CN101122377B - Replaceable light emitting diode module - Google Patents
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 63
- 239000007769 metal material Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
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- 239000003086 colorant Substances 0.000 description 3
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- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
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- 230000035939 shock Effects 0.000 description 2
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- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
Description
技术领域technical field
本发明涉及一种可替换式发光二极管模块,尤其涉及一种插拔式的可替换式发光二极管模块。The invention relates to a replaceable light emitting diode module, in particular to a pluggable replaceable light emitting diode module.
背景技术Background technique
发光二极管(Light Emitting Diode;LED)是一种微小的固态(Solid-State)光源,兼具体积小、耐震性佳、省电、寿命长、颜色多样等优点,且可配合各种新兴应用需求,已成为日常生活中随处可见的光源。随着发光二极管的发光效率逐渐提升、演色性与色温表现渐佳及价格降低,发光二极管的照明应用领域将更趋宽广。Light Emitting Diode (LED) is a tiny solid-state (Solid-State) light source, which has the advantages of small size, good shock resistance, power saving, long life, and various colors, and can meet various emerging application requirements , has become a light source that can be seen everywhere in daily life. As the luminous efficiency of light-emitting diodes gradually improves, the performance of color rendering and color temperature gradually improves, and the price decreases, the lighting application fields of light-emitting diodes will become wider.
与传统的白炽灯泡及荧光灯相比,发光二极管可具有多颗、多种的组合,且单一的发光二极管的发热量低,因此可减少热幅射的产生。又由于发光二极管利用低电压、低电流起动,因此其耗电量小,可节省能源。且发光二极管的耐震性高,可于高频操作,损毁后的废弃物可回收兼具环保特性,且发光二极管可平面封装并可开发成轻薄短小产品,基于以上的优点,发光二极管是被业界看好,能成为替代传统照明器具的一大潜力商品。Compared with traditional incandescent light bulbs and fluorescent lamps, LEDs can have multiple pieces and various combinations, and a single LED has low calorific value, thus reducing the generation of heat radiation. And because the light-emitting diode is started with low voltage and low current, its power consumption is small, which can save energy. In addition, light-emitting diodes have high shock resistance and can be operated at high frequencies. The damaged waste can be recycled and environmentally friendly. Moreover, light-emitting diodes can be flat-packaged and developed into light, thin and short products. Based on the above advantages, light-emitting diodes are widely used in the industry. Optimistic, it can become a great potential commodity to replace traditional lighting fixtures.
发光二极管由于体积轻小,常以大量的单颗发光二极管组成一模块,以供产业上的应用,若是其中一个发光二极管损毁,往往需要整组模块进行更换,如此一来,大幅地增加成本负担,且发光二极管模块在非照明面的发热量积少成多不容小视,故发光二极管的系统构装及散热技术开发,便成为发光二极管应用所需面对的重要课题。Light-emitting diodes are light and small, so a large number of single light-emitting diodes are often used to form a module for industrial applications. If one of the light-emitting diodes is damaged, it is often necessary to replace the entire set of modules, which greatly increases the cost burden , and the calorific value of the LED module on the non-illumination surface is small and large, which cannot be underestimated. Therefore, the system structure of the LED and the development of heat dissipation technology have become important issues for the application of the LED.
发明内容Contents of the invention
因此,本发明所要解决的技术问题在于提供一种可替换的发光二极管模块,用以减少发光二极管模块的维修成本。Therefore, the technical problem to be solved by the present invention is to provide a replaceable LED module to reduce the maintenance cost of the LED module.
本发明的另一目的在于提供一种发光二极管模块,可配合不同的模块需求进行调整或更换,以增加使用时的弹性。Another object of the present invention is to provide a light emitting diode module, which can be adjusted or replaced according to different module requirements, so as to increase the flexibility in use.
