel P and the electronic component W, it can be easily handled.

In addition, it is assumed that a second electronic component reversing device 130 that reverses the front and back of the electronic component W transported from the bonding device 10 to the temporary crimping device 20 is provided so that the anisotropic conductivity is bonded through the bonding device 10 The front and back of the electronic component W of the film F are reversed and transported to the temporary crimping device 20.

Thereby, even when the electronic component W is temporarily crimped with respect to the display panel P with the mounting portion of the electronic component W facing downward, the anisotropic conductive film F can be bonded using the bonding device 10 shared with the display panel P By connecting to the electronic component W, it is also possible to suppress an increase in size or complexity of the mounting device 1.

In addition, it is assumed that the electronic component rotating device 140 that rotates the direction of the electronic component W transported to the temporary crimping device 20 in a horizontal plane is provided, and the mounting location between the electronic component W transported to the temporary crimping device 20 and the display panel P It is conveyed to the display panel P side of the temporary crimping device 20.

Thereby, even if the mounting location between the electronic component W and the display panel P conveyed to the temporary crimping device 20 of the electronic components W stored in the tray T is not on the side of the display panel P conveyed to the temporary crimping device 20 In the state, it can match the orientation required for temporary crimping. Therefore, it is possible to bond the anisotropic conductive film F to the electronic component W using the bonding device 10 shared with the display panel P, and thereby, it is also possible to suppress the increase in size or complexity of the mounting device 1 and to flexibly cope with the electronics Installation of parts.

In addition, suppose that the bonding device 10, the temporary crimping device 20, and the full crimping device 30 are arranged in a row, on one side of the direction (the Y direction) crossing (orthogonal to) the arrangement direction (X direction) (On the front side), the first display panel conveying device 60 and the second display panel conveying device 70 are arranged, and the first electronic component conveying device 80 and the second electronic component conveying device 90 are arranged on the other side (rear side).

By configuring as described above, the conveying path of the display panel P and the conveying path of the electronic component W to be conveyed to the common bonding device 10 can be separated without intersecting. Therefore, it is possible to simplify the structure of the conveyance path of the display panel P and the conveyance path of the electronic component W, and thereby it is also possible to suppress the increase in size or complexity of the mounting device 1.

Furthermore, it is configured to be able to move the stage 11A and the stage 11B of the bonding device 10 between the first display panel conveying device 60 and the first electronic component conveying device 80 by the Y-direction driving unit 11 a.

By configuring as described above, even if the first display panel transport device 60 and the first electronic component transport device 80 transport the display panel P and the electronic component W in only one direction (X direction), the display panel P The electronic component W and the electronic component W are transported to the common bonding device 10, whereby the size or complexity of the mounting device 1 can also be suppressed.

It is assumed that a treatment to improve the adhesiveness of the anisotropic conductive film F is provided at the position where the anisotropic conductive film F is bonded to the display panel P that is transported to the bonding device 10 by the first display panel transport device 60 A device 42a, and an electronic component W transported to the bonding device 10 by the first electronic component transport device 80 at the location where the anisotropic conductive film F is adhered, is provided with a process for improving the adhesion of the anisotropic conductive film Processing device 51a. In addition, the processing device 42a and the processing device 51a are configured to include a display panel P, a rotating brush for wiping a portion of the electronic component W where the anisotropic conductive film F is adhered, or a plasma irradiation part that irradiates plasma.

Thereby, the area where the display panel P or the electronic component W adheres to the anisotropic conductive film F can be roughened and cleaned, and the adhesion of the anisotropic conductive film F can be improved, so that reliable mounting can be achieved.

The embodiments of the present invention have been described above, but the embodiments are only examples and are not intended to limit the scope of the invention. These novel embodiments described above can be implemented in various other ways, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments are included in the scope or spirit of the invention, and are included in the invention described in the scope of the invention application.

