JP5845446B2 - Component mounting apparatus and component mounting method - Google Patents

Description

  The present invention relates to a component mounting apparatus and a component mounting method for manufacturing a liquid crystal panel substrate by mounting a component on a substrate and then pressing the component on the substrate.

  2. Description of the Related Art Conventionally, a component mounting apparatus for manufacturing a liquid crystal panel substrate that manufactures a liquid crystal panel substrate by mounting components on the substrate is known (for example, see Patent Document 1). Such a component mounting apparatus for manufacturing a liquid crystal panel substrate receives a substrate mounting unit that receives two substrates sent from the upstream process side by two substrate receiving stages, in addition to a component mounting unit that mounts components on the substrate. And a substrate transfer unit that transfers the substrate received by the substrate receiving unit to the component mounting unit, and the substrate transfer unit is arranged at an interval between two substrate receiving stages included in the substrate receiving unit. Two pickup devices are simultaneously picked up by one pickup means and transferred to the component mounting portion.

  Such component mounting apparatuses include a component mounting for a first size (small size) board and a second size (large size) board that is larger than the first size board. There is a component mounting for the target. Here, when a component mounting apparatus that mounts a component on a small-sized board places two large-sized boards on two board receiving stages, the two boards interfere with each other. Therefore, a component mounting apparatus that mounts a component on a large-sized board must be separated from a component mounting apparatus that mounts a component on a small-sized board. On the other hand, in a board production line for mounting components, it is necessary to incorporate two types of component mounting apparatuses corresponding to two types of large and small boards into the board production line.

JP-A-6-75199

  However, as described above, when the two types of component mounting apparatuses corresponding to the two types of large and small boards are respectively incorporated in the board production line, there are a plurality of board production lines, which is disadvantageous in terms of cost. It was.

  Therefore, the present invention can mount components on both a small-sized board and a large-sized board, and can integrate a production line for two large and small-sized boards. It is another object of the present invention to provide a component mounting method.

The component mounting apparatus according to claim 1 is a component mounting apparatus including a component mounting unit that performs component mounting on a substrate, and sets an interval between two substrate receiving stages as a first interval and performs an upstream process. Receiving two substrates of the first size sent from the side, or setting the interval between the two substrate receiving stages to a second interval larger than the first interval, and sending the substrate from the upstream process side. A substrate receiving unit that receives two substrates of a second size that is larger than the first size substrate, and the first size or the second size received by the substrate receiving unit. A board transfer unit that transfers the board to the component mounting unit, and the board transfer unit receives the second board when the board receiving unit receives the two substrates of the second size. The second size of Sheets were transferred to the component mounting unit one by one individually substrate, when the substrate receiving portion receives the two substrates of the first size, two of the received the first size Are simultaneously transferred to the component mounting portion .

A component mounting apparatus according to a second aspect is the component mounting apparatus according to the first aspect , wherein the component mounting section has the first size transferred by the board transfer section at the same time. a substrate holding portion for holding the substrate of the second size one by one have been transferred separately by the substrate or the substrate transfer unit, is adhered an adhesive member on the substrate held by the substrate holding portion adhesive The component attaching operation unit, the component mounting operation unit for mounting the component on the substrate to which the adhesive member is adhered by the adhesive member attaching operation unit, and the component mounting on the substrate on which the component is mounted in the component mounting operation unit A component crimping working unit for crimping a component mounted in the working unit, wherein the substrate holding unit holds the first substrate holding stage or the second size simultaneously holding the two substrates of the first size. A second substrate holding one of the substrates Has become can be mounted the stage selectively.

The component mounting apparatus according to claim 3 is the component mounting apparatus according to claim 2 , wherein the substrate transfer unit adjusts the two substrate reception stages to the first interval by the substrate receiver. And two pickup means arranged at intervals at which the two substrates having the first size received at the same time can be picked up at the same time. When two substrates of the first size are received with the receiving stage adjusted to the first interval, the two substrates of the first size are simultaneously picked up by the two pickup means. Transfer to the substrate holder.

The component mounting apparatus according to claim 4 is the component mounting apparatus according to claim 3 , wherein the substrate transfer unit adjusts the two substrate reception stages to the second interval by the substrate receiver. When the two substrates having the second size are received in this state, one of the two substrates having the second size is picked up and transferred to the substrate holder. Then, after the substrate receiving unit adjusts the two substrate receiving stages to the first interval, the other one of the two pickup means picks up the remaining one substrate of the second size. To the substrate holder.

The component mounting method according to claim 5 is a component mounting method by a component mounting apparatus including a component mounting unit that performs component mounting on a board, and sets an interval between two board receiving stages as a first interval. Then, two substrates of the first size sent from the upstream process side are received, or the interval between the two substrate receiving stages is set to a second interval larger than the first interval, and the upstream A substrate receiving step of receiving two substrates of a second size larger than the first size substrate sent from the process side; and the first size or the first received in the substrate receiving step A board transfer step of transferring a board having a size of 2 to the component mounting unit, wherein the board transfer process receives the second board of the second size in the board receiving process. ,That Only taken and transferred to the component mounting unit one by one separately two substrates of the second size, when receiving the two substrates of the first size at the substrate receiving step, the The received two substrates of the first size are simultaneously transferred to the component mounting portion .

  In the present invention, the interval between the two substrate receiving stages is set to the first interval to receive two substrates of the first size (small size) sent from the upstream process side, or two substrate receiving stages. Two substrates of a second size (large size) larger than the first size substrate sent from the upstream process side with the interval of 2 set to a second interval larger than the first interval To receive. When two substrates of the second size are received, the received two substrates of the second size are individually transferred to the component mounting unit one by one. Since component mounting can be performed on either the one-size board or the second-size board, it is possible to unify the production lines for large and small two-size boards.

The top view of the component mounting apparatus in one embodiment of this invention The figure which shows the advancing procedure of the component mounting operation | work with respect to the board | substrate by the component mounting apparatus in one embodiment of this invention The block diagram which shows the control system of the component mounting apparatus in one embodiment of this invention (A) (b) The figure which shows the structure of the board | substrate receiving part with which the component mounting apparatus in one embodiment of this invention is provided. (A) (b) The perspective view of the ACF sticking operation part with which the component mounting apparatus in one embodiment of this invention is equipped, and a left board | substrate transfer part (A) (b) The perspective view of the ACF sticking operation part with which the component mounting apparatus in one embodiment of this invention is equipped, and a left board | substrate transfer part (A) (b) (c) The figure which shows the execution procedure of the sticking operation | work of the ACF tape by the ACF sticking operation | work part in one embodiment of this invention. (A) (b) The perspective view of the component mounting operation part with which the component mounting apparatus in one embodiment of this invention is equipped, and a center board | substrate transfer part (right board | substrate transfer part) (A) (b) The perspective view of the component mounting operation part with which the component mounting apparatus in one embodiment of this invention is equipped, and a center board | substrate transfer part (right board | substrate transfer part) The flowchart which shows the execution procedure of the component mounting operation | work by the component mounting operation | work part in one embodiment of this invention (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting operation part in one embodiment of this invention. (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting operation part in one embodiment of this invention. (A) (b) The perspective view of the 1st component crimping operation part (2nd component crimping operation part) and the left board | substrate transfer part (right board transfer part) with which the component mounting apparatus in one embodiment of this invention is equipped. Figure (A) (b) The perspective view of the 1st component crimping operation part (2nd component crimping operation part) and the left board | substrate transfer part (right board transfer part) with which the component mounting apparatus in one embodiment of this invention is equipped. Figure (A) (b) (c) The figure which shows the execution procedure of the component crimping operation | work by the 1st component crimping operation part (2nd component crimping operation part) in one embodiment of this invention. The flowchart which shows the procedure of the component crimping operation which the component mounting apparatus in one embodiment of this invention performs (A)-(f) The figure which shows the execution procedure of the component crimping operation | work by the 1st component crimping operation part (2nd component crimping operation part) in one embodiment of this invention. (A) (b) The figure which shows the structure of the board | substrate delivery part with which the component mounting apparatus in one embodiment of this invention is provided. The perspective view of the board | substrate transfer part in one embodiment of this invention The fragmentary top view of the component mounting apparatus in one embodiment of this invention (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention (A) (b) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention (A) (b) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention

  Embodiments of the present invention will be described below with reference to the drawings. A component mounting apparatus 1 for manufacturing a liquid crystal panel substrate shown in FIG. 1 has an ACF tape as an adhesive member on an electrode portion 2a provided at one end of four sides of a rectangular panel-like substrate 2 shown in FIG. After attaching 3, the component 4 is mounted on the attached ACF tape 3 (preliminary pressure bonding) and then pressure bonded (main pressure bonding) to perform component mounting work for mounting the component 4 on the substrate 2. The component 4 used here is, for example, a drive circuit component and has a film-like portion 4a.

  In FIG. 1, a base 11 of the component mounting apparatus 1 includes a left base 11 a and a center base from the left in the left-right direction as viewed from the operator OP (the left-right direction in FIG. 1 and the X-axis direction). 11b and the right base 11c are arranged in this order, the left base 11a has a board receiving part 21, the central base 11b has a component mounting part 22, and the right base 11c has a board delivery part 23. Is provided. The operations of the board receiving unit 21, the component mounting unit 22, and the board passing unit 23 are controlled by a control device 24 (FIG. 3) as control means. The board 2 flows in the X-axis direction from the left side to the right side, that is, in order of the board receiving part 21, the component mounting part 22, and the board delivery part 23, and is sequentially processed.

