SU948926A1 - Etching paste - Google Patents

Description

(5) PLASTE FOR POISONING

one

The invention relates to the technology of surface treatment of glass, glass and quartz and can be used in the electronic and optical-mechanical industry.

A known composition for etching, including, wt.%:

 k6; BaSO, 23; 23; dextrin 8 fij.

This etching composition is used to create a diffuse-dissolving light-producing surface layer and is used as a thick paste only for glass etching and is not suitable for glass and quartz, since it does not provide the required surface quality due to the small material removal. The use of the specified etching composition does not lead to the hardening of the surface of the processed materials.

The closest to the invention to the technical essence and the achieved result. is an etching paste, comprising, wt%:

 20-50; BaSO 10-20; HF BO-JltO; glycerin 2-20; KVG 5-20; SnCl, 1-5 Cz.

The disadvantage of this composition is that the treated surface does not have high mechanical strength.

The aim of the invention is to increase the mechanical strength of the treated surface.

The goal is achieved by the fact that the paste for the etching of predominantly quartz and cellars, including,

15, HF, further comprises. and CH COONa in the following ratio of components, weight: 36-39

NH4.F-HF

20 30-33

BaSO, 15-17

HF k-6

H.2S04

CHjGOONa 33 The additional introduction of CH..COONa in comparison with the known composition makes it possible to obtain a fine-grained matted surface; the addition of H, SOA is necessary to convert the reaction products of hydrofluoric acid into soluble, easily washable salts. Table 1 shows the compositions of pastes. The surface hardening after treatment with its proposed composition is presented in Table 2. Thus, the mechanical strength of the surface treated with this composition increases by a factor of 1.5. Using the invention makes it possible to significantly reduce the hardness of the surface of the cellar

Composition

Voltage

gap (brs (sp), kg / mm

14.21 15.22 15.73 10.15

table 2

For machined surface, quartz

. Relay

Voltage

e on. bending to break

(

(Bragr) kg / mm

kg / mm

8.7

10.1 10.8 9.3 9.61

ii; i 6,2

7,2 6 Depletion of the process in obtaining a rough surface, while maintaining good adhesion of glass, glass, quartz to metals and organic materials; use this compound to prepare the surface for subsequent metallization in order to further obtain reliable vacuum-tight connections. The rate of surface etching under the action of the proposed composition is increased to 0.9-1.0 µm / min, which shortens the effect of the composition on glass, glass, quartz, and makes it possible to use it repeatedly. Table 1

5 3 83266

Fbrmula of invention HF 15-17

Pickling agent pre-CH-COONa. 9-11 quartz and sital glass, including; HF, I distinguish 5 Sources of information, so that, with the aim of being taken into account in the examination of the mechanical strength of obra-1. Vacek M. and Kupf V. Chemical surface, it is an additional glass processing. M.,. Lightly industrially contains CHjCOONA, 197, p. 77. with the following component-O ratio. Comrade weight: 2. USSR author's certificate 36-39 in application No. 2882661 / 29-33, BaS04 30-33kl. On 03 On 15/00, 1980.

H

Claims (2)

Claim Paste for etching mainly quartz and glass, including NH ^ F-HF; BaSO ^; HF, which implies that, in order to increase the mechanical strength of the treated surface, it additionally contains H ^ BOD. and CH ^ COONa in the following ratio of components, wt.%: NH ^ F-HF36-39 BaS0 ₄ 30-33 HF15-17 H SO4.4-6 CH ^ COONa9-11 5 Sources of information taken into account in the examination 1. Vacek I. and Kupf V. Chemical processing of glass. M., Light Industry, 1974, p. 77. Yu 2. USSR author's certificate on application ^, 2882661 / .29-33, cl. C 03 C 15/00, 1980.