为实现上述目的,提出一种可替换式发光二体模块,利用一插拔的方式,以组合一基座模块及至少一发光模块.基座模块包含一底板,以及配置于底板上的多个插槽.发光模块包含一本体,配置于本体的一侧与插槽对应的一插脚,以及多个发光二极管,配置于本体相对插脚的另一侧,其中发光模块通过插脚与基座模块中的插槽耦合.基座模块包含一散热结构,配置于底板上,而插槽可配置于散热结构中.每一发光模块中的插脚可为一散热插脚,其中每一发光模块所产生的一热量,可经由散热插脚与散热结构进行一热交换.散热结构可具有多个散热块,配置于插槽之间,以与散热插脚进行热交换.此散热块可与散热插脚直接接触.此散热块的材料可为一金属材料、一陶瓷材料,或一高分子材料.此金属材料可为铜或铝.基座模块还包含一供电装置,配置于底板上,每一发光模块还包含一驱动接脚,配置于本体对应供电装置处,且可于组合时与供电装置接触,其中供电装置所提供的一电源可经由驱动接脚,传送至发光二极管使用.驱动接脚包含多个连接器,且可与供电装置相接触,每一发光二极管具有一引脚组与连接器的其中之一连接.发光二极管的本体较佳地为一长形薄板结构,发光二极管较佳地为一线形排列,且配置于长形薄板结构较长的一侧,散热插脚及驱动接脚则配置于长形薄板结构较长的另一侧.线形排列可为一单面的线形排列或为一双面的线形排列.In order to achieve the above purpose, a replaceable light-emitting two-body module is proposed, which uses a plug-in method to combine a base module and at least one light-emitting module. The base module includes a base plate and a plurality of Slot. The light-emitting module includes a body, which is arranged on one side of the body and a pin corresponding to the slot, and a plurality of light-emitting diodes, which are arranged on the other side of the body opposite to the pin, wherein the light-emitting module is connected to the base module through the pin Slot coupling. The base module includes a heat dissipation structure, which is arranged on the base plate, and the slot can be arranged in the heat dissipation structure. The pin in each light emitting module can be a heat dissipation pin, and the heat generated by each light emitting module , can conduct a heat exchange with the heat dissipation structure through the heat dissipation pins. The heat dissipation structure can have multiple heat dissipation blocks, which are arranged between the slots to exchange heat with the heat dissipation pins. The heat dissipation block can be in direct contact with the heat dissipation pins. The heat dissipation block The material can be a metal material, a ceramic material, or a polymer material. The metal material can be copper or aluminum. The base module also includes a power supply device, which is arranged on the bottom plate. Each light emitting module also includes a driving interface The feet are arranged at the body corresponding to the power supply device, and can be in contact with the power supply device when combined, wherein a power supply provided by the power supply device can be transmitted to the light-emitting diode for use through the drive pin. The drive pin includes a plurality of connectors, and Can be in contact with the power supply device, each light emitting diode has a set of pins connected to one of the connectors. The body of the light emitting diode is preferably a long thin plate structure, and the light emitting diodes are preferably arranged in a line, and It is arranged on the longer side of the elongated thin plate structure, and the cooling pins and driving pins are arranged on the other side of the elongated thin plate structure. The linear arrangement can be a single-sided linear arrangement or a double-sided linear arrangement .
