NO20033352L - Termoplastiske halogenerte polymerblandinger, fremgangsmåte for fremstilling av dem og anvendelse derav - Google Patents
Termoplastiske halogenerte polymerblandinger, fremgangsmåte for fremstilling av dem og anvendelse deravInfo
- Publication number
- NO20033352L NO20033352L NO20033352A NO20033352A NO20033352L NO 20033352 L NO20033352 L NO 20033352L NO 20033352 A NO20033352 A NO 20033352A NO 20033352 A NO20033352 A NO 20033352A NO 20033352 L NO20033352 L NO 20033352L
- Authority
- NO
- Norway
- Prior art keywords
- preparation
- polymer blends
- halogenated polymer
- thermoplastic halogenated
- thermoplastic
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/443—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
- H01B3/445—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds from vinylfluorides or other fluoroethylenic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Organic Insulating Materials (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0101266A FR2820140B1 (fr) | 2001-01-26 | 2001-01-26 | Compositions de polymeres halogenes thermoplastiques, procede pour leur preparation et utilisation de celles-ci |
PCT/EP2002/000771 WO2002059190A2 (fr) | 2001-01-26 | 2002-01-23 | Compositions de polymeres halogenes thermoplastiques, procede pour leur preparation et utilisation de celles-ci |
Publications (2)
Publication Number | Publication Date |
---|---|
NO20033352D0 NO20033352D0 (no) | 2003-07-25 |
NO20033352L true NO20033352L (no) | 2003-09-25 |
Family
ID=8859421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20033352A NO20033352L (no) | 2001-01-26 | 2003-07-25 | Termoplastiske halogenerte polymerblandinger, fremgangsmåte for fremstilling av dem og anvendelse derav |
Country Status (14)
Country | Link |
---|---|
US (1) | US6979715B2 (pt) |
EP (1) | EP1409583B1 (pt) |
JP (2) | JP2004524397A (pt) |
KR (1) | KR100883978B1 (pt) |
CN (1) | CN1266213C (pt) |
AU (1) | AU2002246057A1 (pt) |
BR (1) | BR0206707B1 (pt) |
CA (1) | CA2435570C (pt) |
FR (1) | FR2820140B1 (pt) |
MX (1) | MXPA03006660A (pt) |
NO (1) | NO20033352L (pt) |
PL (1) | PL202979B1 (pt) |
RU (1) | RU2279451C2 (pt) |
WO (1) | WO2002059190A2 (pt) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009043758A1 (de) * | 2007-09-28 | 2009-04-09 | Basf Se | Verfahren zur herstellung flammgeschützter thermoplastischer formmassen |
JP2013523907A (ja) * | 2010-03-26 | 2013-06-17 | ソルヴェイ(ソシエテ アノニム) | コア/シェル粒子を含むポリマー組成物 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4115481A (en) * | 1977-09-16 | 1978-09-19 | E. I. Du Pont De Nemours And Company | Fluoroelastomer blend composition |
JPS5940066A (ja) * | 1982-08-31 | 1984-03-05 | Daikin Ind Ltd | 耐潤滑油性シ−ル材 |
JPS5964342A (ja) * | 1982-09-29 | 1984-04-12 | Daikin Ind Ltd | 熱回復性物品 |
JPS61206114A (ja) * | 1985-03-08 | 1986-09-12 | 日立電線株式会社 | 含ふつ素エラストマ被覆電線・ケ−ブルの製造方法 |
DE3786223T2 (de) * | 1986-04-22 | 1993-09-23 | Raychem Corp | Fluorpolymerzusammensetzungen. |
