CN105762580B - Kato and its manufacturing method - Google Patents
Kato and its manufacturing method Download PDFInfo
- Publication number
- CN105762580B CN105762580B CN201610243598.6A CN201610243598A CN105762580B CN 105762580 B CN105762580 B CN 105762580B CN 201610243598 A CN201610243598 A CN 201610243598A CN 105762580 B CN105762580 B CN 105762580B
- Authority
- CN
- China
- Prior art keywords
- electronic card
- component
- kato
- upper side
- side frame
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/64—Means for preventing incorrect coupling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Credit Cards Or The Like (AREA)
Abstract
A kind of Kato, including upper component, and the lower component of the upper component side is incorporated into using spot-welding technology, the upper component is stamped and formed out using plate-shape metal according to electronics card structure, the upper component includes upper side frame, it is stamped and formed out at least one electronic card putting groove in the upper side frame, the lower component is stamped and formed out using plate-shape metal, the lower component includes lower frame, the cut away section that punching is formed among from the plate-shape metal, and punching press is used from the inside of the lower frame or is drawn technique and processes the electronic card holding part to be formed, the electronic card holding part is overlapped with the electronic card putting groove with holding electronic card in vertical direction, the electronic card holding part forms the card receiving portion of receiving electronic card with the electronic card putting groove.The application Kato has both cost advantage and metal feel.
Description
Technical field
This application involves stamped field, espespecially a kind of electronic card coupler Kato and its manufacturing method.
Background technology
Electronic card coupler is widely used in the connection of identification card, memory card, the electronic card used in smart mobile phone
Connector using Kato structure, i.e., carries electronic card by Kato more and more, and Kato then is inserted into electronic card again connects
It connects in device.Currently, used Kato manufacturing process is divided into following several, using forging or CNC processing technologys, powder metallurgy work
Skill is aided with injection molding process again using plastic material injection molding, using embedded metal item.Wherein, forging, CNC and powder
The product that metallurgy manufactures uses metal material, and product strength is high, good hand touch, but cost of goods manufactured is very high；And it adopts
With plastic material injection molding or it is aided with the manufacturing process of metal embedded component, although solving the problems, such as that manufacture is of high cost,
Because it uses plastic material, the feel of product is bad, and intensity is insufficient, can not meet the need of middle and high end mobile phone requirement metal feel
It asks.
Invention content
The application's is designed to provide a kind of intensity height, the Kato for having both metal feel and low cost and its manufacturer
Method.
For this purpose, this application provides a kind of Kato, the upper component one is incorporated into including upper component and using spot-welding technology
The lower component of side, the upper component are stamped and formed out using plate-shape metal according to electronics card structure, the upper component include upper side frame,
It being stamped and formed out at least one electronic card putting groove in the upper side frame, the lower component is stamped and formed out using plate-shape metal,
The lower component includes lower frame, the cut away section that punching is formed among the plate-shape metal and is adopted from the inside of the lower frame
It with punching press or is drawn technique and processes the electronic card holding part to be formed, the electronic card holding part is in vertical direction and the electronic card
Putting groove is overlapped with holding electronic card, and the card that the electronic card holding part forms receiving electronic card with the electronic card putting groove is received
Appearance portion.
Preferably, the electronic card putting groove is stamped and formed out according to the shape and structure of electronic card so that electronic card is from the electricity
Subcard putting groove is placed in.
Preferably, it is formed with stage portion between the electronic card holding part and the lower frame.
Preferably, the front end of the lower frame and two transverse sides form spot welding region, the lower component with described upper group
After part fits in together, by the lower frame the spot welding of spot-welding part region so that the lower frame and the upper side frame weld
In one and form several solder joints.
Preferably, the solder joint is around the periphery setting of the lower frame of the lower component.
Preferably, the thickness of the lower component is about the 30%-50% of the upper component thickness.
Preferably, the outer edge of a transverse sides of the lower component and the outer edge of the upper side frame of the upper component are put down
Together as the sliding part coordinated with electronic card coupler metal shell, another transverse sides of the lower component are then positioned at described
The inside of lower frame, using the lower frame of the lower component as the sliding part coordinated with electronic card coupler metal shell.
