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TW200720855A - Exposure method and exposure apparatus - Google Patents

Exposure method and exposure apparatus

Info

Publication number
TW200720855A
TW200720855A TW095139206A TW95139206A TW200720855A TW 200720855 A TW200720855 A TW 200720855A TW 095139206 A TW095139206 A TW 095139206A TW 95139206 A TW95139206 A TW 95139206A TW 200720855 A TW200720855 A TW 200720855A
Authority
TW
Taiwan
Prior art keywords
photomask
exposure
flexible substrate
read
substrate
Prior art date
Application number
TW095139206A
Other languages
Chinese (zh)
Inventor
Ken Miyake
Ken Imanishi
Original Assignee
San Ei Giken Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by San Ei Giken Inc filed Critical San Ei Giken Inc
Publication of TW200720855A publication Critical patent/TW200720855A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

A substrate, a first photomask and a second photomask are highly accurately aligned. Three alignment marks (22, 25, 26) at corresponding positions on the flexible substrate (10), the first photomask (11) and the second photomask (12) are read at the same time by a CCD camera. Based on the mark position information from the read images, a relative position between the flexible substrate (10) and the first photomask (11) and that between the flexible substrate (10) and the second photomask (12) are adjusted and alignment is performed.
TW095139206A 2005-10-25 2006-10-24 Exposure method and exposure apparatus TW200720855A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005309975A JP5117672B2 (en) 2005-10-25 2005-10-25 Exposure method and exposure apparatus

Publications (1)

Publication Number Publication Date
TW200720855A true TW200720855A (en) 2007-06-01

Family

ID=37967750

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095139206A TW200720855A (en) 2005-10-25 2006-10-24 Exposure method and exposure apparatus

Country Status (3)

Country Link
JP (1) JP5117672B2 (en)
TW (1) TW200720855A (en)
WO (1) WO2007049640A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102968000A (en) * 2012-11-21 2013-03-13 京东方科技集团股份有限公司 Dual-sided processing method and exposure device
TWI772549B (en) * 2017-10-31 2022-08-01 日商亞多特克工程股份有限公司 Double-side exposure device and double-side exposure method

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6200224B2 (en) 2012-09-13 2017-09-20 日本メクトロン株式会社 Photomask, photomask set, exposure apparatus and exposure method
JP5326148B2 (en) * 2012-09-18 2013-10-30 ボンドテック株式会社 Transfer method and transfer apparatus
KR101600810B1 (en) * 2014-05-12 2016-03-08 주식회사 옵티레이 Roll to roll exposure device
JP5997409B1 (en) * 2016-05-26 2016-09-28 株式会社 ベアック Double-side exposure apparatus and mask and workpiece alignment method in double-side exposure apparatus
JP7121184B2 (en) * 2017-10-31 2022-08-17 株式会社アドテックエンジニアリング Double-sided exposure device and double-sided exposure method
JP7378910B2 (en) * 2017-10-31 2023-11-14 株式会社アドテックエンジニアリング Double-sided exposure device and double-sided exposure method
JP7412872B2 (en) * 2017-10-31 2024-01-15 株式会社アドテックエンジニアリング Double-sided exposure device
JP7234426B2 (en) * 2017-11-30 2023-03-07 株式会社アドテックエンジニアリング Mask pairs and double-sided exposure equipment
JP7323267B2 (en) * 2017-11-30 2023-08-08 株式会社アドテックエンジニアリング Double-sided exposure device
CN108401373B (en) * 2018-02-12 2020-03-06 广州兴森快捷电路科技有限公司 Circuit board and exposure fool-proofing method thereof
JP6762640B1 (en) * 2020-07-06 2020-09-30 株式会社 ベアック Exposure device
JP7439001B2 (en) * 2021-02-19 2024-02-27 矢崎総業株式会社 Flexible printed circuit board, flexible printed circuit board manufacturing method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3445188A1 (en) * 1984-12-11 1986-07-03 MANIA Elektronik Automatisation Entwicklung und Gerätebau GmbH Layer sequence for the fabrication of a mask for the production of wiring supports
JPH0323457A (en) * 1989-06-20 1991-01-31 Mitsubishi Electric Corp Phototool
JP3180004B2 (en) * 1995-06-27 2001-06-25 松下電工株式会社 Exposure film alignment method and alignment apparatus
JPH09244265A (en) * 1996-03-11 1997-09-19 Toshiba Corp Exposure device
JP2002006515A (en) * 2000-06-22 2002-01-09 Hitachi Kokusai Electric Inc Automatic mask film aligner for printed circuit boards
JP4218418B2 (en) * 2003-05-23 2009-02-04 ウシオ電機株式会社 Double-sided projection exposure system for belt-like workpieces

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102968000A (en) * 2012-11-21 2013-03-13 京东方科技集团股份有限公司 Dual-sided processing method and exposure device
TWI772549B (en) * 2017-10-31 2022-08-01 日商亞多特克工程股份有限公司 Double-side exposure device and double-side exposure method

Also Published As

Publication number Publication date
JP2007121425A (en) 2007-05-17
WO2007049640A1 (en) 2007-05-03
JP5117672B2 (en) 2013-01-16

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