[go: up one dir, main page]

PL1890887T3 - Sposób i urządzenie do nanoszenia wzoru z pieczęci na podłoże - Google Patents

Sposób i urządzenie do nanoszenia wzoru z pieczęci na podłoże

Info

Publication number
PL1890887T3
PL1890887T3 PL06728092T PL06728092T PL1890887T3 PL 1890887 T3 PL1890887 T3 PL 1890887T3 PL 06728092 T PL06728092 T PL 06728092T PL 06728092 T PL06728092 T PL 06728092T PL 1890887 T3 PL1890887 T3 PL 1890887T3
Authority
PL
Poland
Prior art keywords
stamp
transferring
pattern
substrate
Prior art date
Application number
PL06728092T
Other languages
English (en)
Inventor
Ronald M Schneider
Marinus J J Dona
Michel M J Decre
Original Assignee
Koninklijke Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Nv filed Critical Koninklijke Philips Nv
Publication of PL1890887T3 publication Critical patent/PL1890887T3/pl

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41K—STAMPS; STAMPING OR NUMBERING APPARATUS OR DEVICES
    • B41K3/00—Apparatus for stamping articles having integral means for supporting the articles to be stamped
    • B41K3/02—Apparatus for stamping articles having integral means for supporting the articles to be stamped with stamping surface located above article-supporting surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41K—STAMPS; STAMPING OR NUMBERING APPARATUS OR DEVICES
    • B41K3/00—Apparatus for stamping articles having integral means for supporting the articles to be stamped
    • B41K3/02—Apparatus for stamping articles having integral means for supporting the articles to be stamped with stamping surface located above article-supporting surface
    • B41K3/12—Apparatus for stamping articles having integral means for supporting the articles to be stamped with stamping surface located above article-supporting surface with curved stamping surface for stamping by rolling contact
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41K—STAMPS; STAMPING OR NUMBERING APPARATUS OR DEVICES
    • B41K3/00—Apparatus for stamping articles having integral means for supporting the articles to be stamped
    • B41K3/36—Apparatus for stamping articles having integral means for supporting the articles to be stamped with means for deforming or punching the copy matter
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/0046—Surface micromachining, i.e. structuring layers on the substrate using stamping, e.g. imprinting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Printing Methods (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
PL06728092T 2005-05-03 2006-05-01 Sposób i urządzenie do nanoszenia wzoru z pieczęci na podłoże PL1890887T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP05103706 2005-05-03
EP06728092.5A EP1890887B1 (en) 2005-05-03 2006-05-01 Method and device for transferring a pattern from a stamp to a substrate
PCT/IB2006/051352 WO2006117745A2 (en) 2005-05-03 2006-05-01 Method and device for transferring a pattern from a stamp to a substrate

Publications (1)

Publication Number Publication Date
PL1890887T3 true PL1890887T3 (pl) 2016-04-29

Family

ID=37308378

Family Applications (1)

Application Number Title Priority Date Filing Date
PL06728092T PL1890887T3 (pl) 2005-05-03 2006-05-01 Sposób i urządzenie do nanoszenia wzoru z pieczęci na podłoże

Country Status (8)

