CN105762580A - Card holder and manufacturing method thereof - Google Patents
Card holder and manufacturing method thereof Download PDFInfo
- Publication number
- CN105762580A CN105762580A CN201610243598.6A CN201610243598A CN105762580A CN 105762580 A CN105762580 A CN 105762580A CN 201610243598 A CN201610243598 A CN 201610243598A CN 105762580 A CN105762580 A CN 105762580A
- Authority
- CN
- China
- Prior art keywords
- assembly
- electronic cards
- described lower
- kato
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/64—Means for preventing incorrect coupling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The invention discloses a card holder, wherein the card holder includes an upper assembly and a lower assembly, wherein the lower assembly is combined with one side of the upper assembly through a spot welding technology; the upper assembly is formed through stamping of plate-shaped metal according to an electronic card structure, and comprises an upper frame and at least one electronic card holding slot which is formed in the upper frame through stamping; the lower assembly is formed through stamping of plate-shaped metal, and comprises a lower frame, a cutting part which is formed from the middle part of the plate-shaped metal through stamping and cutting, and an electronic card holding part which is formed from the inner side of the lower frame through processing of a stamping or drawing technology; the electronic card holding part overlaps with the electronic card holding slot in the vertical direction so as to hold the electronic card; and the electronic card holding part and the electronic card holding slot form a card accommodating part for accommodating the electronic card. The card holder has the advantages of cost and metal hand feeling.
Description
Technical field
The application relates to stamped field, espespecially one electronic card coupler Kato and manufacture method thereof.
Background technology
Electronic card coupler is widely used in the connection of identification card, memory card, and the electronic card coupler used in smart mobile phone is increasingly using card holder structure, namely carries electronic cards by Kato, is then inserted in electronic card coupler by Kato again.Currently, the Kato manufacturing process used is divided into following several, adopts forging or CNC processing technique, powder metallurgical technique, employing plastic material injection mo(u)lding, adopts embedded metal bar to be aided with injection molding process again.Wherein, forging, CNC and powder metallurgically manufacturing product out adopts metal material, and product strength is high, good hand touch, but cost of goods manufactured is very high；And adopt plastic material injection mo(u)lding or be aided with the manufacturing process of metal embedded component, although solving the problem that manufacturing cost is high, but adopt plastic material because of it, the feel of product is not good, and intensity is not enough, it is impossible to meet the demand of middle and high end mobile phone requirement metal feel.
Summary of the invention
The purpose of the application is in that to provide a kind of intensity height, has metal feel concurrently and the Kato of low cost and manufacture method thereof.
For this, this application provides a kind of Kato, including upper assembly, and adopt spot-welding technology to be incorporated into the lower assembly of described upper assembly side, described upper assembly adopts plate-shape metal to be stamped and formed out according to electronic cards structure, described upper assembly includes upper side frame, it is stamped and formed out at least one the electronic cards putting groove in described upper side frame, described lower assembly adopts plate-shape metal to be stamped and formed out, described lower assembly includes lower frame, the cut away section that stamping-out is formed in the middle of described plate-shape metal, and inside described lower frame, adopt punching press or be drawn the electronic cards holding part that processes is formed, described electronic cards holding part overlaps with holding electronic cards with described electronic cards putting groove in the vertical direction, described electronic cards holding part constitutes, with described electronic cards putting groove, the card resettlement section housing electronic cards.
Preferably, described electronic cards putting groove is stamped and formed out so that electronic cards is inserted from described electronic cards putting groove according to the shape and structure of electronic cards.
Preferably, it is formed with stage portion between described electronic cards holding part and described lower frame.
Preferably, the front end of described lower frame constitutes spot welding region with two transverse sides, described lower assembly and described upper component joint in together with after, by the spot-welding part region spot welding of described lower frame so that described lower frame and described upper side frame are welded in one and form some solder joints.
Preferably, described solder joint is arranged around the periphery of the lower frame of described lower assembly.
Preferably, the thickness of described lower assembly is about the 30%-50% of described upper component thickness.
Preferably, the outward flange of one transverse sides of described lower assembly is concordant with the outward flange of the upper side frame of described upper assembly as the sliding part coordinated with electronic card coupler metal shell, another transverse sides of described lower assembly is then positioned at the inner side of described lower frame, using the lower frame of described lower assembly as the sliding part coordinated with electronic card coupler metal shell.
Preferably, two transverse sides of the lower frame of described lower assembly are positioned at the inner side of the upper side frame of described upper assembly, and Kato coordinates slip by the both lateral sides of the upper side frame of described upper assembly with electronic card coupler metal shell.