  In FIG. 1, the substrate receiving unit 21 has two substrate receiving stages 21s on the left side (upstream process side) and the right side (downstream process side). These two board receiving stages 21s are provided so as to be movable up and down with respect to the left base 11a, and the two boards 2 sent from the upstream process side of the component mounting apparatus 1 to the two board receiving stages 21s. Is placed.

  As shown in FIG. 4, the right substrate receiving stage 21s is fixed to the left base 11a, and the left substrate receiving stage 21s can be moved on the left base 11a in the X-axis direction. . The component mounting apparatus 1 can perform a component mounting operation on a substrate 2 having a size different in size. For example, when performing a component mounting operation on a substrate 2 having a first size (hereinafter referred to as a small size), The interval between the two substrate receiving stages 21s is set to an interval (referred to as a first interval) at which two small-sized substrates 2 can be received without causing mutual interference (refer to FIG. 4A). When a component mounting operation is performed on a substrate 2 of a second size (hereinafter referred to as a large size) that is larger than the size of the substrate 2, the interval between the two substrate receiving stages 21 s is greater than the first interval. An interval (referred to as a second interval) at which two large and large substrates 2 can be received without interfering with each other is set (FIG. 4B).

  The component mounting unit 22 is an ACF adhering unit 22 a (adhesive member adhering unit) that performs an operation of adhering the ACF tape 3 that is an adhesive member to the substrate 2, and a component that performs the operation of mounting the component 4 on the substrate 2. Two component crimping work sections (first component crimping work) for crimping the component 4 mounted by the component mounting work section 22b to the board 2 on which the component 4 mounting work has been performed in the mounting work section 22b and the component mounting work section 22b Part 22c and second component crimping work part 22d).

  The ACF attaching work part 22a is provided in the left area of the central base 11b, and the component mounting work part 22b is provided in the central area of the central base 11b. The first component crimping work part 22c is provided in a region between the ACF adhering work part 22a and the component mounting work part 22b on the central base 11b, and the second component crimping work part 22d is the central base. It is provided in the area on the right side of the component mounting work part 22b on 11b. That is, in the component mounting apparatus 1 according to the present embodiment, the first component crimping work part 22c and the second component crimping work part 22d are provided at positions sandwiching the component mounting work part 22b from the left and right sides.

  A first base portion 31 is provided in the front area of the ACF attaching work portion 22a on the central base 11b (the front-rear direction viewed from the operator OP is the Y-axis direction). A second base portion 32 is provided extending in the X-axis direction in the front region of the component mounting operation portion 22b, the first component crimping operation portion 22c, and the second component crimping operation portion 22d.

  In FIGS. 1 and 5A and 5B, the first base portion 31 is provided with a left substrate transfer portion 33L. The left substrate transfer portion 33L is provided on the first base portion 31 so as to extend in the Y-axis direction, and is provided on the first base portion 31 so as to be movable in the X-axis direction. The moving stage 35 is provided so as to be movable in the Y-axis direction on the Y-axis table 34, and two substrate holding stages 36 are provided on the upper surface of the moving stage 35 so as to be arranged in the X-axis direction. On the two substrate holding stages 36, the two substrates 2 are transferred and held from the two substrate receiving stages 21s of the substrate receiving unit 21.

  As shown in FIG. 6A, the two substrate holding stages 36 of the left substrate transfer unit 33L can be replaced with one substrate holding stage 36T. In this case, the substrate is placed on the substrate holding stage 36T. One substrate 2 is transferred and held from one of the two substrate receiving stages 21 s of the receiving unit 21.

  The two substrate holding stages 36 are attached to the left substrate transfer unit 33L when two small-sized substrates 2 are held by the two substrate holding stages 36, and the left substrate transfer unit 33L. One substrate holding stage 36T is attached to the case where a single large-sized substrate 2 is held by this one substrate holding stage 36. In other words, in the present embodiment, the left substrate transfer unit 33L is configured such that the two substrate holding stages 36 (first substrate holding stage) that simultaneously hold the two small-sized substrates 2 or one large-sized substrate. One substrate holding stage 36T (second substrate holding stage) that holds 2 can be selectively attached.

  The two substrate holding stages 36 (or one substrate holding stage 36T) can be moved up and down with respect to the moving stage 35. The control device 24 moves the moving stage 35 in the Y axis direction with respect to the Y axis table 34. The substrate 2 is transferred, and the two substrate holding stages 36 or one substrate holding stage 36T is moved up and down to move the substrate 2 placed on the two substrate holding stages 36 or one substrate holding stage 36T up and down.

  5 (a), 5 (b) and 6 (a), 6 (b), the ACF adhering work part 22a has two adhering heads 41 arranged above the central base 11b in the X-axis direction. And two backup stages 42 for ACF adhering work provided extending in the X-axis direction below the adhering heads 41.

  Each of the two sticking heads 41 feeds and feeds the ACF tape 3, cuts the fed ACF tape 3 into a predetermined length, and holds it in a horizontal position at a predetermined position, and a tape supply A sticking tool 41b for pressing the ACF tape 3 held in a horizontal posture by the part 41a from above onto the backup stage 42 side for ACF sticking work is provided.

  The control device 24 sets the moving stage 35 of the left substrate transfer part 33L to the “substrate transfer position” (FIGS. 5A and 6A) set to the front on the Y-axis table 34 and the rear. The “working position” (FIG. 5B and FIG. 6B) is moved. The “substrate delivery position” is a position where the substrate 2 can be delivered to the two substrate holding stages 36 (or one substrate holding stage 36T), and the “working position” is the position on the two substrate holding stages 36. A position (or one sheet placed on one substrate holding stage 36T) where the electrode portions 2a of the two placed substrates 2 can be positioned above the two backup stages 42 for attaching the ACF. The electrode portion 2a of the substrate 2 can be positioned above one of the two backup stages 42 for attaching the ACF.

  The operation of attaching the ACF tape 3 to the substrate 2 by the attaching head 41 will be described with reference to FIG. First, as shown in FIG. 7A, the control device 24 operates the tape supply unit 41a to position the ACF tape 3 in a state cut to a predetermined length above the substrate 2 (electrode unit 2a). Next, as shown in FIG. 7B, the sticking tool 41b is lowered to press the ACF tape 3 together with the substrate 2 against the backup stage 42 for the ACF sticking work. Finally, as shown in FIG. 7C, the sticking tool 41 b is raised with respect to the substrate 2. As a result, the ACF tape 3 having a predetermined length is attached to the substrate 2.

  In FIG. 1, the second base portion 32 is provided with a central substrate transfer portion 33C and a right substrate transfer portion 33R. The central substrate transfer unit 33C and the right substrate transfer unit 33R are the same type, and the central substrate transfer unit 33C is located to the left of the right substrate transfer unit 33R. The central substrate transfer unit 33C (same as the right substrate transfer unit 33R) is provided to be movable in the X-axis direction along the second base portion 32, as shown in FIGS. 8 (a) and 8 (b). A Y-axis table 51, a moving stage 52 provided on the Y-axis table 51 so as to be movable in the Y-axis direction, and two substrate holding stages 53 provided side by side in the X-axis direction on the upper surface of the moving stage 52 are provided. The moving stage 52 has a built-in lifting mechanism that lifts and lowers the two substrate holding stages 53 individually in the Z-axis direction. The two substrate holding stages 53 can be moved in the horizontal direction by moving the Y-axis table 51 in the X-axis direction with respect to the second base portion 32 and moving the moving stage 52 with respect to the Y-axis table 51. On the holding stage 53, the two substrates 2 are transferred and held from the two substrate holding stages 36 of the left substrate transfer part 33L.

  Each of the two substrate holding stages 53 of the central substrate transfer unit 33C and the two substrate holding stages 53 of the right substrate transfer unit 33R can be replaced with one substrate holding stage 53T as shown in FIG. 9A. In this case, one substrate 2 is transferred and held on the substrate holding stage 53T from one substrate holding stage 36T of the left substrate transfer part 33L.

  The two substrate holding stages 53 are attached to the central substrate transfer unit 33C and the right substrate transfer unit 33R when the two substrates 2 having a small size are held by the two substrate holding stages 53. The single substrate holding stage 53T is attached to the central substrate transfer unit 33C and the right substrate transfer unit 33R when the single substrate 2 is held by the single substrate holding stage 53. In other words, in the present embodiment, the central substrate transfer unit 33C and the right substrate transfer unit 33R have two substrate holding stages 53 (first substrate holding stage) or a large substrate holding two small-sized substrates 2 simultaneously. One substrate holding stage 53T (second substrate holding stage) for holding a single size substrate 2 can be selectively attached.

  The two substrate holding stages 53 (or one substrate holding stage 53T) move horizontally by moving the Y-axis table 51 in the X-axis direction relative to the second base portion 32 and moving the moving stage 52 relative to the Y-axis table 51, respectively. Are freely movable, and can be individually moved up and down by driving the above-described lifting mechanism built in the moving stage 52. The control device 24 moves the Y-axis table 51 in the X-axis direction with respect to the second base portion 32 and moves the moving stage 52 in the Y-axis direction with respect to the Y-axis table 51, thereby providing two substrate holding stages 53 (or 1). The two substrate holding stages 53T) are moved in the horizontal plane to transfer the substrate 2, and the two substrate holding stages 53 (or one substrate holding stage 53T) are lowered / raised, so that the two substrate holding stages 53 are moved. The two substrates 2 (or one substrate 2 placed on one substrate holding stage 53T) placed on the substrate are landed / separated from the upper surface of the backup stage 64.

