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MXPA05009407A - Sistema y metodo para dispositivo de despliegue con desecante activado. - Google Patents

Sistema y metodo para dispositivo de despliegue con desecante activado.

Info

Publication number
MXPA05009407A
MXPA05009407A MXPA05009407A MXPA05009407A MXPA05009407A MX PA05009407 A MXPA05009407 A MX PA05009407A MX PA05009407 A MXPA05009407 A MX PA05009407A MX PA05009407 A MXPA05009407 A MX PA05009407A MX PA05009407 A MXPA05009407 A MX PA05009407A
Authority
MX
Mexico
Prior art keywords
desiccant
mems device
display device
backplane
substrate
Prior art date
Application number
MXPA05009407A
Other languages
English (en)
Inventor
William J Cummings
Original Assignee
Idc Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idc Llc filed Critical Idc Llc
Publication of MXPA05009407A publication Critical patent/MXPA05009407A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00285—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Micromachines (AREA)
  • Drying Of Gases (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

Un empaque de dispositivo MEMS 70 que comprende un substrato 72 con un dispositivo MEMS 76 formado en el mismo, una tarjeta base 74, un sello 78 y un desecante inactivo 80 dentro del empaque; el desecante 80 es activado despues de ensamblar el empaque mediante exposicion a un cambio ambiental o una sustancia de activacion; un metodo para fabricar un dispositivo MEMS comprende activar un desecante y poner en contacto un substrato con el dispositivo MEMS formado en el mismo, un sello y una tarjeta base, en donde el desecante esta colocado sobre el substrato o la tarjeta base.
MXPA05009407A 2004-09-27 2005-09-02 Sistema y metodo para dispositivo de despliegue con desecante activado. MXPA05009407A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US61328004P 2004-09-27 2004-09-27
US11/140,498 US20060076632A1 (en) 2004-09-27 2005-05-27 System and method for display device with activated desiccant

Publications (1)

Publication Number Publication Date
MXPA05009407A true MXPA05009407A (es) 2006-03-29

Family

ID=35482166

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA05009407A MXPA05009407A (es) 2004-09-27 2005-09-02 Sistema y metodo para dispositivo de despliegue con desecante activado.

Country Status (11)

Country Link
US (1) US20060076632A1 (es)
EP (1) EP1640323A3 (es)
JP (1) JP2006121043A (es)
KR (1) KR20060092899A (es)
AU (1) AU2005203551A1 (es)
BR (1) BRPI0503902A (es)
CA (1) CA2517413A1 (es)
MX (1) MXPA05009407A (es)
RU (1) RU2005129908A (es)
SG (1) SG121090A1 (es)
TW (1) TW200626476A (es)

