200810143 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種可替換式發光二極體模組，且特 別疋有關於一種插拔式的可替換式發光二極體模組。 【先前技術】 發光二極體（Light Emitting Diode ; LED)是一種微小的 固恶（Solid-State)光源，兼具體積小、耐震性佳、省電、壽 命長、顏色多樣等優點，且可配合各種新興應用需求，已 成為日常生活中隨處可見的光源。隨著發光二極體之發光 效率逐漸提昇、演色性與色溫表現漸佳及價袼降低，發光 一極體之照明應用領域將更趨寬廣。 與傳統之白熾燈泡及螢光燈相比，發光二極體可具有 多顆、多種的組合，且單一的發光二極體之發熱量低，因 此可減少熱幅射的產生。又由於發光二極體係利用低電 壓、低電流起動，因此其耗電量小，可節省能源。且發光 二板體之耐震性高，可於高頻操作，損毀後之廢棄物可回 收兼具環保特性，且發光二極體可平面封裝並可開發成輕 薄紐小產品，基於以上之優點，發光二極體是被業界看好， 成成為替代傳統照明器具的一大潛力商品。 發光二極體由於體積輕小，常以大量的單顆發光二極 體組成一模組，以供產業上之應用，若是其中一個發光二 極體損，往往需要整組模組進行更換，如此一來，大幅 地增加成本負擔，且發光二極體模組在非照明面之發熱量 積少成多不容小覷，故發光二極體之系統構裝及散熱技術 200810143 開發便成為發光二極體應用所需面對之重要課題。 【發明内容】 口此本明的目的就是在提供一種可替換之發光二極 體模組，用以減少發光二極體模組之維修成本。 本發明的另一目的是在提供一種發光二極體模組，可 配合不同的模組需求進行調整或更換，以增加使用 性。 坪200810143 IX. Description of the Invention: [Technical Field] The present invention relates to an alternative light-emitting diode module, and in particular to a plug-in replaceable light-emitting diode module. [Prior Art] Light Emitting Diode (LED) is a tiny solid-state light source, which has the advantages of small specific capacity, good shock resistance, power saving, long life and various colors. With the needs of a variety of emerging applications, it has become a visible source of light in everyday life. As the luminous efficiency of the light-emitting diode is gradually improved, the color rendering and color temperature performance are gradually improved, and the price is lowered, the lighting application field of the light-emitting diode will be wider. Compared with conventional incandescent bulbs and fluorescent lamps, the light-emitting diodes can have a combination of multiple and multiple, and the single light-emitting diode has a low heat generation, thereby reducing the generation of heat radiation. Since the light-emitting diode system is activated by low voltage and low current, it consumes less power and saves energy. The light-emitting two-plate body has high shock resistance and can be operated at high frequency. The damaged waste can be recycled and has environmental protection characteristics, and the light-emitting diode can be planarly packaged and can be developed into a light and thin new product. Based on the above advantages, Light-emitting diodes are favored by the industry and become a potential commodity to replace traditional lighting fixtures. Due to the small size of the light-emitting diode, a large number of single light-emitting diodes are often used to form a module for industrial applications. If one of the light-emitting diodes is damaged, the entire module is often required to be replaced. In the first place, the cost burden is greatly increased, and the heat generation of the light-emitting diode module on the non-illuminated surface is not too small, so the system assembly and heat dissipation technology of the light-emitting diode 200810143 becomes a light-emitting diode. The important issues that need to be applied to the application. SUMMARY OF THE INVENTION The purpose of the present invention is to provide an alternative light-emitting diode module for reducing the maintenance cost of the LED module. Another object of the present invention is to provide a light emitting diode module that can be adjusted or replaced in accordance with different module requirements to increase usability. Ping
