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TW200625725A - Anisotropic conductive connector for inspecting wafer, manufacturing method thereof, waver inspection probe card, manufacturing method thereof, and wafer inspection device - Google Patents

Anisotropic conductive connector for inspecting wafer, manufacturing method thereof, waver inspection probe card, manufacturing method thereof, and wafer inspection device

Info

Publication number
TW200625725A
TW200625725A TW094136933A TW94136933A TW200625725A TW 200625725 A TW200625725 A TW 200625725A TW 094136933 A TW094136933 A TW 094136933A TW 94136933 A TW94136933 A TW 94136933A TW 200625725 A TW200625725 A TW 200625725A
Authority
TW
Taiwan
Prior art keywords
manufacturing
wafer
anisotropic conductive
material layer
conductive connector
Prior art date
Application number
TW094136933A
Other languages
Chinese (zh)
Inventor
Kiyoshi Kimura
Fujio Hara
Daisuke Yamada
Sugiro Shimoda
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200625725A publication Critical patent/TW200625725A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

There is disclosed an anisotropic conductive connector capable of surely achieving a preferable electric connection state even when electrodes to be inspected on a wafer have an extremely small pitch. There are also disclosed a manufacturing method of the anisotropic conductive connector, a probe card, a manufacturing method thereof, and a wafer inspection device. The anisotropic conductive connector manufacturing method includes: a step for arranging contact members formed by magnetic metal and arranged on the surface of conductive elastomer material layer formed on a detachable support plate; a step for applying a magnetic field to the conductive elastomer material layer in its thickness direction; a step for performing a hardening process to form a conductive elastomer layer; a step of machining the conductive elastomer layer by using laser; a step or removing portions other than the portion where the contact members are arranged, thereby forming connection conductive parts having the contact members; a step for introducing each of the connection conductive parts into the insulation part material layer formed so as to close the opening of the frame plate; and a step for hardening the insulation part material layer so as to form an insulation part.
TW094136933A 2004-10-22 2005-10-21 Anisotropic conductive connector for inspecting wafer, manufacturing method thereof, waver inspection probe card, manufacturing method thereof, and wafer inspection device TW200625725A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004308963 2004-10-22
JP2005148067 2005-05-20
JP2005250764 2005-08-31

Publications (1)

Publication Number Publication Date
TW200625725A true TW200625725A (en) 2006-07-16

Family

ID=36203047

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094136933A TW200625725A (en) 2004-10-22 2005-10-21 Anisotropic conductive connector for inspecting wafer, manufacturing method thereof, waver inspection probe card, manufacturing method thereof, and wafer inspection device

Country Status (2)

Country Link
TW (1) TW200625725A (en)
WO (1) WO2006043631A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI867799B (en) * 2019-08-15 2024-12-21 優顯科技股份有限公司 Electronic detection module and electronic detection method

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102680301B (en) * 2012-06-07 2014-01-01 北京航空航天大学 A preparation device for uniformly distributed and chain-shaped magnetically sensitive elastomers with millimeter particles
KR101339166B1 (en) 2012-06-18 2013-12-09 주식회사 아이에스시 Test socket with conductive powder having through-hole and fabrication method thereof
CN105762580B (en) * 2016-04-19 2018-06-22 深圳市长盈精密技术股份有限公司 Kato and its manufacturing method
JP7308660B2 (en) * 2019-05-27 2023-07-14 東京エレクトロン株式会社 Intermediate connection member and inspection device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5193393A (en) * 1975-02-12 1976-08-16 Erasuteitsuku kontakutoshiitonoseizohoho
JPS6032285B2 (en) * 1977-05-31 1985-07-27 ジェイエスアール株式会社 Method for manufacturing pressurized conductive elastomer
JPS61250906A (en) * 1985-04-26 1986-11-08 ジェイエスアール株式会社 Conductive elastomer sheet
JP2001050983A (en) * 1999-08-09 2001-02-23 Jsr Corp Probe card
EP1365479B1 (en) * 2001-02-09 2011-01-05 JSR Corporation Anisotropic conductive connector, its manufacture method and probe member
CN1764844A (en) * 2003-03-26 2006-04-26 Jsr株式会社 Connector for measurement of electric resistance, connector device for measurement of electric resistance and production process thereof, and measuring apparatus and measuring method of electric resis

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI867799B (en) * 2019-08-15 2024-12-21 優顯科技股份有限公司 Electronic detection module and electronic detection method

Also Published As

Publication number Publication date
WO2006043631A1 (en) 2006-04-27

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