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SE9604678L - Bulor i spår för elastisk lokalisering - Google Patents

Bulor i spår för elastisk lokalisering

Info

Publication number
SE9604678L
SE9604678L SE9604678A SE9604678A SE9604678L SE 9604678 L SE9604678 L SE 9604678L SE 9604678 A SE9604678 A SE 9604678A SE 9604678 A SE9604678 A SE 9604678A SE 9604678 L SE9604678 L SE 9604678L
Authority
SE
Sweden
Prior art keywords
bumps
parts
alignment
grooves
elastic
Prior art date
Application number
SE9604678A
Other languages
English (en)
Swedish (sv)
Other versions
SE9604678D0 (sv
Inventor
Lillebror Hjalmar Hesselbom
Jan Peter Bodoe
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9604678A priority Critical patent/SE9604678L/xx
Publication of SE9604678D0 publication Critical patent/SE9604678D0/xx
Priority to TW086100965A priority patent/TW327245B/zh
Priority to KR1019997005629A priority patent/KR20000069627A/ko
Priority to PCT/SE1997/002179 priority patent/WO1998027590A1/en
Priority to CA002275521A priority patent/CA2275521A1/en
Priority to AU55056/98A priority patent/AU5505698A/en
Priority to JP52763198A priority patent/JP4143130B2/ja
Priority to CNB971817049A priority patent/CN1145210C/zh
Priority to EP97951405A priority patent/EP0951736A1/en
Priority to US08/995,202 priority patent/US6188138B1/en
Publication of SE9604678L publication Critical patent/SE9604678L/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H01L2224/81141—Guiding structures both on and outside the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/83138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H01L2224/83141—Guiding structures both on and outside the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SE9604678A 1996-12-19 1996-12-19 Bulor i spår för elastisk lokalisering SE9604678L (sv)

Priority Applications (10)

Application Number Priority Date Filing Date Title
SE9604678A SE9604678L (sv) 1996-12-19 1996-12-19 Bulor i spår för elastisk lokalisering
TW086100965A TW327245B (en) 1996-12-19 1997-01-29 Bumps in grooves for elastic positioning
US08/995,202 US6188138B1 (en) 1996-12-19 1997-12-19 Bumps in grooves for elastic positioning
CA002275521A CA2275521A1 (en) 1996-12-19 1997-12-19 Bumps in grooves for elastic positioning
PCT/SE1997/002179 WO1998027590A1 (en) 1996-12-19 1997-12-19 Bumps in grooves for elastic positioning
KR1019997005629A KR20000069627A (ko) 1996-12-19 1997-12-19 탄성적 위치결정을 위한 홈내 범프
AU55056/98A AU5505698A (en) 1996-12-19 1997-12-19 Bumps in grooves for elastic positioning
JP52763198A JP4143130B2 (ja) 1996-12-19 1997-12-19 少なくとも１つのｖ字溝を備えた第１部品と、少なくとも１つの隆起を備えた第２部品とを有した整合構造
CNB971817049A CN1145210C (zh) 1996-12-19 1997-12-19 对准结构
EP97951405A EP0951736A1 (en) 1996-12-19 1997-12-19 Bumps in grooves for elastic positioning

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9604678A SE9604678L (sv) 1996-12-19 1996-12-19 Bulor i spår för elastisk lokalisering

Publications (2)

Publication Number Publication Date
SE9604678D0 SE9604678D0 (sv) 1996-12-19
SE9604678L true SE9604678L (sv) 1998-06-20

Family

ID=20405044

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9604678A SE9604678L (sv) 1996-12-19 1996-12-19 Bulor i spår för elastisk lokalisering

Country Status (10)

Country Link
US (1) US6188138B1 (xx)
EP (1) EP0951736A1 (xx)
JP (1) JP4143130B2 (xx)
KR (1) KR20000069627A (xx)
CN (1) CN1145210C (xx)
AU (1) AU5505698A (xx)
CA (1) CA2275521A1 (xx)
SE (1) SE9604678L (xx)
TW (1) TW327245B (xx)
WO (1) WO1998027590A1 (xx)