Country Link
US (1) US8166876B2 (pl)
EP (1) EP1890887B1 (pl)
JP (1) JP5180820B2 (pl)
KR (1) KR101256383B1 (pl)
CN (1) CN100559271C (pl)
PL (1) PL1890887T3 (pl)
TW (1) TWI377132B (pl)
WO (1) WO2006117745A2 (pl)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4853129B2 (ja) * 2006-06-23 2012-01-11 大日本印刷株式会社 ナノインプリント用転写装置
US9440254B2 (en) * 2006-12-04 2016-09-13 Koninklijke Philips N.V. Method and apparatus for applying a sheet to a substrate
CN101583436B (zh) * 2007-01-16 2014-05-07 皇家飞利浦电子股份有限公司 用于挠性板件和基板接触的方法和系统
US7678423B2 (en) * 2007-02-27 2010-03-16 The Regents Of The University Of Michigan System and method for depositing thin layers on non-planar substrates by stamping
JP5041214B2 (ja) * 2007-06-15 2012-10-03 ソニー株式会社 金属薄膜の形成方法および電子デバイスの製造方法
DE112008001634A5 (de) * 2007-06-21 2010-04-01 GeSIM Gesellschaft für Silizium-Mikrosysteme mbH Verfahren und Vorrichtung zur Übertragung von Mikro- oder Nanostrukturen durch Kontaktstempeln
WO2009014717A1 (en) * 2007-07-25 2009-01-29 Nano Terra Inc. Contact printing method using an elastomeric stamp having a variable surface area and variable shape
WO2009074932A1 (en) 2007-12-10 2009-06-18 Koninklijke Philips Electronics N. V. Patterned cell sheets and a method for production of the same
KR101026040B1 (ko) * 2008-11-13 2011-03-30 삼성전기주식회사 박막소자 제조방법
KR101046064B1 (ko) * 2008-12-11 2011-07-01 삼성전기주식회사 박막소자 제조방법
GB2468120B (en) * 2009-02-20 2013-02-20 Api Group Plc Machine head for production of a surface relief
KR101042607B1 (ko) * 2009-03-20 2011-06-21 박종칠 상부 몰드의 연속 공급구조를 갖는 스탬핑 장치
JP5411557B2 (ja) * 2009-04-03 2014-02-12 株式会社日立ハイテクノロジーズ 微細構造転写装置
JP5843784B2 (ja) * 2009-12-22 2016-01-13 スリーエム イノベイティブ プロパティズ カンパニー 加圧ローラーを使用するマイクロコンタクトプリンティングのための装置及び方法
US9161448B2 (en) 2010-03-29 2015-10-13 Semprius, Inc. Laser assisted transfer welding process
US20110272838A1 (en) * 2010-05-06 2011-11-10 Matt Malloy Apparatus, System, and Method for Nanoimprint Template with a Backside Recess Having Tapered Sidewalls
KR101323235B1 (ko) * 2010-06-07 2013-10-30 엘지디스플레이 주식회사 임프린팅 장치 및 이를 이용한 임프린팅 방법
CN102336076B (zh) * 2010-07-20 2013-05-22 深圳市沃尔核材股份有限公司 一种模印装置及模印管
JP5240287B2 (ja) * 2010-12-16 2013-07-17 大日本印刷株式会社 ナノインプリント用モールド搬送装置および転写方法
CN102096315B (zh) * 2010-12-22 2012-04-04 青岛理工大学 整片晶圆纳米压印的装置和方法
JP2012143915A (ja) * 2011-01-10 2012-08-02 Scivax Kk インプリント用型
KR101385874B1 (ko) * 2011-04-01 2014-04-21 주식회사 엘지화학 인쇄 장치 및 인쇄 방법
EP2729308B1 (en) * 2011-06-30 2017-10-11 3M Innovative Properties Company Apparatus and method for microcontact printing on indefinite length webs
JP6004738B2 (ja) * 2011-09-07 2016-10-12 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP5893303B2 (ja) 2011-09-07 2016-03-23 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
US9412727B2 (en) 2011-09-20 2016-08-09 Semprius, Inc. Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion
DE102011054789A1 (de) * 2011-10-25 2013-04-25 Universität Kassel Nano-Formgebungsstruktur
US9149958B2 (en) 2011-11-14 2015-10-06 Massachusetts Institute Of Technology Stamp for microcontact printing
JP5759348B2 (ja) * 2011-11-30 2015-08-05 株式会社Ｓｃｒｅｅｎホールディングス パターン形成装置およびパターン形成方法
TW201334948A (zh) * 2012-02-21 2013-09-01 Coretronic Corp 壓印設備及壓印方法
CN102616031B (zh) * 2012-03-29 2014-01-29 浙江大学 一种磁力控制的墨水渗透式微接触印刷装置
CN103373094A (zh) * 2012-04-11 2013-10-30 得利环球有限公司 微接触印刷设备及方法
EP2874179A4 (en) 2012-07-10 2016-05-11 Lg Chemical Ltd PRINTED MATERIAL FIXING PART, PRINTING DEVICE, AND PRINTING METHOD
KR20170046812A (ko) 2012-09-06 2017-05-02 에베 그룹 에. 탈너 게엠베하 구조 스탬프 및 구조 스탬프를 엠보싱하기 위한 장치 및 방법
JP6207997B2 (ja) * 2013-01-30 2017-10-04 株式会社Ｓｃｒｅｅｎホールディングス パターン形成装置およびパターン形成方法
US10108086B2 (en) * 2013-03-15 2018-10-23 Nanonex Corporation System and methods of mold/substrate separation for imprint lithography
WO2015037601A1 (ja) * 2013-09-12 2015-03-19 旭硝子株式会社 モールドの凹凸パターンを転写した物品、物品の製造方法、および光学パネルの製造方法