對插腳之另一側，其中發光模組係藉由插腳與基座模組中 之插槽耦合。基座模組包含一散熱結構，配置於底板上， 而插槽可配置於散熱結構中。每一發光模組中之插腳可為 一散熱插腳，其中每一發光模組所產生之一熱量，可經由 根據本發明之上述目的，提出一種可替換式發光二體 模組，係利用一插拔之方式，以組合一基座模組及至少一 發光模組。基座模組包含一底板，以及配置於底板上之複 數個插槽。發光模組包含一本體，配置於本體之一側與插 槽對應之一插腳，以及複數個發光二極體，配置於本體相 散熱插腳與散熱結構進行一熱交換。散熱結構可具有複數 個政熱塊，配置於插槽之間，以與散熱插腳進行熱交換。 此散熱塊可與散熱插腳直接接觸。此散熱塊之材料可為一 金屬材料、一陶瓷材料，或一高分子材料。此金屬材料可 為銅或鋁。基座模組更包含一供電裝置，配置於底板上， 母發光板組更包含一驅動接腳，配置於本體對應供電裝 置處，且可於組合時與供電裝置接觸，其中供電裝置所提 供之一電源可經由驅動接腳，傳送至發光二極體使用。驅 200810143 動接腳包含複數個連接器，且可與供電裝置相接觸，每一 發光二極體具有-引腳組與連接器之其中之一連接。發光 二極體之本體較佳地係為一長形薄板結構，發光二極體較 佳地係為一線形排列，且配置於長形薄板結構較長之一 側，散熱插腳及驅動接腳則配置於長形薄板結構較長之另 一側。線形排列可為一單面之線形排列或為一雙面之線形 排列。 -本發明之另一態樣為一種可替換式發光二極體模組， • &含"基座模組以及至少—發光模組。其巾基座模組包含 一底板’配置於底板上之至少—散熱結構，以及配置於散 熱結構中之複數個插槽。其中每一發光模組包含一本體， 配置於本體之-側對應於插槽之至少一散熱插腳，以及複 數個發光二極體，配置於本體相對散熱插腳之另一側，其 中發光模組係藉由散熱插腳與散熱結構中之插槽之至少其 中之-耗合。每一散熱結構可具有複數個散熱塊，配置ς 插槽之間’其中每一發光模組所產生之一熱量，可經由散 籲#插腳與散熱塊進行一熱交換。此散熱插腳可與散熱塊直 接接觸以進行熱交換。散熱塊之材料可為一金屬材料、一 陶竟材料，或為一高分子材料。此金屬材料可為銅或銘。 基座模組可更包含一供電裝置，配置於底板上，每一發光 模組可更包含一驅動接腳，配置於本體對應於供電裝置之 處’ ^可於組合時與供電裝置相接觸，其中供電裝置所提 =之-電源可經由驅動接腳，傳送至發光二極體使用。驅 動接腳可包含複數個連接器，以與供電裝置相接觸，每一 發光二極體具有-引腳組，其中每一引腳組可與連接器之 200810143 其中之一相連接。發光模組之本體較佳地係為一長形薄板 結構，發光二極體較佳地係為一線形排列，且配置於長形 薄板結構較長之一側，而散熱插腳及驅動接腳則配置於長 形薄板結構較長之另一側。此線形排列可為一單面之線形 排列或為一雙面之線形排列。 、本發明之可替換式發光二極體模組，係利用插拔之方 式固疋發光模組及基座模組，且每一發光模組係為獨立設 此口此：’可配合所需之焭度及顏色進行發光模組之 調整，且若是其中有-顆發光二極體損壞，僅需更換其中 :組發光模組即可，如此—來，可大幅地降低可替換式發 光一極體模組之維修成本並增加使用之彈性。且發光模組 所產生之熱1，可經由具散熱功能之插腳，與基座模組上 之散熱結構中之散熱塊進行熱交換，如此-來，發光二極 體可經由基座模組進行散熱，以解決習知技術中積熱之問 題。發光模組中之發光二極體可為線形排列，因此，可配 合不同形狀之模組需求，藉由調整每—個發光模組的長 度，以組合為模組所需之面光源。 【實施方式】 以下將以圖式及詳細說明清楚說明本發明之精神，任 何所屬技術領域中具有通常知識者在瞭解本發明之較佳實 施例後，當可由本發明所教示之技術，加以改變及修飾， 其並不脫離本發明之精神與範圍。 參第1圖，其綠示本發明之可替換發光二極體模组 一較佳實施例的爆炸圖。可替換式發光二極體模組100、包 200810143 含至少一發光模組11 0以及一基座模組1 50，並利用一插拔 之方式組合基座模組150與發光模組11〇。其中基座模組 150包含一底板160，以及複數個插槽172配置於底板16〇 上。每一個發光模組110包含一本體112、一插腳13〇,以 及複數個發光二極體120。其中插腳130係配置於本體112 之一端對應於插槽172之處，發光二極體12〇則是配置於 本體112相對插腳130之另一側。可替換式發光二極體模 組1〇〇可藉由插腳130與插槽172之耦合，將發光模組11〇 # 組合於基座模組I50上，並可藉由拔出發光模組110,以分 離發光模組110及基座模組150，即為使用插拔之固定方 式。 相較於傳統之發光二極體模組，此可替換式發光二極 體模組100係利用插拔的方式固定發光模組110及基座模 組150,且每一個發光模組11〇係為獨立配置，若是其中一 個發光二極體120損壞，僅需更換損壞之發光模組11〇即 可，如此一來，可有效地降低可替換式發光二極體模組之 φ 維修成本。且此可替換式發光二極體模組1〇〇可藉由具有 不同顏色之發光模組110,以提供不同組合之外觀色彩，如 此一來，更可增加使用之彈性。 基座模組150更包含一散熱結構17〇以進行散熱，其 中插槽172係配置於散熱結構17〇中。散熱結構174包含 複數個散熱塊174,配置於插槽m之間，插腳13〇可為一 散熱插腳，以於與插槽172耦合時，與散熱塊174進行一 熱父換。散熱塊174之材料可為一高導熱材料，如一金屬 材料、一陶兗材料，或為一高分子材料。散熱塊174之材 200810143 料可為銅或銘，而發光模組11 〇所產生之一熱量係經由插 腳130，與配置於基座模組150上之散熱塊174進行熱交 換。底板160之材料較佳地係為銘。具散熱功能之插腳13〇 可具有一金屬表面132，以提高插腳130之散熱效果。 基座模組150可更包含一供電裝置18〇，配置於底板 160上，供電裝置180可與一外部電源相連接，以提供可替 換式發光二極體模組1〇〇所需之電源。發光模組11〇可更 具有一驅動接腳140，配置於本體112對應於供電裝置18〇 處，且於組合時與供電裝置180接觸。每一個發光二極體 120均具有一包含正負極之引腳組122，驅動接腳丨上具 有複數個連接器142,發光二極體12〇之引腳組122係連接 至連接器142。當發光模組110與基座模組15〇組合時，供 电裝置180所提供之電源，可傳送至與供電裝置相接 觸之連接器142,再經由連接器142傳送至引腳組122，以 驅動發光二極體120。發光模組11〇較佳地係為一長形薄板 結構’發光二極體12G較佳係為—線形排列，魏置於發 光mio杈長之一側’具散熱功能之插腳⑽與驅動接 腳H0可配置於發光模組11〇較長之另一側。此線形排列 可為一単面之線形排列。每一個發光模組ιι〇之長度可配 合不同形狀的模組需求進行修改 11Λ, A 汉以將複數個的發光模組 0、、且a形成模組所需之一面光源。 可替換式發光二極體模組1〇〇 仆，與点丨二一 」具有不同類型之變 舉例而吕’發光模組110之數 線強度進行增減，散埶έ士構170 & 者斤人使用之先 、每虹2 ^…、·。構170中之散熱塊174可替換為 複數個散熱鰭片。參昭第 』曰挟馬 >”，、弟2圖，其係繪示本發明之可替換 200810143 式發光二極體模組另一較佳實施例之爆炸圖。基座模組i5〇 之底板160上可具有複數個散熱結構17〇，而發光模組ιι〇 亦具有對應之複數個兼具散熱功能之插腳13〇，以與散熱結 構170中之插槽172耦合並進行熱交換。或者，插腳13〇 可與散熱塊174直接接觸，以進行發光模組11〇之散熱。 發光二極體120亦可為一雙面之線形排列，以增加單位面 積之亮度。 由上述本發明較佳實施例可知，、應用本發明具有下列 • 優點。本發明之可替換式發光二極體模組，係初用插拔之 方式固定發光模組及基座模組’且每一發光模組係為獨立 δ又置，因此，可配合所需之亮度及顏色進行調整，若是其 中有一顆發光二極體損壞，僅需更換其中一組發光模組即 可，如此一來，可大幅地降低可替換式發光二極體模組之 維修成本。且發光模組所產生之熱量，可經由具散熱功能 之插腳，與基座模組上之散熱結構中之散熱塊進行熱交 換，如此一來，發光二極體可經由基座模組進行散熱，以 • 解決習知積熱之問題。發光模組中之發光二極體可為線形 排列，因此，可配合不同形狀之模組需求，藉由調整每一 個發光模組的長度，以組合為模組所需之面光源。 雖然本發明已以一較佳實施例揭露如上，然其並非用 以限定本發明，任何所屬技術領域中具有通常知識者，在 不脫離本發明之精神和範圍内，當可作各種之更動與潤 飾，因此本發明之保護範圍當視後附之申請專利範圍所界 定者為準。 