  1, FIG. 8 (a), FIG. 8 (b) and FIG. 9 (a), (b), the component mounting work section 22b is provided to project rearward from the rear portion of the central base 11b to supply the component 4. A component supply unit 61 to be performed, a mounting head 63 that is movable in a horizontal plane by a mounting head moving mechanism 62 provided at the center rear portion of the central base 11b, and a mounting head 63 that adsorbs the component 4 supplied by the component supply unit 61 from above and the first. 2 is provided with a backup stage 64 for component mounting work provided extending in the Y-axis direction in the center rear region of the base portion 32 of the second base portion 32. The control device 24 controls the supply operation of the component 4 by the component supply unit 61, the movement operation of the mounting head 63 in the horizontal plane by the operation of the mounting head moving mechanism 62, and the suction operation of the component 4 by the mounting head 63. Thereby, a series of operations from adsorption (pickup) of the component 4 by the mounting head 63 to mounting of the component 4 on the substrate 2 is performed.

  8A and 9A, the part mounting work backup stage 64 is provided with two position recognition cameras 65 arranged in the X-axis direction with the imaging visual field facing upward. These two position recognition cameras 65 are controlled by the control device 24 to perform an imaging operation, and a transparent material portion 64a such as quartz glass provided on the upper part of the backup stage 64 for mounting components (FIGS. 8A and 9). The object located above the backup stage 64 for component mounting is imaged through (a)).

  The component mounting operation control unit SR1 (FIG. 3) of the control device 24 sets the “substrate delivery position” (FIG. 8A and FIG. 8) in which the moving stage 52 of the central substrate transfer unit 33C is set forward on the Y-axis table 51. 9 (a)) and the “working position” set rearward (FIGS. 8B and 9B). The “substrate delivery position” is a position where the substrate 2 can be delivered to the two substrate holding stages 53 (or one substrate holding stage 53T). The “working position” indicates that the ACF tape 3 attached to the electrode part 2a of the substrate 2 placed on the two substrate holding stages 53 (or one substrate holding stage 53T) is attached to the backup stage 64 for component mounting work. This is a position that can be positioned above (further above a backup stage 72 for component crimping work described later).

  When a component mounting operation for mounting the component 4 on the substrate 2 is executed, the control device 24 (component mounting operation control unit SR1) first moves the moving stage 52 to the “working position” to thereby form the electrode unit 2a of the substrate 2. Is positioned above the backup stage 64 (mounting work position) (step ST1 shown in the flowchart of FIG. 10). Then, the two position recognition cameras 65 image and recognize two position recognition marks m (FIG. 2) of the board 2 positioned above the component mounting backup stage 64 (FIG. 11A). Based on the position information of the two position recognition marks m, information (position information of the substrate 2 with respect to the substrate holding stage 53 or the substrate holding stage 53T) is calculated (acquired), and the result is stored in the control device 24. It memorize | stores in the part 24a (FIG. 3) (step ST2).

  Specifically, when two substrates 2 are placed on the two substrate holding stages 53, the position of the substrate 2 held on the left substrate holding stage 53 of the central substrate transfer unit 33 </ b> C with respect to the substrate holding stage 53. The correction amount data is stored in the first correction data storage area KR1 of the storage unit 24a as information on the position of the substrate 2. Similarly, the position correction amount data for the substrate 2 held on the substrate holding stage 53 on the right side of the central substrate transfer unit 33C is stored in the second correction data storage area KR2. Further, the position correction amount data for the substrate holding stage 53 for the substrate 2 held on the left substrate holding stage 53 of the right substrate transfer unit 33R is stored in the third correction data storage area KR3, and the right substrate holding stage 53 is stored. The position correction data for the substrate 2 held in is stored in the fourth correction data storage area KR4.

  On the other hand, when one substrate 2 is placed on one substrate holding stage 53T, position correction amount data for the substrate holding stage 53T with respect to the substrate 2 held on the substrate holding stage 53T of the central substrate transfer unit 33C is obtained. Information regarding the position of the substrate 2 is stored in the first correction data storage area KR1 of the storage unit 24a. Further, the position correction amount data for the substrate holding stage 53T of the substrate 2 held on the substrate holding stage 53T of the right substrate transfer unit 33R is stored in the third correction data storage area KR3.

  After finishing step ST2, the control device 24 (component mounting operation control unit SR1) once moves the moving stage 52 forward to retract the electrode unit 2a of the substrate 2 from the upper position (mounting operation position) of the backup stage 64. Then, the mounting head 63 is lowered and the component 4 is moved to the backup stage 64 (to the position recognition camera 65 side) (to the mounting work position) (step ST3). ST4). Then, a position recognition mark (not shown) of the component 4 is picked up and recognized by the two position recognition cameras 65 (FIG. 11C), and information on the position of the component 4 (position information of the component 4 with respect to the mounting head 63). Is calculated (acquired), the position correction amount of the component 4 is obtained, and the result is stored in the storage unit 24a (step ST5).

  After storing the position information of the substrate 2 and the position information of the component 4 in the storage unit 24a as described above, the control device 24 (the component mounting operation control unit SR1) raises the mounting head 63 (FIG. 12 ( a)) The moving stage 52 is positioned again at the “working position”. Based on the information related to the position of the substrate 2 (position correction amount of the substrate 2) and the information related to the position of the component 4 (position correction amount of the component 4) stored in the storage unit 24a (not shown) The central substrate transfer part 33C is controlled so that the electrode part 2a on the substrate 2 side is vertically aligned, and the substrate 2 is positioned with respect to the component mounting work part 22b (directly with respect to the component 4) ( Fig. 12 (b), step ST6).

  When the control device 24 (component mounting operation control unit SR1) positions the substrate 2 with respect to the component mounting operation unit 22b in this way, the mounting head 63 is lowered and the component 4 adsorbed by the mounting head 63 is transferred to the substrate 2. It is pressed against the upper ACF tape 3 and mounted on the substrate 2 (FIG. 12 (c), step ST7). The pressing force of the mounting head 63 at this time is supported by the backup stage 64 for mounting components. When the component 4 is mounted on the substrate 2, the control device 24 raises the mounting head 63 (step ST8).

  As shown in FIGS. 8, 9, 11 and 12, each of the two substrate holding stages 53 (or one substrate holding stage 53T) provided in the central substrate transfer unit 33C (the same applies to the right substrate transfer unit 33R). Is provided with a frame-like film-like portion support portion 54 having a horizontal portion 54a extending in the X-axis direction behind the substrate holding stage 53 (or the substrate holding stage 53T). As shown in FIG. 2 and the like, the component 4 mounted on the substrate 2 by the component mounting operation unit 22 b protrudes from the substrate 2 in the state where the component 4 is mounted on the substrate 2. However, since the film-like portion support portion 54 is provided on each substrate holding stage 53 (or substrate holding stage 53T), the component 4 protrudes outside the substrate 2 in a state where the component 4 is mounted on the substrate 2. The four film-like portions 4 a are supported from below by the horizontal portion 54 a of the film-like portion supporting portion 54. Thereby, it is prevented that the film-like part 4a of the component 4 in the state mounted on the board | substrate 2 will be in the state hung down below.

  As shown in FIGS. 13A and 13B and FIGS. 14A and 14B, the first component crimping work part 22c (same as the second component crimping work part 22d) is in the X-axis direction. And two back-up stages 72 for crimping the two components provided extending in the Y-axis direction below the respective crimping heads 71. The component crimping operation control unit SR2 (FIG. 3) of the control device 24 controls the ascending and descending operations of the crimping head 71 provided in the first component crimping operation unit 22c and the crimping head 71 provided in the second component crimping operation unit 22d. (Figure 3).

  The control device 24 (component crimping operation control unit SR2) has two substrates 2 (or one substrate holding stage 53T) placed on the two substrate holding stages 53 provided in the central substrate transfer unit 33C. When the mounting operation of the component 4 by the mounting head 63 is finished for the two substrates 2), the Y-axis table 51 is left along the second base portion 32 as it is (that is, on the first component crimping operation portion 22c side). The ACF tapes 3 of the two substrates 2 (or one substrate 2 placed on one substrate holding stage 53T) placed on the two substrate holding stages 53 are attached. The attached portion is positioned above the backup stage 72 for two component crimping operations (below the two crimping heads 71). At this time, the substrate holding stage 53 (or the substrate holding stage 53T) is moved based on the information related to the position of the substrate 2 stored in the storage unit 24a, and the substrate 2 is positioned with respect to the first component crimping operation unit 22c ( FIG. 13 (a) or FIG. 14 (a)).

  Specifically, when two substrates 2 are placed on the two substrate holding stages 53, the substrate 2 held on the left substrate holding stage 53 is read from the first correction data storage area KR1. Positioning is performed using the position correction amount data, and the substrate 2 held on the right substrate holding stage 53 is positioned using the position correction amount data read from the second correction data storage area KR2. Then, the two crimping heads 71 provided in the first component crimping work unit 22c are sequentially lowered, and the component 4 mounted by the component mounting work unit 22b is crimped to the two substrates 2 (FIG. 15A → FIG. 15). 15 (b) → FIG. 15 (c)). On the other hand, when one substrate 2 is placed on one substrate holding stage 53T, the position correction amount data read from the first correction data storage area KR1 for the substrate 2 held on the substrate holding stage 53T. Use to position. Then, the two crimping heads 71 provided in the first component crimping work unit 22c are sequentially lowered, and the component 4 mounted by the component mounting work unit 22b is crimped to the two substrates 2 (FIG. 15A → FIG. 15). 15 (b) → FIG. 15 (c)).