JP6363838B2 (ja) * 2014-01-08 2018-07-25 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
KR102249004B1 (ko) 2014-04-22 2021-05-07 에베 그룹 에. 탈너 게엠베하 나노구조를 엠보싱하기 위한 방법 및 장치
MY182253A (en) * 2014-07-20 2021-01-18 X Celeprint Ltd Apparatus and methods for micro-transfer-printing
EP3198341B1 (en) * 2014-09-22 2023-07-19 Koninklijke Philips N.V. Transfer method and apparatus and computer program product
US9704821B2 (en) 2015-08-11 2017-07-11 X-Celeprint Limited Stamp with structured posts
US10468363B2 (en) 2015-08-10 2019-11-05 X-Celeprint Limited Chiplets with connection posts
CN105159029A (zh) * 2015-10-10 2015-12-16 兰红波 大面积微纳图形化的装置和方法
US10103069B2 (en) 2016-04-01 2018-10-16 X-Celeprint Limited Pressure-activated electrical interconnection by micro-transfer printing
JP6220918B2 (ja) * 2016-04-22 2017-10-25 株式会社写真化学 電子デバイス用の転写装置および電子デバイス用の転写方法
US10222698B2 (en) 2016-07-28 2019-03-05 X-Celeprint Limited Chiplets with wicking posts
US11064609B2 (en) 2016-08-04 2021-07-13 X Display Company Technology Limited Printable 3D electronic structure
CN107776222A (zh) * 2016-08-25 2018-03-09 苏州光越微纳科技有限公司 大面积平板吸附压印模具及压印方法
KR102100669B1 (ko) * 2016-09-27 2020-05-27 (주)엘지하우시스 차량용 내장재의 제조방법 및 차량용 내장재
JP2017130678A (ja) * 2017-03-09 2017-07-27 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 型押し加工のための構造体スタンプ、装置および方法
CN107215111B (zh) * 2017-06-14 2023-03-28 浙江大学 一种磁控转印印章及磁控转移印刷方法
CN109696799B (zh) * 2017-10-20 2023-11-28 长春工业大学 一种辊型紫外纳米压印装置
EP3881134B1 (en) 2018-11-14 2022-07-20 Koninklijke Philips N.V. Pneumatic system, imprint apparatus and use thereofs
US10748793B1 (en) 2019-02-13 2020-08-18 X Display Company Technology Limited Printing component arrays with different orientations
KR102156263B1 (ko) * 2019-02-27 2020-09-16 서울대학교산학협력단 전사장치
CN110466267B (zh) * 2019-09-18 2024-05-03 成都凌云汽车零部件有限公司 一种玻璃滑槽的标识辊压系统
US11062936B1 (en) 2019-12-19 2021-07-13 X Display Company Technology Limited Transfer stamps with multiple separate pedestals
CN114261196B (zh) * 2021-11-25 2023-06-16 重庆康佳光电技术研究院有限公司 印刷治具和连线印刷方法
CN116461238B (zh) * 2023-02-28 2024-12-13 中铁建设集团有限公司 室内装修用铝板雕花转印控制系统及其方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5900160A (en) * 1993-10-04 1999-05-04 President And Fellows Of Harvard College Methods of etching articles via microcontact printing
JPH08294966A (ja) * 1995-04-26 1996-11-12 Nippon Shokubai Co Ltd 樹脂成形品の連続成形方法
WO1997006013A1 (en) * 1995-08-04 1997-02-20 International Business Machines Corporation Lithographic surface or thin layer modification
US5669303A (en) * 1996-03-04 1997-09-23 Motorola Apparatus and method for stamping a surface
US5725788A (en) 1996-03-04 1998-03-10 Motorola Apparatus and method for patterning a surface
US5947027A (en) * 1998-09-08 1999-09-07 Motorola, Inc. Printing apparatus with inflatable means for advancing a substrate towards the stamping surface
US7338613B2 (en) 2001-09-10 2008-03-04 Surface Logix, Inc. System and process for automated microcontact printing
US6840167B2 (en) * 2002-01-24 2005-01-11 Lloyd Douglas Clark Multi-color pad printing apparatus and method
KR100981692B1 (ko) * 2002-05-27 2010-09-13 코닌클리케 필립스 일렉트로닉스 엔.브이. 스탬프로부터 기판으로 패턴을 전사하기 위한 방법 및 디바이스
US7019819B2 (en) * 2002-11-13 2006-03-28 Molecular Imprints, Inc. Chucking system for modulating shapes of substrates
US20040197712A1 (en) * 2002-12-02 2004-10-07 Jacobson Joseph M. System for contact printing
JP4155511B2 (ja) * 2003-05-09 2008-09-24 Ｔｄｋ株式会社 インプリント装置およびインプリント方法
JP4478424B2 (ja) * 2003-09-29 2010-06-09 キヤノン株式会社 微細加工装置およびデバイスの製造方法
US7037458B2 (en) * 2003-10-23 2006-05-02 Intel Corporation Progressive stamping apparatus and method
US6981445B2 (en) * 2003-12-24 2006-01-03 Axela Biosensors Inc. Method and apparatus for micro-contact printing
US7382449B2 (en) * 2004-12-21 2008-06-03 Alces Technology Alignment tool for precise pattern transfer
JP4596981B2 (ja) * 2005-05-24 2010-12-15 株式会社日立ハイテクノロジーズ インプリント装置、及び微細構造転写方法