JPH02258324A (ja) * | 1989-03-31 | 1990-10-19 | Mitsubishi Cable Ind Ltd | 熱収縮性チューブ |
JP2787073B2 (ja) * | 1989-10-13 | 1998-08-13 | ジェイエスアール株式会社 | ゴム組成物 |
JPH0724897A (ja) * | 1993-07-12 | 1995-01-27 | Sumitomo Electric Ind Ltd | 電気絶縁体の製造方法 |
DE19622188A1 (de) * | 1996-06-03 | 1997-12-04 | Bayer Ag | Fluorkautschuk, ein Verfahren zur Herstellung und seiner Verwendung sowie ein Verfahren zur Herstellung von Fluorelastomer-Formkörpern und/oder Beschichtungen |
JP3687318B2 (ja) * | 1997-12-12 | 2005-08-24 | Nok株式会社 | 炭酸ガス用シール材 |
JP2000191709A (ja) * | 1998-12-25 | 2000-07-11 | Nippon Mektron Ltd | 含フッ素共重合体の製造方法、含フッ素共重合体および該含フッ素共重合体を含む架橋性組成物、ならびにシ―ル材 |
ITMI991515A1 (it) * | 1999-07-09 | 2001-01-09 | Ausimont Spa | Co polimeri peralogenati termoprocessabili del clorotrifluoroetilene |
-
2001
- 2001-01-26 FR FR0101266A patent/FR2820140B1/fr not_active Expired - Fee Related
-
2002
- 2002-01-23 MX MXPA03006660A patent/MXPA03006660A/es active IP Right Grant
- 2002-01-23 AU AU2002246057A patent/AU2002246057A1/en not_active Abandoned
- 2002-01-23 CN CNB028071670A patent/CN1266213C/zh not_active Expired - Fee Related
- 2002-01-23 RU RU2003125963/04A patent/RU2279451C2/ru not_active IP Right Cessation
- 2002-01-23 CA CA2435570A patent/CA2435570C/fr not_active Expired - Fee Related
- 2002-01-23 BR BRPI0206707-2A patent/BR0206707B1/pt not_active IP Right Cessation
- 2002-01-23 EP EP02714111.8A patent/EP1409583B1/fr not_active Expired - Lifetime
- 2002-01-23 US US10/466,560 patent/US6979715B2/en not_active Expired - Fee Related
- 2002-01-23 KR KR1020037009845A patent/KR100883978B1/ko not_active IP Right Cessation
- 2002-01-23 PL PL367270A patent/PL202979B1/pl unknown
- 2002-01-23 WO PCT/EP2002/000771 patent/WO2002059190A2/fr active Application Filing
- 2002-01-23 JP JP2002559485A patent/JP2004524397A/ja active Pending
-
2003
- 2003-07-25 NO NO20033352A patent/NO20033352L/no not_active Application Discontinuation
-
2009
- 2009-01-14 JP JP2009005915A patent/JP5356048B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
AU2002246057A1 (en) | 2002-08-06 |
CA2435570A1 (fr) | 2002-08-01 |
BR0206707A (pt) | 2004-02-25 |
WO2002059190A2 (fr) | 2002-08-01 |
JP2009120844A (ja) | 2009-06-04 |
CA2435570C (fr) | 2011-03-15 |
EP1409583B1 (fr) | 2015-03-18 |
RU2279451C2 (ru) | 2006-07-10 |
FR2820140A1 (fr) | 2002-08-02 |
KR100883978B1 (ko) | 2009-02-17 |
CN1266213C (zh) | 2006-07-26 |
JP2004524397A (ja) | 2004-08-12 |
JP5356048B2 (ja) | 2013-12-04 |
EP1409583A2 (fr) | 2004-04-21 |
BR0206707B1 (pt) | 2011-05-17 |
CN1524110A (zh) | 2004-08-25 |
PL202979B1 (pl) | 2009-08-31 |
NO20033352D0 (no) | 2003-07-25 |
WO2002059190A3 (fr) | 2004-01-29 |
KR20030078892A (ko) | 2003-10-08 |
US6979715B2 (en) | 2005-12-27 |
PL367270A1 (en) | 2005-02-21 |
FR2820140B1 (fr) | 2007-03-09 |
US20040106768A1 (en) | 2004-06-03 |
MXPA03006660A (es) | 2004-05-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FC2A | Withdrawal, rejection or dismissal of laid open patent application |