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PL2310558T3 - Improved copper-tin electrolyte and process for the deposition of tin-bronze layers - Google Patents

Improved copper-tin electrolyte and process for the deposition of tin-bronze layers

Info

Publication number
PL2310558T3
PL2310558T3 PL09776985T PL09776985T PL2310558T3 PL 2310558 T3 PL2310558 T3 PL 2310558T3 PL 09776985 T PL09776985 T PL 09776985T PL 09776985 T PL09776985 T PL 09776985T PL 2310558 T3 PL2310558 T3 PL 2310558T3
Authority
PL
Poland
Prior art keywords
bronze layers
tin
layers
bronze
decorative
Prior art date
Application number
PL09776985T
Other languages
Polish (pl)
Inventor
Klaus Bronder
Bernd Weyhmueller
Frank Oberst
Sascha Berger
Uwe Manz
Original Assignee
Umicore Galvanotechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Umicore Galvanotechnik Gmbh filed Critical Umicore Galvanotechnik Gmbh
Publication of PL2310558T3 publication Critical patent/PL2310558T3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Consumer goods and industrial articles are electroplated with bronze layers for decorative purposes and for protection against corrosion. The electrolytes used hitherto for producing decorative bronze layers are cyanide-containing or, as in the case of baths based on organosulfonic acids, highly corrosive, or, as in the case of cyanide-free baths based on diphosphoric acid, give unsatisfactory brightness and shine. The present invention provides a nontoxic electrolyte for the electrochemical deposition of uniformly bright and shiny bronze layers and a corresponding process for the application of such decorative bronze layers to consumer goods and industrial articles, by means of which relatively thick bronze layers can also be deposited electrochemically in a satisfactory way.
PL09776985T 2008-07-10 2009-07-06 Improved copper-tin electrolyte and process for the deposition of tin-bronze layers PL2310558T3 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008032398A DE102008032398A1 (en) 2008-07-10 2008-07-10 Improved copper-tin electrolyte and process for depositing bronze layers
PCT/EP2009/004879 WO2010003621A1 (en) 2008-07-10 2009-07-06 Improved copper-tin electrolyte and process for the deposition of bronze layers
EP09776985A EP2310558B1 (en) 2008-07-10 2009-07-06 Improved copper-tin electrolyte and process for the deposition of tin-bronze layers

Publications (1)

Publication Number Publication Date
PL2310558T3 true PL2310558T3 (en) 2012-09-28

Family

ID=41258161

Family Applications (1)

Application Number Title Priority Date Filing Date
PL09776985T PL2310558T3 (en) 2008-07-10 2009-07-06 Improved copper-tin electrolyte and process for the deposition of tin-bronze layers

Country Status (10)

Country Link
US (1) US20110174631A1 (en)
EP (1) EP2310558B1 (en)
JP (1) JP2011527381A (en)
KR (1) KR20110031183A (en)
CN (1) CN102089466B (en)
AT (1) ATE549434T1 (en)
DE (1) DE102008032398A1 (en)
PL (1) PL2310558T3 (en)
TW (1) TW201014935A (en)
WO (1) WO2010003621A1 (en)

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DE102010044551A1 (en) * 2010-09-07 2012-03-08 Coventya Gmbh Anode and their use in an alkaline electroplating bath
DE102011121799B4 (en) * 2011-12-21 2013-08-29 Umicore Galvanotechnik Gmbh An electrolyte and a method for the electrodeposition of Cu-Zn-Sn alloy layers and a method for producing a thin-film solar cell
DE102012008544A1 (en) 2012-05-02 2013-11-07 Umicore Galvanotechnik Gmbh Chromed composites without nickel coating
AT514818B1 (en) * 2013-09-18 2015-10-15 W Garhöfer Ges M B H Ing Deposition of Cu, Sn, Zn coatings on metallic substrates
DE102013226297B3 (en) * 2013-12-17 2015-03-26 Umicore Galvanotechnik Gmbh Aqueous, cyanide-free electrolyte for the deposition of copper-tin and copper-tin-zinc alloys from an electrolyte and process for the electrolytic deposition of these alloys
CN103789803B (en) * 2014-01-13 2016-04-27 孙松华 A kind of without cyanogen gunmetal electroplate liquid and preparation method thereof
JP5938426B2 (en) * 2014-02-04 2016-06-22 株式会社豊田中央研究所 Electroplating cell and metal film manufacturing method
AR100422A1 (en) * 2014-05-15 2016-10-05 Nippon Steel & Sumitomo Metal Corp SOLUTION FOR DEPOSITION FOR THREADED CONNECTION FOR A PIPE OR PIPE AND PRODUCTION METHOD OF THE THREADED CONNECTION FOR A PIPE OR PIPE
CN106521574B (en) * 2016-12-05 2018-10-26 浙江工业大学 A kind of non-cyanide plating solution for copper-plating used and preparation method thereof suitable for width pH and wide current density range
CN110139948B (en) * 2016-12-28 2022-09-30 德国艾托特克公司 Tin plating bath and method for depositing tin or tin alloy on surface of substrate
CN110344079B (en) * 2019-08-16 2021-06-08 广东超华科技股份有限公司 Device and method for reducing concentration of iron ions in electrolytic copper foil electrolyte
RU2762501C1 (en) * 2021-05-17 2021-12-21 Федеральное государственное бюджетное образовательное учреждение высшего образования "Российский химико-технологический университет имени Д.И. Менделеева" (РХТУ им. Д.И. Менделеева) Alkaline electrolyte for electrolytic deposition of yellow tin bronze
DE202021004169U1 (en) 2021-07-02 2022-12-07 Umicore Galvanotechnik Gmbh Bronze layer as a substitute for precious metals in smart cards
DE102021117095A1 (en) 2021-07-02 2023-01-05 Umicore Galvanotechnik Gmbh Bronze layers as a substitute for precious metals

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US4289286A (en) * 1978-10-16 1981-09-15 East/West Industries, Inc. Replaceable harness bracket assembly
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JP3455712B2 (en) 2000-04-14 2003-10-14 日本ニュークローム株式会社 Pyrophosphate bath for copper-tin alloy plating
DE50106133D1 (en) * 2000-09-20 2005-06-09 Schloetter Fa Dr Ing Max ELECTROLYTE AND METHOD OF DEPOSITING TIN COPPER ALLOY LAYERS
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DE502007002479D1 (en) * 2007-02-14 2010-02-11 Umicore Galvanotechnik Gmbh Copper-tin electrolyte and process for the deposition of bronze layers

Also Published As

Publication number Publication date
ATE549434T1 (en) 2012-03-15
CN102089466B (en) 2012-11-07
CN102089466A (en) 2011-06-08
US20110174631A1 (en) 2011-07-21
KR20110031183A (en) 2011-03-24
TW201014935A (en) 2010-04-16
JP2011527381A (en) 2011-10-27
DE102008032398A1 (en) 2010-01-14
EP2310558A1 (en) 2011-04-20
EP2310558B1 (en) 2012-03-14
WO2010003621A1 (en) 2010-01-14

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