Preferably, two transverse sides of the lower frame of the lower component are located at the inside of the upper side frame of the upper component, card
The both lateral sides for the upper side frame that support passes through the upper component are slided with the cooperation of electronic card coupler metal shell.
Present invention also provides a kind of Kato production method, including：
First plate-shape metal is provided, planform of first plate-shape metal according to electronic card is punched to form upper group
Part, the upper component punching are formed with upper side frame, at least one electronic card putting groove being formed in the upper side frame；
The second plate-shape metal for being thinner than first plate-shape metal is provided, second plate-shape metal foundation is needed to be punched
Form lower component, the lower component include lower frame, the cut away section that punching is formed among second plate-shape metal and from
Punching press is used on the inside of the lower frame or is drawn technique and processes the electronic card holding part to be formed；
The lower component is fitted on the upper component, carrying out spot welding in the lower frame position of the lower component forms weldering
Point so that lower component is combined as a whole with the upper component, the electronic card holding part of the lower component vertical direction and it is described on
The electronic card putting groove of component overlaps the card receiving portion to form receiving electronic card.
Compared to the prior art, the Kato of the application distinguishes punch forming by upper component and lower component and carries out spot welding group again
The mode of conjunction greatly reduces manufacture cost, while provides and metal hand specific to powder metallurgy or CNC processing technologys
Sense.
Description of the drawings
Fig. 1 is the stereogram of one Kato of the embodiment of the present application；
Fig. 2 is the stereogram of another angle of one Kato of the embodiment of the present application；
Fig. 3 is the stereo decomposing of one Kato of application embodiment；
Fig. 4 is the stereogram of the lower component of one Kato of the embodiment of the present application；
Fig. 5 is sectional view of one Kato of the embodiment of the present application along A-A dotted lines shown in Fig. 2；
Fig. 6 is the sectional view of two Kato of the embodiment of the present application.
Specific embodiment
Embodiment one
Shown in please referring to Fig.1 to Fig.3, the application Kato is included upper component 10 and is incorporated on described using spot-welding technology
The lower component 20 of 10 downside of component.
The upper component 10 is formed using plate stamping, and the upper component 10 includes upper side frame 11, is stamped and formed out in described
At least one electronic card putting groove 12 in upper side frame 11.Shape and structure punching press of the electronic card putting groove 12 according to electronic card
It is formed so that electronic card is placed in from the electronic card putting groove 12.The edge part 13 of the electronic card putting groove 12 is in vertical direction
For horizontal structure without groove or step structure in the vertical direction, in this way, plate can be simply punched using Sheet Metal Forming Technology
Metal can be made into the upper component.
For the lower component 20 using plate-shape metal by being stamped and formed out, the lower component 20 includes lower frame 21, described in
The cut away section 22 formed is punched among plate-shape metal and punching press is used from the inside of the lower frame 21 or is drawn technique and cuts to be formed
Electronic card holding part 23.The electronic card holding part 23 is located at the lower edge of the electronic card putting groove 12 of the upper component 10
Part is stuck in interior, the electronic card putting groove 12 of the upper component 10 and the electronic card holding of the lower component 20 for holding electronics
Portion 23 forms the card receiving portion 30 of receiving electronic card.
It please refers to shown in Fig. 2, Fig. 4, Fig. 5, the lower component 20 is described when being stamped and formed out the electronic card holding part 23
Stage portion 25, front end and two transverse sides of the lower frame 21 are formed between electronic card holding part 23 and the lower frame 21
24 form spot welding region.After the lower component 20 fits in together with the upper component 10, pass through the point in the lower frame 21
The region spot welding of weldering portion is so that the lower frame 21 is welded in one and forms several solder joints 26, the solder joint with the upper side frame 11
26 surround the periphery setting of the lower frame 21 of the lower component 20.The thickness of the lower component 20 is about 10 thickness of upper component
30%-50%, in this way, convenient for the electronic card holding part 23 of the lower component 20 punching press or be drawn technique high quality complete.
