SG10201910032WA - Wafer processing method - Google Patents

Wafer processing method

Info

Publication number: SG10201910032WA
Authority: SG; Singapore
Prior art keywords: processing method; wafer processing; wafer; processing
Prior art date: 2018-11-06

Application number

SG10201910032WA

Inventor

Harada Shigenori

Matsuzawa Minoru

Kiuchi Hayato

Yodo Yoshiaki

Arakawa Taro

Agari Masamitsu

Kawamura Emiko

Fujii Yusuke

Miyai Toshiki

Ohmae Makiko

Original Assignee

Disco Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2018-11-06

Filing date

2019-10-26

Publication date

2020-06-29

2019-10-26 Application filed by Disco Corp filed Critical Disco Corp

2020-06-29 Publication of SG10201910032WA publication Critical patent/SG10201910032WA/en

Classifications

- H10P90/123—
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- H10P10/12—
- H10P14/40—
- H10P54/00—
- H10P72/0428—
- H10P72/0431—
- H10P72/0436—
- H10P72/0442—
- H10P72/0602—
- H10P72/3206—
- H10P72/3212—
- H10P72/7402—
- H10P72/78—
- H10P90/1914—
- H10P95/90—
- H10W10/00—
- H10W10/01—
- H10W20/068—
- H10W95/00—
- H10P72/7416—
- H10P72/7442—

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Power Engineering (AREA)
General Physics & Mathematics (AREA)
Microelectronics & Electronic Packaging (AREA)
Computer Hardware Design (AREA)
Manufacturing & Machinery (AREA)
Condensed Matter Physics & Semiconductors (AREA)
Optics & Photonics (AREA)
Mechanical Engineering (AREA)
Plasma & Fusion (AREA)
Dicing (AREA)
High Energy & Nuclear Physics (AREA)
Laser Beam Processing (AREA)
Health & Medical Sciences (AREA)
Toxicology (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

SG10201910032WA 2018-11-06 2019-10-26 Wafer processing method SG10201910032WA (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2018208629A JP7503886B2 (en)	2018-11-06	2018-11-06	Wafer Processing Method

Publications (1)

Publication Number	Publication Date
SG10201910032WA true SG10201910032WA (en)	2020-06-29

Family

ID=70457809

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SG10201910032WA SG10201910032WA (en)	2018-11-06	2019-10-26	Wafer processing method

Country Status (8)

Country	Link
US (1)	US11031234B2 (en)
JP (1)	JP7503886B2 (en)
KR (1)	KR102762080B1 (en)
CN (1)	CN111146115B (en)
DE (1)	DE102019217093B4 (en)
MY (1)	MY194815A (en)
SG (1)	SG10201910032WA (en)
TW (1)	TWI826569B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
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JP7430515B2 (en) *	2019-11-06	2024-02-13	株式会社ディスコ	Wafer processing method
KR20210133787A (en)	2020-04-29	2021-11-08	주식회사 엘지에너지솔루션	Battery Pack and Electronic Device Comprising the Same and Vehicle

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2018
- 2018-11-06 JP JP2018208629A patent/JP7503886B2/en active Active
2019
- 2019-10-21 MY MYPI2019006203A patent/MY194815A/en unknown
- 2019-10-26 SG SG10201910032WA patent/SG10201910032WA/en unknown
- 2019-10-28 KR KR1020190134592A patent/KR102762080B1/en active Active
- 2019-11-04 CN CN201911064932.1A patent/CN111146115B/en active Active
- 2019-11-05 US US16/674,276 patent/US11031234B2/en active Active
- 2019-11-05 TW TW108140153A patent/TWI826569B/en active
- 2019-11-06 DE DE102019217093.5A patent/DE102019217093B4/en active Active

Also Published As

Publication number	Publication date
JP2020077681A (en)	2020-05-21
US20200144049A1 (en)	2020-05-07
CN111146115B (en)	2025-03-21
TW202018796A (en)	2020-05-16
DE102019217093B4 (en)	2025-04-30
KR20200052831A (en)	2020-05-15
MY194815A (en)	2022-12-16
US11031234B2 (en)	2021-06-08
JP7503886B2 (en)	2024-06-21
CN111146115A (en)	2020-05-12
DE102019217093A1 (en)	2020-05-07
TWI826569B (en)	2023-12-21
KR102762080B1 (en)	2025-02-04

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