本发明的另一态样为一种可替换式发光二极管模块,包含一基座模块以及至少一发光模块。其中基座模块包含一底板,配置于底板上的至少一散热结构,以及配置于散热结构中的多个插槽。其中每一发光模块包含一本体,配置于本体的一侧对应于插槽的至少一散热插脚,以及多个发光二极管,配置于本体相对散热插脚的另一侧,其中发光模块通过散热插脚与散热结构中的插槽的至少其中之一耦合。每一散热结构可具有多个散热块,配置于插槽之间,其中每一发光模块所产生的一热量,可经由散热插脚与散热块进行一热交换。此散热插脚可与散热块直接接触以进行热交换。散热块的材料可为一金属材料、一陶瓷材料,或为一高分子材料。此金属材料可为铜或铝。基座模块可还包含一供电装置,配置于底板上,每一发光模块可还包含一驱动接脚,配置于本体对应于供电装置之处,且可于组合时与供电装置相接触,其中供电装置所提供的一电源可经由驱动接脚,传送至发光二极管使用。驱动接脚可包含多个连接器,以与供电装置相接触,每一发光二极管具有一引脚组,其中每一引脚组可与连接器的其中之一相连接。发光模块的本体较佳地为一长形薄板结构,发光二极管较佳地为一线形排列,且配置于长形薄板结构较长的一侧,而散热插脚及驱动接脚则配置于长形薄板结构较长的另一侧。此线形排列可为一单面的线形排列或为一双面的线形排列。Another aspect of the present invention is a replaceable light emitting diode module, which includes a base module and at least one light emitting module. The base module includes a bottom plate, at least one heat dissipation structure arranged on the bottom plate, and a plurality of slots arranged in the heat dissipation structure. Wherein each light emitting module comprises a body, is arranged on one side of the body and corresponds to at least one heat dissipation pin of the slot, and a plurality of light emitting diodes, is arranged on the other side of the body opposite to the heat dissipation pin, wherein the light emitting module communicates with the heat dissipation through the heat dissipation pin At least one of the slots in the structure is coupled. Each heat dissipation structure can have a plurality of heat dissipation blocks arranged between the slots, wherein the heat generated by each light emitting module can be exchanged with the heat dissipation blocks through the heat dissipation pins. The heatsink pins make direct contact with the heatsink for heat exchange. The material of the cooling block can be a metal material, a ceramic material, or a polymer material. The metal material can be copper or aluminum. The base module may further include a power supply device configured on the bottom plate, and each light emitting module may further include a driving pin configured at a position of the body corresponding to the power supply device, and may be in contact with the power supply device when combined, wherein the power supply A power provided by the device can be transmitted to the LED for use through the driving pin. The driving pins may include a plurality of connectors to be in contact with the power supply device, each LED has a set of pins, and each set of pins may be connected to one of the connectors. The body of the light emitting module is preferably an elongated thin plate structure, the light emitting diodes are preferably arranged in a line and arranged on the longer side of the elongated thin plate structure, and the heat dissipation pins and driving pins are arranged on the elongated thin plate The other side of the structure is longer. The linear arrangement can be a single-sided linear arrangement or a double-sided linear arrangement.
本发明的可替换式发光二极管模块,利用插拔的方式固定发光模块及基座模块,且每一发光模块为独立设置因此,因此,可配合所需的亮度及颜色进行发光模块的调整,且若是其中有一颗发光二极管损坏,仅需更换其中一组发光模块即可,如此一来,可大幅地降低可替换式发光二极管模块的维修成本并增加使用的弹性。且发光模块所产生的热量,可经由具散热功能的插脚,与基座模块上的散热结构中的散热块进行热交换,如此一来,发光二极管可经由基座模块进行散热,以解决现有技术中积热的问题。发光模块中的发光二极管可为线形排列,因此,可配合不同形状的模块需求,通过调整每一个发光模块的长度,以组合为模块所需的面光源。The replaceable light-emitting diode module of the present invention fixes the light-emitting module and the base module by plugging and unplugging, and each light-emitting module is set independently. Therefore, the light-emitting module can be adjusted according to the required brightness and color, and If one of the light-emitting diodes is damaged, only one set of light-emitting modules needs to be replaced. In this way, the maintenance cost of the replaceable light-emitting diode modules can be greatly reduced and the flexibility of use can be increased. And the heat generated by the light-emitting module can exchange heat with the heat-dissipating block in the heat-dissipating structure on the base module through the pins with heat dissipation function, so that the light-emitting diodes can dissipate heat through the base module to solve the existing problem Accumulated problems in technology. The light-emitting diodes in the light-emitting module can be arranged in a line. Therefore, according to the requirements of modules of different shapes, the length of each light-emitting module can be adjusted to form the surface light source required by the module.