In the description of the embodiment of the present invention, it is assumed that the electronic component W is transferred from the relay station 51 to the stage 11A and the stage 11B of the bonding apparatus 10, and from the relay station 51 to the electronic component. The mounting table 141 of the component rotating device 140 is transferred from the mounting table 11A and the mounting table 11B to the mounting table 141, and the electronic component W is transferred from the mounting table 141 to the mounting table 23a of the parts conveying section 23 by the second electronic component conveying device 90, However, the first electronic component transport device 80 may also be transported by the second electronic component transport device 90.

In the former described above, while the electronic component W is transferred from the relay station 51 to the stage 11A and the stage 11B, the electronic component W can be transferred from the electronic component rotating device 140 to the stage 23a, so that the electronic component can be improved. W installation efficiency. In the latter, the second electronic component conveying device 90 can be omitted, so it is estimated that cost and size can be saved.

In addition, the form in which the electronic component W is not mounted on the display panel P, that is, the form of Fig. 3(A) or Fig. 3(B), has been mainly described, but it is of course also possible to cope with other forms, that is, the form of Fig. 3 ( C)-The form of (F) in Fig. 3.

In these cases, it may be based on the orientation of the front and back of the display panel P transported in the previous step, the orientation of the front and back of the electronic component W contained in the tray T, and the display panel when the actual crimping device 30 is used for the actual crimping. For the orientation of the front and back of P, inverting devices such as the first display panel inverting device 100, the second display panel inverting device 110, the first electronic component inverting device 120, and the second electronic component inverting device 130 are selectively used The front and back of the display panel P or the electronic component W are reversed.

Furthermore, in the above-described embodiment, the processing device 42a of the display panel P includes a rotating brush, and the processing device 51a of the electronic component W includes a plasma irradiation unit, but it is not limited to this, and the processing device 42a may include plasma irradiation. Section, the processing device 51a includes a rotating brush, but the two processing devices 42a and 51a may include a rotating brush and a plasma irradiation section. In short, the structure is not limited as long as it can be processed to improve the adhesion of the anisotropic conductive film F to the portion of the display panel P or the electronic component W where the anisotropic conductive film F is bonded.

1: Install the device 10: Bonding device 11A, 11B, 23a, 32A, 32B: carrier 11a, 23b, 104: Y direction drive unit 11b, 14, 43b, 62, 72, 82, 92: X-direction drive unit 11c: Rotation (θ) direction drive unit 12: Bonding unit 12a: body part 12b: crimping joint 12b1: crimping tool 12b2: Pressure driving part 12c: supply reel 12d: Recovery nozzle 12e, 43: Transport Department 12e1: guide roller 12e2: Feed roller 13: frame 13a: Horizontal part 20: Temporary crimping device 21: Temporarily press the joint 22: Panel stage 23: Parts handling department 30: Formal crimping device 31: Formal crimping unit 31a: Formal crimping joint 40: Display panel supply unit 41, 141, 151: mounting table 42, 51: Repeater 42a, 51a: processing device 43a, 61, 71, 81, 91: transfer arm 50: Electronic parts supply department 60: The first display panel conveying device 70: The second display panel conveying device 80: The first electronic component conveying device 90: The second electronic part conveying device 100: The first display panel inversion device 101: holding part 102: Rotary drive unit 103: Lifting drive 110: The second display panel inverting device 120: The first electronic part reversal device 130: The second electronic part reversing device 140: Rotating device for electronic parts 150: discharge part 160: control device F: Anisotropic conductive film G: receiving location H: Temporary crimping position K, N: transfer position L, M: location P: display panel Q: Formal crimping position T: Tray W, W1, W2: electronic parts

Fig. 1 is a plan view showing a schematic configuration of a mounting device according to an embodiment. Fig. 2 is a front view showing the structure of the bonding device included in the mounting device of the embodiment. Fig. 3 is a schematic diagram showing a mounting method of a display panel and an electronic component using the mounting device of the embodiment as a mounting target.

