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TW200638098A - Treatment system - Google Patents

Treatment system

Info

Publication number
TW200638098A
TW200638098A TW095102299A TW95102299A TW200638098A TW 200638098 A TW200638098 A TW 200638098A TW 095102299 A TW095102299 A TW 095102299A TW 95102299 A TW95102299 A TW 95102299A TW 200638098 A TW200638098 A TW 200638098A
Authority
TW
Taiwan
Prior art keywords
unit
carrying
conveyance
support part
conveyance path
Prior art date
Application number
TW095102299A
Other languages
Chinese (zh)
Other versions
TWI320022B (en
Inventor
Takeo Kaeriyama
Jun Satake
Tatsuya Iwasaki
Tomihiro Sakata
Mitsuhiro Sakai
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200638098A publication Critical patent/TW200638098A/en
Application granted granted Critical
Publication of TWI320022B publication Critical patent/TWI320022B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The 1st conveyance path 162 that the cylindrical roller 160 is arranged in a predetermined pitch is laid in the carrying-in unit (IN) 120 and the cleaning process part 25. The temporal support part 168 that receives two substrates Gi and Gi+1 from the conveyance mechanism 24 of the conveyance unit 20 simultaneously in the level state at once and supported temporarily, and the moving and carrying mechanism 170 that loads the substrate Gi and Gi+1 from the temporal support part 168 in turn at the predetermined position on the conveyance path 162 is established in the carrying-in unit (IN) 120.
TW095102299A 2005-02-24 2006-01-20 Treatment system TWI320022B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005048922A JP4476133B2 (en) 2005-02-24 2005-02-24 Processing system

Publications (2)

Publication Number Publication Date
TW200638098A true TW200638098A (en) 2006-11-01
TWI320022B TWI320022B (en) 2010-02-01

Family

ID=37040545

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095102299A TWI320022B (en) 2005-02-24 2006-01-20 Treatment system

Country Status (3)

Country Link
JP (1) JP4476133B2 (en)
KR (1) KR101229609B1 (en)
TW (1) TWI320022B (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4708217B2 (en) * 2006-02-28 2011-06-22 大日本スクリーン製造株式会社 Substrate processing apparatus and lifting apparatus
KR101291794B1 (en) * 2006-03-17 2013-07-31 엘지디스플레이 주식회사 System for manufacturing liquid crystal display panel and liquid crystal display panel using the same
JP4312787B2 (en) * 2006-11-15 2009-08-12 東京エレクトロン株式会社 Vacuum dryer
KR100824996B1 (en) * 2006-12-27 2008-04-24 주식회사 하이닉스반도체 Post cleaning method in chemical mechanical polishing process
KR100885877B1 (en) * 2008-07-11 2009-02-26 주식회사 인아텍 Board Feeder
JP4973675B2 (en) * 2009-02-26 2012-07-11 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
JP5730322B2 (en) * 2010-10-19 2015-06-10 株式会社アルバック Vapor deposition apparatus and vapor deposition method
JP2013098288A (en) * 2011-10-31 2013-05-20 Disco Abrasive Syst Ltd Carrier device
KR101287564B1 (en) * 2011-12-06 2013-07-19 주식회사 에스에프에이 Cleaning device for printing plate
JP6864514B2 (en) * 2017-03-23 2021-04-28 株式会社Ｓｃｒｅｅｎホールディングス Board processing system and board processing method
CN107720265B (en) * 2017-11-13 2024-07-05 旭东机械(昆山)有限公司 Go into piece system
EP4079451A4 (en) * 2019-12-18 2024-01-03 Ebara Corporation Pusher, substrate transport device, and substrate treatment device
JP7453784B2 (en) * 2019-12-18 2024-03-21 株式会社荏原製作所 Pushers, substrate transfer equipment, and substrate processing equipment
JP7548761B2 (en) 2020-09-24 2024-09-10 株式会社荏原製作所 Substrate Processing Equipment

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1041368A (en) * 1996-07-25 1998-02-13 Kokusai Electric Co Ltd Substrate transfer device
JPH10321704A (en) * 1997-05-19 1998-12-04 Kokusai Electric Co Ltd Substrate transfer machine
JP3632812B2 (en) * 1997-10-24 2005-03-23 シャープ株式会社 Substrate transfer equipment
JP3930244B2 (en) * 2000-11-10 2007-06-13 東京エレクトロン株式会社 Processing equipment
JP2004056016A (en) * 2002-07-23 2004-02-19 Tokyo Electron Ltd Processing system, and device and method for transporting substrate
JP4245387B2 (en) * 2003-03-19 2009-03-25 東京エレクトロン株式会社 Substrate transport apparatus and substrate processing apparatus

Also Published As

Publication number Publication date
JP4476133B2 (en) 2010-06-09
KR20060094488A (en) 2006-08-29
KR101229609B1 (en) 2013-02-04
TWI320022B (en) 2010-02-01
JP2006232468A (en) 2006-09-07

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