[go: up one dir, main page]

TW200626476A - System and method for display device with activated desiccant - Google Patents

System and method for display device with activated desiccant

Info

Publication number
TW200626476A
TW200626476A TW094129132A TW94129132A TW200626476A TW 200626476 A TW200626476 A TW 200626476A TW 094129132 A TW094129132 A TW 094129132A TW 94129132 A TW94129132 A TW 94129132A TW 200626476 A TW200626476 A TW 200626476A
Authority
TW
Taiwan
Prior art keywords
desiccant
mems device
display device
backplane
substrate
Prior art date
Application number
TW094129132A
Other languages
English (en)
Inventor
Lauren Palmateer
William J Cummings
Brian J Gally
Jeffrey B Sampsell
Original Assignee
Idc Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idc Llc filed Critical Idc Llc
Publication of TW200626476A publication Critical patent/TW200626476A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00285—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Micromachines (AREA)
  • Electroluminescent Light Sources (AREA)
  • Drying Of Gases (AREA)
TW094129132A 2004-09-27 2005-08-25 System and method for display device with activated desiccant TW200626476A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US61328004P 2004-09-27 2004-09-27
US11/140,498 US20060076632A1 (en) 2004-09-27 2005-05-27 System and method for display device with activated desiccant

Publications (1)

Publication Number Publication Date
TW200626476A true TW200626476A (en) 2006-08-01

Family

ID=35482166

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094129132A TW200626476A (en) 2004-09-27 2005-08-25 System and method for display device with activated desiccant

Country Status (11)