Present invention also provides a kind of Kato manufacture method, including:
First plate-shape metal is provided, described first plate-shape metal is formed upper assembly, at least one electronic cards putting groove that described upper assembly stamping-out is formed with upper side frame, is formed in described upper side frame according to the planform stamping-out of electronic cards；
The second plate-shape metal being thinner than described first plate-shape metal is provided, by described second plate-shape metal according to needing stamping-out to form lower assembly, described lower assembly includes lower frame, stamping-out is formed in the middle of described second plate-shape metal cut away section and adopt punching press inside described lower frame or be drawn the electronic cards holding part that processes is formed；
By described lower component joint on described upper assembly, the lower frame position of described lower assembly carry out spot welding formed solder joint so that lower assembly with described on assembly be combined as a whole, the electronic cards holding part of described lower assembly overlaps with the electronic cards putting groove of described upper assembly in the vertical direction with constitute collecting electronic cards card resettlement section.
Compared to prior art, the Kato of the application carries out the mode of spot welding combination again by upper assembly and lower assembly punch forming respectively, greatly reduces manufacturing cost, provide simultaneously with powder metallurgy or CNC processing technique specific to metal feel.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of the embodiment of the present application one Kato；
Fig. 2 is the axonometric chart of the embodiment of the present application one another angle of Kato；
Fig. 3 is the stereo decomposing of application embodiment one Kato；
Fig. 4 is the axonometric chart of the lower assembly of the embodiment of the present application one Kato；
Fig. 5 is the embodiment of the present application one Kato sectional view along A-A dotted line shown in Fig. 2；
Fig. 6 is the sectional view of the embodiment of the present application two Kato.
Detailed description of the invention
Embodiment one
Referring to shown in Fig. 1 to Fig. 3, the application Kato includes assembly 10 and adopts spot-welding technology to be incorporated into the lower assembly 20 on the downside of described upper assembly 10.
Described upper assembly 10 adopts plate stamping to be formed, at least one electronic cards putting groove 12 that described upper assembly 10 includes upper side frame 11, is stamped and formed out in described upper side frame 11.Described electronic cards putting groove 12 is stamped and formed out according to the shape and structure of electronic cards so that electronic cards is inserted from described electronic cards putting groove 12.The edge part 13 of described electronic cards putting groove 12 is horizontal structure and without the groove of in the vertical direction or ledge structure at vertical direction, so, it is possible to use namely Sheet Metal Forming Technology simple stamping-out plate-shape metal can be made into described upper assembly.
Described lower assembly 20 adopts plate-shape metal to pass through to be stamped and formed out, described lower assembly 20 includes lower frame 21, stamping-out is formed in the middle of the described plate-shape metal cut away section 22 and adopt punching press inside described lower frame 21 or be drawn technique and cut the electronic cards holding part 23 of formation.The lower edge part of the electronic cards putting groove 12 that described electronic cards holding part 23 is positioned at described upper assembly 10 is stuck in for holding electronics, and the electronic cards putting groove 12 of described upper assembly 10 constitutes, with the electronic cards holding part 23 of described lower assembly 20, the card resettlement section 30 housing electronic cards.
Refer to shown in Fig. 2, Fig. 4, Fig. 5, described lower assembly 20 is when being stamped and formed out described electronic cards holding part 23, being formed with stage portion 25 between described electronic cards holding part 23 and described lower frame 21, the front end of described lower frame 21 and two transverse sides 24 constitute spot welding region.Described lower assembly 20 fit in described upper assembly 10 together with after, by in the spot-welding part region spot welding of described lower frame 21 so that described lower frame 21 and described upper side frame 11 are welded in one and form some solder joints 26, described solder joint 26 is arranged around the periphery of the lower frame 21 of described lower assembly 20.The thickness of described lower assembly 20 is about the 30%-50% of described upper assembly 10 thickness, so, it is simple to the punching press of the electronic cards holding part 23 of described lower assembly 20 or be drawn technique high-quality and complete.
The outward flange of one transverse sides 24 of described lower assembly 20 is concordant with the outward flange of the upper side frame 11 of described upper assembly 10 as the sliding part coordinated with electronic card coupler metal shell (not shown), another transverse sides 24 of described lower assembly 20 is then positioned at the inner side of described lower frame 11, only using the lower frame 11 of described lower assembly 20 as the sliding part coordinated with electronic card coupler metal shell (not shown).It is so designed that, it is possible to the level height making the both lateral sides that Kato coordinates with electronic card coupler metal shell is inconsistent, forms difference in height h, to reach the effect preventing from mispluging.
Solder joint 26 in the transverse sides 24 of described lower assembly 20 can make solder joint concordant with the horizontal plane of transverse sides 24 by the mode polished, and makes the insertion of described Kato exit smooth and easy.
