SG10201407399PA - Downholder for holding down the substrate places of a substrate - Google Patents

Downholder for holding down the substrate places of a substrate

Info

Publication number: SG10201407399PA
Authority: SG; Singapore
Prior art keywords: substrate; downholder; holding down; places; substrate places
Prior art date: 2013-12-09

Application number

SG10201407399PA

Inventor

Guido Suter

Original Assignee

Besi Switzerland Ag

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2013-12-09

Filing date

2014-11-10

Publication date

2015-07-30

2014-11-10 Application filed by Besi Switzerland Ag filed Critical Besi Switzerland Ag

2015-07-30 Publication of SG10201407399PA publication Critical patent/SG10201407399PA/en

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/75981—Apparatus chuck

Landscapes

Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Manufacturing & Machinery (AREA)
Actuator (AREA)
Die Bonding (AREA)
Road Paving Machines (AREA)
Casting Or Compression Moulding Of Plastics Or The Like (AREA)

SG10201407399PA 2013-12-09 2014-11-10 Downholder for holding down the substrate places of a substrate SG10201407399PA (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
CH02035/13A CH708932B1 (en)	2013-12-09	2013-12-09	Downholder for holding down the substrate locations of a substrate for the purpose of mounting semiconductor components.

Publications (1)

Publication Number	Publication Date
SG10201407399PA true SG10201407399PA (en)	2015-07-30

Family

ID=53185405

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SG10201407399PA SG10201407399PA (en)	2013-12-09	2014-11-10	Downholder for holding down the substrate places of a substrate

Country Status (6)

Country	Link
JP (1)	JP6627143B2 (en)
KR (1)	KR20150067019A (en)
CN (1)	CN104701220B (en)
CH (1)	CH708932B1 (en)
DE (1)	DE102014116939A1 (en)
SG (1)	SG10201407399PA (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE102023110438B4 (en)	2023-04-24	2025-05-15	Besi Switzerland Ag	Device with an improved hold-down device

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH01120834A (en) *	1987-11-04	1989-05-12	Nec Corp	Die bonding device for semiconductor element
JPH0538884U (en) *	1991-10-28	1993-05-25	関西日本電気株式会社	Lead bonder
JPH06252210A (en) *	1993-02-25	1994-09-09	Nec Kansai Ltd	Inner lead bonder
US5556808A (en) *	1994-06-30	1996-09-17	Motorola Inc.	Method for aligning a semiconductor device
JP2000021930A (en) *	1998-07-01	2000-01-21	Nippon Avionics Co Ltd	Thermocompression bonding equipment
DE10058145B4 (en) *	1999-11-26	2006-12-28	Smc K.K.	cylinder device
JP3850351B2 (en) *	2002-04-25	2006-11-29	京セラ株式会社	Electronic component element mounting method
US7048174B2 (en) *	2003-08-25	2006-05-23	The Boeing Company	Adaptable spring force clamping apparatus and methods
JP4241683B2 (en) *	2005-07-06	2009-03-18	パナソニック株式会社	Parts pressing device
FR2905883B1 (en) *	2006-09-14	2008-12-05	Valeo Electronique Sys Liaison	METHOD FOR WELDING AN ORGAN ON A SUPPORT BY DELIVERING MATERIAL AND DEVICE FOR ARRANGING TWO ELEMENTS ON ONE ANOTHER
CN101801646B (en) *	2007-11-08	2013-04-17	株式会社爱发科	Bonding substrate manufacturing apparatus and bonding substrate manufacturing method
JP5359009B2 (en) *	2008-04-18	2013-12-04	株式会社ニコン	Semiconductor substrate bonding equipment
CN201262949Y (en) *	2008-09-04	2009-06-24	浙江华越芯装电子股份有限公司	Improved bonding clamper for integrated circuit heat pressing ultrasound ball welder
TWI550680B (en) *	2009-09-28	2016-09-21	尼康股份有限公司	Substrate pressurization device and its control method
JP5580163B2 (en) *	2010-10-13	2014-08-27	東レエンジニアリング株式会社	Parallelism adjusting method and parallelism adjusting device for mounting apparatus
TWI564106B (en) *	2011-03-28	2017-01-01	山田尖端科技股份有限公司	Bonding apparatus and bonding method
JP2013143542A (en) *	2012-01-12	2013-07-22	Tokyo Electron Ltd	Semiconductor device manufacturing system and semiconductor device manufacturing method
WO2013133015A1 (en) *	2012-03-07	2013-09-12	東レ株式会社	Method and apparatus for manufacturing semiconductor device

2013
- 2013-12-09 CH CH02035/13A patent/CH708932B1/en not_active IP Right Cessation
2014
- 2014-11-10 SG SG10201407399PA patent/SG10201407399PA/en unknown
- 2014-11-17 KR KR1020140160125A patent/KR20150067019A/en active Pending
- 2014-11-19 DE DE102014116939.5A patent/DE102014116939A1/en not_active Withdrawn
- 2014-12-02 JP JP2014243892A patent/JP6627143B2/en not_active Expired - Fee Related
- 2014-12-09 CN CN201410810596.1A patent/CN104701220B/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
CH708932A1 (en)	2015-06-15
KR20150067019A (en)	2015-06-17
HK1206867A1 (en)	2016-01-15
CN104701220A (en)	2015-06-10
JP2015115606A (en)	2015-06-22
CH708932B1 (en)	2017-04-13
DE102014116939A1 (en)	2015-06-11
JP6627143B2 (en)	2020-01-08
CN104701220B (en)	2019-07-23

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