Country Link
US (1) US20060076632A1 (zh)
EP (1) EP1640323A3 (zh)
JP (1) JP2006121043A (zh)
KR (1) KR20060092899A (zh)
AU (1) AU2005203551A1 (zh)
BR (1) BRPI0503902A (zh)
CA (1) CA2517413A1 (zh)
MX (1) MXPA05009407A (zh)
RU (1) RU2005129908A (zh)
SG (1) SG121090A1 (zh)
TW (1) TW200626476A (zh)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI289708B (en) 2002-12-25 2007-11-11 Qualcomm Mems Technologies Inc Optical interference type color display
US7342705B2 (en) 2004-02-03 2008-03-11 Idc, Llc Spatial light modulator with integrated optical compensation structure
US7405924B2 (en) * 2004-09-27 2008-07-29 Idc, Llc System and method for protecting microelectromechanical systems array using structurally reinforced back-plate
WO2007120885A2 (en) * 2006-04-13 2007-10-25 Qualcomm Mems Technologies, Inc. Mems devices and processes for packaging such devices
WO2007136706A1 (en) * 2006-05-17 2007-11-29 Qualcomm Mems Technologies Inc. Desiccant in a mems device
US20080121947A1 (en) * 2006-09-14 2008-05-29 Robert Eugene Frahm Solar-powered MEMS acoustic sensor and system for providing physical security in a geographical area with use thereof
EP1943551A2 (en) 2006-10-06 2008-07-16 Qualcomm Mems Technologies, Inc. Light guide
US9019183B2 (en) 2006-10-06 2015-04-28 Qualcomm Mems Technologies, Inc. Optical loss structure integrated in an illumination apparatus
US7816164B2 (en) * 2006-12-01 2010-10-19 Qualcomm Mems Technologies, Inc. MEMS processing
JP5412031B2 (ja) * 2007-07-24 2014-02-12 ローム株式会社 Ｍｅｍｓセンサ
WO2009041951A1 (en) * 2007-09-28 2009-04-02 Qualcomm Mems Technologies, Inc. Optimization of desiccant usage in a mems package
US8068710B2 (en) * 2007-12-07 2011-11-29 Qualcomm Mems Technologies, Inc. Decoupled holographic film and diffuser
US7852491B2 (en) 2008-03-31 2010-12-14 Qualcomm Mems Technologies, Inc. Human-readable, bi-state environmental sensors based on micro-mechanical membranes
US7787130B2 (en) 2008-03-31 2010-08-31 Qualcomm Mems Technologies, Inc. Human-readable, bi-state environmental sensors based on micro-mechanical membranes
US8077326B1 (en) 2008-03-31 2011-12-13 Qualcomm Mems Technologies, Inc. Human-readable, bi-state environmental sensors based on micro-mechanical membranes
US7787171B2 (en) 2008-03-31 2010-08-31 Qualcomm Mems Technologies, Inc. Human-readable, bi-state environmental sensors based on micro-mechanical membranes
US20090323170A1 (en) * 2008-06-30 2009-12-31 Qualcomm Mems Technologies, Inc. Groove on cover plate or substrate
US8410690B2 (en) * 2009-02-13 2013-04-02 Qualcomm Mems Technologies, Inc. Display device with desiccant
EP2438610A4 (en) * 2009-06-01 2015-12-02 Sumitomo Chemical Co PROCESS AND ENCAPSULATION STRUCTURE FOR ELECTRONIC DEVICES
US8852819B2 (en) * 2009-06-05 2014-10-07 Blackberry Limited System and method for managing fuel cell operating conditions in a mobile communication device
US8379392B2 (en) * 2009-10-23 2013-02-19 Qualcomm Mems Technologies, Inc. Light-based sealing and device packaging
US8711361B2 (en) 2009-11-05 2014-04-29 Qualcomm, Incorporated Methods and devices for detecting and measuring environmental conditions in high performance device packages
US9090456B2 (en) * 2009-11-16 2015-07-28 Qualcomm Mems Technologies, Inc. System and method of manufacturing an electromechanical device by printing raised conductive contours
US8284476B2 (en) * 2009-12-11 2012-10-09 Qualcomm Mems Technologies, Inc. Backlight utilizing desiccant light turning array
TWI443784B (zh) 2010-07-29 2014-07-01 Ind Tech Res Inst 環境敏感電子元件之封裝體及其封裝方法
US20120056855A1 (en) * 2010-09-03 2012-03-08 Qualcomm Mems Technologies, Inc. Interferometric display device
JP2012064673A (ja) * 2010-09-14 2012-03-29 Daishinku Corp 電子部品パッケージ、及び電子部品パッケージの製造方法
US9809445B2 (en) 2011-08-26 2017-11-07 Qualcomm Incorporated Electromechanical system structures with ribs having gaps
TWI528608B (zh) 2011-11-21 2016-04-01 財團法人工業技術研究院 環境敏感電子元件之封裝體
US9156678B2 (en) * 2013-12-12 2015-10-13 Qualcomm Mems Technologies, Inc. MEMS encapsulation by multilayer film lamination
US9102513B1 (en) 2014-01-29 2015-08-11 Himax Display, Inc. MEMS package structure
US9409766B2 (en) 2014-01-29 2016-08-09 Himax Display, Inc. MEMS package structure and manufacturing method thereof
US9952111B2 (en) 2015-04-15 2018-04-24 Infineon Technologies Ag System and method for a packaged MEMS device
US10498001B2 (en) 2017-08-21 2019-12-03 Texas Instruments Incorporated Launch structures for a hermetically sealed cavity
US10775422B2 (en) 2017-09-05 2020-09-15 Texas Instruments Incorporated Molecular spectroscopy cell with resonant cavity
US10589986B2 (en) 2017-09-06 2020-03-17 Texas Instruments Incorporated Packaging a sealed cavity in an electronic device
US10551265B2 (en) 2017-09-07 2020-02-04 Texas Instruments Incorporated Pressure sensing using quantum molecular rotational state transitions
US10549986B2 (en) 2017-09-07 2020-02-04 Texas Instruments Incorporated Hermetically sealed molecular spectroscopy cell
US10444102B2 (en) 2017-09-07 2019-10-15 Texas Instruments Incorporated Pressure measurement based on electromagnetic signal output of a cavity
US10131115B1 (en) 2017-09-07 2018-11-20 Texas Instruments Incorporated Hermetically sealed molecular spectroscopy cell with dual wafer bonding
US10424523B2 (en) * 2017-09-07 2019-09-24 Texas Instruments Incorporated Hermetically sealed molecular spectroscopy cell with buried ground plane
US10544039B2 (en) 2017-09-08 2020-01-28 Texas Instruments Incorporated Methods for depositing a measured amount of a species in a sealed cavity