  Similarly, the control device 24 (component crimping operation control unit SR2) mounts two substrates 2 (or one substrate holding stage 53T) placed on the two substrate holding stages 53 provided in the right substrate transfer unit 33R. When the mounting operation of the component 4 by the mounting head 63 is completed for the single substrate 2 placed, the Y-axis table 51 is directly moved along the second base portion 32 to the right (that is, the second component crimping operation portion). 22d side) and the components 4 of the two substrates 2 (or one substrate 2 placed on one substrate holding stage 53T) placed on the two substrate holding stages 53 are mounted. The portions are respectively positioned above the backup stage 72 for component crimping work (below the crimping head 71). Then, the substrate holding stage 53 is moved based on the information related to the position of the substrate 2 acquired in the above-described step ST2, and the substrate 2 is positioned with respect to the second component crimping operation part 22d (FIG. 13A or FIG. 14 (a)).

  Specifically, when two substrates 2 are placed on the two substrate holding stages 53, the substrate 2 held on the left substrate holding stage 53 is read from the third correction data storage area KR3. Positioning is performed using the position correction amount data, and the substrate 2 held on the right substrate holding stage 53 is positioned using the position correction amount data read from the fourth correction data storage area KR4. Then, the two crimping heads 71 provided in the second component crimping operation unit 22d are sequentially lowered, and the component 4 mounted in the component mounting operation unit 22b is crimped to the two substrates 2 (FIG. 15A → FIG. 15). 15 (b) → FIG. 15 (c)). On the other hand, when one substrate 2 is placed on one substrate holding stage 53T, the position correction amount data read from the third correction data storage area KR3 for the substrate 2 held on the substrate holding stage 53T. Use to position. Then, the two crimping heads 71 provided in the second component crimping operation unit 22d are sequentially lowered, and the component 4 mounted in the component mounting operation unit 22b is crimped to the two substrates 2 (FIG. 15A → FIG. 15). 15 (b) → FIG. 15 (c)).

  In the crimping operation of the component 4 by the two crimping heads 71 provided in each of the first component crimping working portion 22c and the second component crimping working portion 22d, two substrate holding stages 53 are attached and two substrates 2 are attached. In the case of handling at the same time, the two substrate holding stages 53 are attached to one moving stage 52, so that the positioning of each substrate 2 with respect to the corresponding pressure-bonding head 71 and the subsequent component pressure-bonding operation are sequentially performed at different timings. This operation will be described in detail with reference to FIGS.

  First, the control device 24 (component crimping operation control unit SR2) sets a position where the component 4 of each of the two substrates 2 placed on the two substrate holding stages 53 is positioned above the backup stage 72 (crimping operation position). (Step ST11 shown in the flowchart of FIG. 16). At this time, information about the position of the substrate 2 (in the substrate holding stage 53 on the left side) acquired in the component mounting operation described above and stored in the first correction data storage area KR1 (or the third correction data storage area KR3) of the storage unit 24a. The moving stage 52 is moved based on the held position correction amount data of the substrate 2. Thereby, the board | substrate 2 on the left side is positioned with respect to the corresponding crimping | compression-bonding head 71 (FIG. 17 (a), step ST12).

  After positioning the left substrate 2, the control device 24 then lowers the left crimping head 71 to clamp the substrate 2 between the backup stage 72 and the crimping head 71, and put the component 4 on the left substrate 2. Crimping is performed (FIG. 17B) Step ST13. Then, while holding the clamped state, the left substrate holding stage 53 is slightly lowered to release the holding of the substrate 2 by the substrate holding stage 53 (FIG. 17 (c), step ST14).

  As a result, when the moving stage 52 can be moved independently of the left-side substrate 2, the second correction data storage area KR <b> 2 (or the fourth correction data storage area 24 a) is obtained in the same component mounting operation as described above. The moving stage 52 is moved based on the information on the position of the substrate 2 stored in the correction data storage area KR4 (position correction amount data of the substrate 2 held on the right substrate holding stage 53), and the right substrate 2 is moved. Positioning is performed with respect to the corresponding pressure bonding head 71 (step ST15).

  After positioning the right substrate 2, the control device 24 then lowers the right crimping head 71 to clamp the substrate 2 between the backup stage 72 and the crimping head 71, and place the component 4 against the right substrate 2. Crimping is performed (FIG. 17 (d), step ST16). When the component 4 is crimped to the right substrate 2, the control device 24 (component crimping operation control unit SR 2) raises the left substrate holding stage 53 to hold the substrate 2, and then moves the left crimping head 71. Then, the pressure bonding head 71 on the right side is raised (FIG. 17 (f), step ST18). Thereby, the crimping operation of the component 4 to the two substrates 2 is completed.

  When the component 24 is crimped to the two substrates 2 by the above-described procedure, the control device 24 (component crimping operation control unit SR2) moves the moving stage 52 forward along the Y-axis table 51 to move the moving stage 52. 52 is returned to the “board transfer position”.

  Note that the positioning of the pressure-bonding head 71 with respect to the substrates 2 placed on the two substrate holding stages 53 and the pressure-bonding of the component 4 with the pressure-bonding head 71 are not performed individually on the left and right substrates 2 as described above, but are performed simultaneously. May be. In that case, an average value of the positional deviation of the left substrate 2 with respect to the left substrate holding stage 53 and the positional deviation of the right substrate 2 with respect to the right substrate holding stage 53 obtained in the component mounting operation is calculated, and the left and right substrates are calculated. The substrate holding stage 53 is simultaneously positioned with respect to each corresponding pressure bonding head 71. Thereafter, the component 4 is simultaneously crimped to the substrate 2 by the crimping head 71. In this case, the tact time can be shortened although the positioning accuracy is slightly lowered as compared with the individual positioning.

  In FIG. 1, the substrate transfer section 23 has two substrate transfer stages 23 s on the left side (upstream process side) and the right side (downstream process side). These two left and right substrate delivery stages 23s are provided so as to be movable up and down with respect to the right base 11c. The two component delivery stages 23s have a first component crimping work portion 22c or a second component crimping work portion 22d. 2, the two substrates 2 on which the crimping operation of the component 4 has been completed are placed. The two substrates 2 placed on the two substrate delivery stages 23 s are sent to another device provided on the lower side of the component mounting apparatus 1 by a substrate unloading means (not shown).

  As shown in FIG. 18, the left substrate transfer stage 23s is fixed to the right base 11c, and the right substrate transfer stage 23s can be moved in the X-axis direction on the right base 11c. . When a component mounting operation is performed on the small-sized board 2, the interval between the two board transfer stages 23s can be received without causing the two small-sized boards 2 to interfere with each other without interfering with each other. The first interval is set to the first interval (FIG. 18A), and the second interval is set to be able to receive the two large-sized substrates 2 without interfering with each other (FIG. 18B). )).

  In FIG. 1, a moving base 81 extending in the X-axis direction is provided in the front region of the base 11 over the left base 11a, the center base 11b, and the right base 11c. On the moving base 81, a left substrate transfer portion 82a, a central substrate transfer portion 82b, and a right substrate transfer portion 82c are provided in order from the left.

  As shown in FIG. 19, each of the left substrate transfer portion 82a, the central substrate transfer portion 82b, and the right substrate transfer portion 82c is provided with a base 91 that is movable in the X-axis direction with respect to the movement base 81. And two arm units 92 provided on the base 91. Each arm unit 92 includes an arm base 93 fixed to the base portion 91 and two arms 94 provided to extend horizontally rearward from the arm base 93. Each arm 94 is provided with a plurality of suction pads 95 with suction surfaces facing downward. Each arm unit 92 can vacuum-suck a single substrate 2 through a total of four suction pads 95 provided on the two arms 94.

  When the substrate 2 placed on the substrate receiving stage 21s of the substrate receiving unit 21 is picked up by the left substrate transfer unit 82a, the control device 24 selects the left base 11a out of the two substrate receiving stages 21s. The substrate receiving stage 21s is moved up and down in a state where the suction pad 95 of the right arm 94 of the left substrate transfer portion 82a is positioned above the right substrate receiving stage 21s fixed to the right side. Here, the interval in the X-axis direction of the two arms 94 included in each of the left substrate transfer unit 82a, the central substrate transfer unit 82b, and the right substrate transfer unit 82c is set to the first interval, Therefore, when the two substrate receiving stages 21 s are set to the first interval, the right substrate receiving stage 21 s is positioned below the suction pad 95 of the right arm 94, and the left arm When the right substrate receiving stage 21s is positioned below the 94 suction pads 95 and two substrates 2 are placed on the two substrate receiving stages 21s, the two arms 94 simultaneously 2 A single substrate 2 can be picked up.

  The substrate 2 placed on the substrate holding stage 36 (or substrate holding stage 36T) of the left substrate transfer unit 33L is picked up by the arm 94, or the substrate 2 picked up by the arm 94 is picked up by the substrate holding stage 36 (or substrate holding stage). 36T), the control device 24 is in a state where the suction pads 95 of the two arms 94 are positioned above the two substrate holding stages 36 provided in the left substrate transfer unit 33L (or one substrate). The two substrate holding stages 36 (or one substrate holding stage 36T) are moved up and down in a state where one suction pad 95 of the two arms 94 is positioned above the holding stage 36T.