The outer edge of the outer edge of one transverse sides 24 of the lower component 20 and the upper side frame 11 of the upper component 10
Concordantly as the sliding part with the cooperation (not shown) of electronic card coupler metal shell, another cross side of the lower component 20
Side 24 then be located at the upper side frame 11 inside, only using the upper side frame 11 of the upper component as with electronic card coupler metal-back
The sliding part of body cooperation (not shown).It is so designed that, lateral the two of Kato and the cooperation of electronic card coupler metal shell can be made
The level height of side is inconsistent, difference in height h is formed, to achieve the effect that prevent to misplug.
Solder joint 26 in the transverse sides 24 of the lower component 20 can make solder joint and transverse sides by way of polishing
24 horizontal plane is concordant, exits the Kato insertion smooth.
Embodiment two
It please refers to shown in Fig. 6, compared to embodiment one, difference lies in：The two of the lower frame 21 of the lower component 20 are laterally
Side 24 is respectively positioned on the inside of the upper side frame 11 of the upper component 10, the transverse direction that Kato passes through the upper side frame 11 of the upper component 10
Both sides directly coordinate with electronic card coupler metal shell to be slided, so as to avoid the lower frame 21 of lower component 20 in embodiment one
Transverse sides 24 on solder joint cause slide it is not smooth the problem of.20 downward projection of electronic card of lower component is used in the present embodiment
Portion 23 is shielded and sustain as fool proof, the structure feature of anti-mis-insertion.
The Kato of the application is distinguished punch forming upper component 10 and lower component 20 and is carried out again by way of spot welding combines, greatly
Manufacture cost is reduced greatly, while is provided and metal feel specific to powder metallurgy or CNC processing technologys.
And the application Kato distinguishes stamping forming mode using upper component 10 with lower component 20, is used also for solution
Whole plate metal one-time punch forming can not form the different 24 grade knots of transverse sides in uneven face in 20 side of lower component
Structure.Using whole plate metal one-time punching press, finally still need to carry out product the structure in the different uneven faces of CNC processing
Feature.
Embodiment three
It please referring to Fig.1 to shown in Fig. 6, will be described in detail the application Kato manufacturing method, including the following steps：
First plate-shape metal is provided, planform of first plate-shape metal according to electronic card is punched to form upper component
10, the upper punching of component 10 is formed with upper side frame 11, at least one electronic card putting groove being formed in the upper side frame 11
12；
The second plate-shape metal for being thinner than first plate-shape metal is provided, second plate-shape metal foundation is needed to be punched
Lower component 20 is formed, the lower component 20 includes lower frame 21, cutting for formation is punched among second plate-shape metal
It portion 22 and using punching press or is drawn technique from 21 inside of the lower frame and processes the electronic card holding part 23 to be formed；
The lower component 20 is fitted on the upper component 10, is carried out a little in 21 position of lower frame of the lower component 20
Weldering forms solder joint 26 and is combined as a whole so as to count lower component 20 with the upper component 10, the electronic card holding part 23 of the lower component
The card receiving portion 30 to form receiving electronic card is overlapped with the electronic card putting groove 12 of the upper component 20 in vertical direction.
Claims (8)
1. a kind of Kato, it is characterised in that：The following group of the upper component side is incorporated into including upper component and using spot-welding technology
Part, the upper component are stamped and formed out using plate-shape metal according to electronics card structure, and the upper component includes upper side frame, is stamped and formed out
In at least one electronic card putting groove in the upper side frame, the lower component is stamped and formed out using plate-shape metal, the following group
Part include lower frame, the cut away section that punching is formed among the plate-shape metal and from the inside of the lower frame using punching press or
It is drawn technique and processes the electronic card holding part to be formed, the electronic card holding part is in vertical direction and the electronic card putting groove weight
It closes with holding electronic card, the electronic card holding part forms the card receiving portion of receiving electronic card with the electronic card putting groove；Institute
A transverse sides for stating lower component are located at the inside of upper side frame.
2. Kato as described in claim 1, which is characterized in that the electronic card putting groove is rushed according to the shape and structure of electronic card
Swaging is into so that electronic card is placed in from the electronic card putting groove.
3. Kato as described in claim 1, which is characterized in that be formed between the electronic card holding part and the lower frame
Stage portion.
4. Kato as described in claim 1, which is characterized in that the front end of the lower frame forms Welding Area with two transverse sides
Domain, the lower component with the upper component joint after together, by the lower frame the spot welding of spot-welding part region so that institute
Lower frame is stated to be welded in one with the upper side frame and form several solder joints.