1: Install the device

10: Bonding device

11A, 11B, 23a, 32A, 32B: carrier

11a, 23b, 104: Y direction drive unit

43b, 62, 72, 82, 92: X direction drive unit

43: Transport Department

13: frame

20: Temporary crimping device

21: Temporarily press the joint

22: Panel stage

23: Parts handling department

30: Formal crimping device

31: Formal crimping unit

31a: Formal crimping joint

40: Display panel supply unit

41, 141, 151: mounting table

42, 51: Repeater

42a, 51a: processing device

43a, 61, 71, 81, 91: transfer arm

50: Electronic parts supply department

60: The first display panel conveying device

70: The second display panel conveying device

80: The first electronic component conveying device

90: The second electronic part conveying device

100: The first display panel inversion device

101: holding part

102: Rotary drive unit

103: Lifting drive

110: The second display panel inverting device

120: The first electronic part reversal device

130: The second electronic part reversing device

140: Rotating device for electronic parts

150: discharge part

160: control device

G: receiving location

H: Temporary crimping position

K, N: transfer position

L, M: location

P: display panel

Q: Formal crimping position

T: Tray

W: Electronic parts

Claims (9)

An electronic component mounting device, characterized in that it is an electronic component mounting device for mounting electronic components on a display panel via an anisotropic conductive film, and the electronic component mounting device includes: Bonding device for bonding the anisotropic conductive film to the display panel or the electronic component; Temporary crimping device for bonding the display panel or the electronic component with the anisotropic conductive film to the display panel or the electronic component via the bonding device via the anisotropic conductive film The other is temporarily crimped; A formal crimping device, which officially crimps the display panel and the electronic component temporarily crimped by the temporary crimping device; A display panel conveying device, which selectively conveys the display panel to the bonding device and the temporary crimping device; and An electronic component conveying device selectively conveys the electronic component to the bonding device and the temporary crimping device. The electronic component mounting device according to claim 1, which includes: A control device that controls the display panel conveying device and the electronic component conveying device, and When bonding the anisotropic conductive film to the display panel, the control device controls the display panel transporting device so that the display panel is transported to the bonding device and will pass through The display panel on which the anisotropic conductive film is bonded by the bonding device is transported to the temporary crimping device, and the control device controls the electronic component transport device so as not to pass through the bonding Device to transport the electronic components to the temporary crimping device, When bonding the anisotropic conductive film to the electronic component, the control device controls the electronic component conveying device so that the electronic component is conveyed to the bonding device and passed through The electronic component to which the anisotropic conductive film is bonded by the bonding device is transported to the temporary crimping device, and the control device controls the display panel transport device so as not to pass through the bonding Device to transport the display panel to the temporary crimping device. The electronic component mounting device according to claim 1, which includes: The reversing device reverses the front and back of the display panel or the electronic component. The electronic component mounting device according to any one of claim 1 to claim 3, wherein: The bonding device, the temporary crimping device and the formal crimping device are arranged in a row, The display panel conveying device is disposed on one side of the bonding device that intersects the arrangement direction, The electronic component conveying device is arranged on the other side intersecting the arrangement direction with respect to the bonding device. The electronic component mounting device according to claim 4, wherein: The bonding device includes a carrier that supports the display panel or the electronic component to which the anisotropic conductive film is bonded, The stage is configured to be movable in a direction crossing the arrangement direction, so that the display panel or the electronic components can be transferred between the display panel conveying device and the electronic component conveying device. The electronic component mounting device according to any one of claim 1 to claim 5, wherein: The temporary crimping device includes an electronic component rotating device that rotates the direction of the electronic component conveyed to the temporary crimping device in a horizontal plane. The electronic component mounting device according to any one of claim 1 to claim 6, which includes: A processing device for improving the adhesion of the anisotropic conductive film to the portion where the anisotropic conductive film is bonded to the display panel that is transported to the bonding device by the display panel conveying device deal with. The electronic component mounting device according to any one of claim 1 to claim 7, which includes: A processing device for improving the adhesion of the anisotropic conductive film to the portion where the anisotropic conductive film is bonded to the electronic component that is transferred to the bonding device by the electronic component transfer device deal with. The electronic component mounting device according to claim 7 or 8, wherein: The processing device includes: a rotating brush that is slidably connected to the part; and a driving part that rotates the brush.

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