11 200810143 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之詳細說明如下： 第1圖係緣示本發明> 月之可替換式發光二極體模組一較 佳實施例之爆炸圖。 第2圖係繪示本發g月 較佳實施例之爆炸圖。 之可替換式發光二極體模組另 _ _On the other side of the pin, the light module is coupled to the slot in the base module by pins. The pedestal module includes a heat dissipation structure disposed on the bottom plate, and the socket is configurable in the heat dissipation structure. The pin in each of the light-emitting modules can be a heat-dissipating pin, and one of the heat generated by each of the light-emitting modules can provide a replaceable light-emitting two-body module according to the above object of the present invention. The method of pulling out is to combine a base module and at least one light emitting module. The base module includes a base plate and a plurality of slots disposed on the base plate. The light-emitting module comprises a body disposed on one side of the body and one pin corresponding to the slot, and a plurality of light-emitting diodes disposed on the heat-dissipating pin of the body and the heat-dissipating structure for heat exchange. The heat dissipation structure may have a plurality of thermal blocks disposed between the slots for heat exchange with the heat sink pins. This heat sink block can be in direct contact with the heat sink pins. The material of the heat sink block may be a metal material, a ceramic material, or a polymer material. This metal material can be copper or aluminum. The base module further includes a power supply device disposed on the bottom plate, and the mother light-emitting board group further includes a driving pin disposed at the corresponding power supply device of the body, and can be in contact with the power supply device when combined, wherein the power supply device provides A power source can be transmitted to the light emitting diode via the driving pin. Drive 200810143 The dynamic pin includes a plurality of connectors and is in contact with the power supply device, and each of the light emitting diodes has a - pin group connected to one of the connectors. Preferably, the body of the light-emitting diode is an elongated thin plate structure, and the light-emitting diodes are preferably arranged in a line shape, and are disposed on one side of the elongated thin plate structure, and the heat-dissipating pins and the driving pins are disposed. It is placed on the other side of the long thin plate structure. The linear arrangement may be a single-sided linear arrangement or a double-sided linear arrangement. - Another aspect of the invention is a replaceable light emitting diode module, && base module and at least - light emitting module. The towel base module includes a bottom plate 'at least a heat dissipating structure disposed on the bottom plate, and a plurality of slots disposed in the heat dissipating structure. Each of the light-emitting modules includes a body, at least one heat-dissipating pin corresponding to the slot disposed on the side of the body, and a plurality of light-emitting diodes disposed on the other side of the body opposite to the heat-dissipating pin, wherein the light-emitting module is At least one of the slots in the heat sink structure and the heat sink structure is utilized. Each of the heat dissipating structures may have a plurality of heat dissipating blocks, and one of the heat generated by each of the light emitting modules disposed between the slots may be heat exchanged with the heat dissipating blocks via the dissipating # pins. This heat sink pin can be in direct contact with the heat