采用本发明的可替换式发光二极管模块可大幅地降低可替换式发光二极管模块的维修成本,且发光模块所产生的热量,可经由具散热功能的插脚,与基座模块上的散热结构中的散热块进行热交换,因此,发光二极管可经由基座模块进行散热,以解决现有积热的问题。而且,采用本发明可配合不同形状的模块需求,通过调整每一个发光模块的长度,以组合为模块所需的面光源。The use of the replaceable LED module of the present invention can greatly reduce the maintenance cost of the replaceable LED module, and the heat generated by the light emitting module can be connected with the heat dissipation structure on the base module through the heat dissipation pins. The heat dissipation block performs heat exchange, so the LEDs can dissipate heat through the base module to solve the problem of existing heat accumulation. Moreover, the present invention can be used to meet the requirements of modules of different shapes, and by adjusting the length of each light-emitting module, it can be combined into a surface light source required by the module.
附图说明Description of drawings
图1为本发明的可替换式发光二极管模块一较佳实施例的分解图,FIG. 1 is an exploded view of a preferred embodiment of the replaceable LED module of the present invention,
图2为本发明的可替换式发光二极管模块另一较佳实施例的爆炸图。FIG. 2 is an exploded view of another preferred embodiment of the replaceable LED module of the present invention.
其中,附图标记:Among them, reference signs:
100:可替换式发光二极管模 110:发光模块100: replaceable light-emitting diode module 110: light-emitting module
112:本体 120:发光二极管112: Body 120: LED
122:引脚组 130:插脚122: Pin group 130: Pin
132:金属表面 140:驱动接脚132: metal surface 140: drive pin
142:连接器 150:基座模块142: Connector 150: Base module
160:底板 170:散热结构160: Bottom plate 170: Heat dissipation structure
172:插槽 174:散热块172: slot 174: cooling block
180:供电装置180: power supply device
具体实施方式Detailed ways
参照图1,其为本发明的可替换发光二极管模块一较佳实施例的分解图。可替换式发光二极管模块100包含至少一发光模块110以及一基座模块150,并利用一插拔的方式组合基座模块150与发光模块110。其中基座模块150包含一底板160,以及多个插槽172配置于底板160上。每一个发光模块110包含一本体112、一插脚130,以及多个发光二极管120。其中插脚130配置于本体112的一端对应于插槽172之处,发光二极管120则是配置于本体112相对插脚130的另一侧。可替换式发光二极管模块100可通过插脚130与插槽172的耦合,将发光模块110组合于基座模块150上,并可通过拔出发光模块110,以分离发光模块110及基座模块150,即为使用插拔的固定方式。Referring to FIG. 1 , it is an exploded view of a preferred embodiment of the replaceable LED module of the present invention. The
相较于传统的发光二极管模块,此可替换式发光二极管模块100利用插拔的方式固定发光模块110及基座模块150,且每一个发光模块110为独立配置,若是其中一个发光二极管120损坏,仅需更换损坏的发光模块110即可,如此一来,可有效地降低可替换式发光二极管模块的维修成本。且此可替换式发光二极管模块100可通过具有不同颜色的发光模块110,以提供不同组合的外观色彩,如此一来,更可增加使用的弹性。Compared with the traditional LED module, the
基座模块150还包含一散热结构170以进行散热,其中插槽172配置于散热结构170中。散热结构174包含多个散热块174,配置于插槽172之间,插脚130可为一散热插脚,以于与插槽172耦合时,与散热块174进行一热交换。散热块174的材料可为一高导热材料,如一金属材料、一陶瓷材料,或为一高分子材料。散热块174的材料可为铜或铝,而发光模块110所产生的一热量经由插脚130,与配置于基座模块150上的散热块174进行热交换。底板160的材料较佳地为铝。具散热功能的插脚130可具有一金属表面132,以提高插脚130的散热效果。The
基座模块150可还包含一供电装置180,配置于底板160上,供电装置180可与一外部电源相连接,以提供可替换式发光二极管模块100所需的电源。发光模块110可还具有一驱动接脚140,配置于本体112对应于供电装置180处,且于组合时与供电装置180接触。每一个发光二极管120均具有一包含正负极的引脚组122,驱动接脚140上具有多个连接器142,发光二极管120的引脚组122连接至连接器142。当发光模块110与基座模块150组合时,供电装置180所提供的电源,可传送至与供电装置180相接触的连接器142,再经由连接器142传送至引脚组122,以驱动发光二极管120。发光模块110较佳地为一长形薄板结构,发光二极管120较佳为一线形排列,且配置于发光模块110较长的一侧,具散热功能的插脚130与驱动接脚140可配置于发光模块110较长的另一侧。此线形排列可为一单面的线形排列。每一个发光模块110的长度可配合不同形状的模块需求进行修改,以将多个的发光模块110组合形成模块所需的一面光源。The