Embodiment two
Refer to shown in Fig. 6, compared to embodiment one, it is distinctive in that: two transverse sides 24 of the lower frame 21 of described lower assembly 20 are respectively positioned on the inner side of the upper side frame 11 of described upper assembly 10, Kato directly coordinates slip with electronic card coupler metal shell by the both lateral sides of the upper side frame 11 of described upper assembly 10, thus the solder joint avoided in embodiment one in the transverse sides 24 of the lower frame 21 of lower assembly 20 causes not smooth problem of sliding.The present embodiment adopt the lower downward projection of electronic cards of assembly 20 shield and sustain the portion 23 architectural feature as fool proof, anti-mis-insertion.
The Kato of the application carries out the mode of spot welding combination again by upper assembly 10 and lower assembly 20 punch forming respectively, greatly reduces manufacturing cost, provide simultaneously with powder metallurgy or CNC processing technique specific to metal feel.
And the application Kato adopts upper assembly 10 and lower assembly 20 stamping forming mode respectively, also for solving to adopt overall tabular metal one-time punch forming cannot form the structures such as uneven different transverse sides 24 in lower assembly 20 side.Adopt overall tabular metal one-time punching press, finally need for product is carried out the architectural feature of different uneven of CNC processing.
Embodiment three
Refer to shown in Fig. 1 to Fig. 6, will be described in detail the application Kato manufacture method, comprise the steps:
First plate-shape metal is provided, described first plate-shape metal is formed upper assembly 10, at least one electronic cards putting groove 12 that described upper assembly 10 stamping-out is formed with upper side frame 11, is formed in described upper side frame 11 according to the planform stamping-out of electronic cards；
The second plate-shape metal being thinner than described first plate-shape metal is provided, by described second plate-shape metal according to needing stamping-out to form lower assembly 20, described lower assembly 20 includes lower frame 21, stamping-out is formed in the middle of described second plate-shape metal cut away section 22 and adopt punching press inside described lower frame 21 or be drawn the electronic cards holding part 23 that processes is formed；
Described lower assembly 20 is fitted on described upper assembly 10, lower frame 21 position of described lower assembly 20 carry out spot welding form solder joint 26 so that several lower assembly 20 with described on assembly 10 be combined as a whole, the electronic cards holding part 23 of described lower assembly overlaps with the electronic cards putting groove 12 of described upper assembly 20 the card resettlement section 30 to constitute collecting electronic cards in vertical direction.
Claims (10)
1. a Kato, it is characterized in that: include assembly, and adopt spot-welding technology to be incorporated into the lower assembly of described upper assembly side, described upper assembly adopts plate-shape metal to be stamped and formed out according to electronic cards structure, described upper assembly includes upper side frame, it is stamped and formed out at least one the electronic cards putting groove in described upper side frame, described lower assembly adopts plate-shape metal to be stamped and formed out, described lower assembly includes lower frame, the cut away section that stamping-out is formed in the middle of described plate-shape metal, and inside described lower frame, adopt punching press or be drawn the electronic cards holding part that processes is formed, described electronic cards holding part overlaps with holding electronic cards with described electronic cards putting groove in the vertical direction, described electronic cards holding part constitutes, with described electronic cards putting groove, the card resettlement section housing electronic cards.
2. Kato as claimed in claim 1, it is characterised in that described electronic cards putting groove is stamped and formed out so that electronic cards is inserted from described electronic cards putting groove according to the shape and structure of electronic cards.
3. Kato as claimed in claim 1, it is characterised in that be formed with stage portion between described electronic cards holding part and described lower frame.
4. Kato as claimed in claim 1, it is characterized in that, the front end of described lower frame constitutes spot welding region with two transverse sides, described lower assembly and described upper component joint in together with after, by the spot-welding part region spot welding of described lower frame so that described lower frame and described upper side frame are welded in one and form some solder joints.
5. Kato as claimed in claim 4, it is characterised in that described solder joint is arranged around the periphery of the lower frame of described lower assembly.
6. Kato as claimed in claim 1, it is characterised in that the thickness of described lower assembly is about the 30%-50% of described upper component thickness.
7. Kato as claimed in claim 1, it is characterized in that, the outward flange of one transverse sides of described lower assembly is concordant with the outward flange of the upper side frame of described upper assembly as the sliding part coordinated with electronic card coupler metal shell, another transverse sides of described lower assembly is then positioned at the inner side of described lower frame, using the lower frame of described lower assembly as the sliding part coordinated with electronic card coupler metal shell.
8. Kato as claimed in claim 1, it is characterized in that, two transverse sides of the lower frame of described lower assembly are positioned at the inner side of the upper side frame of described upper assembly, and Kato coordinates slip by the both lateral sides of the upper side frame of described upper assembly with electronic card coupler metal shell.