sink for heat exchange. The material of the heat sink block may be a metal material, a ceramic material, or a polymer material. This metal material can be copper or polished. The base module can further include a power supply device, and is disposed on the bottom plate. Each of the light-emitting modules can further include a driving pin disposed at a position corresponding to the power supply device of the body. The power supply device can be used to transmit the power to the light-emitting diode via the drive pin. The drive pin can include a plurality of connectors for contacting the power supply, each of the light emitting diodes having a - pin set, wherein each pin set can be coupled to one of the connectors 200810143. Preferably, the body of the light-emitting module is an elongated thin-plate structure, and the light-emitting diodes are preferably arranged in a line shape and disposed on one side of the elongated thin-plate structure, and the heat-dissipating pins and the driving pins are disposed. It is placed on the other side of the long thin plate structure. The linear arrangement may be a single-sided linear arrangement or a double-sided linear arrangement. The replaceable light-emitting diode module of the present invention is configured to fix the light-emitting module and the base module by means of plugging and unplugging, and each of the light-emitting modules is independently provided with the port: The brightness and color are adjusted by the light-emitting module, and if one of the light-emitting diodes is damaged, only the group of light-emitting modules can be replaced, so that the replaceable light-emitting one can be greatly reduced. The maintenance cost of the body module increases the flexibility of use. The heat generated by the light-emitting module can be exchanged with the heat-dissipating block in the heat-dissipating structure on the base module via the heat-dissipating pin, so that the light-emitting diode can be performed via the base module. Heat dissipation to solve the problem of heat accumulation in the prior art. The light-emitting diodes in the light-emitting module can be arranged in a line shape. Therefore, the module requirements of different shapes can be matched, and the length of each light-emitting module can be adjusted to combine the surface light sources required for the module. The present invention will be clearly described in the following drawings and detailed description, and those skilled in the art will be able to change the teachings of the present invention. And modifications may be made without departing from the spirit and scope of the invention. Referring to Fig. 1, there is shown an exploded view of a preferred embodiment of the replaceable light-emitting diode module of the present invention. The replacement LED module 100 and the package 200810143 comprise at least one illumination module 110 and a base module 150, and the base module 150 and the illumination module 11 are combined by a plugging method. The base module 150 includes a bottom plate 160, and a plurality of slots 172 are disposed on the bottom plate 16A. Each of the light emitting modules 110 includes a body 112, a pin 13 〇, and a plurality of LEDs 120. The pins 130 are disposed at one end of the body 112 corresponding to the slot 172, and the LEDs 12 are disposed on the other side of the body 112 opposite to the pins 130. The illuminating module 11 is coupled to the pedestal module I50 by the coupling of the pin 130 and the slot 