SE394171B - Aggregat innefattande ett distanselement. - Google Patents
Aggregat innefattande ett distanselement.Info
- Publication number
- SE394171B SE394171B SE7409324A SE7409324A SE394171B SE 394171 B SE394171 B SE 394171B SE 7409324 A SE7409324 A SE 7409324A SE 7409324 A SE7409324 A SE 7409324A SE 394171 B SE394171 B SE 394171B
- Authority
- SE
- Sweden
- Prior art keywords
- unit including
- distance element
- distance
- unit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT26760/73A IT992650B (it) | 1973-07-19 | 1973-07-19 | Elemento per accoppiare un radiatore di calore con la massa termica di un dispositivo integra to nel montaggio su circuito stam pato |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| SE7409324L SE7409324L (xx) | 1975-01-20 |
| SE394171B true SE394171B (sv) | 1977-06-06 |
Family
ID=11220191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE7409324A SE394171B (sv) | 1973-07-19 | 1974-07-17 | Aggregat innefattande ett distanselement. |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US3911327A (xx) |
| JP (1) | JPS5050874A (xx) |
| DE (1) | DE2434627C3 (xx) |
| FR (1) | FR2238314B1 (xx) |
| GB (1) | GB1475573A (xx) |
| IT (1) | IT992650B (xx) |
| NL (1) | NL7409696A (xx) |
| SE (1) | SE394171B (xx) |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4004528A (en) * | 1976-03-26 | 1977-01-25 | The Singer Company | Heat sink for an appliance circuit board |
| US4199654A (en) * | 1977-09-14 | 1980-04-22 | Bunker Ramo Corporation | Semiconductor mounting assembly |
| DE2819499C3 (de) * | 1978-05-03 | 1981-01-29 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Gehäuse für eine Halbleiteranordnung |
| US4167031A (en) * | 1978-06-21 | 1979-09-04 | Bell Telephone Laboratories, Incorporated | Heat dissipating assembly for semiconductor devices |
| US4251852A (en) * | 1979-06-18 | 1981-02-17 | International Business Machines Corporation | Integrated circuit package |
| US4367523A (en) * | 1981-02-17 | 1983-01-04 | Electronic Devices, Inc. | Rectifier bridge unit |
| US4498120A (en) * | 1982-03-01 | 1985-02-05 | Kaufman Lance R | Electrical sub-assembly having a lead frame to be compressed between a circuit board and heat sink |
| US4447842A (en) * | 1982-06-01 | 1984-05-08 | Control Data Corporation | Finned heat exchangers for electronic chips and cooling assembly |
| JPS59502003A (ja) * | 1982-11-09 | 1984-11-29 | シリコン コネクシヨン，インコ−ポレ−テツド | 電子回路チツプ接続アツセンブリおよび方法 |
| JPS60121652U (ja) * | 1984-01-26 | 1985-08-16 | 株式会社 メレツク | パワ−トランジスタの放熱器への取付構造 |
| FR2567324B1 (fr) * | 1984-07-06 | 1986-11-28 | Telemecanique Electrique | Dispositif de montage, pour composant hybride a couche epaisse notamment pour module electronique |
| US4665467A (en) * | 1986-02-18 | 1987-05-12 | Ncr Corporation | Heat transfer mounting device |
| US4878108A (en) * | 1987-06-15 | 1989-10-31 | International Business Machines Corporation | Heat dissipation package for integrated circuits |
| US4891686A (en) * | 1988-04-08 | 1990-01-02 | Directed Energy, Inc. | Semiconductor packaging with ground plane conductor arrangement |
| US5089936A (en) * | 1988-09-09 | 1992-02-18 | Hitachi, Ltd. | Semiconductor module |
| US5258649A (en) * | 1989-05-20 | 1993-11-02 | Hitachi, Ltd. | Semiconductor device and electronic apparatus using semiconductor device |
| US5283467A (en) * | 1992-06-05 | 1994-02-01 | Eaton Corporation | Heat sink mounting system for semiconductor devices |
| US5377078A (en) * | 1993-01-26 | 1994-12-27 | Relm Communications Inc. | Apparatus mounting a power semiconductor to a heat sink |
| US5396404A (en) * | 1993-09-20 | 1995-03-07 | Delco Electronics Corp. | Heat sinking assembly for electrical components |