  The substrate 2 held on the substrate holding stage 53 (or the substrate holding stage 53T) of the central substrate transfer unit 33C or the right substrate transfer unit 33R is picked up by the arm 94, or the substrate 2 picked up by the arm 94 is held by the substrate. When placing on the stage 53 (or the substrate holding stage 53T), the control device 24 sets the two arms 94 above the two substrate holding stages 53 provided in the central substrate transfer unit 33C or the right substrate transfer unit 33R. A state in which the suction pad 95 is positioned or a state in which one suction pad 95 of the two arms 94 is positioned above one substrate holding stage 53T (or two arms 94 above one substrate holding stage 53T). In the state where one of the suction pads 95 is positioned), the two substrate holding stages 53 (or 1) The substrate holding stage of 53T) moving up and down the.

  The controller 24 moves the left substrate transfer unit 82a, the central substrate transfer unit 82b, and the right substrate transfer unit 82c in the X-axis direction along the movement base 81, and suction pads in each arm unit 92. The adsorption | suction operation | movement of the board | substrate 2 through 95 is controlled (FIG. 3). Specifically, the control device 24 operates the left substrate transfer unit 82a to transfer the substrate 2 from the substrate receiving unit 21 to the left substrate transfer unit 33L, and operates the central substrate transfer unit 82b to move the left. The substrate 2 is transferred from the side substrate transfer unit 33L to the center substrate transfer unit 33C or the right side substrate transfer unit 33R. That is, the two substrate holding stages 53 (or one substrate holding stage 53T) and the right substrate transferring portion 33R provided in the central substrate transferring portion 33C include the substrate 2 to which the ACF tape 3 is attached by the ACF attaching operation portion 22a. The two substrate holding stages 53 (or one substrate holding stage 53T) provided are distributed and placed. Further, the control device 24 operates the right substrate transfer unit 82c to transfer the substrate 2 from the central substrate transfer unit 33C or the right substrate transfer unit 33R to the substrate transfer unit 23.

  Next, the operation of each part when the component mounting apparatus 1 performs a component mounting operation on the board 2 will be described. As shown in FIG. 20, the control device 24 sets the front position (first position) of the substrate receiving section 21 as positions that the left substrate transfer section 82a, the central substrate transfer section 82b, and the right substrate transfer section 82c can take. 1 position P1), a front position (second position P2) of the ACF attaching work part 22a, a front position (third position P3) of the first component crimping work part 22c, and a front position (fourth position) of the component mounting work part 22b. Position P4), a front position (fifth position P5) of the second component crimping work part 22d, and a front position (sixth position P6) of the board transfer part 23 are defined.

  In this component mounting apparatus 1, as described above, component mounting work can be performed on two types of large and small substrates 2, and in the following description, for convenience, a work mode in which components are mounted on a small size substrate 2. Is referred to as a first mode, and a work mode for mounting components on a large-sized board 2 is referred to as a second mode. The selection of whether the component mounting apparatus 1 performs the component mounting operation in the first mode or the component mounting operation in the second mode is performed by selecting the mode selection switch 90 (FIG. 3) connected to the control device 24 by the operator OP. Do by operating.

  When the first mode is set, the substrate receiving unit 21 has two small-sized sheets sent from the upstream process side in a state where the two substrate receiving stages 21s are set to the first interval. The substrate 2 is received simultaneously. On the other hand, when the second mode is set, the substrate receiving unit 21 is a large size 2 sent from the upstream process side with the two substrate receiving stages 21s set to the second interval. A plurality of substrates 2 are received simultaneously.

  Similarly, when the first mode is set, the substrate transfer unit 23 has the two substrate transfer stages 23s set at the first interval, and the central substrate transfer unit 33C or the right substrate transfer unit 33R. If the second mode is set and the second mode is set, the central substrate transfer unit 33C is adjusted with the two substrate transfer stages 23s adjusted to the second interval. Alternatively, one substrate is individually received from the right substrate transfer unit 33R and transferred to the downstream process side.

  When the operator OP selects the first mode, first, the two substrate holding stages 36 are mounted on the moving stage 35 of the left substrate transfer unit 33L, and the central substrate transfer unit 33C and the right substrate transfer unit are mounted. Two substrate holding stages 53 are also mounted on each moving stage 52 of 33R. Then, the mode selection switch 90 is operated to select the first mode.

  When the first mode is selected by the mode selection switch 90, the control device 24 sets the left substrate transfer portion 82a to the first position P1, the central substrate transfer portion 82b to the second position P2, and the right substrate. The transfer unit 82c is positioned at the fourth position P4, the central substrate transfer unit 33C is positioned in front of the component mounting operation unit 22b, and the right substrate transfer unit 33R is positioned in front of the second component crimping operation unit 22d. Let Then, both the interval between the two substrate receiving stages 21s of the substrate receiving unit 21 and the interval between the two substrate transfer stages 23s of the substrate transferring unit 23 are set to the first interval (which is not changed thereafter), and the apparatus on the upstream process side When the two small-sized substrates 2 sent from are received by the two substrate receiving stages 21s of the substrate receiving unit 21 (substrate receiving step), the two received substrates 2 are transferred to the left substrate transfer unit 82a. Are picked up by the two arms 94 (FIG. 21A).

  When the control unit 24 picks up the two substrates 2 from the two substrate receiving stages 21s of the substrate receiving unit 21 by the two arms 94 of the left substrate transferring unit 82a, the control unit 24 moves the left substrate transferring unit 82a to the second position. In P2, the two substrates 2 picked up by the left substrate transfer unit 82a are obtained by positioning the central substrate transfer unit 82b at the fourth position P4 and the right substrate transfer unit 82c at the sixth position P6. It is placed and held on the two substrate holding stages 36 of the left substrate transfer part 33L (FIG. 21B. Substrate transfer step). Then, the moving stage 35 of the left substrate transfer unit 33L is moved to the “working position”, and the ACF adhering operation to the two substrates 2 by the ACF adhering operation unit 22a is executed (FIG. 21C). During this period, two new substrates 2 are placed on the two substrate receiving stages 21 s of the substrate receiving unit 21.

  When the control device 24 performs the ACF attaching operation to the two substrates 2 by the ACF attaching operation portion 22a, the control device 24 moves the moving stage 35 of the ACF left substrate transfer portion 33L to the “substrate delivery position”, and then to the left The substrate transfer unit 82a is positioned at the first position P1, the central substrate transfer unit 82b is positioned at the second position P2, and the right substrate transfer unit 82c is positioned at the fourth position P4. The two substrates 94 on the two substrate receiving stages 21s of the substrate receiving unit 21 are picked up by the two arms 94 of the left substrate transferring unit 82a, and the two arms 94 of the central substrate transferring unit 82b are used to pick up the two substrates 94. Two substrates 2 on the left substrate transfer unit 33L are picked up (FIG. 22A).

  The control device 24 picks up the two substrates 2 from the two substrate receiving stages 21s of the substrate receiving unit 21 by the two arms 94 of the left substrate transferring unit 82a, and two arms 94 of the central substrate transferring unit 82b. When the two substrates 2 on the two substrate holding stages 36 of the left substrate transfer unit 33L are picked up by the left substrate transfer unit 33L, the left substrate transfer unit 82a is set to the second position P2, and the central substrate transfer unit 82b is set to the fourth position P4. In addition, by positioning the right substrate transfer portion 82c at the sixth position P6, the two substrates 2 picked up by the two arms 94 of the left substrate transfer portion 82a are transferred to the two left substrate transfer portions 33L. The two substrates 2 placed and held on the substrate holding stage 36 and picked up by the two arms 94 of the central substrate transfer part 82b are transferred to the two bases of the central substrate transfer part 33C. To be held is placed on the holding stage 53 (FIG. 22 (b)).

  Next, the control device 24 positions the moving stage 35 of the left substrate transfer unit 33L at the “working position” and executes the ACF adhering operation to the two substrates 2 by the ACF adhering operation unit 22a, while the central substrate The moving stage 52 of the transfer unit 33C is moved to the “work position”, and the left substrate 2 of the two substrates 2 on the two substrate holding stages 53 is positioned above the backup stage 64 for component mounting work. Thus, the component mounting operation is performed on the left board 2 by the component mounting operation unit 22b (FIG. 22C, component mounting step).

  When the component mounting operation for the left substrate 2 by the component mounting operation unit 22b is performed, the control device 24 moves the central substrate transfer unit 33C to the left, and places it on the two substrate holding stages 53 of the central substrate transfer unit 33C. The right substrate 2 of the two substrates 2 placed is positioned above the backup stage 64 for component mounting operation, and the component mounting operation for the right substrate 2 by the component mounting operation unit 22b is executed. (FIG. 23A. Component mounting process). During this period, two new substrates 2 are placed on the two substrate receiving stages 21 s of the substrate receiving unit 21.

  After executing the component mounting operation by the component mounting operation unit 22b, the control device 24 moves the central substrate transfer unit 33C to the left (the first component crimping operation unit 22c side) as it is, and the two substrate holding stages 53 are moved. The substrate 2 placed on the substrate 2 is transferred to the first component crimping work unit 22c, and the two substrates 2 placed on the two substrate holding stages 53 are placed above the backup stage 72 for the two component crimping operations. Then, a component crimping operation is performed on the two substrates 2 by the first component crimping operation section 22c (FIG. 23B, component crimping step). At the same time, the left substrate transfer portion 82a is positioned at the first position P1, and the two substrates 2 placed on the two substrate receiving stages 21s of the substrate receiving portion 21 are moved to the left substrate. While picking up by the two arms 94 of the transfer unit 82a, the central substrate transfer unit 82b is positioned at the second position P2 in accordance with the movement stage 35 of the left substrate transfer unit 33L being positioned at the “substrate transfer position”. The two substrates 2 on the two substrate holding stages 36 of the left substrate transfer unit 33L are picked up by the two arms 94 of the central substrate transfer unit 82b. Further, the right substrate transfer part 33R is positioned at the front position of the component mounting work unit 22b, and the right substrate transfer part 82c is positioned at the fourth position P4 (FIG. 23B).

