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TW200620529A - Apparatus for treating a substrate - Google Patents

Apparatus for treating a substrate

Info

Publication number
TW200620529A
TW200620529A TW094136143A TW94136143A TW200620529A TW 200620529 A TW200620529 A TW 200620529A TW 094136143 A TW094136143 A TW 094136143A TW 94136143 A TW94136143 A TW 94136143A TW 200620529 A TW200620529 A TW 200620529A
Authority
TW
Taiwan
Prior art keywords
substrate
carrier
treating device
conveyance roller
moving
Prior art date
Application number
TW094136143A
Other languages
Chinese (zh)
Other versions
TWI276199B (en
Inventor
Hiroshi Shibazaki
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200620529A publication Critical patent/TW200620529A/en
Application granted granted Critical
Publication of TWI276199B publication Critical patent/TWI276199B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

To provide an apparatus having a mechanism that transfers a substrate from a horizontal carrier means to a substrate rotating and treating device, the apparatus being prevented from rising dust and from inconvenience in performing wet treatment, and having a simple structure with footprint relatively small. The apparatus comprises: a carrier 20 including a substrate rotating and treating device 10 and a conveyance roller 16, and being disposed so as to face an end portion of a carrying passage of the conveyance roller and to come a substrate supporting surface of a free roller 28 and a substrate carrying surface on the same level; a transfer arm 32 for moving the substrate horizontally from the end portion of a carrying passage of the conveyance roller onto the carrier; and a supporting/moving mechanism for moving the carrier which supports the substrate from a substrate exchanging position A onto a rotary holding disk 12 of the substrate rotating and treating device; and in which the rotary holding disk includes supporting pins 44 and 46 for holding a mounting surface and the substrate.
TW094136143A 2004-11-15 2005-10-17 Apparatus for treating a substrate TWI276199B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004330261A JP4313284B2 (en) 2004-11-15 2004-11-15 Substrate processing equipment

Publications (2)

Publication Number Publication Date
TW200620529A true TW200620529A (en) 2006-06-16
TWI276199B TWI276199B (en) 2007-03-11

Family

ID=36620976

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094136143A TWI276199B (en) 2004-11-15 2005-10-17 Apparatus for treating a substrate

Country Status (4)

Country Link
JP (1) JP4313284B2 (en)
KR (1) KR100643053B1 (en)
CN (1) CN100352000C (en)
TW (1) TWI276199B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413204B (en) * 2009-07-23 2013-10-21 Dms Co Ltd Apparatus for processing substrate

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1987436B (en) * 2006-12-27 2010-04-21 友达光电股份有限公司 Substrate detection device and glass substrate detection device
JP4840595B2 (en) * 2007-02-20 2011-12-21 株式会社Ｉｈｉ Board transfer machine
CN101671113B (en) * 2008-09-12 2011-12-21 佛山市顺德区高力威机械有限公司 Automatic linear conveying transfer station for glass
JP5887935B2 (en) * 2009-11-26 2016-03-16 株式会社ニコン Substrate processing apparatus, display element manufacturing method, and substrate processing method
JP5678177B2 (en) * 2011-04-13 2015-02-25 シャープ株式会社 Substrate support device and drying device
CN102633103A (en) * 2012-03-21 2012-08-15 李莉 Plate glass rotary table
CN102730401B (en) * 2012-06-26 2014-04-02 深圳市华星光电技术有限公司 Substrate transfer device and substrate carrying system
CN102790002B (en) 2012-07-27 2015-02-11 京东方科技集团股份有限公司 Flexible substrate treatment device
KR101991889B1 (en) * 2013-03-28 2019-06-21 주식회사 원익아이피에스 Substrate horizontal rotation module, and substrate transfer method
CN108137240A (en) * 2015-10-22 2018-06-08 惠普深蓝有限责任公司 Sense the article in conveyer
CN105775743B (en) * 2016-04-26 2019-04-05 武汉华星光电技术有限公司 Steering unit and transfer for glass substrate processing
CN106225467B (en) * 2016-07-14 2019-03-15 武汉华星光电技术有限公司 Film dries machine support and film dryer
JP7097759B2 (en) * 2018-06-22 2022-07-08 東京エレクトロン株式会社 Board processing equipment and board processing method
CN108861595A (en) * 2018-07-02 2018-11-23 君泰创新（北京）科技有限公司 Positioning device
CN108841474B (en) * 2018-07-28 2022-02-01 陕西秦酒酒业有限公司 Raw material processing device for preparing sorghum liquor
CN109004108B (en) * 2018-08-02 2021-03-26 京东方科技集团股份有限公司 Display panel manufacturing method and display panel
CN111168986A (en) * 2020-01-06 2020-05-19 广东华中科技大学工业技术研究院 A transmission device with dust-proof structure for flexible film production
CN114408572B (en) * 2021-12-20 2024-04-26 江苏长欣车辆装备有限公司 Transfer device that glass production workshop used
CN115677205B (en) * 2022-10-28 2023-11-07 湖南邵虹特种玻璃股份有限公司 An automatic feeding device for heat treatment of glass substrates

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19748088A1 (en) * 1997-10-30 1999-05-12 Wacker Siltronic Halbleitermat Method and device for detecting a misalignment of a semiconductor wafer
JP2000040728A (en) * 1998-07-22 2000-02-08 Nippon Asm Kk Wafer carrying mechanism
JP3682396B2 (en) * 2000-02-24 2005-08-10 東レエンジニアリング株式会社 Fixed point conveying device for thin plate materials

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413204B (en) * 2009-07-23 2013-10-21 Dms Co Ltd Apparatus for processing substrate

Also Published As

Publication number Publication date
JP2006140380A (en) 2006-06-01
JP4313284B2 (en) 2009-08-12
KR20060053995A (en) 2006-05-22
CN100352000C (en) 2007-11-28
KR100643053B1 (en) 2006-11-10
TWI276199B (en) 2007-03-11
CN1776884A (en) 2006-05-24

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees