SG11201510638XA - Process for locating devices - Google Patents
Process for locating devicesInfo
- Publication number
- SG11201510638XA SG11201510638XA SG11201510638XA SG11201510638XA SG11201510638XA SG 11201510638X A SG11201510638X A SG 11201510638XA SG 11201510638X A SG11201510638X A SG 11201510638XA SG 11201510638X A SG11201510638X A SG 11201510638XA SG 11201510638X A SG11201510638X A SG 11201510638XA
- Authority
- SG
- Singapore
- Prior art keywords
- locating devices
- locating
- devices
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/026—Wafer-level processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Die Bonding (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Electrodes Of Semiconductors (AREA)
- Micromachines (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1301697A FR3008543B1 (en) | 2013-07-15 | 2013-07-15 | METHOD OF LOCATING DEVICES |
PCT/FR2014/051568 WO2015007971A1 (en) | 2013-07-15 | 2014-06-24 | Method for locating devices |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201510638XA true SG11201510638XA (en) | 2016-01-28 |
Family
ID=49546458
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201510638XA SG11201510638XA (en) | 2013-07-15 | 2014-06-24 | Process for locating devices |
Country Status (8)
Country | Link |
---|---|
US (2) | US20160197006A1 (en) |
JP (1) | JP6463751B2 (en) |
KR (1) | KR102218891B1 (en) |
AT (1) | AT521083B1 (en) |
DE (1) | DE112014003280T5 (en) |
FR (1) | FR3008543B1 (en) |
SG (1) | SG11201510638XA (en) |
WO (1) | WO2015007971A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3076292B1 (en) * | 2017-12-28 | 2020-01-03 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | METHOD FOR TRANSFERRING A USEFUL LAYER ONTO A SUPPORT SUBSTRATE |
FR3079659B1 (en) * | 2018-03-29 | 2020-03-13 | Soitec | METHOD FOR MANUFACTURING A DONOR SUBSTRATE FOR THE PRODUCTION OF AN INTEGRATED THREE-DIMENSIONAL STRUCTURE AND METHOD FOR MANUFACTURING SUCH AN INTEGRATED STRUCTURE |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2628555B2 (en) | 1988-03-22 | 1997-07-09 | 富士通株式会社 | Method for manufacturing semiconductor device |
KR0155835B1 (en) * | 1995-06-23 | 1998-12-01 | 김광호 | Method for forming align key pattern of semiconductor device |
KR100543393B1 (en) * | 2000-03-09 | 2006-01-20 | 후지쯔 가부시끼가이샤 | Semiconductor device and manufacturing method thereof |
JP2005142252A (en) * | 2003-11-05 | 2005-06-02 | Sony Corp | Forming method of alignment mark, semiconductor device, and manufacturing method thereof |
EP1571705A3 (en) | 2004-03-01 | 2006-01-04 | S.O.I.Tec Silicon on Insulator Technologies | Process of making a semiconductor structure on a substrate |
KR101233105B1 (en) * | 2008-08-27 | 2013-02-15 | 소이텍 | Methods of fabricating semiconductor structures or devices using layers of semiconductor material having selected or controlled lattice parameters |
JP5196160B2 (en) * | 2008-10-17 | 2013-05-15 | 日亜化学工業株式会社 | Semiconductor light emitting device |
JP5617835B2 (en) * | 2009-02-24 | 2014-11-05 | 日本電気株式会社 | Semiconductor device and manufacturing method thereof |
US8058137B1 (en) * | 2009-04-14 | 2011-11-15 | Monolithic 3D Inc. | Method for fabrication of a semiconductor device and structure |
WO2011132654A1 (en) | 2010-04-20 | 2011-10-27 | 住友電気工業株式会社 | Method for producing composite substrate |
JP5440442B2 (en) * | 2010-08-18 | 2014-03-12 | 株式会社リコー | Optical scanning apparatus and image forming apparatus |
WO2012042653A1 (en) * | 2010-09-30 | 2012-04-05 | 富士電機株式会社 | Method of manufacturing semiconductor device |
US8502389B2 (en) * | 2011-08-08 | 2013-08-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | CMOS image sensor and method for forming the same |
US8779539B2 (en) * | 2011-09-21 | 2014-07-15 | United Microelectronics Corporation | Image sensor and method for fabricating the same |
FR3005648B1 (en) * | 2013-05-15 | 2016-02-12 | Commissariat Energie Atomique | METHOD FOR ENCAPSULATING A MICROELECTRONIC DEVICE COMPRISING A NOVEL GAS INJECTION THROUGH A MATERIAL PERMEABLE TO THIS NOBLE GAS |
-
2013
- 2013-07-15 FR FR1301697A patent/FR3008543B1/en active Active
-
2014
- 2014-06-24 US US14/903,961 patent/US20160197006A1/en not_active Abandoned
- 2014-06-24 AT ATA9279/2014A patent/AT521083B1/en active
- 2014-06-24 KR KR1020167001033A patent/KR102218891B1/en active Active
- 2014-06-24 WO PCT/FR2014/051568 patent/WO2015007971A1/en active Application Filing
- 2014-06-24 DE DE112014003280.8T patent/DE112014003280T5/en active Pending
- 2014-06-24 SG SG11201510638XA patent/SG11201510638XA/en unknown
- 2014-06-24 JP JP2016526673A patent/JP6463751B2/en active Active
-
2019
- 2019-11-15 US US16/685,938 patent/US11088016B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US11088016B2 (en) | 2021-08-10 |
AT521083B1 (en) | 2020-04-15 |
AT521083A3 (en) | 2019-12-15 |
US20200161172A1 (en) | 2020-05-21 |
AT521083A2 (en) | 2019-10-15 |
JP6463751B2 (en) | 2019-02-06 |
JP2016527717A (en) | 2016-09-08 |
KR20160031489A (en) | 2016-03-22 |
FR3008543B1 (en) | 2015-07-17 |
FR3008543A1 (en) | 2015-01-16 |
US20160197006A1 (en) | 2016-07-07 |
WO2015007971A1 (en) | 2015-01-22 |
KR102218891B1 (en) | 2021-02-24 |
DE112014003280T5 (en) | 2016-04-14 |
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