172, and the illuminating module 110 can be pulled out by the illuminating module 110. In order to separate the light-emitting module 110 and the base module 150, it is a fixed manner using plugging and unplugging. Compared with the conventional LED module, the replaceable LED module 100 is used to fix the LED module 110 and the base module 150 by plugging and unplugging, and each of the LED modules 11 For independent configuration, if one of the light-emitting diodes 120 is damaged, only the damaged light-emitting module 11 更换 needs to be replaced, so that the φ maintenance cost of the replaceable light-emitting diode module can be effectively reduced. Moreover, the replaceable LED module 1 can provide different combinations of appearance colors by using the light-emitting modules 110 having different colors, and thus, the flexibility of use can be increased. The base module 150 further includes a heat dissipation structure 17 for dissipating heat, wherein the slot 172 is disposed in the heat dissipation structure 17A. The heat dissipation structure 174 includes a plurality of heat dissipation blocks 174 disposed between the slots m. The pins 13A can be a heat dissipation pin for performing a hot parent exchange with the heat dissipation block 174 when coupled with the socket 172. The material of the heat sink block 174 can be a highly thermally conductive material, such as a metal material, a ceramic material, or a polymer material. The material of the heat sink block 174 200810143 may be copper or inscription, and one of the heat generated by the light-emitting module 11 is thermally exchanged with the heat-dissipating block 174 disposed on the base module 150 via the pin 130. The material of the bottom plate 160 is preferably referred to as the name. The heat sinking pin 13 〇 can have a metal surface 132 to improve the heat dissipation effect of the pin 130. The pedestal module 150 can further include a power supply device 18 〇 disposed on the bottom plate 160. The power supply device 180 can be connected to an external power source to provide the power required for the replaceable LED module. The lighting module 11A can further have a driving pin 140 disposed on the body 112 corresponding to the power supply device 18 , and in contact with the power supply device 180 when combined. Each of the LEDs 120 has a pin group 122 including a positive and negative electrodes, a plurality of connectors 142 on the driving pin, and a pin group 122 of the LEDs 12 connected to the connector 142. When the light emitting module 110 is combined with the base module 15 , the power provided by the power supply device 180 can be transmitted to the connector 142 in contact with the power supply device, and then transmitted to the pin group 122 via the connector 142 to drive Light emitting diode 120. The light-emitting module 11 〇 is preferably an elongated thin-plate structure. The light-emitting diode 12G is preferably arranged in a line shape, and is disposed on one side of the light-emitting mio 杈 ''heat-dissipating pin (10) and the driving pin. H0 can be disposed on the other side of the light-emitting module 11〇. This linear arrangement can be a linear arrangement of a facet. The length of each light-emitting module can be modified according to the requirements of different shapes of the module. 