5. Kato as claimed in claim 4, which is characterized in that the solder joint is set around the periphery of the lower frame of the lower component
It puts.
6. Kato as described in claim 1, which is characterized in that the thickness of the lower component is about the upper component thickness
30%-50%.
7. Kato as described in claim 1, which is characterized in that the outer edge of another transverse sides of the lower component and institute
State the outer edge of the upper side frame of component concordantly as the sliding part coordinated with electronic card coupler metal shell so that Kato with
The level height of the both lateral sides of electronic card coupler metal shell cooperation is inconsistent, and form difference in height prevents what is mispluged to reach
Effect.
8. Kato as described in claim 1, which is characterized in that another transverse sides of the lower frame of the lower component are also located at
The inside of the upper side frame of the upper component, Kato pass through the both lateral sides of the upper side frame of the upper component and electronic card coupler gold
Belong to housing cooperation to slide；The lower component, which is downwardly projected, to form that electronic card shields and sustain portion and then to form fool proof, the structure of anti-mis-insertion special
Sign.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610243598.6A CN105762580B (en) | 2016-04-19 | 2016-04-19 | Kato and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610243598.6A CN105762580B (en) | 2016-04-19 | 2016-04-19 | Kato and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105762580A CN105762580A (en) | 2016-07-13 |
| CN105762580B true CN105762580B (en) | 2018-06-22 |
Family
ID=56335342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610243598.6A Active CN105762580B (en) | 2016-04-19 | 2016-04-19 | Kato and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105762580B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006043631A1 (en) * | 2004-10-22 | 2006-04-27 | Jsr Corporation | Anisotropic conductive connector for inspecting wafer, manufacturing method thereof, waver inspection probe card, manufacturing method thereof, and wafer inspection device |
| CN201741861U (en) * | 2010-07-26 | 2011-02-09 | 深圳市长盈精密技术股份有限公司 | Laminated type double-SIM (Subscriber Identity Module) card connector capable of automatically popping up |
| CN202633665U (en) * | 2012-05-24 | 2012-12-26 | 富港电子（东莞）有限公司 | Card connector |
| CN103915699A (en) * | 2013-09-17 | 2014-07-09 | 深圳市长盈精密技术股份有限公司 | Connector for card |
| CN204809500U (en) * | 2015-06-15 | 2015-11-25 | 无锡阿尔卑斯电子有限公司 | Card connector |
| CN205583286U (en) * | 2016-04-19 | 2016-09-14 | 深圳市长盈精密技术股份有限公司 | Card holds in palm |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI511382B (en) * | 2012-08-21 | 2015-12-01 | Chiun Mai Comm Systems Inc | Chip card holder and electronic device using the same |
| CN205039340U (en) * | 2015-09-29 | 2016-02-17 | 安费诺-泰姆斯（常州）通迅设备有限公司 | Double -deck stamping workpiece stack injection moulding's card tray structure |
| CN105161892B (en) * | 2015-10-08 | 2017-12-26 | 昆山嘉华电子有限公司 | Kato |
-
2016
- 2016-04-19 CN CN201610243598.6A patent/CN105762580B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006043631A1 (en) * | 2004-10-22 | 2006-04-27 | Jsr Corporation | Anisotropic conductive connector for inspecting wafer, manufacturing method thereof, waver inspection probe card, manufacturing method thereof, and wafer inspection device |
| CN201741861U (en) * | 2010-07-26 | 2011-02-09 | 深圳市长盈精密技术股份有限公司 | Laminated type double-SIM (Subscriber Identity Module) card connector capable of automatically popping up |
| CN202633665U (en) * | 2012-05-24 | 2012-12-26 | 富港电子（东莞）有限公司 | Card connector |
| CN103915699A (en) * | 2013-09-17 | 2014-07-09 | 深圳市长盈精密技术股份有限公司 | Connector for card |
| CN204809500U (en) * | 2015-06-15 | 2015-11-25 | 无锡阿尔卑斯电子有限公司 | Card connector |
| CN205583286U (en) * | 2016-04-19 | 2016-09-14 | 深圳市长盈精密技术股份有限公司 | Card holds in palm |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105762580A (en) | 2016-07-13 |
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