  When the above operation is completed, the control device 24 positions the right substrate transfer portion 82c at the sixth position P6, and then positions the central substrate transfer portion 82b at the fourth position P4, thereby moving the left substrate transfer portion. The two substrates 2 picked up from the two substrate holding stages 36L of 33L are placed and held on the two substrate holding stages 53 of the right substrate transfer unit 33R, and the left substrate transfer unit 82a is set to the second one. By positioning at the position P2, the two substrates 2 picked up from the two substrate receiving stages 21s of the substrate receiving unit 21 are placed and held on the two substrate holding stages 36 of the left substrate transfer unit 33L (FIG. 23 (c)).

  When the substrate 2 is placed on the two substrate holding stages 36 of the right substrate transfer unit 33R and the two substrate holding stages 53 of the left substrate transfer unit 33L, the control device 24 moves the moving stage 35 of the left substrate transfer unit 33L. Is moved to the “working position”, and the ACF sticking work unit 22a performs the ACF sticking work on the two substrates 2 while moving the moving stage 52 of the right substrate transfer part 33R to the “working position”. By positioning the right substrate 2 out of the two substrates 2 placed on the two substrate holding stages 53 above the backup stage 64 for component mounting operation, the right substrate by the component mounting operation unit 22b. 2 is executed (FIG. 24A, component mounting process).

  After executing the ACF adhering operation by the ACF adhering operation unit 22a and the component mounting operation by the component mounting operation unit 22b, the control device 24 moves the right substrate transfer unit 33R to the right, and the right substrate transfer unit Of the two substrates 2 placed on the two substrate holding stages 53R of 33R, the left substrate 2 is positioned above the backup stage 64 for component mounting work, and the left by the component mounting work unit 22b. The component mounting operation is performed on the substrate 2 (FIG. 24B, component mounting step). During this period, two new substrates 2 are placed (loaded in) on the two substrate receiving stages 21 s of the substrate receiving unit 21.

  When the component mounting operation by the component mounting operation unit 22b is performed, the control device 24 moves the right substrate transfer unit 33R to the right (the second component crimping operation unit 22d side) as it is, and the two substrate holding stages. The two substrates 2 placed on 53 are transferred to the second component crimping operation section 22d, and the two substrates 2 placed on the two substrate holding stages 53 are used as backup stages for two component crimping operations. The component crimping operation is performed on the two substrates 2 by the second component crimping operation section 22d (FIG. 24 (c), component crimping step). At the same time, the left substrate transfer unit 82a is positioned at the first position P1, and the two substrates 2 placed on the two substrate receiving stages 21s of the substrate receiving unit 21 are transferred to the left substrate. While picking up by the two arms 94 of the mounting portion 82a, the central substrate transfer portion 82b is positioned at the second position P2 in accordance with the movement stage 35 of the left substrate transfer portion 33L being positioned at the “substrate transfer position”. The two substrates 2 on the two substrate holding stages 36 of the left substrate transfer unit 33L are picked up by the two arms 94 of the central substrate transfer unit 82b. Further, while moving the moving stage 52 of the central substrate transfer unit 33C to the “substrate delivery position”, the central substrate transfer unit 33C is positioned in front of the component mounting operation unit 22b and is positioned in front of the component mounting operation unit 22b. The two substrates 94 on the two substrate holding stages 36 of the central substrate transfer unit 33C are picked up by the two arms 94 of the right substrate transfer unit 82c (FIG. 24C).

  When the above operation is completed, the control device 24 positions the right substrate transfer portion 82c at the sixth position P6 and places the two substrates 2 on the two substrate transfer stages 23s of the substrate transfer portion 23, while at the center. The substrate transfer unit 82b is positioned at the fourth position P4, and the two substrates 2 picked up from the two substrate holding stages 36 of the left substrate transfer unit 33L are transferred to the two substrate holding stages 53 of the central substrate transfer unit 33C. The two substrates 2 picked up from the two substrate receiving stages 21s of the substrate receiving unit 21 are moved to the left by placing and holding the left substrate transfer unit 82a at the second position P2. It is placed and held on the two substrate holding stages 36 of the substrate transfer section 33L (FIG. 25A).

  When the substrate 24 is placed and held on the two substrate holding stages 36 of the central substrate transfer unit 33C and the two substrate holding stages 36 of the left substrate transfer unit 33L, the control device 24 moves the left substrate transfer unit 33L. While the moving stage 35 is positioned at the “working position” and the ACF sticking work unit 22a performs the ACF sticking work on the two substrates 2, the moving stage 52 of the central substrate transfer part 33C is located at the “working position”. The component mounting operation for the left substrate 2 by the component mounting operation unit 22b is executed by positioning the left substrate 2 of the two substrates 2 above the backup stage 64 for component mounting operation. (FIG. 25B. Component mounting process).

  The control device 24 moves the central substrate transfer unit 33C to the left after performing the ACF adhering operation by the ACF adhering operation unit 22a and the component mounting operation by the component mounting operation unit 22b. The right substrate 2 of the two substrates 2 placed on one substrate holding stage 53 is positioned above the backup stage 64 for component mounting work, and the right substrate 2 by the component mounting work unit 22b. A component mounting operation is executed on (FIG. 25C, component mounting step). During this period, two new substrates 2 are placed on the two substrate receiving stages 21 s of the substrate receiving unit 21.

  When the component mounting operation by the component mounting operation unit 22b is performed, the control device 24 moves the central substrate transfer unit 33C to the left (the first component crimping operation unit 22c side) as it is, so that the two substrate holding stages 53 are moved. The two substrates 2 placed on the substrate 2 are transferred to the first component crimping operation unit 22c, and the two substrates 2 placed on the two substrate holding stages 53 are transferred to the two component crimping operations backup stage 72. The component crimping operation is performed on the two substrates 2 by the first component crimping operation portion 22c (FIG. 26A, component crimping step). At the same time, the left substrate transfer unit 82a is positioned at the first position P1, and the two substrates 2 placed on the two substrate receiving stages 21s of the substrate receiving unit 21 are transferred to the left substrate. While picking up by the two arms 94 of the mounting portion 82a, the central substrate transfer portion 82b is positioned at the second position P2 in accordance with the movement stage 35 of the left substrate transfer portion 33L being positioned at the “substrate transfer position”. The two substrates 2 on the two substrate holding stages 36 of the left substrate transfer unit 33L are picked up by the two arms 94 of the central substrate transfer unit 82b. Further, while moving the moving stage 52 of the right board transfer section 33R to the “board delivery position”, the right board transfer section 33R is positioned in front of the component mounting work section 22b, and is already positioned in front of the component mounting work section 22b. The two substrates 2 on the right substrate transfer unit 33R are picked up by the two arms 94 of the right substrate transfer unit 82c (FIG. 26A).

  When the above operation is completed, the controller 24 places the two substrates 2 on the two substrate transfer stages 23s of the substrate transfer unit 23 by positioning the right substrate transfer unit 82c at the sixth position P6, and The two substrates 2 picked up from the substrate holding stage 36 of the left substrate transfer unit 33L are mounted on the two substrate holding stages 53 of the right substrate transfer unit 33R with the central substrate transfer unit 82b positioned at the fourth position P4. The two substrates 2 picked up from the two substrate receiving stages 21s of the substrate receiving unit 21 are moved to the left substrate transferring unit 33L by placing and holding the left substrate transfer unit 82a at the second position P2. The two substrate holding stages 36 are placed and held (FIG. 26B).

  Since the state of FIG. 26B is exactly the same as the state of FIG. 23C, thereafter, by repeating the steps of FIG. 23C to FIG. A series of operations from receiving the substrate 2 to mounting the component 4 on the substrate 2 to delivering the substrate 2 to the outside by the substrate delivery unit 23 can be repeatedly executed to perform continuous substrate production.

  On the other hand, when selecting the second mode, the operator OP first attaches one substrate holding stage 36T on the moving stage 35 of the left substrate transfer unit 33L, and also transfers the central substrate transfer unit 33C and the right substrate transfer. One substrate holding stage 53T can also be mounted on the moving stage 52 of each part 33R. Then, the mode selection switch 90 is operated to select the second mode.

  When the second mode is selected by the mode selection switch 90, the control device 24 sets the left substrate transfer portion 82a to the first position P1, the central substrate transfer portion 82b to the second position P2, and the right substrate. The transfer unit 82c is positioned at the fourth position P4, the central substrate transfer unit 33C is positioned in front of the component mounting operation unit 22b, and the right substrate transfer unit 33R is positioned in front of the second component crimping operation unit 22d. Let Then, the interval between the two substrate receiving stages 21 s of the substrate receiving unit 21 is set to the second interval, and the two large-sized substrates 2 sent from the apparatus on the upstream process side are transferred to the two of the substrate receiving units 21. When it is received by the substrate receiving stage 21s (substrate receiving step), the right one of the two received substrates 2 is picked up by the right arm 94 of the left substrate transfer portion 82a (FIG. 27A). ).