11Λ, A Han will make a plurality of light-emitting modules 0, and a form a surface light source required by the module. The alternative light-emitting diode module 1 servant has a different type of variation with the point 丨 」 而 而 吕 吕 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 170 170 170 170 170 170 170 170 170 170 170 Jin people use the first, each rainbow 2 ^..., ·. The heat sink block 174 in the structure 170 can be replaced with a plurality of heat sink fins. Explosion diagram of another preferred embodiment of the replaceable 200810143 type light-emitting diode module of the present invention is shown in the figure of the 曰挟 曰挟 曰挟 & & 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The bottom plate 160 can have a plurality of heat dissipation structures 17 〇, and the light-emitting module ιι 〇 also has a plurality of pins 13 兼 that have a heat-dissipating function to couple and exchange heat with the slots 172 in the heat dissipation structure 170. The pin 13 直接 can be in direct contact with the heat sink block 174 for heat dissipation of the light emitting module 11 . The light emitting diode 120 can also be arranged in a line shape on both sides to increase the brightness per unit area. It can be seen that the application of the present invention has the following advantages. The replaceable light-emitting diode module of the present invention is to initially fix the light-emitting module and the base module by means of plugging and unplugging, and each light-emitting module is For independent δ, it can be adjusted with the required brightness and color. If one of the LEDs is damaged, only one of the illuminating modules needs to be replaced, which can greatly reduce the brightness. Replacement dipole The maintenance cost of the module, and the heat generated by the light-emitting module can be exchanged with the heat-dissipating block in the heat-dissipating structure on the base module via the heat-dissipating pin, so that the light-emitting diode can be The pedestal module dissipates heat to solve the problem of conventional heat accumulation. The illuminating diodes in the illuminating module can be arranged in a line, so that the module can be adjusted to meet the needs of different shapes of the module. The length of the surface is combined with the surface light source required for the module. Although the present invention has been disclosed above in a preferred embodiment, it is not intended to limit the present invention, and any one of ordinary skill in the art does not deviate from the present invention. In the spirit and scope of the invention, the scope of the invention is defined by the scope of the appended claims. 11 200810143 [Simplified description of the drawings] And other objects, features, advantages and embodiments can be more clearly understood. The detailed description of the drawings is as follows: Figure 1 shows the present invention > Month replaceable light-emitting diode Group than a good exploded view of the embodiment. FIG. 2 shows an exploded view of system of the preferred embodiment of the present embodiment months g. Of a replaceable light emitting diode module further _ _
【主要元件符號說明】 :發光模組 100 :可替換式發光二接 # W雙模110 組[Main component symbol description]: Light-emitting module 100: Replaceable light-emitting diode #W dual-mode 110 group
112 :本體 122 :引腳組 132 :金屬表面 142 :連接器 160 =底板 172 :插槽 180 :供電裝置 120 :發光二極體 130 :插腳 140 :驅動接腳 150 :基座模組 170 :散熱結構 174 =散熱塊 12112: body 122: pin group 132: metal surface 142: connector 160 = bottom plate 172: slot 180: power supply device 120: light emitting diode 130: pin 140: drive pin 150: base module 170: heat dissipation Structure 174 = heat sink block 12