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US7405924B2 (en) * 2004-09-27 2008-07-29 Idc, Llc System and method for protecting microelectromechanical systems array using structurally reinforced back-plate
US7746537B2 (en) * 2006-04-13 2010-06-29 Qualcomm Mems Technologies, Inc. MEMS devices and processes for packaging such devices
US8040587B2 (en) 2006-05-17 2011-10-18 Qualcomm Mems Technologies, Inc. Desiccant in a MEMS device
US20080121947A1 (en) * 2006-09-14 2008-05-29 Robert Eugene Frahm Solar-powered MEMS acoustic sensor and system for providing physical security in a geographical area with use thereof
EP2366946A1 (en) 2006-10-06 2011-09-21 Qualcomm Mems Technologies, Inc. Optical loss layer integrated in an illumination apparatus of a display
US8872085B2 (en) 2006-10-06 2014-10-28 Qualcomm Mems Technologies, Inc. Display device having front illuminator with turning features
US7816164B2 (en) 2006-12-01 2010-10-19 Qualcomm Mems Technologies, Inc. MEMS processing
JP5412031B2 (ja) * 2007-07-24 2014-02-12 ローム株式会社 Ｍｅｍｓセンサ
EP2116508A3 (en) * 2007-09-28 2010-10-13 QUALCOMM MEMS Technologies, Inc. Optimization of desiccant usage in a MEMS package
US8068710B2 (en) * 2007-12-07 2011-11-29 Qualcomm Mems Technologies, Inc. Decoupled holographic film and diffuser
US7787171B2 (en) 2008-03-31 2010-08-31 Qualcomm Mems Technologies, Inc. Human-readable, bi-state environmental sensors based on micro-mechanical membranes
US8077326B1 (en) 2008-03-31 2011-12-13 Qualcomm Mems Technologies, Inc. Human-readable, bi-state environmental sensors based on micro-mechanical membranes
US7852491B2 (en) 2008-03-31 2010-12-14 Qualcomm Mems Technologies, Inc. Human-readable, bi-state environmental sensors based on micro-mechanical membranes
US7787130B2 (en) * 2008-03-31 2010-08-31 Qualcomm Mems Technologies, Inc. Human-readable, bi-state environmental sensors based on micro-mechanical membranes
US20090323170A1 (en) * 2008-06-30 2009-12-31 Qualcomm Mems Technologies, Inc. Groove on cover plate or substrate
US8410690B2 (en) * 2009-02-13 2013-04-02 Qualcomm Mems Technologies, Inc. Display device with desiccant
KR101747451B1 (ko) * 2009-06-01 2017-06-27 스미또모 가가꾸 가부시키가이샤 전자 장치용의 개선된 전극들에 대한 제형들
US8852819B2 (en) * 2009-06-05 2014-10-07 Blackberry Limited System and method for managing fuel cell operating conditions in a mobile communication device
US8379392B2 (en) * 2009-10-23 2013-02-19 Qualcomm Mems Technologies, Inc. Light-based sealing and device packaging
US8711361B2 (en) 2009-11-05 2014-04-29 Qualcomm, Incorporated Methods and devices for detecting and measuring environmental conditions in high performance device packages
US9090456B2 (en) * 2009-11-16 2015-07-28 Qualcomm Mems Technologies, Inc. System and method of manufacturing an electromechanical device by printing raised conductive contours
US8284476B2 (en) * 2009-12-11 2012-10-09 Qualcomm Mems Technologies, Inc. Backlight utilizing desiccant light turning array
TWI443784B (zh) 2010-07-29 2014-07-01 Ind Tech Res Inst 環境敏感電子元件之封裝體及其封裝方法
US20120056855A1 (en) * 2010-09-03 2012-03-08 Qualcomm Mems Technologies, Inc. Interferometric display device
JP2012064673A (ja) * 2010-09-14 2012-03-29 Daishinku Corp 電子部品パッケージ、及び電子部品パッケージの製造方法
US9809445B2 (en) 2011-08-26 2017-11-07 Qualcomm Incorporated Electromechanical system structures with ribs having gaps
TWI528608B (zh) 2011-11-21 2016-04-01 財團法人工業技術研究院 環境敏感電子元件之封裝體
US9156678B2 (en) * 2013-12-12 2015-10-13 Qualcomm Mems Technologies, Inc. MEMS encapsulation by multilayer film lamination
US9102513B1 (en) 2014-01-29 2015-08-11 Himax Display, Inc. MEMS package structure
US9409766B2 (en) 2014-01-29 2016-08-09 Himax Display, Inc. MEMS package structure and manufacturing method thereof
US9952111B2 (en) 2015-04-15 2018-04-24 Infineon Technologies Ag System and method for a packaged MEMS device
US10498001B2 (en) 2017-08-21 2019-12-03 Texas Instruments Incorporated Launch structures for a hermetically sealed cavity
US10775422B2 (en) 2017-09-05 2020-09-15 Texas Instruments Incorporated Molecular spectroscopy cell with resonant cavity
US10589986B2 (en) 2017-09-06 2020-03-17 Texas Instruments Incorporated Packaging a sealed cavity in an electronic device
US10551265B2 (en) 2017-09-07 2020-02-04 Texas Instruments Incorporated Pressure sensing using quantum molecular rotational state transitions
US10444102B2 (en) 2017-09-07 2019-10-15 Texas Instruments Incorporated Pressure measurement based on electromagnetic signal output of a cavity
US10131115B1 (en) 2017-09-07 2018-11-20 Texas Instruments Incorporated Hermetically sealed molecular spectroscopy cell with dual wafer bonding
US10424523B2 (en) * 2017-09-07 2019-09-24 Texas Instruments Incorporated Hermetically sealed molecular spectroscopy cell with buried ground plane
US10549986B2 (en) 2017-09-07 2020-02-04 Texas Instruments Incorporated Hermetically sealed molecular spectroscopy cell
US10544039B2 (en) 2017-09-08 2020-01-28 Texas Instruments Incorporated Methods for depositing a measured amount of a species in a sealed cavity

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Also Published As

Publication number Publication date
RU2005129908A (ru) 2007-04-10
AU2005203551A1 (en) 2006-05-04
EP1640323A3 (en) 2007-12-05
SG121090A1 (en) 2006-04-26
CA2517413A1 (en) 2006-03-27
JP2006121043A (ja) 2006-05-11
US20060076632A1 (en) 2006-04-13
EP1640323A2 (en) 2006-03-29
BRPI0503902A (pt) 2006-05-09
TW200626476A (en) 2006-08-01
KR20060092899A (ko) 2006-08-23

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