  When the control device 24 picks up the substrate 2 from the substrate receiving stage 21s on the right side of the substrate receiving unit 21 by the right arm 94 of the left substrate transferring unit 82a, the left substrate transferring unit 82a is moved to the second position P2. The substrate 2 picked up by the left substrate transfer unit 82a is moved to the left substrate transfer unit 33L by positioning the central substrate transfer unit 82b at the fourth position P4 and the right substrate transfer unit 82c at the sixth position P6. Is placed and held on the substrate holding stage 36T (FIG. 27B, substrate transfer step). During this time, the left substrate receiving stage 21s on which the substrate 2 of the substrate receiving unit 21 is still placed is moved rightward to set the interval between the two substrate receiving stages 21s to the first interval ( FIG. 27 (b)). Then, the moving stage 35 of the left substrate transfer unit 33L is moved to the “working position”, and the ACF adhering operation to the substrate 2 by the ACF adhering operation unit 22a is executed (FIG. 27C).

  When the controller 24 performs the ACF attaching operation to the substrate 2 by the ACF attaching operation unit 22a, the control device 24 moves the moving stage 35 of the ACF left substrate transfer unit 33L to the “substrate delivery position”, and then transfers the left substrate. The portion 82a is positioned at the first position P1, the center substrate transfer portion 82b is positioned at the second position P2, and the right substrate transfer portion 82c is positioned at the fourth position P4. Then, the substrate 2 on the substrate receiving stage 21s on the left side of the substrate receiving unit 21 is picked up by the left arm 94 of the left substrate transferring unit 82a, and the left substrate is picked up by the right arm 94 of the central substrate transferring unit 82b. The substrate 2 on the transfer unit 33L is picked up (FIG. 28 (a)).

  The control device 24 picks up the substrate 2 on the substrate receiving stage 21s on the left side of the substrate receiving unit 21 by the left substrate transfer unit 82a, and the substrate holding stage 36T of the left substrate transfer unit 33L by the central substrate transfer unit 82b. When the upper substrate 2 is picked up, the left substrate transfer portion 82a is positioned at the second position P2, the central substrate transfer portion 82b is positioned at the fourth position P4, and the right substrate transfer portion 82c is positioned at the sixth position P6. As a result, the substrate 2 picked up by the left substrate transfer unit 82a is placed and held on the substrate holding stage 36T of the left substrate transfer unit 33L, and the substrate 2 picked up by the central substrate transfer unit 82b is transferred to the central substrate. The substrate 33C is placed and held on the substrate holding stage 53T (FIG. 28B). During this time, the substrate receiving stage 21 s on the left side of the substrate receiving unit 21 is moved leftward to set the interval between the two substrate receiving stages 21 s to the second interval.

  Next, the control device 24 positions the moving stage 35 of the left substrate transfer part 33L at the “working position” and executes the ACF attachment work on the substrate 2 by the ACF attachment work part 22a, while the central substrate transfer part 33C. The moving stage 52 is moved to the “working position” and the substrate 2 is positioned above the backup stage 64 for mounting the component, thereby performing the component mounting operation on the substrate 2 by the component mounting work unit 22b (FIG. 28). (C) Component mounting process). During this time, two new large-sized substrates 2 are placed on the substrate receiving unit 21.

  After executing the component mounting operation on the substrate 2 by the component mounting operation unit 22b, the control device 24 moves the central substrate transfer unit 33C to the left (the first component crimping operation unit 22c side) as it is, and the substrate holding stage. The substrate 2 held by 53T is transferred to the first component crimping operation section 22c, and the substrate 2 held by the substrate holding stage 53T is placed above one of the two backup stages 72 for component crimping operation (here, left). Then, a component crimping operation is performed on the substrate 2 by the first component crimping operation unit 22c (FIG. 29A, component crimping step). At the same time, the left substrate transfer unit 82a is positioned at the first position P1, and the substrate 2 placed on the substrate receiving stage 21s on the right side of the substrate receiving unit 21 is moved to the left substrate transfer unit. While picking up by the arm 94 on the right side of 82a, the central substrate transfer portion 82b is positioned at the second position P2 in accordance with the movement stage 35 of the left substrate transfer portion 33L being positioned at the “substrate transfer position”. The substrate 2 on the left substrate transfer unit 33L is picked up by the left arm 94 of the substrate transfer unit 82b. Further, the right substrate transfer portion 82c is positioned at the fourth position P4 (FIG. 29A).

  When the above operation is completed, the control device 24 positions the right substrate transfer portion 82c at the sixth position P6 and positions the right substrate transfer portion 33R at the front position of the component mounting operation portion 22b. By positioning the substrate transfer portion 82b at the fourth position P4, the substrate 2 picked up from the left substrate transfer portion 33L is placed and held on the substrate holding stage 53T of the right substrate transfer portion 33R, and leftward By positioning the substrate transfer portion 82a at the second position P2, the substrate 2 picked up from the substrate receiving portion 21 is placed and held on the substrate holding stage 36T of the left substrate transfer portion 33L (FIG. 29B). ).

  After holding the substrate 2 on the substrate holding stage 53T of the right substrate transfer unit 33R and the substrate holding stage 36T of the left substrate transfer unit 33L, the control device 24 moves the moving stage 35 of the left substrate transfer unit 33L to “ While the ACF adhering operation unit 22a performs the ACF adhering operation on the substrate 2 at the “operating position”, the moving stage 52 of the right substrate transfer unit 33R is moved to the “operating position” and the substrate holding stage 53T. By placing the placed substrate 2 above the backup stage 64 for component mounting operation, the component mounting operation for the substrate 2 by the component mounting operation unit 22b is executed (FIG. 29 (c), component mounting step).

  After executing the ACF adhering operation by the ACF adhering operation unit 22a and the component mounting operation by the component mounting operation unit 22b, the control device 24 moves the right substrate transfer unit 33R to the right (second component crimping operation unit). 22d side) and the substrate 2 held on the substrate holding stage 53T is transferred to the second component crimping working part 22d, and the substrate 2 placed on the substrate holding stage 53T is moved to one side (here, left). A component crimping operation is performed on the substrate 2 by the second component crimping operation portion 22d, being positioned above the backup stage 72 for component crimping (FIG. 30A, component crimping step). At the same time, the left substrate transfer unit 82a is positioned at the first position P1, and the substrate 2 placed on the substrate receiving stage 21s on the left side of the substrate receiving unit 21 is moved to the left substrate transfer unit 82a. The left substrate 94 is picked up, and the central substrate transfer portion 82b is positioned at the second position P2 in accordance with the movement stage 35 of the left substrate transfer portion 33L being positioned at the “substrate transfer position”. The substrate 2 on the substrate holding stage 36T of the left substrate transfer unit 33L is picked up by the right arm 94 of the transfer unit 82b. Further, while moving the moving stage 52 of the central substrate transfer unit 33C to the “substrate delivery position”, the central substrate transfer unit 33C is positioned in front of the component mounting operation unit 22b and is positioned in front of the component mounting operation unit 22b. The substrate 2 on the substrate holding stage 53T of the central substrate transfer unit 33C is picked up by the right arm 94 of the right substrate transfer unit 82c (FIG. 30A).

  When the above operation is completed, the control device 24 positions the right substrate transfer portion 82c at the sixth position P6 and sets the substrate 2 picked up by the right arm 94 at the second interval. The substrate 2 picked up from the substrate holding stage 36T of the left substrate transfer unit 33L is moved to the central substrate transfer while the central substrate transfer unit 82b is positioned at the fourth position P4. The substrate picked up from the substrate receiving stage 21s on the left side of the substrate receiving unit 21 by placing and holding the substrate holding stage 53T of the unit 33C and positioning the left substrate transfer unit 82a at the second position P2. 2 is placed and held on the substrate holding stage 36T of the left substrate transfer part 33L (FIG. 30B).

  After placing the substrate 2 on the substrate holding stage 53T of the central substrate transfer unit 33C and the substrate holding stage 36T of the left substrate transfer unit 33L, the control device 24 moves the moving stage 35 of the left substrate transfer unit 33L to “work”. The ACF adhering operation unit 22a performs the ACF adhering operation on the substrate 2 while the moving stage 52 of the central substrate transfer unit 33C is positioned at the “operating position” and the substrate on the substrate holding stage 53T. 2 is positioned above the backup stage 64 for component mounting operation, and the component mounting operation for the substrate 2 by the component mounting operation unit 22b is executed (FIG. 30C, component mounting step). During this time, the substrate transfer stage 23s on the right side of the substrate transfer unit 23 is moved in the right direction to set the interval between the two substrate transfer stages 23s to the second interval (FIG. 30C).

  After executing the ACF adhering operation by the ACF adhering operation unit 22a and the component mounting operation by the component mounting operation unit 22b, the control device 24 moves the central substrate transfer unit 33C to the left (the first component crimping operation unit 22c). The substrate 2 held on the substrate holding stage 53T is transferred to the first component crimping working part 22c, and the substrate 2 placed on the substrate holding stage 53T is crimped on one (here, the right) component. A component crimping operation is performed on the substrate 2 by the first component crimping working portion 22c, being positioned above the work backup stage 72 (FIG. 31A, component crimping step). At the same time, the left substrate transfer unit 82a is positioned at the first position P1, and the substrate 2 placed on the substrate receiving stage 21s on the right side of the substrate receiving unit 21 is moved to the left substrate transfer unit 82a. The right substrate 94 is picked up, and the central substrate transfer portion 82b is positioned at the second position P2 in accordance with the movement stage 35 of the left substrate transfer portion 33L being positioned at the “substrate transfer position”. The substrate 2 on the substrate holding stage 36T of the left substrate transfer unit 33L is picked up by the left arm 94 of the transfer unit 82b (FIG. 31A).