9. a Kato manufacture method, it is characterised in that including:
First plate-shape metal is provided, described first plate-shape metal is formed upper assembly, at least one electronic cards putting groove that described upper assembly stamping-out is formed with upper side frame, is formed in described upper side frame according to the planform stamping-out of electronic cards；
The second plate-shape metal being thinner than described first plate-shape metal is provided, by described second plate-shape metal according to needing stamping-out to form lower assembly, described lower assembly includes lower frame, stamping-out is formed in the middle of described second plate-shape metal cut away section and adopt punching press inside described lower frame or be drawn the electronic cards holding part that processes is formed；
By described lower component joint on described upper assembly, the lower frame position of described lower assembly carry out spot welding formed solder joint so that lower assembly with described on assembly be combined as a whole, the electronic cards holding part of described lower assembly overlaps with the electronic cards putting groove of described upper assembly in the vertical direction with constitute collecting electronic cards card resettlement section.
10. method as claimed in claim 9, it is characterised in that the thickness of described lower assembly is about the 30%-50% of described upper component thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610243598.6A CN105762580B (en) | 2016-04-19 | 2016-04-19 | Kato and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610243598.6A CN105762580B (en) | 2016-04-19 | 2016-04-19 | Kato and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105762580A true CN105762580A (en) | 2016-07-13 |
| CN105762580B CN105762580B (en) | 2018-06-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610243598.6A Active CN105762580B (en) | 2016-04-19 | 2016-04-19 | Kato and its manufacturing method |
Country Status (1)
| Country | Link |
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| CN (1) | CN105762580B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006043631A1 (en) * | 2004-10-22 | 2006-04-27 | Jsr Corporation | Anisotropic conductive connector for inspecting wafer, manufacturing method thereof, waver inspection probe card, manufacturing method thereof, and wafer inspection device |
| CN201741861U (en) * | 2010-07-26 | 2011-02-09 | 深圳市长盈精密技术股份有限公司 | Laminated type double-SIM (Subscriber Identity Module) card connector capable of automatically popping up |
| CN202633665U (en) * | 2012-05-24 | 2012-12-26 | 富港电子（东莞）有限公司 | Card connector |
| US20140055925A1 (en) * | 2012-08-21 | 2014-02-27 | Chi Mei Communication Systems, Inc. | Chip card holder for electronic device |
| CN103915699A (en) * | 2013-09-17 | 2014-07-09 | 深圳市长盈精密技术股份有限公司 | Connector for card |
| CN204809500U (en) * | 2015-06-15 | 2015-11-25 | 无锡阿尔卑斯电子有限公司 | Card connector |
| CN105161892A (en) * | 2015-10-08 | 2015-12-16 | 昆山嘉华电子有限公司 | Card clamping and supporting unit |
| CN205039340U (en) * | 2015-09-29 | 2016-02-17 | 安费诺-泰姆斯（常州）通迅设备有限公司 | Double -deck stamping workpiece stack injection moulding's card tray structure |
| CN205583286U (en) * | 2016-04-19 | 2016-09-14 | 深圳市长盈精密技术股份有限公司 | Card holds in palm |
-
2016
- 2016-04-19 CN CN201610243598.6A patent/CN105762580B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006043631A1 (en) * | 2004-10-22 | 2006-04-27 | Jsr Corporation | Anisotropic conductive connector for inspecting wafer, manufacturing method thereof, waver inspection probe card, manufacturing method thereof, and wafer inspection device |
| CN201741861U (en) * | 2010-07-26 | 2011-02-09 | 深圳市长盈精密技术股份有限公司 | Laminated type double-SIM (Subscriber Identity Module) card connector capable of automatically popping up |
| CN202633665U (en) * | 2012-05-24 | 2012-12-26 | 富港电子（东莞）有限公司 | Card connector |
| US20140055925A1 (en) * | 2012-08-21 | 2014-02-27 | Chi Mei Communication Systems, Inc. | Chip card holder for electronic device |
| CN103915699A (en) * | 2013-09-17 | 2014-07-09 | 深圳市长盈精密技术股份有限公司 | Connector for card |
| CN204809500U (en) * | 2015-06-15 | 2015-11-25 | 无锡阿尔卑斯电子有限公司 | Card connector |
| CN205039340U (en) * | 2015-09-29 | 2016-02-17 | 安费诺-泰姆斯（常州）通迅设备有限公司 | Double -deck stamping workpiece stack injection moulding's card tray structure |
| CN105161892A (en) * | 2015-10-08 | 2015-12-16 | 昆山嘉华电子有限公司 | Card clamping and supporting unit |
| CN205583286U (en) * | 2016-04-19 | 2016-09-14 | 深圳市长盈精密技术股份有限公司 | Card holds in palm |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105762580B (en) | 2018-06-22 |
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