可替换式发光二极管模块100可具有不同类型的变化,举例而言,发光模块110的数量可随着所欲使用的光线强度进行增减,散热结构170中的散热块174可替换为多个散热鳍片.参照图2,其为本发明的可替换式发光二极管模块另一较佳实施例的爆炸图.基座模块150的底板160上可具有多个散热结构170,而发光模块110也具有对应的多个兼具散热功能的插脚130,以与散热结构170中的插槽172耦合并进行热交换.或者,插脚130可与散热块174直接接触,以进行发光模块110的散热.发光二极管120也可为一双面的线形排列,以增加单位面积的亮度.The
由上述本发明较佳实施例可知,应用本发明具有下列优点。本发明的可替换式发光二极管模块,利用插拔的方式固定发光模块及基座模块,且每一发光模块为独立设置,因此,可配合所需的亮度及颜色进行调整,若是其中有一颗发光二极管损坏,仅需更换其中一组发光模块即可,如此一来,可大幅地降低可替换式发光二极管模块的维修成本。且发光模块所产生的热量,可经由具散热功能的插脚,与基座模块上的散热结构中的散热块进行热交换,如此一来,发光二极管可经由基座模块进行散热,以解决现有积热的问题。发光模块中的发光二极管可为线形排列,因此,可配合不同形状的模块需求,通过调整每一个发光模块的长度,以组合为模块所需的面光源。It can be known from the above preferred embodiments of the present invention that the application of the present invention has the following advantages. The replaceable light-emitting diode module of the present invention fixes the light-emitting module and the base module by plugging and unplugging, and each light-emitting module is set independently, so it can be adjusted according to the required brightness and color, if one of them emits light If the diode is damaged, only one group of the light-emitting modules needs to be replaced, so that the maintenance cost of the replaceable light-emitting diode modules can be greatly reduced. And the heat generated by the light-emitting module can exchange heat with the heat-dissipating block in the heat-dissipating structure on the base module through the pins with heat dissipation function, so that the light-emitting diodes can dissipate heat through the base module to solve the existing problem heat build-up problem. The light-emitting diodes in the light-emitting module can be arranged in a line. Therefore, according to the requirements of modules of different shapes, the length of each light-emitting module can be adjusted to form the surface light source required by the module.
当然,本发明还可有其它多种实施例,在不背离本发明精神及其实质的情况下,熟悉本领域的普通技术人员当可根据本发明做出各种相应的改变和变形,但这些相应的改变和变形都应属于本发明所附的权利要求的保护范围。Certainly, the present invention also can have other various embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these Corresponding changes and deformations should belong to the scope of protection of the appended claims of the present invention.
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WO2005024291A2 (en) * | 2003-09-04 | 2005-03-17 | Space Cannon Vh S.P.A. | Bar provided with led light |
US20060087843A1 (en) * | 2003-01-27 | 2006-04-27 | Tatsumi Setomoto | Multichip led lighting device |
WO2006049086A1 (en) * | 2004-11-01 | 2006-05-11 | Matsushita Electric Industrial Co., Ltd. | Light emitting module, lighting device, and display device |
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US20060087843A1 (en) * | 2003-01-27 | 2006-04-27 | Tatsumi Setomoto | Multichip led lighting device |
WO2004071143A1 (en) * | 2003-02-07 | 2004-08-19 | Matsushita Electric Industrial Co., Ltd. | Socket for led light source and lighting system using the socket |
WO2005024291A2 (en) * | 2003-09-04 | 2005-03-17 | Space Cannon Vh S.P.A. | Bar provided with led light |
WO2006049086A1 (en) * | 2004-11-01 | 2006-05-11 | Matsushita Electric Industrial Co., Ltd. | Light emitting module, lighting device, and display device |
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