  When the above operation is completed, the controller 24 places the right substrate transfer portion 82c at the sixth position P6 and places the substrate 2 picked up by the left arm 94 on the left substrate transfer stage 23s of the substrate transfer portion 23. The substrate 2 picked up from the substrate holding stage 36T of the left substrate transfer unit 33L is placed on the substrate holding stage 53T of the right substrate transfer unit 33R with the central substrate transfer unit 82b positioned at the fourth position P4. The substrate 2 picked up from the substrate receiving stage 21s on the right side of the substrate receiving unit 21 is placed on the substrate holding stage 36T of the left substrate transferring unit 33L by positioning the left substrate transfer unit 82a at the second position P2. It is mounted (FIG. 31 (b)).

  Since the state of FIG. 31 (b) is exactly the same as the state of FIG. 29 (b), the substrate to the substrate receiving unit 21 is subsequently repeated by repeating the steps of FIGS. 29 (b) to 31 (a). Continuous board production can be performed by repeatedly executing a series of operations from loading of 2 to mounting of the component 4 on the board 2 to unloading to the board delivery unit 23.

  As described above, the component mounting apparatus 1 according to the present embodiment sets the interval between the two substrate receiving stages 21 s in addition to the component mounting unit 22 that performs component mounting on the substrate 2 to the first interval. Two small-sized substrates 2 sent from the upstream process side are received, or the interval between the two substrate receiving stages 21s is set to a second interval larger than the first interval, and sent from the upstream process side. The board receiving unit 21 that receives two large-sized boards 2 larger than the incoming small-sized board 2 and the small-sized or large-sized board 2 received by the board receiving unit 21 are transferred to the component mounting unit 22. The left-side substrate transfer unit 82a receives the small-size two substrates 2 when the substrate-receiving unit 21 receives two small-sized substrates 2. When the two small-sized substrates 2 are simultaneously transferred to the component mounting unit 22 and the substrate receiving unit 21 receives the two large-sized substrates 2, the large size received by the substrate receiving unit 21 is received. The two substrates 2 of the size are individually transferred to the component mounting unit 22 one by one.

  Further, the component mounting unit 22 is a small size substrate 2 that has been transferred simultaneously by the left substrate transfer unit 82a, or a large size that has been individually transferred by the left substrate transfer unit 82a. A left substrate transfer unit 33L as a substrate holding unit for holding the substrate 2 and an ACF adhering work unit 22a (adhesion) for adhering the ACF tape 3 as an adhesive member to the substrate 2 held by the left substrate transfer unit 33L Member mounting operation unit), component mounting operation unit 22b for mounting component 4 on substrate 2 to which ACF tape 3 is bonded by ACF bonding operation unit 22a, and substrate 2 on which component 4 is mounted in component mounting operation unit 22b. The component mounting operation unit 22b includes a component crimping unit (first component crimping unit 22c and second component crimping unit 22d) for crimping the component 4 mounted on the component mounting unit 22b. 2 pieces of size A first substrate holding stage (two substrate holding stages 36) for simultaneously holding 2 or a second substrate holding stage (one substrate holding stage 36T) for holding one large-sized substrate 2 is selectively attached. It is possible.

  Further, the left substrate transfer unit 82a has an interval at which the substrate receiving unit 21 can simultaneously pick up two small-sized substrates 2 received with the two substrate receiving stages 21s adjusted to the first interval. The left substrate transfer unit 82a is configured to have a small size with the substrate receiving unit 21 adjusting the two substrate receiving stages 21s to the first interval. When two substrates 2 are received, two small substrates 2 are simultaneously picked up by two arms 94 and transferred to the left substrate transfer unit 33L, while the substrate receiving unit 21 has two substrates. When two large substrates 2 are received with the receiving stage 21 s adjusted to the second interval, one large substrate 2 is picked out of one of the two arms 94. The substrate receiving unit 21 adjusts the two substrate receiving stages 21s to the first interval after the substrate receiving unit 21 adjusts the two substrate receiving stages 21s to the first interval. One substrate 2 is picked up and transferred to the left substrate transfer part 33L.

  In the component mounting method according to the present embodiment, the two substrate receiving stages 21s are set at the first interval to receive the two small-sized substrates 2 sent from the upstream process side, or 2 The two large-sized substrates 2 larger in size than the small-sized substrates sent from the upstream process side are received by setting the interval between the two substrate receiving stages 21s to a second interval larger than the first interval. Including a substrate transfer step, a substrate transfer step of transferring the small-size or large-size substrate 2 received in the substrate reception step to the component mounting unit 22, and the substrate transfer step includes two small-size substrates in the substrate reception step. When the board is received, the two small-sized boards 2 received in the board receiving process are simultaneously transferred to the component mounting unit 22, and the two large-sized boards 2 are transferred in the board receiving process. If only taken is made it shall be transferred to the two individual component mounting unit one by one the substrate 2 of the large size received on the substrate receiving step.

  In the component mounting apparatus 1 and the component mounting method in the present embodiment, the small substrate 2 received from the upstream process side is received by setting the interval between the two substrate receiving stages 21s to the first interval. Alternatively, two large-sized sheets larger than the small-sized substrate 2 sent from the upstream process side with the interval between the two substrate receiving stages 21s set to a second interval larger than the first interval. The substrate 2 is received. When two large-sized boards 2 are received, the received two large-sized boards 2 are individually transferred to the component mounting unit 22 one by one. Since component mounting can be performed on either the large-sized substrate 2 or the large-sized substrate 2, it is possible to unify the production lines for the large-sized and small-sized substrates 2.

  A component mounting apparatus and a component mounting method capable of mounting a component on both a small-sized substrate and a large-sized substrate and integrating a production line for two large and small-sized substrates. provide.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Board | substrate 3 ACF tape (adhesive member)
4 component 21 board receiving part 21s board receiving stage 22 component mounting part 22a ACF sticking work part (adhesive member sticking work part)
22b Component mounting work unit 22c First component crimping work unit (component crimping work unit)
22d Second component crimping work part (component crimping work part)
33L Left substrate transfer unit (substrate holding unit)
36 Substrate holding stage (first substrate holding stage)
36T substrate holding stage (second substrate holding stage)
82a Left substrate transfer part (substrate transfer part)
94 Arm (pickup means)

Claims (5)

A component mounting apparatus having a component mounting unit for mounting components on a board,
The interval between the two substrate receiving stages is set to the first interval to receive two substrates of the first size sent from the upstream process side, or the interval between the two substrate receiving stages is set to the first interval A substrate receiving unit configured to receive two substrates of a second size larger than the first size of substrates sent from the upstream process side by setting a second interval larger than the interval;
A board transfer section for transferring the board of the first size or the second size received by the board receiving section to the component mounting section;
When the substrate receiving unit receives the two substrates of the second size, the substrate transfer unit individually mounts the received two substrates of the second size one by one. When the board receiving unit receives the two substrates of the first size, the received two substrates of the first size are simultaneously transferred to the component mounting unit. The component mounting apparatus characterized by performing. The component mounting unit may include the first size substrate that has been simultaneously transferred by the substrate transfer unit or the second size that has been individually transferred by the substrate transfer unit one by one. A substrate holder for holding the substrate;
An adhesive member adhered working unit of sticking an adhesive member to a substrate held by the substrate holder,
A component mounting work unit for mounting the component on the substrate on which the adhesive member is pasted by the adhesive member pasting unit;
A component crimping work unit for crimping the component mounted in the component mounting work unit on a substrate on which the component is mounted in the component mounting work unit;
The substrate holding unit selectively selects a first substrate holding stage that holds two substrates of the first size at the same time or a second substrate holding stage that holds one substrate of the second size. The component mounting apparatus according to claim 1 , wherein the component mounting apparatus can be attached. The substrate transfer unit is disposed at an interval at which the substrate receiving unit can pick up the two substrates of the first size received in a state where the two substrate receiving stages are adjusted to the first interval. The substrate transfer unit includes two pickup means, and the substrate transfer unit holds the two substrates of the first size in a state where the substrate reception unit adjusts the two substrate reception stages to the first interval. 3. The component mounting apparatus according to claim 2 , wherein when received, the two pickup means simultaneously pick up the two substrates of the first size and transfer them to the substrate holder. 4. When the substrate receiving unit receives the two substrates of the second size in a state in which the substrate receiving unit adjusts the two substrate receiving stages to the second interval, the two pickup means After one of the substrates of the second size is picked up and transferred to the substrate holding unit, the substrate receiving unit then adjusts the two substrate receiving stages to the first interval 4. The component mounting apparatus according to claim 3 , wherein the other one of the two pickup means picks up the remaining one substrate of the second size and transfers it to the substrate holder. A component mounting method using a component mounting apparatus including a component mounting unit for mounting components on a board,
The interval between the two substrate receiving stages is set to the first interval to receive two substrates of the first size sent from the upstream process side, or the interval between the two substrate receiving stages is set to the first interval A substrate receiving step of receiving two substrates of a second size larger than the first size of substrates sent from the upstream process side with a second interval larger than the interval;
A board transfer step of transferring the board of the first size or the second size received in the board receiving step to the component mounting unit,
In the substrate transfer step, when the two substrates of the second size are received in the substrate receiving step, the received two substrates of the second size are individually mounted one by one. When the two substrates of the first size are received in the substrate receiving step, the received two substrates of the first size are simultaneously transferred to the component mounting unit. A component mounting method characterized by:

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