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4844614A (en) * 1987-09-01 1989-07-04 Nicolet Instrument Corporation Interchangeable beam splitting holder and compartment therefor
US7460291B2 (en) * 1994-05-05 2008-12-02 Idc, Llc Separable modulator
US7123216B1 (en) * 1994-05-05 2006-10-17 Idc, Llc Photonic MEMS and structures
US6680792B2 (en) * 1994-05-05 2004-01-20 Iridigm Display Corporation Interferometric modulation of radiation
US5610438A (en) * 1995-03-08 1997-03-11 Texas Instruments Incorporated Micro-mechanical device with non-evaporable getter
US5614785A (en) * 1995-09-28 1997-03-25 Texas Instruments Incorporated Anode plate for flat panel display having silicon getter
US5939785A (en) * 1996-04-12 1999-08-17 Texas Instruments Incorporated Micromechanical device including time-release passivant
US6762868B2 (en) * 2000-11-16 2004-07-13 Texas Instruments Incorporated Electro-optical package with drop-in aperture
US6664779B2 (en) * 2000-11-16 2003-12-16 Texas Instruments Incorporated Package with environmental control material carrier
US7307775B2 (en) * 2000-12-07 2007-12-11 Texas Instruments Incorporated Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
US6906847B2 (en) * 2000-12-07 2005-06-14 Reflectivity, Inc Spatial light modulators with light blocking/absorbing areas
US6534850B2 (en) * 2001-04-16 2003-03-18 Hewlett-Packard Company Electronic device sealed under vacuum containing a getter and method of operation
TW583049B (en) * 2001-07-20 2004-04-11 Getters Spa Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices
US6776538B2 (en) * 2001-12-12 2004-08-17 Axsun Technologies, Inc. MEMS tunable optical filter system with moisture getter for frequency stability
US6923625B2 (en) * 2002-01-07 2005-08-02 Integrated Sensing Systems, Inc. Method of forming a reactive material and article formed thereby
US6707351B2 (en) * 2002-03-27 2004-03-16 Motorola, Inc. Tunable MEMS resonator and method for tuning
US20040189195A1 (en) * 2003-03-24 2004-09-30 Osram Opto Semiconductors Gmbh Devices including, methods using, and compositions of reflowable getters
US7371452B2 (en) * 2003-04-28 2008-05-13 Eastman Kodak Company Conductive patterned sheet utilizing multi-layered conductive conduit channels
US7060895B2 (en) * 2004-05-04 2006-06-13 Idc, Llc Modifying the electro-mechanical behavior of devices
US7164520B2 (en) * 2004-05-12 2007-01-16 Idc, Llc Packaging for an interferometric modulator
US20050253283A1 (en) * 2004-05-13 2005-11-17 Dcamp Jon B Getter deposition for vacuum packaging
US7327510B2 (en) * 2004-09-27 2008-02-05 Idc, Llc Process for modifying offset voltage characteristics of an interferometric modulator
US8124434B2 (en) * 2004-09-27 2012-02-28 Qualcomm Mems Technologies, Inc. Method and system for packaging a display

Also Published As

Publication number Publication date
EP1640323A2 (en) 2006-03-29
SG121090A1 (en) 2006-04-26
KR20060092899A (ko) 2006-08-23
US20060076632A1 (en) 2006-04-13
BRPI0503902A (pt) 2006-05-09
JP2006121043A (ja) 2006-05-11
AU2005203551A1 (en) 2006-05-04
EP1640323A3 (en) 2007-12-05
RU2005129908A (ru) 2007-04-10
CA2517413A1 (en) 2006-03-27
MXPA05009407A (es) 2006-03-29

Similar Documents

Publication Publication Date Title
TW200626476A (en) System and method for display device with activated desiccant
WO2007120885A3 (en) Mems devices and processes for packaging such devices
ATE508094T1 (de) Verfahren zur häusung einer mikromechanischen anzeigevorrichtung
TW200626484A (en) Device having patterned spacers for backplates and method of making the same
MXPA05009404A (es) Sistema y metodo para dispositivo de despliegue con desecante integrado.
WO2007149475A3 (en) Method for packaging an optical mems device
TW200710473A (en) Liquid crystal device, electro-optical device, projector, and micro-device
TW200735703A (en) Manufacturing equipment of display device and manufacturing method of display device
MXPA05010088A (es) Metodo y sistema para proporcionar paquete de dispositivo de mems con sello secundario.
TW200715708A (en) Electronic substrate, manufacturing method for electronic substrate, and electronic device
WO2008009575A3 (en) Method of bonding
WO2007109213A3 (en) On/off reversible adhesive
TW200737589A (en) Electronic device and antenna structure thereof
TW200627604A (en) System and method for display device with reinforcing substance
TW200746885A (en) Hot-melt type member and organic EL display panel
GB2432257B8 (en) A method of forming nano patterns, thin film transistor using the patterns, and liquid crystal display device having the thin film transistor
TW200705113A (en) Exposure method, exposure apparatus, method for manufacturing device, and film evaluation method
TW200735081A (en) Function element mounting module, manufacturing method thereof, and resin sealing board and substrate-structured unit for resin sealing used by the same
TW200628952A (en) Method for manufacturing array board for display device
WO2006036642A3 (en) Method of making a reflective display device using thin film transistor production techniques
TW200700814A (en) Liquid crystal display device and fabricating method thereof
AP2226A (en) Method for applying an electronic assembly to a substrate and a device for applying said assembly.
TW200640318A (en) Method of forming film pattern, method of manufacturing device, electro-optical device, and electronic apparatus
TW200725122A (en) Liquid crystal display device having organic alignment layer and fabrication method thereof
TW200722878A (en) Liquid crystal display device and method of fabricating the same