| JP2944405B2 (ja) * | 1993-12-29 | 1999-09-06 | 日本電気株式会社 | 半導体素子の冷却構造および電磁遮蔽構造 |
| FR2721438B1 (fr) * | 1994-06-21 | 1996-10-18 | Jacques Daniel Lhomme | Dispositif de serrage utilisable notamment pour les semi-conducteurs de puissance. |
| US5477188A (en) * | 1994-07-14 | 1995-12-19 | Eni | Linear RF power amplifier |
| US5504653A (en) * | 1994-11-21 | 1996-04-02 | Delco Electronics Corp. | Heat sinking assembly for electrical components |
| US5557503A (en) * | 1995-05-12 | 1996-09-17 | International Business Machines Corporation | Circuit card having a large module strain relief and heat sink support |
| US5796584A (en) * | 1996-04-30 | 1998-08-18 | Telefonaktiebolaget Lm Ericsson | Bridge for power transistors with improved cooling |
| US5825107A (en) * | 1997-06-13 | 1998-10-20 | General Electric Company | Drive package for a dynamoelectric machine |
| US6731503B2 (en) * | 2001-08-10 | 2004-05-04 | Black & Decker Inc. | Electrically isolated module |
| AU2002343325B2 (en) * | 2001-08-10 | 2006-08-03 | Black & Decker Inc. | Electrically isolated module |
| DE10149886A1 (de) * | 2001-10-10 | 2003-04-30 | Eupec Gmbh & Co Kg | Leistunghalbleitermodul |
| US20050161195A1 (en) * | 2003-07-22 | 2005-07-28 | Hein Gerald K. | System for reliably removing heat from a semiconductor junction |
| EP1760557B1 (fr) * | 2005-09-06 | 2009-11-11 | ETA SA Manufacture Horlogère Suisse | Pièce d'horlogerie comportant un cadran en matériau semi-conducteur |
| US8657031B2 (en) * | 2005-10-12 | 2014-02-25 | Black & Decker Inc. | Universal control module |
| US7746653B2 (en) * | 2008-01-02 | 2010-06-29 | Harman International Industries Incorporated | Clamp for electrical devices |
| JP2010285980A (ja) * | 2009-05-13 | 2010-12-24 | Sanden Corp | インバータ一体型電動圧縮機 |
| US8860209B1 (en) | 2010-08-16 | 2014-10-14 | NuLEDs, Inc. | LED luminaire having front and rear convective heat sinks |
| US8585248B1 (en) | 2010-08-16 | 2013-11-19 | NuLEDs, Inc. | LED luminaire having heat sinking panels |
| WO2018063171A1 (en) * | 2016-09-28 | 2018-04-05 | Intel Corporation | Thermal conductivity for integrated circuit packaging |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3219885A (en) * | 1961-03-20 | 1965-11-23 | Gen Motors Corp | Transistor heat dissipator |
| US3689804A (en) * | 1971-09-30 | 1972-09-05 | Nippon Denso Co | Hybrid circuit device |
| US3812557A (en) * | 1973-02-05 | 1974-05-28 | Eaton Corp | Holding clamp |
-
1973
- 1973-07-19 IT IT26760/73A patent/IT992650B/it active
-
1974
- 1974-07-17 SE SE7409324A patent/SE394171B/xx not_active IP Right Cessation
- 1974-07-17 NL NL7409696A patent/NL7409696A/xx not_active Application Discontinuation
- 1974-07-17 US US489172A patent/US3911327A/en not_active Expired - Lifetime
- 1974-07-18 DE DE2434627A patent/DE2434627C3/de not_active Expired
- 1974-07-18 GB GB3192474A patent/GB1475573A/en not_active Expired
- 1974-07-19 JP JP49082339A patent/JPS5050874A/ja active Pending
- 1974-07-19 FR FR7425201A patent/FR2238314B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB1475573A (en) | 1977-06-01 |
| AU7136474A (en) | 1976-01-22 |
| NL7409696A (nl) | 1975-01-21 |
| JPS5050874A (xx) | 1975-05-07 |
| DE2434627B2 (de) | 1976-07-29 |
| SE7409324L (xx) | 1975-01-20 |
| IT992650B (it) | 1975-09-30 |
| DE2434627A1 (de) | 1975-02-06 |
| FR2238314A1 (xx) | 1975-02-14 |
| US3911327A (en) | 1975-10-07 |
| FR2238314B1 (xx) | 1976-12-24 |
| DE2434627C3 (de) | 1980-10-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| NUG | Patent has lapsed |
Ref document number: 7409324-6 Effective date: 19940810 Format of ref document f/p: F |