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EP1122567A1 (en) * 2000-02-02 2001-08-08 Corning Incorporated Passive alignement using slanted wall pedestal
US6809420B1 (en) * 2000-02-29 2004-10-26 Intel Corporation Characterization of induced shift on an overlay target using post-etch artifact wafers
US6759746B1 (en) * 2000-03-17 2004-07-06 Robert Bruce Davies Die attachment and method
EP1178340A1 (en) * 2000-08-02 2002-02-06 Corning Incorporated Vertically-tolerant alignment using slanted wall pedestal
US6495396B1 (en) * 2001-08-29 2002-12-17 Sun Microsystems, Inc. Method of coupling and aligning semiconductor devices including multi-chip semiconductor devices
US6696320B2 (en) * 2001-09-30 2004-02-24 Intel Corporation Low profile stacked multi-chip package and method of forming same
US6774482B2 (en) * 2002-12-27 2004-08-10 International Business Machines Corporation Chip cooling
US7112882B2 (en) * 2004-08-25 2006-09-26 Taiwan Semiconductor Manufacturing Co., Ltd. Structures and methods for heat dissipation of semiconductor integrated circuits
US20070013053A1 (en) * 2005-07-12 2007-01-18 Peter Chou Semiconductor device and method for manufacturing a semiconductor device
US7745301B2 (en) * 2005-08-22 2010-06-29 Terapede, Llc Methods and apparatus for high-density chip connectivity
US8957511B2 (en) * 2005-08-22 2015-02-17 Madhukar B. Vora Apparatus and methods for high-density chip connectivity
US20080048456A1 (en) * 2006-08-23 2008-02-28 Northern Power Systems, Inc. Modular microturbine system
US7656017B2 (en) * 2006-12-18 2010-02-02 Stats Chippac Ltd. Integrated circuit package system with thermo-mechanical interlocking substrates
JP5073351B2 (ja) * 2007-04-12 2012-11-14 日本電波工業株式会社 表面実装用の電子デバイス
TWI478272B (zh) * 2007-08-15 2015-03-21 尼康股份有限公司 A positioning device, a bonding device, a laminated substrate manufacturing device, an exposure device, and a positioning method
US20140090234A1 (en) * 2011-05-23 2014-04-03 University Of Massachusetts Apparatus and methods for multi-scale alignment and fastening
CN103282814B (zh) 2011-12-26 2015-02-25 株式会社藤仓 光模块
CN102623615A (zh) * 2012-03-30 2012-08-01 东南大学 可自对准的发光二极管的圆片级封装方法
US9044237B2 (en) * 2012-04-16 2015-06-02 Boston Scientific Scimed, Inc. Securement structure for joining medical device parts
CN104662460B (zh) 2012-09-27 2016-11-09 株式会社藤仓 光模块
CN204135925U (zh) * 2014-03-07 2015-02-04 耐克创新有限合伙公司 磁性自对准的制造固定器
JP7006322B2 (ja) 2018-01-31 2022-01-24 トヨタ自動車株式会社 車両
CN108966488B (zh) * 2018-09-26 2024-04-16 四川锐宏电子科技有限公司 一种半孔微槽电路板及其加工设备和加工工艺
CN113658880A (zh) * 2020-05-12 2021-11-16 联华电子股份有限公司 芯片键合应力的测量方法及芯片键合辅助结构
CN113178421B (zh) * 2021-04-08 2022-03-29 深圳市磐锋精密技术有限公司 一种手机集成电路的多芯片封装定位装置及其定位方法

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Also Published As

Publication number Publication date
SE9604678D0 (sv) 1996-12-19
JP2001506415A (ja) 2001-05-15
CA2275521A1 (en) 1998-06-25
TW327245B (en) 1998-02-21
CN1145210C (zh) 2004-04-07
JP4143130B2 (ja) 2008-09-03
WO1998027590A1 (en) 1998-06-25
CN1245586A (zh) 2000-02-23
US6188138B1 (en) 2001-02-13
KR20000069627A (ko) 2000-11-25
AU5505698A (en) 1998-07-15
EP0951736A1 (en) 1999-10-27

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