Also Published As

Publication number Publication date
CN100559271C (zh) 2009-11-11
WO2006117745A3 (en) 2007-10-11
WO2006117745A2 (en) 2006-11-09
EP1890887B1 (en) 2015-10-28
US20080202365A1 (en) 2008-08-28
EP1890887A2 (en) 2008-02-27
KR101256383B1 (ko) 2013-04-25
JP2008540164A (ja) 2008-11-20
TW200709937A (en) 2007-03-16
TWI377132B (en) 2012-11-21
KR20080005391A (ko) 2008-01-11
US8166876B2 (en) 2012-05-01
JP5180820B2 (ja) 2013-04-10
CN101171142A (zh) 2008-04-30

Similar Documents

Publication Publication Date Title
PL1890887T3 (pl) Sposób i urządzenie do nanoszenia wzoru z pieczęci na podłoże
PL1834805T3 (pl) Urządzenie i sposób dociskania okładki do ruchomego bloku podłoża drukowego
TWI366863B (en) Method for forming a pattern in semiconductor device with double exposure technology
HK1085544A1 (en) Device for transferring a pattern to an object
TWI365483B (en) Method for forming a via in a substrate
GB2443342B (en) Method for forming high-resolution pattern and substrate having prepattern formed thereby
GB0423685D0 (en) Improved method for coating a substrate
EP1987110A4 (en) METHOD OF SUBSTRATE TREATMENT
HK1118871A1 (en) Apparatus and method for coating a substrate
GB0504962D0 (en) A method and apparatus for managing printing devices
GB0616116D0 (en) A method of forming a component on a substrate
TWI367539B (en) Methods and apparatus for purging a substrate carrier
HK1103852A1 (en) Method for mounting a flip chip on a substrate
PH12011501221A1 (en) Method and printing press for printing a substrate
EP2389478A4 (en) APPARATUS AND METHOD FOR REALIZING MARKERS ON A SUBSTRATE
EP1842228A4 (en) SYSTEM AND METHOD FOR CREATING A SURFACE PATTERN
EG25336A (en) Method for applying an electronic assembly to a substrate and a device for applying said assembly.
PL1968801T3 (pl) Sposób znakowania powierzchni podłoża typu szklanego, takie podłoże i element znakujący do tego sposobu
PL2226747T3 (pl) Sposób i urządzenie do wytwarzania układu połączeń na podłożu
SG121045A1 (en) Method and device for packaging a substrate
GB0400982D0 (en) Method of forming a pattern on a substrate
EP1749113A4 (en) METHOD OF FORMING A SURFACE CURED ON A SUBSTRATE
SG133552A1 (en) Lithographic apparatus and method for manufacturing a device
GB2452174B (en) A method and composition for selectively stripping nickel from a substrate
HK1125741A1 (en) Device and method for holding a substrate